Double-glass photovoltaic module layering equipment and method based on cooperation of linear cutting and laser scanning

Abstract

The invention provides a double-glass photovoltaic module layering device and method based on cooperation of linear cutting and laser scanning. The double-glass photovoltaic module layering equipment comprises a rack, a sliding rail, a movement module, a visual identification system, a laser scanning system and a linear cutting separation system, the rack is used for bearing a double-glass photovoltaic module, the sliding rail is installed on the rack, the movement module is slidably installed on the sliding rail, the visual identification system is installed on the movement module, the laser scanning system is movably installed on the movement module, and the linear cutting separation system is installed on the rack. The linear cutting separation system is slidably installed on the sliding rail. According to the method, through the synergistic effect of linear cutting and laser scanning, laser is regulated and controlled to accurately act on the surface of a silicon wafer, layering of the silicon wafer / adhesive film in a silicon wafer area is achieved, the adhesive film in a silicon wafer-free area is efficiently cut through linear cutting according to a preset path, and finally complete layering and separation of a double-glass assembly are guaranteed.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of photovoltaic module recycling, and in particular relates to a double-glass photovoltaic module layering equipment and method based on line cutting and laser scanning cooperation. BACKGROUND

[0002] With the increasing global demand for renewable energy, the photovoltaic industry has ushered in unprecedented development opportunities. Photovoltaic modules, as the core components of solar power generation systems, their manufacturing technology and production process improvements are of great significance to improve overall power generation efficiency and reduce costs. Double-glass photovoltaic modules have occupied an increasingly important position in the market in recent years due to their excellent durability and power generation efficiency.

[0003] Double-glass photovoltaic modules are composed of two tempered glasses, a film layer and solar cell pieces, and are formed into a composite layer through high-temperature lamination technology. This structure not only enhances the mechanical strength of the module, but also improves its weather resistance and service life. However, at the same time, this kind of fully enclosed multi-layer composite structure also brings certain challenges to the recycling of double-glass modules. Traditional mechanical methods, high-temperature incineration methods and chemical solvent methods will no longer be applicable. First of all, the structure of double-glass modules is relatively complex, consisting of two glasses and the cell pieces and encapsulation materials in between, and the adhesion of the film material to the glass and cell pieces is strong, which increases the technical difficulty in the recycling process. In addition, to ensure the complete sealing of the cell pieces, only the film is contained in the area around the double-glass module and the silicon piece, and the characteristics of this area and the silicon piece area are quite different, which also increases the difficulty of separating the double-glass module. Secondly, the traditional recycling module methods (such as chemical treatment method, physical recycling method, etc.) rely on relatively simple equipment and processes, and these equipment and processes are not up to the task when dealing with complex and variable double-glass photovoltaic modules. In addition, due to the lack of efficient automated equipment and intelligent control systems, traditional methods have difficulties in achieving large-scale and high-efficiency recycling. Finally, existing cutting methods may not be able to ensure the complete separation of high-precision glass, film and silicon pieces, thereby affecting the performance and reliability of the recycled materials. The stability problem in the recycling process can also cause damage to the internal components of the module or increase the defect rate.

[0004] Laser technology, with its high speed, precision, and non-contact characteristics, is gradually replacing traditional processing techniques in high-end manufacturing, becoming the mainstream technology. It uses a laser beam to precisely and non-contactly process the encapsulant film through glass, achieving separation and delamination between the encapsulant film and the silicon wafer or glass without physical damage to the material. Near-infrared lasers are currently a relatively mature type of laser, capable of completely penetrating glass to act on the encapsulant film. However, in reality, because the encapsulant film has weak laser absorption, most of the laser energy is absorbed by the silicon wafer. When the temperature reaches the reaction temperature of the encapsulant film, gas is generated at the interface between the encapsulant film and the silicon wafer, resulting in delamination. However, in the manufacturing of double-glass modules, to achieve complete sealing of the silicon wafer, only encapsulant material is present around each individual silicon wafer and the entire double-glass module. This area, lacking silicon wafer, absorbs less light and cannot delaminate, ultimately leading to incomplete separation of the double-glass module.

[0005] Wire cutting technology, as a mature cutting process, has been widely used in the cutting of both metallic and non-metallic materials. However, due to the large size of double-glass modules, it is difficult to achieve complete separation of the modules using only wire cutting technology during the separation and delamination process of double-glass photovoltaic modules. Summary of the Invention

[0006] The technical problem addressed in this application is: how to achieve complete delamination of the internal adhesive layer and glass in a double-glass module using a combination of laser and wire cutting.

