Liquid cooling domain controller and vehicle

Abstract

The invention discloses a liquid cooling domain controller and a vehicle. The liquid cooling domain controller comprises a first cover plate; the second cover plate and the first cover plate are arranged on the upper side and the lower side of the liquid cooling domain controller respectively; the liquid cooling shell assembly comprises a liquid cooling shell body and a liquid cooling side wall, and the liquid cooling side wall is arranged around the periphery of the liquid cooling shell body; the liquid cooling side wall, the liquid cooling shell body and the first cover plate are enclosed to form a first cavity, and the liquid cooling side wall, the liquid cooling shell body and the second cover plate are enclosed to form a second cavity; the liquid cooling shell body comprises a liquid cooling flow channel, and the liquid cooling flow channel is used for accommodating a liquid cooling medium; the first circuit board is arranged in the first cavity; and the second circuit board is arranged in the second cavity. The liquid cooling domain controller is beneficial for solving the problems of limited integration level, large occupied space of the whole vehicle and high total cost of the liquid cooling domain controller.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology for automotive controllers, and more particularly to a liquid-cooled controller and a vehicle. Background Technology

[0002] With the development of automotive intelligence, the overall vehicle electrical architecture is increasingly shifting towards a centrally integrated design. Domain controllers, as the core component of this integrated architecture, have gradually become the mainstream in the market. Currently, most domain controllers used in automobiles are integrated into a single circuit board to implement their functions.

[0003] Existing domain controllers have the following shortcomings: limited functional integration. Although the functions integrated by existing domain controllers are constantly increasing, they are always being expanded and upgraded on a single circuit board, making it difficult to achieve higher-dimensional cross-domain fusion and integration, and thus failing to meet the needs of high-level autonomous driving; large vehicle space and heavy weight. Existing domain controllers need to be distributed in different locations throughout the vehicle according to their functions and installation environment requirements, and the controllers are connected and communicate with each other through wiring harnesses. This means that the vehicle not only needs to reserve installation space for each domain controller, but also needs to reserve additional space for wiring harness installation, which occupies a large amount of vehicle space and increases the overall weight; and high overall cost. The distributed layout of existing domain controllers leads to relatively high development and manufacturing costs. Summary of the Invention

[0004] This invention provides a liquid-cooled domain controller and a vehicle to address the problems of limited integration of liquid-cooled domain controllers, large vehicle space occupation, and high overall cost.

[0005] To address the aforementioned technical problems, the present invention adopts the following technical solution:

[0006] In a first aspect, embodiments of the present invention provide a liquid cooling zone controller, comprising:

[0007] First cover plate;

[0008] The second cover plate and the first cover plate are respectively disposed on the upper and lower sides of the liquid cooling zone controller;

[0009] A liquid-cooled housing assembly includes a liquid-cooled housing body and a liquid-cooled sidewall, the liquid-cooled sidewall being disposed around the periphery of the liquid-cooled housing body; the liquid-cooled sidewall, the liquid-cooled housing body, and a first cover plate enclose a first cavity, and the liquid-cooled sidewall, the liquid-cooled housing body, and a second cover plate enclose a second cavity; the liquid-cooled housing body includes a liquid-cooled flow channel for containing a liquid-cooling medium;

[0010] A first circuit board is disposed in the first cavity;

[0011] The second circuit board is disposed in the second cavity.

[0012] Optionally, the liquid-cooled housing assembly further includes a liquid-cooled cover plate, wherein the liquid-cooled housing body is groove-shaped, and the liquid-cooled cover plate is located at the groove opening of the liquid-cooled housing body to form a liquid-cooled cavity;

[0013] The liquid cooling cavity is provided with multiple flow channel ribs, boss partitions, liquid cooling medium inlet and liquid cooling medium outlet; the boss partition is located in the middle of the liquid cooling cavity, the liquid cooling medium inlet is located on one side of the boss partition, and the liquid cooling medium outlet is located on the other side of the boss partition; the flow channel ribs are arranged parallel to the boss partition.

