Manufacturing device and manufacturing method of novel alloy chip resistor

Abstract

The invention relates to a novel alloy chip resistor manufacturing device and method, the novel alloy chip resistor manufacturing device comprises a cutting module, a transfer module and a bearing module, and the cutting module comprises a cutting assembly used for cutting a limiting groove in a resistor substrate and a cutting assembly used for cutting the resistor substrate; a transferring module is further arranged on one side of the first conveying module, and the transferring module comprises a pushing assembly arranged on the first conveying module, a transferring assembly arranged on one side of the first conveying module and a grabbing assembly arranged at the upper end of the second conveying module; a plurality of bearing modules are arranged on the second conveying module, and each bearing module comprises a supporting plate matched with the corresponding limiting groove and used for supporting the corresponding resistor substrate, fixing assemblies arranged on the two sides of the supporting plate and used for fixing the corresponding strip-shaped substrate, rotating assemblies arranged on the outer sides of the fixing assemblies and pitch changing assemblies arranged on the outer sides of the rotating assemblies; therefore, the technical problem that the electrode machining efficiency of an existing chip resistor is low is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of resistance, in particular to a manufacturing device and method of a novel alloy chip resistor. BACKGROUND

[0002] The chip resistor is a kind of metal glass glaze resistor, which is made by mixing metal powder and glass glaze powder and printing on the substrate by screen printing method. It is resistant to moisture and high temperature, has small temperature coefficient, can greatly save circuit space cost, and makes design more refined. With the progress of science and technology, chip resistors are widely used on PCBs due to their small size and excellent performance. Chip resistors, also known as chip fixed resistors, are a kind of resistor. They have small size, light weight, suitable for reflow soldering and wave soldering, stable electrical performance, high reliability, low assembly cost, compatibility with automatic assembly equipment, high mechanical strength, and superior high-frequency characteristics.

[0003] The patent document with patent number CN113889308B discloses a method for manufacturing a chip resistor loaded on a ceramic substrate, which belongs to the field of electrical component manufacturing. The method includes the following steps: providing a ceramic substrate, the upper and lower end faces of the ceramic substrate are provided with multiple transverse folding block lines and multiple longitudinal folding strip lines, the folding strip lines and folding block lines are crosswise staggered to form multiple grid areas, the positions of the folding strip lines on the lower end face correspond one-to-one with the positions of the folding strip lines on the upper end face, the grid areas on the upper end face correspond one-to-one with the grid areas on the lower end face, and the positions of the folding block lines on the lower end face correspond one-to-one with the positions of the folding block lines on the upper end face. A groove is formed between every two adjacent folding strip lines on the upper end face of the ceramic substrate.

[0004] However, in actual use, the inventors found that the existing chip resistors are mostly first coated with paste on the front surface of the substrate and the back surface of the substrate to form front electrodes and back electrodes, and then the two side surfaces of the substrate are sputtered to form side electrodes by vacuum sputtering to connect the front electrodes and the back electrodes. This electrode forming method requires multiple transportation of the substrate and multiple process procedures for processing, resulting in low electrode processing efficiency of the chip resistor. SUMMARY

[0005] The purpose of the present application is to solve the technical problems of low electrode processing efficiency of the existing chip resistor by setting a new alloy chip resistor manufacturing device, which comprises a cutting module, a transfer module and a bearing module, the cutting module comprises a cutting assembly for cutting a limiting groove on the resistor substrate, and a cutting assembly for cutting the resistor substrate; The side of the first conveying module is also provided with a transfer module, and the conveying transfer module comprises a pushing assembly provided on the first conveying module, a transfer assembly provided on the side of the first conveying module and a grabbing assembly provided on the upper end of the second conveying module; A plurality of bearing modules are provided on the second conveying module, and the bearing module comprises a support plate matched with the limiting groove and used for supporting the resistor substrate, a fixing assembly provided on both sides of the support plate and used for fixing the strip-shaped substrate, a rotating assembly provided on the outer side of the fixing assembly and a distance changing assembly provided on the outer side of the rotating assembly, thereby solving the technical problems of low electrode processing efficiency of the existing chip resistor.

[0006] In view of the above technical problems, the technical scheme is as follows: a new alloy chip resistor manufacturing device, comprising: A cutting module is arranged on the first conveying module, and the cutting module comprises a cutting assembly for cutting a limiting groove on the resistor substrate, a cutting assembly for cutting the resistor substrate and a driving assembly for controlling the working of the cutting assembly; A transfer module is arranged on the side of the first conveying module, and the transfer module comprises a pushing assembly arranged on the first conveying module, a transfer assembly arranged on the side of the first conveying module and a grabbing assembly arranged on the upper end of the second conveying module; A plurality of bearing modules are arranged on the second conveying module, and the bearing module comprises a support plate matched with the limiting groove and used for supporting the resistor substrate, a fixing assembly provided on both sides of the support plate and used for fixing the strip-shaped substrate, a rotating assembly provided on the outer side of the fixing assembly and a distance changing assembly provided on the outer side of the rotating assembly; The cutting assembly cuts the resistor substrate into a plurality of strip-shaped substrates, and the plurality of strip-shaped substrates on the first conveying module are transferred one by one to the bearing module under the driving of the transfer module and are fixedly matched with the bearing module, and then the strip-shaped substrate is turned over multiple times under the driving of the rotating assembly and is matched with multiple printing devices to complete the multi-surface coating work of the coating.

