Pickup device for chip testing

Abstract

The invention discloses a pick-up device for chip testing, and relates to the field of chips, the pick-up device comprises a mounting shell, a chip pick-up operation cavity is slidably arranged in the top end of the mounting shell, and four multi-connecting-rod lifting adjustment modules are mounted at the bottom end of the interior of the mounting shell. According to the invention, a cooperative sensing function is realized, and adsorption and electrostatic adsorption technologies are fused, so that the whole-process closed-loop operation from visual identification, laser ranging to force sense control is realized, the adsorption effect on the chip is better, and by adopting the mode, the phenomenon that the chip falls can be effectively avoided, and meanwhile, the chip is prevented from being damaged. The ejection assembly stably pushes the chip through the potential energy of the spring when adsorption is removed, the chip is prevented from being adhered to the adsorption structure, the requirement for picking up the ultrathin and high-strength chip is met, damage to the chip caused by picking up is effectively avoided, meanwhile, the chip picking device can adapt to multiple kinds of chips without replacing the adsorption head, and the production efficiency is improved. The problems that a traditional clamping mode is poor in adaptability and the chip is prone to being damaged are solved.

Description

TECHNICAL FIELD

[0001] The application relates to the field of chips, in particular to a pickup device for chip testing. BACKGROUND

[0002] As the core cornerstone of the information technology industry, chips are known as "industrial grain", and the technical level directly determines the performance, power consumption and intelligent degree of electronic equipment, and are widely used in consumer electronics, communication, automobile, industrial control, aerospace, medical health and other key fields of national economy. From the application processor in smart phones, the radio frequency chip of communication base station, to the power semiconductor of new energy vehicles and GPU in the field of artificial intelligence, chips have become the strategic core elements supporting the development of digital economy and national technological competitiveness.

[0003] In the process of semiconductor chip manufacturing and testing, chip picking is the core link connecting wafer cutting, testing and sorting, packaging and other processes. However, in the picking operation process, the strength of the chip is difficult to adapt to the force generated by the traditional clamping assembly clamping and picking, which easily leads to chip damage. At the same time, with the development of chips, the size of chips is getting thinner and thinner, and the picking success rate of the traditional clamping and picking method is low, which causes low efficiency and chaotic work in chip testing.

[0004] Through retrieval, a chip FT testing pickup device is disclosed in Chinese patent document (publication number: CN117699460B), but there are still the following defects: Although the above-mentioned chip testing pickup device has the advantage of reducing energy consumption, it still has the problems of low efficiency and chip damage caused by traditional clamping and picking chips. SUMMARY

[0005] In order to improve the problem of low efficiency and chip damage caused by traditional clamping and picking chips, the application provides a chip testing pickup device.

[0006] The chip testing pickup device provided by the application adopts the following technical scheme: A chip testing pickup device, comprising a mounting shell, a chip picking operation cavity is slidably arranged in the top end of the mounting shell, four multi-link lifting adjustment modules are installed at the inner bottom end of the mounting shell, a synchronous transmission mechanism is arranged between the four multi-link lifting adjustment modules, a chip contact plate is installed in the chip picking operation cavity, an electrostatic adsorption assembly is installed through the middle part of the chip contact plate, auxiliary adsorption assemblies are arranged on both sides of the electrostatic adsorption assembly, protective cover plates are symmetrically arranged at the top end of the chip picking operation cavity, an intelligent data acquisition assembly is arranged at the top end of one of the protective cover plates, and the intelligent data acquisition assembly is electrically connected with an intelligent data analysis system.

[0007] By adopting the technical scheme, the multi-link lifting adjusting module is driven by the synchronous transmission mechanism to vertically adjust the chip picking operation cavity, to adapt to the position of the required picked chip, and the chip contact plate completes lossless adsorption picking through the electrostatic adsorption assembly and the auxiliary adsorption assembly. Meanwhile, the protective cover performs protection during movement, and the intelligent data acquisition assembly cooperates with the intelligent data analysis system to flexibly control the output power of the electrical components of the device.

[0008] Preferably, the four multi-link lifting adjusting modules comprise adjusting arms, top ends of the adjusting arms are hingedly connected to both sides of the bottom end of the chip picking operation cavity through rotating shafts, bottom ends of the adjusting arms are hingedly connected to top ends of the sliders through rotating shafts, the sliders are slidingly arranged in the interiors of the first sliding rails, and the first sliding rails are symmetrically arranged at the interior bottom ends of the mounting housings.

