A method for fabricating a high-precision rigid-flex plate for an intelligent vision module

Abstract

A method for manufacturing a high-precision rigid-flex plate for an intelligent vision module involves: fabricating a flexible plate layer and a rigid plate layer with a covering film according to design data; taking a prepreg and stacking the three layers correspondingly to form a press plate; the flexible plate layer is located on the surface of the press plate; creating a surface circuit pattern on the press plate; milling the rigid and flexible areas according to the forming lines to form a first through groove, with several connecting bridges distributed in the first through groove, connecting the effective and ineffective areas; forming a milled plate; the first milling also includes controlled depth milling along the controlled depth milling lines; welding components; performing a second milling; and processing in subsequent steps to form the rigid-flex plate; by placing the flexible plate layer on the surface of the press plate, the flexible area can be exposed by only one peeling operation from one side of the rigid plate layer, significantly reducing the difficulty of high-precision controlled depth processing, reducing processing steps and sources of error, improving overall processing efficiency, and ensuring the forming quality of the plate.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and in particular to a method for manufacturing a high-precision rigid-flex board for intelligent vision modules. Background Technology

[0002] In some fields of visual perception modules, due to the typically small installation space, high-precision rigid-flex boards are required to meet the application requirements of small-space three-dimensional assembly and high-precision integration.

[0003] Generally, this type of rigid-flex board adopts a design where the flexible board layer is located in the inner layer, and the stacked structure tends to be symmetrical from top to bottom, avoiding warping and buckling problems during the processing. At the same time, it ensures that the board has good symmetrical bending performance, and welding pads are designed on the surface of the flexible board layer to provide basic processing conditions for component welding.

[0004] However, this structural design has many drawbacks in actual processing and use:

[0005] (1) When the flexible board layer is located in the inner layer, the uncovering process needs to be carried out from both the front and back sides. The rigid board layer covering the surface of the flexible board layer is removed by high-precision processing methods such as controlled depth milling or controlled depth laser cutting to expose the flexible area. The process is complicated and can easily cause various processing problems.

[0006] (2) Since the flexible board layer is in the inner layer and the surface of the flexible board layer is designed with solder pads, the surface treatment of the solder pads faces a dilemma:

[0007] If electroplating gold is used, the electroplating process must be completed during the flexible board layer processing stage before it is laminated with the rigid board layer. Subsequent processes may cause adhesive residue to be generated on the surface of the solder pads.

[0008] If other surface treatment processes such as immersion gold are used, the pads need to be exposed after the cover is removed before processing. This not only makes the process cumbersome, but the process of removing the cover can also easily cause contamination and scratches on the pads.

[0009] (3) When soldering components to the pads, since the flexible board layer is in the inner layer, the pads must be exposed after the cover is removed before soldering can be performed. After the cover is removed, the flexible board layer loses the support of the rigid board layer. Its softness will cause problems such as poor soldering and poor soldering during the soldering process, which will seriously affect the product quality.

[0010] Based on the above background and problems, there is a need to provide a new method for manufacturing a high-precision rigid-flex plate for intelligent vision modules. Summary of the Invention

[0011] This invention aims to solve the comprehensive problems of complex processing caused by the structural design of existing rigid-flex boards, and provides a method for manufacturing a high-precision rigid-flex board for intelligent vision modules. The rigid-flex board is processed according to design data. The rigid-flex board is designed with forming lines, the area within the forming lines is the effective area, and other areas are ineffective areas. The effective area includes rigid and flexible areas. The design data includes pads. The boundary between the rigid and flexible areas is a controlled-depth milling cut line.

[0012] S10: Fabricate a flexible plate layer with a covering film layer and a rigid plate layer according to the design data; take a prepreg, stack the flexible plate layer, the prepreg, and the rigid plate layer in sequence and press them together to form a press plate; the flexible plate layer is located on the surface of the press plate;

[0013] S20: The surface circuit pattern and the first milling are sequentially made on the press plate to form a milled plate; the first milling is to mill the rigid area and the flexible area according to the forming line to form a first through groove, the first through groove is distributed with a plurality of connecting bridges, the connecting bridges connect the effective area and the ineffective area; the first milling also includes controlled depth milling of the controlled depth milling line.

