Circuit board assembly, preparation method and equipment

Abstract

The invention provides a circuit board assembly and a preparation method and equipment thereof, and solves the problem that the design of a circuit board assembly in the prior art is not beneficial to disassembly of an electronic device. The circuit board assembly provided by the invention comprises a substrate and an electronic device, the substrate is provided with dismounting holes and jacks, the plurality of jacks are configured into a jack group, at least part of the jacks correspond to the dismounting holes, and the jacks are communicated with the corresponding dismounting holes; a plurality of pins on the electronic device are respectively inserted into the jacks of one jack group, and the width of the pins is smaller than the minimum width of the communicated part of the jacks and the corresponding dismounting holes. In the process of disassembling the electronic device, each pin of the electronic device can be independently disassembled from the circuit board, and the pins can be separated from the jacks after being disassembled, so that the time for disassembling the electronic device can be shortened; and meanwhile, each pin can be independently heated and bent through independent operation, so that the heating time of the circuit board can be greatly shortened, and the damage to the circuit board is reduced.

Description

Technical Field

[0001] This invention relates to the field of electronic technology, and more specifically to a circuit board assembly and its manufacturing method and equipment. Background Technology

[0002] A circuit board assembly includes a circuit board and electronic components mounted on the circuit board. If an electronic component on the circuit board assembly fails, it can be repaired by replacing the faulty electronic component.

[0003] However, the current design of circuit board assemblies is not conducive to the disassembly of electronic components. Summary of the Invention

[0004] In view of this, embodiments of the present invention aim to provide a circuit board assembly and its manufacturing method and equipment.

[0005] In a first aspect, the present invention provides a circuit board assembly, comprising: a substrate having a removal hole and a socket, the removal hole and the socket both penetrating the substrate along the thickness direction of the substrate, a plurality of sockets being configured as a socket group, at least some of the sockets corresponding to the removal hole and communicating with the corresponding removal hole; a wiring layer, the wiring layer being located at least on one side of the substrate and having a plurality of traces therein; a pad, the pad being located on one side of the substrate, the pad corresponding to the socket and at least partially surrounding the corresponding socket, the pad being electrically connected to at least one trace; and an electronic device having a plurality of pins on one side, the pins corresponding to the sockets, the plurality of pins on the electronic device being respectively inserted into the sockets of the socket group, the pins being soldered to the pads disposed around the corresponding sockets, the width of the pins being less than the minimum width of the socket and the corresponding removal hole at the point of communication.

[0006] In one embodiment, at least one disassembly hole corresponds to one socket; for example, in a group of sockets, the disassembly hole corresponding to each socket has the same setting direction and setting spacing relative to the socket; or, in a group of sockets, the area enclosed by the group of sockets has a center, and the disassembly hole corresponding to each socket is located in the direction of the socket toward the center.

[0007] In another embodiment, a set of sockets corresponds to two or more disassembly holes, and at least one disassembly hole corresponds to at least two sockets in a set of sockets; for example, at least one disassembly hole corresponds to two sockets, and the disassembly hole is located between the corresponding two sockets; or, a plurality of sockets corresponding to one disassembly hole are arranged in a straight line, and the disassembly hole is located on the same side of the plurality of sockets; or, a plurality of sockets corresponding to one disassembly hole are arranged around the disassembly hole.

[0008] In another embodiment, a set of sockets corresponds to a disassembly hole, and the sockets in the set of sockets are arranged around the disassembly hole; exemplaryly, the shape of the disassembly hole includes a rectangle; exemplaryly, a set of sockets includes four sockets, and the four corners of the disassembly hole correspond to and are connected to one socket respectively.

[0009] In one embodiment, at least a portion of the socket coincides with a corresponding disassembly hole portion, and the socket coinciding with the disassembly hole portion has an opening, the width of which is greater than the width of the pin.

[0010] In another embodiment, at least a portion of the socket and the corresponding disassembly hole are provided with a communication channel, one end of the communication channel being connected to a socket and the other end of the communication channel being connected to a disassembly hole, the minimum width of the communication channel being greater than the width of the pin; exemplaryly, a portion of the pad surrounds at least a portion of the area of ​​the communication channel.

[0011] In one embodiment, the shape of the socket includes a semi-circular hole.

[0012] In one embodiment, the electronic device includes a button.

