Chip desoldering device and system and use method

Abstract

The invention provides a chip desoldering device and system and a use method, and relates to the technical field of electronic assembly. The device comprises a heating table and a positioning mechanism, and the heating table is provided with a heating plane and a temperature control unit and used for controlling the heating temperature and time; the positioning mechanism is used for fixing the substrate. The system comprises the chip desoldering device, a chip transfer device and an automatic control unit, and realizes automatic chip disassembly. According to the method, a substrate is heated through a heating table, the substrate is fixed through a positioning mechanism, and an automatic control unit controls a temperature control unit to control heating according to preset parameters and controls a chip transfer device to remove a chip. The heating table is used for heating and is matched with the positioning mechanism for positioning and fixing, multiple chips can be heated at the same time, simultaneous desoldering of the multiple chips is achieved, and therefore the desoldering efficiency is remarkably improved, and the problem of low efficiency caused by single-point heating of a traditional hot air gun is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic assembly, and in particular to a chip de-soldering device, system and use method. BACKGROUND

[0002] With the rapid development of electronic information technology, electronic products are constantly developing towards miniaturization, thinness and high performance. As the core component of electronic products, chips have higher and higher packaging density and smaller and smaller size, and the soldering process is becoming more and more complex. In the production, maintenance and recycling process of electronic products, chips often need to be disassembled from the circuit board. Chip de-soldering technology is a key technology in the field of electronic manufacturing and maintenance, and its efficiency directly affects the efficiency of production and maintenance.

[0003] Traditional chip de-soldering devices mainly rely on tools such as hot air guns to heat individual chips and their surrounding areas. This method has obvious efficiency bottlenecks.

[0004] Traditional de-soldering devices, such as hot air guns, can usually only heat and disassemble a single chip at a time. For circuit boards containing multiple chips, each chip needs to be processed, which is tedious and time-consuming, and has low efficiency. Especially in scenarios where a large number of chips need to be de-soldered, this single-point operation method seriously restricts production efficiency. Limited by heating methods and device structures, traditional de-soldering devices lack the ability to heat and disassemble multiple chips simultaneously, which is a fundamental factor restricting their efficiency improvement.

[0005] Therefore, it is necessary to improve the existing chip de-soldering device technology to overcome the defects of the prior art. SUMMARY

[0006] To overcome the problems in the related art, one of the purposes of the present application is to provide a chip de-soldering device that heats substrates to be de-soldered by a heating table, and fixes and positions the substrates by a positioning mechanism, which can heat and disassemble multiple substrates to be de-soldered at the same time, thereby significantly improving the efficiency of chip de-soldering and overcoming the problem of low de-soldering efficiency in the prior art.

[0007] A chip de-soldering device, comprising: a heating table for heating a plurality of substrates to be de-soldered, the heating table comprising a heating plane and a temperature control unit, the heating plane being used to accommodate a plurality of the substrates; a positioning mechanism for fixing and positioning the substrates so that the substrates are located in the effective heating area of the heating table; the temperature control unit, connected with the heating plane, is used to control the heating temperature and heating time of the heating plane.

[0008] Furthermore, the heating plane includes a heating array composed of multiple heating units; The temperature control unit is capable of independently controlling the temperature of each heating unit.

[0009] The heating plane consists of a heating array of multiple heating units, each with its own independently controllable temperature control unit. This allows the heating stage to form multiple independent heating zones, enabling differentiated heating of different areas. The size and shape of the heating zones can be flexibly configured according to the size of different substrates and the position of the chips, allowing for simultaneous heating of multiple substrates or multiple chips on a single substrate, significantly improving desoldering efficiency. Furthermore, independent temperature control allows for setting different heating temperatures based on the heat resistance of different chips, preventing damage to some chips due to overheating, further improving the reliability and yield of desoldering.

[0010] Furthermore, the positioning mechanism includes a fixing fixture for fixing and positioning the substrate; The fixing fixture has at least one fixing slot; The fixing slot corresponds to the shape of the substrate; The heating platform is provided with a fixed edge around its perimeter, which is used to limit and fix the fixing fixture.

[0011] The positioning mechanism uses a fixture with fixed slots to secure the substrate, and these slots correspond to the substrate's shape. This ensures precise positioning of the substrate on the fixture, preventing uneven heating caused by substrate misalignment. Fixed edges around the heating stage limit the fixture's movement during heating, further guaranteeing the stability and reliability of substrate positioning. Furthermore, the positioning mechanism also includes a fixture fixing strip for fixing the fixing fixture; The fixture fixing strip is mounted above the heating table.

