Exposure device, exposure method, and alignment method
By setting linear scales and reference marks in the exposure apparatus, the movement error of the stage is measured and corrected, thus solving the alignment accuracy problem caused by thermal expansion and deformation of the stage and achieving higher precision exposure alignment.
Patent Information
- Application Number
- CN202510294984.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-13
- Filing Date
- 2025-03-13
- Publication Date
- 2026-02-13
AI Technical Summary
In exposure apparatus, the movement error caused by the thermal expansion and deformation of the stage varies with factors such as transport speed, number of stops, and dwell time, affecting alignment accuracy. Existing technologies struggle to effectively correct these errors.
By setting a linear scale and reference marks on the stage, the error in the amount of movement is measured, and the exposure position is corrected using the shooting data. A pair of stage reference marks and exposure position correction parts are used for precise alignment to correct the movement error of the stage.
It achieves proper alignment considering errors during stage movement, improves the accuracy of exposure position and alignment, and reduces the offset effect caused by thermal expansion and deformation.
Smart Images

Figure CN121522962A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to alignment performed in an exposure apparatus or the like that forms a pattern on a substrate. BACKGROUND
[0002] In an exposure apparatus or the like, in order to perform alignment of a work (hereinafter referred to as a workpiece) such as a substrate with high precision, a camera for alignment is used to capture an alignment mark provided on the substrate, and a deviation of a position of the captured alignment mark from a design position of the mark is detected. Then, position adjustment of a stage on which the substrate is mounted, modification of an exposure position, correction processing of pattern data, and the like are performed.
[0003] On the other hand, a deviation (shift) of the exposure position occurs due to a change in ambient temperature of a conveyance system including the stage, heat generation caused by motor driving, and the like. In order to also perform appropriate alignment adjustment for such a deviation of the exposure position, an alignment adjustment based on temperature detection is known (see Patent Literature 1).
[0004] Here, a difference between a temperature measured at the start of drawing and a temperature at the time of correction of the exposure position (drawing start position) is found, and a misalignment of the exposure position is calculated based on the temperature difference and based on a predetermined correlation formula.
[0005] In addition, an alignment method in which a reference mark is provided independently of a correction scale is known (see Patent Literature 2). Here, a reference plate on which a reference mark is provided is arranged in parallel with the correction scale, and a misalignment of the correction scale is detected by capturing the reference mark with a camera for capturing the reference mark, that is, a misalignment that occurs due to thermal expansion, deformation, and the like of a conveyance system including the stage.
[0006] Prior art documents
[0007] Patent documents
[0008] Patent Literature 1: Japanese Patent Application Publication No. 2014-197136
[0009] Patent Literature 2: Japanese Patent Application Publication No. 2018-004860 SUMMARY
[0010] PROBLEMS TO BE SOLVED BY THE INVENTION
[0011] The heat generated by the stage (transport system) that transports the substrate not only causes misalignment due to thermal expansion and deformation of the entire transport system, but also causes errors in the amount of movement of the stage due to thermal deformation of the linear scale and the like. The error in the linearity of the amount of movement of the stage changes with the conditions for the operation of the stage, such as the transport speed, the number of stops, the stop time, and the passage of time for the operation of the stage. The error also changes depending on the method of movement of the stage corresponding to the shape of the substrate, the position of the alignment mark, and the like.
[0012] Thus, in an exposure apparatus or the like that includes a stage, it is required to perform appropriate alignment taking into account the error that occurs with the movement of the stage.
[0013] Solution to the problem
[0014] An exposure apparatus according to an aspect of the present application includes a stage that moves in a scan direction with respect to an exposure portion and has a table on which a substrate is placed. The stage includes, for example, a linear scale, and the stage moves a predetermined distance in the scan direction while measuring the amount of movement using the linear scale. The exposure portion includes, for example, an array of light modulation elements. By moving the substrate placed on the table in the scan direction, it is possible to scan pattern light from the array of light modulation elements with respect to the substrate W.