[0014] S30: Components are welded to the pads in the milling plate, followed by a second milling and subsequent processing to form the rigid-flexible bonded plate.

[0015] Furthermore, the depth of the controlled-depth milling is from one side of the rigid plate to the surface of the cover film of the flexible plate.

[0016] Furthermore, the fabrication of the flexible board layer includes attaching a reinforcing sheet to the other side of the flexible board layer corresponding to the pad; and creating a window in the area of ​​the prepreg corresponding to the reinforcing sheet.

[0017] Furthermore, the stacked arrangement forms a stacked structure, and two sides of the stacked structure are provided with a pressing auxiliary structure. The pressing auxiliary structure is provided with a first release layer on the side corresponding to the rigid plate layer, and a second release layer, a covering layer and a third release layer are provided sequentially from the stacked structure outward on the side corresponding to the flexible plate layer.

[0018] Furthermore, the boundary line between the flexible area where the pad is located and the adjacent invalid area is the pad area forming line; the second milling includes laser depth-controlled cutting of the pad area forming line; the depth of the laser depth-controlled cutting is from the surface to the cover film layer.

[0019] Furthermore, the boundary line between the flexible area where the pad is located and the adjacent invalid area is the pad area forming line; the boundary line between the position of the pad and the adjacent invalid area is the soldering position milling line; the first milling also includes milling along the pad area forming line other than the soldering position milling line to form a second through groove, the second through groove including a second connecting bridge, the second connecting bridge connecting the invalid area and the flexible area; the second milling is to mill the connecting bridge, the second connecting bridge and the soldering position milling line.

[0020] Furthermore, the boundary line between the flexible area where the pad is located and the adjacent invalid area is the pad area forming line; the boundary line between the position of the pad and the adjacent invalid area is the soldering position milling line; the first milling also includes milling along the pad area forming line to form a third through groove, the third through groove including a third connecting bridge, the third connecting bridge connecting the invalid area and the flexible area; the second milling is to mill the connecting bridge and the third connecting bridge.

[0021] Furthermore, the second milling is performed using laser cutting.

[0022] Furthermore, the flexible plate layer is subjected to plasma treatment before the stacking.

[0023] Furthermore, after taking the prepreg, a high-temperature resistant tape is attached to the side of the prepreg facing the flexible plate layer corresponding to the flexible area.

[0024] The main beneficial effects of this technical solution include the following:

[0025] By placing the flexible layer on the surface of the pressed plate, the flexible area can be exposed by simply peeling it off from one side of the rigid layer. This avoids the complex double-sided peeling method used in traditional processes, significantly reducing the difficulty of high-precision depth control machining, reducing machining steps and sources of error, improving overall machining efficiency, significantly improving machining accuracy, and ensuring the quality of plate forming.

[0026] By simultaneously setting the pads on the surface along with the flexible board layer, on the one hand, the surface layout allows the pads to be directly subjected to surface treatments such as electroplating and immersion gold, which simplifies the processing flow and reduces the difficulty of operation; on the other hand, it can effectively prevent problems such as adhesive residue, contamination, and scratches on the pad surface that are prone to occur during the uncovering process, ensuring the surface cleanliness and structural integrity of the pads, and laying a good foundation for subsequent component soldering.

