Magnetoelectric sensor packaging structure capable of resisting multi-dimensional vibration interference and preparation method of magnetoelectric sensor packaging structure

Abstract

The invention relates to a magnetoelectric sensor packaging structure capable of resisting multi-dimensional vibration interference and a preparation method of the magnetoelectric sensor packaging structure. The magnetoelectric sensor packaging structure resistant to multi-dimensional vibration interference comprises a vibration conversion structure and a packaging box, one end of the vibration conversion structure is horizontally placed, the other end of the vibration conversion structure is fixedly connected with the bottom face of the packaging box, and a differential magnetoelectric sensor and a reverse bias magnet are installed in the packaging box. The reverse bias magnets are located at symmetrical positions on the two sides of the differential magnetoelectric sensor. Based on the differential magnetoelectric sensor, a reasonable vibration conversion structure is designed, and the problems that the differential magnetoelectric sensor only has a good vibration noise suppression effect on one-dimensional out-of-plane vibration and has a poor suppression effect on a complex vibration form are solved, so that the application capability of the differential magnetoelectric sensor is enhanced.

Description

Technical Field

[0001] This invention belongs to the field of sensor technology, specifically relating to a magnetoelectric sensor packaging structure and its fabrication method that resists multidimensional vibration interference. Background Technology

[0002] Magnetoelectric coupling, also known as magnetoelectric / electromagnetic coupling, refers to the physical phenomenon where a magnetic field controls polarization or an electric field controls magnetization of a material. Magnetoelectric materials based on this coupling effect can achieve energy conversion between magnetism and electricity by utilizing the product of piezomagnetism and piezoelectricity. Compared to fluxgate sensors and magnetoresistive sensors, magnetic field sensors based on this coupling effect offer advantages such as higher sensitivity, lower manufacturing cost, and lower power consumption.

[0003] In the area of ​​vibration noise suppression for magnetoelectric coupled weak magnetic sensors, experts and scholars have conducted many fruitful studies. CN115754846A proposes a differential structure and fabrication method for suppressing vibration noise in magnetoelectric coupled sensors. The structure of this technical solution is as follows: Figure 1 As shown, a spindle-shaped / elongated magnetoelectric composite material is installed inside the outer shell base. This composite material is connected to a three-core signal connector and is equipped with a reverse bias magnet. This technical solution solves the problem of poor symmetry in traditional discrete differential sensors by integrating two sensing arms of magnetostrictive material into a 2-1 type multi-push-pull piezoelectric sensitive unit. Simultaneously, the one-dimensional elongated configuration enhances the longitudinal vibration mode, effectively improving the coupling strength and detection capability of the differential magnetoelectric sensor. This addresses the problem that traditional integrated differential structures fail to effectively utilize the 2-1 type magnetoelectric composite structure, and the discrete differential magnetoelectric coupling sensor suffers from weak symmetry of sensing elements, resulting in insufficient common-mode rejection ratio for environmental noise. However, this differential structure only has a relatively good vibration noise suppression effect for one-dimensional out-of-plane vibration; its suppression effect is poor for complex multi-dimensional vibration interference. Summary of the Invention

[0004] To address the technical problem of traditional differential magnetoelectric sensors' poor suppression of complex vibration patterns, this invention proposes a magnetoelectric sensor packaging structure resistant to multidimensional vibration interference, comprising a vibration conversion structure and a packaging box. One end of the vibration conversion structure is placed horizontally, and the other end is fixedly connected to the bottom surface of the packaging box. A differential magnetoelectric sensor and a reverse bias magnet are installed inside the packaging box, with the reverse bias magnet located symmetrically on both sides of the differential magnetoelectric sensor.

[0005] Furthermore, the vibration conversion structure includes a base, a ring, a spring plate, an intermediate connector, and a stud;

[0006] The base is placed horizontally;

[0007] The intermediate connector is a cylinder, located above the base, and is fixedly connected to the base;

[0008] The spring sheet is a circular spring sheet with a gap, including a first spring sheet and a second spring sheet, which are respectively disposed at both ends of the intermediate connector. The first spring sheet abuts against the upper bottom surface of the intermediate connector, and the second spring sheet abuts against the lower bottom surface of the intermediate connector.