[0012] The positioning mechanism also includes a fixture fixing strip mounted above the heating table for further securing the fixture. The fixture fixing strip applies pressure to the fixture, ensuring tight contact between it and the heating table, thereby improving the stability of the substrate and the efficiency of heat conduction. This reduces uneven heating caused by gaps between the substrate and the heating table, further improving the reliability and efficiency of desoldering.

[0013] Furthermore, the positioning mechanism also includes a fixing bar adjustment assembly disposed on both sides of the heating table; The fixing bar adjustment assembly includes slide rails and sliders fixed to both sides of the heating table; The two ends of the fixture fixing strip are connected to the slider.

[0014] The positioning mechanism also includes adjustable fixing strip components located on both sides of the heating stage. The fixture fixing strips are connected to the slide rail via sliders. This design allows for flexible adjustment of the fixture fixing strip position, accommodating fixtures and substrates of different sizes and shapes. It avoids obstructing the chip desoldering process. By adjusting the position of the slider on the slide rail, the distance between the fixture fixing strip and the heating stage, as well as its horizontal position, can be changed, thus achieving precise positioning and stable fixation of different substrates. This adjustability greatly improves the versatility and applicability of the chip desoldering device.

[0015] Furthermore, the heating surface is made of graphite material.

[0016] Graphite materials possess excellent thermal conductivity and thermal stability, enabling rapid and uniform heat transfer to the substrate, thus improving heating efficiency and temperature control accuracy. Graphite also exhibits good high-temperature resistance and chemical stability, allowing it to withstand the high-temperature environment during desoldering processes and extending the lifespan of the heating stage. Using graphite to fabricate the heating surface effectively enhances the performance and reliability of chip desoldering devices.

[0017] The second objective of this invention is to provide a chip desoldering system, comprising: Such as the chip desoldering device mentioned above; A chip transfer device for removing the chip from the substrate; An automatic control unit is connected to the chip desoldering device and the chip transfer device, and is used to automatically control the operation of the chip desoldering device and the chip transfer device.

[0018] This system integrates a chip transfer device and an automatic control unit into a complete automated chip desoldering and soldering device. The chip transfer device automatically removes the chip, avoiding inconsistencies and potential chip damage caused by manual operation. The automatic control unit coordinates the actions of the chip desoldering and soldering device and the chip transfer device, achieving automated control of the desoldering and soldering process, thus improving efficiency and automation. The automatic control unit can also precisely control the heating temperature, heating time, and the actions of the chip transfer device, ensuring the reliability and consistency of the desoldering and soldering process.

[0019] Furthermore, the chip transfer device includes a multi-axis robotic arm and a suction nozzle; The suction nozzle is mounted at the end of the multi-axis robotic arm and is used to adsorb the chip.

[0020] Multi-axis robotic arms possess multiple degrees of freedom, allowing for flexible adjustment of the nozzle's spatial position and orientation to adapt to chip removal needs in various locations and orientations. The nozzle uses negative pressure to adsorb the chip, enabling non-destructive chip gripping and avoiding potential damage caused by mechanical clamping methods. This allows the chip transfer system to efficiently and reliably complete chip removal tasks, improving the automation and reliability of the desoldering system.

[0021] Furthermore, the chip transfer device also includes a vision module, which is used to acquire an image of the chip and locate the chip.

[0022] The vision module can automatically identify the chip's position and orientation, and feed this information back to the automatic control unit, thereby guiding the robotic arm to precisely move above the chip for pickup. The application of the vision module improves the accuracy and automation of chip positioning, avoids errors that may occur in fixed-point movement procedures, and further enhances the efficiency and reliability of the desoldering system.

[0023] A third objective of this invention is to provide a method for using a chip desoldering system, which includes the following steps: The substrate to be desoldered is fixed by the positioning mechanism of the chip desoldering device, with the chip on the substrate facing upwards. The automatic control unit controls the temperature control unit to control the heating platform to heat the substrate according to preset heating parameters; When the predetermined time is reached, the automatic control unit controls the chip transfer device to remove the chip from the substrate.

