Array substrate, preparation method of array substrate, display panel and display device

Abstract

The invention discloses an array substrate, a preparation method of the array substrate, a display panel and a display device, and relates to the technical field of display. The array substrate comprises a substrate body and a metal circuit layer arranged on one side of the substrate body, and a plurality of pixel areas are defined by the metal circuit layer; the array substrate further comprises a pixel layer and a shading layer, the pixel layer comprises a plurality of pixel units, the pixel units are arranged in the pixel area, the distance from the surface, away from the substrate, of each pixel unit to the substrate is defined as H1, the distance from the surface, away from the substrate, of the metal circuit layer to the substrate is defined as H2, and H1 is larger than H2; the shading layer covers the side, away from the substrate, of the metal circuit layer and is connected with the pixel units, the distance between the surface, away from the substrate, of the shading layer and the substrate is defined as H3, and H3 is not larger than H1. The problem that the aperture opening ratio of a traditional display panel is small is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to an array substrate, a preparation method of the array substrate, a display panel and a display device. BACKGROUND

[0002] In the display device, when the light is emitted out through the backlight module, not all the light can pass through the panel, some areas, such as the metal lines on the array substrate side, need to be shielded by the black matrix. The conventional light shielding means is to use the black matrix to shield the light, that is, to prepare a matrix on the color film substrate, which corresponds to the metal lines on the array substrate. However, this method has the problem that the upper and lower glass panels themselves have differences in assembly and process fluctuation offset, which easily causes the light leakage phenomenon caused by not completely shielding the lines on the array substrate side, so it is usually necessary to increase the light shielding range to prevent the light leakage caused by the process fluctuation, but this will lead to the increase of the light shielding area, and thus the aperture ratio is greatly lost. SUMMARY

[0003] The main purpose of the present application is to provide an array substrate, a preparation method of the array substrate, a display panel and a display device, which aims to improve the problem of small aperture ratio of the conventional display panel.

[0004] To achieve the above-mentioned purpose, the array substrate provided by the present application comprises a substrate and a metal line layer arranged on one side of the substrate, the metal line layer defines a plurality of pixel areas; the array substrate further comprises a pixel layer and a light shielding layer, the pixel layer comprises a plurality of pixel units, the pixel units are arranged in the pixel areas, and the distance from the surface of the pixel unit away from the substrate to the substrate is defined as H1, the distance from the surface of the metal line layer away from the substrate to the substrate is defined as H2, wherein H1 is greater than H2; the light shielding layer is arranged on the side of the metal line layer away from the substrate and connected with the pixel units, and the distance from the surface of the light shielding layer away from the substrate to the substrate is defined as H3, wherein H3 is not greater than H1.

[0005] In an embodiment, the H3 is equal to the H1.

[0006] In an embodiment, the metal line layer comprises a plurality of scan lines, a plurality of data lines and a plurality of common electrodes, the scan lines and the data lines are arranged to intersect and jointly define a plurality of first areas, the common electrodes are arranged in the first areas and have a gap between the scan lines and the data lines, the common electrodes are enclosed to form the pixel areas, and the projection of the edge of the pixel unit falls on the common electrodes.

[0007] In an embodiment, the array substrate further comprises a protective layer, the protective layer is arranged between the metal line layer and the light shielding layer. And / or, the array substrate further comprises a planar layer, the planar layer is arranged on the side of the light-shielding layer away from the substrate and covers the light-shielding layer and the pixel unit.

[0008] The application further provides a preparation method of the array substrate, the preparation method comprising: preparing a substrate and coating a metal circuit layer on the substrate, the metal circuit layer defining a plurality of pixel regions; coating a pixel layer on one side of the substrate and etching the pixel layer so that the pixel layer covers the pixel regions and the distance from the surface of the pixel layer away from the substrate to the substrate is greater than the distance from the surface of the metal circuit layer away from the substrate to the substrate; coating a light-shielding layer on the side of the metal circuit layer away from the substrate, wherein the distance from the surface of the light-shielding layer away from the substrate to the substrate is not greater than the distance from the surface of the pixel layer away from the substrate to the substrate.

[0009] In an embodiment, the step of coating a light-shielding layer on the side of the metal circuit layer away from the substrate, wherein the distance from the surface of the light-shielding layer away from the substrate to the substrate is not greater than the distance from the surface of the pixel layer away from the substrate to the substrate, comprises: coating a light-shielding layer on both the side of the metal circuit layer away from the substrate and the side of the pixel layer away from the substrate; performing overall etching on the light-shielding layer; detecting that the pixel layer is in a revealed state and stopping etching the light-shielding layer so that the distance from the surface of the light-shielding layer away from the substrate to the substrate is equal to the distance from the surface of the pixel layer away from the substrate to the substrate.