[0007] As a preferred, the cutting assembly comprises a workbench arranged on the upper end of the first conveying module, a horizontal guide rail fixedly arranged on the upper end of the workbench, a moving unit translating on the horizontal guide rail and a laser cutting unit fixedly arranged on the moving unit; The cutting assembly comprises a support frame, a plurality of fixing rods fixed between the support frame and the first conveying module, and a cutting knife slidingly arranged on the fixing rods; The driving assembly comprises a first driving rack fixedly connected with the moving unit, a first driving gear in transmission with the first driving rack and rotatingly arranged on the workbench, a first bevel gear coaxially arranged with the first driving gear, a second bevel gear in cooperation with the first bevel gear and rotatingly arranged in a support box, a second driving gear coaxially arranged with the second bevel gear, and a second driving rack in transmission with the second driving gear and fixedly connected with the cutting knife at the other end, wherein the support box is fixedly arranged on the first conveying module.

[0008] Preferably, the first conveying module is further provided with a guiding assembly, so that the plurality of bar-shaped substrates cut down are arranged in order, which comprises: a longitudinal guiding plate fixedly arranged on the first conveying module through a plurality of connecting rods, wherein the cross section of the longitudinal guiding plate is L-shaped; a transverse guiding plate arranged at a position corresponding to the pushing assembly, wherein the lower end of the transverse guiding plate is further provided with a plurality of guiding rollers in cooperation with the bar-shaped substrates.

[0009] Preferably, the pushing assembly comprises a telescopic unit arranged at one side of the first conveying module, and a pushing plate connected with the telescopic unit and used for pushing the bar-shaped substrates into the clamping holes. The transfer assembly comprises a storage disc arranged between the first conveying module and the second conveying module, a plurality of clamping holes opened in the storage disc, clamping plates arranged in the clamping holes and oppositely arranged, compression springs having one end connected with the clamping plates and the other end fixed in the clamping holes, and a driving unit used for driving the storage disc to rotate.

[0010] Preferably, the grabbing assembly is used for transferring the bar-shaped substrates in the clamping holes to the bearing module, which comprises a two-axis moving truss arranged at the upper end of the second conveying module, and electric clamps arranged on the two-axis moving truss and used for clamping the bar-shaped substrates.

[0011] Preferably, the fixing assembly comprises: a fixing block fixedly connected with the support plate; a sliding block slidingly arranged on the fixing block, wherein a buffer spring is arranged between the sliding block and the fixing block, and the upper end of the sliding block is curved. The fixed block is provided with a slide rail at the upper end, the pressing block is slidably arranged on the slide rail, one end of the pressing block is rotatably connected with a first threaded rod, the other end of the first threaded rod is threadedly connected with the fixed block and connected with a first gear, and the fixed block is provided with a groove at the position corresponding to the first gear.

[0012] Preferably, the rotating assembly comprises a rotating shaft fixedly connected with the fixed block, a second gear fixedly arranged outside the rotating shaft, and a supporting block connected with the rotating shaft and arranged on the second conveying module.

[0013] Preferably, the distance changing assembly comprises: The guide unit comprises an upper top plate, a guide rail fixedly arranged at the lower end of the upper top plate, a plurality of sliding blocks slidably arranged on the guide rail, and a guide rod arranged on the sliding blocks. The distance changing unit comprises a sliding plate slidably arranged at the lower end of the upper top plate and provided with a plurality of distance changing grooves, a distance changing rod having one end arranged in the distance changing groove and the other end fixedly connected with the supporting block, and a lower bottom plate fixedly arranged on the second conveying module, and the end of the distance changing rod extending into the distance changing groove is fixedly connected with the guide rod. The control unit comprises a second threaded rod rotatably arranged at the lower end of the upper top plate, a connecting block fixedly connected with the sliding plate and arranged in transmission with the second threaded rod, and a third gear fixedly arranged at one end of the second threaded rod.

[0014] Preferably, the second conveying module is provided with a plurality of groups of first, second and third racks respectively cooperating with the first, second and third gears.

[0015] The application also provides a manufacturing method for the alloy patch resistor manufacturing equipment, comprising the following steps: Step one: slotting and dividing process, the dividing module is arranged on the resistor substrate to form a plurality of limiting grooves cooperating with the bearing module, and simultaneously divides the resistor substrate into a plurality of strip-shaped substrates; Step two: transfer process, the plurality of strip-shaped substrates are transferred to the bearing module under the driving of the transfer module; Step three: fixing process, after the strip-shaped substrate is placed on the supporting plate, the strip-shaped substrate is fixed on the supporting plate under the action of the fixing assembly; Step four: brushing process, when the strip-shaped substrate moves forward following the second conveying module, the rotating angle of the strip-shaped substrate and the distance between adjacent strip-shaped substrates are changed by cooperating with the rotating assembly and the distance changing assembly, and the brushing of the paste is completed by cooperating with the printing equipment.

[0016] The beneficial effects of the present application are as follows: (1) In the present application, by setting the segmentation module and the bearing module, when in use, the segmentation module will open a plurality of limiting grooves on the resistance substrate, which cooperate with the bearing module, and simultaneously divide the resistance substrate into a plurality of strip-shaped substrates, then the plurality of strip-shaped substrates will be transferred to the bearing module, under the driving of the second conveying module, the bearing module drives the plurality of strip-shaped substrates to forwardly convey, in the process of conveying, the bearing module drives the strip-shaped substrates to rotate by a certain angle, so that the position of the strip-shaped substrate entering the different screen printing equipment each time is different, thereby facilitating the brushing of different pastes on different surfaces of the strip-shaped substrate, after completing the paste coating work on the four surfaces of the strip-shaped substrate, the strip-shaped substrate is sent into the oven to solidify the paste, which can perform paste printing on multiple surfaces of the strip-shaped substrate on one manufacturing equipment, and can solidify the paste on multiple surfaces at one time, without the need for multiple transfer and processing of the substrate, thereby improving the electrode processing efficiency of the chip resistor; (2) In the present application, by setting the guide assembly on the first conveying module, after the resistance substrate is divided into a plurality of strip-shaped substrates, under the action of the guide assembly, the strip-shaped substrates after being divided still maintain the initial position, and the position will not change at will, so as to facilitate the subsequent transfer work of the strip-shaped substrate; (3) In the present application, by setting the transfer module including the pushing assembly, the transfer assembly and the grabbing assembly, the pushing assembly can push the strip-shaped substrates one by one into the interior of the transfer assembly, the transfer assembly can transfer the strip-shaped substrate on the upper end to one side of the second conveying module and turn over the strip-shaped substrate by 180°, then under the driving of the grabbing assembly, the cooperation work with the bearing module can be completed, which has high automation and can effectively improve the transfer efficiency of the strip-shaped substrate; (4) In the present application, by setting the bearing module including the support plate, the fixing assembly, the rotating assembly and the distance changing assembly, after the strip-shaped substrate is placed on the support plate, under the action of the fixing assembly, the strip-shaped substrate can be temporarily fixed on the support plate, so that when the strip-shaped substrate rotates with the support plate, it can also ensure that the strip-shaped substrate will not fall off from the support plate, then in the work, the angle of the strip-shaped substrate and the distance between adjacent strip-shaped substrates can be changed by cooperating with the rotating assembly and the distance changing assembly, so as to facilitate the subsequent coating work.