[0009] By adopting the technical scheme, the slider changes the inclination angle of the adjusting arm, and the adjusting arm inclination angle drives the chip picking operation cavity to adaptively move.

[0010] Preferably, the synchronous transmission mechanism comprises at least a fourth bevel gear and a first motor, the fourth bevel gear is rotationally connected in the interior of the mounting housing, the top end of the fourth bevel gear is in transmission connection with the output end of the first motor, the bottom end of the fourth bevel gear is in meshing connection with a third bevel gear, the two side outer walls of the third bevel gear are each provided with a second bevel gear through a linkage rod, and the outer side walls of the second bevel gears are symmetrically in meshing connection with first bevel gears.

[0011] By adopting the technical scheme, the first motor outputs according to the accurate output power control instruction issued by the instruction control module, so that the first motor drives the fourth bevel gear to rotate, the fourth bevel gear drives the meshing connected third bevel gear to rotate, the third bevel gear cooperates with the linkage rod fixed on the two side outer walls to drive the second bevel gears to rotate, and the two first bevel gears meshing with the outer side walls rotate in opposite directions.

[0012] Preferably, the first bevel gears are each rotationally connected to the outer side walls of the first sliding rails, and first connecting lead screws are each rotationally connected in the interiors of the first sliding rails, one end of the first connecting lead screw is in transmission connection with one end of the first bevel gear, and the outer side walls of the first connecting lead screws are in meshing connection with first transmission lead screw sleeves, and the first transmission lead screw sleeves are each arranged in the interiors of the sliders.

[0013] By adopting the technical scheme, the first bevel gears drive the first connecting lead screws to rotate at the same speed, so that the sliders on both sides of the mounting housing relatively move in the interiors of the first sliding rails.

[0014] Preferably, the static adsorption assembly at least comprises an electrode plate, the electrode plate is installed inside the top end of the chip contact plate, the bottom end of the chip contact plate is provided with a static generator, a first insulating layer is arranged between the top end of the static generator and the bottom end of the electrode plate, and the static generator is electrically connected with the electrode plate through a line.

[0015] By adopting the technical scheme, the static generator cooperates with the electrode plate to adhere to the center part of the chip to perform static adsorption.

[0016] Preferably, the top end of the electrode plate is provided with a groove, the top end of the groove is provided with a pop-up assembly, the pop-up assembly at least comprises a pop-up block, the pop-up block is arranged inside the top end of the groove, the top end of the pop-up block is provided with a second insulating layer, and the bottom end of the pop-up block is symmetrically provided with a spring, and the spring is symmetrically arranged at the bottom end of the chip contact plate.

[0017] By adopting the technical scheme, when the electrode plate and the chip are adsorbed, the pop-up block is also adsorbed on the surface of the electrode plate, so as to compress the spring, when the electrode plate and the chip are separated, the potential energy of the compressed spring drives the chip to push to a specified area, so as to avoid the phenomenon that the chip and the suction cup cannot be separated in a short time.

[0018] Preferably, the auxiliary adsorption assembly at least comprises a suction cup, four through holes are arranged in the top end of the chip contact plate, and the suction cup is arranged inside each through hole, a vacuum generator is symmetrically arranged at the bottom end of the chip pickup work cavity, and the two output ends of the vacuum generator are connected with the bottom end of the suction cup through pipelines.

[0019] By adopting the technical scheme, the suction cup is adsorbed on the four corner regions of the chip, so as to adsorb and assist in fixing the chip by vacuum adsorption, and the phenomenon of falling is reduced.

[0020] Preferably, the intelligent data acquisition assembly at least comprises a mounting seat, the bottom end of the mounting seat is connected with the top end of one of the protective cover plates, an image capture device and a laser ranging device are arranged at the top end of the mounting seat, the image capture device and the laser ranging device are electrically connected with an intelligent data analysis system, the intelligent data analysis system comprises a chip type confirmation module, a distance data acquisition module and an instruction control module, and the intelligent data analysis system functions to confirm the type of the chip to be picked up, acquire the distance between the chip contact plate and the chip, and respectively issue accurate output power control instructions to the first motor, the static generator and the vacuum generator according to the type of the chip and the distance parameter data.

[0021] By adopting the technical scheme, the intelligent data analysis system can accurately match the output power required for picking up the chip, so that the pickup work can be completed by adapting the power.