[0013] In a second aspect, the present invention provides a method for manufacturing a circuit board assembly, comprising: providing a substrate; forming a disassembly hole and a insertion hole on the substrate, wherein the disassembly hole and the insertion hole penetrate the substrate along the thickness direction of the substrate, and a plurality of insertion holes are configured as a group of insertion holes, wherein at least some insertion holes correspond to the disassembly holes and the insertion holes are connected to the corresponding disassembly holes; forming a pad and a trace layer on one side of the substrate, wherein the pad and the trace layer are located on the same side of the substrate, the pad corresponds to the insertion hole, and the pad is at least partially arranged around the corresponding insertion hole, the trace layer has a plurality of traces, and at least one trace is electrically connected to the pad; mounting an electronic device on the substrate, wherein one side of the electronic device has a plurality of pins, the pins correspond to the insertion holes, the plurality of pins of the electronic device are respectively inserted into the insertion holes of a group of insertion holes, the pins are soldered to pads arranged around the corresponding insertion holes, and the width of the pins is less than the minimum width of the insertion hole and the corresponding disassembly hole at the point of communication.

[0014] In a third aspect, the present invention provides an electrical device including the circuit board assembly described above.

[0015] The circuit board assembly provided by this invention includes a substrate, a trace layer, pads, and electronic devices. The substrate has removal holes and insertion holes, both of which penetrate the substrate along its thickness direction. Multiple insertion holes are configured as a group of insertion holes, with at least some insertion holes corresponding to removal holes and communicating with their corresponding removal holes. The trace layer is located at least on one side of the substrate and has multiple traces. The pads are located on one side of the substrate, corresponding to the insertion holes, and at least partially surrounding the corresponding insertion holes. The pads are electrically connected to at least one trace. One side of the electronic device has multiple pins, which correspond to the insertion holes. The multiple pins on the electronic device are respectively inserted into the insertion holes of a group of insertion holes. The pins are soldered to the pads disposed around the corresponding insertion holes, and the width of the pins is less than the minimum width of the insertion hole and the corresponding removal hole at the point of communication. During the disassembly of electronic components, each pin can be individually detached from the circuit board, and the pin will disengage from the socket after detachment, which helps to shorten the disassembly time. At the same time, each pin can be heated and bent individually, so the heating time of the circuit board can be greatly shortened, thereby reducing damage to the circuit board. Attached Figure Description

[0016] Figure 1 The diagram shown is a schematic of a circuit board assembly.

[0017] Figure 2 The image shown is a plan view of a circuit board assembly.

[0018] Figure 3 The figure shown is a first plan view of a circuit board assembly provided by the present invention.

[0019] Figure 4 The image shown is a second plan view of a circuit board assembly provided by the present invention.

[0020] Figure 5 The image shown is a third plan view of a circuit board assembly provided by the present invention.

[0021] Figure 6 The image shown is a fourth plan view of a circuit board assembly provided by the present invention.

[0022] Figure 7 The image shown is a fifth plan view of a circuit board assembly provided by the present invention.

[0023] Figure 8 The image shown is a sixth plan view of a circuit board assembly provided by the present invention.

[0024] Figure 9 The image shown is a seventh plan view of a circuit board assembly provided by the present invention.

[0025] Figure 10The diagram shows a flowchart of a method for manufacturing a circuit board assembly provided by the present invention.

[0026] Explanation of reference numerals in the attached figures: 1. Circuit board; 11. Substrate; 111. Hole; 112. Removal hole; 113. Connecting channel; 12. Trace; 13. Pad; 2. Electronic component; 21. Pin. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0029] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0030] For certain elements, terms like "above" or "over" are sometimes used when describing the position of an element in the thickness direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "over," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0031] Some mechanical or electrical equipment requiring electrical control typically has circuit board assemblies to achieve this control. Circuit board assemblies consist of a circuit board and electronic components mounted on it. Some electronic components (such as buttons) are prone to failure due to frequent use or other reasons, such as mechanical buttons. From a cost control perspective, maintenance costs can be reduced by replacing faulty electronic components.

[0032] Figure 1 The diagram shown is a schematic of a circuit board assembly.

[0033] Figure 2 The image shown is a plan view of a circuit board assembly.

[0034] refer to Figure 1 and Figure 2 The circuit board assembly includes a circuit board 1 and an electronic device 2. The circuit board 1 includes a substrate 11 and a wiring layer and pads 13 formed on the substrate 11. The substrate 11 has a socket 111. The pads 13 are located on one side of the substrate 11 and are arranged around the socket 111. The wiring layer has multiple traces 12, and at least one trace 12 is electrically connected to the pad 13. The electronic device 2 has pins 21. The pins 21 of the electronic device 2 are inserted into the sockets 111, and then the pins 21 and the pads 13 are soldered together.

