Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel is provided with a display area and a frame area surrounding the periphery of the display area; the display panel includes: a substrate; the display function layer is arranged on one side of the substrate, and the display function layer is located in the display area; the driving chip and the display function layer are arranged on the same side of the substrate, and the driving chip is located in the frame area; the cover plate is arranged on one side, deviating from the substrate, of the display function layer and the driving chip; and the heat reflecting layer is positioned in the frame area, and the heat reflecting layer is positioned between the driving chip and the cover plate. The heat transferred to the cover plate when the driving chip works can be reduced, the temperature uniformity of the cover plate is ensured, and the use experience is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0002] With the development of display technology, people have higher and higher requirements on the use experience of display panel devices.

[0003] At present, the display panel usually includes a substrate, a display function layer, a driving chip and a cover plate; the display function layer is arranged on one side of the substrate, the driving chip is bound on the substrate; and the cover plate is arranged on the side of the display function layer and the driving chip away from the substrate.

[0004] However, the heat generated by the driving chip during work is transferred to the cover plate, causing the local temperature of the cover plate to be too high, which affects the use experience. SUMMARY

[0005] Therefore, the embodiments of the present application provide a display panel and a display device, which can reduce the heat transferred to the cover plate by the driving chip during work, ensure the uniform temperature of the cover plate, and improve the use experience.

[0006] In one aspect, the embodiments of the present application provide a display panel, which has a display area and a frame area surrounding the periphery of the display area; the display panel includes:

[0007] a substrate;

[0008] a display function layer, the display function layer being arranged on one side of the substrate, and the display function layer being located in the display area;

[0009] a driving chip, the driving chip being arranged on the same side of the substrate as the display function layer, and the driving chip being located in the frame area;

[0010] a cover plate, the cover plate being arranged on the side of the display function layer and the driving chip away from the substrate;

[0011] a heat reflection layer, the heat reflection layer being located in the frame area, and the heat reflection layer being located between the driving chip and the cover plate.

[0012] In another aspect, the embodiments of the present application provide a display device, which includes the display panel provided in the foregoing embodiments of the present application.

[0013] The display panel and display device provided in this application embodiment have a display area and a bezel area surrounding the display area. A display functional layer is disposed on one side of the substrate, located within the display area. This allows the display functional layer to display various images within the display area, facilitating user viewing. A driver chip is disposed on the substrate, with the driver chip and display functional layer located on the same side of the substrate, and positioned within the bezel area. This allows the driver chip to drive the light-emitting devices of the display functional layer to emit light, enabling the light emitted by the light-emitting devices to illuminate the area outside the display panel and display various images. A cover plate is disposed on the side of the display functional layer and driver chip facing away from the substrate, protecting the display functional layer and driver chip and extending the lifespan of the display panel. By setting a heat-reflective layer in the bezel area, which is located between the driver chip and the cover plate, the heat generated by the driver chip during operation can be reflected by the heat-reflective layer, thereby locking the heat generated by the driver chip inside the display panel. This reduces the heat transfer from the driver chip to the cover plate, which means that the local temperature of the cover plate area corresponding to the driver chip can be reduced, ensuring uniform temperature in all areas of the cover plate and improving the user experience. Attached Figure Description

[0014] Figure 1 This is a front view of a display panel provided in some embodiments of this application.

[0015] Figure 2 This is a partial cross-sectional view of a display panel provided in some embodiments of this application.

[0016] Figure 3 yes Figure 2 A magnified view of a portion of point A in the middle.

[0017] Figure 4 This is an exploded structural diagram of the heat-reflective layer and cover plate in a display panel provided in some embodiments of this application.

[0018] Figure 5 yes Figure 2 Another magnified view of point A in the middle.

[0019] Figure 6 This is an exploded structural diagram of the heat-reflective layer, heat-insulating layer, and cover plate in a display panel provided in some embodiments of this application.

[0020] Figure 7 yes Figure 2 Another magnified view of point A in the middle.

[0021] Figure 8 This is an exploded structural diagram of the heat reflection layer, heat dissipation layer and cover plate in a display panel provided in some embodiments of this application.

[0022] Figure 9 is Figure 2 is another partial enlarged view at A in FIG. 1.

