Diamond wire cutting and cutting fluid lubricating performance integrated measuring device and method

Abstract

The invention discloses a diamond wire cutting and cutting fluid lubricating performance integrated measuring device and method.The device comprises a silicon cylinder rod, a fixing mechanism for driving the silicon cylinder rod to rotate around the axis, a silicon cylinder surface grooving tool, a fixed pulley block, a dynamometer, a weight, a cutting fluid spraying system and the like; one end of the diamond wire fixes a dynamometer through a fixed pulley, and the other end of the diamond wire fixes a weight through a fixed pulley; during measurement, under the action of the cutting fluid, the diamond wire performs friction cutting in the wire groove, the tension and the moving distance are obtained through the dynamometer and the height pointer, the relative fluctuation coefficient CV and the average friction coefficient are calculated to represent the lubricating capacity of the cutting fluid, and the cutting rate R of the diamond wire represents the cutting capacity of the diamond wire. Under a real cutting scene, synchronous and low-cost measurement and accurate characterization of the diamond wire cutting performance and the cutting fluid lubricating performance are realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of diamond wire cutting, in particular to a device and method for measuring the cutting and cutting fluid lubrication performance of diamond wire. BACKGROUND

[0002] Currently, the cutting ability of diamond wire is mainly tested by cutting silicon ingots with an industrial slicing machine. However, the test requires thousands of meters of diamond wire and expensive silicon ingots, and the cost is high. Moreover, it is difficult to obtain effective data to characterize the cutting ability. CN202110114316.3 proposes a device and method for simply measuring the cutting ability of diamond wire. The main idea is to use the friction coefficient to characterize the cutting ability by rubbing a silicon sliding block on a diamond wire mesh. However, the friction coefficient cannot be completely equivalent to the cutting ability of diamond wire.

[0003] During the cutting process of diamond wire, cutting fluid is used to play the role of lubrication, cooling, and cleaning. The existing industrial evaluation of cutting fluid mainly measures the performance of cutting fluid through single indicators (such as viscosity, surface tension, and pH value) and an industrial slicing machine. However, it cannot test the friction coefficient in a real cutting scenario. CN202410768953.6 proposes a method for measuring the friction coefficient of cutting fluid under specific conditions by reciprocating friction of a hard ball on the surface of silicon material. CN202110114316.3 proposes a method for obtaining the friction coefficient by rubbing a silicon sliding block on a diamond wire mesh. However, the ball-on-disc friction method and the silicon block rubbing method on the diamond wire mesh cannot completely simulate the real scenario of diamond wire cutting in a narrow silicon cutting groove. SUMMARY

[0004] The present application aims to provide a device and method for measuring the cutting and cutting fluid lubrication performance of diamond wire in a real cutting scenario, which can realize the synchronous, low-cost measurement and characterization of the cutting and cutting fluid lubrication performance of diamond wire.

[0005] To achieve the above-mentioned purpose, the device for measuring the cutting and cutting fluid lubrication performance of diamond wire comprises a cutting fluid spraying mechanism and a fixed pulley set. The diamond wire is wound on the wire groove of the fixed pulley set and a silicon cylindrical rod. One end is connected to the measurement end of a force gauge, and the other end hangs a weight and a height indicator. Under the conditions of the silicon cylindrical rod being stationary and rotating around the axis being cut by the diamond wire, the tension and movement distance are obtained by the force gauge and the height indicator, and the relative coefficient of variation CV and the average friction coefficient are calculated. The cutting fluid lubrication ability is characterized, and the cutting rate R of diamond wire represents the cutting ability of diamond wire.

[0006] Preferably, the fixed pulley set comprises multiple sets of fixed pulleys symmetrically arranged on both sides of the silicon cylinder rod, and the left and right swings of the fixed pulleys on both sides of the silicon cylinder rod are adjusted to ensure that the diamond wire on the silicon cylinder rod is wound into the fixed pulleys on both sides in a vertical manner.

[0007] Preferably, the fixed pulley set and the force meter are installed on a first platform, and a slide rail is arranged below the first platform, and the first platform is axially translated along the silicon cylinder rod under the constraint of the slide rail.

