A master board liquid cooling heat dissipation development debugging module and a debugging method

Abstract

This invention relates to the field of liquid cooling technology, and discloses a liquid cooling heat dissipation R&D and debugging module and debugging method for a main control board. The module includes a cooling box body, a turbulence column array, a turbulence driving component, a signal reading unit, and a controller. The cooling box body is adapted to main control boards with different layouts. The turbulence column array is equipped with an integrated temperature measurement unit, which consists of temperature sensors independently set on each turbulence column. The turbulence columns achieve sealing expansion and contraction relative to the cooling box body by applying a preset driving force externally. The turbulence driving component achieves the adsorption of turbulence columns through an electromagnetic ring. The signal reading unit completes the acquisition, conversion, and transmission of temperature signals. The controller is electrically connected to each component to realize the automatic control of each component. Combined with the debugging method, this module can automatically realize the iterative adjustment of the turbulence structure without changing the mold, significantly shortening the debugging cycle and reducing R&D costs, and adapting to the liquid cooling heat dissipation R&D needs of various high-heat electronic devices.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and in particular to a liquid cooling heat dissipation development and debugging module and debugging method for a main control board. Background Technology

[0002] With the significant increase in demand for artificial intelligence and big data processing, the computing tasks of controller motherboards are becoming increasingly heavy, leading to a surge in power consumption and heat generation. Traditional air cooling methods are no longer sufficient to meet these demands, and liquid cooling technology has become a crucial technological approach for solving the heat dissipation problem of high-performance controller motherboards. In the design of liquid coolers, incorporating turbulence structures within the flow channels is the core method for enhancing heat transfer. However, determining the optimal turbulence structure scheme for a controller motherboard with a specific component layout and power consumption spectrum to achieve uniform and controllable overall board temperature and maximize heat dissipation efficiency remains a key bottleneck in current research and development.

[0003] Existing technologies suffer from long debugging cycles and high costs. Each iteration relies on the processing and testing of molds, but each mold only verifies a single, fixed turbulence structure scheme, resulting in extremely low data acquisition efficiency. The debugging cycle increases significantly with the number of iterations, and the cost increases linearly. Summary of the Invention

[0004] The primary objective of this invention is to address the drawbacks of long debugging cycles and high costs associated with the debugging of existing liquid-cooled heat sink turbulence columns. This invention provides a main control board liquid-cooled heat sink R&D and debugging module that significantly shortens the debugging cycle and reduces R&D costs.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0006] A main control board liquid cooling heat dissipation research and debugging module includes:

[0007] The cooling box body has a cooling channel system inside, and its surface is replaceably equipped with a main control board, which is an object to be debugged with different component layouts.

[0008] The turbulence column array consists of several independent turbulence columns that can be sealed and extended in the vertical direction. The extension and retraction of the turbulence columns require a preset driving force. The turbulence columns are arranged in a preset array within the cooling channel system, with the end of the turbulence column furthest from the main control board located outside the cooling box body.

[0009] The turbulence drive assembly includes a drive plate, a lifting drive component, and a magnetic gripping array;

[0010] The drive board is located on the side of the cooling box body away from the main control board. It moves closer to or away from the cooling box body as the lifting drive component moves.

[0011] The magnetic gripping array is fixed on the side of the drive plate near the cooling box body. It consists of multiple magnetic gripping components that correspond one-to-one with the turbulence columns. The magnetic gripping components can attract or release the corresponding turbulence columns when they are energized or de-energized.

[0012] The integrated temperature measurement unit consists of temperature sensors independently mounted on each of the turbulence columns;

[0013] The signal reading unit is located on the magnetic gripping array and is used to connect with the integrated temperature measurement unit when the magnetic gripping component contacts the turbulence column in order to read the data from the temperature sensor on the corresponding turbulence column.

[0014] The controller is electrically connected to the lifting drive component, the magnetic grip array, and the signal reading unit.

[0015] Using the above solution, the main body of the cooling box supports replaceable assembly of the main control board, enabling it to adapt to the debugging objects with different component layouts, greatly improving the versatility of the module and eliminating the need to design a separate debugging device for each main control board. The baffle column array adopts an independent structure that can be sealed and extended vertically, and the driving force required for the extension and retraction of the baffle columns is clearly defined. This ensures the sealing of the cooling channel and can stably maintain the preset height of the baffle columns after release, avoiding positional displacement caused by external forces. Combined with the adsorption and release function of the magnetic gripping array, individualized control of the baffle columns is achieved, breaking the traditional fixed... The limitations of the turbulence structure are addressed by independently setting temperature sensors on each turbulence column. Combined with real-time data acquisition from the signal reading unit, the temperature distribution in each area of ​​the cooling channel can be accurately captured, providing data support for turbulence strategy optimization. The electrical connection between the controller and each component ensures the automated linkage of actions such as lifting drive, magnetic attraction control, and data acquisition, reducing manual intervention and improving debugging efficiency. The overall architecture of this module, through the integration of mechanical structure and electronic control system, enables rapid reconstruction of the turbulence scheme and accurate evaluation of heat dissipation effect, significantly shortening the R&D debugging cycle and reducing iteration costs.