[0023] Figure 10 is a decomposition structure schematic diagram of the heat reflection layer, the heat insulation layer, the heat equalization layer and the cover plate in the display panel provided by some embodiments of the present application.

[0024] Explanation of reference signs:

[0025] 10 - display panel;

[0026] 11 - display area; 12 - frame area; 101 - substrate; 102 - display functional layer; 103 - driving chip; 104 - cover plate; 105 - heat reflection layer; 106 - heat insulation layer; 107 - heat equalization layer;

[0027] 1051 - preset gap. DETAILED DESCRIPTION

[0028] In order to make the above objectives, characteristics and advantages of the present application more apparent, obvious and easy to understand, the specific embodiments of the present application are described in detail below. In the following description, a large number of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0030] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0031] In the present application, unless specifically delimitated and limited, if the terms "mount", "connect", "connect", "fix" and the like appear, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] In the present application, unless specifically delimitated and limited, if the terms "mount", "connect", "connect", "fix" and the like appear, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and are not the only embodiment.

[0034] Figure 1 is a front view of a display panel provided by some embodiments of the present application. Figure 2 is a partial cross-sectional view of a display panel provided by some embodiments of the present application.

[0035] In some examples, referring to Figure 1 and Figure 2 shown, some examples of embodiments of the present application can have a display area 11. The display area 11 can refer to an area where the display panel 10 can display information or pictures.

[0036] In some examples, referring to Figure 1 shown, the display panel 10 can include a frame area 12. The frame area 12 can surround the outer periphery of the display area 11. The frame area 12 can be connected to the display area 11. The frame area 12 can have other functions in addition to display.

[0037] In some examples, refer to Figure 2 As shown, the display panel 10 may include a substrate 101. The substrate 101 may include a glass substrate or a flexible substrate, etc. It is understood that in some examples of the embodiments of this application, the type of substrate 101 may be the same as, similar to or similar to the type of substrate in the related art. For details, please refer to the detailed description of the related art. The embodiments of this application will not repeat the details here.

[0038] In some examples, refer to Figure 2 As shown, the display panel 10 may include a display functional layer 102. The display functional layer 102 may be disposed on one side of the substrate 101. It can be understood that the display functional layer 102 may be disposed on one side of the substrate 101 along the thickness direction.

[0039] In some examples, the display function layer 102 may be located in the display area 11. That is, the display function layer 102 can display the screen through the display area 11.

[0040] In some examples, display layer 102 may include multiple light-emitting devices. These multiple light-emitting devices may emit different colors of light. For example, some of the light-emitting devices may emit red (R) light, another group may emit green (G) light, and the remaining group may emit blue (B) light.

[0041] In some examples, the display functional layer 102 may include driving circuitry. The driving circuitry may be electrically connected to a light-emitting device, thereby driving the light-emitting device to emit light. It is understood that in some examples of the embodiments of this application, the arrangement of the driving circuitry and the light-emitting device may be the same as, similar to, or analogous to related technologies. For details, please refer to the detailed descriptions of related technologies; these will not be repeated in the embodiments of this application.

[0042] In some examples, refer to Figure 2 As shown, to drive the light-emitting device to emit light, the display panel 10 may include a driver chip 103. The driver chip 103 may be disposed on one side of the substrate 101.

[0043] In some examples, the driver chip 103 may be located on the same side of the substrate 101 as the display functional layer 102. (See reference...) Figure 2 As shown, the driver chip 103 can be located in the border area 12.

[0044] In some examples, this is done to protect the display functional layer 102 and the driver chip 103, and to extend the lifespan of the display panel 10. (See reference...) Figure 2 As shown, the display panel 10 may include a cover plate 104. The cover plate 104 may be disposed on the side of the display functional layer 102 and the driving chip 103 opposite to the substrate 101.

[0045] In some examples, the cover plate 104 can be connected to the side of the display functional layer 102 opposite to the substrate 101 via optically transparent adhesive.

[0046] In some examples, cover plate 104 may include a glass cover plate.

[0047] In some examples, the portion of the cover plate 104 located in the border area 12 facing the driver chip 103 may have an ink layer. The ink layer can cover the driver chip 103.