[0027] A two-stage milling process is adopted. The first milling only completes the processing of the forming lines of the non-welded pads and the adjacent invalid areas, while retaining the forming lines of the adjacent invalid areas of the welded pads. This gives the pads a stable support from the rigid plate layer, which greatly improves the stress stability of the components during welding and avoids problems such as cold solder joints and welding misalignment from the root. After welding is completed, the reserved forming lines are precisely removed by the second milling to form a complete rigid-flexible bonded plate. This not only ensures the welding quality but also ensures the final forming accuracy of the product, thus comprehensively improving the processing quality and product reliability. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 This is a process flow diagram of an embodiment of the present invention;

[0030] Figure 2 This is a cross-sectional schematic diagram of the stacked structure according to an embodiment of the present invention;

[0031] Figure 3 This is a cross-sectional schematic diagram of the pressing plate according to an embodiment of the present invention;

[0032] Figure 4 This is a plan view of the first type of milling plate according to an embodiment of the present invention;

[0033] Figure 5 This is a plan view of the second type of milling plate according to an embodiment of the present invention;

[0034] Figure 6 This is a plan view of the third milling plate according to an embodiment of the present invention;

[0035] Figure 7 This is a plan view of the welding plate according to an embodiment of the present invention;

[0036] Figure 8 This is a planar schematic diagram of a rigid-flexible plate according to an embodiment of the present invention.

[0037] Explanation of reference numerals: 100, forming line; 200, effective area; 210, rigid area; 220, flexible area; 230, controlled-depth milling line; 300, ineffective area; 400, solder pad; 500, stacked structure; 510, upper pressing auxiliary structure; 5010, first steel plate; 5020, first release layer; 520, lower pressing auxiliary structure; 5030, second release layer; 5040, covering layer; 5050, third release layer; 5060, second steel plate; 10, flexible plate layer; 1010, reinforcing sheet; 1020, cover film layer; 1030 1040 Core board layer; 1050 Copper layer; 20 Cover film; 30 Rigid board layer; 40 A Pressed board; 40 A Milled board of the first embodiment; 40 B Milled board of the second embodiment; 40 C Milled board of the third embodiment; 4010 First through slot; 4020 Connecting bridge; 4040 Pad area forming line; 4050 Milling line of welding position; 4060 Second through slot; 4070 Second connecting bridge; 4080 Third through slot; 4090 Third connecting bridge; 50 Welding board; 530 Component; 60 Flexible-rigid bonded board.

[0038] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0041] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0043] To better understand the above technical solution, a detailed explanation of the technical solution is provided below with reference to the accompanying drawings.

[0044] Please see Figure 1 , Figure 1 This is a process flow diagram of an embodiment of the present invention.

[0045] A method for manufacturing a high-precision rigid-flex PCB for an intelligent vision module. The rigid-flex PCB is processed according to design data. The rigid-flex PCB is designed with a forming line 100, the area within the forming line 100 is the effective area 200, and the other areas are ineffective areas 300. The effective area 200 includes a rigid area 210 and a flexible area 220. The design data includes pads 400. The boundary between the rigid area 210 and the flexible area 220 is a controlled-depth milling line 230. The manufacturing method follows... Figure 1 The manufacturing process is described in detail below.

[0046] Please see Figure 2 and Figure 3 , Figure 2 This is a cross-sectional schematic diagram of the stacked structure according to an embodiment of the present invention; Figure 3 This is a cross-sectional schematic diagram of the pressing plate according to an embodiment of the present invention.

[0047] Step S10:

[0048] According to the design data, a flexible board layer 10 with a covering film layer 1020 (including a core board layer 1030 and a copper layer 1040, the copper layer 1040 is subsequently fabricated to form a circuit pattern including pads 400) and a rigid board layer 20 are fabricated; a prepreg (not shown in the attached figure) is taken, and the flexible board layer 10, the prepreg and the rigid board layer 20 are stacked in sequence (forming a stacked structure 500) and pressed together to form a press plate 30; the flexible board layer 10 is located on the surface of the press plate 30.

[0049] By placing the flexible plate layer 10 with the covering film layer 1020 on the surface of the pressing plate 30, the processing flow can be greatly simplified. With the flexible plate layer 10 on the surface, the cover operation only needs to be performed from one side of the rigid plate layer 20, eliminating the need for the traditional two-sided cover operation. This can significantly reduce the complexity of high-precision depth control processing and improve processing efficiency and overall processing accuracy. On the other hand, it can also effectively protect the pads 400. The pads 400 are on the surface simultaneously with the flexible plate layer 10, making it easy to directly carry out surface treatments such as electroplating gold and immersion gold, and preventing problems such as adhesive residue, contamination, and scratches on the surface of the pads 400 that are prone to occur during pressing and cover removal.