[0022] Preferably, the inner side walls of the protective cover are symmetrically provided with rollers, the rollers are movably connected to the interior of the movable cavity, the movable cavity is arranged in the interior of the mounting block, the mounting block is symmetrically arranged on the outer side wall of the chip picking cavity, one side of the protective cover is provided with a second mounting frame, the interior of the second mounting frame is hingedly connected to one end of a transmission block through a rotating shaft, the other end of the transmission block is hingedly connected to the interior of the first mounting frame through a rotating shaft, and the first mounting frame is arranged on the outer side wall of the sliding block.

[0023] By adopting the above technical scheme, the protective cover moves in the interior of the movable cavity through the rollers, so that the protective cover is arranged on both sides of the mounting shell and the chip picking cavity when picking the chip.

[0024] Preferably, the sliding block is movably connected to the interior of the second sliding rail, the second sliding rail is connected to the mounting block through a connecting plate, the interior of the sliding block is provided with a second transmission screw sleeve, the inner side wall of the second transmission screw sleeve is engagedly connected with a second connecting screw rod, the second connecting screw rod is rotatably connected between the interior top end and the interior bottom end of the second sliding rail, the bottom end of the second connecting screw rod is in transmission connection with the top end of the first transmission bevel gear, the outer side wall of the first transmission bevel gear is engagedly connected with a second transmission bevel gear, and one end of the second transmission bevel gear is in transmission connection with the output end of the second motor.

[0025] By adopting the above technical scheme, the second motor outputs work to drive the second transmission bevel gear to rotate, so that the second transmission bevel gear drives the first transmission bevel gear to rotate, and the first transmission bevel gear drives the second connecting screw rod to rotate, and the second connecting screw rod and the second transmission screw sleeve form a screw rod transmission structure, so that the sliding block moves in the interior of the second sliding rail, and the first mounting frame, the transmission block and the second mounting frame are cooperated with the movement of the sliding block to complete the unfolding or closing of the protective cover.

[0026] To sum up, the present application has at least one of the following beneficial technical effects: 1. The present application cooperates with the sensing function, and combines the vacuum adsorption and electrostatic adsorption technologies, so as to realize the full-process closed-loop operation from visual recognition, laser ranging to force control, better adsorption effect of the chip, effectively avoid the phenomenon of chip falling, and smoothly push the chip by the spring potential when the adsorption is released, prevent the chip from adhering to the adsorption structure, adapt to the picking demand of ultra-thin and high-strength chips, effectively avoid the damage of the chip caused by picking, adapt to multiple varieties of chips without replacing the adsorption head, and solve the pain points of poor adaptability and easy damage of the chip in the traditional clamping mode. 2. The application realizes the dynamic adaptation of the adsorption force and the adjustment stroke by confirming the chip type through the image capture device, acquiring the distance data between the chip contact plate and the chip through the laser ranging device, and automatically issuing precise output power control instructions to the first motor, the electrostatic generator and the vacuum generator based on the chip type, size, weight and distance parameters, which not only avoids the errors of manual operation, but also enables the device to quickly adapt to different types and specifications of chips, significantly improves the pickup success rate and work efficiency, and improves the low efficiency and chaotic work phenomenon of the traditional pickup mode; 3. The protective cover plate structure can be flexibly expanded and closed, and during the chip picking process, the protective cover plate is expanded through the transmission mechanism without affecting the work, so that during the chip transfer process, the protective cover plate is closed to cover the chip picking work cavity, which can not only play a dustproof protection role, but also prevent the chip from falling when the device is inverted or moved, and the multi-link lifting adjustment module drives the chip picking work cavity to realize vertical adjustment through the linkage mechanism, and cooperates with the bidirectional protection function of the protective cover plate, so that the device can be flexibly installed upward or downward according to the work scene, adapt to the pickup requirements of wafer cutting, testing and sorting, packaging and other processes, and greatly improve the application range and work safety of the device. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a front view structure schematic diagram of the application; Figure 2 It is a combined part structure schematic diagram of the mounting shell and the chip picking work cavity in the application; Figure 3 It is an internal part structure schematic diagram of the mounting shell in the application; Figure 4 It is a combined part structure schematic diagram of the multi-link lifting adjustment module and the synchronous transmission mechanism in the application; Figure 5 It is a sectional part structure schematic diagram of the first sliding rail in the application; Figure 6 It is a split part structure schematic diagram of the chip picking work cavity and the chip contact plate in the application; Figure 7 It is a part structure schematic diagram of the electrostatic adsorption assembly in the application; Figure 8 It is a part structure schematic diagram of the ejection assembly in the application; Figure 9 It is a part structure schematic diagram of the auxiliary adsorption assembly in the application; Figure 10 It is a combined part structure schematic diagram of the protective cover plate and the roller in the application; Figure 11It is the combined part structure schematic view of the movable cavity, the mounting block, the second slide rail, the sliding block and the first mounting frame in the application. Figure 12 It is the module part structure schematic view of the intelligent data analysis system in the application. Figure 13 It is the specific operation flow schematic view of the intelligent data analysis system in the application.