[0015] The exposure apparatus according to the present application includes a measurement portion that measures the error in the amount of movement of the stage in the scan direction corresponding to the movement of the stage. Here, the "error in the amount of movement" indicates the difference between the actual amount of movement when the stage is moved and the predetermined (designated) amount of movement. As the error in the amount of movement, there is included an error in which the amount of deviation increases linearly in the scan direction.
[0016] As a structure that measures corresponding to the movement of the stage, by actually measuring the position of the stage (e.g., the start position and the stop position) during the period from the start to the stop of the movement of the stage, it is possible to measure the error in the amount of movement.
[0017] The measurement portion can measure the error in the amount of movement by imaging a mark. For example, a plurality of marks that move in conjunction with the stage are provided corresponding to the distance interval from the start position to the stop position of the movement of the stage, and the error in the amount of movement can be measured from the positional relationship between the marks imaged at predetermined positions.
[0018] For example, two marks are arranged in the same line in the scan direction, and the marks are imaged in order from a predetermined position corresponding to the movement of the stage, and thus it is possible to measure the error in the amount of movement. The other mark is imaged at the same position with reference to the center position of the imaging region of the two-dimensional image of one mark, and the error in the amount of movement can be found from the deviation of the mark on the image with respect to the center position.
[0019] An exposure apparatus according to another aspect of the present application includes: a stage which moves along a scanning direction with respect to an exposure portion and has a table on which a substrate is placed; at least one pair of stage reference marks which moves with the stage and which are opposite to each other along the scanning direction; a photographing portion which photographs the at least one pair of stage reference marks in correspondence with movement of the stage along the scanning direction by a predetermined distance; and an exposure position correction portion which corrects an exposure position of the substrate based on mark position information obtained from the photographing data of the at least one pair of stage reference marks.
[0020] For example, in a case where an error in the amount of movement is treated as a linear error, the exposure position correction portion calculates a correction coefficient for correcting the exposure position of the substrate based on an error in the amount of movement of the stage obtained from the mark position information. The correction coefficient can be calculated as a value corresponding to the degree of expansion or contraction in the scanning direction. The correction amount differs depending on the exposure position (distance from the exposure start position) and can be calculated as a proportional value. Thus, the exposure data can be corrected based on the calculated correction coefficient and the exposure position information (hereinafter referred to as a ruler correction process).
[0021] The at least one pair of stage reference marks can be configured to be opposite to each other with the substrate mounted on the stage interposed therebetween. In addition, one of the at least one pair of stage reference marks can be configured as a reference mark for detecting a deviation in the position of a camera of the photographing portion.
[0022] For example, the exposure apparatus can be configured such that a pair of correction rulers which move in conjunction with the stage are disposed with the table interposed therebetween, and the reference marks are arranged at predetermined intervals in each of the pair of correction rulers. In addition, the photographing portion can sequentially photograph the at least one pair of stage reference marks in correspondence with the direction of movement of the stage at the time of the exposure operation.
[0023] An exposure method according to still another aspect of the present application includes: arranging, with respect to a stage, at least one pair of stage reference marks which move with the stage and which are opposite to each other along a scanning direction, the stage moving along the scanning direction with respect to an exposure portion and having a table on which a substrate is placed; photographing the at least one pair of stage reference marks in correspondence with movement of the stage along the scanning direction by a predetermined distance; correcting an exposure position of the substrate based on mark position information obtained from the photographing data of the at least one pair of stage reference marks; and performing an exposure operation based on the corrected exposure position.
[0024] In the alignment method as another aspect of the present application, at least one pair of stage reference marks which move together with a stage and are opposite in a scanning direction are arranged with respect to the stage which moves in the scanning direction with respect to an exposure portion and has a table on which a substrate is placed, the at least one pair of stage reference marks are imaged in correspondence with movement of the stage by a predetermined distance in the scanning direction, and alignment of the substrate is performed based on mark position information obtained from the imaging data of the at least one pair of stage reference marks. For example, during movement of the stage in the scanning direction, imaging of one of the pair of stage reference marks, imaging of a plurality of alignment marks on one line of the substrate in the scanning direction, and imaging of the other of the pair of stage reference marks are sequentially performed.
