Multi-dimensional temperature sensing and hierarchical dynamic regulation and control system of PC Farm array server

Abstract

The invention provides a multi-dimensional temperature sensing and hierarchical dynamic regulation and control system of a PC Farm array server, and belongs to the technical field of server heat dissipation control, the system comprises a multi-dimensional temperature monitoring module, a thermal field modeling module, an intelligent fan speed regulation module, a hierarchical regulation and control module and the like, and is also provided with a data storage and communication module. The multi-dimensional temperature monitoring module obtains multi-source temperature data of a CPU, a GPU and the like, and the thermal field modeling module constructs a three-dimensional diagram to position an overheating area according to the multi-source temperature data. And the intelligent fan speed regulation module dynamically regulates the speed according to the result and comprises gradual and dynamic balance speed regulation strategies. The hierarchical regulation and control module is operated in different levels, including fan speed regulation, hardware level intervention and fault early warning. The data storage module supports system optimization, and the communication module realizes interaction with the outside. The system is comprehensive and accurate in temperature control, flexible in heat dissipation strategy and provided with a multi-layer coping mechanism, the reliability, stability and manageability of the server are improved, heat dissipation resource distribution is optimized, and energy consumption is reduced.

Description

Technical Field

[0001] This invention relates to the field of server heat dissipation control technology, specifically to a multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers. Background Technology

[0002] Existing PC Farm array server thermal control technologies suffer from several pain points. Traditional solutions only monitor CPU and GPU temperatures, neglecting heat accumulation in critical motherboard areas such as MOSFETs and PCH chips. This can lead to localized overheating, accelerating capacitor aging or causing hardware failures. Furthermore, the internal temperature gradient of the chassis is not quantified, resulting in distorted assessments of thermal efficiency. The speed control mechanism is also rigid, relying on fixed threshold triggers for fan speed adjustment, leading to significant response delays and an inability to adapt to transient load fluctuations. Moreover, when even full-speed fans fail to control temperature, there is a lack of hardware-level intervention, requiring manual troubleshooting and resulting in lengthy recovery times. Additionally, existing solutions lack a correlation model between the environment, components, and power consumption, leading to inefficient allocation of thermal resources and increased energy consumption. External sensor solutions require chassis structure modifications, resulting in high costs and poor compatibility; software monitoring tools rely on operating system-level data, become ineffective during hardware failures, and cannot adjust BIOS-level parameters.

[0003] To address this, a multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers is proposed. Summary of the Invention

[0004] The present invention aims to solve the problems mentioned in the background art by providing a multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers.

[0005] The specific technical solution is as follows:

[0006] A multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers includes a multi-dimensional temperature monitoring module, a thermal field modeling module, an intelligent fan speed control module, and a hierarchical control module. The multi-dimensional temperature monitoring module acquires multi-source temperature data from the PC Farm array server. The thermal field modeling module, connected to the multi-dimensional temperature monitoring module, constructs a three-dimensional temperature distribution map based on the data acquired by the multi-dimensional temperature monitoring module to locate overheated areas in real time. The intelligent fan speed control module, connected to the thermal field modeling module, executes a progressive speed control strategy and dynamic balance speed control based on the results of the thermal field modeling module. The hierarchical control module, connected to the intelligent fan speed control module, performs different levels of control operations under different temperature conditions, including fan speed control, hardware-level intervention, and fault warning.

[0007] The aforementioned PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system includes multi-source temperature data acquired by the multi-dimensional temperature monitoring module, such as CPU temperature, GPU temperature, temperatures of key areas on the motherboard like MOS transistors and PCH chips, and temperatures of the air inlets and outlets inside the chassis.

[0008] The aforementioned PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system includes a three-dimensional temperature distribution map constructed by the thermal field modeling module, which can accurately locate overheated areas such as MOS transistor clusters to achieve precise analysis of the server's thermal field.