[0016] Preferably, the cooling channel system includes a cooling channel that is a rectangular reciprocating serpentine channel, and the turbulence columns are staggered and distributed within the cooling channel along its extension direction.

[0017] Using the above scheme, the rectangular reciprocating serpentine flow channel can significantly extend the flow path of the cooling medium in a limited space, increase its heat exchange time with the main control board, improve the overall heat dissipation uniformity, and avoid local heat accumulation; the staggered distribution design of the turbulence columns, compared with uniform arrangement, can generate more turbulent areas, enhance the fluid disturbance intensity, and improve the heat transfer coefficient.

[0018] Preferably, the integrated temperature measurement unit includes a contact assembly located at the end of each turbulence column away from the main control board. The contact assembly includes concentrically distributed inner and outer ring contacts, which are electrically connected to the two electrodes of the temperature sensor, respectively.

[0019] By adopting the above scheme, the concentric distribution structure ensures the docking accuracy between the contacts and the signal reading unit and maintains the reliability of the contact connection.

[0020] Preferably, the signal reading unit includes:

[0021] The contact connection module includes probe assemblies that correspond one-to-one with the contact assemblies, and are used to electrically connect with the contact assemblies when the magnetic gripping component adsorbs the turbulence column;

[0022] The signal acquisition and conversion module, which is electrically connected to the contact connection module, is used to provide excitation signals to the temperature sensor, receive the sensing signals generated by the sensor, and convert the sensing signals into digital temperature data.

[0023] The data communication module, connected to the signal acquisition and conversion module, is used to send digital temperature data to the controller.

[0024] Using the above scheme, the probe components and contact components of the contact connection module correspond one-to-one, realizing a fast and reliable electrical connection when the magnetic gripping component adsorbs the turbulence column, providing a solid foundation for temperature signal acquisition; the signal acquisition and conversion module provides excitation signals, receives sensing signals and converts them into digital temperature data, and the digital signals can more accurately reflect the actual temperature value; the data communication module ensures the efficient transmission of digital temperature data to the controller, ensuring that the controller can obtain the temperature information of each turbulence column position in a timely manner, providing timely and reliable data support for the subsequent formulation and adjustment of turbulence strategies.

[0025] Preferably, the signal acquisition and conversion module includes:

[0026] Multiple signal conditioning sub-boards are connected to different probe assemblies. Each signal conditioning sub-board constitutes an independent signal acquisition channel and includes a constant current source, amplifier circuit and data converter.

[0027] The local processing unit is connected to each signal conditioning sub-board and is used to coordinate the signal acquisition timing and preliminary data processing of each signal acquisition channel.

[0028] The above scheme equips each signal conditioning sub-board with a constant current source, an amplifier circuit, and a data converter. The constant current source provides a stable operating current to the temperature sensor, ensuring the consistency of the sensor's output signal. The amplifier circuit amplifies weak sensor signals, improving the signal-to-noise ratio. The data converter accurately converts analog signals to digital signals, ensuring the accuracy of temperature data. Multiple signal conditioning sub-boards correspond to different probe components, supporting multi-channel parallel acquisition to avoid congestion problems in single-channel acquisition, and can simultaneously acquire temperature data from all turbulence column locations. The local processing unit coordinates the acquisition timing of each channel to avoid signal interference, while simultaneously performing preliminary data processing, reducing the computational burden on the controller and ensuring high efficiency in data processing. This design can adapt to the temperature measurement needs of large-scale turbulence column arrays, providing solid technical support for quickly plotting temperature distribution maps and timely adjusting turbulence strategies.

[0029] Preferably, the probe assembly includes a center probe and an outer probe that correspond to the inner ring contact and the outer ring contact, respectively.

[0030] By adopting the above scheme, precise docking between the probe and the contact point can be achieved, ensuring the reliability of temperature signal transmission.

[0031] Preferably, the magnetic gripping component includes a movable column fixed on the drive plate and an electromagnetic ring. The electromagnetic ring is fixed on the side of the movable column near the cooling box body, and a positioning ring is protruding from the end of the movable column inside the electromagnetic ring. The center probe is inserted into the positioning ring, and the outer probe is sleeved outside the positioning ring. The distance between the outer probe and the inner wall of the electromagnetic ring is matched. The center probe and the outer probe are elastically extended and retracted relative to the magnetic gripping component by a spring.