[0025] Effects of Invention
[0026] According to the present application, in an exposure apparatus or the like provided with a stage, appropriate alignment can be performed taking into account linear errors which occur with movement of the stage. BRIEF DESCRIPTION OF DRAWINGS
[0027] Figure 1 is a schematic side view of an exposure apparatus as the present embodiment.
[0028] Figure 2 is a schematic plan view of the exposure apparatus as viewed from above.
[0029] Figure 3 is a view showing a configuration structure of a correction scale and a table.
[0030] Figure 4 is a block diagram of the exposure apparatus.
[0031] Figure 5 is a view showing a shift which occurs with movement of a stage.
[0032] Figure 6 is a view showing a flow of alignment including a correction process.
[0033] Figure 7 is a view showing a difference in imaging position of a reference mark which occurs with movement of a stage.
[0034] BRIEF DESCRIPTION OF DRAWINGS
[0035] 10, exposure apparatus; 15, stand; 20, exposure head; 50, stage; 52, table; 54, X stage moving mechanism; 62, correction scale; 64, correction scale; 80, alignment camera; CM, reference mark. DETAILED DESCRIPTION
[0036] Embodiments of the present application will be described below with reference to the accompanying drawings. Embodiments of the present application will be described below with reference to the accompanying drawings.
[0037] Figure 1 is a side view of an exposure apparatus as a whole of the embodiment. Figure 2 is a schematic plan view of the exposure apparatus from above.
[0038] The exposure apparatus 10 is provided with a stage 15 and a support body 40 provided on an upper surface 15S of the stage 15. The support body 40 includes a rectangular support table 42 and leg portions 43A, 43B, 44A, 44B provided at the four corners of the support table 42, and the leg portions 43A, 43B, 44A, 44B are fixed to the stage 15. An exposure head 20 and a light source portion 30 are provided on an upper surface 42S of the support table 42. Here, the exposure head 20 is equipped with a DMD (Digital Micro-mirror Device) in which micro-mirrors are two-dimensionally arranged.
[0039] On the upper surface 15S of the stage 15, a pair of guide rails 60A, 60B are arranged in parallel with each other at a predetermined interval along the stage length direction, extending from one end of the support table 42 to the other end of the support table 42 through the leg portions 43A, 43B and between the leg portions 44A, 44B. A stage 50 that is movable along the guide rails 60A, 60B is provided on the guide rails 60A, 60B.
[0040] The stage 50 has a work table 52 on which a substrate W is placed, and is provided with a stage moving mechanism 55 that supports the work table 52 from below and moves the work table 52. The stage moving mechanism 55 is provided with an X-stage moving mechanism 54 that moves the stage 50 along the guide rails 60A, 60B and a Y-stage moving mechanism 56 that moves the stage 50 in a direction perpendicular to the guide rails 60A, 60B.
[0041] An X-Y coordinate system with the apparatus as a reference is defined on the upper surface 15S of the stage 15, the X direction along the guide rails 60A, 60B is defined as the main scanning direction, and the Y direction perpendicular to the X direction is defined as the sub-scanning direction. In addition, the vertical (plumb) direction of the X-Y coordinate system is defined as the Z direction. A linear scale 58 for detecting the X direction position of the stage 50 is provided on the stage 15 along the guide rails 60A, 60B. The rectangular work table 52 is provided on the stage 50 in such a manner that the length direction end surface 52L is parallel to the X direction and the end surface 52T perpendicular to the end surface 52L is parallel to the Y direction.