[0050] Furthermore, the fabrication of the flexible board layer 10 includes attaching a reinforcing sheet 1010 to the other side of the flexible board layer 10 corresponding to the pad 400; and creating a window in the area of ​​the prepreg corresponding to the reinforcing sheet 1010.

[0051] By attaching the reinforcing sheet 1010, targeted rigid support is provided for the pad 400 area. The prepreg has an opening (not shown in the figure) in the area corresponding to the reinforcing sheet 1010, which can avoid the size of the reinforcing sheet 1010 and prevent the interlayer from not being tightly bonded due to the protrusion of the reinforcing sheet 1010 during the lamination process. This can lead to problems such as unevenness of the board surface and air bubbles between layers, thus ensuring the structural stability and flatness of the laminate 30.

[0052] Furthermore, after removing the prepreg, a high-temperature resistant tape is attached to the side of the prepreg corresponding to the flexible area 220 facing the flexible plate 10, so that a stable release state is established between the prepreg and the flexible plate 10, providing a release processing basis for subsequent capping processing.

[0053] Furthermore, before stacking, the flexible board layer 10 is subjected to plasma treatment to improve the interlayer adhesion reliability between the flexible board layer 10 and the prepreg and rigid board layer 20, effectively avoiding problems such as interlayer loosening and peeling during processing or use.

[0054] Furthermore, the stacked structures form a stacked structure 500. The stacked structure 500 has pressing auxiliary structures (including an upper pressing auxiliary structure 510 and a lower pressing auxiliary structure 520) on both sides. The pressing auxiliary structure has a first steel plate 5010 and a first release layer 5020 on the side corresponding to the rigid plate layer 20, and a second release layer 5030, a covering layer 5040, a third release layer 5050 and a second steel plate 5060 arranged sequentially from the stacked structure 500 outwards on the side corresponding to the flexible plate layer 10.

[0055] Because the overall plate structure is asymmetrical after pressing, it is easy to cause problems such as plate bending and warping. Therefore, the stacked structure 500 adopts an asymmetrical structure with different structural forms set independently on both sides. One side of the rigid plate layer 20 forms an effective rigid support, and the other side of the flexible plate layer 10 forms an effective covering effect.

[0056] Specifically, a first release layer 5020 is provided on one side of the rigid plate layer 20 to ensure that subsequent auxiliary structures can be effectively removed; while a second release layer 5030, a cover layer 5040, and a third release layer 5050 are stacked sequentially on one side of the flexible plate layer 10. This is because the flexible plate layer 10 is made of soft material and requires stronger cover-up ability during pressing to ensure tight adhesion with the prepreg. Among them, the cover layer 5040, as the core functional layer, can provide good buffering and cover-up effects for the flexible plate layer 10, improving the adhesion and interlayer bonding effect during pressing. The second release layer 5030 and the third release layer 5050 respectively serve to isolate the flexible plate layer 10 and assist in subsequent peeling. At the same time, they optimize the force transmission during the pressing process. The stable support of the rigid plate layer 20 and the cover-up effect of the flexible plate layer 10 complement each other, effectively balancing the stress distribution during the pressing process, greatly improving the bowing and warping problems that are prone to occur in asymmetrical stacking, and ensuring the regularity of the shape and dimensional accuracy of the plate after molding.

[0057] Please see Figure 4 , Figure 4 This is a plan view of the first type of milling plate according to an embodiment of the present invention.

[0058] Step S20: The surface circuit pattern and the first milling are sequentially made on the press plate 30 to form the milled plate 40A of the first embodiment; the first milling is to mill the rigid area 210 and the flexible area 220 according to the forming line 100 to form the first through groove 4010. The first through groove 4010 is distributed with a plurality of connecting bridges 4020, which connect the effective area 200 and the ineffective area 300; the first milling also includes controlling the depth of the controlled depth milling line 230.

