Box-packed packaging laser

Abstract

The invention relates to a box-packed laser which comprises a bottom plate, a mounting platform deck, a heat sink and a laser chip in sequence from bottom to top, a fixing seat is mounted at the top of the mounting platform deck and located on one side of the heat sink, a collimating lens is mounted at the top of the fixing seat, and a cofferdam frame is fixedly mounted at the top of the bottom plate and located on the outer side of the mounting platform deck. A glass window is mounted on the side wall of the cofferdam frame, a top cover is mounted at the top of the cofferdam frame, an insulating layer is mounted at the top of the top cover, two outer contact plates are mounted at the top of the insulating layer, and conductive columns are mounted at the bottoms of the two outer contact plates; a first conductive layer and a second conductive layer are fixedly mounted at the top of the heat sink, the laser chip is located at the top of the first conductive layer, and a conductive wire extending to the top of the second conductive layer is mounted at the top of the laser chip; and the bottoms of the two conductive columns are respectively contacted with the tops of the first conductive layer and the second conductive layer. The box-packed packaged laser has the advantages of being small in occupied installation space, convenient to connect with an external circuit, high in heat dissipation performance and the like.

Description

Technical Field

[0001] This invention relates to the field of laser technology, specifically to a box-packaged laser. Background Technology

[0002] Since the advent of lasers, their applications in various fields have been extensive. However, with the continuous increase in the output power of high-power laser equipment, weight and size have become key issues restricting its application and development. Currently, high-power laser equipment still prioritizes increasing output power, and its complex structure and low energy conversion efficiency hinder the miniaturization and weight reduction of high-power laser equipment.

[0003] Most existing laser packages use pins for connecting external circuits, such as TO packages and butterfly packages, which occupy a large installation space. A few substrate-type and box-type packages do not use external pins. Generally, the power connection points for these pinless packages are fabricated on the bottom surface of the chip mounting platform. Although this method occupies less installation space, the heat dissipation of the entire laser relies on the chip mounting platform to conduct heat downwards, making it difficult to simultaneously provide sufficient space for laser wiring and establish a good heat dissipation path. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a box-packaged laser with advantages such as small installation space occupation, easy external circuit connection, and strong heat dissipation performance.

[0005] This invention provides the following technical solution: A box-packaged laser includes a base plate, a mounting platform fixedly mounted on the top of the base plate, a heat sink fixedly mounted on the top of the mounting platform, a laser chip fixedly mounted on the top of the heat sink, a mounting base fixedly mounted on the top of the mounting platform and to one side of the heat sink, a collimating lens fixedly mounted on the top of the mounting base, a cofferdam frame fixedly mounted on the top of the base plate and to the outside of the mounting platform, a glass window fixedly mounted on the inner side wall of the cofferdam frame near the mounting base, a top cover fixedly mounted on the top of the cofferdam frame, an insulating layer fixedly mounted on the top of the top cover, two outer contact plates fixedly mounted on the top of the insulating layer, and conductive posts extending to the top of the heat sink fixedly mounted on the bottom of each of the two outer contact plates; a first conductive layer and a second conductive layer fixedly mounted on the top of the heat sink, the laser chip located on the top of the first conductive layer, and a conductive wire extending to the top of the second conductive layer fixedly mounted on the top of the laser chip; the bottoms of the two conductive posts are in contact with the tops of the first and second conductive layers, respectively.

[0006] Furthermore, both the top and bottom surfaces of the base plate are chamfered rectangles. The width of the top surface of the base plate is the same as the width of the bottom surface of the cofferdam frame, and the length of the top surface of the base plate is greater than the length of the bottom surface of the cofferdam frame. The cofferdam frame is installed in the middle of the base plate, and the left and right sides of the base plate can be exposed on the outside of the cofferdam frame. The cofferdam frame serves a sealing and supporting function.

[0007] Furthermore, the base plate has two threaded holes on its diagonal sides that penetrate the bottom and top surfaces, and two positioning holes on its other diagonal side that penetrate the bottom and top surfaces. The threaded holes and positioning holes are provided diagonally, so that during installation, simple snap-fit ​​fixing can be performed first through the positioning holes, and then screws can be added through the threaded holes for further fixing, which facilitates the expansion installation of the bottom surface of the base plate.