[0014] Optionally, the liquid-cooled housing body further includes a plurality of first heat dissipation protrusions; the plurality of first heat dissipation protrusions are distributed on the side of the liquid-cooled housing body away from the liquid-cooled cover plate;

[0015] And / or, the liquid cooling cover plate includes a second heat dissipation protrusion, which is disposed on the side of the liquid cooling cover plate near the first cover plate.

[0016] Optionally, a heating element is provided on the side of the first circuit board near the liquid-cooled housing body, and the side of the heating element near the liquid-cooled housing body is filled with a first thermally conductive material layer; the second heat dissipation boss and the heating element are connected through the first thermally conductive material layer;

[0017] The heating element is disposed on the side of the second circuit board near the liquid-cooled housing body, and the side of the heating element near the liquid-cooled housing body is filled with a second thermally conductive material layer; the first heat dissipation boss and the heating element are connected through the second thermally conductive material layer.

[0018] Optionally, the side of the liquid-cooled cover plate away from the first cover plate is fitted with the boundary of the liquid-cooled cavity.

[0019] Optionally, the liquid-cooled zone controller device further includes a sealing material layer;

[0020] A first U-shaped adhesive groove is provided at the end of the liquid-cooled sidewall near the first cover plate;

[0021] A raised first sealing rib is provided on the first cover plate, and the first sealing rib is accommodated in the first U-shaped adhesive groove.

[0022] The sealing material layer fills the gap between the first sealing rib and the first U-shaped adhesive groove.

[0023] Optionally, a second U-shaped adhesive groove is provided at the end of the liquid-cooled sidewall near the second cover plate;

[0024] A raised second sealing rib is provided on the second cover plate, and the second sealing rib is accommodated in the second U-shaped adhesive groove.

[0025] The sealing material layer fills the gap between the second sealing rib and the second U-shaped adhesive groove.

[0026] Optionally, a first assembly structure is provided at the position where the liquid-cooled sidewall connects to the first circuit board, and a second assembly structure is provided at the position where the liquid-cooled sidewall connects to the second circuit board.

[0027] Optionally, the first assembly structure includes a first Z-shaped step, which includes a first layer and a second layer. The first layer overlaps with the first circuit board. A conductive material is applied to the second layer. Copper exposure is performed on the edge of the first circuit board away from the first cover plate, and a portion of the exposed copper area is in contact with the conductive material.

[0028] The second assembly structure includes a second Z-shaped step, which includes a third layer and a fourth layer. The third layer overlaps with the second circuit board. The conductive material is coated on the fourth layer. Copper exposure is performed on the edge of the second circuit board near the first cover plate, and a portion of the exposed copper area is in contact with the conductive material.

[0029] Secondly, embodiments of the present invention also provide a vehicle, the vehicle including a liquid-cooled domain controller device as described in any of the above embodiments.

[0030] This invention, through a dual-cavity design accommodating two circuit boards, an integrated liquid-cooled housing assembly, and a closed structure, effectively solves the problems of limited functional integration, difficulty in cross-domain fusion, large vehicle space occupation, high weight, high overall cost, and insufficient heat dissipation after multi-component integration in traditional domain controllers. It significantly improves functional integration, supports cross-domain fusion functionality, and meets the complex requirements of advanced autonomous driving. By integrating two circuit boards into a single liquid-cooled domain controller, it drastically reduces the vehicle installation space and the weight of the liquid-cooled domain controller itself, while simplifying wiring harness layout. This lowers the overall cost of development, manufacturing, and vehicle assembly. Even with the high integration of the liquid-cooled domain controller, it still ensures efficient heat dissipation, dust intrusion prevention through sealing, and shielding against signal interference between the two circuit boards, ensuring stable operation of the liquid-cooled domain controller.