[0042] On the side of the leg portions 44A, 44B of the support body 40, that is, the center side, a plate (hereinafter referred to as a camera mount) 45 extending in the Y direction is fixed to the side surface of the support body 40 and the leg portions 44A, 44B. Further, on the side of the camera mount 45 opposite the support body 40, a guide mechanism 46 that moves the alignment camera 80 in the Y direction is fitted. The guide mechanism 46 is constituted by, for example, a ball screw mechanism, and a camera drive section (not shown) provided with a motor or the like moves the alignment camera 80. The alignment camera 80 is constituted by two alignment cameras 80A, 80B separated by a predetermined interval.
[0043] As shown in Figure 2 , a plurality of alignment marks AM are regularly arranged at predetermined intervals on a substrate W placed at a predetermined position on the stage 52. The alignment camera 80 can capture each alignment mark AM by movement of the stage 50 (stage 52) in the X direction and movement of the alignment camera 80 itself in the Y direction.
[0044] On the inner side (-X direction) of the stage 50, a support table 92 is provided vertically with respect to the X stage movement mechanism 54, and a scale (hereinafter referred to as a correction scale) 62 for camera position correction is provided on the support table 92. A plurality of reference marks CM are arranged at predetermined intervals along the end surface 52T of the stage 52, that is, the Y direction on the correction scale 62. The alignment camera 80 can capture each reference mark CM by movement of the stage 50 and movement of the alignment camera 80 itself. The shape of the reference mark CM is arbitrary and can be circular, cross-shaped, or the like. In Figure 2 , a circular reference mark CM is illustrated.
[0045] On the front side (+X direction side) of the X stage movement mechanism 54, a support table 94 is provided across the stage 52, and a correction scale 64 is supported by the support table 94. Like the correction scale 62, reference marks CM are regularly arranged at predetermined intervals along the Y direction on the correction scale 64. The correction scales 62, 64 move together with the stage 50 during movement of the stage 50 in the X direction. On the other hand, during movement of the stage 50 in the Y direction, the correction scales 62, 64 do not move. The correction scales 62, 64 are both at the same height, and the reference marks CM are all on the same plane.
[0046] Near the correction scale 62, a rectangular plate (hereinafter referred to as a reference plate) provided with one reference mark (not shown here) is equipped on the X stage movement mechanism 54. The reference mark provided on the reference plate is arranged on the same line as the reference marks CM of the correction scale 62 and is at the same height.
[0047] In addition, a dedicated reference camera (not shown) different from the alignment camera 80 is fixed to the camera base 45 at a position capable of capturing the reference mark. Furthermore, the structure of the reference plate and the reference camera is described in the prior art document 2, and detailed description is omitted.
[0048] In the exposure operation, the substrate W is mounted on the stage 52, and the stage 50 is continuously moved at a certain speed along the X direction. Simultaneously with the movement of the stage 52, the projection region (exposure region) of the pattern light projected from the exposure head 20 toward the substrate W relatively moves along the X direction, thereby forming a pattern on the substrate W. If the scanning on one scan band is completed, the stage 52 is moved along the Y direction, and the scanning on the next scan band is performed.
[0049] Figure 3 is a view showing the configuration structure of the correction scales 62, 64 and the stage 52.
[0050] The correction scales 62, 64 are both made of glass, and a chromium film in which reference marks CM of the same size and the same shape are drawn is formed on the surface thereof. The arrangement pitch of the reference marks CM is determined in accordance with the size of the field of view frame F of the alignment camera 80 or the like.
[0051] The reference marks CM are determined to be of a size and a shape in which the mark position coordinates can be accurately found when captured by the alignment camera 80. The image of the reference marks CM obtained by the capturing becomes an image of the same size for both the correction scales 62, 64.
[0052] The reference marks CM of the correction scale 64 are arranged in such a manner that the Y coordinates thereof are the same as those of the reference marks CM of the correction scale 62. That is, each of the reference marks CM of the correction scale 62 becomes a configuration structure in which the facing surface thereof is faced with the opposite reference mark CM of the correction scale 64 along the X direction.