[0035] During the disassembly of the faulty electronic component 2, it is necessary to use a soldering iron or hot air gun to continuously heat each pin 21 of the electronic component 2. However, the circuit board 1 cannot withstand repeated continuous heating. Therefore, the circuit board 1 is easily damaged after the faulty electronic component 2 is replaced 2-3 times.

[0036] Specifically, during the disassembly of the faulty electronic device 2, the solder on multiple pins 21 on one side of the electronic device 2 is heated simultaneously. Then, one side of the electronic device 2 is lifted to disengage the multiple pins 21 from their corresponding sockets 111. Next, the solder on multiple pins 21 on the other side of the electronic device 2 is heated simultaneously, and the other side of the electronic device is lifted to disengage the multiple pins 21 from their corresponding sockets 111, thus completing the disassembly of the electronic device 2. The disassembly process of the electronic device 2 is relatively complex, resulting in a long disassembly time and low efficiency. Generally, disassembling an electronic device 2 with four pins 21 takes 10 to 15 minutes.

[0037] Furthermore, since it is necessary to melt the solder on multiple pins 21 on one side of the electronic device 2 simultaneously and lift the electronic device 2, a long heating time is required to keep the solder in a softened state during this process so that the pins 21 of the electronic device 2 can be detached from the socket 111. However, prolonged heating can easily cause the pads 13 to detach from the circuit board 1, thereby damaging the circuit board 1 and rendering it unusable.

[0038] In addition, after electronic component 2 is removed from circuit board 1, solder remains on circuit board 1. The solder needs to be heated again, and a desoldering pump is used to remove the solder to ensure that the residual solder does not clog the socket 111. This will also increase the heating time of circuit board 1, thereby increasing the possibility that the pad 13 will detach from circuit board 1 and reducing the lifespan of circuit board 1.

[0039] Based on this, at least one embodiment of the present invention provides a circuit board assembly, comprising: a substrate having a disassembly hole and a socket, both the disassembly hole and the socket penetrating the substrate along its thickness direction; a plurality of sockets being configured as a socket group, at least some of the sockets corresponding to the disassembly hole, the sockets communicating with the corresponding disassembly hole, and the area of ​​the socket being smaller than the area of ​​the corresponding disassembly hole; a wiring layer, the wiring layer being located at least on one side of the substrate, the wiring layer having multiple traces; a pad, the pad being located on one side of the substrate, the pad corresponding to the socket, and the pad at least partially surrounding the corresponding socket, the pad being electrically connected to at least one trace; and an electronic device having a plurality of pins on one side, the pins corresponding to the sockets, the plurality of pins on the electronic device being respectively inserted into the sockets of a socket group, the pins being soldered to the pads disposed around the corresponding sockets, and the width of the pins being smaller than the minimum width of the socket and the corresponding disassembly hole at the point of communication.

[0040] The circuit board assembly provided in the embodiments of the present invention will be described below with reference to some specific implementation methods.

[0041] A schematic diagram of the circuit board assembly provided in the embodiments of the present invention and Figure 1 same.

[0042] refer to Figure 1 The circuit board assembly provided in this embodiment of the invention includes a circuit board 1 and an electronic device 2, with the electronic device 2 mounted on the circuit board 1. The electronic device 2 may include buttons or other easily damaged components.

[0043] Figure 3 The figure shown is a first plan view of a circuit board assembly provided by the present invention.

[0044] refer to Figure 1 and Figure 3 The circuit board 1 includes a substrate 11, a wiring layer, and pads 13. The substrate 11 has removal holes 112 and insertion holes 111, both penetrating the substrate 11 along its thickness direction. At least a portion of the insertion holes 111 correspond to the removal holes 112, and there is a connection between the insertion holes 111 and their corresponding removal holes 112. Multiple insertion holes 111 are configured as a group, corresponding to an electronic device 2. Pads 13 are located on one side of the substrate 11, corresponding to the insertion holes 111, with at least a portion of the pads 13 surrounding the corresponding insertion holes 111. The wiring layer is located at least on one side of the substrate 11, and has multiple traces 12, with at least one trace 12 electrically connected to the pads 13.

[0045] Electronic device 2 includes a front and a back side. The front side of electronic device 2 has multiple pins 21, which correspond to sockets 111. Each pin 21 is inserted into a set of sockets 111, meaning there is a one-to-one correspondence between the pins 21 and the sockets 111 in the set. After the pins 21 are inserted into their corresponding sockets 111, they are soldered to pads 13 surrounding the sockets 111, such as through soldering. Furthermore, the width of the pins 21 is less than the minimum width at the connection point between the socket 111 and the corresponding removal hole 112, allowing the pins 21 to move smoothly from the socket 111 to the removal hole 112. The area of ​​the socket 111 can also be smaller than the area of ​​the removal hole 112, allowing the pins 21 to easily exit from the removal hole 112.