[0008] Furthermore, both the top and bottom surfaces of the base plate are rectangular, and the top surface of the base plate has the same length and width as the bottom surface of the cofferdam frame. The overall laser device is small in size and requires less installation space.

[0009] Furthermore, the base plate has four fixing holes inside, each located at the bottom of the assembled cofferdam frame, and each fixing hole has a thread, allowing for the expansion and installation of the bottom surface of the base plate through the threads in the fixing holes.

[0010] Furthermore, the bottom inner side of the cofferdam frame is provided with a snap-fit ​​groove that is compatible with the installation platform, and the bottom surface of the cofferdam frame is fixedly connected to the top surface of the base plate by welding.

[0011] Furthermore, a through-hole is provided in the side wall of the cofferdam frame near the fixed seat. The shape of the through-hole is geometric, and the glass window is fixed in the through-hole by sintering.

[0012] Furthermore, the top of the cofferdam frame is provided with an installation groove that matches the top cover, and the cofferdam frame and the top cover are connected by welding.

[0013] Furthermore, the inner side of the top cover has two through holes, and the two through holes are respectively fixedly connected to the corresponding conductive posts through a sintered insulating layer. The area of ​​the insulating layer is greater than the sum of the areas of the two outer contact plates. The two outer contact plates do not contact each other, and the insulating layer serves as an insulating gap between the two outer contact plates and the top cover.

[0014] Furthermore, a solder layer is provided on the top of the first conductive layer, and the top surface of the solder layer is fixedly connected to the bottom surface of the laser chip. There is a gap between the first conductive layer and the second conductive layer, and the gap is at least greater than 0.1 mm. This prevents the gold-tin solder from crawling out during the eutectic process of the laser chip and causing the two conductive layers to conduct, thereby improving the packaging yield. The area of ​​the first conductive layer is greater than the area of ​​the second conductive layer.

[0015] Compared with the prior art, the present invention provides a box-packaged laser with the following advantages: 1. This box-packaged laser, by setting a first conductive layer and a second conductive layer, has a laser chip mounted on the top of the first conductive layer. A conductive line extending to the top of the second conductive layer is fixedly mounted on the top of the laser chip. A combination of two outer contact plates and conductive pillars is set. The bottom of the two conductive pillars contacts the top of the first and second conductive layers respectively, leading the positive and negative electrodes of the laser chip to the outer shell of the laser package. Compared with the pin electrode method, it occupies less installation space.

[0016] 2. This box-packaged laser provides reserved space for wiring operations above the laser by placing two external contact plates on the top of the top cover, which facilitates the connection of external circuits and does not affect the heat dissipation path on the bottom of the laser.

[0017] 3. This boxed laser is packaged with two different sizes and shapes of base plates, each with threaded holes, positioning holes, or fixing holes. This facilitates the expansion and installation of the laser base plate, improves the tight contact between the laser base plate and the heat dissipation structure, enhances the laser's heat dissipation performance, and the multiple base plate structures can adapt to the light source installation space requirements of more laser equipment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a box-packaged laser according to the present invention; Figure 2 This is a perspective view of a circular light-transmitting hole structure used in a box-packaged laser according to the present invention; Figure 3 This is a perspective view of a box-packaged laser using a square light-transmitting hole according to the present invention; Figure 4 This is a schematic diagram of another box-packaged laser according to the present invention; Figure 5 This is a perspective view of another box-packaged laser using a circular light-transmitting hole structure according to the present invention; Figure 6 This is a perspective view of another type of box-packaged laser using a square light-transmitting hole structure according to the present invention.