[0010] In an embodiment, the step of detecting that the pixel layer is in a revealed state and stopping etching the light-shielding layer so that the distance from the surface of the light-shielding layer away from the substrate to the substrate is equal to the distance from the surface of the pixel layer away from the substrate to the substrate, comprises: detecting the concentration of a reaction gas in a dry etching process; comparing the concentration of the reaction gas with a preset concentration ratio; detecting that the concentration of the reaction gas is lower than the preset concentration; determining that the pixel layer is in a revealed state; stopping etching the light-shielding layer so that the distance from the surface of the light-shielding layer away from the substrate to the substrate is equal to the distance from the surface of the pixel layer away from the substrate to the substrate.

[0011] In an embodiment, the step of coating the light-shielding layer on the side of the metal circuit layer away from the substrate, wherein the distance from the surface of the light-shielding layer away from the substrate to the substrate is not greater than the distance from the surface of the pixel layer away from the substrate to the substrate, further comprises: coating a planar layer on the side of the light-shielding layer away from the substrate.

[0012] The present application also provides a display panel, comprising a counter substrate, liquid crystal and the array substrate as described above, the counter substrate is arranged on the side of the light-shielding layer away from the substrate, and a gap is arranged between the light-shielding layer and the counter substrate, and the liquid crystal is arranged in the gap.

[0013] The present application also provides a display device, comprising a backlight module and the display panel as described above, and the backlight module is arranged on the side of the substrate away from the metal circuit layer.

[0014] The array substrate in the technical scheme of the present application comprises a substrate and a metal circuit layer arranged on one side of the substrate, and the metal circuit layer defines a plurality of pixel areas so as to arrange pixel units in the pixel areas. The array substrate in the present application further comprises a light-shielding layer arranged on the side of the metal circuit layer away from the substrate, and the distance H1 from the surface of the pixel unit of the array substrate away from the substrate to the substrate is greater than the distance H2 from the surface of the metal circuit layer away from the substrate to the substrate, and the distance H3 from the surface of the light-shielding layer away from the substrate to the substrate is not greater than H1, so that a topographic difference is formed between the pixel layer and the metal circuit layer. When a light-shielding layer with a certain thickness is arranged on the side of the metal circuit layer away from the substrate, the light-shielding layer can be arranged at the same height as part of the pixel layer without shielding the pixel layer, and thus the opening rate is increased on the basis of completely shielding the metal circuit layer. In addition, by arranging the light-shielding layer on the array substrate, the relative position of the light-shielding layer and the metal circuit layer is always fixed and unchanged, and no matter how the array substrate or another substrate opposite to the array substrate moves, the light-shielding effect of the light-shielding layer on the metal circuit and the size of the opening rate will not be affected, so that the problem of small opening rate caused by the influence of assembly difference or process difference of the light-shielding layer on the other substrate can be solved. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the drawings shown.

[0016] Figure 1 A sectional view of an example of the array substrate of Embodiment One of the present application. Figure 2 This is a partial top view of the array substrate of Embodiment 1 provided by the present invention; Figure 3 A cross-sectional view of another example of the array substrate provided in Embodiment 1 of the present invention; Figure 4 A schematic diagram of the cross-sectional structural state change process of an example of the fabrication method of the array substrate in Embodiment 2 of the present invention; Figure 5 A top view schematic diagram illustrating the structural state change process of an example of the fabrication method of the array substrate in Embodiment 2 of the present invention; Figure 6 This is a schematic flowchart illustrating an example of the method for fabricating an array substrate according to Embodiment 2 of the present invention. Figure 7 A detailed flowchart of step S30 in the method for fabricating an array substrate according to an embodiment of the present invention; Figure 8 A detailed flowchart of step S33 in the method for fabricating an array substrate according to an embodiment of the present invention; Figure 9 A schematic flowchart illustrating yet another example of the method for fabricating the array substrate according to Embodiment 2 of the present invention; Figure 10 This is a schematic diagram of the structure of the display panel according to Embodiment 3 of the present invention; Figure 11 This is a schematic diagram of the structure of the display device according to Embodiment 4 of the present invention.

[0017] Explanation of icon numbers: 10. Display panel; 100, Array substrate; 110, Substrate; 120, Metal circuit layer; 121, Scan line; 122, Data line; 123, Common electrode; 130, Pixel layer; 131, Pixel unit; 140, Light-shielding layer; 150, Protective layer; 160, Planarization layer; 200. Opposite substrate; 300, LCD; 20. Backlight module.