[0024] A positioning mechanism secures the substrate to be desoldered, ensuring stable and accurate heating. An automatic control unit controls the heating stage according to preset heating parameters, automating and precisely controlling the heating process. Once the predetermined time is reached and the solder melts, the automatic control unit controls a chip transfer device to automatically remove the chip, automating the chip removal process. This reduces manual intervention, simplifies operation, and improves desoldering efficiency and reliability. In particular, preset heating parameters and automatic control enable batch desoldering of multiple substrates, significantly improving production efficiency and overcoming the inefficiencies of traditional desoldering methods.

[0025] The beneficial effects of this invention are as follows: This invention provides a chip desoldering device, which includes a heating stage and a positioning mechanism. The heating stage heats the substrate with soldered chips. Compared with the traditional single-point heating method of a hot air gun, the heating stage has a larger heating surface, enabling more uniform heating of the substrate over a wider area. It can simultaneously heat multiple substrates or multiple chip areas on a single substrate, achieving simultaneous desoldering of multiple chips, thereby significantly improving desoldering efficiency.

[0026] In addition, the positioning mechanism can accurately fix the substrate within the effective heating area of ​​the heating stage, ensuring that the chip area on the substrate can be heated evenly, avoiding uneven or ineffective heating caused by inaccurate positioning, and improving the accuracy and effectiveness of heating.

[0027] The temperature control unit can precisely control the heating temperature and heating time of the heating surface. By precisely controlling the heating temperature and time, it can be ensured that the solder reaches its melting point while keeping the temperature rise of the chip and substrate within a safe range. This ensures the desoldering effect while maximizing the protection of the chip and substrate, thus improving the reliability and yield of desoldering. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the fixation fixture provided in this application; Figure 2 This is a schematic diagram of the fixed edge provided in this application; Figure 3 This is a three-dimensional schematic diagram of the chip desoldering device provided in Embodiment 1 of this application; Figure 4 This is a top view of the chip desoldering apparatus provided in Embodiment 1 of this application.

[0029] Figure label: 100. Heating platform; 110. Heating surface; 120. Fixing edge; 210. Fixture; 211. Fixture slot; 220. Fixture fixing strip; 230. Fixture adjusting assembly; 231. Slide rail; 232. Slider. Detailed Implementation

[0030] Preferred embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0031] Example 1 like Figures 1 to 4As shown, this embodiment provides a chip desoldering device, system, and method of use. The device includes a heating stage 100 and a positioning mechanism.

[0032] The heating stage 100 is used to heat the substrate on which the chip is to be desoldered. The heating stage 100 includes a heating surface 110 and a temperature control unit. The heating surface 110 is used to contact the substrate and transfer heat to it. The temperature control unit is connected to the heating surface 110 and is used to control the heating temperature and heating time of the heating surface 110.

[0033] In this embodiment, the heating plane 110 is made of graphite. Graphite has excellent thermal conductivity and thermal stability, enabling it to quickly and uniformly transfer heat to the substrate, improving heating efficiency and temperature control accuracy. Simultaneously, graphite also possesses good high-temperature resistance and chemical stability, allowing it to withstand the high-temperature environment during the desoldering process and extending the service life of the heating stage 100.

[0034] The positioning mechanism is used to fix and position the substrate, ensuring that the substrate is within the effective heating area of ​​the heating table 100. In this embodiment, the positioning mechanism includes a fixing fixture 210 for fixing and positioning the substrate. The fixing fixture 210 has five fixing slots 211. The shape and size of the fixing slots 211 correspond to the shape of the substrate, allowing the substrate to be accurately placed in the fixing slots 211. The fixing fixture 210 also has inwardly recessed notches on both sides to facilitate movement of the fixing fixture 210.

[0035] The heating table 100 is provided with a fixing edge 120 around its perimeter for limiting and fixing the fixture 210. When the fixture 210 is placed on the heating table 100, the fixing edge 120 can limit the fixture 210.

[0036] The positioning mechanism also includes a fixture fixing strip 220 for further securing the fixture 210. The fixture fixing strip 220 is mounted above the heating table 100, such as... Figure 3 , Figure 4 As shown, in this embodiment, the fixture fixing strip 220 has two strips. The positioning mechanism also includes fixing strip adjustment assemblies 230 located on both sides of the heating table 100.