[0017] In summary, the device has the advantages of high processing efficiency, and is especially suitable for the chip resistor technical field. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to make the technical solution of the embodiments of the present application clearer, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0019] Figure 1 It is a schematic diagram of the overall structure of the present application.

[0020] Figure 2 It is a schematic diagram of the structure of the splitting module and the first conveying module.

[0021] Figure 3 It is a schematic diagram of the structure of the splitting module.

[0022] Figure 4 It is a schematic diagram of the structure of the splitting module. Figure 3 It is a partial enlarged schematic diagram of A in the middle.

[0023] Figure 5 It is a schematic diagram of the structure of the guiding assembly.

[0024] Figure 6 It is a schematic diagram of the structure of the guiding assembly. Figure 5 It is a partial enlarged schematic diagram of B in the middle.

[0025] Figure 7 It is a schematic diagram of the structure of the transfer module.

[0026] Figure 8 It is another schematic diagram of the structure of the transfer module.

[0027] Figure 9 It is a schematic diagram of the structure inside the clamping hole.

[0028] Figure 10 It is a schematic diagram of the structure of the grabbing assembly.

[0029] Figure 11 It is a schematic diagram of the structure of the bearing module.

[0030] Figure 12 It is a schematic diagram of the structure of the bearing module. Figure 11 It is a partial enlarged schematic diagram of C in the middle.

[0031] Figure 13 It is a schematic diagram of the structure of the strip-shaped substrate placed on the bearing module.

[0032] Figure 14 It is a sectional view of the bearing module.

[0033] Figure 15 It is a schematic diagram of the structure of the bearing module and the printing device.

[0034] Figure 16 It is a schematic diagram of the structure of the variable-distance assembly.

[0035] Figure 17 is a schematic view of the internal structure of the variable pitch assembly.

[0036] Figure 18 is another schematic view of the internal structure of the variable pitch assembly.

[0037] Figure 19 is Figure 15 is a partial enlarged view at D.

[0038] Figure 20 is a sectional view of the strip-shaped substrate.

[0039] Figure 21 is a process flow chart of the high-precision low-resistance alloy chip resistor. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings. EMBODIMENT

[0041] As Figures 1-13 shown, a manufacturing device of a new alloy chip resistor includes a segmentation module 1, a transfer module 2, and a bearing module 3. The segmentation module 1 is arranged on a first conveying module 4. The segmentation module 1 includes a cutting assembly 11 for cutting a limiting groove 120 on a resistor substrate 100, a segmentation assembly 12 for segmenting the resistor substrate 100, and a driving assembly 13 for controlling the work of the segmentation assembly 12. One side of the first conveying module 4 is further provided with the transfer module 2. The transfer module 2 includes a pushing assembly 21 arranged on the first conveying module 4, a transfer assembly 22 arranged on one side of the first conveying module 4, and a grabbing assembly 23 arranged on the upper end of a second conveying module 5. The second conveying module 5 is provided with a plurality of bearing modules 3. The bearing module 3 includes a support plate 31 matched with the limiting groove 120 and used for supporting the resistor substrate 100, a fixing assembly 32 arranged on both sides of the support plate 31 and used for fixing the strip-shaped substrate 110, a rotating assembly 33 arranged on the outer side of the fixing assembly 32, and a variable pitch assembly 34 arranged on the outer side of the rotating assembly 33. The segmentation assembly 12 segments the resistor substrate 100 into a plurality of strip-shaped substrates 110. The strip-shaped substrates 110 on the first conveying module 4 are transferred one by one to the bearing modules 3 under the driving of the transfer module 2 and are fixedly matched with the bearing modules 3. Then, the strip-shaped substrates 110 are flipped multiple times under the driving of the rotating assembly 33 and complete the multi-surface coating work of the paint in cooperation with multiple printing devices 6. The strip-shaped substrate 110 includes a face electrode 130 at the upper end, a back electrode 140 at the lower end, and two side electrodes 150 at both sides.