[0009] The ring is sleeved on the outside of the second spring sheet and is fixedly connected to the second spring sheet;

[0010] An even number of studs are connected between the first spring sheet and the second spring sheet, and between the first spring sheet and the packaging box. The studs are symmetrically distributed along the axis of the intermediate connector, and the ring, spring sheet and packaging box are connected and fixed by the studs.

[0011] The vibration conversion structure enables the complex multidimensional motion of the magnetoelectric sensor system to be transformed into one-dimensional motion through anisotropic force transmission. When only one spring is used, the vibration conversion structure will sway from side to side and cannot be fixed. Therefore, two spring plates are used to fix it, ensuring that the vibration conversion device does not sway and improving the structural stability.

[0012] Furthermore, each spring sheet has a mounting lug extending radially outward at its upper end, and the ring and encapsulation box are machined with corresponding mounting holes. The stud passes through the mounting lug and mounting holes to lock and fix the ring, spring sheet and encapsulation box.

[0013] Furthermore, the base includes a bottom disk, a middle cone, and a top cylinder that are coaxially and fixedly connected in sequence, with the top cylinder abutting against the second spring plate.

[0014] Furthermore, the geometric center axes of the base, spring sheet, and intermediate connector coincide and are collinear with the geometric center axis of the bottom surface of the packaging box. The spring and copper stud are the core force transmission components, which achieve effective conversion of multidimensional vibration to the vertical direction through preload. Their installation position and force transmission path are strictly aligned with the bottom surface of the sensor packaging to reduce non-axial interference.

[0015] Furthermore, the geometric center axis of the differential magnetoelectric sensor is collinear with the centerline of the vibration conversion structure and coincides with the geometric center axis of the packaging box.

[0016] Furthermore, the encapsulation box is symmetrically provided with grooves, and the reverse bias magnets are respectively embedded in the grooves to provide a bias magnetic field for the differential magnetoelectric sensor.

[0017] Furthermore, the spring sheet and stud are made of copper. The use of copper for both the spring and the copper stud ensures that the mechanical connection between the vibration conversion structure and the differential magnetoelectric sensor does not interfere with the magnetic field measurement.

[0018] Furthermore, the base, ring, and intermediate connector are all made of photosensitive material.

[0019] Furthermore, the reverse bias magnet is made of neodymium iron boron magnet material.

[0020] The present invention also provides a method for fabricating the aforementioned magnetoelectric sensor packaging structure resistant to multidimensional vibration interference, comprising the following steps:

[0021] Fabrication of vibration conversion structures;

[0022] Prepare a package for housing a differential magnetoelectric sensor;

[0023] The reverse bias magnet is fixed inside the package, so that the reverse bias magnet is located at a symmetrical position on both sides of the differential magnetoelectric sensor, and the appropriate bias magnetic field is adjusted by increasing or decreasing the number of magnets.

[0024] The encapsulation box and vibration conversion structure are axially aligned and installed.

[0025] Furthermore, the preparation of the vibration conversion structure specifically includes:

[0026] The bottom disc, the middle cone, and the top cylinder are machined and fixedly connected in sequence so that their axes are on a straight line to obtain the base;

[0027] A second spring plate, an intermediate connector, and a first connector are placed sequentially on the top cylinder of the base. A ring is fitted over the outside of the second spring plate, and the first spring plate and the second spring plate, as well as the first spring plate and the encapsulation box, are fixedly connected by studs to obtain a vibration conversion structure.

[0028] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0029] This invention proposes a magnetoelectric sensor packaging structure resistant to multidimensional vibration interference, comprising a vibration conversion structure and a packaging box. One end of the vibration conversion structure is placed horizontally, and the other end is fixedly connected to the packaging box. A differential magnetoelectric sensor and a reverse bias magnet are installed inside the packaging box. Based on a differential magnetoelectric sensor, this invention designs a reasonable vibration conversion structure. This structure limits external multidimensional vibration interference, ensuring that the sensor inside the packaging box is only affected by single-dimensional vibration interference, thereby achieving a multidimensional vibration suppression effect. This solves the problem that differential magnetoelectric sensors only have a good vibration noise suppression effect for one-dimensional out-of-plane vibrations, but their suppression effect is poor for complex vibration patterns, thus enhancing the application capabilities of differential magnetoelectric sensors. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the packaging structure of the magnetoelectric sensor resisting multidimensional vibration interference according to the present invention;

[0031] Figure 2 This is a front view of the packaging structure of the magnetoelectric sensor resisting multidimensional vibration interference according to the present invention;

[0032] Figure 3 This is an exploded view of the packaging structure of the magnetoelectric sensor resisting multidimensional vibration interference according to the present invention.