[0037] The fixing bar adjustment assembly 230 includes four slide rails 231 and four sliders 232 symmetrically fixed on both sides of the heating table 100. Two high and two low slide rails 231 and two sliders 231 are respectively provided on each side, and both sliders 231 slide in engagement with the high and low slide rails 231. The two ends of the two fixture fixing bars 220 are respectively connected to the sliders 232 on both sides. By adjusting the position of the sliders 232 on the slide rails 231, the distance between the fixture fixing bars 220 and the heating table 100, as well as their horizontal position, can be changed.

[0038] The chip desoldering system of this embodiment includes the chip desoldering device, chip transfer device and automatic control unit described above.

[0039] A chip transfer device is used to remove chips from a substrate. In this embodiment, the chip transfer device includes a multi-axis robotic arm and a suction nozzle. The suction nozzle is mounted at the end of the multi-axis robotic arm for adsorbing the chip.

[0040] The chip transfer device also includes a vision module for acquiring images of the chip and locating the chip.

[0041] The automatic control unit is connected to the chip desoldering device and the chip transfer device to control the heating temperature and heating time of the chip desoldering device, as well as the removal action of the chip transfer device.

[0042] The chip desoldering system in this embodiment also includes a host computer connected to the automatic control unit, used to set desoldering parameters, monitor the desoldering process, and store desoldering data.

[0043] The method of using the chip desoldering and soldering system in this embodiment includes the following steps: The substrate to be desoldered is fixed in place by the positioning mechanism of the chip desoldering device, with the chip on the substrate facing upwards. The substrate to be desoldered is placed in the fixing slot 211 of the fixing fixture 210, and then the fixing fixture 210 is placed on the heating stage 100 and limited by the fixing edge 120. Finally, the position of the fixture fixing strip 220 is adjusted to press it firmly against the fixing fixture 210.

[0044] The automatic control unit controls the heating stage 100 to heat the substrate according to preset heating parameters. The preset heating parameters can be obtained through desoldering experiments or a database. The heating parameters include heating temperature and heating time.

[0045] When the predetermined time is reached, the automatic control unit controls the chip transfer device to remove the chip from the substrate. When the solder reaches the preset molten state, the automatic control unit controls the multi-axis robotic arm to move above the chip, controls the suction nozzle to pick up the chip, and removes the chip from the substrate.

[0046] The automatic control unit controls the heating table 100 to stop heating.

[0047] This embodiment provides a chip desoldering device, system, and method of use. By employing a graphite heating plane 110 and a positioning mechanism, it achieves efficient and uniform heating and stable positioning of the substrate. The excellent thermal conductivity and thermal stability of graphite ensure rapid and uniform heating, improving desoldering efficiency. The positioning mechanism, through a fixing fixture 210 with a fixed slot 211, a fixing edge 120 of the limiting fixing fixture 210, and an adjustable fixture fixing strip 220, achieves precise fixing and positioning of the substrate, avoiding uneven heating or chip damage caused by substrate misalignment or unstable fixing. By pre-setting heating parameters and automated control, the operation difficulty is reduced, and the reliability and yield of the desoldering process are improved. The chip desoldering system also includes a chip transfer device and an automatic control unit, realizing automated control of the desoldering process, avoiding inconsistencies and potential chip damage caused by manual operation, further improving desoldering efficiency and automation.

[0048] Example 2 like Figures 1 to 4 As shown, this embodiment provides a chip desoldering device, system, and method of use. The device can efficiently disassemble chips soldered on a substrate, and is especially suitable for scenarios where multiple chips need to be disassembled at the same time, which can significantly improve desoldering efficiency.

[0049] The chip desoldering device in this embodiment includes a heating stage 100 and a positioning mechanism.

[0050] The heating stage 100 is used to heat the substrate on which the chip is to be desoldered.

[0051] The heating stage 100 includes a heating surface 110 and a temperature control unit. The heating surface 110 is used to contact the substrate and transfer heat to it. The temperature control unit is connected to the heating surface 110 and is used to control the heating temperature and heating time of the heating surface 110.

[0052] The heating plane 110 comprises a heating array consisting of multiple heating units. Each heating unit can have its temperature independently controlled. The temperature control unit can independently control the temperature of each heating unit, thereby achieving precise control of the heating area. This design allows the heating stage 100 to form multiple independent heating areas, and the size and shape of the heating areas can be flexibly configured according to the size of different substrates and the position of the chips, enabling simultaneous heating of multiple substrates or multiple chips on a single substrate. Furthermore, independent temperature control allows for setting different heating temperatures based on the heat resistance of different chips, preventing some chips from being damaged due to excessive heat.