[0042] In the embodiment, by setting the segmentation module 1 cooperates with the transfer module 2 and the bearing module 3, in use, the segmentation module 1 will open a plurality of limiting grooves 120 on the resistance substrate 100 which cooperates with the bearing module 3, and synchronously divides the resistance substrate 100 into a plurality of strip-shaped substrates 110, then the plurality of strip-shaped substrates 110 will be transferred to the bearing module 3 under the driving of the transfer module 2, under the driving of the second conveying module 5, the bearing module 3 drives the plurality of strip-shaped substrates 110 to forwardly convey, in the process of conveying, the bearing module 3 will drive the strip-shaped substrate 110 to rotate by a certain angle, so that the position of the strip-shaped substrate 110 entering the inside of the different screen printing equipment 6 is different each time, thereby facilitating brushing different pastes on different surfaces of the strip-shaped substrate 110, after completing the paste coating work on the four surfaces of the strip-shaped substrate 110, the strip-shaped substrate 110 is sent into the oven to solidify the paste, so that the paste printing on the plurality of surfaces of the strip-shaped substrate 110 can be performed on one manufacturing equipment, and the paste on the plurality of surfaces can be solidified at one time, without the need of transferring and processing the substrate for multiple times, thereby improving the electrode processing efficiency of the chip resistor.

[0043] In detail, first, the operator or the transfer device places the resistance substrate 100 on the first conveying module 4 one by one, under the driving of the first conveying module 4, the resistance substrate 100 will move to the position of the segmentation module 1, then the cutting assembly 11 cuts the limiting groove 120 at the preset position on the resistance substrate 100, while the cutting assembly 11 is working, the cutting assembly 11 can also drive the segmentation assembly 12 to work synchronously through the driving assembly 13, thereby driving the segmentation assembly 12 to cut the resistance substrate 100, so that the resistance substrate 100 is cut and segmented at the same time, thereby improving the processing efficiency of the resistance substrate 100; Then, the strip-shaped substrate 110 which completes the cutting and segmentation work is transferred to the position of the pushing assembly 21 under the driving of the first conveying module 4, the pushing assembly 21 pushes the strip-shaped substrate 110 into the inside of the transfer assembly 22 one by one, then the transfer assembly 22 drives the strip-shaped substrate 110 to overturn by 180°, so that the strip-shaped substrate 110 moves to the position close to the second conveying module 5, finally, under the driving of the grabbing assembly 23, the strip-shaped substrate 110 is placed on the bearing module 3, and the limiting groove 120 cooperates with the support plate 31, that is, the preliminary cooperation work between the strip-shaped substrate 110 and the bearing module 3 is completed; Then, the strip-shaped substrate 110 is fixed on the support plate 31 under the action of the fixing assembly 32, and the angle of the strip-shaped substrate 110 and the distance between adjacent strip-shaped substrates 110 are changed under the driving of the rotating assembly 33 and the distance changing assembly 34, so as to facilitate the subsequent coating work.

[0044] Further, as Figures 2-4As shown, the cutting assembly 11 comprises a workbench 111 arranged at the upper end of the first conveying module 4, a horizontal guide rail 112 fixedly arranged at the upper end of the workbench 111, a moving unit 113 translating on the horizontal guide rail 112, and a laser cutting unit 114 fixedly arranged on the moving unit 113; the dividing assembly 12 comprises a support frame 121, a plurality of fixed rods 122 fixedly arranged between the support frame 121 and the first conveying module 4, and a dividing knife 123 slidingly arranged on the fixed rods 122; the driving assembly 13 comprises a first driving rack 131 fixedly connected with the moving unit 113, a first driving gear 132 drivingly arranged with the first driving rack 131 and rotatingly arranged on the workbench 111, a first bevel gear 133 coaxially arranged with the first driving gear 132, a second bevel gear 135 cooperatively arranged with the first bevel gear 133 and rotatingly arranged inside a support box 134, a second driving gear 136 coaxially arranged with the second bevel gear 135, and a second driving rack 137 drivingly arranged with the second driving gear 136 and fixedly connected with the dividing knife 123 at the other end, and the support box 134 is fixedly arranged on the first conveying module 4.

[0045] In the embodiment, by arranging the cutting assembly 11 cooperating with the dividing assembly 12 and the driving assembly 13, the resistance substrate 100 can be cut and divided at the same time, thereby improving the processing efficiency of the resistance substrate 100.

[0046] In detail, when the resistance substrate 100 is conveyed to the lower end of the cutting assembly 11 and the dividing assembly 12, the moving unit 113 on the workbench 111 works and drives the laser cutting unit 114 to move on the horizontal guide rail 112, at the same time, the laser cutting unit 114 works and radiates the required limiting groove 120 on the resistance substrate 100, and the moving unit 113 also works to drive the first driving rack 131 to move synchronously, the first driving rack 131 moves to drive the first driving gear 132 to rotate synchronously, the first driving gear 132 rotates to drive the first bevel gear 133 to rotate and further drive the second bevel gear 135 to rotate, the second driving gear 136 coaxially arranged with the second bevel gear 135 rotates to drive the second driving rack 137 to move in the vertical direction and further drive the dividing knife 123 to vertically slide on the fixed rods 122, and the horizontal reciprocating work of the moving unit 113 can synchronously drive the vertical reciprocating movement of the dividing knife 123, thereby realizing the dividing work of the resistance substrate 100.

[0047] Further, as shown in FIG. 2, the cutting assembly 11 comprises a laser cutting unit 114, the laser cutting unit 114 comprises a laser cutting head 1141, a laser cutting head 1142, a laser cutting head 1143, a laser cutting head 1144, a laser cutting head 1145, a laser cutting head 1146, a laser cutting head 1147, a laser cutting head 1148, a laser cutting head 1149, and a laser cutting head 1140. Figures 5-6As shown, the first conveying module 4 is further provided with a guiding assembly 41, so that the multiple strip-shaped substrates 110 are arranged in order, which comprises longitudinal guiding plates 411 and transverse guiding plates 412, the longitudinal guiding plates 411 are fixedly arranged on the first conveying module 4 through a plurality of connecting rods 413, and the cross section of the longitudinal guiding plates 411 is L-shaped; the transverse guiding plates 412 are arranged at positions corresponding to the pushing assembly 21, and the lower end of the transverse guiding plates 412 is further provided with a plurality of guiding rollers 414 matched with the strip-shaped substrates 110.