[0019] In the diagram: 1 base plate, 2 mounting platform, 3 heat sink, 4 laser chip, 5 conductive wire, 6 mounting base, 7 collimating lens, 8 cofferdam frame, 9 glass window, 10 top cover, 11 insulation layer, 12 contact plate, 13 conductive post, 31 first conductive layer, 32 second conductive layer, 101 threaded hole, 101' fixing hole, 102 positioning hole. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figure 1-2 A box-packaged laser includes a base plate 1, a mounting platform 2 fixedly mounted on the top of the base plate 1, a heat sink 3 fixedly mounted on the top of the mounting platform 2, a laser chip 4 fixedly mounted on the top of the heat sink 3, a mounting base 6 fixedly mounted on the top of the mounting platform 2 and to the right of the heat sink 3, a collimating lens 7 fixedly mounted on the top of the mounting base 6, and a cofferdam frame 8 fixedly mounted on the top of the base plate 1 and outside the mounting platform 2. The right side wall of the cofferdam frame 8 (see...) Figure 1 A glass window 9 is fixedly installed inside the right side of the dam frame 8. A top cover 10 is fixedly installed on the top of the top cover 10. An insulation layer 11 is fixedly installed on the top of the insulation layer 11. Two outer contact plates 12 are fixedly installed on the top of the insulation layer 11. A conductive post 13 extending to the top of the heat sink 3 is fixedly installed at the bottom of each of the two outer contact plates 12. A first conductive layer 31 and a second conductive layer 32 are fixedly installed on the top of the heat sink 3. The laser chip 4 is located on top of the first conductive layer 31, and a conductive line 5 extending to the top of the second conductive layer 32 is fixedly installed on the top of the laser chip 4.

[0022] The bottoms of the two conductive pillars 13 are in contact with the tops of the first conductive layer 31 and the second conductive layer 32, respectively.

[0023] In this embodiment, the top and bottom surfaces of the base plate 1 are both rectangular with chamfers. The width of the top surface of the base plate 1 is the same as the width of the bottom surface of the cofferdam frame 8, and the length of the top surface of the base plate 1 is greater than the length of the bottom surface of the cofferdam frame 8. The cofferdam frame is installed in the middle of the base plate, and the left and right sides of the base plate can be exposed on the outside of the cofferdam frame.

[0024] In this embodiment, two threaded holes 101 are provided on the diagonal of the base plate 1, penetrating the bottom and top surfaces of the base plate 1. Two positioning holes 102 are provided on the other diagonal of the base plate 1, penetrating the bottom and top surfaces of the base plate 1. The threaded holes and positioning holes are provided in a diagonal manner. During installation and fixing, simple snap-fit ​​fixing can be performed first through the positioning holes, and then screw fixing can be added through the threaded holes, which facilitates the expansion installation of the bottom surface of the base plate.

[0025] In this embodiment, the bottom inner side of the cofferdam frame 8 is provided with a snap-fit ​​groove that is compatible with the mounting platform 2, and the bottom surface of the cofferdam frame 8 is fixedly connected to the top surface of the base plate 1 by welding.

[0026] In this embodiment, a through-hole is provided inside the right side wall of the cofferdam frame 8. The through-hole is circular in shape, and the glass window 9 is fixed inside the through-hole by sintering.

[0027] In this embodiment, the top of the cofferdam frame 8 is provided with an installation groove that matches the top cover 10, and the cofferdam frame 8 and the top cover 10 are connected by welding.

[0028] In this embodiment, the inner side of the top cover 10 has two through holes. The two through holes are respectively fixedly connected to the corresponding conductive post 13 through a sintered insulating layer 11. The area of ​​the insulating layer 11 is greater than the sum of the areas of the two outer contact plates 12. The two outer contact plates 12 do not contact each other. The insulating layer 11 serves as an insulating gap between the two outer contact plates 12 and the top cover 10.

[0029] In this embodiment, a solder layer is provided on the top of the first conductive layer 31. The top surface of the solder layer is fixedly connected to the bottom surface of the laser chip 4. There is a gap in the middle of the first conductive layer 31 and the second conductive layer 32. The gap is at least greater than 0.1 mm to prevent the gold-tin solder from crawling out during the eutectic process of the laser chip and causing the two conductive layers to conduct, thereby improving the packaging yield. The area of ​​the first conductive layer 31 is greater than the area of ​​the second conductive layer 32.

[0030] Example 2 Please see Figure 1 and Figure 3 Except for the square light-transmitting hole inside the right side wall of the cofferdam frame 8, it is the same as in Example 1.