[0059] The rigid area 210 and the flexible area 220 are milled according to the forming line 100, forming a first through groove 4010 between the effective area 200 and the ineffective area 300. At the same time, several connecting bridges 4020 are set in the first through groove 4010 to connect the effective area 200 and the ineffective area 300. The area of ​​the board body that does not include the pads 400 is pre-formed first, and the relative positional relationship between the two is maintained by the connecting bridges 4020 to avoid displacement, deformation or damage of the effective area 200 in subsequent processing, and to provide structural guarantee for the implementation of subsequent processes.

[0060] Furthermore, precise depth-controlled milling is also performed on the depth-controlled milling line 230, strictly controlling the milling depth to the surface of the cover film layer 1020 of the flexible plate layer 10. This not only completes the initial separation of the rigid area 210 and the flexible area 220, providing a basis for subsequent capping, but also does not damage the internal structure of the flexible plate layer 10, thus achieving precise zoning processing.

[0061] This step, combined with the structural design of the flexible board layer 10 located on the surface, allows for controlled-depth milling that only needs to be processed from one side of the rigid board layer 20, eliminating the need for the traditional two-sided peeling process. This further improves peeling efficiency and accuracy, while avoiding damage to the flexible board layer 10 and surface circuitry during peeling.

[0062] Furthermore, the depth of controlled milling is from one side of the rigid plate layer 20 to the surface of the cover film of the flexible plate layer 10.

[0063] The process achieves precise protection, and the depth control of the controlled-depth milling precisely avoids the flexible plate layer 10. This not only ensures the effective separation between the rigid area 210 and the flexible area 220, but also protects the structural integrity of the flexible plate layer 10 and the pad 400 through complete coverage. At the same time, it provides convenience for subsequent single-time peeling from one side of the rigid plate layer 20, completely eliminating the complicated process of traditional double-sided peeling and reducing processing errors.

[0064] It is worth noting that the surface circuit pattern includes sequentially fabricating pads 400, laminating a cover film 1050, and performing surface treatment on pads 400. This places pads 400 on the surface and performs surface treatment beforehand, which not only simplifies the operation process of surface treatment processes such as electroplating gold or immersion gold and reduces the processing difficulty, but also completely eliminates the problems of surface adhesive residue, contamination, and scratches that are easily caused by peeling off the cover to expose pads 400 after lamination in traditional processes. This significantly improves the surface cleanliness and structural stability of pads 400.

[0065] Please refer to it again. Figure 4 Please see Figure 5 , Figure 6 , Figure 7 and Figure 8 , Figure 5 This is a plan view of the second type of milling plate according to an embodiment of the present invention; Figure 6 This is a plan view of the third milling plate according to an embodiment of the present invention; Figure 7 This is a plan view of the welding plate according to an embodiment of the present invention; Figure 8 This is a planar schematic diagram of a rigid-flexible plate according to an embodiment of the present invention.

[0066] Step S30:

[0067] In the first embodiment, the pads 400 of the milling plate 40A are used to weld components 530 to form a welding plate 50. Then, a second milling is performed, and after subsequent processing, a rigid-flexible bonded plate 60 is formed.

[0068] The connecting bridge 4020 retained after the first milling is used to maintain a stable connection between the effective area 200 and the ineffective area 300, so that the area around the pad 400 still has the support structure provided by the rigid plate layer 20 or the connecting bridge 4020, providing stable support for the soldering of the component 530; after the soldering is completed, the final shape is completed by the second milling.

[0069] The three specific milling methods are as follows:

[0070] Please refer to it again. Figure 4 .

[0071] Optionally, the boundary line between the flexible area 220 where the pad 400 is located and the adjacent invalid area 300 is the pad area forming line 4040, forming the milling plate 40A of the first embodiment. The second milling includes laser depth-controlled cutting of the pad area forming line 4040; the depth of the laser depth-controlled cutting is from the surface to the cover film layer 1020.