[0048] In some examples, refer to Figure 2 As shown, when the driver chip 103 is working, the driver chip 103 generates a large amount of heat. The heat generated by the driver chip 103 is transferred to the cover plate 104 through thermal radiation, causing the local temperature of the cover plate 104 in the area corresponding to the driver chip 103 to be higher than the temperature of other areas.

[0049] Figure 3 yes Figure 2 A magnified view of a portion of point A in the middle.

[0050] In some examples, to reduce the local temperature of the cover plate 104 corresponding to the area of ​​the driver chip 103, refer to Figure 3 As shown, the display panel 10 may include a heat-reflective layer 105. The heat-reflective layer 105 may be located in the bezel area 12. The heat-reflective layer 105 may be located between the driver chip 103 and the cover plate 104.

[0051] In some examples, the heat-reflective layer 105 may be disposed on the side surface of the cover plate 104 facing the driver chip 103.

[0052] In some examples, the heat reflective layer 105 can reflect the heat radiation generated by the driver chip 103, so that the heat radiated by the driver chip 103 to the cover plate 104 is reflected and locked within the display panel 10, thereby reducing the heat radiated by the driver chip 103 to the cover plate 104 and lowering the temperature of the bezel area 12 corresponding to the driver chip 103.

[0053] The display panel 10 provided in this embodiment has a display area 11 and a frame area 12 surrounding the display area 11. A display functional layer 102 is provided on one side of the substrate 101, located within the display area 11. Thus, the display functional layer 102 can display various images within the display area 11, facilitating user viewing of these images. A driver chip 103 is provided on the substrate 101, located on the same side as the display functional layer 102, and positioned within the frame area 12. This allows the driver chip 103 to drive the light-emitting devices of the display functional layer 102 to emit light, thereby illuminating the outside of the display panel 10 to display various images. A cover plate 104 is provided on the side of the display functional layer 102 and the driver chip 103 away from the substrate 101. The cover plate 104 protects the display functional layer 102 and the driver chip 103, extending the lifespan of the display panel 10. By setting a heat-reflective layer 105 in the bezel area 12, the heat-reflective layer 105 is located between the driver chip 103 and the cover plate 104; in this way, the heat generated by the driver chip 103 during operation can be reflected by the heat-reflective layer 105, thereby locking the heat generated by the driver chip 103 during operation inside the display panel 10, which can reduce the heat transfer from the driver chip 103 to the cover plate 104. In other words, it can reduce the local temperature of the area of ​​the cover plate 104 corresponding to the driver chip 103, ensure the temperature of each area of ​​the cover plate 104 is uniform, and improve the user experience.

[0054] In some examples, refer to Figure 3 As shown, the heat reflective layer 105 may have a first orthographic projection on the substrate 101. The driving chip 103 may have a second orthographic projection on the substrate 101.

[0055] In some examples, the first orthographic projection may overlap with the second orthographic projection.

[0056] In some examples, the first orthographic projection may partially overlap with the second orthographic projection. For instance, the heat-reflective layer 105 can partially block the driver chip 103, thereby reducing the area of ​​heat radiated from the driver chip 103 to the cover plate 104. This reduces the temperature of the cover plate 104 in the frame area 12, ensuring uniform temperature across all areas of the cover plate 104 and improving the user experience.

[0057] In some examples, the first orthogonal projection can completely overlap the second orthogonal projection. For example, the area of the first orthogonal projection can be the same, similar or close to the area of the second orthogonal projection, and the first orthogonal projection and the second orthogonal projection can overlap. In this way, the heat reflecting layer 105 can cover the driving chip 103 towards the side surface of the cover plate 104, and the reflective area of the heat reflecting layer 105 can be increased, so that the heat reflecting layer 105 can reflect more heat (heat radiated from the driving chip 103 to the cover plate 104), thereby reducing the heat radiated from the driving chip 103 to the cover plate 104, reducing the temperature of the cover plate 104 in the frame area 12, ensuring the uniformity of the temperature of each area of the cover plate 104, and improving the user experience.

[0058] In some examples, the area of the first orthogonal projection can be greater than the area of the second orthogonal projection. That is, the heat reflecting layer 105 can completely cover the driving chip 103, and the heat reflecting layer 105 can extend beyond the edge of the driving chip 103 in the lateral direction of the display panel 10. In this way, the area of the heat reflecting layer 105 can be increased, so that the heat reflecting layer 105 can reflect the heat radiated from the driving chip 103 from the side, thereby reducing the heat radiated from the driving chip 103 to the cover plate 104, reducing the temperature of the cover plate 104 in the frame area 12, ensuring the uniformity of the temperature of each area of the cover plate 104, and improving the user experience.