[0053] The positioning mechanism is used to fix and position the substrate, ensuring that the substrate is within the effective heating area of ​​the heating table 100. In this embodiment, the positioning mechanism includes a fixing fixture 210 for fixing and positioning the substrate. The fixing fixture 210 has at least one fixing slot 211. The shape and size of the fixing slot 211 correspond to the shape of the substrate, allowing the substrate to be precisely placed in the fixing slot 211.

[0054] The heating stage 100 is provided with a fixing edge 120 around its perimeter, which is used to limit and fix the fixture 210. When the fixture 210 is placed on the heating stage 100, the fixing edge 120 can limit the fixture 210 to prevent it from moving during the heating process and ensure the stability of the substrate during the heating process.

[0055] The positioning mechanism also includes a fixture fixing strip 220 for further securing the fixture 210. The fixture fixing strip 220 is mounted above the heating table 100. The fixture fixing strip 220 applies pressure to the fixture 210, ensuring close contact between it and the heating table 100, thereby improving the stability of the substrate and the efficiency of heat conduction.

[0056] The positioning mechanism also includes fixing strip adjustment assemblies 230 disposed on both sides of the heating table 100. In this embodiment, there are two fixture fixing strips 220. Corresponding to the number of fixture fixing strips 220, there are also two fixing strip adjustment assemblies 230, each fixing strip adjustment assembly 230 corresponding to one fixing strip. The fixing strip adjustment assembly 230 includes a slide rail 231 and a slider 232 fixed to both sides of the heating table 100. The two ends of the fixture fixing strip 220 are connected to the slider 232. By adjusting the position of the slider 232 on the slide rail 231, the distance between the fixture fixing strip 220 and the heating table 100, as well as its position in the horizontal direction, can be changed, thereby achieving adaptation to fixing fixtures 210 and substrates of different sizes and shapes. This design allows the position of the fixture fixing strip 220 to be flexibly adjusted, thereby adapting to fixing fixtures 210 and substrates of different sizes and shapes, improving the versatility of the device.

[0057] The chip desoldering system of this embodiment includes the chip desoldering device, chip transfer device and automatic control unit described above.

[0058] A chip transfer device is used to remove chips from a substrate. In this embodiment, the chip transfer device includes a multi-axis robotic arm and a suction nozzle. The suction nozzle is mounted at the end of the multi-axis robotic arm for adsorbing the chip. The multi-axis robotic arm has multiple degrees of freedom, allowing for flexible adjustment of the spatial position and orientation of the suction nozzle.

[0059] The chip transfer device also includes a vision module for acquiring images of the chip and locating it. The vision module can automatically identify the chip's position and orientation and feed this information back to the automatic control unit.

[0060] The automatic control unit is connected to the chip desoldering device and the chip transfer device to control the heating temperature and heating time of the chip desoldering device, as well as the removal action of the chip transfer device. The automatic control unit can receive information provided by the vision module and control the heating parameters of the heating stage 100 and / or the removal action of the multi-axis robotic arm based on this information.

[0061] The chip desoldering system in this embodiment also includes a host computer connected to the automatic control unit, used to set desoldering parameters, monitor the desoldering process, and store desoldering data.

[0062] The method of using the chip desoldering and soldering system in this embodiment includes the following steps: The substrate to be desoldered is fixed in place by the positioning mechanism of the chip desoldering device, with the chip on the substrate facing upwards. Specifically, the substrate to be desoldered is placed in the fixing slot 211 of the fixing fixture 210, and then the fixing fixture 210 is placed on the heating table 100 and limited by the fixing edge 120. Finally, the position of the fixture fixing strip 220 is adjusted to press it firmly against the fixing fixture 210.

[0063] The automatic control unit controls the heating stage 100 to heat the substrate according to preset heating parameters. These preset heating parameters can be obtained through desoldering experiments or a database. The heating parameters include heating temperature and heating time. The heating surface 110 of the heating stage 100 heats the substrate according to a preset heating curve.

