Wafer detection device

Abstract

The invention discloses a wafer detection device, and relates to the technical field of semiconductor equipment, the wafer detection device comprises a fixing assembly, a suspension assembly and a detection assembly, the fixing assembly is used for being arranged on a bearing device and generating a first magnetic field; the suspension assembly is used for generating a second magnetic field, the directions of the first magnetic field and the second magnetic field are opposite, the suspension assembly can suspend above the fixing assembly under the interaction of the first magnetic field and the second magnetic field, and the detection assembly is connected with the suspension assembly and can suspend above the bearing device and the fixing assembly together with the suspension assembly. And the wafer on the bearing device is detected. Through interaction of magnetic fields generated by the fixing assembly and the suspension assembly, suspension of the detection assembly above the bearing device is realized, the distance of the detection assembly relative to the bearing device can be adjusted, the position arrangement is more flexible, and the detection accuracy is improved. Meanwhile, a detection component used for detecting other structures in the cavity can be arranged on the detection assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, and more particularly to a wafer detection device. BACKGROUND

[0002] Semiconductor processing tools utilize a robot to move wafers between various wafer stations. Since the end effector of the robot is typically a paddle or spoon type used to pick up the wafer, and the fixation of the wafer on the end effector is not always completely reliable, a slight relative displacement between the end effector and the wafer can occur.

[0003] To solve this technical problem, the industry currently generally installs an AWC (Active Wafer Centering, a technology used for motion control and wafer calibration of wafer handling robots in semiconductor manufacturing) system at the transfer port between the processing chamber and the transfer chamber to detect and correct the position of the wafer. Although the AWC system can correct the wafer, due to the sensitivity of the semiconductor processing operation, there can still be unacceptable errors in the position of the wafer in the processing chamber or in the wafer station. On this basis, the prior art combines an APS (Adaptive Positioning System, adaptive positioning system) calibration device for calibrating the transfer position of the wafer to ensure that the wafer can be placed approximately centered on the carrier table in the chamber within an acceptable tolerance range.

[0004] However, since the existing wafer position detection device is limited to being installed on the end effector of the robot or the carrier table for detection, such installation limits the flexibility of its use and hinders its wider functional application.

[0005] Therefore, how to improve the flexibility of the arrangement and use of the wafer position detection device has become a technical problem to be solved by those skilled in the art. SUMMARY

[0006] Therefore, how to improve the flexibility of the arrangement and use of the wafer position detection device has become a technical problem to be solved by those skilled in the art.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0008] A wafer detection device, comprising:

[0009] A fixing assembly configured to be arranged on a carrier device and to generate a first magnetic field;

[0010] A suspension assembly configured to generate a second magnetic field, wherein the first magnetic field and the second magnetic field are in opposite directions, so that the suspension assembly can be suspended above the fixing assembly;

[0011] A detection assembly is connected to the levitation assembly, and is used to detect the wafer on the carrier device.

[0012] Optionally, in the wafer detection device, the fixing assembly comprises:

[0013] A main coil is arranged on the carrier device and generates the first magnetic field.

[0014] A first sensor is arranged on the carrier device and arranged in the main coil, and is used to detect the first magnetic field.

[0015] Optionally, in the wafer detection device, the fixing assembly further comprises a plurality of auxiliary coils arranged in the main coil, and used to generate an auxiliary magnetic field for fine-tuning the levitation angle of the levitation assembly; and / or,

[0016] The fixing assembly further comprises a second sensor arranged on the carrier device, and used to detect whether the levitation assembly is levitated above the fixing assembly.

[0017] Optionally, in the wafer detection device, the levitation assembly comprises:

[0018] A magnet assembly is arranged in the detection assembly and generates the second magnetic field.

[0019] A rotary motor is arranged in the detection assembly and used to drive the magnet assembly to rotate.

[0020] Optionally, in the wafer detection device, the magnet assembly comprises:

[0021] A first permanent magnet is arranged in the detection assembly and arranged on the side of the rotary motor away from the fixing assembly, and the rotary motor is used to drive the first permanent magnet to rotate.

[0022] A second permanent magnet is arranged in the detection assembly and arranged on the side of the rotary motor close to the fixing assembly, and connected with the rotary motor and the detection assembly.