[0072] In the first milling, the forming line 100 between the flexible area 220 where the pad 400 is located and the adjacent invalid area 300 is retained, so that the area of ​​the pad 400 is surrounded by the rigid plate layer 20, providing a stable rigid support foundation for the welding of the component 530. After the welding process is completed, laser depth-controlled cutting is performed on the forming line 4040 of the pad area, and the cutting depth is controlled to extend from the surface to the cover film layer 1020 of the flexible plate layer 10. This not only utilizes the high precision characteristics of laser cutting to achieve precise separation between the flexible area 220 where the pad 400 is located and the invalid area 300, but also avoids damage to the flexible plate layer 10 and the welded component 530 through depth control. At the same time, relying on the release state between the prepreg and the flexible area 220, it ensures that the interlayer structure can be smoothly separated after laser cutting.

[0073] Please refer to it again. Figure 5 .

[0074] Furthermore, the boundary line between the flexible area 220 where the pad 400 is located and the adjacent invalid area 300 is the pad area forming line 4040; the boundary line between the position of the pad 400 and the adjacent invalid area 300 is the welding position milling line 4050; the first milling also includes milling along the pad area forming line 4040 other than the welding position milling line 4050 to form a second through groove 4060, the second through groove 4060 includes a second connecting bridge 4070, the second connecting bridge 4070 connects the invalid area 300 and the flexible area 220; the whole board forms the milled plate 40B of the second embodiment, and the second milling is to mill the connecting bridge 4020, the second connecting bridge 4070 and the welding position milling line 4050.

[0075] During the first milling, the milling line 4050 at the welding position is avoided, and the second through groove 4060 is formed only along the forming line 4040 of the remaining pad area. At the same time, a second connecting bridge 4070 is set in the second through groove 4060, which works together with the connecting bridge 4020 formed in the first milling. Together with the retained welding position milling line 4050 and the second connecting bridge 4070, multiple connections are formed to provide stable rigid support for the flexible area 220 and the pad 400, avoiding deformation and displacement during welding and transportation. After the component 530 is welded, the second milling focuses on processing the connecting bridge 4020 and the previously retained welding position milling line 4050, and finally forming the shape.

[0076] Please refer to it again. Figure 6 .

[0077] Furthermore, the boundary line between the flexible area 220 where the pad 400 is located and the adjacent invalid area 300 is the pad area forming line 4040; the boundary line between the position of the pad 400 and the adjacent invalid area 300 is the welding position milling line 4050; the first milling also includes milling along the pad area forming line 4040 to form a third through groove 4080, the third through groove 4080 includes a third connecting bridge 4090, the third connecting bridge 4090 connects the invalid area 300 and the flexible area 220; the whole board forms the milling plate 40C of the third embodiment, and the second milling is to mill the connecting bridge 4020 and the third connecting bridge 4090.

[0078] In the first milling, the entire area along the forming line 4040 of the pad area is milled to form the third through groove 4080 surrounding the flexible area 220. The rigid connection between the ineffective area 300 and the flexible area 220 is achieved only through the third connecting bridge 4090 in the third through groove 4080. Before welding, sufficient support and fixation are provided for the flexible area 220 and the pad 400. After the component 530 is welded, the second milling is precisely cut only for the connecting bridge and the third connecting bridge. Relying on the release state between the prepreg and the flexible area 220, the effective area 200 and the ineffective area 300 are separated after the connecting bridge 4020 and the third connecting bridge 4090 are cut, and the final shape is formed.

[0079] Furthermore, the second milling is only performed on the connecting bridge 4020 and the third connecting bridge 4090. The processing range and cutting amount are relatively small, which greatly reduces the vibration and dust generated during the final cutting process, avoids impact, contamination or secondary damage to the welded components 530 or the welded joints, and effectively ensures the reliability of the welding of components 530.

[0080] Optionally, the second milling is performed using laser cutting.