[0032] Using the above scheme, the electromagnetic ring attracts the turbulence column when energized and releases it when de-energized. The control method is simple and efficient, and the attraction force is stable, ensuring that the turbulence column does not fall off or shift during the lifting and lowering process. The positioning ring provides precise guidance for the center probe and the outer ring probe, ensuring the docking accuracy between the probe and the contact assembly. At the same time, the spacing between the outer ring probe and the inner wall of the electromagnetic ring matches to avoid jamming or interference during probe movement.

[0033] Preferably, the lifting drive component is a servo electric actuator or a servo linear module.

[0034] Using the above solution, the servo electric actuator and servo linear module have the core advantages of high positioning accuracy, stable operation and fast response speed. They can accurately control the moving distance and speed of the drive board and ensure that the lifting and lowering movement of the spoiler column strictly meets the requirements of the debugging strategy.

[0035] The second objective of this invention is to provide a debugging method for a liquid cooling heat dissipation R&D debugging module for a main control board, comprising the following steps:

[0036] S1. Control the drive board to move so that the signal reading unit contacts the integrated temperature measuring unit on the turbulence column, collect the temperature data of all turbulence columns in the initial turbulence-free state, and generate a preliminary temperature distribution map.

[0037] S2. Based on the preliminary temperature distribution map generated in S1, perform automated turbulence array reconstruction to form a differentiated turbulence height configuration, specifically including:

[0038] S21. The control drive board approaches the main body of the cooling box and uses a magnetic gripping array to attract all the turbulence columns. It then drives the turbulence columns to move synchronously into the main body of the cooling box until the bottom of all the turbulence columns abuts against the inner wall of the cooling channel near the main control board. This position is used as the unified zero-point reference for calculating the extension of all turbulence columns.

[0039] S22. The control drive board carries all the adsorbed turbulence columns to rise synchronously, and based on the debugging strategy formulated in the preliminary temperature distribution map, selectively controls the magnetic gripping component to de-energize at different height positions to release the corresponding turbulence columns.

[0040] S23. Under the new turbulence height distribution formed in step S22, the system is brought to thermal equilibrium. Step S1 is executed again to obtain a new temperature distribution map to evaluate the heat dissipation effect. If the evaluation result does not meet the preset optimization target, the new temperature distribution map is used as input to adjust the debugging strategy and return to step S21 to execute the next iteration until a turbulence height distribution that meets the optimization target is obtained.

[0041] The above scheme achieves automated and intelligent iterative optimization of the turbulence scheme based on the module's hardware structure, changing the inefficient debugging mode that relies on manual design, mold processing, and repeated testing. Step S1, drawing the initial temperature distribution map, collects temperature data under turbulence-free conditions, providing a clear benchmark for subsequent turbulence strategy formulation, making turbulence optimization more targeted. Step S2, configuring the differentiated turbulence height, achieves automated reconstruction and iterative optimization of the turbulence array through a closed-loop process formed by establishing a unified zero-point benchmark in S21, strategic extension in S22, and effect evaluation and optimization in S23. Establishing a unified benchmark ensures consistency in the calculation of the extension amount of all turbulence columns, avoiding uneven turbulence effects caused by individual deviations; strategic extension is based on temperature distribution to achieve targeted turbulence enhancement; effect evaluation and optimization continuously approach the optimal heat dissipation effect through repeated iterations. The entire method does not require mold replacement; the turbulence structure can be quickly adjusted through the electronic control system, significantly shortening the debugging cycle and reducing R&D costs. Simultaneously, it can formulate personalized turbulence schemes for the heat dissipation characteristics of different main control boards, improving the accuracy and reliability of heat dissipation.

[0042] Preferably, a release position threshold or release time threshold is set for each turbulence column. The value of the threshold is determined based on the temperature value at the corresponding position in the preliminary temperature distribution map. The higher the temperature value, the smaller the set release threshold. When the real-time position or rise time of the drive board reaches the release threshold of any turbulence column, the corresponding magnetic gripping component is de-energized to release the turbulence column.

[0043] By adopting the above scheme, the debugging strategy of step S22 is clarified. By linking the release threshold with the temperature value, the turbulence height can be precisely and differentiatedly configured, thereby enhancing the heat dissipation effect of the high-heat area.