[0053] With respect to the alignment performed before the exposure operation, the alignment camera 80 is moved to capture the reference marks CM of the correction scale 62. In addition, the stage 50 is continuously moved at a predetermined certain speed between the correction scale 62 and the correction scale 64, and the alignment camera 80 captures predetermined reference marks CM of the correction scales 62, 64 which face each other.
[0054] Figure 4 is a block diagram of the exposure apparatus.
[0055] The control section 38 controls the exposure operation of the exposure apparatus 10, the alignment adjustment, the illumination, and the like of the entire exposure apparatus. If the light source 32 is turned on by the light source control section 31, the illumination light is incident on the DMD (Digital Micromirror Device) 24 via the optical system 23.
[0056] The exposure control section 34 converts the pattern data (vector data) transmitted from the work station into raster data, and transmits the raster data (exposure data) to the DMD drive section 22. The DMD drive section 22 performs on / off control of each micromirror of the DMD 24 based on the raster data, to project the pattern light corresponding to the exposure position. The light reflected by the DMD 24 is imaged as the pattern light on the surface of the substrate W by the projection optical system 25.
[0057] The stage drive section (moving mechanism) 55 provided with a motor or the like drives the X stage moving mechanism 54 and the Y stage moving mechanism 56 to move the stage 50, i.e., the work table 52 in the X and Y directions. Figure 1 The position detector 59 including a linear scale 58 (refer to FIG. 2) detects the position coordinates of the work table 52 with respect to the gantry 15 (i.e., the exposure apparatus main body as one configuration including the support body 40). Figure 1
[0058] The camera drive section 82 drives and controls the alignment cameras 80, and moves the alignment cameras 80 in accordance with the arrangement row of the alignment marks AM of the substrate W at the time of alignment adjustment. The image processing section 83 detects the positions of the alignment marks AM based on the imaging signals output from the alignment cameras 80A and 80B.
[0059] Specifically, the deviation of the alignment mark center position with respect to the center of the field of view of the alignment cameras 80A and 80B is detected. The alignment control section 35 controls the exposure control section 34 based on the transmitted position information, and corrects the exposure data (raster data) to compensate for the deformation of the substrate or the like.
[0060] In addition, in the case of correcting the deviation of the camera position, the camera drive section 82 drives and controls the alignment cameras 80 to image the reference marks CM of the correction scale 62. The image processing section 83 detects the misalignment amount of the reference marks CM with respect to the center of the field of view, and the correction section 37 calculates the correction amount based on the camera misalignment amount. The alignment control section 35 controls the exposure control section 34 in accordance with the calculated correction amount, and adds the calculated correction amount to the above-mentioned exposure data.
[0061] Furthermore, in order to detect the error in the main scanning direction (X direction) generated in the stage 50, the control section 38 drives and controls the stage moving mechanism 55 to move the stage 50 in the X direction. The alignment control section 35 controls the alignment cameras 80 and the not-illustrated fixed camera to image the reference marks CM of the correction scales 62 and 64 and the reference marks of the not-illustrated reference plate. The correction section 37 controls the exposure control section 34 based on the detected position information of the reference marks CM to perform the correction process on the exposure data.
[0062] Figure 5 is a graph showing the error amount indicating the movement amount of the stage 50.
[0063] The alignment cameras 80A, 80B are mounted to the guide mechanism 46 so as to be movable in the Y direction, and generate mounting errors, assembly errors, and the like. In addition, if the alignment cameras 80A, 80B are reciprocated by the guide mechanism 46, the position of the field center deviates from the designed position due to a positional error of the guide mechanism 46, a change in the camera axis angle, and the like.
[0064] In order to correct the deviation of the field center position, i.e., the misalignment of the alignment cameras 80A, 80B, the position of the reference mark CM is measured, and the misalignment amount of the alignment cameras 80 (i.e., the error of the positional relationship between the alignment cameras 80 and the support table 42 of the fixed exposure head 20) is found from the difference between the actual measurement position and the position of the mark that should originally exist. Such a misalignment amount of the alignment cameras 80 is measured with the position of the correction scale 62 as a reference.