[0031] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0033] Figure 1 This is a structural diagram of a liquid-cooled domain controller provided in an embodiment of the present invention;

[0034] Figure 2 This is a structural diagram of another liquid-cooled domain controller provided in an embodiment of the present invention;

[0035] Figure 3 This is a top view of another liquid-cooled domain controller provided in an embodiment of the present invention;

[0036] Figure 4 This is a structural diagram of another liquid-cooled domain controller provided in an embodiment of the present invention. Detailed Implementation

[0037] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0039] Figure 1 This is a structural diagram of a liquid-cooled domain controller provided in an embodiment of the present invention. See also... Figure 1 The liquid cooling zone controller includes:

[0040] First cover plate 110;

[0041] The second cover plate 120 and the first cover plate 110 are respectively disposed on the upper and lower sides of the liquid cooling zone controller;

[0042] The liquid-cooled housing assembly 130 includes a liquid-cooled housing body 131 and a liquid-cooled sidewall 132, which surrounds the periphery of the liquid-cooled housing body 131. The liquid-cooled sidewall 132, the liquid-cooled housing body 131, and the first cover plate 110 enclose a first cavity 140, and the liquid-cooled sidewall 132, the liquid-cooled housing body 131, and the second cover plate 120 enclose a second cavity 150. The liquid-cooled housing body 131 includes a liquid-cooled flow channel 131A for containing liquid cooling medium.

[0043] The first circuit board 160 is disposed in the first cavity 140;

[0044] The second circuit board 170 is disposed in the second cavity 150.

[0045] The first cover plate 110 and the second cover plate 120, together with the liquid-cooled housing assembly 130, provide sealing and protection for the internal components of the liquid-cooled domain controller. The liquid-cooled housing assembly 130, as the main frame of the liquid-cooled domain controller, is the core structure for achieving heat dissipation. The liquid-cooled housing body 131 can accommodate the flow of liquid cooling medium, and its upper and lower surfaces are respectively opposite to the first circuit board 160 and the second circuit board 170. The liquid cooling medium efficiently absorbs the heat generated by the two circuit boards as it flows through. The liquid-cooled sidewall 132 surrounds the edge of the liquid-cooled housing body 131, extending upwards to the first cover plate 110 and the first circuit board 160, and downwards to the second cover plate 120 and the second circuit board 170. It serves to connect and support the two circuit boards and, together with the two cover plates, forms a closed space. The first cavity 140 and the second cavity 150 are independent of each other, effectively preventing signal interference between the first circuit board 160 and the second circuit board 170. The first circuit board 160 and the second circuit board 170 are core functional components that carry electronic components such as chips, capacitors, and interfaces, and are responsible for realizing the various functions of the liquid-cooled domain controller. This design breaks through the limitations of traditional single circuit boards and can integrate different functions. For example, one circuit board is responsible for autonomous driving calculations, and another circuit board is responsible for intelligent cockpit control, realizing the centralized integration of cross-domain functions. For example, the first cavity 140 and the first cover plate 110 are assembled with screws, the second cavity 150 and the second cover plate 120 are assembled with screws, and the first circuit board 160 and the second circuit board 170 are connected to the liquid-cooled housing assembly 130 with screws.

[0046] This invention, through a dual-cavity design accommodating two circuit boards, an integrated liquid-cooled housing assembly, and a closed structure, effectively solves the problems of limited functional integration, difficulty in cross-domain fusion, large vehicle space occupation, high weight, high overall cost, and insufficient heat dissipation after multi-component integration in traditional domain controllers. It significantly improves functional integration, supports cross-domain fusion functionality, and meets the complex requirements of advanced autonomous driving. By integrating two circuit boards into a single liquid-cooled domain controller, it drastically reduces the vehicle installation space and the weight of the liquid-cooled domain controller itself, while simplifying wiring harness layout. This lowers the overall cost of development, manufacturing, and vehicle assembly. Even with the high integration of the liquid-cooled domain controller, it still ensures efficient heat dissipation, dust intrusion prevention through sealing, and shielding against signal interference between the two circuit boards, ensuring stable operation of the liquid-cooled domain controller.

[0047] Figure 2 This is a structural diagram of another liquid-cooled domain controller provided in an embodiment of the present invention. Figure 2 The liquid-cooled sidewall is not shown. See also Figure 2 Based on the above embodiments, optionally, the liquid-cooled housing assembly 130 further includes a liquid-cooled cover plate 133. The liquid-cooled housing body 131 is groove-shaped, and the liquid-cooled cover plate 133 is located at the groove opening of the liquid-cooled housing body 131, forming a liquid-cooled cavity. Multiple flow channel ribs 131B, boss partitions 131C, and a liquid cooling medium inlet are provided within the liquid-cooled cavity. Figure 2 (not shown in the image) and the outlet for the liquid cooling medium ( Figure 2 (Not shown in the image); the boss partition 131C is located in the middle of the liquid cooling cavity, the liquid cooling medium inlet 131D is located on one side of the boss partition 131C, and the liquid cooling medium outlet 131E is located on the other side of the boss partition 131C; the flow channel rib 131B is arranged parallel to the boss partition 131C.