[0044] This invention, by employing the above technical solutions, achieves significant technical effects: through innovative module structure and optimized debugging methods, it enables automated and rapid iterative debugging of the main control board's liquid cooling heat dissipation. The cooling box body is adaptable to main control boards with different layouts. Combined with an independently sealable and retractable array of turbulence columns requiring pre-set driving force and magnetic drive components, the turbulence structure can be quickly reconstructed without changing the mold, significantly shortening the debugging cycle and reducing R&D costs. The integrated temperature measurement unit and signal reading unit accurately capture the temperature distribution within the cooling channel. Combined with a differentiated configuration strategy of "the higher the temperature, the stronger the turbulence" and an iterative optimization process, it effectively improves the overall temperature uniformity and heat dissipation efficiency of the main control board. After the controller is electrically connected to each component, a fully automated control closed loop is constructed, reducing manual intervention and operational errors, and ensuring debugging accuracy. The module structure design considers sealing, stability, and versatility, and can be extended to the development of liquid cooling heat dissipation solutions for various high-heat electronic devices, possessing multiple core advantages such as high efficiency, high adaptability, accuracy, and economy. Attached Figure Description

[0045] Figure 1 This is a front view of a main control board liquid cooling heat dissipation R&D and debugging module according to this embodiment;

[0046] Figure 2 yes Figure 1 A sectional view of AA;

[0047] Figure 3 yes Figure 2 A cross-sectional view of BB;

[0048] Figure 4 This is an isometric view of the driver board and the magnetic gripping array mounted thereon in this embodiment;

[0049] Figure 5 This is an isometric view of the driver board and the signal acquisition and conversion module mounted thereon in this embodiment.

[0050] Figure 6 This is an isometric view of the turbulence column in this embodiment;

[0051] Figure 7 This is a flowchart of the main control board liquid cooling heat dissipation research and debugging method in this embodiment.

[0052] The parts referred to by the numbers in the above attached figures are as follows: 1. Cooling box body; 101. Box body; 1011. Cooling channel; 1012. Inlet; 1013. Outlet; 102. Cover; 2. Main control board; 3. Drive board; 301. Guide block; 4. Magnetic gripping component; 401. Moving column; 4011. Positioning ring; 402. Electromagnetic ring; 5. Assembly plate; 6. Servo electric push rod; 7. Base; 8. Support frame; 9. Controller; 10. Signal conditioning sub-board; 11. Local processing unit; 12. Baffle column; 121. Baffle fluid; 122. Working end cover; 1221. Assembly section; 1222. Mating groove; 13. Temperature sensor; 14. Contact assembly; 141. Inner ring contact; 142. Outer ring contact; 15. Probe assembly; 151. Center probe; 152. Outer ring probe; 16. Spring. Detailed Implementation

[0053] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0054] A liquid cooling heat dissipation research and debugging module for a main control board, referring to Figures 1-6 As shown, it includes a cooling box body 1, a turbulence column array, a turbulence drive component, an integrated temperature measurement unit, a signal reading unit, and a controller 9.

[0055] The cooling box body 1 is formed by bolting together an aluminum alloy box body 101 and a cover 102, creating a sealed space to accommodate the cooling channel system. The cooling channel system consists of a single cooling channel 1011, which is a rectangular reciprocating serpentine channel. The inlet 1012 and outlet 1013 of the cooling channel 1011 are located at both ends of the side wall of the box body 101, facilitating the circulation of the cooling medium. The cover 102 has a 6×6 array of mounting through holes for assembling an array of turbulence-inducing columns. A main control board 2, to be debugged, is replaceably mounted on the side of the box body 101 away from the cover 102 using bolts. The main control board 2 has connecting blocks with mounting holes on both sides, corresponding one-to-one with the connecting blocks on both sides of the box body 101 and the cover 102. All three are synchronously fixed using the same bolts, adapting to the debugging requirements of main control boards 2 with different component layouts.

[0056] The baffle column array consists of 36 independent baffle columns 12, each of which is correspondingly and sealed into the mounting through hole of the cover 102. The baffle column array integrates an integrated temperature measurement unit. The integrated temperature measurement unit includes a temperature sensor 13 and a contact assembly 14 disposed in each baffle column 12. The temperature sensor 13 adopts a miniature NTC temperature sensor.

[0057] The turbulence column 12 includes a turbulence body 121 and a working end cap 122. The turbulence body 121 is made of 304 stainless steel and has a hollow cylindrical structure. The inner wall of the end away from the main control board 2 has an internal thread. The working end cap 122 is also made of 304 stainless steel and includes an assembly section 1221 that extends into the turbulence body 121 and is adapted to the internal thread, and a mating groove 1222 for concentrically guiding the electromagnetic ring 402. The opening end of the mating groove 1222 is set in a conical ring shape to facilitate the introduction of the electromagnetic ring 402. The assembly section 1221 and the mating groove 1222 are located at opposite ends of the working end cap 122. After the assembly section 1221 is screwed into the turbulence body 121 through a threaded fit, a space is reserved between its end and the end of the turbulence body 121 near the main control board 2 for the installation of a temperature sensor 13. The temperature sensor 13 is embedded in this space, and thermally conductive silicone grease is filled between the temperature sensor 13 and the inner wall of the turbulence body 121 to enhance heat conduction.