[0031] Example 3 Please see Figure 4-5 A box-packaged laser includes a base plate 1, a mounting platform 2 fixedly mounted on the top of the base plate 1, a heat sink 3 fixedly mounted on the top of the mounting platform 2, a laser chip 4 fixedly mounted on the top of the heat sink 3, a mounting base 6 fixedly mounted on the top of the mounting platform 2 and to the right of the heat sink 3, a collimating lens 7 fixedly mounted on the top of the mounting base 6, a cofferdam frame 8 fixedly mounted on the top of the base plate 1 and to the outside of the mounting platform 2, a glass window 9 fixedly mounted inside the right side wall of the cofferdam frame 8, a top cover 10 fixedly mounted on the top of the cofferdam frame 8, an insulating layer 11 fixedly mounted on the top of the top cover 10, two outer contact plates 12 fixedly mounted on the top of the insulating layer 11, and conductive posts 13 extending to the top of the heat sink 3 fixedly mounted at the bottom of each of the two outer contact plates 12. A first conductive layer 31 and a second conductive layer 32 are fixedly installed on the top of the heat sink 3. The laser chip 4 is located on top of the first conductive layer 31, and a conductive line 5 extending to the top of the second conductive layer 32 is fixedly installed on the top of the laser chip 4.

[0032] The bottoms of the two conductive pillars 13 are in contact with the tops of the first conductive layer 31 and the second conductive layer 32, respectively.

[0033] In this embodiment, the top and bottom surfaces of the base plate 1 are both rectangular. The top surface of the base plate 1 has the same length and width as the bottom surface of the cofferdam frame 8. The overall laser has a small volume and low installation space requirements.

[0034] In this embodiment, the base plate 1 has four fixing holes 101' inside. The four fixing holes are all located at the bottom of the assembled cofferdam frame, and each of the four fixing holes has a thread. The bottom surface of the base plate is extended and installed through the threads in the fixing holes.

[0035] In this embodiment, the bottom inner side of the cofferdam frame 8 is provided with a snap-fit ​​groove that is compatible with the mounting platform 2, and the bottom surface of the cofferdam frame 8 is fixedly connected to the top surface of the base plate 1 by welding.

[0036] In this embodiment, a through-hole is provided inside the right side wall of the cofferdam frame 8. The through-hole is circular in shape, and the glass window 9 is fixed inside the through-hole by sintering.

[0037] In this embodiment, the top of the cofferdam frame 8 is provided with an installation groove that matches the top cover 10, and the cofferdam frame 8 and the top cover 10 are connected by welding.

[0038] In this embodiment, the inner side of the top cover 10 has two through holes. The two through holes are respectively fixedly connected to the corresponding conductive post 13 through a sintered insulating layer 11. The area of ​​the insulating layer 11 is greater than the sum of the areas of the two outer contact plates 12. The two outer contact plates 12 do not contact each other. The insulating layer 11 serves as an insulating gap between the two outer contact plates 12 and the top cover 10.

[0039] In this embodiment, a solder layer is provided on the top of the first conductive layer 31. The top surface of the solder layer is fixedly connected to the bottom surface of the laser chip 4. There is a gap in the middle of the first conductive layer 31 and the second conductive layer 32. The gap is at least greater than 0.1 mm to prevent the gold-tin solder from crawling out during the eutectic process of the laser chip and causing the two conductive layers to conduct, thereby improving the packaging yield. The area of ​​the first conductive layer 31 is greater than the area of ​​the second conductive layer 32.

[0040] Example 4 Please see Figure 4 and Figure 6 Except for the square light-transmitting hole inside the right side wall of the cofferdam frame 8, it is the same as in embodiment 3.

[0041] The beneficial effects of the above embodiments are as follows: This box-packaged laser, by setting a first conductive layer 31 and a second conductive layer 32, has a laser chip 4 mounted on top of the first conductive layer 31. A conductive line 5 extending to the top of the second conductive layer 32 is fixedly mounted on the top of the laser chip 4. A combination of two outer contact plates 12 and conductive posts 13 is provided. The bottom of the two conductive posts 13 contacts the top of the first conductive layer 31 and the top of the second conductive layer 32, respectively, leading the positive and negative electrodes of the laser chip 4 to the outer shell of the laser package (two outer contact plates 12). Compared with the pin electrode method, it occupies less installation space.

[0042] This box-packaged laser provides reserved space for wiring operations above the laser by placing two external contact plates 12 on the top of the top cover 10, which facilitates the connection of external circuits and does not affect the heat dissipation path on the bottom of the laser.