[0028] Reference signs: 1, mounting shell; 2, chip pickup operation cavity; 3, adjusting arm; 4, sliding block; 5, first slide rail; 6, first transmission screw sleeve; 7, first connecting screw; 8, first bevel gear; 9, second bevel gear; 10, linkage rod; 11, third bevel gear; 12, fourth bevel gear; 13, first motor; 14, chip contact plate; 15, electrode plate; 16, first insulation layer; 17, electrostatic generator; 18, groove; 19, ejection block; 20, second insulation layer; 21, spring; 22, suction cup; 23, vacuum generator; 24, protective cover plate; 25, mounting seat; 26, image capture device; 27, laser ranging device; 28, roller; 29, movable cavity; 30, mounting block; 31, connecting piece; 32, second slide rail; 33, sliding block; 34, second transmission screw sleeve; 35, second connecting screw; 36, first transmission bevel gear; 37, second transmission bevel gear; 38, second motor; 39, first mounting frame; 40, transmission block; 41, second mounting frame. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings Figures 1-11 The application is further described in detail.

[0030] The application embodiment discloses a pickup device for chip testing.

[0031] Reference Figures 1-5The utility model provides a kind of pickup device for chip testing, including installation shell 1, the inside bottom end of installation shell 1 is fixedly connected with four multi-connecting rod lifting adjustment module, four multi-connecting rod lifting adjustment module includes adjusting arm 3, sliding block 4, first sliding rail 5, first transmission screw sleeve 6 and first connecting screw rod 7, the inside bottom end of installation shell 1 is fixedly connected with four first sliding rail 5, the inside of four first sliding rail 5 is slidably connected with sliding block 4, first transmission screw sleeve 6 is fixedly connected in the inside of sliding block 4, first transmission screw sleeve 6 is engagedly connected with first connecting screw rod 7 in the inside, first connecting screw rod 7 is rotatably connected in the inside of first sliding rail 5, the top of sliding block 4 is hingedly connected with the bottom of adjusting arm 3 by pivot, the top of adjusting arm 3 is hingedly connected with the top of chip pickup operation cavity 2 by pivot, chip pickup operation cavity 2 is vertically movably connected in the top inside of installation shell 1, and the outside wall tooth of four first connecting screw rods 7 is all set as same structure.

[0032] When first connecting screw rod 7 is rotated, first transmission screw sleeve 6 and first connecting screw rod 7 constitute screw rod transmission structure, so when first connecting screw rod 7 is rotated, sliding block 4 is driven to move in the inside of first sliding rail 5, and the inside sliding block 4 of first sliding rail 5 symmetrically arranged on both sides is relatively moved by synchronous transmission mechanism, so that the inclination angle of adjusting arm 3 is changed, and the chip pickup operation cavity 2 is driven to move adaptively by the inclination angle of adjusting arm 3.

[0033] Refer to Figure 4 The inside bottom end of installation shell 1 is provided with synchronous transmission mechanism, synchronous transmission mechanism includes first bevel gear 8, second bevel gear 9, linkage rod 10, third bevel gear 11, fourth bevel gear 12 and first motor 13, the outside wall of both sides first sliding rail 5 is rotatably connected with first bevel gear 8, second bevel gear 9 is engagedly connected between first bevel gear 8, one end of first bevel gear 8 is drivingly connected with one end of corresponding first connecting screw rod 7, one end of second bevel gear 9 is fixedly connected with linkage rod 10, linkage rod 10 is fixedly connected between third bevel gear 11, the top outside wall of third bevel gear 11 is engagedly connected with fourth bevel gear 12, and the top of fourth bevel gear 12 is fixedly connected with the output end of first motor 13.

[0034] In use, the first motor 13 outputs according to the accurate output power control instruction issued by the instruction control module, so that the first motor 13 drives the fourth bevel gear 12 to rotate, the fourth bevel gear 12 drives the third bevel gear 11 engaged with it to rotate, the third bevel gear 11 drives the second bevel gear 9 through the linkage rod 10 fixed on both sides to rotate, and when the second bevel gear 9 rotates, the two first bevel gears 8 engaged with the outer side wall rotate in opposite directions, and the first connecting lead screw 7 rotates at the same speed, so that the sliders 4 on both sides of the mounting shell 1 move relatively in the first slide rail 5.