[0058] The contact assembly 14 includes concentrically distributed inner ring contacts 141 and outer ring contacts 142. An insulating gasket is provided in the mating groove 1222. The gasket is made of polytetrafluoroethylene and is fixed to the bottom of the mating groove 1222 with high-temperature resistant epoxy adhesive. The surface of the gasket has installation positions adapted to the inner ring contacts 141 and outer ring contacts 142 to achieve electrical insulation between the contact assembly 14 and the working end cover 122. The two electrode wires of the temperature sensor 13 extend along the hollow channel inside the turbulence fluid 121 into the mating groove 1222 and are welded and fixed to the inner ring contacts 141 and outer ring contacts 142 respectively. The weld joint is sealed with insulating sealant to prevent the cooling medium from seeping in and further enhance the insulation effect.

[0059] The outer wall of the turbulence column 121 is fixedly fitted with an elastic layer made of highly elastic damping rubber. The elastic layer fits tightly against the inner wall of the mounting through hole of the cover 102, achieving both a leak-proof seal and providing damping for the extension and retraction of the turbulence column 12. A preset driving force is required to drive the turbulence column 12. This driving force is greater than the contact elastic force of the subsequent probe assembly 15 and the frictional force when the electromagnetic ring 402 is inserted, ensuring that the turbulence column 12 can stably maintain the preset height after release. All turbulence columns 12 are staggered along the extension direction of the cooling channel and achieve independent sealed extension and retraction. The mating groove 1222 end of the working end cover 122 extends beyond the cooling box body 1, facilitating cooperation with the subsequent magnetic gripping array.

[0060] The turbulence drive assembly is located on the side of the cover 102 away from the box 101, and includes a drive plate 3, a lifting drive component, and a magnetic gripping array. The lifting drive component is a servo electric push rod 6, which is fixed on the base 7 of the module, and the output shaft is bolted vertically upward to the center of the drive plate 3. The module is equipped with a support frame 8, which is fixed parallel to the base 7. Vertical guide grooves are provided on opposite sides of the support frame 8, and the two ends of the drive plate 3 are guided and slidably assembled on the vertical guide grooves through guide blocks 301.

[0061] The upper end of the support frame 8 is also provided with threaded holes. The connecting blocks on both sides of the main control board 2, the box body 101, and the cover 102 have corresponding mounting holes on the upper and lower sides. These mounting holes are aligned with the threaded holes. The main control board 2, the box body 101, and the cover 102 can be tightly fitted with the threaded holes on the support frame 8 through the same bolt, so as to realize the installation of the main control board 2 on the cooling box body 1, the sealing assembly of the cooling box body 1, and the fixed assembly of the main control board 2 and the cooling box body 1 on the support frame 8.

[0062] The magnetic gripping array consists of 36 magnetic gripping components 4 corresponding one-to-one with the 36 turbulence columns 12. Each magnetic gripping component 4 includes a movable column 401 fixed on the drive plate and an electromagnetic ring 402. The movable column 401 is fixed on the drive plate 3, and the electromagnetic ring 402 is screwed to one end of the movable column 401 near the cooling box body 1. An annular positioning ring 4011 is protruding from the end of the movable column 401 inside the electromagnetic ring 402 for guiding the probe assembly 15. After the electromagnetic ring 402 is energized, it can be concentrically guided into the mating groove 1222 of the working end cover 122 of the turbulence column 12 to achieve stable adsorption of the turbulence column 12.

[0063] The signal reading unit is integrated on the magnetic gripping component 4, including a contact connection module, a signal acquisition and conversion module, and a data communication module. The contact connection module is a probe assembly 15 adapted to the contact assembly 14. Each probe assembly 15 includes a central probe 151 and an outer ring probe 152. The central probe 151 is guided and inserted into the positioning ring 4011, and the outer ring probe 152 is guided and sleeved outside the positioning ring 4011 and maintains a distance fit with the inner wall of the electromagnetic ring 402. A spring 16 is fixed to the rear end of both probes, and the end of the spring 16 away from the probe is fixed to a fixed ring. The fixed ring is fixedly embedded in the moving post 401. Through the above arrangement, the central probe 151 and the outer ring probe 152 can achieve elastic extension and contraction, and are partially located outside the electromagnetic ring 402 in normal state. This ensures that when the electromagnetic ring 402 is inserted into the bottom of the mating groove 1222, the central probe 151 and the outer ring probe 152 can make tight contact with the inner ring contact 141 and the outer ring contact 142, respectively.

[0064] The signal acquisition and conversion module includes six signal conditioning sub-boards 10 and one local processing unit 11. Each signal conditioning sub-board 10 is connected to a probe assembly 15 with six baffle pillars 12. Each signal conditioning sub-board 10 integrates a constant current source, an amplifier circuit, and a data converter. The constant current source provides stable excitation for the temperature sensor 13, the amplifier circuit amplifies the weak sensing signal, and the data converter converts the analog signal into digital temperature data. The local processing unit 11 uses an STM32 microcontroller and is connected to each signal conditioning sub-board 10 via an SPI bus to coordinate the acquisition timing of each channel and perform preliminary data filtering. The data communication module uses an RS485 communication module, which is electrically connected to the local processing unit 11 and is responsible for transmitting digital temperature data to the controller 9.