[0046] When electronic component 2 malfunctions and needs to be disassembled and replaced, the operator can use a soldering iron or hot air gun to melt the solder on the pins 21 and pads 13. Since the width of pin 21 is less than the minimum width at the connection between the socket 111 and the corresponding disassembly hole 112, pin 21 can be bent from the socket 111 through the connection to the disassembly hole 112. After bending all the pins 21 of electronic component 2 to the corresponding disassembly holes 112 according to the above steps, since the area of ​​the disassembly hole 112 is larger than the area of ​​the socket 111, pin 21 can be easily detached from the disassembly hole 112, thereby removing electronic component 2 from the circuit board 1 for replacement.

[0047] During the disassembly of electronic component 2, each pin 21 can be heated and bent individually, thus significantly reducing the heating time of circuit board 1 and minimizing damage. This reduces the likelihood of pad 13 detaching from substrate 11, allowing circuit board 1 to withstand more frequent replacements of electronic component 2 and extending its lifespan. Specifically, for PCBs of the same quality, with the design of disassembly holes 112 and insertion holes 111, the same electronic component 2 can be replaced more than 20 times before pad 13 detaches.

[0048] Meanwhile, since each pin 21 of electronic device 2 can be individually detached from circuit board 1, electronic device 2 can be removed after all pins 21 have been detached from circuit board 1, thus significantly shortening the time required to disassemble electronic device 2. Taking the disassembly of electronic device 2 with four pins 21 as an example, the time required for disassembly can be reduced to about 2 minutes. In addition, the pads 13 are generally made of copper, while the pins 21 can be made of iron. After the solder melts, it tends to adhere to the pins 21, so the solder is more likely to move with the pins 21 to the removal hole 112 and can be removed together without the need for separate heating to absorb the solder, thus avoiding further damage to the pads 13 on circuit board 1.

[0049] During the installation of the new electronic device 2, the pins 21 of the electronic device 2 can be directly inserted into the corresponding sockets 111, and then soldered with solder to make the pins 21 soldered to the pads 13 set around the corresponding sockets 111.

[0050] In summary, the disassembly and replacement of electronic component 2 requires heating of circuit board 1 twice, both times within a small area of ​​each pin 21. The heating time is short, and there is no need to pry the electronic component 2, minimizing damage to circuit board 1 and extending its lifespan. Furthermore, each pin 21 of electronic component 2 can be individually detached from circuit board 1, and after detachment, the pin 21 will disengage from the socket 111, preventing it from re-soldering to the pad 13 after solder solidification. This simplifies the disassembly process and helps shorten the disassembly time.

[0051] It should be noted that there are many ways to arrange the socket 111 and the corresponding disassembly hole 112. Some specific examples are listed below for illustration.

[0052] In some examples, reference Figure 3 At least one disassembly hole 112 corresponds to one insertion hole 111. For example, in a set of insertion holes, insertion holes 111 and disassembly holes 112 correspond one-to-one, that is, each insertion hole 111 corresponds to a different disassembly hole 112. This helps to reduce the total area of ​​the disassembly holes 112, thereby increasing the wiring space of the circuit board 1.

[0053] For example, refer to Figure 3 In a set of sockets, the orientation and spacing of the disassembly holes 112 corresponding to each socket 111 are the same. During the disassembly of the electronic device 2, each pin 21 of the electronic device 2 bends in the same direction from the socket 111 through the connection point to the disassembly hole 112. This means that the direction of force applied by the operator when bending the pin 21 using tools such as a soldering iron is always the same, eliminating the need to repeatedly adjust the handheld tool's posture. This configuration is particularly suitable for small-sized electronic devices 2.

[0054] Figure 4 The image shown is a second plan view of a circuit board assembly provided by the present invention.

[0055] For example, refer to Figure 4In a set of sockets, the area enclosed by the sockets 111 within the set has a center, and the disassembly hole 112 corresponding to each socket 111 is located in the direction of the socket 111 toward the center; that is, all the disassembly holes 112 are located in the inner area of ​​a set of multiple sockets 111. During the disassembly of the electronic device 2, the direction in which each pin 21 of the electronic device 2 bends from the socket 111 through the connection to the disassembly hole 112 is from the outside in. This arrangement of the sockets 111 and the disassembly holes 112 is particularly suitable for disassembly operations on a rotary workbench, as it eliminates the need for the operator to change the posture of their handheld tools.

[0056] Figure 5 The image shown is a third plan view of a circuit board assembly provided by the present invention.