[0009] The aforementioned PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system includes an intelligent fan speed control module whose progressive speed control strategy can gradually adjust the fan speed according to temperature changes to achieve efficient heat dissipation.

[0010] The aforementioned PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system includes a smart fan speed control module that dynamically balances speed by automatically reducing the fan speed to the equilibrium point when the temperature difference between the air outlet and the inlet (outlet air - inlet air) is less than or equal to 5°C.

[0011] The aforementioned PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system includes a hierarchical control module where Level 1 control is fan speed adjustment, with a response time of less than 1 second.

[0012] The aforementioned PC Farm array server's multi-dimensional temperature sensing and graded dynamic control system includes a graded control module whose Level 2 control is a hardware-level intervention. It is activated when the temperature cannot be controlled even when the fan is running at full speed. The system modifies the BIOS power supply parameters through the BMC, including reducing the CPU core voltage by 0.05V (in steps) and limiting the CPU TDP to 80% of the base value.

[0013] The aforementioned PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system includes a hierarchical control module whose Level 3 control is for fault early warning, issuing a fault early warning signal under specific temperature and operating conditions.

[0014] The aforementioned PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system also includes a data storage module, which is connected to the multi-dimensional temperature monitoring module, thermal field modeling module, intelligent fan speed control module, and hierarchical control module to store the data generated and used by each module.

[0015] The aforementioned PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system also includes a communication module for data interaction with external devices, transmitting temperature data, control status, and other information to external monitoring devices or receiving control commands from external devices.

[0016] The present invention has the following beneficial effects:

[0017] 1. Comprehensive and precise temperature control: The multi-dimensional temperature monitoring module acquires multi-source temperature data to avoid monitoring blind spots, and the thermal field modeling module accurately locates overheated areas, enabling precise control of the server's thermal field and providing strong support for subsequent regulation.

[0018] 2. Flexible heat dissipation strategy: The intelligent fan speed control module's progressive speed control and dynamic balance speed control can flexibly adjust the fan speed according to temperature changes, avoiding insufficient heat dissipation or energy waste, and achieving efficient heat dissipation and energy saving.

[0019] 3. Multi-level response mechanism: Different levels of control operations of the graded control module, from fan speed adjustment to hardware-level intervention and fault warning, can ensure stable operation of the server under various temperature scenarios and improve the server's reliability and stability.

[0020] 4. Optimized system management: The data storage module provides data support for system optimization and fault diagnosis, while the communication module facilitates remote monitoring and adjustment of the system by maintenance personnel, improving the system's manageability and flexibility to adapt to different application scenarios and management needs. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the architecture of the multi-dimensional temperature sensing and hierarchical dynamic control system for a PC Farm array server provided in an embodiment of the present invention. Detailed Implementation

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this application. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0024] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0025] In the description of this invention, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] Example

[0027] The PC Farm array server multi-dimensional temperature sensing and hierarchical dynamic control system provided in this embodiment, such as Figure 1 As shown, the system includes a multi-dimensional temperature monitoring module, a thermal field modeling module, an intelligent fan speed control module, and a graded control module. The multi-dimensional temperature monitoring module acquires multi-source temperature data from the PC Farm array server. The thermal field modeling module is connected to the multi-dimensional temperature monitoring module and constructs a three-dimensional temperature distribution map based on the data acquired by the multi-dimensional temperature monitoring module to locate overheated areas in real time. The intelligent fan speed control module is connected to the thermal field modeling module and executes a progressive speed control strategy and dynamic balance speed control based on the results of the thermal field modeling module. The graded control module is connected to the intelligent fan speed control module and performs different levels of control operations under different temperature conditions, including fan speed control, hardware-level intervention, and fault warning.