[0065] The signal acquisition and conversion module is fixed on the side of the drive board 3 away from the magnetic gripping array. In order to assemble the servo electric push rod 6, an assembly plate 5 is fixed on the side of the drive board 3 away from the magnetic gripping array. There is an assembly space between the assembly plate 5 and the drive board 3 for assembling the signal acquisition and conversion module. The output shaft of the servo electric push rod 6 is fixedly connected to the assembly plate 5.

[0066] The controller 9 is a PLC controller, which is installed on the side of the support frame 8 and is electrically connected to the servo electric push rod 6, the electromagnetic ring 402, the signal conditioning sub-board 10 and the data communication module through wires.

[0067] Reference Figure 7 As shown, the debugging method for using the module in this embodiment is as follows:

[0068] S1. Control the drive board 3 to move, so that the signal reading unit contacts the integrated temperature measuring unit on the turbulence column 12, collect the temperature data of all turbulence columns 12 in the initial undisturbed state, and generate a preliminary temperature distribution map, specifically including:

[0069] S11. After reaching thermal equilibrium from the undisturbed state, the probe assembly 15 of the signal reading unit precisely connects with the contact assembly 14 of the turbulence column 12. The constant current source of the signal conditioning sub-board 10 provides a stable excitation current to the temperature sensor 13. The temperature sensor 13 converts the temperature change into a weak resistance change signal, which is amplified by the amplifier circuit and then converted into digital temperature data by the data converter. The local processing unit coordinates the timing of 36 independent signal acquisition channels to avoid data conflicts, and simultaneously filters and denoises the raw data to ensure data reliability.

[0070] S12, the local processing unit 11 transmits 36 discrete temperature data to the controller 9 via an RS485 communication module. The controller 9 first performs coordinate calibration on the data, binding each temperature data point to the physical coordinates of the baffle column 12 within the cooling channel 1011; then, it performs data normalization processing, mapping all temperature values ​​to a unified range, which in this embodiment is 0-100℃, eliminating range offsets caused by individual errors of the temperature sensor 13; finally, it uses an interpolation algorithm to complete the discrete data, filling the temperature data gaps between the baffle columns and forming a continuous temperature data matrix.

[0071] S13 and controller 9 spatially map the standardized temperature data matrix to the physical model of the cooling channel 1011 to clarify the actual position of each data point in the cooling channel 1011; then, through the heat map rendering rules, different temperature values ​​are corresponding to different color gradients. In this embodiment, low temperature corresponds to blue, medium temperature corresponds to yellow, and high temperature corresponds to red, finally generating a heat map that intuitively reflects the temperature distribution in the cooling channel, clearly presenting the high heat generation area and temperature uniformity.

[0072] S2. Based on the preliminary temperature distribution map generated in S1, perform automated turbulence array reconstruction to form a differentiated turbulence height configuration, specifically including:

[0073] S21. The control drive board 3 approaches the cooling box body 1 and uses a magnetic gripping array to attract all the turbulence columns 12. The turbulence columns 12 are driven to move synchronously into the cooling box body 1 until the bottom of all the turbulence columns 12 abuts against the inner wall of the cooling channel near the main control board 2. This position is used as the unified zero point reference for calculating the extension of all the turbulence columns 12.

[0074] S22, the control drive board 3 carries all the adsorbed turbulence columns 12 to rise synchronously, and based on the debugging strategy formulated according to the preliminary temperature distribution map, selectively controls the magnetic gripping component 4 to de-energize at different height positions to release the corresponding turbulence column 12, specifically including:

[0075] S221 and controller 9 receive the temperature data matrix corresponding to the initial temperature distribution map. Taking the position of all the turbulence columns 12 "abutting the inner wall of the cooling channel at the bottom" as a unified zero point reference, they establish a coordinate system for calculating the extension amount of the turbulence columns 12. The extension amount = the rising distance of the drive plate - the distance corresponding to the release threshold, ensuring that the height adjustment of all turbulence columns 12 has a unified reference standard.

[0076] S222 and controller 9 extract the temperature value of each coordinate point and allocate the release position threshold according to the principle of "the higher the temperature, the smaller the release threshold". If the temperature of a certain area in the cooling channel is 80℃, it is a high temperature zone, and the release position threshold is set to 5mm; if the temperature of a certain area is 40℃, it is a low temperature zone, and the release position threshold is set to 15mm. The threshold is linearly negatively correlated with the temperature value. Threshold = K - ΔT × α, where K is the maximum release distance constant, ΔT is the difference between the measured temperature and the reference temperature, and α is the proportional coefficient.