[0007] This application provides a double-glass photovoltaic module layering equipment based on the combined use of wire cutting and laser scanning, the double-glass photovoltaic module layering equipment comprising:

[0008] The rack is used to support double-glass photovoltaic modules;

[0009] A slide rail, which is mounted on the frame;

[0010] A motion module, which is slidably mounted on the slide rail;

[0011] A visual recognition system, wherein the visual recognition system is installed on the motion module;

[0012] A laser scanning system is movably mounted on the motion module;

[0013] A wire cutting separation system, wherein the wire cutting separation system is slidably mounted on the slide rail.

[0014] Optionally, the direction of motion of the motion module in the visual recognition system is perpendicular to the direction of sliding of the motion module on the slide rail.

[0015] Optionally, the direction of motion of the laser scanning system on the motion module is perpendicular to the direction of sliding of the motion module on the slide rail.

[0016] Optionally, the laser scanning system includes a laser and a laser scanning head.

[0017] Optionally, the laser scanning head includes an XY scanning mirror, a field mirror, and a galvanometer.

[0018] Optionally, the visual recognition system includes a lighting system, a camera, an image acquisition module, and a processor.

[0019] Optionally, the wire cutting separation system includes a wire tensioner, a wire, and a cutting clamp.

[0020] This application also discloses a layering method for a double-glass photovoltaic module layering equipment based on the synergy of wire cutting and laser scanning, the layering method comprising:

[0021] Fix the double-glass photovoltaic modules to be separated to the frame;

[0022] The double-glass photovoltaic module is scanned using a visual recognition system to determine the silicon-free and silicon-containing areas of the double-glass photovoltaic module;

[0023] A laser scanning system is used to scan the silicon-free areas located at the edge, and then a wire cutting separation system is used to segment the silicon-free areas located at the edge.

[0024] A laser scanning system is used to scan the double-glass photovoltaic module, and a wire cutting separation system is used simultaneously after the laser scanning to divide the non-silicon wafer area around the silicon wafer area.

[0025] Optionally, when scanning using a laser scanning system, the motion module is controlled to slide along a first direction at a first speed on the slide rail, and the laser scanning system is controlled to move along a second direction at a second speed on the motion module, wherein the first direction is perpendicular to the second direction and the second speed is greater than the first speed.

[0026] This application provides a layering equipment and method for double-glass photovoltaic modules based on the synergy of wire cutting and laser scanning, which has the following technical advantages:

[0027] This method utilizes the synergistic effect of wire cutting and laser scanning to precisely target the silicon wafer surface with the laser, achieving the separation of silicon wafer / film in the silicon wafer area. The wire cutting efficiently cuts the film in the silicon wafer-free area along a predetermined path, ultimately ensuring complete separation of the double-glass module. Attached Figure Description

[0028] Figure 1 A top view of a double-glass photovoltaic module layering apparatus based on wire cutting and laser scanning collaboration according to one or more embodiments;

[0029] Figure 2A side view of a double-glass photovoltaic module layering apparatus based on wire cutting and laser scanning in accordance with one or more embodiments. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0031] Before describing the various embodiments of this application in detail, the technical concept of this application is first briefly described: Currently, it is difficult to completely separate double-glass modules using only laser scanning or only wire cutting technology. Therefore, this application provides a layering equipment and method for double-glass photovoltaic modules based on the synergy of wire cutting and laser scanning. A visual recognition system is used to identify the areas with and without silicon wafers. A laser scanning system is used to scan the double-glass photovoltaic module to achieve precise layering and separation of the silicon wafer areas. A wire cutting tool is used to cut the areas without silicon wafers, achieving separation of the encapsulant film and glass within these areas. The specific principle of the layering equipment for double-glass photovoltaic modules based on the synergy of wire cutting and laser scanning of this application will be described below with reference to more embodiments.

[0032] Specifically, such as Figure 1 and Figure 2 As shown, the double-glass photovoltaic module layering equipment based on the synergy of wire cutting and laser scanning in this embodiment includes a frame 10, a slide rail 20, a motion module 30, a vision recognition system 40, a laser scanning system 50, and a wire cutting separation system 60. The frame 10 is used to support the double-glass photovoltaic modules. The slide rail 20 is installed on the frame 10. The motion module 30 is slidably installed on the slide rail 20. The vision recognition system 40 is installed on the motion module 30. The laser scanning system 50 is movably installed on the motion module 30. The wire cutting separation system 60 is slidably installed on the slide rail 20.