[0008] Preferably, a slotting tool is further included for cutting the wire slot, and the slotting tool is installed on a second platform, and the second platform is axially translated along the silicon cylinder rod under the constraint of the slide rail.

[0009] Preferably, the slotting tool is a diamond tip, a carbide tip, or a cubic boron nitride tip.

[0010] The method for measuring the lubrication performance of the cutting fluid in the diamond wire cutting according to the application comprises the following steps: under the static working condition of the silicon cylinder rod, the tension is obtained by the force meter , and the height is obtained by the height indicator .

[0011] Under the working condition that the silicon cylinder rod rotates around the shaft and is cut by the diamond wire, the working condition comprises a pre-cutting stage and a formal cutting stage. In the pre-cutting stage, the diamond wire is based on the wire slot of the silicon cylinder rod, and cuts into the silicon cylinder rod to a depth under the action of the cutting fluid, and then enters the formal cutting stage. At this time, the height is obtained by the height indicator .

[0012] In the formal cutting stage, the diamond wire continuously cuts the silicon cylinder rod under the action of the cutting fluid, and the tension versus time data is recorded by the force meter. After a period of time T, the rotation cutting is stopped, and the height is obtained by the height indicator at this time.

[0013] Preferably, the average friction coefficient and the relative fluctuation coefficient CV of the cutting process are calculated according to the tension data, wherein the average friction coefficient is obtained by averaging the friction coefficients at different time points, and the calculation formula is as follows:

[0014] ,

[0015]

[0016] wherein, the total number of records is selected within the time period T, represents the th record, This indicates the first time interval within time period T. The tensile force displayed by force gauge 7 during the next recording. This indicates the first time interval within time period T. The friction coefficient was recorded and calculated.

[0017] Preferably, the diamond wire cutting rate R represents the cutting amount per unit load and unit cutting stroke, and the calculation formula is:

[0018] ,

[0019] in, The radius of the circle enclosed by the wire trough. The linear velocity of the silicon cylindrical rod surface during rotation. For rotation time.

[0020] Preferably, the diameter of the silicon cylindrical rod is 10~100 mm, and the linear velocity of the curved surface of the silicon cylindrical rod during rotation is... The range is from 0.01 m / s to 15 m / s.

[0021] Preferably, the spray flow rate is 1 L / min to 10 L / min.

[0022] Beneficial effects: The present invention has the following advantages: 1. The device of the present invention has a simple structure and is easy to operate, enabling simultaneous and low-cost determination of diamond wire cutting and cutting fluid lubrication performance in real cutting scenarios; 2. The present invention utilizes the relative fluctuation coefficient CV and the average friction coefficient The cutting fluid lubrication capability is characterized by the diamond wire cutting rate R, which is more closely related to the actual cutting effect. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the device of the present invention;

[0024] Figure 2 This is a front view of the device of the present invention;

[0025] Figure 3 Flowchart for measuring the performance of diamond wire cutting;

[0026] Figure 4 This is a flowchart for determining the lubrication performance of cutting fluid. Detailed Implementation

[0027] The technical solution of the present invention will be described in detail below with reference to the embodiments and accompanying drawings.

[0028] like Figure 1 , 2As shown, the integrated testing device for diamond wire cutting and cutting fluid lubrication performance includes: a cutting fluid spraying mechanism 1, a silicon cylindrical rod and a fixing mechanism 2 for driving it to rotate around its axis, a silicon cylindrical rod 3, weights 4, a fixed pulley group 5, a grooving tool 6, a force gauge 7, a slide rail 8, a first platform 9-1 and a second platform 9-2 that move axially on the slide rail, and a cutting fluid circulation system 10.

[0029] Among them, the diameter of the silicon cylindrical rod 3 is 10~100 mm, and the linear velocity of the curved surface of the silicon cylindrical rod 3 during rotation is... With a speed of 0.01 m / s to 15 m / s, friction and cutting between silicon material and three sides (left, right and bottom) of diamond wire 12 are achieved.

[0030] The first platform 9-1 and the second platform 9-2 are located below the silicon cylindrical rod 3 and can be translated along the axial direction of the silicon cylindrical rod 3 according to the slide rail 8.