[0048] The liquid cooling cover plate 133 is a sealing component that covers the opening of the groove in the liquid cooling housing body 131 and is fixed to the liquid cooling housing body 131 through a sealing design, thereby sealing the groove and preventing the cooling medium from leaking. It also forms a closed cooling space together with the groove. The liquid cooling cavity is the internal closed space formed by the sealing of the groove in the liquid cooling housing body 131 and the liquid cooling cover plate 133. It is the core area for the flow of the liquid cooling medium and the completion of heat dissipation, and its sealing performance is crucial to ensuring that the liquid cooling medium does not leak. The boss partition 131C separates the liquid cooling medium inlet 131D and the liquid cooling medium outlet 131E inside the liquid cooling cavity, preventing the liquid cooling medium from flowing directly out of the outlet immediately after entering through the inlet, ensuring that the liquid cooling medium can flow completely through the entire cavity. The flow channel ribs 131B divide the liquid-cooled cavity into several parallel sub-channels. After the liquid cooling medium enters through the liquid cooling medium inlet 131D, it flows between the flow channel ribs 131B. Each flow channel rib can exchange heat with the liquid cooling medium to improve heat exchange efficiency. The number of flow channel ribs 131B can be adjusted according to the power consumption assessment of the circuit board devices to adapt to the heat dissipation and power consumption requirements of different liquid cooling domain controllers. For example, the liquid cooling cover plate 133 and the liquid cooling housing body 131 are welded together by a welding process. Optionally, the top of the flow channel ribs 131B can be spaced apart from the liquid cooling cover plate 133; or, the top of the flow channel ribs 131B can abut against the liquid cooling cover plate 133.

[0049] In this embodiment of the invention, by designing flow channel ribs 131B and boss partitions 131C inside the liquid cooling cavity, the liquid cooling medium can fully contact the cavity wall to efficiently absorb heat and ensure heat dissipation.

[0050] Figure 3 This is a top view of another liquid-cooled domain controller provided in an embodiment of the present invention. See also... Figure 3 , Figure 3 The diagram shows an inlet 131D and an outlet 131E for the liquid cooling medium, which are used for the inflow and outflow of the liquid cooling medium in the liquid-cooled domain controller, respectively. The inlet 131D is connected to the inlet side of the liquid-cooled cavity of the liquid-cooled housing 131, and the outlet 131E is connected to the outlet side of the liquid-cooled cavity. The inlet and outlet sides of the liquid-cooled cavity are interconnected within the cavity, together forming the heat dissipation area of ​​the liquid-cooled domain controller.

[0051] See also Figure 2In one embodiment, optionally, the liquid cooling housing body 131 further includes a plurality of first heat dissipation protrusions 131F; the plurality of first heat dissipation protrusions 131F are distributed on the side of the liquid cooling housing body 131 away from the liquid cooling cover plate 133; the liquid cooling cover plate 133 includes a second heat dissipation protrusion 133A, the second heat dissipation protrusion 133A being disposed on the side of the liquid cooling cover plate 133 close to the first cover plate 110.

[0052] The first heat dissipation protrusion 131F and the second heat dissipation protrusion 133A are outward-protruding structures. These protrusions increase the actual contact area between the liquid-cooled components and the circuit board, accelerating the transfer of heat from the circuit board to the liquid-cooled housing assembly 130. The heat generated by the second circuit board 170 during operation is transferred through the first heat dissipation protrusion 131F to the liquid cooling medium within the liquid-cooled cavity, where it is carried away, thus achieving a heat dissipation effect. The heat from the first circuit board 160 is transferred through the second heat dissipation protrusion 133A to the liquid-cooled cover plate 133, and then conducted through the liquid-cooled cover plate 133 to the coolant inside the liquid-cooled cavity, further supplementing the heat dissipation capacity and making the heat dissipation of the entire liquid-cooled controller more uniform.