[0033] Figure 4 This is a schematic diagram of the package containing the differential magnetoelectric sensor and the reverse bias magnet of the present invention;

[0034] Figure 5 This is a physical diagram of the differential magnetoelectric sensor of the magnetic detection system of the present invention;

[0035] Figure 6 This is a physical diagram of the wireless data acquisition and transmission device of the magnetic detection system of the present invention;

[0036] Figure 7 This is a physical diagram of the magnetic detection system of the present invention;

[0037] Figure 8 To obtain the amplitude-frequency response curves of the single-ended mode and differential mode waveforms of the magnetic detection system under 10Hz vibration excitation environment by performing fast Fourier transform;

[0038] Figure 9 The present invention describes the frequency domain characteristics of a magnetic detection system under 7Hz magnetic field and 10Hz vibration excitation by performing FFT on single-ended and differential mode waveforms.

[0039] Figure 10 The differential time-domain waveform of the magnetic detection system of the present invention under 7Hz magnetic field and 10Hz vibration excitation is recovered after digital processing;

[0040] Among them, 100 is the vibration conversion structure; 110 is the base; 111 is the bottom disk; 112 is the middle cone; 113 is the top cylinder; 120 is the ring; 130 is the spring plate; 131 is the first spring plate; 132 is the second spring plate; 140 is the intermediate connector; 150 is the stud; 200 is the encapsulation box; 300 is the differential magnetoelectric sensor; and 400 is the reverse bias magnet. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0042] Example 1

[0043] To address the problem of traditional differential magnetoelectric sensors' poor suppression of complex multidimensional vibration patterns, this invention proposes a magnetoelectric sensor packaging structure based on a clamping device, designed for multidimensional vibration interference under power conditions. The aim is to transform complex multidimensional vibrations under power conditions into one-dimensional vibrations through force anisotropy transmission, effectively enhancing the application capabilities of differential magnetoelectric sensors.

[0044] This embodiment proposes a magnetoelectric sensor packaging structure for multi-dimensional vibration interference under power operating conditions, such as... Figures 1-4 As shown, the device includes a vibration conversion structure 100 and a packaging box 200. The vibration conversion structure 100 is fixedly connected to the bottom surface of the packaging box 200. A differential magnetoelectric sensor 300 and a reverse bias magnet 400 are installed inside the packaging box 200. The reverse bias magnet 400 is located symmetrically on both sides of the differential magnetoelectric sensor 300. By limiting external multi-dimensional vibration interference through the vibration conversion structure 100, the sensor inside the packaging box 200 is protected from single-dimensional vibration interference, thereby achieving a multi-dimensional vibration suppression effect.

[0045] The vibration conversion structure 100 includes a base 110, a ring 120, a spring plate 130, an intermediate connector 140, and a stud 150. The base 110 is placed horizontally. The intermediate connector 140 is a cylinder, located above the base 110, and fixedly connected to the base 110. The spring plate 130 is a circular spring plate with a gap, including a first spring plate 131 and a second spring plate 132, respectively located at both ends of the intermediate connector 140. The first spring plate 131 is connected to the upper bottom of the intermediate connector 140. The second spring sheet 132 abuts against the lower bottom surface of the intermediate connecting member 140. The ring 120 is sleeved on the outside of the second spring sheet 132 and fixedly connected to the second spring sheet 132. An even number of studs 150 are connected between the first spring sheet 131 and the second spring sheet 132, and between the first spring sheet 131 and the encapsulation box 300. The studs 150 are symmetrically distributed along the axis of the intermediate connecting member 140. The ring 120, the spring sheet 130, and the encapsulation box 200 are connected and fixed by the studs 140. The vibration conversion structure 100 adopts a rigid constraint design, which limits the motion degree of freedom of the differential magnetoelectric sensor 300 in the encapsulation box 200 to the normal direction (i.e., the direction perpendicular to the sensor plane), ensuring that the mechanical transmission path of the external excitation is strictly distributed along the axial direction, thereby realizing the conversion of external multidimensional vibration interference into single-dimensional vibration and achieving the effect of suppressing multidimensional vibration.

