Semiconductor roller transport device and semiconductor apparatus

Abstract

The application provides a semiconductor roller conveying device and a semiconductor device, which comprise a groove body, rollers, a roller first support assembly, a roller second support assembly and a transmission assembly, can realize multi-degree-of-freedom adjustment, thereby can greatly simplify an installation and adjustment process and subsequent maintenance work, and reduce production and operation costs; by reducing the roller spacing and adopting a non-standard bevel gear meshing transmission scheme, stable, synchronous driving, compact structure and reliable transmission of a single transmission shaft to multiple cross-arranged rollers are realized, so that when conveying silicon wafers of the same size, the number of effective contact points between the silicon wafers and the rollers is increased by 20%-25%, thereby the conveying stability can be improved, the bending deformation of the silicon wafers is inhibited, the etching uniformity is ensured, and the stability of a process window and the product yield are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor manufacturing, and relates to a semiconductor roller conveying device and a semiconductor equipment. BACKGROUND

[0002] In a semiconductor manufacturing process, the back surface of a silicon wafer can be treated by a wet process to remove substances on the back surface of the silicon wafer to achieve insulation of the front surface and the back surface of the silicon wafer. At present, a roller type conveying mechanism is mostly used to convey the silicon wafer, so that the back surface of the silicon wafer can be in contact with etching liquid to perform the wet process.

[0003] The existing semiconductor roller conveying device has poor operation convenience during installation, debugging, maintenance and repair due to structural limitations. For example, when adjusting the level and height, the production operation cost is increased.

[0004] Therefore, it is necessary to provide a semiconductor roller conveying device and a semiconductor equipment. SUMMARY

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a semiconductor roller conveying device and a semiconductor equipment to solve the problem of operation convenience of the semiconductor roller conveying device in the prior art.

[0006] To achieve the above-mentioned purpose and other related purposes, the present application provides a semiconductor roller conveying device, which comprises:

[0007] a groove body, an inner part of the groove body being provided with a positioning groove;

[0008] a roller, the roller comprising oppositely arranged first and second ends;

[0009] a roller first support assembly, the roller first support assembly comprising:

[0010] a first support side plate, the first support side plate being fixed in the groove body, and the first support side plate being provided with a first support side plate positioning hole;

[0011] a first support, the first support being arranged on the inner side of the first support side plate, the first support being provided with a first support vertical adjusting hole, a first support height adjusting threaded hole and a first accommodating groove; the first support vertical adjusting hole penetrating through the first support from the side wall of the first support and being arranged corresponding to the first support side plate positioning hole; the first support height adjusting threaded hole penetrating through the first support from the top end of the first support, and a corresponding first support height adjusting screw being arranged in the first support height adjusting threaded hole; the first accommodating groove being arranged corresponding to the first end of the roller;

[0012] a second roller support assembly, comprising:

[0013] a support bottom plate fixed in the positioning groove, and a support bottom plate positioning hole provided on the support bottom plate;

[0014] a second support side plate, a second support side plate horizontal adjustment hole and a second support side plate vertical adjustment hole are provided on the second support side plate; the second support side plate horizontal adjustment hole penetrates through the second support side plate from the top end of the second support side plate, and the second support side plate horizontal adjustment hole is correspondingly arranged with the support bottom plate positioning hole; the second support side plate vertical adjustment hole penetrates through the second support side plate from the side wall of the second support side plate;

[0015] a second support provided outside the second support side plate, a second support first fixing hole, a second support height adjustment threaded hole, a second accommodating groove and a second support second fixing hole are provided on the second support; the second support first fixing hole is correspondingly arranged with the second support side plate vertical adjustment hole; the second support height adjustment threaded hole penetrates through the second support from the top end of the second support, and a corresponding second support height adjustment screw is arranged in the second support height adjustment threaded hole; the second accommodating groove is correspondingly arranged with the second end of the roller;

[0016] a transmission assembly provided outside the second support, the transmission assembly comprises a transmission shaft mounting seat, a transmission shaft, a first bevel gear and a second bevel gear; the transmission shaft mounting seat is fixed with the second support through the second support second fixing hole and keeps synchronous displacement; the transmission shaft is mounted on the transmission shaft mounting seat; the first bevel gear is mounted on the second end of the roller; the second bevel gear is mounted on the transmission shaft, and the first bevel gear and the second bevel gear are engaged to drive the roller to rotate;

[0017] wherein, the first accommodating groove and the second accommodating groove are arranged at equal intervals, the diameter of the roller is R, the interval of adjacent rollers is D, and R < D.