[0028] The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers described in this solution achieves comprehensive and precise temperature regulation through the collaborative work of multiple modules. The multi-dimensional temperature monitoring module acquires multi-source temperature data, providing a comprehensive temperature information foundation for the entire system and avoiding monitoring blind spots. The thermal field modeling module constructs a three-dimensional temperature distribution map based on this data to locate overheated areas, enabling the system to accurately grasp the thermal field distribution within the server. The intelligent fan speed control module adjusts fan speed according to the thermal field modeling results, dynamically adjusting the heat dissipation strategy based on actual temperature conditions, avoiding rigid speed control mechanisms. The hierarchical control module executes different levels of control under different temperature conditions, realizing a multi-layered response from simple fan speed adjustment to hardware-level intervention and fault early warning, ensuring stable server operation under various temperature scenarios, improving server reliability and stability, while optimizing heat dissipation resource allocation and reducing energy consumption.

[0029] Specifically, in this embodiment, the multi-source temperature data acquired by the multi-dimensional temperature monitoring module includes CPU temperature, GPU temperature, temperature of key areas of the motherboard such as MOSFETs and PCH chips, and temperature of the air inlet and outlet inside the chassis.

[0030] This solution utilizes multi-source temperature data acquired by a multi-dimensional temperature monitoring module, including temperatures from the CPU, GPU, key areas of the motherboard, and the chassis's air intake and exhaust vents. This comprehensive coverage of critical heat-generating components within the server, as well as the ambient temperature of the chassis, effectively avoids the localized overheating issues caused by traditional solutions that only monitor the temperature of a few components. The system gains a more accurate understanding of the server's overall thermal condition, providing more complete and accurate data support for subsequent thermal field modeling and control. This results in more precise heat dissipation control, improving the server's cooling performance and operational stability.

[0031] Specifically, in this embodiment, the three-dimensional temperature distribution map constructed by the thermal field modeling module can accurately locate overheated areas such as MOS transistor clusters, so as to achieve accurate analysis of the server's thermal field.

[0032] This solution uses a thermal field modeling module to construct a 3D temperature distribution map that can accurately locate overheated areas such as MOSFET clusters. This allows the system to precisely identify specific overheating locations inside the server. Compared to traditional solutions that cannot accurately identify localized overheating, this technology enables heat dissipation measures to be more targeted at overheated areas, improving heat dissipation efficiency, reducing problems such as accelerated capacitor aging and hardware failures caused by localized overheating, extending the lifespan of server hardware, and ensuring long-term stable operation of the server.

[0033] Specifically, in this embodiment, the progressive speed control strategy of the intelligent fan speed control module can gradually adjust the fan speed according to temperature changes in order to achieve efficient heat dissipation.

[0034] This solution employs a progressive speed control strategy in its intelligent fan speed control module to gradually adjust the fan speed based on temperature changes. Compared to a rigid speed control mechanism triggered by a fixed threshold, this approach offers a more flexible response to temperature variations. As the temperature rises or falls slowly, the fan speed adjusts accordingly, preventing insufficient heat dissipation or energy waste caused by overly drastic or delayed speed adjustments. This achieves efficient heat dissipation while optimizing energy utilization.

[0035] Specifically, in this embodiment, the dynamic balance speed regulation of the intelligent fan speed regulation module is to automatically reduce the fan speed to the balance point when the temperature difference at the air outlet (outlet air - inlet air) is less than or equal to 5°C.

[0036] This solution utilizes a smart fan speed control module for dynamic balancing, automatically reducing the fan speed to an equilibrium point when the temperature difference between the exhaust and intake air is small. This mechanism prevents the fan from maintaining high speed when it is not needed, thereby reducing fan energy consumption, minimizing fan noise, and extending fan lifespan. It achieves both energy saving and equipment protection while ensuring the server's cooling requirements are met.

[0037] Specifically, in this embodiment, the Level 1 control of the graded control module is fan speed control, with a response time of less than 1 second.

[0038] In this solution, the Level 1 control of the tiered control module is fan speed adjustment with a short response time (less than 1 second). This allows the system to react quickly in the early stages of temperature changes, adjusting fan speed promptly to cope with temperature fluctuations. This rapid response prevents further temperature increases, effectively preventing server overheating, ensuring stable server temperature during daily operation, and improving server efficiency and stability.