[0035] Referring to Figures 6-9 The chip pickup work cavity 2 is fixedly connected with a chip contact plate 14 inside, an electrostatic adsorption assembly is installed through the middle of the chip contact plate 14, auxiliary adsorption assemblies are arranged on both sides of the electrostatic adsorption assembly, the electrostatic adsorption assembly includes an electrode plate 15, a first insulating layer 16 and an electrostatic generator 17, the electrode plate 15 is fixedly connected to the middle of the top end of the chip contact plate 14, the electrode plate 15 adopts a multi-pole electrode structure and is made of titanium oxide doped aluminum ceramic, the bottom end of the electrode plate 15 is fixedly connected with the first insulating layer 16, and the bottom end of the chip contact plate 14 is fixedly connected with the electrostatic generator 17, the electrostatic generator 17 is a bipolar high-voltage power supply module, specifically a high-voltage electrostatic power supply controller, the top end of the electrostatic generator 17 abuts against the bottom end of the first insulating layer 16, the electrostatic generator 17 is electrically connected with the electrode plate 15 through a line, recesses 18 are formed in the top end of the electrode plate 15 and the chip contact plate 14 and are in communication, a pop-up assembly is arranged in the recess 18, the pop-up assembly includes a pop-up block 19, a second insulating layer 20 and a spring 21, the pop-up block 19 is arranged in the recess 18 and is made of metal material, the bottom end of the pop-up block 19 abuts against the top end of the electrode plate 15, the top end of the pop-up block 19 is coated with the second insulating layer 20, the bottom end of the chip contact plate 14 is fixedly connected with the spring 21, the top end of the spring 21 penetrates through the bottom end of the chip contact plate 14 and is fixedly connected with the bottom end of the pop-up block 19, the auxiliary adsorption assembly includes a suction disc 22 and a vacuum generator 23, four through holes are formed in the top end of the chip contact plate 14, the suction disc 22 is fixedly connected in the through holes, and the vacuum generator 23 is fixedly connected to the bottom end of the chip pickup work cavity 2, the two output ends of the vacuum generator 23 are connected with the bottom end of the suction disc 22 through pipelines.

[0036] In the chip picking operation, the chip picking operation cavity 2 is driven vertically by the multi-link lifting adjustment module, and the electrostatic generator 17 and the vacuum generator 23 are controlled to output according to the accurate output power control instruction issued by the instruction control module, so that the electrode plate 15 is attached to the center of the chip, and the chuck 22 is adsorbed on the four corner areas of the chip. This method can stably pick up the chip and abandon the traditional clamping method. The picking method of the device can stably and efficiently pick up the chip and avoid damaging the chip. After moving to the next process or designated area, the electrostatic generator 17 stops outputting, so that the electrode plate 15 and the chip are not adsorbed, and the vacuum generator 23 also stops outputting, so that the chuck 22 stops vacuum adsorption. When the electrode plate 15 and the chip are not adsorbed, the compression spring 21 generates potential energy and drives the chip to the designated area, so as to avoid the phenomenon that the chip and the chuck 22 cannot be separated for a short time, thereby improving the practicability of the device.

[0037] With reference to Figure 10 and Figure 11 The front end outer wall and the rear end outer wall of the chip picking operation cavity 2 are symmetrically and fixedly connected with the mounting block 30, and the inside of the mounting block 30 is provided with the movable cavity 29. The movable cavity 29 and the mounting block 30 are provided in an "L" shape structure, the top end of the chip picking operation cavity 2 is symmetrically provided with the protective cover plate 24, the inner side wall of the protective cover plate 24 is hingedly connected with the roller 28, the roller 28 is movably connected in the inside of the movable cavity 29, the opposite side outer wall of the protective cover plate 24 is fixedly connected with the second mounting frame 41, the inside of the second mounting frame 41 is hingedly connected with one end of the transmission block 40 through a rotating shaft, the other end of the transmission block 40 is hingedly connected with the inside of the first mounting frame 39 through a rotating shaft, and the first mounting frame 39 is fixedly connected with one end of the sliding block 33.