[0065] On the other hand, in the stage 50, heat is generated from the motor drive section of the X stage moving mechanism 54 and the like due to the continuous reciprocating movement, and thermal expansion and deformation occur in the X stage moving mechanism 54, the linear scale 58, and the like. As a result, a shift occurs in the entire stage 50 to the same degree (which does not change depending on the exposure position) as time passes.
[0066] In addition, not only a shift occurs, but also an error occurs between the movement amount (the movement instruction amount to the X stage moving mechanism 54) and the arrival position of the stage 50 (the reading of the linear scale 58) when the stage 50 is moved due to the expansion and contraction of the linear scale 58 and the like. For example, when the stage 50 is moved by several hundred millimeters or so with respect to the gantry 15, the actual movement does not always become the movement corresponding to the movement amount, and a shift of several micrometers occurs at times. Such an error in the movement amount has an influence when a pattern is formed at the micrometer level or sub-micrometer level.
[0067] The error in the movement amount varies depending on the operation conditions of the stage 50, specifically, depending on the movement speed, the number of stops, the rest time, and the like. In addition, the error in the movement amount also varies depending on the manner (movement path) of the movement of the stage 50 due to the arrangement and the number of the alignment marks AM provided on the substrate W.
[0068] The error in the movement amount can be regarded as an error that occurs as a cumulative error, and can be regarded as having a linear characteristic. That is, it can be regarded that the error amount linearly increases along the X direction in accordance with the movement distance from the start point of the self-movement of the stage 50.
[0069] In Figure 5In the present embodiment, the difference in the length of the arrow indicates the difference in the amount of error at the front side end portion, the central portion, and the back side end portion of the substrate W. Along the moving direction of the stage 50, the amount of error of the position of the stage 50 at each exposure position linearly increases. In addition to the error of the moving amount, there is a shift that is generated to the same degree for the entire stage 50 due to heat and the like as time passes, that is, the same amount of error is detected at each exposure position.
[0070] Thus, when performing alignment, it is necessary to correct the following errors at the same time: an error that is generated to the entire stage 50 as time passes, that is, an error whose amount does not change depending on the exposure position (static error), and an error whose amount changes depending on the movement of the stage 50 (dynamic error).
[0071] In the present embodiment, for the static error (shift), the amount of error is detected using the photographing of the reference mark of the reference plate, and for the dynamic error, the reference marks of the pair of correction scales 62, 64 are detected respectively, and the correction coefficient for correcting the linear error is decided. In addition, for the static error, it is also possible to detect misalignment based on temperature measurement as shown in the prior art document 1, and it is also possible to use a method other than this.
[0072] Figure 6 is a diagram showing the flow of alignment including the correction process. Figure 7 is a diagram showing the difference in the photographing position of the reference mark generated depending on the movement of the stage 50.
[0073] The correction process can be performed for each batch, for each substrate, and in addition, the correction process can be performed at predetermined time intervals. In consideration of productivity and the like, it is also possible to shorten the measurement interval in the case of starting operation again from a standstill state, and to lengthen the measurement interval if the temperature reaches a stable state. Although the correction process is performed in conjunction with the correction process of the camera position of the alignment camera 80 here, it is also possible to perform it separately.
[0074] First, the alignment camera 80 is moved to a position (Y coordinate) corresponding to a predetermined alignment mark AM of the substrate W. Here, it is the position corresponding to the alignment mark AM located at the end portion side of the substrate W. Then, the stage 50 is positioned so that the correction scales 62, 64 become the design center position of the field of view of the alignment camera 80 (S101). This position corresponds to a position where the center position of the field of view of the reference camera, which is not shown, theoretically coincides with the center position of the reference mark.
[0075] Next, the reference camera photographs the reference marks of the reference plate, and the stage 50 is moved in the X direction, and the alignment camera 80 photographs the predetermined opposite reference marks CM of the correction scales 62, 64 (S102). First, the reference marks CM of the correction scale 62 on the inner side are photographed, and then the reference marks CM of the correction scale 64 on the front side are photographed.