[0046] Each spring plate 130 has a mounting ear extending radially outward at its upper end. The ring and the encapsulation box are machined with corresponding mounting holes. The stud 150 passes through the mounting ear and the mounting hole to lock and fix the ring 120, the spring plate 130 and the encapsulation box 200.

[0047] The base 110 includes a bottom disc 111, a middle cone 112 and a top cylinder 113 that are coaxially and fixedly connected in sequence, and the top cylinder 113 abuts against the second spring plate 132.

[0048] The geometric center axes of the base 110, spring plate 130, and intermediate connector 140 coincide and are collinear with the geometric center axis of the bottom surface of the packaging box 200. The spring 130 and stud 150, as core force transmission components, effectively convert multi-dimensional vibrations to the vertical direction through preload. That is, when facing multi-dimensional (up / down, front / back, left / right, etc.) vibration interference, the spring and copper stud limit different-dimensional vibrations to up / down vibrations, thereby suppressing multi-dimensional vibrations. Their installation position and force transmission path are strictly aligned with the bottom surface of the sensor packaging to reduce non-axial interference.

[0049] The geometric center axis of the differential magnetoelectric sensor 300 is collinear with the axis of the vibration conversion structure 100 and coincides with the geometric center axis of the packaging box 200.

[0050] The encapsulation box 200 has two symmetrical grooves inside, and the reverse bias magnets 400 are respectively embedded in the grooves.

[0051] In this embodiment, the design specifications of each component are as follows: the ring: outer diameter 74mm, inner diameter 60mm, axial thickness 3mm; the intermediate connector: cylindrical structure, diameter 20mm, height 30mm. The design specifications of the base are as follows: bottom disc: diameter 100mm, thickness 10mm; middle cone: upper diameter 20mm, lower diameter 74mm, vertical height 15mm; top cylinder: diameter 20mm, height 10mm. The design parameters of the spring include: outer diameter 28.32mm, inner diameter 11.42mm, radial clearance 4mm (per turn interval), gap 2mm, ring thickness 3mm; the stud: stud parameters: height 30mm, standard M3 thread. The dimensional design values ​​are typical values ​​of this embodiment, and other dimensional designs using this vibration transmission mechanism are also within the protection of this invention. The core influencing factors of vibration conversion performance include the spring's material properties (such as elastic modulus), geometric parameters (wire diameter, number of turns, free length), and stiffness coefficient. The dynamic response characteristics of the structure can be adjusted by optimizing these parameters under different operating conditions. It should be noted that since the parameter values ​​differ under different operating conditions, this invention does not provide specific typical parameter values. Other core parameter designs using this vibration conversion mechanism are also within the protection scope of this invention.

[0052] To ensure that the mechanical connection between the vibration conversion structure and the magnetoelectric sensor does not interfere with the magnetic field measurement, the spring 130 and the connecting stud 150 are both made of copper to avoid introducing additional magnetic interference. The base 110, the ring 120, and the intermediate connector 140 are all made of photosensitive material. The reverse bias magnet 400 is made of neodymium iron boron magnet material. The encapsulation box 200 is a resin encapsulation box.

[0053] Example 2

[0054] This embodiment provides a method for fabricating a magnetoelectric sensor packaging structure resistant to multidimensional vibration interference as described in Embodiment 1, comprising the following steps:

[0055] (1) Design and process the bottom disc 111, the middle cone 112 and the top cylinder 113 to be assembled together, and make the base 110;

[0056] (2) The ring 120, the intermediate connector 130 and the spring plate 130 are mounted on the base 110 to form a vibration conversion structure 100;

[0057] (3) Prepare a package 200 for placing the differential magnetoelectric sensor 300;

[0058] (4) Prepare a differential magnetoelectric sensor 300, connect the circuit and button battery, and fix the reverse bias magnet 400 in the groove inside the package box 200 so that the reverse bias magnet 400 is located at a symmetrical position on both sides of the differential magnetoelectric sensor 300, and adjust to a suitable bias magnetic field by increasing or decreasing the number of magnets.