[0064] When the predetermined time is reached, the automatic control unit controls the chip transfer device to remove the chip from the substrate. During the heating process, the melting state of the solder is monitored. When the solder reaches the preset melting state, the automatic control unit controls the multi-axis robotic arm to move above the chip, controls the suction nozzle to pick up the chip, and removes the chip from the substrate.

[0065] The automatic control unit controls the heating table 100 to stop heating.

[0066] In this embodiment, the heating stage 100 employs a heating array composed of multiple independently temperature-controlled heating units. One or more fixtures 210 can be placed on the heating array as needed, and corresponding heating parameters can be set to achieve simultaneous heating of multiple substrates. Once the solder melts, the automatic control unit can control the chip transfer device to sequentially remove the chips from each substrate.

[0067] This embodiment provides a chip desoldering device, system, and method, employing a heating array composed of multiple independently temperature-controlled heating units. This allows the heating stage 100 to form multiple independent heating zones, enabling simultaneous heating of multiple substrates or multiple chips on a single substrate, significantly improving desoldering efficiency. Each heating unit can be independently temperature-controlled, allowing for flexible temperature settings based on the heat resistance of different chips, preventing damage to some chips due to excessive temperature and improving the reliability and yield of desoldering. Simultaneously, the positioning mechanism design ensures the stability and positional accuracy of the substrate during heating, avoiding uneven heating caused by substrate misalignment. Furthermore, the system integrates a chip transfer device, a vision module, and an automatic control unit, achieving automation and intelligence in the desoldering process. The vision module automatically identifies the chip position, and the automatic control unit controls the chip transfer device to precisely remove the chip, reducing manual intervention, lowering operational difficulty, and further improving desoldering efficiency and reliability.

[0068] The system addresses the issue of uneven heating caused by misalignment. Furthermore, it integrates a chip transfer device, a vision module, and an automatic control unit, automating and intelligently managing the desoldering process. The vision module automatically identifies the chip's position, and the automatic control unit precisely removes the chip using the chip transfer device, reducing manual intervention, simplifying operations, and further improving the efficiency and reliability of desoldering.

[0069] Example 3 This embodiment provides a chip desoldering device. Based on Embodiments 1 and 2, the embodiment further elaborates on the invention. The device can actively suppress thermal deformation of the substrate during the heating process. It is especially suitable for desoldering scenarios of large-size or thin substrates with extremely high process precision requirements, and can significantly improve the reliability and yield of desoldering.

[0070] The chip desoldering device in this embodiment also includes a heating stage 100 and a positioning mechanism. Unlike the previous embodiments, the system in this embodiment has undergone the following functional expansions and structural optimizations: This embodiment of the system adds a non-contact temperature sensing array. This array can consist of multiple infrared thermal imaging sensors, mounted on a fixed gantry bracket above the heating stage 100, and its field of view can completely cover the entire effective heating area on the heating stage 100. During the heating process, the temperature sensing array can scan and capture the complete temperature distribution on the surface of the substrate to be desoldered in real time at a high refresh rate, generate two-dimensional temperature cloud map data, and send this data to the automatic control unit in real time.

[0071] In this embodiment, the internal structure of the heating stage 100 has been improved, integrating a pre-stressed anti-warping mechanism. This mechanism includes multiple independently controllable Z-axis fine-tuning pins, which are evenly distributed below the heating surface 110. Each fine-tuning pin is connected to an independent micro servo motor. The automatic control unit can precisely control the rotation angle and torque of each servo motor according to an algorithm, thereby enabling each fine-tuning pin to independently perform micron-level vertical lifting and lowering, and apply a precise and controllable local support force to the substrate placed on the heating surface 110.

[0072] In this embodiment, the chip desoldering process is as follows: The operator uses a positioning mechanism to fix the substrate to be desoldered onto the heating table 100, with the bottom of the substrate in close contact with the heating surface 110.

[0073] The automatic control unit initiates the heating program, and at the same time, the non-contact temperature sensing array starts working to monitor the surface temperature changes of the substrate in real time.

[0074] During the heating process, the substrate may expand unevenly due to internal thermal stress, causing local areas to arch upwards, i.e., warping deformation. This deformation can cause parts of the substrate to detach from the heating plane 110, resulting in uneven heating, and in severe cases, it may even damage the substrate or surrounding components.