[0018] Optionally, the interval D of adjacent rollers is in the range of 35mm ≤ D < 45mm.

[0019] Optionally, the diameter R of the roller is in the range of 32mm ≤ R < 45mm.

[0020] Optionally, the number of teeth z1 of the first bevel gear is in the range of z1 ≤ 14, and the number of teeth z2 of the second bevel gear is in the range of 17 ≤ z2 ≤ 21.

[0021] Optionally, among the two adjacent rollers, one is a left-handed roller and the other is a right-handed roller, and the left-handed roller and the right-handed roller rotate in the same direction.

[0022] Optionally, the materials of the groove, the roller, the first bracket assembly of the roller, the second bracket assembly of the roller and the transmission assembly each include one or a combination of polyvinylidene fluoride, polytetrafluoroethylene and polypropylene.

[0023] Optionally, the groove is provided with two sets of independently arranged devices composed of the roller, the first bracket assembly of the roller, the second bracket assembly of the roller and the transmission assembly, and the two sets of devices are in an axial symmetry structure.

[0024] Optionally, the first bracket vertical adjustment hole includes a waist-shaped hole, the second bracket side plate vertical adjustment hole includes a waist-shaped hole, and the second bracket side plate horizontal adjustment hole includes a waist-shaped hole.

[0025] Optionally, the device further comprises a pressing rod corresponding to the roller, the pressing rod comprises oppositely arranged first and second ends, the first end of the pressing rod is installed in the first accommodating groove, and the second end of the pressing rod is installed in the second accommodating groove.

[0026] The application also provides a semiconductor device comprising the semiconductor roller transmission device.

[0027] As described above, the semiconductor roller transmission device and the semiconductor device of the application comprise a groove, a roller, a first bracket assembly of the roller, a second bracket assembly of the roller and a transmission assembly, wherein the first bracket assembly of the roller comprises a first bracket side plate and a first bracket, the second bracket assembly of the roller comprises a bracket bottom plate, a second bracket side plate and a second bracket, the first bracket assembly of the roller can be adjusted in the vertical direction, and the second bracket assembly of the roller can be adjusted in the horizontal and vertical directions, so that multi-degree-of-freedom adjustment can be realized, thereby greatly simplifying the installation and debugging process and subsequent maintenance work and reducing production and operation costs.

[0028] Further, by reducing the roller spacing and adopting a non-standard bevel gear meshing transmission scheme, stable and synchronous driving of a single transmission shaft on multiple cross-arranged rollers, compact structure and reliable transmission are realized, so that when the same size of silicon wafers is transmitted, the number of effective contact points between the silicon wafers and the rollers increases by 20%~25%, thereby significantly dispersing the pressure of the upper water film on the silicon wafer, improving the transmission stability, inhibiting the bending deformation and "water film dropping" phenomenon of the silicon wafer, ensuring the etching uniformity, and improving the stability of the process window and the product yield.

[0029] The semiconductor roller transmission device and the semiconductor equipment of the present application provide a convenient, stable and uniform solution for silicon wafer transmission, especially thin silicon wafer transmission, and have important engineering application value and market prospect. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 A structure schematic diagram of the semiconductor roller transmission device in the embodiment of the present application is shown.

[0031] Figure 2 A structure schematic diagram of the roller first support assembly in the embodiment of the present application is shown.

[0032] Figure 3 A structure schematic diagram of the roller second support assembly in the embodiment of the present application is shown.

[0033] Figure 4 An exploded structure schematic diagram of the roller second support assembly in the embodiment of the present application is shown.

[0034] Figure 5 A structure schematic diagram of the transmission assembly in the embodiment of the present application is shown.