[0057] Figure 6 The image shown is a fourth plan view of a circuit board assembly provided by the present invention.

[0058] Figure 7 The image shown is a fifth plan view of a circuit board assembly provided by the present invention.

[0059] In other examples, refer to Figures 5 to 7 In any one of the images, a set of sockets corresponds to two or more disassembly holes 112, and at least one disassembly hole 112 corresponds to at least two sockets 111 in a set of sockets.

[0060] For example, refer to Figure 5 At least one disassembly hole 112 corresponds to two sockets 111, and the disassembly hole 112 is located between the two corresponding sockets 111. After the two pins 21 of the electronic device 2 are inserted into the two sockets 111 corresponding to a disassembly hole 112, the sockets 111 can be used to initially position the electronic device 2 to ensure that the pins 21 do not move into the disassembly hole 112.

[0061] For example, refer to Figure 6 Multiple sockets 111 corresponding to a disassembly hole 112 are arranged in a straight line, and the disassembly hole 112 is located on the same side of the corresponding multiple sockets 111. During the disassembly of the electronic device 2, the pins 21 around the disassembly hole 112 are bent in the same direction from the socket 111 through the connection to the disassembly hole 112. That is to say, when the operator uses tools such as a soldering iron to bend the pins 21 around the disassembly hole 112, the direction of force is the same, and there is no need to repeatedly adjust the posture of the hand tool.

[0062] For example, refer to Figure 7 Multiple sockets 111, corresponding to a disassembly hole 112, are arranged around the disassembly hole 112. During the disassembly of the electronic device 2, the pins 21 around the disassembly hole 112 bend from the sockets 111 through the connection to the disassembly hole 112 in the direction from the outside to the inside.

[0063] Figure 8 The image shown is a sixth plan view of a circuit board assembly provided by the present invention.

[0064] In yet another example, refer to Figure 8 Each set of sockets corresponds to one disassembly hole 112, and the sockets 111 in a set of sockets are arranged around the disassembly hole 112.

[0065] For example, a set of sockets includes four sockets 111, and the shape of the disassembly hole 112 includes a rectangle, with the four corners of the disassembly hole 112 corresponding to and connected to one of the sockets 111 respectively.

[0066] It should be noted that the shape of the disassembly hole 112 is not limited to a rectangle, and can be set to any shape as needed, such as a circle, a semi-circle, an ellipse, etc.

[0067] Regarding the connection method between the socket 111 and the corresponding disassembly hole 112, the embodiments of the present invention provide two examples for reference.

[0068] In some examples, reference Figure 8 At least a portion of the socket 111 overlaps with the corresponding disassembly hole 112. The socket 111 overlapping with the disassembly hole 112 has an opening, the width of which is greater than the width of the pin 21. It should be noted that the shape of the socket 111 here refers to a preset shape (e.g., circular). After the socket 111 partially overlaps with the disassembly hole 112, the shape of the socket 111 may be semi-circular or a three-quarter circle, etc. After the socket 111 partially overlaps with the corresponding disassembly hole 112, the connection point between the socket 111 and the disassembly hole 112 is the junction of the outer contour of the socket 111 and the outer contour of the disassembly hole 112. This reduces the path length required for the pin 21 to move from the socket 111 to the disassembly hole 112, and reduces the difficulty of the pin 21 detaching from the socket 111.

[0069] Figure 9 The image shown is a seventh plan view of a circuit board assembly provided by the present invention.

[0070] In other examples, refer to Figure 9 A connecting channel 113 is provided between at least a portion of the socket 111 and the corresponding disassembly hole 112. One end of the connecting channel 113 is connected to a socket 111, and the other end of the connecting channel 113 is connected to a disassembly hole 112. The minimum width of the connecting channel 113 is greater than the width of the pin 21. The connection channel helps to increase the flexibility of the arrangement of the socket 111 and the disassembly hole 112. A portion of the pad 13 can also surround at least a portion of the connecting channel 113, thereby increasing the area of ​​the pad 13 and improving the reliability of the electrical connection between the pad 13 and the pin 21 via solder.

[0071] For example, the socket 111 can be set as a semi-circular hole, so that the minimum width of the connection between the socket 111 and the disassembly hole 112 can be set to be the same as the diameter of the socket 111, which helps to reduce the difficulty of bending the pin 21 from the socket 111 to the disassembly hole 112.

[0072] In summary, the circuit board assembly provided by the embodiments of the present invention has at least the following advantages: (1) During the disassembly of electronic device 2, each pin 21 of electronic device 2 can be detached from circuit board 1 individually, and after the pin 21 is detached, it will be removed from the socket 111 and will not be soldered to the pad 13 again after the solder solidifies, which makes the disassembly of electronic device 2 simpler and helps to shorten the time of disassembling electronic device 2.