[0059] (5) The encapsulation box 200 and the vibration conversion structure 100 are installed by axial alignment using studs 150.

[0060] Test case

[0061] like Figure 4 The image shows the components of the transmitter of the final designed and manufactured weak magnetic field detection system and the overall finished product structure. Figure 5 This is a packaged differential magnetoelectric sensor. Figure 6 For data acquisition and wireless transmission devices, Figure 7 The magnetic detection system consists of a core differential magnetoelectric composite structure (containing a Metglas / PZT laminated unit with a reverse bias magnetic field configuration), a reverse bias permanent magnet (neodymium iron boron magnet, magnetic field strength ±3Oe), a dual-channel charge amplifier (gain 18.4mV / pC, bandwidth 0.1-10Hz), and a button battery (±3.3V power supply). The sensor's two output terminals (#1 and #2) are connected to the analog input port of the upper-level data acquisition system via 0.1mm diameter enameled wire.

[0062] The system adopts a layered modular design: the bottom is a vibration damping structure (copper spring damping system, outer diameter 30mm, pitch 10mm), which is connected to the upper resin encapsulation box (dimensions 15×20×40cm) via copper studs (M3 thread, length 20mm). 3 The structure is fixed in place; a differential magnetoelectric sensor is placed in the lower layer inside the resin-encapsulated box, and a data acquisition system (32-bit ADC, sampling rate 10ksps, STM32F103 main controller) is integrated in the upper layer. An external lithium battery (18650 type, 3.7V / 3000mAh) is located on the top of the box for power. A LoRa wireless transmission module (433MHz band, 22dBm transmit power) and an omnidirectional antenna are embedded in the side of the box to achieve remote real-time transmission of detection data. All components are externally wrapped with a copper foil shielding layer and grounded to suppress electromagnetic interference. The base of the vibration suppression structure is fixed to a horizontal tabletop with screws.

[0063] Providing the aforementioned device with a 10Hz vibration excitation environment causes its magnetic detection system to respond, such as Figure 8The amplitude-frequency response curves of the magnetic detection system under 10Hz vibration excitation were obtained by performing Fast Fourier Transform (FFT) on the single-ended and differential modes. #1 and #2 represent the two output channels in single-ended mode, while #1-#2 represent the differential output. Output voltage is the output voltage, and frequency is the frequency. The results show that the vibration energy in the low-frequency range below 4Hz is suppressed from 2mVrms to below 300μVrms, with a common-mode rejection ratio (CMRR) of approximately 16.5dB. Meanwhile, the response amplitude of the 10Hz vibration decreases from 160mVrms to 16mVrms, with a CMRR of approximately 20dB. Residual 10Hz harmonic components (such as the 20Hz second harmonic) are further suppressed to below 400μVrms.

[0064] When the device is provided with a 7Hz magnetic field and a 10Hz vibration excitation, its magnetic detection system generates a response, such as... Figure 9 The frequency domain characteristics of the magnetic detection system under 7Hz magnetic field and 10Hz vibration excitation were obtained by performing FFT on single-ended and differential mode waveforms. #1 and #2 are the two output channels in single-ended mode, and #1-#2 are the differential outputs. Output voltage is the output voltage, and frequency is the frequency. The results show that the effective value of the differential magnetoelectric sensor signal at 7Hz magnetic field increased from 80mVrms to 160mVrms, with a gain of up to 100%, while the vibration noise at 10Hz was suppressed from 80mVrms to 20mVrms, with a common-mode rejection ratio greater than 12dB, and its second harmonic (20Hz) amplitude attenuated by 90%.

[0065] like Figure 10 As shown, this device recovers the differential time-domain waveform after digital processing from the magnetic detection system under a 7Hz magnetic field and 10Hz vibration excitation. The Normalized Differential Output is the normalized differential output. It can be seen that the smoothing exponent of the recovered waveform after filtering and normalization at the 15Hz cutoff frequency is close to that of the differential output mode, indicating that the vibration suppression structure effectively reduces the nonlinear noise of the sensor output through mechanical filtering, reducing the dependence on digital signal processing. This invention originates from a differential magnetoelectric sensor, which, when combined with it, forms a magnetic detection system. In terms of application scale, as the market demand for measurement accuracy and interference shielding increases, this patented technology, with its inherent effectiveness and simplified structure, will have a considerable application scale.