[0018] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0021] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0022] When light is emitted from the backlight panel, not all light can pass through the panel. For example, signal traces, thin-film transistor switches, and storage capacitors for voltage storage exist. These areas are not only not completely transparent, but the light passing through them is not voltage-controlled, preventing the display of correct grayscale. Therefore, they need to be shielded using a black matrix to avoid interfering with other transparent areas. The ratio of the effective transparent area to the total area is called the aperture ratio. Conventional light-shielding methods primarily use a black matrix, which uses black color resist fabricated in a matrix shape on the color filter substrate, corresponding to the metal lines on the array substrate. However, this approach suffers from assembly differences between the upper and lower glass substrates and process fluctuations, easily leading to incomplete shielding of the array substrate's lines and causing light leakage. Therefore, the shielding area is usually increased during design to mitigate light leakage caused by process fluctuations, but this results in a larger shielding area and a smaller aperture ratio.

[0023] Example 1: To address the issue of small aperture ratio in traditional display panels, this invention proposes an array substrate.

[0024] like Figure 1 As shown, in one embodiment of the present invention, the array substrate 100 includes a substrate 110 and a metal line layer 120 disposed on one side of the substrate 110, the metal line layer 120 defining a plurality of pixel regions; the array substrate 100 also includes a pixel layer 130 and a light-shielding layer 140, the pixel layer 130 includes a plurality of pixel units 131, the pixel units 131 are disposed within the pixel regions, and the distance from the surface of the pixel unit 131 away from the substrate 110 to the substrate 110 is defined as H1, the distance from the surface of the metal line layer 120 away from the substrate 110 to the substrate 110 is defined as H2, wherein H1 is greater than H2; the light-shielding layer 140 covers the side of the metal line layer 120 away from the substrate 110 and is connected to the pixel units 131, and the distance from the surface of the light-shielding layer 140 away from the substrate 110 to the substrate 110 is defined as H3, wherein H3 is not greater than H1.

[0025] The substrate 110 of the array substrate 100 can be a thin-film transistor array glass substrate or a ceramic substrate, etc. The metal circuit layer 120 can include scan lines 121, data lines 122, and a common electrode 123. The scan lines 121 and data lines 122 are intersecting, and can be perpendicular, acute, or obtuse. Multiple scan lines 121 are provided, and the multiple scan lines 121 are arranged in parallel; multiple data lines 122 are also provided, and the multiple data lines 122 are arranged in parallel. The multiple data lines 122 and multiple scan lines 121 together define multiple cutout areas. These cutout areas can serve as pixel areas for pixel units 131. The common electrode 123 is disposed around the cutout areas, and gaps are formed between the scan lines 121 and data lines 122 and the common electrode 123. The pixel unit 131 can be disposed in the area formed by the common electrode 123, or it can extend onto or outside the common electrode 123. It should be noted that the arrangement of the metal circuit layer 120 on the array substrate 100 is a well-known technique to those skilled in the art, and will not be described in detail here.

[0026] The array substrate 100 also includes a pixel layer 130, which includes a plurality of pixel units 131. When pixel units 131 are disposed within a pixel region, one pixel unit 131 or multiple pixel units 131 can be disposed within a pixel region. At least two different colors of pixel units 131 may be present among the plurality of pixel units 131. For example, the plurality of pixel units 131 may include red pixel sub-units, green pixel sub-units, and blue pixel sub-units. One red pixel sub-unit, one green pixel sub-unit, and one blue pixel sub-unit form a pixel group. The pixel layer 130 may include one or more such pixel groups. Of course, in other examples, the pixel group may also include yellow pixel sub-units and / or white pixel sub-units. Two adjacent pixel groups are defined as a first pixel group and a second pixel group. The color of the pixel unit 131 in the first pixel group that is closer to the second pixel group can be the same as or different from the color of the pixel unit 131 in the second pixel group that is closer to the first pixel group. It is understandable that when the color of the pixel unit 131 of the first pixel group near the second pixel group is the same as the color of the pixel unit 131 of the second pixel group near the first pixel group, a light-shielding layer 140 is not required between these two pixel units 131 with the same color, thereby further improving the aperture ratio. When the color of the pixel unit 131 of the first pixel group near the second pixel group is different from the color of the pixel unit 131 of the second pixel group near the first pixel group, the light mixing effect of the display panel 10 can be improved, achieving a better display effect. In this invention, the distance from the surface of the pixel unit 131 away from the substrate 110 to the substrate 110 is H1, and the distance from the surface of the metal circuit layer 120 away from the substrate 110 to the substrate 110 is H2, where H1 is greater than H2. For example, the difference between H1 and H2 can be 1μm, 2μm, or 3μm, etc. This makes the terrain of the pixel unit 131 higher than that of the metal circuit layer 120. Therefore, when a light-shielding layer 140 of a certain thickness is subsequently set, the light-shielding layer 140 can completely cover the metal circuit layer 120 and is less likely to cross the pixel layer 130 away from the surface of the substrate 110, that is, it is less likely to block the pixel layer 130 from crossing the surface of the substrate 110. Therefore, the risk of the light-shielding layer 140 covering the pixel area can be reduced, thereby improving the aperture ratio.