[0073] (2) During the disassembly of electronic device 2, each pin 21 can be heated and bent individually, thus greatly shortening the heating time of circuit board 1, thereby reducing the damage to circuit board 1, i.e. reducing the possibility of solder pad 13 detaching from substrate 11, and enabling circuit board 1 to withstand more damage caused by replacing electronic device 2, thereby improving the service life of circuit board 1.

[0074] (3) During the disassembly of electronic device 2, the solder tends to adhere to the pin 21 after melting. Therefore, the solder is more likely to move to the disassembly hole 112 with the pin 21 and can be removed together without heating and adsorbing the solder separately, so as to avoid damaging the pad 13 on the circuit board 1 again.

[0075] An embodiment of the present invention provides a method for fabricating a circuit board assembly, comprising: providing a substrate; forming a disassembly hole and a insertion hole on the substrate, wherein the disassembly hole and the insertion hole penetrate the substrate along the thickness direction of the substrate, and a plurality of insertion holes are configured as a group of insertion holes, wherein at least some insertion holes correspond to the disassembly holes and are connected to the corresponding disassembly holes, and the area of ​​the insertion hole is smaller than the area of ​​the corresponding disassembly hole; forming a pad and a trace layer on one side of the substrate, wherein the pad and the trace layer are located on the same side of the substrate, the pad corresponds to the insertion hole, and the pad is at least partially arranged around the corresponding insertion hole, the trace layer has multiple traces, and at least one trace is electrically connected to the pad; mounting an electronic device on the substrate, wherein one side of the electronic device has a plurality of pins, the pins correspond to the insertion holes, the plurality of pins of the electronic device are respectively inserted into the insertion holes of a group of insertion holes, the pins are soldered to the pads arranged around the corresponding insertion holes, and the width of the pin is smaller than the minimum width of the insertion hole and the corresponding disassembly hole at the connection point.

[0076] refer to Figure 10 The following describes a method for preparing a circuit board assembly according to an embodiment of the present invention, using specific implementation details. The method includes: S100, providing substrate 11.

[0077] S200, a disassembly hole 112 and an insertion hole 111 are formed on the substrate 11.

[0078] Both the disassembly hole 112 and the insertion hole 111 penetrate the substrate 11 along its thickness direction. At least a portion of the insertion hole 111 corresponds to the disassembly hole 112, and there is a communication point between the insertion hole 111 and the corresponding disassembly hole 112. The insertion hole 111 and the corresponding disassembly hole 112 are connected at the communication point, and the area of ​​the insertion hole 111 is smaller than the area of ​​the disassembly hole 112. Multiple insertion holes 111 are configured as a group of insertion holes, corresponding to one electronic device 2.

[0079] It should be noted that there are many ways to arrange the socket 111 and the corresponding disassembly hole 112. Some specific examples are listed below for illustration.

[0080] In some examples, at least one disassembly hole 112 corresponds to one socket 111. For example, in a set of sockets, sockets 111 and disassembly holes 112 are in one-to-one correspondence, that is, each socket 111 corresponds to a different disassembly hole 112. This helps to reduce the total area of ​​the disassembly holes 112, thereby increasing the wiring space on the circuit board 1.

[0081] For example, refer to Figure 3 In a set of sockets, the orientation and spacing of the disassembly holes 112 corresponding to each socket 111 are the same. During the disassembly of the electronic device 2, each pin 21 of the electronic device 2 bends in the same direction from the socket 111 through the connection point to the disassembly hole 112. This means that the direction of force applied by the operator when bending the pin 21 using tools such as a soldering iron is always the same, eliminating the need to repeatedly adjust the handheld tool's posture. This configuration is particularly suitable for small-sized electronic devices 2.

[0082] For example, refer to Figure 4 In a set of sockets, the area enclosed by the sockets 111 within the set has a center, and the disassembly hole 112 corresponding to each socket 111 is located in the direction of the socket 111 toward the center; that is, all the disassembly holes 112 are located in the inner area of ​​a set of multiple sockets 111. During the disassembly of the electronic device 2, the direction in which each pin 21 of the electronic device 2 bends from the socket 111 through the connection to the disassembly hole 112 is from the outside in. This arrangement of the sockets 111 and the disassembly holes 112 is particularly suitable for disassembly operations on a rotary workbench, as it eliminates the need for the operator to change the posture of their handheld tools.

[0083] In other examples, a set of sockets corresponds to two or more detachment holes 112, and at least one detachment hole 112 corresponds to at least two sockets 111 in a set of sockets.