[0038] During the movement of the device, the protective cover plate 24 is arranged on the top end of the chip picking operation cavity 2, so as to prevent dust from entering the chip picking operation cavity 2 and prevent the chip from falling when the chip picking operation cavity 2 is used downward. When picking up the chip, the first mounting frame 39 is vertically moved by the sliding block 33, so that the protective cover plate 24 is moved in the movable cavity 29 through the roller 28. When picking up the chip, the protective cover plate 24 is arranged on both sides of the mounting shell 1 and the chip picking operation cavity 2, so as to pick up the chip.

[0039] With reference to Figure 11The sliding block 33 is vertically movably connected to the inside of the second sliding rail 32, one end of the outer wall of the second sliding rail 32 is fixedly connected to the outer side wall of the mounting block 30 through the connecting sheet 31, the top end of the sliding block 33 penetrates and is fixedly connected with the second transmission screw sleeve 34, the inside of the second transmission screw sleeve 34 penetrates and is meshingly connected with the second connecting screw 35, the second connecting screw 35 is rotatably connected between the inside top end and the inside bottom end of the second sliding rail 32, the bottom end of the second connecting screw 35 is in transmission connection with the top end of the first transmission bevel gear 36, the first transmission bevel gear 36 is rotatably connected to the bottom end of the second sliding rail 32, the outer side wall of the first transmission bevel gear 36 is meshingly connected with the second transmission bevel gear 37, one end of the second transmission bevel gear 37 is fixedly connected with the output end of the second motor 38.

[0040] When the device reaches the required pickup chip area, the second motor 38 outputs work to drive the second transmission bevel gear 37 to rotate, so that the second transmission bevel gear 37 drives the first transmission bevel gear 36 to rotate, so that the first transmission bevel gear 36 drives the second connecting screw 35 to rotate, because the second connecting screw 35 and the second transmission screw sleeve 34 form a screw transmission structure, so that the sliding block 33 moves in the inside of the second sliding rail 32, and the protective cover plate 24 is unfolded or closed through the cooperation of the first mounting frame 39, the transmission block 40 and the second mounting frame 41, and then the protective work is completed through the protective cover plate 24.

[0041] The implementation principle of the chip test pickup device is as follows: first, the device is connected and fixed with the electromagnetic sliding rail and other transmission equipment, and can be installed upward or downward according to the pickup requirement, when the device reaches the required pickup chip area, the second motor 38 outputs work to drive the second transmission bevel gear 37 to rotate, so that the second transmission bevel gear 37 drives the first transmission bevel gear 36 to rotate, so that the first transmission bevel gear 36 drives the second connecting screw 35 to rotate, because the second connecting screw 35 and the second transmission screw sleeve 34 form a screw transmission structure, so that the sliding block 33 moves in the inside of the second sliding rail 32, and the protective cover plate 24 is unfolded or closed through the cooperation of the first mounting frame 39, the transmission block 40 and the second mounting frame 41; Secondly, the first motor 13 outputs according to the accurate output power control instruction issued by the instruction control module, so that the first motor 13 drives the fourth bevel gear 12 to rotate, the fourth bevel gear 12 drives the third bevel gear 11 engaged with it to rotate, the third bevel gear 11 drives the second bevel gear 9 engaged with the linkage rod 10 fixed on the two side walls to rotate, and when the second bevel gear 9 rotates, the two first bevel gears 8 engaged with the outer side wall rotate in opposite directions, the first bevel gears 8 drive the first connecting lead screws 7 to rotate at the same speed, and when the first connecting lead screws 7 rotate, the sliding blocks 4 in the first sliding rails 5 move, the two sliding blocks 4 in the first sliding rails 5 move relatively through the synchronous transmission mechanism, so that the sliding blocks 4 change the inclination angle of the adjusting arm 3, and the chip pickup cavity 2 is driven to move adaptively through the inclination angle of the adjusting arm 3. Then, the multi-link lifting adjusting module drives the chip pickup cavity 2 to move vertically, and the electrostatic generator 17 and the vacuum generator 23 are both output according to the accurate output power control instruction issued by the instruction control module, so that the electrode plate 15 is attached to the center of the chip, the electrostatic adsorption is performed, the suction cup 22 is adsorbed on the four corner regions of the chip, and the protective cover plate 24 is arranged on the top of the chip pickup cavity 2, so that the chip can be protected from dust, and the chip pickup cavity 2 can be prevented from falling downward. Finally, after moving to the next process or designated area, the electrostatic generator 17 stops outputting, the electrode plate 15 and the chip are separated from the adsorption effect, the vacuum generator 23 stops outputting, the suction cup 22 stops vacuum adsorption, the ejection block 19 is adsorbed on the surface of the electrode plate 15 when the electrode plate 15 and the chip are adsorbed, the compression spring 21 is compressed, the electrode plate 15 and the chip are separated from the adsorption, the compression spring 21 generates potential energy, and the chip is driven to the designated area, so that the chip and the suction cup 22 cannot be separated for a short time, and the chip pickup device for chip testing is completed.