[0075] The automatic control unit analyzes the temperature cloud map from the temperature sensor array in real time. When an abnormal temperature is detected in a certain area of ​​the substrate (e.g., the heating rate is significantly lower than that of the surrounding area, which is a typical characteristic of warping and poor contact with the heat source in that area), the closed-loop control system responds immediately.

[0076] The automatic control unit accurately calculates the location and amount of deformation of the warping based on a preset material thermal expansion coefficient model and temperature data. It then sends commands to one or more micro servo motors located below that position.

[0077] Upon receiving the command, the servo motor drives the corresponding Z-axis fine-tuning pin to lift slightly upwards, applying a precisely calculated prestress to the substrate. This force counteracts internal thermal stress, flattens the warped substrate area, and restores good contact with the heating surface 110.

[0078] This is a continuous closed-loop feedback process: the temperature sensor array continuously monitors, the automatic control unit continuously analyzes, and the prestressed anti-warping mechanism continuously performs dynamic fine-tuning until the entire heating process ends.

[0079] Through closed-loop control involving real-time monitoring, analysis, calculation, and proactive compensation, the traditional passive clamping and fixing mechanism is upgraded to intelligent proactive deformation management, fundamentally solving the substrate warping problem during the heating process. This ensures the substrate remains in close contact with the heating plane 110 throughout the entire heating cycle, greatly guaranteeing the efficiency and uniformity of heat transfer and providing a prerequisite for high-quality, high-success-rate desoldering. The system can adaptively compensate for deformation of substrates of different sizes, thicknesses, materials, and layers, significantly expanding the equipment's application range. Simultaneously, by preventing micro-cracks in the substrate or damage to components caused by thermal stress, the overall reliability and yield of the desoldering process are significantly improved.

[0080] Example 4 This embodiment provides a chip desoldering device, which further elaborates on the above embodiments, aiming to provide an intelligent chip removal solution with force feedback and micro-vibration assisted separation functions. This solution can significantly improve the success rate of desoldering, especially when handling precision chips with dense solder joints, small size, or high value, and can effectively avoid damage to the chip or substrate pads caused by residual solder tension.

[0081] The chip desoldering system of this embodiment, whose basic chip desoldering device (including heating stage 100 and positioning mechanism) has a structure and operation mode that can be referred to in Embodiments 1 to 3. The core improvement of this embodiment is focused on the chip transfer device, which, in addition to including a multi-axis robotic arm and a suction nozzle, innovatively integrates a miniature force sensor and a high-frequency micro-vibrator.

[0082] Specifically, a miniature force sensor is integrated into the connection between the nozzle and the multi-axis robotic arm. Its sensing direction is the Z-axis (vertical direction), used to monitor the pulling force experienced by the nozzle during chip lifting in real time with high precision. The signal output of this force sensor is electrically connected to the automatic control unit, enabling the automatic control unit to acquire data on the removal force in real time.

[0083] A high-frequency micro-vibrator, such as a piezoelectric ceramic actuator, is precisely mounted at the end of the nozzle or inside it. This vibrator, under the command of an automatic control unit, generates high-frequency (e.g., 20-40 kHz) and low-amplitude (e.g., 1-5 μm) mechanical vibrations and transmits them to the chip adsorbed through the nozzle. The control input of this vibrator is also connected to the automatic control unit.

[0084] The chip desoldering and resoldering system of this embodiment is used in the following steps: 1. Substrate fixing and heating: Similar to the previous embodiment, the substrate to be desoldered is fixed by a positioning mechanism with the chips on the substrate facing upwards. The automatic control unit controls the heating stage 100 to heat the substrate according to preset parameters until the solder reaches a preset molten state.

[0085] 2. Adsorption and Initial Lifting: After reaching the predetermined time or temperature, the automatic control unit controls the multi-axis robotic arm of the chip transfer device to move directly above the target chip. The suction nozzle descends and applies negative pressure to firmly adsorb the chip. Subsequently, the multi-axis robotic arm is controlled to slowly lift the chip upward along the Z-axis.

[0086] 3. Force feedback monitoring and intelligent decision-making: In the initial stage of the lift, the automatic control unit begins to monitor data from the micro force sensor in real time.

[0087] Scenario 1 (Normal Separation): If the pulling force detected by the force sensor is stable and consistently less than the preset safety threshold (e.g., 0.5N, which can be set according to the chip package and size), the automatic control unit determines that the solder has completely melted and the chip can be safely removed. At this point, the lifting action continues until the chip is completely detached from the substrate.