[0023] Optionally, in the wafer detection device, the first permanent magnet and the second permanent magnet are coaxially arranged, and the cross-sectional dimension of the second permanent magnet is smaller than that of the first permanent magnet in the direction from the first permanent magnet to the second permanent magnet.

[0024] Optionally, in the wafer detection device, the detection assembly comprises:

[0025] A first housing;

[0026] A second housing connected with the first housing and enclosing a mounting space, wherein the floating assembly is arranged in the mounting space;

[0027] An integrated board arranged in the mounting space and connected with the second housing;

[0028] A detection component arranged on the integrated board, and the first housing and / or the second housing is provided with a relief hole for the detection component to detect.

[0029] Optionally, in the wafer detection device, the detection component comprises:

[0030] An edge sensor arranged on a side of the integrated board facing the fixing assembly and arranged eccentrically relative to the rotation center of the floating assembly, for detecting a wafer;

[0031] A center sensor arranged on the integrated board, for detecting the floating assembly.

[0032] Optionally, in the wafer detection device, the detection component further comprises a backside sensor arranged on a side of the integrated board facing away from the fixing assembly and arranged eccentrically relative to the rotation center of the floating assembly, for detecting a media window.

[0033] Optionally, in the wafer detection device, the edge sensor comprises at least one of an image sensor, a distance sensor, and a gas detection sensor; and / or,

[0034] The center sensor comprises at least one of a gyroscope, a vibration sensor, and an image sensor; and / or,

[0035] The backside sensor comprises at least one of an image sensor and a distance sensor.

[0036] Optionally, in the wafer detection device, the edge sensor comprises at least one of an image sensor, a capacitive distance sensor, a laser sensor, an ultrasonic sensor, and a gas detection sensor; and / or,

[0037] The center sensor comprises at least one of a MEMS gyroscope, a vibration sensor, and a center image sensor; and / or,

[0038] The backside sensor comprises at least one of an image sensor and a capacitive distance sensor.

[0039] The wafer detection device provided by the application comprises a fixing assembly, a suspension assembly and a detection assembly, the fixing assembly is arranged on a bearing device and generates a first magnetic field; the suspension assembly generates a second magnetic field, and the directions of the first magnetic field and the second magnetic field are opposite; under the interaction of the first magnetic field and the second magnetic field, the suspension assembly can be suspended above the fixing assembly; the detection assembly is connected with the suspension assembly and can be suspended above the bearing device and the fixing assembly together with the suspension assembly, and can detect the wafer on the bearing device.

[0040] Compared with the prior art, the wafer detection device provided by the application realizes the suspension of the detection assembly above the bearing device through the interaction of the magnetic fields generated by the fixing assembly and the suspension assembly, the distance of the detection assembly relative to the bearing device can be adjusted, the position arrangement is more flexible, and detection components for detecting other structures in the chamber can be arranged on the detection assembly, and the detection of other structures in the chamber can be realized by adjusting the position of the detection assembly. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort.

[0042] Figure 1 The mounting structure schematic diagram of the wafer detection device disclosed by the embodiment of the application;

[0043] Figure 2 The structure schematic diagram related to the magnetic suspension structure of the wafer detection device disclosed by the embodiment of the application;

[0044] Figure 3 The exploded view of the floating body device disclosed by the embodiment of the application;

[0045] Figure 4 The structure schematic diagram of the integrated plate disclosed by the embodiment of the application;

[0046] Figure 5 The process flow chart a of the wafer detection device disclosed by the embodiment of the application for automatic detection;

[0047] Figure 6 The process flow chart b of the wafer detection device disclosed by the embodiment of the application for automatic detection;

[0048] Figure 7 The process flow chart c of the wafer detection device disclosed by the embodiment of the application for automatic detection;

[0049] Figure 8 Process flow chart for automatic detection of wafer detection device disclosed in the embodiment of the present application d;

[0050] Figure 9 Process flow chart for automatic detection of wafer detection device disclosed in the embodiment of the present application e;

[0051] Figure 10 Process flow chart for automatic detection of wafer detection device disclosed in the embodiment of the present application f.