[0053] See also Figure 2 In one embodiment, optionally, a heating element 180 is disposed on the side of the first circuit board 160 near the liquid-cooled housing body 131, and the side of the heating element 180 near the liquid-cooled housing body 131 is filled with a first thermally conductive material layer 190; the second heat dissipation boss 133A and the heating element 180 are connected through the first thermally conductive material layer 190; a heating element 180 is disposed on the side of the second circuit board 170 near the liquid-cooled housing body 131, and the side of the heating element 180 near the liquid-cooled housing body 131 is filled with a second thermally conductive material layer 1A0; the first heat dissipation boss 131F and the heating element 180 are connected through the second thermally conductive material layer 1A0.

[0054] The heat-generating device 180 is the heat-generating element on the circuit board and the source of heat. Installed on the side of the circuit board near the liquid-cooled housing 131, it allows heat to be more directly directed to the heat dissipation structure, reducing transmission path loss. The first thermally conductive material layer 190 and the second thermally conductive material layer 1A0 respectively fill the gaps between the heat-generating device 180 and the second heat dissipation protrusion 133A, and between the heat-generating device 180 and the first heat dissipation protrusion 131F, enhancing heat conduction efficiency and preventing air from hindering heat transfer in the gaps. Each heat dissipation protrusion has three characteristics: position, height, and size, all of which are adapted to the corresponding heat-generating device 180 on the circuit board. The position is precisely set according to the installation location of the heat-generating device 180, the height is designed to match the height of the heat-generating device 180 itself, and the size is equivalent to the cross-sectional area of ​​the heat-generating device 180. The present invention adds two layers of thermally conductive material, which can remove the heat generated by the two circuit boards in time through the common liquid cooling channel 131A when the liquid-cooled domain controller is working, so as to achieve rapid cooling, ensure the stable operation of high-power devices such as chips, and enable the liquid-cooled domain controller to have good heat dissipation performance, thus providing a guarantee for driving safety.

[0055] In one embodiment, optionally, the side of the liquid-cooled cover plate 133 away from the first cover plate 110 is fitted with the boundary of the liquid-cooled cavity.

[0056] Specifically, through the above-mentioned configuration, the liquid cooling cover 133 can tightly cover the liquid cooling cavity. After the liquid cooling cover 133 is in contact with the liquid cooling cavity, it can eliminate the gap between the liquid cooling cover 133 and the boundary of the liquid cooling cavity, preventing the cooling medium in the liquid cooling cavity from leaking from the edge. The tight contact between the liquid cooling cover 133 and the liquid cooling cavity can also make the liquid cooling cover 133 and the liquid cooling housing body 131 form a stable whole, avoiding the displacement of the liquid cooling cover 133 due to vehicle driving bumps, which would affect the sealing performance of the liquid cooling cavity or the stability of the heat dissipation structure.

[0057] Figure 4 This is a structural diagram of another liquid-cooled domain controller provided in an embodiment of the present invention. See also... Figure 4 In one embodiment, optionally, the liquid-cooled domain controller device further includes a sealing material layer 1B0; a first U-shaped adhesive groove 132A is provided at the end of the liquid-cooled sidewall 132 near the first cover plate 110; a raised first sealing rib 111 is provided on the first cover plate 110, the first sealing rib 111 is accommodated in the first U-shaped adhesive groove 132A; the sealing material layer 1B0 fills the gap between the first sealing rib 111 and the first U-shaped adhesive groove 132A.

[0058] The sealing material layer 1B0 is a sealing material that prevents liquid or dust from entering the gap between the first sealing rib 111 and the first U-shaped adhesive groove 132A. The first U-shaped adhesive groove 132A is a U-shaped groove formed at the top of the liquid-cooled sidewall 132, which can accommodate the sealing material layer 1B0 and the first sealing rib 111. The first sealing rib 111 is a rib-like structure that protrudes downward from the inside of the first cover plate 110, and its position corresponds to the first U-shaped adhesive groove 132A. When the first cover plate 110 is closed on the liquid-cooled sidewall 132, the first sealing rib 111 of the first cover plate 110 will be embedded in the first U-shaped adhesive groove 132A of the liquid-cooled sidewall 132. At this time, there may be a gap between the first sealing rib 111 and the first U-shaped adhesive groove 132A, and the sealing material layer 1B0 fills this gap. This method prevents dust and moisture from entering the liquid-cooled domain controller through gaps and affecting the operation of the device, thus ensuring the stable sealing of the liquid-cooled domain controller.