[0033] In one or more embodiments, the slide rail 20 is mounted on the edge of the frame 10 along its length. The movement direction of the motion module 30 is perpendicular to the sliding direction of the motion module 30 on the slide rail 20. That is, the visual recognition system 40 can move on the motion module 30 along the width direction of the frame 10, allowing the visual recognition system 40 to move in a two-dimensional direction, realizing longitudinal and lateral scanning of the double-glass photovoltaic module and accurately identifying the areas with and without silicon wafers. For example, the visual recognition system 40 includes a lighting system, a camera, an image acquisition module, and a processor. After taking pictures and processing them, the system distinguishes the areas without and with silicon wafers in the double-glass module.

[0034] In one or more embodiments, the movement direction of the motion module 30 of the laser scanning system 50 is perpendicular to the sliding direction of the motion module 30 on the slide rail 20. That is, the laser scanning system 50 can move along the width direction of the frame 10 on the motion module 30, and the motion module 30 can move along the length direction of the frame 10, enabling the laser scanning system 50 to move in a two-dimensional direction, achieving full-area scanning of the double-glass photovoltaic module. Exemplarily, the laser scanning system 50 includes a laser and a laser scanning head. Multiple sets of lasers and laser scanning heads can be used for more efficient scanning of the double-glass photovoltaic module. The laser scanning head includes an XY scanning mirror, a field mirror, and a galvanometer, with a scanning range of 100mm to 1000mm for a single laser scanning head. The laser scanning system emits a laser beam from the laser, which passes through the galvanometer and acts on the surface of the double-glass module. The laser rapidly oscillates to complete the scanning and layering of the silicon wafer area.

[0035] In one embodiment, the visual recognition system 40 is mounted on the laser scanning system 50.

[0036] In one or more embodiments, the wire EDM separation system 60 includes a wire tensioner 61, a cutting wire 62, and a cutting fixture 63. The cutting wire 62 is wound around the wire tensioner 61 and passes through the cutting fixture 63, connecting to another cutting fixture 63 on the other side. A motor can drive the cutting wire 62 to move at high speed. The wire EDM separation system 60 uses a mechanical transmission device to drive the cutting wire 62 to cut the adhesive film that has not been separated after laser scanning. The diameter of the cutting wire 62 is 0.1 mm to 1 mm. During cutting, the cutting wire 62 is located approximately 10 mm behind the laser scanning system 50.

[0037] In one or more embodiments, the layering method of the double-glass photovoltaic module layering equipment based on wire cutting and laser scanning synergy includes the following steps:

[0038] Step S10: Fix the double-glass photovoltaic module to be separated onto the frame 10. Before fixing, perform a preliminary inspection and cleaning of the double-glass module to ensure that there are no impurities on the module surface that could interfere with the accuracy of laser scanning. Then, place the double-glass module on the worktable to be processed and prepare the necessary wire cutting equipment and auxiliary tools.

[0039] Step S20: Use a visual recognition system to scan the double-glass photovoltaic module to determine the areas without silicon wafers and the areas with silicon wafers in the double-glass photovoltaic module.

[0040] Step S30: The silicon-free area at the edge is scanned using a laser scanning system, and then the silicon-free area at the edge is segmented using a wire cutting separation system. By cutting the adhesive film in the silicon-free area, an exhaust channel can be reserved for the subsequent laser scanning process of the silicon wafer.

[0041] Step S40: Use a laser scanning system to scan the double-glass photovoltaic module, and simultaneously use a wire cutting separation system to divide the non-silicon wafer area around the silicon wafer area after laser scanning.

[0042] When scanning using a laser scanning system, the motion module slides along a first direction at a first speed on a slide rail, and the laser scanning system moves along a second direction at a second speed on the motion module. The first direction is perpendicular to the second direction, and the second speed is greater than the first speed. For example, the first direction is the length direction of the frame 10, and the second direction is the width direction of the frame 10. The laser power is selected as 1000W, the second speed (lateral scanning speed) is 50000mm / s, the first speed (longitudinal forward speed) is 10mm / s, and the wire cutting speed is consistent with the laser's longitudinal forward speed. The laser scans gradually along the edge of the photovoltaic module in a "Z" shaped path until it fully covers and completes the laser processing of the entire module.