[0052] Wherein, 1 is a suspension assembly, 2 is a fixed assembly, 3 is a detection assembly, 4 is a bearing table, 5 is a control assembly, 6 is a power supply, 7 is a cover ring, 8 is a focusing ring, 9 is a medium window, 10 is a wafer, 11 is an integrated circuit board, 12 is a first edge sensor, 13 is a second edge sensor, 14 is a third edge sensor, 15 is a battery, 16 is a backside sensor, 17 is a processor, 18 is a memory, 19 is a signal transmitter, 20 is an induction coil, 21 is a bearing back plate, 22 is a center sensor, 23 is a chamber, 24 is a mechanical arm, 25 is a chamber door;

[0053] 101 is a first permanent magnet, 102 is a second permanent magnet, and 103 is a rotating motor;

[0054] 201 is a main coil, 202 is an auxiliary coil, and 203 is a first sensor;

[0055] 301 is a first housing, 302 is an integrated board, and 303 is a second housing. DETAILED DESCRIPTION

[0056] The core of the present application is to disclose a wafer detection device to improve the flexibility of wafer position detection device arrangement and use.

[0057] Hereinafter, the embodiments will be described with reference to the accompanying drawings. In addition, the embodiments shown below do not have any limiting effect on the invention content described in the claims. In addition, the entire content of the configuration represented in the following embodiments is not limited to being necessary as a solution to the invention described in the claims. It should be noted that, for the sake of description, only the parts related to the invention are shown in the drawings. In the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0058] Combination Figure 1 And Figure 2The wafer detection device disclosed by the application comprises a fixing assembly 2, a suspension assembly 1 and a detection assembly 3, the fixing assembly 2 is arranged on a bearing device and generates a first magnetic field; the suspension assembly 1 generates a second magnetic field, and the directions of the first magnetic field and the second magnetic field are opposite, under the interaction of the first magnetic field and the second magnetic field, the suspension assembly 1 can be suspended above the fixing assembly 2, the detection assembly 3 is connected with the suspension assembly and can be suspended together with the suspension assembly 1 above the bearing device and the fixing assembly 2, and the wafer 10 on the bearing device is detected.

[0059] The second magnetic field is a stable magnetic field, the first magnetic field is an opposite magnetic field of the second magnetic field and can be regulated, the detection assembly 3 of the application can detect the deviation of the wafer 10 on the bearing device in the state of magnetic suspension, and the detection distance of the detection assembly 3 relative to the wafer 10 can be changed by adjusting the magnetic field strength of the first magnetic field.

[0060] Compared with the prior art, the wafer detection device disclosed by the application realizes the suspension of the detection assembly 3 above the bearing device through the interaction of the magnetic fields generated by the fixing assembly 2 and the suspension assembly 1, the distance of the detection assembly 3 relative to the bearing device can be adjusted, the position arrangement is more flexible, and detection components for detecting other structures in the chamber 23 can also be arranged on the detection assembly 3, and the detection of other structures in the chamber 23 is realized by adjusting the position of the detection assembly 3.

[0061] Those skilled in the art can understand that the wafer detection device disclosed by the application can be applied to different semiconductor process systems, for example, the semiconductor process system can include but is not limited to a plasma etching chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a chamfered edge etching chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etching (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing system that can be associated with or used in the manufacture and / or preparation of semiconductor wafers. The bearing device is used herein to refer to any structure in a wafer station configured to receive and support the wafer 10, such as a bearing table 4, a susceptor, an electrostatic chuck, a wafer support frame, etc.

[0062] The term "wafer" in the present application can refer to a semiconductor wafer or substrate or other similar type of wafer or substrate. As the term is used herein, a wafer station can refer to any location in a semiconductor processing tool into which a wafer can be placed during any one of various wafer processing operations or wafer transfer operations.

[0063] The fixed assembly 2 is usually fixed directly on the bearing device without moving, and the whole of the suspension assembly 1 and the detection assembly 3 is taken as a floating device for description. It can be understood that, since the fixed assembly 2 is usually fixed directly on the bearing device and is long-term inside the chamber 23, it is preferred to use an electromagnet to control the generation of the first magnetic field to avoid the influence of the first magnetic field generated by a permanent magnet on the process of the wafer 10.