[0059] In some examples of the embodiments of the present application, the heat reflecting layer 105 can have a first orthogonal projection on the substrate 101, and the driving chip 103 can have a second orthogonal projection on the substrate 101. By setting the first orthogonal projection to overlap the second orthogonal projection, the heat radiated from the driving chip 103 in the positive direction of the heat radiated from the driving chip 103 to the cover plate 104 can be reflected, the heat radiated from the driving chip 103 to the cover plate 104 can be reduced, the temperature of the cover plate 104 in the frame area 12 can be reduced, the uniformity of the temperature of each area of the cover plate 104 can be ensured, and the user experience can be improved.

[0060] In some examples, referring to FIG. 1, the heat reflecting layer 105 and the driving chip 103 can have a preset gap 1051 therebetween. Figure 3 That is, the distance between the surface of the heat reflecting layer 105 towards the substrate 101 and the substrate 101 can be less than the thickness of the driving chip 103.

[0061] In some examples, the specific size of the preset gap 1051 can be set according to the specific circumstances of the display panel 10, and the embodiments of the present application do not limit this.

[0062] In some examples, the preset gap 1051 can be determined by the thickness of the display functional layer 102 and the thickness of the driving chip 103.

[0063] In some examples of embodiments of this application, a preset gap 1051 is provided between the heat-reflective layer 105 and the driving chip 103. Thus, when the driving chip 103 is operating, the air within the preset gap 1051 is heated by the heat generated by the driving chip 103. The hot air can carry heat and convect within the preset gap 1051, which on the one hand facilitates heat dissipation of the driving chip 103 itself; on the other hand, the preset gap 1051 can be used to isolate the driving chip 103 from the heat-reflective layer 105, meaning that only radiative heat transfer exists between the driving chip 103 and the heat-reflective layer 105, eliminating thermal conduction heat transfer between them. In this way, the heat-reflective layer 105 can effectively reflect thermal radiation, preventing the driving chip 103 from conducting heat to the heat-reflective layer 105; it can effectively reduce the temperature of the cover plate 104 of the bezel area 12, ensuring uniform temperature across all areas of the display panel 10 and improving the user experience of the bezel area 12.

[0064] In some examples, the heat-reflective layer 105 may include at least one of an aluminum foil layer, a silver foil layer, a metal oxide plating layer, or a highly reflective coating. This allows for effective reflection of infrared radiation, reducing the temperature of the bezel area 12 cover plate 104, ensuring uniform temperature across all areas of the display panel 10, and improving the user experience of the bezel area 12.

[0065] Figure 4 This is an exploded structural diagram of the heat-reflective layer and cover plate in a display panel provided in some embodiments of this application.

[0066] In some examples, refer to Figure 4 As shown, the heat generated by the driver chip 103 radiates to the heat-reflecting layer 105 in the direction indicated by arrow a. In the heat-reflecting layer 105, most of the heat radiation is reflected, for example, along... Figure 4 The direction indicated by the middle arrow a1 is reflected. This reduces the heat radiated from the driver chip 103 to the cover plate 104, thereby lowering the temperature of the cover plate 104 in the frame area 12.

[0067] Figure 5 yes Figure 2 Another magnified view of point A in the middle.

[0068] It is understood that in some examples of the embodiments of this application, as the heat radiation from the driving chip 103 continues to radiate to the heat reflective layer 105, the temperature of the heat reflective layer 105 itself will gradually increase while reflecting the heat radiation. After the temperature of the heat reflective layer 105 increases, it will transfer heat to the cover plate 104.

[0069] Therefore, in some examples, refer to Figure 5As shown, the display panel 10 may include a heat insulation layer 106. The heat insulation layer 106 may be disposed in the bezel area 12. The heat insulation layer 106 may be located between the heat reflective layer 105 and the cover plate 104. That is, the heat insulation layer 106 may be disposed on the side of the cover plate 104 facing the driving chip 103, and the heat reflective layer 105 may be disposed on the side of the heat insulation layer 106 away from the cover plate 104.