[0035] BRIEF DESCRIPTION OF DRAWINGS

[0036] 100 Groove body 200 Roller 210 Left-handed roller 220 Right-handed roller 300 Roller first bracket assembly 310 First bracket side plate 320 First bracket 321 First bracket vertical adjustment hole 322 First bracket height adjustment threaded hole 323 First containing groove 330 First bracket height adjustment screw 400 Roller second bracket assembly 410 Bracket bottom plate 411 Bracket bottom plate positioning hole 420 Second bracket side plate 421 Second bracket side plate horizontal adjustment hole 422 Second bracket side plate vertical adjustment hole 430 Second bracket 431 Second bracket first fixing hole 432 Second bracket height adjustment threaded hole 433 Second containing groove 434 Second bracket second fixing hole 500 Transmission assembly 510 Transmission shaft mounting seat 520 Transmission shaft 530 First bevel gear 540 Second bevel gear DETAILED DESCRIPTION

[0037] The present application is described in detail below by specific examples. Other advantages and effects of the present application can be easily understood by those skilled in the art from the disclosure of the present specification. The present application can also be implemented or applied by different specific embodiments, and the details in the present specification can be modified or changed based on different views and applications without departing from the spirit of the present application.

[0038] As described in the detailed description of the embodiments of the present application, the cross-sectional view of the device structure is locally enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.

[0039] For convenience in description, spatially relative terms such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein are to be interpreted in accordance with this understanding.

[0040] Need to explain, the embodiment provided in the figure only in a schematic way to illustrate the basic idea of the present application, so the figure shows only the components related to the present application, not the number of components, shape and size drawn according to the actual implementation, the actual implementation of each component type, quantity and proportion can be a voluntary change, its component layout type may be more complex.

[0041] As Figures 1~5 , the embodiment provides a semiconductor roller transmission device, which comprises:

[0042] The groove body 100 is internally provided with a positioning groove (not shown);

[0043] The roller 200 comprises a first end and a second end arranged oppositely;

[0044] The roller first support assembly 300 comprises:

[0045] The first support side plate 310 is fixed in the groove body 100, and the first support side plate 310 is provided with a first support side plate positioning hole (not shown);

[0046] The first support 320 is arranged on the inner side of the first support side plate 310, and the first support 320 is provided with a first support vertical adjusting hole 321, a first support height adjusting screw hole 322 and a first containing groove 323; the first support vertical adjusting hole 321 penetrates the first support 320 from the side wall of the first support 320 and is arranged correspondingly with the first support side plate positioning hole; the first support height adjusting screw hole 322 penetrates the first support 320 from the top end of the first support 320, and the first support height adjusting screw hole 322 is provided with a corresponding first support height adjusting screw 330; the first containing groove 323 is arranged correspondingly with the first end of the roller 200;

[0047] A second roller support assembly 400, comprising:

[0048] A support bottom plate 410 fixed in the positioning groove, and a support bottom plate positioning hole 411 arranged on the support bottom plate 410;

[0049] A second support side plate 420, a second support side plate horizontal adjustment hole 421 and a second support side plate vertical adjustment hole 422 are arranged on the second support side plate 420; the second support side plate horizontal adjustment hole 421 penetrates the second support side plate 420 from the top end of the second support side plate 420, and the second support side plate horizontal adjustment hole 421 is arranged in correspondence with the support bottom plate positioning hole 411; the second support side plate vertical adjustment hole 422 penetrates the second support side plate 420 from the side wall of the second support side plate 420;

[0050] A second support 430 arranged outside the second support side plate 420, a second support first fixing hole 431, a second support height adjustment threaded hole 432, a second accommodating groove 433 and a second support second fixing hole 434 are arranged on the second support 430; the second support first fixing hole 431 is arranged in correspondence with the second support side plate vertical adjustment hole 422; the second support height adjustment threaded hole 432 penetrates the second support 430 from the top end of the second support 430, and a corresponding second support height adjustment screw (not shown) is arranged in the second support height adjustment threaded hole 432; the second accommodating groove 433 is arranged in correspondence with the second end of the roller 200;

[0051] A transmission assembly 500 arranged outside the second support 430, comprising a transmission shaft mounting seat 510, a transmission shaft 520, a first bevel gear 530 and a second bevel gear 540; the transmission shaft mounting seat 510 is fixed and kept synchronous displacement with the second support 430 through the second support second fixing hole 434; the transmission shaft 520 is mounted on the transmission shaft mounting seat 510; the first bevel gear 530 is mounted on the second end of the roller 200; the second bevel gear 540 is mounted on the transmission shaft 520, and the first bevel gear 530 and the second bevel gear 540 are engaged to drive the roller 200 to rotate;

[0052] Wherein, the first accommodating groove 323 and the second accommodating groove 433 are arranged at equal intervals, the diameter of the roller 200 is R, the interval of adjacent rollers 200 is D, and R < D.