[0027] The light-shielding layer 140 can be made of dark-colored resist, such as black or dark blue. The light-shielding layer 140 covers the side of the metal circuit layer 120 facing away from the substrate 110 and is connected to the pixel unit 131, thus completely shielding the metal circuit layer 120 and reducing the possibility of light being interfered with at the metal circuit layer 120, resulting in incorrect grayscale display. Furthermore, the distance from the surface of the light-shielding layer 140 facing away from the substrate 110 to the substrate 110 is H3, where H3 is not greater than H1, i.e., H3 is equal to H1 or H3 is less than H1. This configuration ensures that the light-shielding layer 140 can completely shield the metal circuit layer 120 without obstructing the pixel layer 130 and the corresponding pixel area, thereby significantly improving the aperture ratio. Furthermore, this configuration allows the light-shielding layer 140 to be completely bonded to the metal circuit layer 120. Regardless of the alignment of the array substrate 100 in the display panel 10 or the opposing substrate 200 opposite to the array substrate 100, the aperture ratio remains unaffected. This improves the problem of a small aperture ratio caused by alignment differences, and also addresses the issue of a small aperture ratio caused by black matrix process fluctuations when the black matrix is ​​placed on the substrate opposite the array substrate 100. The light-shielding layer 140 can be applied to the array substrate 100 by coating or by attaching a light-shielding film.

[0028] The array substrate 100 in the technical solution of the present invention includes a substrate 110 and a metal line layer 120 disposed on one side of the substrate 110. The metal line layer 120 defines a plurality of pixel regions so as to facilitate the arrangement of pixel units 131 within the pixel regions. In this invention, the array substrate 100 further includes a light-shielding layer 140. The light-shielding layer 140 is disposed on the side of the metal line layer 120 away from the substrate 110. The distance H1 from the surface of the pixel unit 131 of the array substrate 100 away from the substrate 110 to the substrate 110 is greater than the distance H2 from the surface of the metal line layer 120 away from the substrate 110 to the substrate 110. The distance H3 from the surface of the light-shielding layer 140 away from the substrate 110 to the substrate 110 is not greater than H1. This creates a ground difference between the pixel layer 130 and the metal line layer 120. When a light-shielding layer 140 of a certain thickness is disposed on the side of the metal line layer 120 away from the substrate 110, the light-shielding layer 140 can be disposed at the same height as part of the pixel layer 130 without obscuring the pixel layer 130. Therefore, it can completely obscure the metal line layer 120 without obscuring the corresponding pixel layer 130 or pixel area, thereby increasing the aperture ratio. Furthermore, by providing the light-shielding layer 140 on the array substrate 100, the relative position of the light-shielding layer 140 and the metal circuit layer 120 is always fixed. No matter how the array substrate 100 or the other substrate opposite to the array substrate 100 moves, the light-shielding effect of the light-shielding layer 140 on the metal circuit will not be affected, nor will the aperture ratio be affected. This can improve the problem of a small aperture ratio caused by differences in the assembly or by differences in the manufacturing process of the light-shielding layer 140 on the other substrate.

[0029] like Figure 1 As shown, in one example of the present invention, H3 is equal to H1.

[0030] This configuration not only improves process efficiency but also makes the array substrate 100 relatively flat, which is beneficial for the subsequent coating process of the transparent electrode layer.

[0031] Specifically, in order to achieve H3 equal to H1, that is, to achieve the effect that the distance from the surface of the light-shielding layer 140 away from the substrate 110 to the substrate 110 is equal to the distance from the surface of the pixel unit 131 away from the substrate 110 to the substrate 110, a larger amount of light-shielding layer 140 can be coated on the pixel unit 131. Due to the advection effect, the light-shielding layer 140 will flow into the groove between two adjacent pixel units 131 and the edge of the pixel layer 130, and is located on the side of the metal circuit layer 120 away from the substrate 110. At this time, the light-shielding layer 140 is in the state of shielding the pixel layer 130. Then, the light-shielding layer 140 is etched all over by dry etching process or other etching process until the pixel layer 130 is exposed. At this time, the surface of the light-shielding layer 140 away from the substrate 110 is flush with the surface of the pixel unit 131 away from the substrate 110. Of course, in other examples, light-shielding material can also be injected individually into the trenches of every two adjacent pixel units 131 until the injection height of the light-shielding material is flush with the surface of the pixel unit 131 facing away from the substrate 110. Any manufacturing process that can achieve a distance from the surface of the light-shielding layer 140 facing away from the substrate 110 to the substrate 110 equal to the distance from the surface of the pixel unit 131 facing away from the substrate 110 to the substrate 110 is within the protection scope of this invention.