[0039] Specifically, in this embodiment, the Level 2 control of the graded control module is a hardware-level intervention. It is activated when the temperature cannot be controlled even when the fan is running at full speed. It modifies the BIOS power supply parameters through the BMC, including reducing the CPU core voltage by 0.05V (in steps) and limiting the CPU TDP to 80% of the base value.

[0040] The Level 2 control module in this solution involves hardware-level intervention, activated when temperature control fails even with the fan running at full speed. By modifying BIOS power supply parameters through the BMC, such as reducing CPU core voltage and limiting CPU TDP, the power of the server's heat sources can be further reduced under extreme temperature conditions, effectively controlling temperature rise. This measure provides additional protection for the server in cases of severe overheating, reducing the risk of hardware damage due to high temperatures, shortening fault recovery time, and improving the server's survivability and reliability under harsh thermal conditions.

[0041] Specifically, in this embodiment, the Level 3 control of the graded control module is a fault warning, which issues a fault warning signal under specific temperature and operating conditions.

[0042] The Level 3 control module in this solution provides fault early warning, issuing warning signals under specific temperature and operating conditions. This allows maintenance personnel to be aware of potential server failure risks in advance, giving them sufficient time to take preventative measures, such as checking the cooling system and adjusting server load, thus avoiding actual server failures, reducing business interruption time caused by server failures, and improving server system availability and business continuity.

[0043] Specifically, in this embodiment, a data storage module is also included, which is connected to the multi-dimensional temperature monitoring module, the thermal field modeling module, the intelligent fan speed control module, and the hierarchical control module, and is used to store the data generated and used by each module.

[0044] The added data storage module in this solution stores the data generated and used by each module, providing data support for system operation and optimization. By storing and analyzing historical temperature data, control strategy data, and other data, the accuracy of thermal field modeling, the rationality of fan speed control strategies, and the timing and method of graded control can be further optimized. Simultaneously, this data also helps in fault diagnosis and performance evaluation, providing a basis for the long-term stable operation and performance improvement of the server.

[0045] Specifically, in this embodiment, a communication module is also included to interact with external devices, transmitting temperature data, control status and other information to external monitoring devices or receiving control commands from external devices.

[0046] This solution enables the system to interact with external devices through a communication module. Temperature data and control status information are transmitted to external monitoring equipment, allowing maintenance personnel to remotely monitor the server's thermal condition and the system's operational status in real time, promptly identifying potential problems. Receiving control commands from external devices allows for remote adjustments and optimizations of the control system based on actual needs, improving system manageability and flexibility to adapt to different application scenarios and management requirements.

[0047] In summary, the working principle of the multi-dimensional temperature sensing and hierarchical dynamic control system for the PC Farm array server provided in this embodiment is as follows:

[0048] This PC Farm array server's multi-dimensional temperature sensing and hierarchical dynamic control system consists of a multi-dimensional temperature monitoring module, a thermal field modeling module, an intelligent fan speed control module, a hierarchical control module, a data storage module, and a communication module. The multi-dimensional temperature monitoring module acquires multi-source temperature data from the server, including the CPU, GPU, key areas of the motherboard, and the temperatures of the chassis's air inlets and outlets, providing comprehensive temperature information for the system. The thermal field modeling module constructs a three-dimensional temperature distribution map based on this data to locate overheated areas in real time. The intelligent fan speed control module dynamically adjusts the fan speed according to the actual temperature conditions through a progressive speed control strategy and dynamic balancing speed control based on the thermal field modeling results. The hierarchical control module performs different levels of control operations under different temperature conditions, ranging from simple fan speed adjustment to hardware-level intervention and fault warnings. The data storage module stores data from each module, providing support for system optimization. The communication module enables data interaction with external devices.