[0070] Figure 6 This is an exploded structural diagram of the heat-reflective layer, heat-insulating layer, and cover plate in a display panel provided in some embodiments of this application.

[0071] In some examples, refer to Figure 6 As shown, the heat generated by the driver chip 103 during operation flows along... Figure 6 The heat radiates in the direction indicated by arrow b towards the heat-reflecting layer 105, which reflects the radiated heat. As the driving chip 103 continuously radiates heat to the heat-reflecting layer 105, the heat-reflecting layer 105 itself is heated. The heat insulation layer 106 can block the heat generated by the heat-reflecting layer 105, thereby locking the heat within the display panel 10. This reduces the heat transferred to the cover plate 104, which in turn lowers the temperature of the cover plate 104 in the bezel area 12, ensuring uniform temperature across all areas of the display panel 10 and improving the user experience of the bezel area 12.

[0072] In some examples of embodiments of this application, a heat insulation layer 106 is provided between the heat reflective layer 105 and the cover plate 104. In this way, the heat insulation layer 106 can isolate the heat generated by the heat reflective layer 105 itself, thereby reducing the heat transferred from the driving chip 103 to the cover plate 104 of the bezel area 12, ensuring uniform temperature in all areas of the display panel 10, and improving the user experience of the bezel area 12.

[0073] In some examples, the heat insulation layer 106 may include at least one of a transparent ceramic coating and a silica aerogel layer. This effectively isolates the heat from the heat reflective layer 105 itself after it has been heated.

[0074] In some examples, refer to Figure 5 As shown, the heat insulation layer 106 may have a fourth orthographic projection on the substrate 101. The fourth orthographic projection may overlap with the first orthographic projection. That is, the heat insulation layer 106 may at least cover at least a portion of the heat reflective layer 105. In this way, at least a portion of the heat after the heat reflective layer 105 is heated can be isolated by the heat insulation layer 106, thereby reducing the temperature of the cover plate 104 in the frame area 12.

[0075] In some examples, the fourth orthographic projection may overlap with the first orthographic projection. For example, the area of ​​the fourth orthographic projection may be the same as, similar to, or approximate to the area of ​​the first orthographic projection. In this way, the heat of the heat-reflective layer 105 can be completely isolated by the heat insulation layer 106, thereby reducing the temperature of the cover plate 104 in the frame area 12.

[0076] In some examples, the area of ​​the fourth orthographic projection can be larger than the area of ​​the first orthographic projection. That is, the heat insulation layer 106 can completely cover the heat reflective layer 105. In this way, the heat of the heat reflective layer 105 can be completely isolated by the heat insulation layer 106, and the radiant heat at the edge of the heat reflective layer 105 can be isolated, thereby reducing the temperature of the cover plate 104 in the frame area 12.

[0077] Figure 7 yes Figure 2 Another magnified view of point A in the middle.

[0078] In some examples, refer to Figure 7 As shown, the display panel 10 may include a heat dissipation layer 107. The heat dissipation layer 107 may be located in the bezel area 12. The heat dissipation layer 107 may be disposed between the cover plate 104 and the heat reflection layer 105. That is, the heat dissipation layer 107 may be disposed on the surface of the cover plate 104 facing the driver chip 103. The heat reflection layer 105 may be disposed on the side of the heat dissipation layer 107 away from the cover plate 104.

[0079] In some examples, the heat spreader 107 can be made of a good conductor of heat. That is, the heat from the heat reflector 105 can be conducted through the heat spreader 107 and carried laterally along the cover plate 104, thereby distributing the heat to various areas of the cover plate 104, making the temperature of each area of ​​the cover plate 104 uniform, and preventing the local temperature of the cover plate 104 in the frame area 12 from being too high and affecting the use of the frame area 12.

[0080] Figure 8 This is an exploded structural diagram of the heat reflection layer, heat dissipation layer and cover plate in a display panel provided in some embodiments of this application.