[0032] like Figure 2 As shown, in one example of the present invention, the metal circuit layer 120 includes multiple scan lines 121, multiple data lines 122, and multiple common electrodes 123. The scan lines 121 and data lines 122 intersect and are arranged to jointly define multiple first regions. The common electrodes 123 are disposed in the first regions and are provided with gaps between them and the scan lines 121 and data lines 122. The common electrodes 123 enclose and form a pixel region, and the projection of the edge of the pixel unit 131 falls on the common electrodes 123.

[0033] It should be noted that if the gap between the common electrode 123 and the scan line 121, or the gap between the common electrode 123 and the data line 122, is not shielded, there is a risk of light leakage. In this example, by projecting the edge of the pixel unit 131 onto the common electrode 123, a portion of the projection of the light-shielding layer 140 can fall into the gap between the common electrode 123 and the scan line 121, and the gap between the common electrode 123 and the data line 122. Therefore, the light-shielding layer 140 can shield the gap between the common electrode 123 and the scan line 121, and the gap between the common electrode 123 and the data line 122, thereby reducing the risk of light leakage.

[0034] like Figure 1 or Figure 3 As shown, in one example of the present invention, the array substrate 100 further includes a protective layer 150, which is disposed between the metal circuit layer 120 and the light-shielding layer 140.

[0035] By placing the protective layer 150 between the metal circuit layer 120 and the light-shielding layer 140, the protective layer 150 provides good protection for the metal circuit layer 120, reduces damage to the metal circuit from other layers, and lowers the risk of short circuits between the metal circuit layer 120 and other layers.

[0036] like Figure 3 As shown, in one example of the present invention, the array substrate 100 further includes a planarization layer 160, which is disposed on the side of the light-shielding layer 140 away from the substrate 110 and covers the light-shielding layer 140 and the pixel unit 131.

[0037] It is understandable that after the light-shielding layer 140 is coated or etched, the side of the light-shielding layer 140 facing away from the substrate 110 may become uneven. By providing a planarization layer 160 on the side of the light-shielding layer 140 facing away from the substrate 110, and by covering the light-shielding layer 140 and the pixel unit 131, the surface of the array substrate 100 becomes flatter, which is beneficial for the subsequent coating of the transparent electrode layer.

[0038] Example 2: This invention also proposes a method for fabricating an array substrate 100. The specific structure of the array substrate 100 is as described in the above embodiments. Since the fabrication method of this array substrate 100 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be repeated here. Please refer to the references. Figures 4 to 6 The method for fabricating the array substrate 100 in this invention includes: S10: Prepare a substrate 110 and coat a metal line layer 120 on the substrate 110, wherein the metal line layer 120 defines a plurality of pixel regions; S20: A pixel layer 130 is coated on one side of the substrate 110, and the pixel layer 130 is etched so that the pixel layer 130 covers the pixel area, and the distance from the surface of the pixel layer 130 away from the substrate 110 to the substrate 110 is greater than the distance from the surface of the metal line layer 120 away from the substrate 110 to the substrate 110. S30: A light-shielding layer 140 is coated on the side of the metal circuit layer 120 away from the substrate 110, wherein the distance from the surface of the light-shielding layer 140 away from the substrate 110 to the substrate 110 is not greater than the distance from the surface of the pixel layer 130 away from the substrate 110 to the substrate 110.

[0039] When fabricating the metal circuit layer 120, copper or aluminum can be used. The metal circuit layer 120 may include scan lines 121, data lines 122, and a common electrode 123. The scan lines 121 and data lines 122 intersect, and can be perpendicular, at an acute angle, or at an obtuse angle. Multiple scan lines 121 are provided, arranged in parallel; multiple data lines 122 are also provided, arranged in parallel. The multiple data lines 122 and multiple scan lines 121 together define multiple cutout areas. These cutout areas can serve as pixel areas for pixel units 131. The common electrode 123 is arranged around the cutout areas, and gaps are formed between the scan lines 121 and data lines 122 and the common electrode 123.

[0040] When the pixel layer 130 is coated, the pixel layer 130 can flow into the pixel area and cover the metal circuit layer 120. Then, the pixel layer 130 is etched to expose the metal circuit layer 120. The pixel layer 130 includes a plurality of pixel units 131. When the pixel units 131 are disposed in a pixel area, one pixel unit 131 can be disposed in a pixel area, or multiple pixel units 131 can be disposed in a pixel area. The plurality of pixel units 131 may have at least two different colors. For example, the plurality of pixel units 131 may include red pixel sub-units, green pixel sub-units, and blue pixel sub-units. One red pixel sub-unit, one green pixel sub-unit, and one blue pixel sub-unit form a pixel group. The pixel layer 130 may include one or more such pixel groups. Of course, in other examples, the pixel group may also include yellow pixel sub-units and / or white pixel sub-units. Two adjacent pixel groups are defined as the first pixel group and the second pixel group. The color of the pixel unit 131 in the first pixel group that is close to the second pixel group can be the same as or different from the color of the pixel unit 131 in the second pixel group that is close to the first pixel group.