[0059] In one embodiment, optionally, a second U-shaped adhesive is provided at the end of the liquid-cooled sidewall 132 near the second cover plate 120; a raised second sealing rib is provided on the second cover plate 120, and the second sealing rib is accommodated in the second U-shaped adhesive groove; the sealing material layer 1B0 fills the gap between the second sealing rib and the second U-shaped adhesive groove.

[0060] The effect achieved by this setting is the same as that in the above embodiments, and will not be repeated here.

[0061] See also Figure 4 In one embodiment, optionally, a first assembly structure 1C0 is provided at the position where the liquid-cooled sidewall 132 is connected to the first circuit board 160, and a second assembly structure is provided at the position where the liquid-cooled sidewall 132 is connected to the second circuit board 170.

[0062] Among them, the first assembly structure 1C0 and the second assembly structure are structures used in the liquid-cooled domain controller to connect the liquid-cooled sidewall 132 with the two circuit boards, which can realize the stable assembly of the circuit boards.

[0063] See also Figure 4In one embodiment, optionally, the first assembly structure 1C0 includes a first Z-shaped step, the first Z-shaped step including a first layer 1C1 and a second layer 1C2, the first layer 1C1 overlapping with the first circuit board 160; a conductive material 1C3 is coated on the second layer 1C2; copper exposure is performed on the edge of the first circuit board 160 away from the first cover plate 110, a portion of the exposed copper area is in contact with the conductive material 1C3; the second assembly structure includes a second Z-shaped step, the second Z-shaped step including a third layer and a fourth layer, the third layer overlapping with the second circuit board 170; a conductive material 1C3 is coated on the fourth layer; copper exposure is performed on the edge of the second circuit board 170 near the first cover plate 110, a portion of the exposed copper area is in contact with the conductive material 1C3.

[0064] The first layer 1C1 of the first Z-shaped step serves as a support surface, overlapping the edge of the first circuit board 160. It fixes the position of the first circuit board 160 and bears its weight, ensuring stable installation within the first cavity 140 without wobbling. The second layer 1C2 of the first Z-shaped step is located below the first layer 1C1 and is coated with a conductive material 1C3, capable of conducting current or electromagnetic signals. The exposed copper treatment on the first circuit board 160 allows a portion of its exposed copper area to adhere tightly to the conductive material 1C3 of the second layer 1C2 when it overlaps with the first layer 1C1, forming a conductive connection between the first circuit board 160, the conductive material 1C3, and the first Z-shaped step. The third layer of the second Z-shaped step serves as a support surface, overlapping the edge of the second circuit board 170 to fix its position. The fourth layer of the second Z-shaped step is coated with the same conductive material 1C3, allowing a portion of the exposed copper area of ​​the second circuit board 170 to adhere to the conductive material 1C3 of the fourth layer, forming a conductive connection.

[0065] In this embodiment of the invention, by making the exposed copper areas of the first circuit board 160 and the second circuit board 170 conductively connected to the conductive material 1C3 and the corresponding Z-shaped step, the two circuit boards can form a complete grounding loop through the liquid-cooled sidewall 132, thereby ensuring that the liquid-cooled domain controller has good electromagnetic shielding performance.

[0066] The present invention also provides a vehicle, which includes a liquid cooling domain controller device as described in any of the above embodiments, and has corresponding beneficial effects.