[0064] Specifically, in combination with Figure 2 The fixed assembly 2 includes a main coil 201 and a first sensor 203 (203a and 203b), the main coil 201 is arranged on the bearing device and generates the first magnetic field; the first sensor 203 is arranged on the bearing device and is arranged in the main coil 201, and is used for detecting the strength of the first magnetic field generated by the main coil 201, so as to facilitate the regulation of the first magnetic field.

[0065] Among them, the first sensor 203 (203a and 203b) is usually two, and the bearing surface of the bearing device for carrying the wafer 10 is defined as a horizontal surface, so that the two first sensors 203 are Hall sensors for detecting the X and Y direction magnetic fields perpendicular to each other on the horizontal surface. It can be understood that the two Hall sensors are arranged as close as possible to the center position of the first magnetic field to ensure the accuracy of the detection result.

[0066] Among them, the fixed assembly 2 is connected with a power supply 6, the power supply 6 supplies power to the main coil 201, and the main coil 201 and the power supply 6 are further provided with a control assembly 5, the control assembly 5 includes a controller and a processor to process sensor signals and control magnetic field distribution.

[0067] Further, the fixed assembly 2 further includes a plurality of auxiliary coils 202, the auxiliary coils 202 are arranged in the main coil 201, and are used for generating an auxiliary magnetic field, the auxiliary magnetic field is used for assisting the suspension assembly 1 to fine-tune the suspension angle, so as to improve the stability of the suspension assembly 1.

[0068] In combination with Figure 2In this embodiment, the auxiliary coils 202 (202a, 202b, 202c and 202d) are arranged in a circumferential uniform arrangement of four around the central axis of the main coil 201. By adjusting the magnetic field strength and direction generated by each auxiliary coil 202, the suspension position of the suspension assembly 1 can be fine-tuned to ensure that the suspension assembly 1 can quickly return to the original suspension position after being slightly disturbed, maintaining the stability of the suspension.

[0069] In addition, the fixing assembly 2 can further include a second sensor arranged on the bearing device to detect whether the suspension assembly 1 is suspended above the fixing assembly 2, that is, to detect whether the floating body device is in place. The second sensor can be a Hall sensor, a distance sensor or the like.

[0070] In order to enable the detection assembly 3 to detect the wafer 10 more comprehensively, the suspension assembly 1 is arranged to be rotatable and to drive the various detection components on the detection assembly 3 to rotate together, thereby achieving detection of different positions on the wafer 10 in the circumferential direction.

[0071] Specifically, the suspension assembly 1 includes a magnet assembly and a rotary motor 103. The magnet assembly is arranged in the detection assembly 3 and generates a second magnetic field. The rotary motor 103 is arranged in the detection assembly 3 and is used to provide a torque to drive the magnet assembly to rotate. When the floating body device is in a magnetic suspension state, according to the law of conservation of angular momentum, the magnet assembly can drive the entire detection assembly 3 to rotate. Since the detection assembly 3 of the present application can rotate in a magnetic suspension state, more detection data can be obtained with fewer detection components.

[0072] The magnet assembly can include a single permanent magnet, two permanent magnets or an electromagnetic coil. The permanent magnet is usually in a pie-shaped structure for easy rotation. When it is a single permanent magnet, the permanent magnet generates the second magnetic field as a rotor. The rotary motor 103 is fixedly connected to the detection assembly 3, and the rotary motor 103 can drive the permanent magnet to rotate, thereby realizing the rotation of the detection assembly 3 in a magnetic suspension state. The specific operation mechanism of the rotary motor 103 for controlling the rotation of the permanent magnet or the electromagnetic coil is prior art, which will not be described here.

[0073] When the magnet assembly comprises two permanent magnets, the two permanent magnets are defined as a first permanent magnet 101 and a second permanent magnet 102, the first permanent magnet 101 and the second permanent magnet 102 jointly generate the second magnetic field described above, one of the first permanent magnet 101 and the second permanent magnet 102 acts as a rotor, the rotor is arranged in the detection assembly 3 and has no direct connection with the detection assembly 3, and the rotor can be driven to rotate by the rotary motor 103 in the detection assembly 3. The other one of the first permanent magnet 101 and the second permanent magnet 102 is fixedly connected with the rotary motor 103 and the detection assembly 3 and is driven to rotate synchronously by the rotor.