[0048] In the embodiment, by arranging the guiding assembly 41, after the resistance substrate 100 is divided into multiple strip-shaped substrates 110, the strip-shaped substrates 110 after being divided still maintain the initial position under the action of the guiding assembly 41, and the position will not change at will, so as to facilitate the subsequent transfer work of the strip-shaped substrates 110.

[0049] In detail, when the resistance substrate 100 is divided, that is, the strip-shaped substrate 110 after being divided has been advanced into the inside of the longitudinal guiding plates 411, the cross section of the longitudinal guiding plates 411 is L-shaped, and by arranging two groups of longitudinal guiding plates 411, the strip-shaped substrate 110 can be limited along the length direction, at the same time, the upper end of the L-shaped longitudinal guiding plates 411 will shield part of the strip-shaped substrate 110, so that even if the strip-shaped substrate 110 is divided, the position of the strip-shaped substrate 110 will not change under the limiting action of the longitudinal guiding plates 411, and then the strip-shaped substrate 110 will continue to be conveyed forward under the driving of the first conveying module 4. When the strip-shaped substrate 110 moves to the position of the pushing assembly 21, the pushing assembly 21 pushes the strip-shaped substrate 110 to move, and under the action of the multiple guiding rollers 414, it can be ensured that the strip-shaped substrate 110 is stably pushed forward.

[0050] It should be noted that in order to ensure that the dividing knife 123 can smoothly cut the resistance substrate 100 completely, the longitudinal guiding plates 411 are provided with a gap 4111 for the dividing knife 123 to pass through at the position corresponding to the dividing knife 123.

[0051] Further, as shown in FIG. 4, the gap 4111 is arranged at the position corresponding to the dividing knife 123, so that the dividing knife 123 can pass through the gap 4111 to cut the resistance substrate 100. Figures 7-9As shown, the pushing assembly 21 comprises a telescopic unit 211 arranged on one side of the first conveying module 4 and a pushing plate 212 connected with the telescopic unit 211 and used for pushing the strip-shaped substrate 110 into the inside of the clamping hole 222; the transferring assembly 22 comprises a storage tray 221 arranged between the first conveying module 4 and the second conveying module 5, a plurality of clamping holes 222 opened in the inside of the storage tray 221, clamping plates 223 arranged oppositely in the inside of the clamping hole 222, compression springs 224 having one end connected with the clamping plates 223 and the other end fixed in the inside of the clamping hole 222, and a driving unit 225 used for driving the storage tray 221 to rotate.

[0052] In this embodiment, by arranging the pushing assembly 21 cooperating with the transferring assembly 22, the pushing assembly 21 can push the strip-shaped substrates 110 into the inside of the transferring assembly 22 one by one, and the transferring assembly 22 can transfer the strip-shaped substrate 110 on the upper end to one side of the second conveying module 5 and turn over the strip-shaped substrate 110 by 180°, so as to facilitate the cooperation between the strip-shaped substrate 110 and the bearing module 3.

[0053] In detail, first, the telescopic unit 211 works and drives the pushing plate 212 to move, the pushing plate 212 continues to drive the strip-shaped substrate 110 to push forward after contacting one end of the strip-shaped substrate 110, until the strip-shaped substrate 110 enters the inside of the clamping hole 222, after entering the inside of the clamping hole 222, the strip-shaped substrate 110 will extrude the two clamping plates 223 and extend between the two clamping plates 223, then the two clamping plates 223 drive the compression springs 224 to compress, so that the strip-shaped substrate 110 is stably clamped between the two clamping plates 223, after completing the pushing and clamping work, the telescopic unit 211 resets, then the driving unit 225 works and drives the storage tray 221 to rotate, thereby driving the strip-shaped substrate 110 to rotate.

[0054] It should be noted that the cross section of the pushing plate 212 is also L-shaped, the upper end of the pushing plate 212 covers part of the strip-shaped substrate 110, so that the position of the strip-shaped substrate 110 can be prevented from deviating when the strip-shaped substrate 110 is pushed; In order to ensure that the strip-shaped substrate 110 can smoothly enter between the two clamping plates 223, a round corner is arranged at the outer end of the clamping plate 223.

[0055] Further, as shown in the figure, Figure 10 The grabbing assembly 23 is used for transferring the strip-shaped substrate 110 in the clamping hole 222 to the bearing module 3, which comprises two shaft moving trusses 231 arranged on the upper end of the second conveying module 5 and electric clamping jaws 232 arranged on the two shaft moving trusses 231 and used for clamping the strip-shaped substrate 110.

[0056] In this embodiment, by setting up a gripping component 23 in conjunction with a pushing component 21 and a transfer component 22, the gripping component 23 can complete the cooperation between the strip substrate 110 and the support module 3. The automation level is high, which can effectively improve the transfer efficiency of the strip substrate 110. During operation, the electric gripper 232 approaches the strip substrate 110 under the drive of the two-axis moving truss 231. Then, the electric gripper 232 clamps the strip substrate 110. The two-axis moving truss 231 moves horizontally, causing the strip substrate 110 to disengage from the clamping hole 222. Then, the two-axis moving truss 231 drives the electric gripper 232 and the strip substrate 110 to the position of the support module 3. When the limiting groove 120 on the strip substrate 110 cooperates with the support plate 31, the electric gripper 232 can be released. Finally, the two-axis moving truss 231 drives the electric gripper 232 again to perform the next operation. The two-axis moving truss 231 and the electric gripper 232 are existing technologies well known to those skilled in the art, and their specific structures will not be described in detail here.