[0084] For example, refer to Figure 5 At least one disassembly hole 112 corresponds to two sockets 111, and the disassembly hole 112 is located between the two corresponding sockets 111. After the two pins 21 of the electronic device 2 are inserted into the two sockets 111 corresponding to a disassembly hole 112, the sockets 111 can be used to initially position the electronic device 2 to ensure that the pins 21 do not move into the disassembly hole 112.

[0085] For example, refer to Figure 6 Multiple sockets 111 corresponding to a disassembly hole 112 are arranged in a straight line, and the disassembly hole 112 is located on the same side of the corresponding multiple sockets 111. During the disassembly of the electronic device 2, the pins 21 around the disassembly hole 112 are bent in the same direction from the socket 111 through the connection to the disassembly hole 112. That is to say, when the operator uses tools such as a soldering iron to bend the pins 21 around the disassembly hole 112, the direction of force is the same, and there is no need to repeatedly adjust the posture of the hand tool.

[0086] For example, refer to Figure 7 and one Multiple insertion holes 111 corresponding to the disassembly hole 112 are arranged around the disassembly hole 112. During the disassembly of the electronic device 2, the pins 21 around the disassembly hole 112 bend from the insertion hole 111 through the connection point toward the disassembly hole 112 in the direction from the outside to the inside.

[0087] In yet another example, refer to Figure 8 Each set of sockets corresponds to one disassembly hole 112, and the sockets 111 in a set of sockets are arranged around the disassembly hole 112.

[0088] For example, a set of sockets includes four sockets 111, and the shape of the disassembly hole 112 includes a rectangle, with the four corners of the disassembly hole 112 corresponding to and connected to one of the sockets 111 respectively.

[0089] It should be noted that the shape of the disassembly hole 112 is not limited to a rectangle, and can be set to any shape as needed, such as a circle, a semi-circle, an ellipse, etc.

[0090] Regarding the connection method between the socket 111 and the corresponding disassembly hole 112, the embodiments of the present invention provide two examples for reference.

[0091] In some examples, reference Figure 8At least a portion of the socket 111 overlaps with the corresponding disassembly hole 112. The socket 111 overlapping with the disassembly hole 112 has an opening, the width of which is greater than the width of the pin 21. It should be noted that the shape of the socket 111 here refers to a preset shape (e.g., circular). After the socket 111 partially overlaps with the disassembly hole 112, the shape of the socket 111 may be semi-circular or a three-quarter circle, etc. After the socket 111 partially overlaps with the corresponding disassembly hole 112, the connection point between the socket 111 and the disassembly hole 112 is the junction of the outer contour of the socket 111 and the outer contour of the disassembly hole 112. This reduces the path length required for the pin 21 to move from the socket 111 to the disassembly hole 112, and reduces the difficulty of the pin 21 detaching from the socket 111.

[0092] In other examples, refer to Figure 9 A connecting channel 113 is provided between at least a portion of the socket 111 and the corresponding disassembly hole 112. One end of the connecting channel 113 is connected to a socket 111, and the other end of the connecting channel 113 is connected to a disassembly hole 112. The minimum width of the connecting channel 113 is greater than the width of the pin 21. The connection channel helps to increase the freedom of arrangement of the socket 111 and the disassembly hole 112. A portion of the pad 13 can also surround at least a portion of the connecting channel 113, thereby increasing the area of ​​the pad 13 and improving the reliability of the electrical connection between the pad 13 and the pin 21 via solder.

[0093] For example, the socket 111 can be set as a semi-circular hole, so that the minimum width of the connection between the socket 111 and the disassembly hole 112 can be set to be the same as the diameter of the socket 111, which helps to reduce the difficulty of bending the pin 21 from the socket 111 to the disassembly hole 112.

[0094] S300, a pad 13 and a trace layer are formed on one side of the substrate 11.

[0095] The pad 13 and the trace layer are located on the same side of the substrate 11. The pad 13 corresponds to the hole 111, and the pad 13 is at least partially arranged around the corresponding hole 111. The trace layer has multiple traces 12, and at least one trace 12 is electrically connected to the pad 13.

[0096] When there is a communication channel 113 between the socket 111 and the corresponding disassembly hole 112, a portion of the pad 13 can also surround at least a portion of the communication channel 113, thereby increasing the area of ​​the pad 13 and improving the reliability of the pad 13 being electrically connected to the pin 21 by solder.

[0097] S400, Install electronic device 2 on substrate 11.