[0074] Specifically, in an embodiment, in combination with Figure 2 , the first permanent magnet 101 is arranged in the detection assembly 3 and is arranged on the side of the rotary motor 103 away from the fixed assembly 2, and the rotary motor 103 is used to drive the first permanent magnet 101 to rotate; the second permanent magnet 102 is arranged in the detection assembly 3 and is arranged on the side of the rotary motor 103 close to the fixed assembly 2, and is connected with the rotary motor 103 and the detection assembly 3, when the rotary motor 103 drives the first permanent magnet 101 to rotate, under the interaction of the first permanent magnet 101 and the second permanent magnet 102, the second permanent magnet 102 drives the rotary motor 103 and the permanent magnet to jointly rotate.

[0075] Preferably, the first permanent magnet 101 and the second permanent magnet 102 are both in a pie structure, the first permanent magnet 101, the second permanent magnet 102 and the rotary motor 103 are coaxially arranged, and along the direction from the first permanent magnet 101 to the second permanent magnet 102, the cross-sectional size of the second permanent magnet 102 is smaller than the cross-sectional size of the first permanent magnet 101, in combination with Figure 2 , Figure 2 the red arc line in the above-mentioned embodiment schematically shows the magnetic force line of the first magnetic field, such a structure with the upper part being larger and the lower part being smaller can adapt to the shape of the first magnetic field, ensure that the first permanent magnet 101 and the second permanent magnet 102 have a relatively large force area relative to the first magnetic field, and further improve the stability of the suspension assembly 1 in the suspension magnetic field. At the same time, compared with the above-mentioned arrangement scheme of a single permanent magnet, by superimposing two permanent magnets with large and small sizes, the magnetic moment distribution of the whole floating body device can be adjusted, so that it is easier to find and maintain a stable balance point in the first magnetic field generated by the fixed assembly 2. In addition, the interaction between the two permanent magnets can produce a certain compensation effect, which is helpful to enhance the resistance of the floating body device to external interference such as electromagnetic interference and mechanical vibration, so as to promote the stability of the floating state of the floating body device.

[0076] In other embodiments, the magnet assembly comprises an electromagnetic coil, the electromagnetic coil is arranged in the detection assembly 3 and generates the second magnetic field for keeping the detection assembly 3 in suspension. The rotary motor 103 is used to drive a pie-shaped object with or without magnetism as a rotor to rotate, so as to realize the rotation of the detection assembly 3 in the magnetic suspension state.

[0077] In combination Figure 3 The detection assembly 3 comprises a first housing 301, a second housing 303, an integrated plate 302 and detection components, the first housing 301 and the second housing 303 are detachably connected and enclose an installation space, the floating assembly 1 is arranged in the installation space, the above-mentioned magnet assembly or the rotary motor 103 is fixed on the first housing 301 or the second housing 303; the integrated plate 302 is arranged in the installation space and connected with the second housing 303; the detection components are arranged on the integrated plate 302, and the first housing 301 and / or the second housing 303 is provided with a relief hole for the detection components to detect. According to the actual needs of the parameters to be detected, the required sensors are selected as the detection components. In addition, the integrated plate 302 is also provided with a power supply assembly for supplying power to the detection components.

[0078] The integrated plate 302 mainly comprises an induction coil 20, a battery 15 (15a and 15b), a rectifier circuit, a signal processing assembly, an integrated circuit board 11 and a bearing back plate 21.

[0079] When the floating body device is not working and is stored in the storage station, the induction coil 20 can be used to wirelessly charge the plurality of batteries 15, and when the floating body device is used in the chamber 23 of the process system, the plurality of batteries 15 can supply power to the signal processing assembly, the detection components and the rotary motor 103 through the integrated circuit board 11 to make them work normally. The above-mentioned various components are fixedly installed on the bearing back plate 21 to avoid the deviation of the components from the original position due to use. The signal processing assembly comprises a processor 17, a memory 18 and a signal transmitter 19, the processor 17 can control the opening and closing of the power supply 6 and the sensors, and can calculate and process the detected data to determine the health status of the components. A large amount of data obtained can be stored in the memory 18, and the original data stored in the memory 18 and the calculation results can be wirelessly transmitted to the user interface through the signal transmitter 19 for user analysis and processing.