[0057] Furthermore, such as Figures 11-14 As shown, the fixing component 32 mainly includes a fixing block 321, a sliding block 322, and a clamping block 324. The fixing block 321 is fixedly connected to the support plate 31. The sliding block 322 is slidably disposed on the fixing block 321, and a buffer spring 323 is provided between the sliding block 322 and the fixing block 321. The upper end of the sliding block 322 is curved. A slide rail 325 is fixedly disposed on the upper end of the fixing block 321. The clamping block 324 is slidably disposed on the slide rail 325. One end of the clamping block 324 is rotatably connected to a first threaded rod 326. The other end of the first threaded rod 326 is threadedly connected to the fixing block 321 and connected to a first gear 327. The fixing block 321 has a groove 3211 at the position corresponding to the first gear 327. The second conveying module 5 is provided with several sets of first racks 51 that cooperate with the first gear 327.

[0058] In this embodiment, by setting the fixing component 32 in conjunction with the support plate 31, the strip substrate 110 placed on the support plate 31 can be effectively fixed and clamped.

[0059] In detail, when the gripping component 23 places the strip substrate 110 on the upper end of the support plate 31, the strip substrate 110 first squeezes the sliding block 322 and drives the sliding block 322 to squeeze the buffer spring 323 until the limiting groove 120 on the strip substrate 110 is fully engaged with the support plate 31. Subsequently, in order to further improve the fixing effect of the fixing component 32 on the strip substrate 110, the second conveying module 5 will drive the bearing module 3 and the upper strip substrate 110 to move forward. During the movement, the first gear 327 on the fixing component 32 will contact the first rack 51. The first rack 51 will drive the first gear 327 to rotate, thereby driving the first threaded rod 326 to perform threaded transmission inside the fixing block 321. Therefore, the first threaded rod 326 will drive the pressing block 324 to gradually approach the sliding block 322 and the sliding block 322 to squeeze, so as to improve the supporting effect of the sliding block 322 on the strip substrate 110.

[0060] It should be noted that the depth of the limiting groove 120 is the same as the thickness of the support plate 31. This setting can prevent the height of the support plate 31 from being higher than the strip substrate 110, which is beneficial to the subsequent screen printing work. The clamping block 324 is rotatably connected to the end of the first threaded rod 326. When the first threaded rod 326 rotates, one end of it that extends into the clamping block 324 will rotate inside the clamping block 324 and will not disengage from the clamping block 324. Therefore, when the first threaded rod 326 rotates, it can drive the clamping block 324 to slide horizontally on the slide rail 325. The second conveying module 5 is provided with at least two sets of first racks 51, which can drive the first gear 327 to rotate in opposite directions (therefore, the two sets of first racks 51 can be respectively arranged on the upper and lower sides of the first gear 327). If one set of first racks 51 is arranged before entering the printing equipment 6, the other set of first racks 51 should be arranged after all printing and drying work is completed, so as to facilitate the removal of the strip substrate 110 after the electrode covering work is completed.

[0061] Furthermore, such as Figures 12-14 As shown, the rotating assembly 33 includes a rotating shaft 331 fixedly connected to the fixed block 321, a second gear 332 fixedly disposed on the outside of the rotating shaft 331, and a support block 333 connected to the rotating shaft 331 and disposed on the second conveying module 5; The second conveying module 5 is provided with several sets of second racks 52 that cooperate with the second gear 332.

[0062] In this embodiment, the rotating component 33, in conjunction with the fixing component 32, can drive the strip substrate 110 to rotate, so as to facilitate the coating work on different surfaces.

[0063] In detail, similar to the driving mode of the first gear 327 in the fixing assembly 32 and the first rack 51, when the second conveying module 5 drives the bearing module 3 and the upper strip-shaped substrate 110 to move forward, the second gear 332 will contact the second rack 52, the second rack 52 will drive the second gear 332 to rotate and further drive the rotating shaft 331 to rotate, and the rotating shaft 331 will drive the fixed block 321 to rotate and further drive the strip-shaped substrate 110 to rotate, wherein the rotating shaft 331 is rotatably connected with the support block 333.

[0064] It should be noted that correspondingly, the second conveying module 5 is provided with a plurality of groups of second racks 52, so that the strip-shaped substrate 110 can be rotated by a certain angle before entering different printing devices 6.

[0065] Further, as shown in Figures 15-19 the distance changing assembly 34 includes a guide unit 341, a distance changing unit 342, and a control unit 343. The guide unit 341 includes an upper top plate 3411, a guide rail 3412 fixedly arranged at the lower end of the upper top plate 3411, a plurality of sliding blocks 3413 slidingly arranged on the guide rail 3412, and a guide rod 3414 arranged on the sliding blocks 3413. The distance changing unit 342 includes a sliding plate 3421 slidingly arranged at the lower end of the upper top plate 3411 and provided with a plurality of distance changing grooves 34211, a distance changing rod 3422 arranged at one end of the distance changing grooves 34211 and fixedly connected with the support block 333 at the other end, and a lower bottom plate 3423 fixedly arranged on the second conveying module 5. The distance changing rod 3422 is further fixedly connected with the guide rod 3414 at the end extending into the distance changing grooves 34211, and is slidingly arranged on the lower bottom plate 3423. The control unit 343 includes a second threaded rod 3431 rotatably arranged at the lower end of the upper top plate 3411, a connecting block 3432 drivingly arranged with the second threaded rod 3431 and fixedly connected with the sliding plate 3421, and a third gear 3433 fixedly arranged at one end of the second threaded rod 3431. The second conveying module 5 is provided with a plurality of groups of third racks 53 cooperating with the third gear 3433.

[0066] In this embodiment, by arranging the distance changing assembly 34, the fixing assembly 32 of the support plate 31, and the rotating assembly 33, after the strip-shaped substrate 110 is placed on the support plate 31, the distance changing assembly 34 can change the distance between adjacent strip-shaped substrates 110, so as to facilitate subsequent coating work.