[0031] The grooving tool 6 is fixed on the second platform 9-2 and is used to cut circumferential grooves on the curved surface of a silicon cylindrical rod to facilitate the embedding of diamond wire. The grooving tool 6 can be made of diamond, cemented carbide, or cubic boron nitride.

[0032] The fixed pulley group 5 and the force gauge 7 are fixed on the first platform 9-1 to ensure that the bent diamond wire after being embedded is on the same plane. The fixed pulley group 5 includes multiple fixed pulleys, which are symmetrically arranged on both sides of the silicon cylindrical rod 3 to change the winding direction of the diamond wire. The fixed pulleys on both sides of the silicon cylindrical rod 3 can swing left and right to ensure that the diamond wire on the silicon cylindrical rod 3 is wound into the fixed pulleys on both sides in a vertical manner.

[0033] One end of the diamond wire is connected to a force gauge 7, and the other end is attached to a weight 4. The force gauge 7 is used to measure the tension on the diamond wire under static and rotating conditions of the silicon cylindrical rod, with an accuracy of mN or higher, to obtain force-time data. The weight 4 applies a certain tension to the diamond wire and provides the normal load of the diamond wire during the friction process on the surface of the silicon cylindrical rod. The weight has a weight of 100 g to 1000 g. A height indicator needle 11 is clamped above the diamond wire at the top of the weight 4 to characterize the weight's settling distance.

[0034] The cutting fluid spraying mechanism 1 and the cutting fluid spraying circulation system 10 are used to provide cutting fluid during the cutting process of diamond wire on silicon cylindrical rod 3, with a spraying flow rate of 1 L / min to 10 L / min.

[0035] like Figure 3 , 4 As shown, the measurement method based on the above-mentioned integrated measuring device includes:

[0036] 1. Adjust the grooving tool 6 so that the tool head is directly below the grooving position on the silicon cylindrical rod 3. The fixing mechanism 2 drives the silicon cylindrical rod 3 to rotate around the axis, and the tool 6 advances, creating a groove on the curved surface of the silicon cylindrical rod (the radius of the circle enclosed by the groove is...). (Approximately the radius of a silicon cylindrical rod), depth 30 μm ~ 500 μm, remove the cutting tool.

[0037] 2. Adjust the fixed pulley block 5, the force measuring instrument 7 and the wire groove to be on the same plane. Fix one end of the diamond wire to the force measuring instrument 7, and wind it through the fixed pulley, the wire groove and the fixed pulley. Hang the weight 4 vertically on the other end, and add a height indicator to the vertical end of the diamond wire at the end of the weight 4.

[0038] 3. Under the condition that the silicon cylindrical rod 3 is stationary, the tensile force data is obtained by the force measuring instrument 7. (i.e., the pulling force provided by the weights), the height is obtained through the height indicator. .

[0039] 4. Under the lubrication of cutting fluid, drive the silicon cylindrical rod 4 to rotate clockwise around its axis until the diamond wire cuts into the silicon cylindrical rod 3 to a certain depth. (Approximately 300 μm) After the force gauge 7 reading stabilizes, stop rotating and obtain the height using the height indicator. The pre-cutting stage is now complete. (1).

[0040] 5. Proceed to the formal cutting test. Rotate the silicon cylindrical rod (the linear velocity of the curved surface of the silicon cylindrical rod is 0.01 m / s ~ 15 m / s), and record the tensile force using a force gauge 7. The data changes over time. After a period of time T, the rotation stops, and the height is obtained via the height indicator. .

[0041] 6. Calculate the coefficient of friction for diamond wire-cut silicon cylindrical rods. ~Time Data, relative volatility coefficient (CV), average friction coefficient Relative fluctuation coefficient (CV) and average friction coefficient It is positively correlated with the lubrication capacity of the cutting fluid, therefore the relative fluctuation coefficient CV and the average friction coefficient are used. Characterizes the lubrication capability of cutting fluid.