[0042] Referring to Figure 12 and Figure 13 A chip pickup device for chip testing includes an intelligent data analysis system, the intelligent data analysis system is electrically connected with an image capture device 26 and a laser ranging device 27, the image capture device 26 is provided in an industrial CMOS camera structure, the image capture device 26 is specifically an industrial visual imaging unit, the image capture device 26 and the laser ranging device 27 are both installed on the top of a mounting seat 25, and the mounting seat 25 is fixedly connected to the top of one of the protective cover plates 24.

[0043] The intelligent data analysis system comprises a chip type confirmation module, a distance data acquisition module and an instruction control module, the chip type confirmation module is electrically connected with the image capturing device 26, the chip type confirmation module functions to capture image parameter data of the chip to be picked up by the image capturing device 26, analyze the type parameter data of the chip to be captured based on the image parameter data of the chip, and transmit the chip type parameter data to the instruction control module.

[0044] The distance data acquisition module is electrically connected with the laser ranging device 27, the distance data acquisition module functions to acquire the distance between the laser ranging device 27 and the chip by the laser ranging device 27 when the transmission assembly is perpendicular to the chip, and transmit the distance parameter data to the instruction control module.

[0045] The instruction control module functions to receive the chip type parameter data and the distance parameter data, acquire the weight and size of the chip to be picked up based on the chip type parameter data, generate the output power control instruction suitable for the chip weight and size, and transmit the output power control instruction to the electrostatic generator 17 and the vacuum generator 23, analyze the distance data between the chip contact plate 14 and the chip based on the distance parameter data, and generate the output power control instruction suitable for the distance data between the chip contact plate 14 and the chip, and transmit the output power control instruction to the first motor 13.

[0046] The specific operation process of the intelligent data analysis system is as follows: S1: acquire the image parameter data of the chip to be picked up by the image capturing device 26; S2: the chip type confirmation module receives the image parameter data and completes chip type confirmation; S3: the chip type confirmation module transmits the chip type parameter data to the instruction control module; S4: the distance data acquisition module acquires the distance between the laser ranging device 27 and the chip by the laser ranging device 27; S5: transmit the distance parameter data to the instruction control module; S6: the instruction control module analyzes the chip type parameter data and the distance data between the laser ranging device 27 and the chip acquired by the laser ranging device 27; S7: the instruction control module issues the accurate output power control instruction to the first motor 13, the electrostatic generator 17 and the vacuum generator 23 according to the analysis result.

[0047] The above is only an optional embodiment of the present disclosure, and is not used to limit the present disclosure. The present disclosure can have various changes and variations for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A chip testing pickup device, characterized in that: The system includes a mounting housing (1), a chip pickup working cavity (2) that is slidably disposed inside the top of the mounting housing (1), four multi-link lifting adjustment modules that are installed at the bottom of the mounting housing (1), a synchronous transmission mechanism that is disposed between the four multi-link lifting adjustment modules, a chip contact plate (14) that is installed inside the chip pickup working cavity (2), an electrostatic adsorption component that is installed through the middle of the chip contact plate (14), auxiliary adsorption components that are disposed on both sides of the electrostatic adsorption component, and protective covers (24) that are symmetrically disposed at the top of the chip pickup working cavity (2), one of the protective covers (24) that is disposed at the top of the top of the protective cover (24), and an intelligent data acquisition component that is electrically connected to an intelligent data analysis system.

2. The chip testing pickup device according to claim 1, characterized in that: The four multi-link lifting adjustment modules include adjustment arms (3). The top ends of the adjustment arms (3) are hinged to the bottom sides of the chip picking working cavity (2) via rotating shafts. The bottom ends of the adjustment arms (3) are hinged to the top ends of the sliders (4) via rotating shafts. The sliders (4) are all slidably arranged inside the first slide rail (5). The first slide rail (5) is symmetrically installed at the bottom of the inner side of the mounting housing (1).