[0066] The above are merely embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of the claims of the present invention pending approval.

Claims

1. A magnetoelectric sensor packaging structure resistant to multidimensional vibration interference, characterized in that, The device includes a vibration conversion structure and a packaging box. One end of the vibration conversion structure is placed horizontally, and the other end is fixedly connected to the bottom surface of the packaging box. A differential magnetoelectric sensor and a reverse bias magnet are installed inside the packaging box. The reverse bias magnet is located symmetrically on both sides of the differential magnetoelectric sensor.

2. The packaging structure according to claim 1, characterized in that, The vibration conversion structure includes a base, a ring, a spring plate, an intermediate connector, and a stud. The base is placed horizontally; The intermediate connector is a cylinder, located above the base, and is fixedly connected to the base; The spring sheet is a circular spring sheet with a gap, including a first spring sheet and a second spring sheet, which are respectively disposed at both ends of the intermediate connector. The first spring sheet abuts against the upper bottom surface of the intermediate connector, and the second spring sheet abuts against the lower bottom surface of the intermediate connector. The ring is sleeved on the outside of the second spring sheet and is fixedly connected to the second spring sheet; An even number of studs are connected between the first spring sheet and the second spring sheet, and between the first spring sheet and the packaging box. The studs are symmetrically distributed along the axis of the intermediate connector, and the ring, spring sheet and packaging box are connected and fixed by the studs.

3. The packaging structure according to claim 2, characterized in that, Each spring sheet has a mounting lug extending radially outward at its upper end. The ring and the encapsulation box are machined with corresponding mounting holes. The stud passes through the mounting lug and the mounting hole to lock and fix the ring, spring sheet and encapsulation box.

4. The packaging structure according to claim 2, characterized in that, The base includes a bottom disc, a middle cone, and a top cylinder that are coaxially and fixedly connected in sequence, with the top cylinder abutting against the second spring plate.

5. The packaging structure according to claim 2, characterized in that, The geometric center axes of the base, spring sheet, and intermediate connector coincide and are collinear with the geometric center axis of the bottom surface of the packaging box.

6. The packaging structure according to claim 5, characterized in that, The geometric center axis of the differential magnetoelectric sensor is collinear with the centerline of the vibration conversion structure and coincides with the geometric center axis of the packaging box.

7. The packaging structure according to claim 1, characterized in that, The packaging box has symmetrical grooves inside, and the reverse bias magnets are respectively embedded in the grooves.

8. The packaging structure according to claim 2, characterized in that, The spring sheet and stud are made of copper.

9. The packaging structure according to claim 2, characterized in that, The base, ring, and intermediate connector are all made of photosensitive material.

10. The packaging structure according to claim 1, characterized in that, The reverse bias magnet is made of neodymium iron boron magnet material.

11. A method for fabricating a magnetoelectric sensor packaging structure resistant to multidimensional vibration interference as described in any one of claims 1 to 10, characterized in that, Includes the following steps: Fabrication of vibration conversion structures; Prepare a package for housing a differential magnetoelectric sensor; The reverse bias magnet is fixed inside the package, so that the reverse bias magnet is located at a symmetrical position on both sides of the differential magnetoelectric sensor, and the appropriate bias magnetic field is adjusted by increasing or decreasing the number of magnets. The encapsulation box and vibration conversion structure are axially aligned and installed.

12. The preparation method according to claim 11, characterized in that, The preparation of the vibration conversion structure specifically includes: The bottom disc, the middle cone, and the top cylinder are machined and fixedly connected in sequence so that their axes are on a straight line to obtain the base; A second spring plate, an intermediate connector, and a first connector are placed sequentially on the top cylinder of the base. A ring is fitted over the outside of the second spring plate, and the first spring plate and the second spring plate, as well as the first spring plate and the encapsulation box, are fixedly connected by studs to obtain a vibration conversion structure.

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