[0053] Specifically, the groove body 100 is mainly used to accommodate a silicon wafer processing liquid, wherein the type of the processing liquid can be selected according to process requirements, such as the processing liquid can include HF, HNO3, H2SO4, etc. The roller 200 is mainly used to carry the silicon wafer to be processed, so as to drive the transmission of the silicon wafer above it through the rotating operation of the roller 200. The roller first support assembly 300 and the roller second support assembly 400 are mainly used to carry the roller 200. The transmission assembly 500 is mainly used to provide rotating power to ensure the rotating operation of the roller 200.

[0054] Wherein, referring to Figure 1 and Figure 2 In this embodiment, the first support side plate 310 in the roller first support assembly 300 is fixed in the groove body 100, such as being fixed with the bottom surface of the groove body 100, and the first support side plate positioning hole is arranged on the first support side plate 310, so as to facilitate the subsequent fixation of the first support 320 through the first support side plate positioning hole and the mounting member such as a screw combined with the first support vertical adjustment hole 321 on the first support 320.

[0055] Wherein, the first support height adjustment threaded hole 322 can be preferably a threaded hole with a smooth upper part and a threaded lower part, so as to facilitate the installation of the first support height adjustment screw 330. Through the first support height adjustment screw 330 and the first support vertical adjustment hole 321, the height of the first support 320 can be adjusted along the vertical direction, i.e. Figure 1 and Figure 2 Y direction, which can be specifically referred to Figure 2 When the first support height adjustment screw 330 is screwed in and out, the height of the first support 320 can be adjusted within the adjustment range accommodated by the first support vertical adjustment hole 321. The first accommodating groove 323 is correspondingly arranged with the first end of the roller 200, and the first end of the roller 200 can be installed in the first accommodating groove 323 through a bearing, etc., and the good rotation of the roller 200 can be ensured.

[0056] Referring to Figure 1 , Figure 3 and Figure 4In the embodiment, the positioning groove is arranged at the bottom of the groove body 100, and the bracket bottom plate positioning hole 411 with a certain depth is arranged on the bracket bottom plate 410. When the second bracket side plate 420 is fixed to the bracket bottom plate 410 by means of the second bracket side plate horizontal adjustment hole 421 corresponding to the bracket bottom plate positioning hole 411 and a mounting member such as a screw, the second bracket side plate horizontal adjustment hole 421 can be adjusted in the horizontal direction, that is, the X direction. Figure 1 In addition, Figure 4 The second bracket side plate vertical adjustment hole 422 and the second bracket first fixing hole 431 are arranged correspondingly, and the second bracket 430 can be fixed to the second bracket side plate 420 by means of a mounting member such as a screw.

[0057] The second bracket height adjustment screw hole 432 is preferably a threaded hole with a smooth upper part and a threaded lower part, so as to facilitate the installation of the second bracket height adjustment screw. The second bracket height adjustment screw and the second bracket side plate vertical adjustment hole 422 can be used to adjust the displacement of the second bracket 430 in the vertical direction, that is, the Y direction. Figure 1 In addition, Figure 4 The second bracket height adjustment screw hole 432 is preferably a threaded hole with a smooth upper part and a threaded lower part, so as to facilitate the installation of the second bracket height adjustment screw. The second bracket height adjustment screw and the second bracket side plate vertical adjustment hole 422 can be used to adjust the displacement of the second bracket 430 in the vertical direction, that is, the Y direction. Figure 4 When the second bracket height adjustment screw is screwed in and out, the height of the second bracket 430 can be adjusted within the adjustment range of the second bracket side plate vertical adjustment hole 422. The second containing groove 433 is arranged correspondingly to the second end of the roller 200, and the second end of the roller 200 can be installed in the second containing groove 433 by means of a bearing, for example. The roller 200 can be installed by means of a U-shaped mounting block, and good rotation of the roller 200 can be ensured.