[0080] Specifically, according to the setting position and function, the above-mentioned detection sensors comprise edge sensors and center sensors 22. The number of edge sensors is not limited, such as Figure 4An embodiment is shown with three edge sensors, namely a first edge sensor 12, a second edge sensor 13, and a third edge sensor 14. The edge sensors are disposed on the side of the integrated plate 302 facing the fixed component 2, and are positioned away from the rotation center of the levitation component 1. When the levitation device rotates, the edge sensors can rotate with it and detect multiple positions on the circumferential direction of the wafer 10. A focusing ring 8 on the carrier device is used to improve the uniformity of wafer 10 processing. The focusing ring 8 is placed outside the wafer 10. Specifically, the edge sensors can be used to detect whether the focusing ring 8 and the wafer 10 have shifted to an unacceptable distance, check whether the height of the focusing ring 8 is still within an acceptable range within a predetermined time or after the wafer 10 has been processed a preset number of times, and check whether the carrier device is level, etc.

[0081] The aforementioned edge sensors can specifically include at least one of image sensors, distance sensors, and gas detection sensors, and the number of each type of sensor can be one or more. Specifically, the image sensor can be a camera, etc., and is used to detect the distance between the wafer 10 and the focusing ring 8, thereby determining whether the wafer 10 is centered on the surface of the support stage 4. The distance sensor can be a capacitive distance sensor, a laser sensor, an ultrasonic sensor, etc. The capacitive distance sensor can detect the distance between the edge of the wafer 10 and the capacitive sensor, thereby determining whether the wafer 10 is warped or not flattened when placed on the surface of the support stage 4. As the etching process proceeds, the thickness of the focusing ring 8 decreases. Generally, three ejector pins (not shown in the figure) are placed below the focusing ring 8, which lift the focusing ring 8 to compensate for the etched thickness. The lifting height of the ejector pins is consistent with the etched thickness of the focusing ring 8. The laser sensor can be used to measure the thickness of the focusing ring 8, thereby determining the health status of the focusing ring 8 and making corresponding compensations using the equipment.

[0082] Edge sensors work in conjunction with the rotation of the floating device to perform detection. After the floating device rotates by a fixed angle α (0° < α < 360°), several edge sensors are activated to perform a detection and recording. For example, every time the floating device rotates 60°, several edge sensors are activated to perform a detection. Thus, for every rotation of the floating device, each edge sensor can obtain three sets of detection data.

[0083] The center sensor 22 is arranged at the rotation center of the floating device, which includes various functional sensors, such as MEMS (Micro-Electro-Mechanical Systems) gyroscopes, vibration sensors, and center image sensors, etc. The MEMS gyroscopes can accurately monitor the rotation angle of the floating device in the suspended state. The floating device is placed in the chamber 23 through the mechanical arm 24. The vibration sensors can effectively detect the stability of the mechanical arm 24 in the conveying process and the stability of the floating device in the magnetic suspension state. The center image sensor can cooperate with the pre-set positioning marks on the surface of the support table 4 to ensure the pre-alignment of the floating device and the support table 4, and to ensure that the position of the floating device relative to the support table 4 does not deviate. It can be understood that when aligning the marks on the support table 4 through the center image sensor, it is necessary to ensure that the wafer 10 is not placed on the support table 4, so as to avoid that the wafer 10 blocks the line of sight of the center image sensor.

[0084] The above-mentioned center image sensor needs to be arranged on the side of the integrated board 302 facing the fixed assembly 2. The MEMS gyroscopes and the vibration sensors can be arranged on both sides of the integrated board 302, and are preferably directly arranged on the side of the integrated board 302 facing the fixed assembly 2, so as to facilitate the connection with the power supply assembly and the layout on the integrated board 302.

[0085] In combination with Figure 1 and Figure 5 , the medium window 9 is arranged on the top of the chamber 23 and opposite to the bearing device. Further, the detection component further includes a backside sensor 16 arranged on the side of the integrated board 302 away from the fixed assembly 2, i.e. arranged towards the medium window 9, for detecting the medium window 9. The contact of the backside sensor 16 penetrates through the bearing back plate 21 and is connected to the integrated circuit board 11, thereby realizing the connection with the power supply assembly.