[0098] Electronic device 2 is mounted on the side of substrate 11 away from pad 13. Multiple pins 21 of electronic device 2 are inserted into the sockets 111 of a set of sockets. The pins 21 are soldered to the pads 13 surrounding the corresponding sockets 111. The width of the pins 21 is less than the minimum width of the socket 111 and the corresponding disassembly hole 112 at the connection point.

[0099] In some possible implementations, this application also provides a device that includes the circuit board assembly described in this application. This device may include mechanical or electrical equipment with electrical controls. Because the device includes the circuit board assembly described in this application, it is characterized by ease of maintenance and minimal damage.

[0100] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A circuit board assembly, characterized in that, include: A substrate having a disassembly hole and an insertion hole, both the disassembly hole and the insertion hole penetrating the substrate along the thickness direction, a plurality of the insertion holes being configured into a group of insertion holes, at least some of the insertion holes corresponding to the disassembly hole, and the insertion hole communicating with the corresponding disassembly hole; A wiring layer, wherein the wiring layer is located at least on one side of the substrate, and the wiring layer has multiple traces; The pad is located on one side of the substrate, the pad corresponds to the socket, and the pad is at least partially arranged around the corresponding socket. The pad is electrically connected to at least one of the traces. An electronic device having multiple pins on one side, the pins corresponding to the sockets, the multiple pins of the electronic device being inserted into the sockets of a group of sockets respectively, the pins being soldered to pads disposed around the corresponding sockets, and the width of the pins being less than the minimum width of the socket and the corresponding disassembly hole at the connection point.

2. The circuit board assembly according to claim 1, characterized in that, At least one of the disassembly holes corresponds to one of the insertion holes; Preferably, in a group of sockets, the orientation and spacing of the disassembly hole corresponding to each socket are the same relative to the socket; or, in a group of sockets, the area enclosed by the sockets of the group of sockets has a center, and the disassembly hole corresponding to each socket is located in the direction of the socket toward the center.

3. The circuit board assembly according to claim 1, characterized in that, A set of the sockets corresponds to two or more of the disassembly holes, and at least one of the disassembly holes corresponds to at least two of the sockets in a set of the sockets; Preferably, at least one of the disassembly holes corresponds to two of the insertion holes, and the disassembly hole is located between the corresponding two insertion holes; or, The plurality of sockets corresponding to one of the disassembly holes are arranged in a straight line, and the disassembly hole is located on the same side of the plurality of sockets; or, A plurality of the insertion holes corresponding to one of the disassembly holes are arranged around the disassembly hole.

4. The circuit board assembly according to claim 1, characterized in that, Each set of the sockets corresponds to one disassembly hole, and the sockets in each set of the sockets are arranged around the disassembly hole; Preferably, the shape of the disassembly hole includes a rectangle; Preferably, a set of the sockets includes four sockets, and the four corners of the disassembly hole correspond to and are connected to one of the sockets.

5. The circuit board assembly according to claim 1, characterized in that, At least a portion of the socket coincides with the corresponding disassembly hole portion, and the socket coinciding with the disassembly hole portion has an opening, the width of which is greater than the width of the pin.

6. The circuit board assembly according to claim 1, characterized in that, At least some of the sockets are provided with a connecting channel between them and the corresponding disassembly holes. One end of the connecting channel is connected to one of the sockets, and the other end of the connecting channel is connected to the disassembly hole. The minimum width of the connecting channel is greater than the width of the pin. Preferably, a portion of the pad surrounds at least a portion of the connecting channel.

7. The circuit board assembly according to claim 1, characterized in that, The shape of the socket includes a semi-circular hole.

8. The circuit board assembly according to claim 1, characterized in that, The electronic device includes buttons.

9. A method for manufacturing a circuit board assembly, characterized in that, include: Provide substrate; A disassembly hole and a insertion hole are formed on the substrate. Both the disassembly hole and the insertion hole penetrate the substrate along the thickness direction. A plurality of insertion holes are configured into a group of insertion holes. At least some of the insertion holes correspond to the disassembly holes, and the insertion holes communicate with the corresponding disassembly holes. A pad and a trace layer are formed on one side of the substrate. The pad and the trace layer are located on the same side of the substrate. The pad corresponds to the socket and is at least partially arranged around the corresponding socket. The trace layer has multiple traces, and at least one of the traces is electrically connected to the pad. The electronic device is mounted on the substrate. One side of the electronic device has multiple pins, which correspond to the sockets. The multiple pins of the electronic device are respectively inserted into the sockets of a group of sockets. The pins are soldered to the pads disposed around the corresponding sockets. The width of the pins is less than the minimum width of the socket and the corresponding disassembly hole at the connection point.

10. A device, characterized in that, Includes the circuit board assembly as described in any one of claims 1 to 8.

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