[0076] The misalignment amount of the reference marks with respect to the center position of the field of view of the reference camera is calculated from the obtained photographing data (S103). This misalignment amount can be considered to correspond to the misalignment amount of the correction scale 62 (reference mark CM) with respect to the exposure coordinate system, and the same degree of (static) error of the stage 50 is found. In addition, the position coordinates of the Y direction of the alignment camera 80 are corrected based on the Y coordinates of the reference marks CM of the correction scale 62 stored in advance and the photographed image of the correction scale 62.
[0077] In addition, in order to detect the error of the movement amount, the deviation of the positions of the two reference marks is detected from the photographing data of the reference marks CM of the correction scales 62, 64 (S103). In the case where the movement amount of the stage 50 is not generated, in the case where the two correction scales 62, 64 are moved by the distance interval Xl along the X direction from the center positions of the two correction scales 62, 64, the photographing positions thereof overlap (become the same position) in the picture vertical direction (x direction) corresponding to the X direction. Figure 7 In the case where the movement amount of the stage 50 is not generated, in the case where the two correction scales 62, 64 are moved by the distance interval Xl along the X direction from the center positions of the two correction scales 62, 64, the photographing positions thereof overlap (become the same position) in the picture vertical direction (x direction) corresponding to the X direction.
[0078] However, the movement amount of the stage 50 is generated, and thus the photographing positions are deviated in the opposite x direction of the reference marks CM. Here, Δx denotes the deviation amount of the photographing positions of the reference marks CM in the frame F. The correction amount of the movement amount of the stage 50 is found based on this Δx.
[0079] The exposure data (lattice data) are subjected to a correction process based on the found misalignment amount of the reference marks of the reference plate and the misalignment amount of the opposite reference marks CM of the correction scales 62, 64 (S104). At this time, the scale correction process is performed with respect to the error of the movement amount of the stage 50.
[0080] Specifically, the correction coefficient of each exposure position is found in correspondence with the distance from the exposure start position based on the misalignment amount of the opposite reference marks CM of the correction scales 62, 64, and the movement distance Xl is multiplied by the correction coefficient, and the scale conversion process corresponding to the position of each exposure data is performed. Thus, the exposure data of the position closer to the inner side are subjected to the scale conversion process based on a larger misalignment amount.
[0081] If the correction processing ends, alignment adjustment is performed by capturing the alignment marks AM of the substrate W with the alignment camera 80. Exposure is performed after the alignment adjustment.
[0082] Further, the shift of the capturing position of the reference mark CM in the Y direction can also be corrected in conjunction with the correction of Δx. For example, if the posture of the stage 50 is shifted due to continuous operation of the stage 50, an error occurs in the Y direction. The amount of shift Δy at this time can also be read from the capturing data of the reference mark CM of the correction scale 62, 64. However, the value of the correction coefficient in the Y direction is in accordance with the amount of error corresponding to the degree of expansion or contraction in the Y direction. By performing shift correction of the drawing data in the Y direction through rotation processing of the data or using the average value, the amount of error can be reduced.
[0083] Instead of performing scale conversion of the exposure data, the exposure position can also be corrected by multiplying the real-time position measurement result of the stage 50 in the main scanning direction at the exposure step by the correction coefficient for compensating for the error. Alternatively, the exposure position can also be corrected by multiplying the movement instruction amount of the stage 50 at the exposure step by the correction coefficient.
[0084] In addition, the reading of the reference mark CM of the correction scale 62, the reading of the plurality of alignment marks AM of the same column of the substrate W, and the reading of the reference mark CM of the correction scale 64 can also be performed during movement of the stage 50 in the scanning direction at one exposure.
[0085] In this case, after the coordinates of all the alignment marks AM on one column are detected, the correction of the camera position coordinates, the calculation of the static error amount of the stage 50, the calculation of the correction coefficient, and the scale correction processing are sequentially performed. By sequentially reading a plurality of marks in one scan, the productivity can be improved.