[0086] In combination with Figure 4 , a plurality of backside sensors 16 are arranged through the rotation center of the floating device. The types of the backside sensors 16 can be various.

[0087] In some embodiments, the backside sensors 16 include capacitive distance sensors or other distance sensors. As the process proceeds, the thickness of the dielectric window 9 at different locations changes, which affects the process result. The capacitive distance sensors can effectively detect the thickness change of the dielectric window 9, and the rotation of the floating body device can obtain multiple sets of thickness data of the dielectric window 9 along the axial direction. Finally, the multiple sets of data can be integrated to obtain the remaining thickness mapping of the dielectric window 9. After the dielectric window 9 is installed and before the process is performed, the floating body device is first introduced into the chamber 23 at a predetermined height position to obtain a set of mapping of the distance between the backside sensors 16 and the dielectric window 9. Then, after a certain period of process is performed, the floating body device is introduced into the chamber 23 again, and the floating body device measures a set of mapping of the distance between the backside sensors 16 and the dielectric window 9 at the same height position. By subtracting the data from the previous time, the thickness change of the dielectric window 9 at each location can be obtained.

[0088] As can be understood by those skilled in the art, compared to detecting the wafer 10, when measuring the distance between the wafer 10 and the dielectric window 9 by the capacitive distance sensor, the voltage applied to the main coil 201 needs to be increased to enhance the first magnetic field, so as to lift the floating body device and make the floating body device as close as possible to the lower surface of the dielectric window 9, so as to shorten the distance between the capacitive distance sensor and the dielectric window 9 and improve the accuracy of the measurement result. The APS wafer, which is a wireless measurement device used in semiconductor process equipment and automated material handling systems, can only try to approach the dielectric window 9 by lifting the carrier 4 when measuring the lower surface of the dielectric window 9. However, the present application only needs to adjust the magnetic field strength of the first magnetic field to make the floating body device closer to the dielectric window 9, which is more convenient to control and has a simpler structure.

[0089] In some embodiments, when the backside sensors 16 include image sensors, it is only necessary to ensure that the distance between the image sensors and the dielectric window 9 falls within the effective focusing distance range of the image sensors used each time. Similarly, the rotation of the detection device can effectively observe the health status of the dielectric window 9, such as whether there is a phenomenon of peeling of the surface coating of the dielectric window 9.

[0090] The image sensors and the capacitive distance sensors described above can also be arranged together, that is, two rows of backside sensors 16 can be arranged on the integrated board 302, and the two rows of backside sensors 16 are capacitive distance sensors and image sensors respectively, so as to realize the detection of the two functions. It can be understood that the backside sensors 16 are not limited to the two types of functional sensors described above, but other types of sensors can be selected according to actual conditions.

[0091] For example, the application is used in an ICP (Inductively Coupled Plasma) inductively coupled plasma chamber, and the application is combined with Figure 1 The fixing assembly 2 is arranged on the bearing table 4, and the bearing table 4 is provided with a cover ring 7, a focusing ring 8 and a wafer 10. The power supply 6 is connected to the fixing assembly 2, so as to supply power to the fixing assembly 2 and process sensor signals and control magnetic field distribution. Figure 5 In the specific detection process, (a) combined with Figure 6 First, the chamber door 25 at the side of the chamber 23 is opened, the mechanical arm 24 carries the wafer 10 into the chamber 23 and maintains above the bearing table 4; (b) combined with Figure 7 The top pin in the bearing table 4 lifts the wafer 10 and separates the wafer 10 from the mechanical arm 24; (c) combined with Figure 8 The mechanical arm 24 is withdrawn from the chamber 23, the top pin carries the wafer 10 to descend and finally places the wafer 10 on the bearing table 4; (d) combined with Figure 9 The mechanical arm 24 is withdrawn from the chamber 23, the top pin carries the wafer 10 to descend and finally places the wafer 10 on the bearing table 4; (d) combined with Figure 10 The mechanical arm 24 is withdrawn from the chamber 23 and the chamber door 25 is closed. The balance position of the float device is regulated by changing the voltage applied to the main coil 201, that is, the magnetic suspension height of the float device. The float device is driven to rotate by starting the rotating motor 103 in the magnetic suspension state. The rotating speed and rotating direction of the float device are controlled by changing the rotating speed and rotating direction of the rotating motor 103. The float device is automatically stopped after rotating a fixed angle by the cooperation of the rotating speed and rotating direction of the rotating motor 103, that is, the rotating angle of the float device is controlled.