[0067] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0068] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A liquid-cooled domain controller, characterized in that, include: First cover plate; The second cover plate and the first cover plate are respectively disposed on the upper and lower sides of the liquid cooling zone controller; A liquid-cooled housing assembly includes a liquid-cooled housing body and a liquid-cooled sidewall, the liquid-cooled sidewall being disposed around the periphery of the liquid-cooled housing body; the liquid-cooled sidewall, the liquid-cooled housing body, and a first cover plate enclose a first cavity, and the liquid-cooled sidewall, the liquid-cooled housing body, and a second cover plate enclose a second cavity; the liquid-cooled housing body includes a liquid-cooled flow channel for containing a liquid-cooling medium; A first circuit board is disposed in the first cavity; The second circuit board is disposed in the second cavity.

2. The liquid-cooled zone controller device according to claim 1, characterized in that, The liquid-cooled housing assembly further includes a liquid-cooled cover plate. The liquid-cooled housing body is groove-shaped, and the liquid-cooled cover plate is located at the groove opening of the liquid-cooled housing body to form a liquid-cooled cavity. The liquid cooling cavity is provided with multiple flow channel ribs, boss partitions, liquid cooling medium inlet and liquid cooling medium outlet; the boss partition is located in the middle of the liquid cooling cavity, the liquid cooling medium inlet is located on one side of the boss partition, and the liquid cooling medium outlet is located on the other side of the boss partition; the flow channel ribs are arranged parallel to the boss partition.

3. The liquid-cooled zone controller device according to claim 2, characterized in that, The liquid-cooled housing body also includes a plurality of first heat dissipation protrusions; the plurality of first heat dissipation protrusions are distributed on the side of the liquid-cooled housing body away from the liquid-cooled cover plate; And / or, the liquid cooling cover plate includes a second heat dissipation protrusion, which is disposed on the side of the liquid cooling cover plate near the first cover plate.

4. The liquid-cooled zone controller device according to claim 3, characterized in that, A heating element is provided on the side of the first circuit board near the liquid-cooled housing body, and the side of the heating element near the liquid-cooled housing body is filled with a first thermally conductive material layer; the second heat dissipation boss and the heating element are connected through the first thermally conductive material layer; The heating element is disposed on the side of the second circuit board near the liquid-cooled housing body, and the side of the heating element near the liquid-cooled housing body is filled with a second thermally conductive material layer; the first heat dissipation boss and the heating element are connected through the second thermally conductive material layer.

5. The liquid-cooled zone controller device according to claim 2, characterized in that, The side of the liquid-cooled cover plate away from the first cover plate is in contact with the boundary of the liquid-cooled cavity.

6. The liquid-cooled zone controller device according to claim 1, characterized in that, It also includes a sealing material layer; A first U-shaped adhesive groove is provided at the end of the liquid-cooled sidewall near the first cover plate; A raised first sealing rib is provided on the first cover plate, and the first sealing rib is accommodated in the first U-shaped adhesive groove. The sealing material layer fills the gap between the first sealing rib and the first U-shaped adhesive groove.

7. The liquid-cooled zone controller device according to claim 6, characterized in that, A second U-shaped adhesive groove is provided at the end of the liquid-cooled sidewall near the second cover plate; A raised second sealing rib is provided on the second cover plate, and the second sealing rib is accommodated in the second U-shaped adhesive groove. The sealing material layer fills the gap between the second sealing rib and the second U-shaped adhesive groove.

8. The liquid-cooled zone controller device according to claim 1, characterized in that, A first assembly structure is provided on the inner side of the liquid-cooled sidewall at the position where it connects to the first circuit board, and a second assembly structure is provided on the inner side of the liquid-cooled sidewall at the position where it connects to the second circuit board.

9. The liquid-cooled zone controller device according to claim 8, characterized in that, The first assembly structure includes a first Z-shaped step, which includes a first layer and a second layer. The first layer overlaps with the first circuit board. A conductive material is applied to the second layer. Copper exposure is performed on the edge of the first circuit board away from the first cover plate, and a portion of the exposed copper area is in contact with the conductive material. The second assembly structure includes a second Z-shaped step, the second Z-shaped step includes a third layer and a fourth layer, the third layer overlaps with the second circuit board; the conductive material is coated on the fourth layer; Exposed copper is applied to the edge of the second circuit board near the first cover plate, and a portion of the exposed copper area is bonded to the conductive material.

10. A vehicle, characterized in that, The vehicle includes a liquid-cooled domain controller device as described in any one of claims 1-9.

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