[0058] Referring to Figure 4 In addition, Figure 5 The second bracket second fixing hole 434 is a fixing hole of the transmission shaft mounting seat 510, so as to fix the transmission shaft mounting seat 510 to the second bracket 430 by means of a mounting member such as a screw, so that the transmission shaft mounting seat 510 can be displaced synchronously with the second bracket 430, so as to adjust the first bevel gear 530 and the second bevel gear 540, and achieve good meshing between the first bevel gear 530 and the second bevel gear 540.

[0059] Therefore, the semiconductor roller 200 transmission device of the embodiment can realize multi-degree-of-freedom adjustment, thereby greatly simplifying the installation and debugging process and subsequent maintenance work, and reducing production and operation costs.

[0060] As an example, the first bracket vertical adjustment hole 321 can comprise a waist-shaped hole; the second bracket side plate vertical adjustment hole 422 can comprise a waist-shaped hole; the second bracket side plate horizontal adjustment hole 421 can comprise a waist-shaped hole, but the shapes of the first bracket vertical adjustment hole 321, the second bracket side plate vertical adjustment hole 422, and the second bracket side plate horizontal adjustment hole 421 are not limited to this.

[0061] As an example, the distance D between adjacent rollers 200 can be in the range of 35mm≤D<45mm.

[0062] Specifically, as the semiconductor manufacturing process tends to be thinned, the traditional roller transmission device has difficulty in ensuring the stability of the silicon wafer during transmission due to the large distance between the rollers. For example, due to the thin thickness of the silicon wafer and the insufficient number of effective support points on the transmission roller, the silicon wafer may be deformed, which may cause the water film on the front surface of the silicon wafer to fall off, thereby causing a series of process problems, including increased etching liquid and poor etching uniformity. Therefore, when the distance D between adjacent rollers 200 is set to 35mm≤D<45mm, such as 35mm, 38mm, 40mm, 42mm, etc., the uniformity of the silicon wafer support can be ensured. In this embodiment, the value of D is preferably 40mm, but the value of D is not limited to this.

[0063] As an example, the diameter R of the roller 200 can be in the range of 32mm≤R<45mm.

[0064] Specifically, the diameter R of the roller 200 can be 32mm, 35mm, 38mm, 40mm, 42mm, etc. In this embodiment, the value of R is preferably 35mm, but the value of R is not limited to this.

[0065] In this embodiment, by optimizing the diameter R of the roller 200 to 35mm and reducing the distance D between the rollers 200 to 40mm, compared with the traditional roller transmission, when transmitting the same size of silicon wafer, the number of effective contact points between the silicon wafer and the roller 200 can be increased by 20%~25%, thereby the pressure of the upper water film on the silicon wafer can be significantly dispersed, the transmission stability can be improved, the bending deformation and the "water film falling" phenomenon of the silicon wafer can be inhibited, the etching uniformity can be ensured, and the stability of the process window and the product yield can be improved.

[0066] As an example, the number of teeth z1 of the first bevel gear 530 can be z1≤14, such as 12, 13, 14, etc., and the number of teeth z2 of the second bevel gear 540 can be 17≤z2≤21, such as 17, 19, 21, etc.

[0067] Specifically, the first bevel gear 530 is a non-standard bevel gear, and in the embodiment, R=35 and D=40 mm are taken as examples. According to formula (1): , and d≤R, d is the diameter of the reference circle, m is the modulus and takes a value of 2.5, and z is the number of teeth. The number of teeth z1 of the first bevel gear 530 can be calculated as z1≤14, such as 12, 13, 14, etc. In the embodiment, the number of teeth z1 of the first bevel gear 530 is 13, and the number of teeth z2 of the second bevel gear 540 is 19.

[0068] According to the minimum shift coefficient formula (2) for avoiding undercutting: , and the minimum number of teeth of the standard cutter without undercutting formula (3): , and the equivalent number of teeth , the small wheel division bevel angle When the pressure angle α=20°, It can be known that the minimum number of teeth Zmin≈17. Since z1≤14 and 17≤z2≤21 in the embodiment, z1

[0069] As an example, among two adjacent rollers 200, one is a left-handed roller 210, and the other is a right-handed roller 220, and the left-handed roller 210 and the right-handed roller 220 rotate in the same direction.