[0041] The distance from the surface of pixel unit 131 away from substrate 110 to substrate 110 is H1, and the distance from the surface of metal line layer 120 away from substrate 110 to substrate 110 is H2, where H1 is greater than H2. For example, the difference between H1 and H2 can be 1μm, 2μm, or 3μm, which makes the terrain of pixel unit 131 higher than that of metal line layer 120. Therefore, when a light-shielding layer 140 of a certain thickness is subsequently set, the light-shielding layer 140 can completely cover the metal line layer 120 and is less likely to cross the surface of pixel layer 130 away from substrate 110. That is, it is less likely to block the surface of pixel layer 130 away from substrate 110. Therefore, the risk of light-shielding layer 140 covering pixel area can be reduced, thereby improving aperture ratio. Specifically, when coating the light-shielding layer 140, the light-shielding layer 140 can first cover the metal circuit layer 120 and the pixel layer 130, and then the pixel layer 130 can be etched; or the light-shielding layer 140 can be directly coated into two adjacent pixel units 131, as long as the distance from the surface of the final light-shielding layer 140 away from the substrate 110 to the substrate 110 is not greater than the distance from the surface of the pixel layer 130 away from the substrate 110 to the substrate 110.

[0042] In this invention, a metal circuit layer 120 and a pixel layer 130 are sequentially coated on one side of a substrate 110, with the pixel layer 130 covering the pixel area. The distance from the surface of the pixel layer 130 away from the substrate 110 is greater than the distance from the surface of the metal circuit layer 120 away from the substrate 110, thus creating a terrain difference between the pixel layer 130 and the metal circuit layer 120. Then, when a light-shielding layer 140 of a certain thickness is provided on the side of the metal circuit layer 120 away from the substrate 110, the distance from the surface of the light-shielding layer 140 away from the substrate 110 is not greater than the distance from the surface of the pixel layer 130 away from the substrate 110. Therefore, the light-shielding layer 140 can be set at the same height as part of the pixel layer 130 without obscuring the pixel layer 130. Thus, while completely obscuring the metal circuit layer 120, it does not obscure the corresponding pixel layer 130 or pixel area, thereby increasing the aperture ratio. Furthermore, by providing the light-shielding layer 140 on the array substrate 100, the relative position of the light-shielding layer 140 and the metal circuit layer 120 is always fixed. No matter how the array substrate 100 or the other substrate opposite to the array substrate 100 moves, the light-shielding effect of the light-shielding layer 140 on the metal circuit will not be affected, nor will the aperture ratio be affected. This can improve the problem of a small aperture ratio caused by differences in the assembly or by differences in the manufacturing process of the light-shielding layer 140 on the other substrate.

[0043] Please refer to the reference. Figures 4 to 7In one example of the present invention, step S30: coating a light-shielding layer 140 on the side of the metal circuit layer 120 facing away from the substrate 110, wherein the distance from the surface of the light-shielding layer 140 facing away from the substrate 110 to the substrate 110 is not greater than the distance from the surface of the pixel layer 130 facing away from the substrate 110 to the substrate 110 includes: S31: A light-shielding layer 140 is coated on both the side of the metal circuit layer 120 facing away from the substrate 110 and the side of the pixel layer 130 facing away from the substrate 110. S32: Etch the entire surface of the light-shielding layer 140; S33: If the pixel layer 130 is detected to be in an exposed state, stop etching the light-shielding layer 140 so that the distance from the surface of the light-shielding layer 140 away from the substrate 110 to the substrate 110 is equal to the distance from the surface of the pixel layer 130 away from the substrate 110 to the substrate 110.

[0044] By coating the light-shielding layer 140 on both the side of the metal circuit layer 120 facing away from the substrate 110 and the side of the pixel layer 130 facing away from the substrate 110, the initial state of the light-shielding layer 140 is such that it masks both the metal circuit layer 120 and the pixel layer 130. This configuration allows the light-shielding layer 140 to achieve a full-coverage effect, eliminating the need to detect the coating position of the light-shielding layer 140 and thus simplifying the coating process. Understandably, after the light-shielding layer 140 masks both the metal circuit layer 120 and the pixel layer 130, it still needs to be etched to expose the pixel layer 130, ensuring that light can pass through the pixel area. In this example, the light-shielding layer 140 is etched across its entire surface until the pixel layer 130 is detected as exposed, at which point the etching stops. This eliminates the need for a photomask during the etching process, simplifying the etching procedure. Specifically, during the etching of the entire light-shielding layer 140, the shaped light-shielding layer 140 can be etched using dry etching or cutting. Furthermore, by etching the entire light-shielding layer 140 until the pixel layer 130 is exposed and then stopping the etching, the surface of the light-shielding layer 140 facing away from the substrate 110 is made flush with the surface of the pixel layer 130 facing away from the substrate 110. This reduces the risk of uneven terrain on the array substrate 100 and facilitates subsequent coating of transparent electrode layers. Specifically, the exposure of the pixel layer 130 can be determined by illuminating one side of the array substrate 100 and observing light emanating from the pixel area on the other side of the array substrate 100. Alternatively, during dry etching, the exposure of the pixel layer 130 can be determined by the concentration of the generated reactive gas. For example, when the pixel layer 130 is exposed, the concentration of the reactive gas generated during the etching of the light-shielding layer 140 decreases, resulting in a lower etching rate.