[0092] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those of ordinary skill in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. The specific techniques in some embodiments can be combined with other embodiments, in part or in whole, unless explicitly excluded by another embodiment. Therefore, the application will not be limited to these embodiments shown in the text, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer inspection apparatus characterized by comprising: The application relates to a wafer detection device, which comprises: a fixed assembly (2) arranged on a carrier device and generating a first magnetic field; a floating assembly (1) generating a second magnetic field, and the directions of the first magnetic field and the second magnetic field are opposite, so that the floating assembly (1) can be suspended above the fixed assembly (2); a detection assembly (3) connected with the floating assembly (1) and used for detecting a wafer (10) arranged on the carrier device.

2. The wafer inspection apparatus of claim 1, wherein The detection assembly (3) comprises: a first shell (301); a second shell (303) connected with the first shell (301) and surrounding an installation space, and the floating assembly (1) is arranged in the installation space; an integrated plate (302) arranged in the installation space and connected with the second shell (303); a detection component arranged on the integrated plate (302), and a relief hole for detection of the detection component is arranged on the first shell (301) and / or the second shell (303).

3. The wafer inspection apparatus of claim 2, wherein The detection component comprises: an edge sensor arranged on a side of the integrated plate (302) facing the fixed assembly (2) and arranged eccentrically relative to a rotation center of the floating assembly (1), and used for detecting the wafer (10); a center sensor (22) arranged on the integrated plate (302) and used for detecting the floating assembly (1).

4. The wafer inspection apparatus of claim 3, wherein The detection component further comprises a back side sensor (16) arranged on a side of the integrated plate (302) facing away from the fixed assembly (2) and arranged eccentrically relative to the rotation center of the floating assembly (1), and used for detecting a medium window (9).

5. The wafer inspection apparatus of claim 4, wherein The edge sensor comprises at least one of an image sensor, a distance sensor and a gas detection sensor; and / or, The center sensor (22) comprises at least one of a gyroscope, a vibration sensor and an image sensor; and / or, The back side sensor (16) comprises at least one of an image sensor and a distance sensor.

6. The wafer inspection apparatus of claim 1, wherein The fixed assembly (2) comprises: a main coil (201) arranged on the carrier device and generating the first magnetic field; a first sensor (203) arranged on the carrier device and arranged in the main coil (201) and used for detecting the first magnetic field.

7. The wafer inspection apparatus of claim 6, wherein The fixed assembly (2) further comprises a plurality of auxiliary coils (202) arranged in the main coil (201) and used for generating an auxiliary magnetic field for fine adjustment of a floating angle of the floating assembly (1); and / or, The fixed assembly (2) further comprises a second sensor arranged on the carrier device and used for detecting whether the floating assembly (1) is suspended above the fixed assembly (2).

8. The wafer inspection apparatus of claim 1, wherein The floating assembly (1) comprises: a magnet assembly arranged in the detection assembly (3) and generating the second magnetic field; a rotating motor (103) arranged in the detection assembly (3) and used for driving the magnet assembly to rotate.

9. The wafer inspection apparatus of claim 8, wherein The magnet assembly comprises: A first permanent magnet (101) is arranged in the detection assembly (3) and on the side of the rotary motor (103) away from the fixed assembly (2), and the rotary motor (103) is used to drive the first permanent magnet (101) to rotate; A second permanent magnet (102) is arranged in the detection assembly (3) and on the side of the rotary motor (103) close to the fixed assembly (2), and is connected with the rotary motor (103) and the detection assembly (3).

10. The wafer inspection apparatus of claim 9, wherein The first permanent magnet (101) and the second permanent magnet (102) are coaxially arranged, and the cross-sectional dimension of the second permanent magnet (102) is smaller than that of the first permanent magnet (101) in the direction from the first permanent magnet (101) to the second permanent magnet (102).

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