[0070] Specifically, referring to Figure 1 and Figure 5 In the embodiment, it is preferred that among two adjacent rollers 200, one is a left-handed roller 210, and the other is a right-handed roller 220, and the left-handed roller 210 and the right-handed roller 220 rotate in the same direction, so as to ensure the transmission of the silicon wafer, and through the complementary cancellation of the axial force by the rotation directions of the left-handed roller 210 and the right-handed roller 220, good collaborative driving of the workpiece is achieved, and the transmission stability is improved.

[0071] As an example, the materials of the groove body 100, the roller 200, the roller first support assembly 300, the roller second support assembly 400, and the transmission assembly 500 can each include one or a combination of polyvinylidene fluoride, polytetrafluoroethylene, and polypropylene.

[0072] Specifically, the materials of the groove 100, the roller 200, the first roller support assembly 300, the second roller support assembly 400 and the transmission assembly 500 can be selected according to the type of the processing liquid loaded in the groove 100. For example, the processing liquid can include HF, HNO3, H2SO4, etc. according to the process requirement.

[0073] In this embodiment, since the wet process is performed on the back surface of the silicon wafer as an example, the materials of the groove 100, the roller 200, the first roller support assembly 300, the second roller support assembly 400 and the transmission assembly 500 are preferably selected to have good corrosion resistance, such as one or a combination of polyvinylidene fluoride, polytetrafluoroethylene and polypropylene, which can be selected according to the requirement.

[0074] For example, the groove 100 is preferably provided with two sets of independently arranged devices including the roller 200, the first roller support assembly 300, the second roller support assembly 400 and the transmission assembly 500, and the two sets of devices are in an axisymmetric structure.

[0075] Specifically, as shown in Figure 1 In this embodiment, the groove 100 is preferably provided with two sets of independently arranged devices including the roller 200, the first roller support assembly 300, the second roller support assembly 400 and the transmission assembly 500, and the two sets of devices are in an axisymmetric structure, wherein the A-A' in Figure 1 can be regarded as a symmetry axis, so that the silicon wafers can be processed independently in the two sets of devices to improve the timeliness.

[0076] For example, a pressing rod (not shown) corresponding to the roller 200 can also be included, the pressing rod including oppositely arranged first and second ends, the first end of the pressing rod being installed in the first accommodating groove 323, and the second end of the pressing rod being installed in the second accommodating groove 433, so that the pressing rod can contact the front surface of the transmitted silicon wafer through the arrangement of the pressing rod, thereby improving the stability of the transmitted silicon wafer.

[0077] This embodiment also provides a semiconductor device, which can include the above-mentioned semiconductor roller transmission device. The type of the semiconductor device can include, but is not limited to, a semiconductor etching machine, a semiconductor cleaning machine, etc.

[0078] In summary, the semiconductor roller conveying device and the semiconductor equipment of the present application comprise a groove body, a roller, a roller first support assembly, a roller second support assembly and a transmission assembly, wherein the roller first support assembly comprises a first support side plate and a first support, the roller second support assembly comprises a support bottom plate, a second support side plate and a second support, and the roller first support assembly can be adjusted in the vertical direction, and the roller second support assembly can be adjusted in the horizontal and vertical directions, so that multi-degree-of-freedom adjustment can be realized, thereby greatly simplifying the installation and debugging process and subsequent maintenance work, and reducing production and operation costs.

[0079] Further, by reducing the roller spacing and adopting a non-standard bevel gear meshing transmission scheme, stable and synchronous driving of multiple cross-arranged rollers by a single transmission shaft, compact structure and reliable transmission are realized, so that when the same size of silicon wafers are conveyed, the number of effective contact points between the silicon wafers and the rollers is increased by 20%~25%, thereby the pressure of the upper water film on the silicon wafer can be significantly dispersed, the transmission stability is improved, the bending deformation and "water film dropping" phenomenon of the silicon wafer are inhibited, the etching uniformity is guaranteed, and the stability of the process window and the product yield are improved.

[0080] The semiconductor roller conveying device and the semiconductor equipment of the present application provide a convenient, high-stability and high-uniformity solution for silicon wafer conveying, especially thin silicon wafer conveying, and have important engineering application value and market prospects.