[0088] Scenario 2 (Abnormal Resistance): If the pulling force detected by the force sensor increases rapidly or exceeds the safety threshold in a short period of time, the automatic control unit will determine that the solder is partially bonded or has a large surface tension, and forcibly pulling it up will cause damage.

[0089] 4. Micro-vibration assisted separation: Upon triggering condition two, the automatic control unit immediately performs the following coordinated operation: (1) Pause the Z-axis lifting action of the multi-axis robotic arm and maintain the current height.

[0090] (2) Send a command to the high-frequency micro-vibrator to operate for a short preset time (e.g., 0.1-0.5 seconds). The applied high-frequency micro-vibration can effectively break the surface tension of the molten solder and cut off any remaining, extremely small bonding joints, so that the chip “floats” on the molten solder.

[0091] (3) After the micro-vibration ends, try to slowly lift the chip along the Z-axis again and continuously monitor the force sensor readings. Usually, after one vibration-assisted operation, the tension will drop significantly to within the safe threshold.

[0092] 5. Removal complete: Once the pulling force meets safety requirements, the automatic control unit controls the robotic arm to complete the subsequent lifting and transfer work, placing the disassembled chip into the designated location. Then, the heating platform 100 is stopped from heating.

[0093] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application. Any specific values ​​in all examples shown and discussed herein should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0094] Furthermore, it should be noted that the use of terms such as "first" and "second" is merely for ease of distinction, and unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application.

[0095] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A chip desoldering device, characterized in that, include: A heating stage (100) is used to heat several substrates to be desoldered from chips. The heating stage (100) includes a heating plane (110) and a temperature control unit. The heating plane (110) is used to accommodate several of the substrates. A positioning mechanism is used to fix and position the substrate so that the substrate is located in the effective heating area of ​​the heating table (100); The temperature control unit is connected to the heating surface (110) and is used to control the heating temperature and heating time of the heating surface (110).

2. The chip desoldering device according to claim 1, characterized in that: The heating plane (110) includes a heating array composed of multiple heating units; The temperature control unit is capable of independently controlling the temperature of each heating unit.

3. The chip desoldering device according to claim 1, characterized in that: The positioning mechanism includes a fixing fixture (210) for fixing and positioning the substrate; The fixing fixture (210) is provided with at least one fixing slot (211); The fixed slot (211) corresponds to the shape of the substrate; The heating table (100) is provided with a fixing edge (120) around its perimeter, which is used to limit and fix the fixing fixture (210).

4. The chip desoldering device according to claim 3, characterized in that: The positioning mechanism also includes a fixture fixing strip (220) for fixing the fixing fixture (210); The fixture fixing strip (220) is mounted above the heating table (100).

5. The chip desoldering device according to claim 4, characterized in that: The positioning mechanism also includes a fixing bar adjustment assembly (230) disposed on both sides of the heating table (100); The fixing bar adjustment assembly (230) includes slide rails (231) and sliders (232) fixed to both sides of the heating table (100); The two ends of the fixture fixing strip (220) are connected to the slider (232).

6. The chip desoldering device according to any one of claims 1-5, characterized in that: The heating surface (110) is made of graphite material.

7. A chip desoldering system, characterized in that, include: The chip desoldering apparatus as described in claims 1 to 6; A chip transfer device for removing the chip from the substrate; An automatic control unit is connected to the chip desoldering device and the chip transfer device, and is used to automatically control the operation of the chip desoldering device and the chip transfer device.

8. The chip desoldering system according to claim 7, characterized in that: The chip transfer device includes a multi-axis robotic arm and a suction nozzle; The suction nozzle is mounted at the end of the multi-axis robotic arm and is used to adsorb the chip.

9. The chip desoldering system according to claim 7, characterized in that: The chip transfer device further includes a vision module, which is used to acquire an image of the chip and locate the chip.

10. A method of using a chip desoldering system, characterized in that, A chip desoldering system as described in any one of claims 7 to 9, comprising the following steps: The substrate to be desoldered is fixed by the positioning mechanism of the chip desoldering device, with the chip on the substrate facing upwards. The automatic control unit controls the temperature control unit to control the heating table (100) to heat the substrate according to the preset heating parameters; When the predetermined time is reached, the automatic control unit controls the chip transfer device to remove the chip from the substrate.

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