[0086] As described above, in the exposure apparatus 10 of the present embodiment, a pair of correction scales 62, 64 configured with reference marks CM opposing each other in the X direction (main scanning direction) are provided, and the opposing reference marks CM are captured with the alignment camera 80 while the stage 50 is moving. Based on the amount of misalignment of the reference marks CM in the captured image, the correction amount for the movement amount of the stage 50 is detected. Then, the exposure data is subjected to scale correction processing in accordance with the correction amount that is found.
[0087] By using the alignment camera 80 that detects the alignment marks AM of the substrate W and the correction scale 62 for camera correction, the linear error of the movement amount of the stage 50 can be detected with a simple structure.
[0088] The above-described alignment function can also be provided to an apparatus other than the exposure apparatus, such as a laser processing apparatus, which has a transport system.
Claims
1. An exposure apparatus, characterized in that, The exposure apparatus includes: A stage that moves relative to the exposure section along the scanning direction and has a worktable for placing a substrate; and The measuring unit measures the error of the amount of movement of the stage along the scanning direction in accordance with the movement of the stage.
2. An exposure apparatus, characterized in that, The exposure apparatus includes: A stage that moves relative to the exposure section along the scanning direction and has a worktable for placing a substrate; At least one pair of stage reference marks, which move together with the stage and are opposite each other along the scanning direction; The imaging unit is capable of imaging the at least one pair of stage reference marks in accordance with the movement of the stage a predetermined distance along the scanning direction. as well as An exposure position correction unit corrects the exposure position of the substrate based on marker position information obtained from the imaging data of the at least one pair of stage reference markers.
3. The exposure apparatus according to claim 2, characterized in that, The at least one pair of stage reference marks are sandwiched between each other and are opposite to the substrate mounted on the stage.
4. The exposure apparatus according to claim 2, characterized in that, One of the at least one pair of stage reference marks is configured as a reference mark for detecting deviation of the camera position of the imaging unit.
5. The exposure apparatus according to claim 4, characterized in that, A pair of calibration scales linked to the stage are disposed across the worktable, and the stage reference marks are arranged at predetermined intervals on each of the pair of calibration scales.
6. The exposure apparatus according to claim 2, characterized in that, The imaging unit sequentially images the at least one pair of stage reference marks in accordance with the direction of movement of the stage during the exposure operation.
7. The exposure apparatus according to any one of claims 2 to 6, characterized in that, The exposure position correction unit calculates a correction coefficient based on the error of the movement of the stage obtained from the mark position information, and performs scale correction processing on the exposure data based on the calculated correction coefficient and the exposure position information.
8. An exposure method, characterized in that, In the exposure method, At least one pair of stage reference marks are configured for the stage, which moves together with the stage and is opposite to it along the scanning direction. The stage moves relative to the exposure unit along the scanning direction and has a stage for placing a substrate. The at least one pair of stage reference marks are photographed in accordance with the predetermined distance the stage moves along the scanning direction. The exposure position of the substrate is corrected based on the marker position information obtained from the imaging data of the at least one pair of stage reference markers. The exposure action is performed based on the corrected exposure position.
9. An alignment method, characterized in that, In the alignment method, At least one pair of stage reference marks are configured for the stage, which moves together with the stage and is opposite to it along the scanning direction. The stage moves relative to the exposure unit along the scanning direction and has a stage for placing a substrate. The at least one pair of stage reference marks are photographed in accordance with the predetermined distance the stage moves along the scanning direction. The substrate is aligned based on the marker position information obtained from the imaging data of the at least one pair of stage reference markers.
10. The alignment method according to claim 9, characterized in that, During the movement of the stage along the scanning direction, the following are performed sequentially: one of the pair of stage reference marks is photographed, a plurality of alignment marks located on a column along the scanning direction on the substrate is photographed, and the other of the pair of stage reference marks is photographed.
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