[0081] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. A semiconductor roller conveying device, characterized in that, The semiconductor roller transport device includes: The tank body, wherein a positioning groove is provided inside the tank body; The roller includes a first end and a second end disposed opposite to each other; The first roller support assembly includes: The first bracket side plate is fixed in the groove, and the first bracket side plate is provided with a first bracket side plate positioning hole. A first bracket is disposed on the inner side of a side plate of a first bracket. The first bracket is provided with a first bracket vertical adjustment hole, a first bracket height adjustment threaded hole, and a first receiving groove. The first bracket vertical adjustment hole extends through the side wall of the first bracket and corresponds to the positioning hole of the side plate of the first bracket. The first bracket height adjustment threaded hole extends through the top of the first bracket and is provided with a corresponding first bracket height adjustment screw. The first receiving groove corresponds to the first end of the roller. The second roller support assembly includes: A bracket base plate, which is fixed in the positioning groove and has positioning holes. The second support side plate is provided with a horizontal adjustment hole and a vertical adjustment hole; the horizontal adjustment hole extends through the top of the second support side plate and corresponds to the positioning hole of the support bottom plate; the vertical adjustment hole extends through the side wall of the second support side plate. The second bracket is disposed on the outer side of the side plate of the second bracket. The second bracket is provided with a first fixing hole, a height adjustment threaded hole, a second receiving groove, and a second fixing hole. The first fixing hole of the second bracket is correspondingly disposed with the vertical adjustment hole of the side plate of the second bracket. The height adjustment threaded hole of the second bracket extends through the top of the second bracket and is provided with a corresponding height adjustment screw. The second receiving groove is correspondingly disposed with the second end of the roller. A transmission assembly is disposed on the outside of the second bracket. The transmission assembly includes a transmission shaft mounting base, a transmission shaft, a first bevel gear, and a second bevel gear. The transmission shaft mounting base is fixed to the second bracket through a second fixing hole and maintains synchronous displacement. The transmission shaft is mounted on the transmission shaft mounting base. The first bevel gear is mounted on the second end of the roller. The second bevel gear is mounted on the transmission shaft, and the first bevel gear meshes with the second bevel gear to drive the roller to rotate. The first and second receiving grooves are equally spaced, the diameter of the roller is R, the distance between adjacent rollers is D, and R < D.

2. The semiconductor roller conveying device according to claim 1, characterized in that: The spacing D between adjacent rollers ranges from 35mm to D < 45mm.

3. The semiconductor roller conveying device according to claim 1, characterized in that: The diameter R of the roller is in the range of 32mm ≤ R < 45mm.

4. The semiconductor roller conveying device according to claim 1, characterized in that: The number of teeth z1 of the first bevel gear is z1≤14, and the number of teeth z2 of the second bevel gear is 17≤z2≤21.

5. The semiconductor roller conveying device according to claim 1, characterized in that: Of the two adjacent rollers, one is a left-handed roller and the other is a right-handed roller, and the left-handed roller and the right-handed roller rotate in the same direction.

6. The semiconductor roller conveying device according to claim 1, characterized in that: The materials of the trough, the roller, the first roller support assembly, the second roller support assembly, and the transmission assembly all include one or a combination of polyvinylidene fluoride, polytetrafluoroethylene, and polypropylene.

7. The semiconductor roller conveying device according to claim 1, characterized in that: The tank is equipped with two independently configured devices, each consisting of the roller, the first roller support assembly, the second roller support assembly, and the transmission assembly, and the two devices are axially symmetrical.

8. The semiconductor roller conveying device according to claim 1, characterized in that: The first bracket vertical adjustment hole includes an oblong hole; the second bracket side plate vertical adjustment hole includes an oblong hole; the second bracket side plate horizontal adjustment hole includes an oblong hole.

9. The semiconductor roller conveying device according to claim 1, characterized in that: It also includes a pressure rod corresponding to the roller, the pressure rod having a first end and a second end disposed opposite to each other, the first end of the pressure rod being installed in the first receiving groove, and the second end of the pressure rod being installed in the second receiving groove.

10. A semiconductor device, characterized in that: The semiconductor device includes the semiconductor roller transport device according to any one of claims 1 to 9.

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