[0081] In some examples, refer to Figure 8 As shown, the heat generated by the driver chip 103 can flow along... Figure 8 The heat radiates in the direction indicated by arrow c towards the heat-reflecting layer 105, which reflects most of the heat, trapping it within the display panel 10. As the driving chip 103 continues to radiate towards the heat-reflecting layer 105, the temperature of the heat-reflecting layer 105 itself increases. At this point, the heat from the heat-reflecting layer 105 can radiate along... Figure 8The heat in the direction of the middle arrow is uniformly dispersed to each area of the cover plate 104 under the heat conduction of the heat equalizing layer 107, which can reduce the local temperature of the cover plate 104 corresponding to the driving chip 103, ensure the normal use of the function of the frame area 12, and improve the use experience of the display panel 10.

[0082] In some examples, referring to Figure 7 As shown, the heat equalizing layer 107 can have a third orthogonal projection on the substrate 101. The third orthogonal projection can overlap the first orthogonal projection.

[0083] In some examples, the third orthogonal projection can at least partially overlap the first orthogonal projection. That is, the heat equalizing layer 107 can cover at least part of the heat reflecting layer 105. In this way, the heat on the heat reflecting layer 105 can be thermally dispersed to each area of the cover plate 104, and the heat is uniformly dispersed in each area of the cover plate 104, so that the temperature of each area of the cover plate 104 is uniform, the temperature of the frame area 12 is reduced, and the use experience of the display panel 10 is improved.

[0084] In some examples, the third orthogonal projection can overlap the first orthogonal projection. For example, the area of the third orthogonal projection can be greater than the area of the first orthogonal projection. The heat equalizing layer 107 can cover the heat reflecting layer 105. In this way, the heat on the heat reflecting layer 105 can be thermally dispersed to each area of the cover plate 104, and the heat is uniformly dispersed in each area of the cover plate 104, so that the temperature of each area of the cover plate 104 is uniform, the temperature of the frame area 12 is reduced, and the use experience of the display panel 10 is improved.

[0085] In some examples, the heat equalizing layer 107 includes at least one of a thermally conductive metal layer, a thermally conductive interface layer, and a carbon-based heat dissipation film layer. In this way, the thermal conductivity of the heat equalizing layer 107 can be ensured, the dispersion effect of the heat on the heat reflecting layer 105 can be improved, the temperature of each area of the cover plate 104 can be uniform, the temperature of the frame area 12 can be reduced, and the use experience of the display panel 10 can be improved.

[0086] Figure 9 is Figure 2 is another partial enlarged view of A in the middle. Figure 10 is a disassembly structure schematic diagram of the heat reflecting layer, the heat insulation layer, the heat equalizing layer, and the cover plate in the display panel provided by some embodiments of the present application.

[0087] In some examples, referring to Figure 9 As shown, the heat insulation layer 106 can be located between the heat equalizing layer 107 and the heat reflecting layer 105. That is, the heat insulation layer 106 can be arranged on the side of the heat equalizing layer 107 away from the cover plate 104, and the heat reflecting layer 105 can be arranged on the side of the heat insulation layer 106 away from the heat equalizing layer 107.

[0088] In some examples, referring toFigure 10 As shown, the heat generated by the driving chip 103 is radiated to the heat reflecting layer 105 along the direction indicated by the arrow d, and the heat reflecting layer 105 reflects most of the heat. As the driving chip 103 continues to radiate heat, the heat reflecting layer 105 is heated and the temperature rises; the heat of the heat reflecting layer is isolated by the heat insulation layer 106. With the extension of time, the temperature of the heat insulation layer 106 component rises, and the heat transferred by the heat insulation layer 106 to the heat equalizing layer 107 is conducted and dispersed to each area of the cover plate 104 by the heat equalizing layer 107, reducing the temperature of the frame area 12 and improving the use experience of the display panel 10. Figure 10

[0089] In some examples, the third orthographic projection can overlap the fourth orthographic projection. It can be understood that the overlapping manner of the third orthographic projection and the fourth orthographic projection in the embodiments of the present application can be the same, similar or analogous to the overlapping manner of the third orthographic projection and the first orthographic projection in the foregoing embodiments of the present application. For details, reference can be made to the foregoing detailed description of the embodiments of the present application, and the embodiments of the present application will not be described again.

[0090] In some examples, as shown in Figure 4 As shown, the heat reflecting layer 105 can surround the outer periphery of the display area 11. That is, the heat reflecting layer 105 can be arranged in a circle along the surrounding direction of the frame area 12. In this way, the heat reflecting layer 105 can reflect heat for the plurality of driving chips 103 around the frame area 12, which can simplify the arrangement of the heat reflecting layer 105 and simplify the production process of the display panel 10.