[0081] Based on the semi-cured sheet from the previous process, high-temperature resistant tape is attached to the side of the flexible area 220 facing the flexible plate 10. After pressing, a release state is formed between the flexible plate 10 and the rigid plate 20. Laser cutting can cut only the flexible plate 10 without cutting the rigid plate 20. This can achieve the supporting role of the rigid plate 20 on the flexible plate 10 during the welding process, and also realize the easy and high-precision cutting of the flexible plate 10 by laser cutting to form the shape, thereby realizing the forming process of the rigid-flexible bond plate 60.

[0082] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the inventive concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a high-precision rigid-flex board for an intelligent vision module, wherein the rigid-flex board is processed according to design data, the rigid-flex board is designed with forming lines, the area within the forming lines is the effective area, and other areas are ineffective areas, the effective area includes a rigid area and a flexible area, the design data includes pads, and the boundary between the rigid area and the flexible area is a controlled-depth milling cut line, characterized in that... S10: Fabricate a flexible plate layer with a covering film layer and a rigid plate layer according to the design data; Take a prepreg, stack the flexible plate layer, the prepreg, and the rigid plate layer in sequence and press them together to form a press plate; the flexible plate layer is located on the surface of the press plate; The pads are located on the surface of the flexible plate layer in the flexible region and on the surface of the laminating plate; S20: The surface circuit pattern and the first milling are sequentially made on the pressed plate to form a milled plate; The first milling is to mill the rigid area and the flexible area according to the forming line to form a first through groove. The first through groove is distributed with a plurality of first connecting bridges, and the first connecting bridges connect the effective area and the ineffective area. The first milling also includes controlled depth milling and linear controlled depth milling; S30: Components are welded to the pads in the milling plate, and then a second milling is performed to complete the final shaping. After subsequent processing, the rigid-flexible bonded plate is formed. The boundary line between the flexible area where the pad is located and the adjacent invalid area is the pad area forming line; The second milling includes laser depth-controlled cutting of the forming line of the pad area; The laser-controlled depth cutting depth is from the surface to the covering film layer.

2. The method for manufacturing a high-precision rigid-flexible bonded plate for an intelligent vision module as described in claim 1, characterized in that, The depth of the controlled-depth milling is from one side of the rigid plate to the surface of the cover film of the flexible plate.

3. The method for manufacturing a high-precision rigid-flexible bonded plate for an intelligent vision module as described in claim 1, characterized in that, Fabricating the flexible board layer includes attaching a reinforcing sheet to the other side of the flexible board layer corresponding to the pads; The prepreg has windows in the area corresponding to the reinforcing sheet.

4. The method for manufacturing a high-precision rigid-flexible bonded plate for an intelligent vision module as described in claim 1, characterized in that, The stacked arrangement forms a stacked structure, and pressing auxiliary structures are provided on both sides of the stacked structure. The pressing auxiliary structure has a first release layer on one side of the rigid plate layer, and a second release layer, a covering layer and a third release layer are sequentially arranged outward from the stacked structure on the other side of the flexible plate layer.

5. The method for manufacturing a high-precision rigid-flexible bonded plate for an intelligent vision module as described in claim 1, characterized in that, The boundary line between the position of the solder pad and the adjacent invalid area is the soldering position milling line; The first milling also includes milling along the pad area forming line other than the welding position milling line to form a second through groove. The second through groove includes a second connecting bridge, which connects the invalid area and the flexible area.

6. The method for manufacturing a high-precision rigid-flexible bonded plate for an intelligent vision module as described in claim 1, characterized in that, The first milling also includes milling along the forming line of the pad area to form a third through groove, the third through groove including a third connecting bridge, the third connecting bridge connecting the invalid area and the flexible area.

7. The method for manufacturing a high-precision rigid-flexible bonded plate for an intelligent vision module as described in claim 1, characterized in that, Before the stacking, the flexible plate layer is subjected to plasma treatment.

8. The method for manufacturing a high-precision rigid-flexible bonded plate for an intelligent vision module as described in claim 1, characterized in that, After taking the prepreg, apply high-temperature resistant tape to the side of the prepreg facing the flexible plate layer corresponding to the flexible area.

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