[0043] 1. Highly efficient and precise delamination capability: Through the synergy of wire cutting and laser scanning, this method can precisely control the laser's action on the silicon wafer surface to achieve silicon wafer / encapsulant film delamination, while efficiently cutting the encapsulant film in areas without silicon wafers, ensuring complete delamination of double-glass modules. This synergy improves the efficiency, accuracy, and thoroughness of the delamination process.

[0044] 2. High energy efficiency: The laser scans the edge of the photovoltaic module in a zigzag pattern, ensuring full coverage and successful completion of the entire laser processing. During this process, the silicon wafer area achieves high energy efficiency due to its high laser absorption rate. Simultaneously, the cutting line closely follows the laser scanning path, precisely cutting the encapsulant film in areas without silicon wafer, effectively avoiding the high energy loss that might occur due to the low laser absorption rate of the encapsulant film.

[0045] 3. Flexibility and adaptability: This method can scan and locate the areas with and without silicon wafers according to the specific structural distribution of the double-glass module through a vision system, thereby flexibly adjusting the working path and parameters of the laser and the cutting line. This flexibility allows the method to adapt to double-glass photovoltaic modules of different specifications and types.

[0046] 4. High degree of automation: This equipment achieves a fully automated process from initial inspection, fixing, scanning and positioning to layer separation. This greatly improves production efficiency and reduces labor costs.

[0047] 5. Scalability and Modular Design: The laser scanning system can consist of a single or multiple lasers and laser scanning heads. Multiple laser scanning heads need to work side by side. This design makes the method more scalable when dealing with large-scale or complex-shaped double-glass modules. At the same time, the modular design also makes the equipment easier to maintain and upgrade.

[0048] The specific embodiments of this application have been described in detail above. Although some embodiments have been shown and described, those skilled in the art should understand that modifications and improvements can be made to these embodiments without departing from the principles and spirit of this application as defined by the claims and their equivalents, and such modifications and improvements should also be within the protection scope of this application.

Claims

1. A layering equipment for double-glass photovoltaic modules based on the synergy of wire cutting and laser scanning, characterized in that, The double-glass photovoltaic module layering equipment includes: The rack is used to support double-glass photovoltaic modules; A slide rail, which is mounted on the frame; A motion module, which is slidably mounted on the slide rail; A visual recognition system, wherein the visual recognition system is installed on the motion module; A laser scanning system is movably mounted on the motion module; A wire cutting separation system, wherein the wire cutting separation system is slidably mounted on the slide rail.

2. The double-glass photovoltaic module layering equipment according to claim 1, characterized in that, The direction of motion of the motion module in the visual recognition system is perpendicular to the direction of sliding of the motion module on the slide rail.

3. The double-glass photovoltaic module layering equipment according to claim 1, characterized in that, The direction of motion of the laser scanning system on the motion module is perpendicular to the direction of sliding of the motion module on the slide rail.

4. The double-glass photovoltaic module layering equipment according to claim 3, characterized in that, The laser scanning system includes a laser and a laser scanning head.

5. The double-glass photovoltaic module layering equipment according to claim 4, characterized in that, The laser scanning head includes an XY scanning mirror, a field mirror, and a galvanometer.

6. The double-glass photovoltaic module layering equipment according to claim 2, characterized in that, The visual recognition system includes a lighting system, a camera, an image acquisition module, and a processor.

7. The double-glass photovoltaic module layering equipment according to claim 1, characterized in that, The wire cutting separation system includes a wire tensioner, a wire, and a cutting fixture.

8. A layering method for a double-glass photovoltaic module layering equipment based on wire cutting and laser scanning synergy according to any one of claims 1 to 7, characterized in that, The layering method includes: Fix the double-glass photovoltaic modules to be separated to the frame; The double-glass photovoltaic module is scanned using a visual recognition system to determine the silicon-free and silicon-containing areas of the double-glass photovoltaic module; A laser scanning system is used to scan the silicon-free areas located at the edge, and then a wire cutting separation system is used to segment the silicon-free areas located at the edge. A laser scanning system is used to scan the double-glass photovoltaic module, and a wire cutting separation system is used simultaneously after the laser scanning to divide the non-silicon wafer area around the silicon wafer area.

9. The layering method according to claim 8, characterized in that, When scanning using a laser scanning system, the motion module is controlled to slide along a first direction at a first speed on the slide rail, and the laser scanning system is controlled to move along a second direction at a second speed on the motion module. The first direction is perpendicular to the second direction, and the second speed is greater than the first speed.

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