[0067] In detail, when printing the strip-shaped substrate 110, usually a plurality of strip-shaped substrates 110 are set as a group to be printed (in this embodiment, eight strip-shaped substrates 110 are set as a group), and after the eight strip-shaped substrates 110 are all matched with the bearing module 3, the group of strip-shaped substrates 110 can proceed to the next printing process. When printing the front electrode 130 or the back electrode 140 of the strip-shaped substrate 110, since the upper surface or the lower surface of the adjacent two strip-shaped substrates 110 is coated with paste, it is better to set the side surfaces of the eight groups of strip-shaped substrates 110 close to each other before coating. Therefore, when the second conveying module 5 drives the variable-distance assembly 34 and the strip-shaped substrate 110 to move, first, the third gear 3433 contacts the third rack 53 and rotates by a certain angle. During the rotation, the third gear 3433 drives the second threaded rod 3431 to rotate, and the connecting block 3432 on the second threaded rod 3431 slides and synchronously drives the sliding plate 3421 to slide along the axis direction of the threaded rod. When the sliding plate 3421 slides, the plurality of variable-distance rods 3422 arranged in the variable-distance groove 34211 move close to each other, thereby driving the plurality of supporting blocks 333 to move close to each other until the supporting blocks 333 drive the plurality of groups of strip-shaped substrates 110 to be close to each other. After the strip-shaped substrate 110 completes the printing work on one side, it needs to be rotated by a certain angle for printing work on the other side. Therefore, when the strip-shaped substrate 110 rotates, the plurality of strip-shaped substrates 110 need to move away from each other to reserve space for rotation. At this time, another group of third racks 53 can drive the third gear 3433 to reverse, thereby achieving the purpose. Embodiment

[0068] As shown in Figure 1 , Figure 20 , wherein the same or corresponding parts as in Embodiment One are denoted by the same reference numerals as in Embodiment One, and for the sake of simplicity, only the differences from Embodiment One will be described below. The difference between this embodiment and Embodiment One is that: Further, four groups of printing devices 6 and drying devices 7 are arranged on the second conveying module 5.

[0069] In detail, when entering the first group of printing devices 6, the front surface of the strip-shaped substrate 110 is printed to complete the printing work of the front electrode 130. Before entering the printing device 6, the third gear 3433 contacts the third rack 53 and rotates to make the plurality of strip-shaped substrates 110 close to each other. After passing through the first set of printing equipment 6 and before entering the second set of printing equipment 6, the third gear 3433 will contact another third rack 53 and rotate to make the multiple strip substrates 110 move away from each other. Then the second gear 332 will contact the second rack 52 and rotate 180° so that the back of the strip substrate 110 faces upward. Then the third gear 3433 will contact the third rack 53 again and rotate to make the multiple strip substrates 110 stick together again. When entering the second set of printing equipment 6, the printing of the back electrode 140 is completed. Subsequently, before entering the third printing equipment 6, the third gear 3433 will contact another third rack 53 and rotate to make the multiple strip substrates 110 move away from each other. The second gear 332 will contact the second rack 52 again and rotate 90°. At this time, one side of the strip substrate 110 faces upward and the printing of the side electrode 150 is completed in the third printing equipment 6. Finally, before entering the fourth printing equipment 6, the second gear 332 will contact the second rack 52 again and rotate 180°, so that the other side of the strip substrate 110 faces upward, and the printing work of the other side electrode 150 is completed in the fourth printing equipment 6. After the coating printing work of the four sides is completed, these strip substrates 110 will enter the drying equipment 7 for drying.

[0070] It should be noted that in this invention, the surface electrode 130 is mainly composed of silver (Ag) or silver-palladium (Ag / Pd) paste, which is sintered at high temperature. It has good adhesion and excellent conductivity with the strip substrate 110 (ceramic substrate) and the resistive film. The back electrode 140 is silver (Ag) paste, and the side electrode 150 is nickel-chromium (Ni / Cr) paste. Example

[0071] like Figure 21 As shown, the present invention also provides a manufacturing method for an alloy chip resistor manufacturing equipment, comprising the following steps: Step 1: Grooving and dividing process. The dividing module 1 will open multiple limiting grooves 120 on the resistor substrate 100 to cooperate with the carrier module 3, and simultaneously divide the resistor substrate 100 into several strip substrates 110. Step 2: Transfer process, several strip substrates 110 will be transferred to the carrier module 3 under the drive of the transfer module 2; Step 3: Fixing process. After the strip substrate 110 is placed on the support plate 31, the strip substrate 110 is fixed on the support plate 31 under the action of the fixing component 32. Step four: the strip-shaped substrate 110 is moved forward along the second conveying module 5, the rotating assembly 33 and the distance changing assembly 34 are used to change the rotating angle of the strip-shaped substrate 110 and the distance between adjacent strip-shaped substrates 110, and the printing device 6 is used to complete the brushing work of the paste.

[0072] In the description of the present application, it should be understood that the terms "front", "rear", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or component referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0073] Of course, in the present technical solution, those skilled in the art should understand that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of one element can be one, and in another embodiment, the number of the element can be multiple, and the term "one" cannot be understood as a limitation on the number.

[0074] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any changes or replacements that can be easily thought of by those skilled in the art under the technical hints of the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A novel apparatus for manufacturing alloy chip resistors, characterized in that, include: A segmentation module is disposed on a first conveying module. The segmentation module includes a cutting component for cutting a limiting groove on a resistor substrate, a segmentation component for segmenting the resistor substrate, and a driving component for controlling the operation of the segmentation component. The transfer module is provided on one side of the first conveying module. The transfer module includes a pushing component on the first conveying module, a transfer component on one side of the first conveying module, and a gripping component on the upper end of the second conveying module. The second conveying module is provided with a plurality of carrying modules. Each carrying module includes a support plate that cooperates with the limiting groove and is used to support the resistor substrate, a fixing component disposed on both sides of the support plate and used to fix the strip substrate, a rotating component disposed on the outside of the fixing component, and a pitch-changing component disposed on the outside of the rotating component. The segmentation component divides the resistor substrate into several strip substrates. The strip substrates on the first conveying module are transferred one by one to the carrier module and fixedly engaged with the carrier module under the drive of the transfer module. Subsequently, the strip substrates are flipped multiple times under the drive of the rotating component and cooperate with multiple printing devices to complete the multi-sided coating of the paint.