[0043] This box-packaged laser uses two different sized and shaped base plates 1, each with threaded holes 101, positioning holes 102, or fixing holes 101'. This facilitates the expansion and installation of the laser base plate, improves the tight contact between the laser base plate and the external heat dissipation structure, enhances the laser's heat dissipation performance, and the multiple base plate structures can adapt to the light source installation space requirements of more laser equipment.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A box-packaged laser, comprising a base plate (1), characterized in that: A mounting platform (2) is fixedly installed on the top of the base plate (1). A heat sink (3) is fixedly installed on the top of the mounting platform (2). A laser chip (4) is fixedly installed on the top of the heat sink (3). A mounting base (6) is fixedly installed on the top of the mounting platform (2) and on one side of the heat sink (3). A collimating lens (7) is fixedly installed on the top of the mounting base (6). A cofferdam frame (8) is fixedly installed on the top of the base plate (1) and on the outside of the mounting platform (2). A glass window (9) is fixedly installed inside the side wall of the cofferdam frame (8) near the mounting base (6). A top cover (10) is fixedly installed on the top of the cofferdam frame (8). An insulating layer (11) is fixedly installed on the top of the heat sink (3). Two external contact plates (12) are fixedly installed on the top of the insulating layer (11). A conductive post (13) extending to the top of the heat sink (3) is fixedly installed on the bottom of each of the two external contact plates (12). A first conductive layer (31) and a second conductive layer (32) are fixedly installed on the top of the heat sink (3). The laser chip (4) is located on the top of the first conductive layer (31). A conductive line (5) extending to the top of the second conductive layer (32) is fixedly installed on the top of the laser chip (4). The bottoms of the two conductive posts (13) are in contact with the tops of the first conductive layer (31) and the second conductive layer (32), respectively.

2. The box-packaged laser according to claim 1, characterized in that: The top and bottom surfaces of the base plate (1) are both rectangular with chamfers. The width of the top surface of the base plate (1) is the same as the width of the bottom surface of the cofferdam frame (8), and the length of the top surface of the base plate (1) is greater than the length of the bottom surface of the cofferdam frame (8).

3. A box-packaged laser according to claim 2, characterized in that: The base plate (1) has two threaded holes (101) on its diagonal side that penetrate the bottom and top surfaces of the base plate (1), and two positioning holes (102) on its other diagonal side that penetrate the bottom and top surfaces of the base plate (1).

4. A box-packaged laser according to claim 1, characterized in that: The top and bottom surfaces of the base plate (1) are both rectangular, and the top surface of the base plate (1) has the same length and width as the bottom surface of the cofferdam frame (8).

5. A box-packaged laser according to claim 4, characterized in that: The base plate (1) has four fixing holes (101') inside.

6. A box-packaged laser according to claim 1, characterized in that: The bottom inner side of the cofferdam frame (8) is provided with a snap-fit ​​groove that is compatible with the mounting platform (2), and the bottom surface of the cofferdam frame (8) and the top surface of the base plate (1) are fixedly connected by welding.

7. A box-packaged laser according to claim 1, characterized in that: The cofferdam frame (8) has a through light-transmitting hole in the side wall near the fixed seat (6). The light-transmitting hole is geometric in shape, and the glass window (9) is fixed in the light-transmitting hole by sintering.

8. A box-packaged laser according to claim 1, characterized in that: The top of the cofferdam frame (8) is provided with an installation groove that is compatible with the top cover (10), and the cofferdam frame (8) and the top cover (10) are connected by welding.

9. A box-packaged laser according to claim 1, characterized in that: The top cover (10) has two through holes on its inner side. The two through holes are fixedly connected to the corresponding conductive post (13) through a sintered insulating layer (11). The area of ​​the insulating layer (11) is greater than the sum of the areas of the two outer contact plates (12). The two outer contact plates (12) do not contact each other.

10. A box-packaged laser according to claim 1, characterized in that: A solder layer is provided on the top of the first conductive layer (31), and the top surface of the solder layer is fixedly connected to the bottom surface of the laser chip (4). There is a gap in the middle of the first conductive layer (31) and the second conductive layer (32), and the area of ​​the first conductive layer (31) is larger than the area of ​​the second conductive layer (32).

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