[0091] In some examples, as shown in Figure 6 As shown, the heat insulation layer 106 can surround the outer periphery of the display area 11. That is, the heat insulation layer 106 can be arranged in a circle along the surrounding direction of the frame area 12.

[0092] In some examples, as shown in Figure 8 As shown, the heat equalizing layer 107 can surround the outer periphery of the display area 11. That is, the heat equalizing layer 107 can be arranged in a circle along the surrounding direction of the frame area 12. In this way, the heat equalizing layer 107 can uniformly distribute the heat on the heat reflecting layer 105 to each area of the cover plate 104, which can reduce the local problem of the frame area 12 and improve the use experience of the display panel 10.

[0093] In some examples, the embodiments of the present application also provide a display device. The display device can include the display panel 10 provided by the foregoing embodiments of the present application.

[0094] ​In some examples, the display device can be a notebook computer, a mobile phone, a wireless device, a personal data assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a watch, a clock, a calculator, a television monitor, a flat panel display, a computer monitor, an automobile display (e.g., a speedometer display, etc.), a navigation instrument, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rear view camera in a vehicle), an electronic photograph, an electronic billboard or sign, a projector, a package, etc.

[0095] It can be understood that the display device provided in some examples of the embodiments of the present application can have the same or corresponding technical features as the display panel 10 provided in the foregoing embodiments of the present application; therefore, the display device provided in the embodiments of the present application can have the same or similar technical effects as the display panel 10 provided in the foregoing embodiments of the present application, and details can be referred to the foregoing detailed description of the embodiments of the present application, which will not be described herein again.

[0096] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described herein, however, as long as the combinations of the technical features do not cause contradictions, they shall be considered as the scope of the present disclosure.

[0097] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, however, it shall not be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these shall be considered as the protection scope of the present application. Therefore, the patent protection scope of the present application shall be subject to the appended claims.

Claims

1. A display panel, characterized in that, The display panel has a display area and a border area surrounding the outer periphery of the display area; the display panel includes: substrate; The display functional layer is disposed on one side of the substrate and is located in the display area; A driver chip is disposed on the same side of the substrate as the display functional layer, and the driver chip is located in the border area; A cover plate is disposed on the side of the display functional layer and the driving chip facing away from the substrate; A heat-reflective layer is located in the frame area and between the driver chip and the cover plate.

2. The display panel according to claim 1, characterized in that, The heat-reflective layer has a first orthographic projection on the substrate, and the driving chip has a second orthographic projection on the substrate, wherein the first orthographic projection and the second orthographic projection overlap.

3. The display panel according to claim 1, characterized in that, There is a preset gap between the heat-reflective layer and the driving chip.

4. The display panel according to claim 1, characterized in that, The heat reflective layer includes at least one of aluminum foil layer, silver foil layer, metal oxide coating, and high reflective coating.

5. The display panel according to any one of claims 1-4, characterized in that, The display panel further includes a heat dissipation layer, which is located in the frame area and disposed between the cover plate and the heat reflection layer; And / or, The display panel further includes a heat insulation layer located in the frame area and disposed between the heat reflective layer and the cover plate.

6. The display panel according to claim 5, characterized in that, The heat dissipation layer has a third orthographic projection on the substrate, and the third orthographic projection overlaps with the first orthographic projection of the heat reflective layer on the substrate.

7. The display panel according to claim 5, characterized in that, The heat dissipation layer includes at least one of a thermally conductive metal layer, a thermally conductive interface layer, and a carbon-based heat dissipation film layer. And / or, The heat insulation layer includes at least one of a transparent ceramic coating and a silica aerogel layer.

8. The display panel according to claim 5, characterized in that, The heat-reflective layer, the heat-insulating layer, and the heat-equalizing layer surround the outer periphery of the display area.

9. The display panel according to claim 5, characterized in that, The heat insulation layer is located between the heat dissipation layer and the heat reflection layer; the heat insulation layer has a fourth orthographic projection on the substrate, and the third orthographic projection of the heat dissipation layer on the substrate overlaps with the fourth orthographic projection.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

Images