2. The manufacturing apparatus for a novel alloy chip resistor according to claim 1, characterized in that, The cutting assembly includes a worktable disposed on the upper end of the first conveying module, a horizontal guide rail fixedly disposed on the upper end of the worktable, a moving unit that moves horizontally on the horizontal guide rail, and a laser cutting unit fixedly disposed on the moving unit. The segmentation component includes a support frame, several fixed rods fixedly disposed between the support frame and the first conveying module, and a segmentation blade slidably disposed on the fixed rods; The drive assembly includes a first drive rack fixedly connected to the moving unit, a first drive gear rotatably mounted on the worktable and driven by the first drive rack, a first bevel gear coaxially mounted with the first drive gear, a second bevel gear rotatably mounted inside the support housing and cooperating with the first bevel gear, a second drive gear coaxially mounted with the second bevel gear, and a second drive rack driven by the second drive gear and whose other end is fixedly connected to the dividing blade. The support housing is fixedly mounted on the first conveying module.

3. The manufacturing apparatus for a novel alloy chip resistor according to claim 1, characterized in that, The first conveying module is also provided with a guiding component, which arranges the multiple strip substrates that have been cut into sections neatly, including: A longitudinal guide plate is fixedly mounted on the first conveying module by a plurality of connecting rods, and the cross-section of the longitudinal guide plate is L-shaped. A transverse guide plate is provided at a position corresponding to the pusher assembly, and a plurality of guide rollers that cooperate with the strip substrate are provided at the lower end of the transverse guide plate.

4. The manufacturing apparatus for a novel alloy chip resistor according to claim 1, characterized in that, The pushing assembly includes a telescopic unit disposed on one side of the first conveying module and a push plate connected to the telescopic unit for pushing the strip substrate into the clamping hole. The transfer assembly includes a storage tray disposed between the first conveying module and the second conveying module, a plurality of clamping holes formed inside the storage tray, clamping plates disposed inside the clamping holes and arranged opposite to each other, a compression spring having one end connected to the clamping plate and the other end fixed inside the clamping hole, and a drive unit for driving the storage tray to rotate.

5. The manufacturing apparatus for a novel alloy chip resistor according to claim 4, characterized in that, The gripping assembly is used to transfer the strip substrate located inside the clamping hole to the carrier module. It includes a two-axis moving truss disposed at the upper end of the second conveying module and an electric gripper disposed on the two-axis moving truss for clamping the strip substrate.

6. The manufacturing apparatus for a novel alloy chip resistor according to claim 5, characterized in that, The fixing component includes: The fixing block is fixedly connected to the support plate; A sliding block is slidably mounted on the fixed block, and a buffer spring is provided between the sliding block and the fixed block. The upper end of the sliding block is curved. The clamping block has a slide rail fixedly mounted on its upper end. The clamping block is slidably mounted on the slide rail. One end of the clamping block is rotatably connected to a first threaded rod. The other end of the first threaded rod is threadedly driven to the fixing block and connected to a first gear. The fixing block has a groove at a position corresponding to the first gear.

7. The manufacturing apparatus for a novel alloy chip resistor according to claim 6, characterized in that, The rotating assembly includes a rotating shaft fixedly connected to the fixed block, a second gear fixedly disposed on the outside of the rotating shaft, and a support block connected to the rotating shaft and disposed on the second conveying module.

8. The manufacturing apparatus for a novel alloy chip resistor according to claim 1, characterized in that, The pitch control component includes: The guide unit includes an upper top plate, a guide rail fixedly installed at the lower end of the upper top plate, a plurality of sliders slidably installed on the guide rail, and a guide rod installed on the sliders; The pitch unit includes a sliding plate that is slidably disposed at the lower end of the upper top plate and has several pitch grooves, a pitch rod that is disposed at one end inside the pitch groove and fixedly connected to the support block at the other end, and a lower bottom plate that is fixedly disposed on the second conveying module. The end of the pitch rod that extends into the pitch groove is also fixedly connected to the guide rod. The control unit includes a second threaded rod rotatably disposed at the lower end of the upper top plate, a connecting block that is driven by the second threaded rod and fixedly connected to the sliding plate, and a third gear fixedly disposed at one end of the second threaded rod.

9. The manufacturing apparatus for a novel alloy chip resistor according to claim 3, characterized in that, The second conveying module is provided with several sets of first racks, second racks and third racks that respectively cooperate with the first gear, the second gear and the third gear.

10. The manufacturing method of the alloy chip resistor manufacturing equipment according to any one of claims 1-9, characterized in that, Includes the following steps: Step 1: Grooving and Segmentation Process. The segmentation module will open multiple limiting grooves on the resistor substrate to cooperate with the carrier module, and simultaneously divide the resistor substrate into several strip substrates. Step 2: Transfer process, where several strip substrates are transferred to the carrier module by the transfer module; Step 3: Fixing process. After the strip substrate is placed on the support plate, it is fixed to the support plate by the fixing components. Step 4: Coating process. As the strip substrate moves forward with the second conveyor module, the rotation angle of the strip substrate and the distance between adjacent strip substrates are changed in conjunction with the rotating component and the pitch-changing component, and the printing equipment completes the coating of the paste.

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