[0042]

[0043]

[0044] in, Within the time period T, select the total number of records. Indicates the first This record, This indicates the first time interval within time period T. The tensile force displayed by force gauge 7 during the next recording. This indicates the first time interval within time period T. The friction coefficient was recorded and calculated.

[0045] 7. Calculate the diamond wire cutting rate R (i.e., the cutting amount per unit load and unit cutting stroke). This index is positively correlated with the diamond wire cutting capability, so the diamond wire cutting rate R is used to characterize the diamond wire cutting capability.

[0046] (4).

[0047] Example 1

[0048] Taking a 10mm diameter silicon cylindrical rod as an example, the groove depth is 30µm, the diamond wire diameter is 30µm, and the weight is 500g. Under static conditions, the tensile force obtained by the force gauge is 5 N, and the height indicator needle height is 15 mm. With 1 L / min cutting fluid A lubrication, the surface velocity of the silicon cylindrical rod is 0.1 m / s. After the diamond wire cuts into the silicon cylindrical rod approximately 300µm and the force gauge reading stabilizes, rotation stops, and the height indicator needle height is 14 mm, completing the pre-cutting stage. Entering the formal cutting test, the weight is changed to 100g (under static conditions, tensile force 1 N). With 1 L / min cutting fluid A lubrication, the surface velocity of the silicon cylindrical rod is 0.01 m / s. The force gauge records the tensile force change over time. After 7200 s, rotation stops, and the height indicator needle height is 13 mm.

[0049] Calculate the friction coefficient of the diamond wire-cut silicon cylindrical rod according to formulas 2 and 3. -time The data curve yielded a relative fluctuation coefficient (CV) of 0.12 and an average friction coefficient. The value is 0.1. According to Formula 4, the calculated diamond wire cutting ratio R is 0.42 mm. 2 / Nm.

[0050] Example 2

[0051] Taking a 100mm diameter silicon cylindrical rod as an example, the groove depth is 500µm, the diamond wire diameter is 100µm, and the weight is 500g. Under static conditions, the force gauge recorded a tensile force of 5 N, and the height indicator needle height was 15mm. With 1 L / min cutting fluid A lubrication, the surface velocity of the silicon cylindrical rod was 0.1 m / s. After the diamond wire penetrated approximately 300µm into the silicon cylindrical rod and the force gauge reading stabilized, rotation stopped, and the height indicator needle height was 14mm, completing the pre-cutting stage. Moving to the formal cutting test, a 1000g weight was used (under static conditions, tensile force 10 N). With 10 L / min cutting fluid A lubrication, the surface velocity of the silicon cylindrical rod was 15 m / s. The measuring instrument recorded the tensile force change over time. After 60 seconds, rotation stopped, and the height indicator needle height was 10mm.

[0052] Calculate the friction coefficient of the diamond wire-cut silicon cylindrical rod according to formulas 2 and 3. -time The data curve yielded a relative fluctuation coefficient (CV) of 0.12 and an average friction coefficient. The value is 0.18. According to Formula 4, the calculated diamond wire cutting rate R is 0.14 mm. 2 / Nm.

[0053] Example 3

[0054] Taking a 50mm diameter silicon cylindrical rod as an example, the groove depth is 100µm, the diamond wire diameter is 30µm, and the weight is 500g. Under static conditions, the tensile force obtained by the force gauge is 5 N, and the height indicator needle height is 15mm. With 1 L / min cutting fluid A lubrication, the surface velocity of the silicon cylindrical rod is 0.01 m / s. After the diamond wire cuts into the silicon cylindrical rod by approximately 300µm and the force gauge reading stabilizes, rotation stops, and the height indicator needle height is 14mm, completing the pre-cutting stage. Entering the formal cutting test, the weight is changed to 500g (under static conditions, tensile force 5 N). With 5 L / min cutting fluid A lubrication, the surface velocity of the silicon cylindrical rod is 5 m / s. The force gauge records the tensile force change over time. After 120 seconds, rotation stops, and the height indicator needle height is 9mm.

[0055] Calculate the friction coefficient of the diamond wire-cut silicon cylindrical rod according to formulas 2 and 3. -time The data curve yielded a relative fluctuation coefficient (CV) of 0.08 and an average friction coefficient. The value is 0.09. According to Formula 4, the calculated diamond wire cutting rate R is 0.26 mm. 2 / Nm.