[0045] By coating a light-shielding layer 140 on both the side of the metal circuit layer 120 facing away from the substrate 110 and the side of the pixel layer 130 facing away from the substrate 110, and then etching the light-shielding layer 140 across its entire surface, and stopping the etching of the light-shielding layer 140 when the pixel layer 130 is detected to be exposed, the use of a photomask during the etching of the light-shielding layer 140 can be reduced, thereby simplifying the manufacturing process and improving process efficiency and accuracy.

[0046] like Figure 8 As shown, in one example of the present invention, step S33: detecting that the pixel layer 130 is in an exposed state, stopping the etching of the light-shielding layer 140, so that the distance from the surface of the light-shielding layer 140 away from the substrate 110 to the substrate 110 is equal to the distance from the surface of the pixel layer 130 away from the substrate 110 to the substrate 110, includes: S331: Detect the concentration of reactant gases during the dry etching process; S332: Compare the concentration of the reactant gas with a preset concentration; S333: The concentration of the reacting gas is detected to be lower than the preset concentration; S334: Determine that the pixel layer 130 is in a visible state; S335: Stop etching the light-shielding layer 140 such that the distance from the surface of the light-shielding layer 140 away from the substrate 110 to the substrate 110 is equal to the distance from the surface of the pixel layer 130 away from the substrate 110 to the substrate 110.

[0047] It is understandable that a chemical reaction occurs during the dry etching of the light-shielding layer 140, generating reactive gases. During the dry etching process, a higher concentration of reactive gases indicates a larger projected area of ​​the light-shielding layer 140 on the substrate 110, meaning the pixel layer 130 is not yet exposed. Conversely, a lower concentration indicates a smaller projected area of ​​the light-shielding layer 140 on the substrate 110, meaning the pixel layer 130 is already exposed. Therefore, by detecting the concentration of reactive gases during the dry etching process and comparing it to a preset concentration, when the concentration is detected to be lower than the preset concentration, it can be determined that the pixel layer 130 is exposed, and the etching of the light-shielding layer 140 can be stopped. This method is simpler and more convenient, requires no additional detection equipment, and has lower costs.

[0048] like Figure 9 As shown, in one example of the present invention, step S30, which involves coating a light-shielding layer 140 on the side of the metal circuit layer 120 facing away from the substrate 110, wherein the distance from the surface of the light-shielding layer 140 facing away from the substrate 110 to the substrate 110 is not greater than the distance from the surface of the pixel layer 130 facing away from the substrate 110 to the substrate 110, further includes: S40: A planarization layer 160 is coated on the side of the light-shielding layer 140 opposite to the substrate 110.

[0049] By coating a planarization layer 160 on the side of the light-shielding layer 140 away from the substrate 110, the side of the light-shielding layer 140 away from the substrate 110 can be planarized, which is beneficial for subsequent coating of other structures such as transparent electrode layers.

[0050] Example 3: The present invention also proposes a display panel 10, such as Figure 10As shown, the display panel 10 includes a counter substrate 200, a liquid crystal 300, and an array substrate 100. The specific structure of the array substrate 100 is as described in the above embodiments. Since this display panel 10 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The counter substrate 200 is disposed on the side of the light-shielding layer 140 away from the substrate 110, and a gap is provided between the counter substrate 200 and the light-shielding layer 140. The liquid crystal 300 is disposed in the gap.

[0051] The liquid crystal 300 is disposed between the opposing substrate 200 and the array substrate 100. When there is a voltage difference between the array substrate 100 and the opposing substrate 200, the liquid crystal 300 deflects at a certain angle, thereby enabling light to pass through the opposing substrate 200 so that the user can view the image. Since light leakage may occur at the positions corresponding to the data line 122 and the scan line 121, the light-blocking layer 140 can cover the scan line 121 and the data line 122 to achieve a comprehensive light leakage prevention effect.

[0052] Example 4: The present invention also proposes a display device, such as Figure 11 As shown, the display device includes a backlight module 20 and a display panel 10. The specific structure of the display panel 10 is as described in the above embodiments. Since this display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The backlight module 20 is disposed on the side of the substrate 110 away from the metal circuit layer 120.