[0077] S223, the controller 9 sends an extension command to the servo electric push rod 6, and the drive board 3 drives all the adsorbed turbulence columns 12 to move synchronously closer to the cover 102. The algorithm collects the real-time position data of the drive board 3 in real time, and through the encoder feedback of the servo electric push rod 6, when the real-time position reaches the release threshold of a certain turbulence column 12, it immediately sends a de-energization signal to the electromagnetic ring 402 of the corresponding magnetic gripping component 4. The electromagnetic ring 402 loses its adsorption force, and the turbulence column 12 stably maintains its current extension height under the sealing damping effect of the elastic damping rubber, realizing differentiated turbulence configuration.

[0078] S23. Under the new turbulence height distribution formed in step S22, the system is brought to thermal equilibrium. Step S1 is executed again to obtain a new temperature distribution map to evaluate the heat dissipation effect. If the evaluation result does not meet the preset optimization target, the new temperature distribution map is used as input to adjust the debugging strategy, and the process returns to step S21 to execute the next iteration until a turbulence height distribution that meets the optimization target is obtained. Specifically, this includes:

[0079] S231. After the new turbulence height configuration is completed, the algorithm control system continues to run for a preset time, which is 30 minutes in this embodiment, and monitors the rate of change of the temperature data matrix in real time. When the fluctuation range of all temperature data within 5 consecutive minutes is ≤ ±0.5℃, the system is determined to have reached thermal equilibrium.

[0080] S232. Extract the temperature data after thermal equilibrium, generate a new temperature distribution map, and calculate two core evaluation indicators: one is the highest temperature of the entire plate, which is set to ≤ 60℃ in this embodiment; the other is the temperature standard deviation, which is set to ≤ 5℃ in this embodiment. If both indicators meet the requirements, the algorithm outputs the optimal turbulence height configuration scheme; if not, the new temperature distribution map is used as input to recalculate the release threshold of each region, further reduce the release threshold and increase the extension of the turbulence columns that are still in the high-temperature zone, and return to step S21 to start the next round of iteration until the optimization goal is achieved.

[0081] Explanation of features involved in this embodiment:

[0082] Undisturbed state: This refers to a state where all the turbulence columns 12 within the cooling channel 1011 are fully retracted and do not extend into the cooling channel 1011 to disturb the flow of the cooling medium. In this state, the cooling medium within the cooling channel 1011 is only affected by the channel structure itself, flowing in a stable laminar or weakly turbulent manner, without being actively disturbed by the turbulence columns 12. This is the baseline state for evaluating the natural heat distribution of the main control board.

[0083] Thermal equilibrium state: refers to a stable state in which the heat generation power of the main control board 2 and the heat dissipation power of the liquid cooling system reach a dynamic balance, and the temperature of each area within the cooling channel 1011 no longer changes significantly over time. The core criterion is "within a continuous preset time period, the fluctuation range of all temperature data is controlled within a preset threshold". In this embodiment, the specific temperature fluctuation is ≤ ±0.5℃ within 5 consecutive minutes.

[0084] Unified zero-point reference: A unified reference starting point set for calculating the extension of all turbulence columns, specifically the position where "the bottom end of the turbulence column 12 is completely in contact with the inner wall of the cooling channel 1011 near the main control board 2". The extension of all turbulence columns 12 is calculated based on this position, i.e., extension = driving plate rising distance - distance corresponding to the release threshold.

[0085] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A main control board liquid cooling heat dissipation research and debugging module, characterized in that, include: The cooling box body (1) has a cooling channel system inside, and its surface is replaceably equipped with a main control board (2). The main control board (2) is an object to be debugged with different component layouts. The turbulence column array consists of several independent turbulence columns (12) that can be sealed and extended in the vertical direction. The extension and retraction of the turbulence columns (12) requires a preset driving force. The turbulence columns (12) are arranged in the cooling channel system according to a preset array. The end of the turbulence column (12) away from the main control board (2) is located outside the cooling box body (1). The turbulence drive assembly includes a drive plate (3), a lifting drive component, and a magnetic gripping array; The drive board (3) is located on the side of the cooling box body (1) away from the main control board (2). As the lifting drive component is driven, it moves closer to or further away from the cooling box body (1). The magnetic gripping array is fixed on the side of the drive plate (3) near the cooling box body (1). It consists of multiple magnetic gripping components (4) that correspond one-to-one with the turbulence column (12). The magnetic gripping component (4) can attract or release the corresponding turbulence column (12) when it is energized or de-energized. The integrated temperature measurement unit consists of temperature sensors (13) independently installed on each of the turbulence columns (12); The signal reading unit is set on the magnetic gripping array and is used to connect with the integrated temperature measurement unit when the magnetic gripping component (4) contacts the turbulence column (12) to read the data of the temperature sensor (13) on the corresponding turbulence column (12); The controller (9) is electrically connected to the lifting drive component, the magnetic grip array, and the signal reading unit.

2. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 1, characterized in that, The cooling channel system includes a cooling channel (1011), which is a rectangular reciprocating serpentine channel, and the turbulence columns (12) are staggered in the cooling channel (1011) along its extension direction.

3. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 1, characterized in that, The integrated temperature measurement unit includes a contact assembly (14) located at the end of each turbulence column (12) away from the main control board (2). The contact assembly (14) includes concentrically distributed inner ring contacts (141) and outer ring contacts (142). The inner ring contacts (141) and outer ring contacts (142) are fixedly connected to the two electrodes of the temperature sensor (13), respectively.

4. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 3, characterized in that, The signal reading unit includes: The contact connection module includes a probe assembly (15) corresponding to the contact assembly (14) for electrically connecting with the contact assembly (14) when the magnetic gripping component (4) adsorbs the turbulence column (12); The signal acquisition and conversion module is electrically connected to the contact connection module and is used to provide an excitation signal to the temperature sensor (13), receive the sensing signal generated by it, and convert the sensing signal into digital temperature data. The data communication module is connected to the signal acquisition and conversion module and is used to send digital temperature data to the controller (9).

5. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 4, characterized in that, The signal acquisition and conversion module includes: Multiple signal conditioning sub-boards (10) are connected to different probe assemblies (15). Each signal conditioning sub-board (10) constitutes an independent signal acquisition channel and includes a constant current source, an amplifier circuit and a data converter. The local processing unit (11) is connected to each signal conditioning sub-board (10) and is used to coordinate the signal acquisition timing and preliminary data processing of each signal acquisition channel.

6. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 4, characterized in that, The probe assembly (15) includes a center probe (151) and an outer probe (152) corresponding to the inner ring contact (141) and the outer ring contact (142), respectively.

7. A main control board liquid cooling heat dissipation R&D and debugging module according to claim 6, characterized in that, The magnetic gripping component (4) includes a movable column (401) fixed on the drive plate (3) and an electromagnetic ring (402). The electromagnetic ring (402) is fixed on the side of the movable column (401) near the cooling box body (1). A positioning ring (4011) is protruding from the end of the movable column (401) inside the electromagnetic ring (402). The center probe (151) is inserted into the positioning ring (4011), and the outer ring probe (152) is sleeved on the outside of the positioning ring (4011). The distance between the outer ring probe (152) and the inner wall of the electromagnetic ring (402) is matched. The center probe (151) and the outer ring probe (152) are elastically extended and retracted relative to the magnetic gripping component (4) by a spring (16).

8. The main control board liquid cooling heat dissipation R&D and debugging module according to claim 1, characterized in that: The lifting drive component is a servo electric push rod (6) or a servo linear module.

9. A debugging method, applied to the main control board liquid cooling heat dissipation R&D debugging module as described in any one of claims 1-8, characterized in that, Includes the following steps: S1. Control the drive board (3) to move so that the signal reading unit contacts the integrated temperature measuring unit on the turbulence column (12), collect the temperature data of all turbulence columns (12) in the initial turbulence-free state, and generate a preliminary temperature distribution map; S2. Based on the preliminary temperature distribution map generated in S1, perform automated turbulence array reconstruction to form a differentiated turbulence height configuration, specifically including: S21. The control drive board (3) approaches the cooling box body (1) and uses a magnetic gripping array to attract all the turbulence columns (12). It then drives the turbulence columns (12) to move synchronously into the cooling box body (1) until the bottom of all the turbulence columns (12) abuts against the inner wall of the cooling channel near the main control board (2). This position is used as the unified zero-point reference for calculating the extension of all the turbulence columns (12). S22, the control drive board (3) carries all the adsorbed turbulence columns (12) to rise synchronously, and based on the debugging strategy formulated by the preliminary temperature distribution map, selectively controls the magnetic gripping component (4) to de-energize at different height positions to release the corresponding turbulence column (12). S23. Under the new turbulence height distribution formed in step S22, the system is brought to thermal equilibrium. Step S1 is executed again to obtain a new temperature distribution map to evaluate the heat dissipation effect. If the evaluation result does not meet the preset optimization target, the new temperature distribution map is used as input to adjust the debugging strategy and return to step S21 to execute the next iteration until a turbulence height distribution that meets the optimization target is obtained.

10. A debugging method according to claim 9, characterized in that, The debugging strategy of S22 includes: setting a release position threshold or release time threshold for each turbulence column (12), the size of which is determined according to the temperature value of the corresponding position in the preliminary temperature distribution diagram; wherein, the higher the temperature value, the smaller the set release threshold; when the real-time position or rise time of the drive board (3) reaches the release threshold of any turbulence column (12), the corresponding magnetic gripping component (4) is de-energized to release the turbulence column (12).

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