[0049] How to use

[0050] The system automatically starts and operates continuously during the PC Farm array server's operation. A multi-dimensional temperature monitoring module collects temperature data in real time and transmits it to the thermal modeling module. The thermal modeling module generates a 3D temperature distribution map, which the intelligent fan speed control module uses to adjust fan speeds. When fan speed control cannot meet temperature control requirements, the tiered control module sequentially initiates hardware-level intervention or issues fault warnings. Maintenance personnel can remotely monitor the system's temperature data and control status via the communication module and can also send control commands to adjust the system.

[0051] The graded control module is connected to the intelligent fan speed control module, and performs different levels of control operations under different temperature conditions.

[0052] Level 1: Fan speed control with short response time, quickly adjusting fan speed in the initial stage of temperature change.

[0053] Level 2: Hardware-level intervention, activated when full fan speed is ineffective, modifies BIOS power supply parameters via BMC, such as reducing CPU core voltage and limiting CPU TDP.

[0054] Level 3: Fault warning, issuing fault warning signals under specific temperature and operating conditions.

[0055] The above are merely preferred embodiments of the present invention and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should recognize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-dimensional temperature sensing and hierarchical dynamic control system for a PC Farm array server, characterized in that, It includes a multi-dimensional temperature monitoring module, a thermal field modeling module, an intelligent fan speed control module, and a graded control module. The multi-dimensional temperature monitoring module is used to acquire multi-source temperature data from the PC Farm array server. The thermal field modeling module is connected to the multi-dimensional temperature monitoring module and constructs a three-dimensional temperature distribution map based on the data acquired by the multi-dimensional temperature monitoring module to locate overheated areas in real time. The intelligent fan speed control module is connected to the thermal field modeling module and executes a progressive speed control strategy and dynamic balance speed control based on the results of the thermal field modeling module. The graded control module is connected to the intelligent fan speed control module and performs different levels of control operations under different temperature conditions, including fan speed control, hardware-level intervention, and fault warning.

2. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to claim 1, characterized in that, The multi-dimensional temperature monitoring module acquires multi-source temperature data including CPU temperature, GPU temperature, temperatures of key areas on the motherboard such as MOSFETs and PCH chips, and temperatures of the air inlet and outlet inside the chassis.

3. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to claim 1, characterized in that, The three-dimensional temperature distribution map constructed by the thermal field modeling module can accurately locate overheated areas such as MOS transistor clusters, thereby enabling precise analysis of the server's thermal field.

4. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to claim 1, characterized in that, The intelligent fan speed control module's progressive speed control strategy can gradually adjust the fan speed according to temperature changes to achieve efficient heat dissipation.

5. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to claim 1, characterized in that, The intelligent fan speed control module's dynamic balance speed control automatically reduces the fan speed to the balance point when the temperature difference at the air outlet is less than or equal to 5℃.

6. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to claim 1, characterized in that, The Level 1 control of the graded control module is fan speed regulation, with a response time of less than 1 second.

7. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to claim 1, characterized in that, The Level 2 control of the graded control module is a hardware-level intervention. It is activated when the temperature cannot be controlled even when the fan is running at full speed. It modifies the BIOS power supply parameters through the BMC, including reducing the CPU core voltage by 0.05V and limiting the CPU TDP to 80% of the base value.

8. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to claim 1, characterized in that, The Level 3 control of the graded control module is for fault early warning, issuing fault early warning signals under specific temperature and operating conditions.

9. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to claim 1, characterized in that, It also includes a data storage module, which is connected to the multi-dimensional temperature monitoring module, thermal field modeling module, intelligent fan speed control module, and graded control module to store the data generated and used by each module.

10. The multi-dimensional temperature sensing and hierarchical dynamic control system for PC Farm array servers according to any one of claims 1-9, characterized in that, It also includes a communication module, which interacts with external devices to transmit temperature data, control status and other information to external monitoring devices or receive control commands from external devices.

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