[0053] The backlight module 20 is used to provide a light source. The light emitted by the backlight module 20 is irradiated by the array substrate 100 onto the opposing substrate 200 so that the user can view the display image from the light-emitting surface of the opposing substrate 200, that is, the surface of the screen facing the user.

[0054] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An array substrate, comprising a substrate and a metal line layer disposed on one side of the substrate, the metal line layer defining a plurality of pixel regions; characterized in that, The array substrate further includes: A pixel layer, comprising a plurality of pixel units disposed within a pixel region, wherein the distance from the surface of the pixel unit away from the substrate to the substrate is defined as H1, and the distance from the surface of the metal circuit layer away from the substrate to the substrate is defined as H2, wherein H1 is greater than H2; and A light-shielding layer is provided, which covers the side of the metal circuit layer away from the substrate and is connected to the pixel unit. The distance from the surface of the light-shielding layer away from the substrate to the substrate is defined as H3, where H3 is not greater than H1.

2. The array substrate as described in claim 1, characterized in that, H3 is equal to H1.

3. The array substrate as described in claim 1, characterized in that, The metal circuit layer includes multiple scan lines, multiple data lines, and multiple common electrodes. The scan lines and data lines intersect and define multiple first regions. The common electrodes are located within the first regions and have gaps between them and the scan lines and data lines. The common electrodes enclose and form the pixel region. The projection of the edge of the pixel unit falls on the common electrodes.

4. The array substrate as described in any one of claims 1 to 3, characterized in that, The array substrate further includes a protective layer, which is disposed between the metal circuit layer and the light-shielding layer; And / or, the array substrate further includes a planarization layer disposed on the side of the light-shielding layer opposite to the substrate, and covering the light-shielding layer and the pixel unit.

5. A method for fabricating an array substrate according to any one of claims 1 to 4, characterized in that, The method for fabricating the array substrate includes: A substrate is prepared, and a metal circuit layer is coated on the substrate, the metal circuit layer defining multiple pixel regions; A pixel layer is coated on one side of the substrate and the pixel layer is etched so that the pixel layer covers the pixel area, and the distance from the surface of the pixel layer away from the substrate to the substrate is greater than the distance from the surface of the metal circuit layer away from the substrate to the substrate. A light-shielding layer is coated on the side of the metal circuit layer facing away from the substrate, wherein the distance from the surface of the light-shielding layer facing away from the substrate to the substrate is not greater than the distance from the surface of the pixel layer facing away from the substrate to the substrate.

6. The method for fabricating an array substrate as described in claim 5, characterized in that, The step of coating a light-shielding layer on the side of the metal circuit layer facing away from the substrate, wherein the distance from the surface of the light-shielding layer facing away from the substrate to the substrate is not greater than the distance from the surface of the pixel layer facing away from the substrate to the substrate, includes: A light-shielding layer is coated on both the side of the metal circuit layer facing away from the substrate and the side of the pixel layer facing away from the substrate. The entire surface of the light-shielding layer is etched. If the pixel layer is detected to be in an exposed state, the etching of the light-shielding layer is stopped, so that the distance from the surface of the light-shielding layer away from the substrate to the substrate is equal to the distance from the surface of the pixel layer away from the substrate to the substrate.

7. The method for fabricating an array substrate as described in claim 6, characterized in that, The step of detecting that the pixel layer is in an exposed state and stopping the etching of the light-shielding layer so that the distance from the surface of the light-shielding layer away from the substrate to the substrate is equal to the distance from the surface of the pixel layer away from the substrate to the substrate includes: Detect the concentration of reactant gases during the dry etching process; Compare the concentration of the reacting gas with a preset concentration; The concentration of the reacting gas was detected to be lower than the preset concentration; The pixel layer is determined to be in a visible state; Stop etching the light-shielding layer so that the distance from the surface of the light-shielding layer away from the substrate to the substrate is equal to the distance from the surface of the pixel layer away from the substrate to the substrate.

8. The method for fabricating an array substrate as described in claim 5, characterized in that, The step of coating a light-shielding layer on the side of the metal circuit layer facing away from the substrate, wherein the distance from the surface of the light-shielding layer facing away from the substrate to the substrate is not greater than the distance from the surface of the pixel layer facing away from the substrate to the substrate, further includes: A planarization layer is coated on the side of the light-shielding layer opposite to the substrate.

9. A display panel, characterized in that, The system includes a counter substrate, a liquid crystal, and an array substrate as described in any one of claims 1 to 4, wherein the counter substrate is disposed on the side of the light-shielding layer away from the substrate and a gap is provided between the counter substrate and the light-shielding layer, and the liquid crystal is disposed within the gap.

10. A display device, characterized in that, It includes a backlight module and a display panel as described in claim 9, wherein the backlight module is disposed on the side of the substrate opposite to the metal circuit layer.

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