3. The chip testing pickup device according to claim 1, characterized in that: The synchronous transmission mechanism includes at least a fourth bevel gear (12) and a first motor (13). The fourth bevel gear (12) is rotatably connected inside the mounting housing (1). The top of the fourth bevel gear (12) is connected to the output end of the first motor (13). The bottom end of the fourth bevel gear (12) is meshed with a third bevel gear (11). The outer walls on both sides of the third bevel gear (11) are equipped with second bevel gears (9) through linkage rods (10). The outer walls of the second bevel gears (9) are symmetrically meshed with first bevel gears (8).

4. The chip testing pickup device according to claim 3, characterized in that: The first bevel gears (8) are all rotatably connected to the outer side wall of the first slide rail (5), and the first connecting screw (7) is rotatably connected inside the first slide rail (5). One end of the first connecting screw (7) is connected to one end of the first bevel gear (8) in a transmission connection. The outer side wall of the first connecting screw (7) is meshed with a first transmission screw sleeve (6). The first transmission screw sleeve (6) is installed through the inside of the slider (4).

5. The chip testing pickup device according to claim 1, characterized in that: The electrostatic adsorption assembly includes at least an electrode plate (15), which is installed through the top of the chip contact plate (14). An electrostatic generator (17) is installed at the bottom of the chip contact plate (14). A first insulating layer (16) is provided between the top of the electrostatic generator (17) and the bottom of the electrode plate (15). The electrostatic generator (17) is electrically connected to the electrode plate (15) through a circuit.

6. The chip testing pickup device according to claim 5, characterized in that: The top of the electrode plate (15) is provided with a groove (18), and a pop-out component is installed inside the top of the groove (18). The pop-out component includes at least a pop-out block (19). The pop-out block (19) is disposed inside the top of the groove (18). A second insulating layer (20) is bonded to the top of the pop-out block (19). A spring (21) is symmetrically installed at the bottom of the pop-out block (19). The spring (21) is symmetrically installed at the bottom of the chip contact plate (14).

7. The chip testing pickup device according to claim 1, characterized in that: The auxiliary adsorption assembly includes at least a suction cup (22). The top of the chip contact plate (14) has four through holes, and a suction cup (22) is installed inside each of the four through holes. A vacuum generator (23) is symmetrically installed at the bottom of the chip picking chamber (2). The two output ends of the vacuum generator (23) are connected to the bottom of the suction cup (22) through pipes.

8. The chip testing pickup device according to claim 1, characterized in that: The intelligent data acquisition component includes at least a mounting base (25). The bottom end of the mounting base (25) is connected to the top end of one of the protective covers (24). An image capture device (26) and a laser rangefinder (27) are installed on the top end of the mounting base (25). The image capture device (26) and the laser rangefinder (27) are both electrically connected to the intelligent data analysis system. The intelligent data analysis system includes a chip type confirmation module, a distance data acquisition module, and an instruction control module. The function of the intelligent data analysis system is to confirm the type of chip to be picked up, and to obtain the distance between the chip contact plate (14) and the chip. Based on the chip type and the distance parameter data, the system issues accurate output power control instructions to the first motor (13), the electrostatic generator (17), and the vacuum generator (23).

9. A chip testing pickup device according to claim 1, characterized in that: Rollers (28) are symmetrically installed on the inner sidewall of the protective cover (24). The rollers (28) are movably connected to the inside of the movable cavity (29). The movable cavity (29) is opened inside the mounting block (30). The mounting block (30) is symmetrically installed on the outer sidewall of the chip picking operation cavity (2). A second mounting bracket (41) is installed on one side of the outer wall of the protective cover (24). The inside of the second mounting bracket (41) is hinged to one end of the transmission block (40) through a rotating shaft. The other end of the transmission block (40) is hinged to the inside of the first mounting bracket (39) through a rotating shaft. The first mounting bracket (39) is installed on the outer sidewall of the sliding block (33).

10. A chip testing pickup device according to claim 9, characterized in that: The sliding block (33) is vertically and movably connected inside the second slide rail (32). The second slide rail (32) is connected to the mounting block (30) through the connecting piece (31). The second transmission screw sleeve (34) is installed through the interior of the sliding block (33). The inner side wall of the second transmission screw sleeve (34) is meshed with the second connecting screw (35). The second connecting screw (35) is rotatably connected between the inner top and inner bottom of the second slide rail (32). The bottom end of the second connecting screw (35) is connected to the top end of the first transmission bevel gear (36). The outer side wall of the first transmission bevel gear (36) is meshed with the second transmission bevel gear (37). One end of the second transmission bevel gear (37) is connected to the output end of the second motor (38).

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