Claims

1. An integrated testing device for diamond wire cutting and cutting fluid lubrication performance, characterized in that, The device includes a cutting fluid spraying mechanism (1) and a fixed pulley system (5). Diamond wire is wound around the fixed pulley system (5) and the groove of the silicon cylindrical rod (3). One end is connected to the measuring end of a force measuring instrument (7), and the other end is hung with a weight (4) and a height indicator. Under the conditions of the silicon cylindrical rod (3) being stationary and rotating around its axis and being cut by the diamond wire, the force measuring instrument (7) and the height indicator are used to obtain the pulling force and the moving distance, and the relative fluctuation coefficient CV and the average friction coefficient are calculated. The cutting fluid lubrication capability is characterized by the cutting fluid lubrication capability, and the diamond wire cutting rate R is characterized by the diamond wire cutting capability.

2. The integrated measuring device according to claim 1, characterized in that, The fixed pulley group (5) includes multiple fixed pulleys, which are symmetrically arranged on both sides of the silicon cylindrical rod (3), wherein the fixed pulleys near the two sides of the silicon cylindrical rod (3) are oscillating left and right.

3. The integrated measuring device according to claim 1, characterized in that, The fixed pulley group (5) and the force measuring instrument (7) are installed on the first platform (9-1). The first platform (9-1) is provided with a slide rail (8) below it. Under the constraint of the slide rail (8), the first platform (9-1) translates along the axial direction of the silicon cylindrical rod (3).

4. The integrated measuring device according to claim 3, characterized in that, It also includes a grooving tool (6) for cutting grooves, which is mounted on a second platform (9-2) and, under the constraint of a slide rail (8), the second platform (9-2) translates axially along the silicon cylindrical bar (3).

5. The integrated measuring device according to claim 4, characterized in that, The grooving tool (6) is a diamond tip, a cemented carbide tip, or a cubic boron nitride tip.

6. A measurement method based on the integrated measuring device according to any one of claims 1 to 5, characterized in that, Under the static condition of the silicon cylindrical rod (3), the tensile force is obtained by a force measuring instrument (7). Obtain altitude via the altitude indicator. ; In the case of a silicon cylindrical rod (3) being cut by diamond wire while rotating around an axis, the process includes a pre-cutting stage and a formal cutting stage. The pre-cutting stage involves the diamond wire cutting into the silicon cylindrical rod (3) to a depth based on the groove of the silicon cylindrical rod (3) under the action of cutting fluid. Then, the formal cutting stage begins, at which point the height is obtained using a height indicator. ; During the formal cutting stage, the diamond wire continuously cuts the silicon cylindrical rod (3) under the action of cutting fluid, and the tensile force is recorded by a force measuring instrument (7). Data changes over time. After a period T, the rotational cutting stops, and the height is then obtained via the height indicator. .

7. The determination method according to claim 6, characterized in that, The average coefficient of friction during the cutting process was calculated based on the tensile force data. and the relative fluctuation coefficient CV, where the average friction coefficient Friction coefficient at different time points The average is obtained using the following formula: ， ， in, Within the time period T, select the total number of records. Indicates the first This record, This indicates the first time interval within time period T. The tensile force displayed by the force measuring instrument (7) during the next recording, This indicates the first time interval within time period T. The friction coefficient was recorded and calculated.

8. The determination method according to claim 6, characterized in that, The diamond wire cutting rate R represents the cutting amount per unit load and unit cutting stroke, and the calculation formula is: ， in, The radius of the circle enclosed by the wire trough. The linear velocity of the silicon cylindrical rod (3) surface during rotation, For rotation time.

9. The determination method according to claim 6, characterized in that, The silicon cylindrical rod (3) has a diameter of 10~100 mm, and the linear velocity of the curved surface of the silicon cylindrical rod (3) during rotation is... The range is 0.01 m / s to 15 m / s.

10. The determination method according to claim 6, characterized in that, The spray flow rate is 1 L / min ~ 10 L / min.

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