Electronic device with bent pins

Abstract

The invention relates to an electronic device with a curved profile pin. An electronic device includes one or more power semiconductor dies and a plurality of plug bushes attached to a substrate. The electronic device also includes an electrically insulating housing laterally encapsulating the one or more power semiconductor dies, and a plurality of pins providing an electrical interface for the electronic device. And the near end of each pin is inserted into one of the plurality of plug bushes. One or more of the pins have a curved profile and include a first section and a third section oriented substantially perpendicular to the substrate and offset from each other in a direction parallel to the substrate, and a second section oriented substantially perpendicular to the substrate and offset from each other in a direction parallel to the substrate. The second section is interposed between and electrically couples the first section and the third section. At least a portion of the first section and at least a portion of the second section are covered with an electrically insulating material.

Description

Background Technology

[0001] The demand for electronic devices for power applications continues to grow across numerous industries, including automotive, consumer electronics, renewable energy, manufacturing, and medical. Advances in semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) have enabled power electronic devices to possess advantageous features such as smaller footprint, higher voltage and current capabilities, and faster switching speeds.

[0002] Reducing the size of power electronics and their corresponding components can lower manufacturing costs and improve the ability to meet the requirements of these devices. Specifically, SiC chips typically have a smaller footprint, allowing for the use of smaller substrates and housings in the fabrication of power electronics, thus providing potential cost savings combined with the performance advantages of SiC. However, especially for high-voltage applications, reducing the size of power electronics can be limited by creepage and clearance requirements. Additionally, some applications require compatible power electronics with specific external interface layouts.

[0003] Therefore, a solution is needed that allows smaller power electronics to be manufactured more cheaply, while still meeting creepage and clearance requirements and being compatible with existing applications. Summary of the Invention

[0004] According to an embodiment of an electronic device, the electronic device includes: a substrate; one or more power semiconductor dies attached to the substrate; an electrically insulating shell laterally encapsulating the one or more power semiconductor dies; a plurality of sockets attached to the substrate; and a plurality of pins providing an electrical interface for the electronic device, each pin having a distal end and a proximal end inserted into one of the plurality of sockets, wherein one or more of the pins have a curved profile and include: a first segment and a third segment oriented substantially perpendicular to the substrate and offset from each other by a distance in a direction parallel to the substrate, the first segment including the proximal end of the pin and the third segment including the distal end of the pin; and a second segment inserted between the first segment and the third segment and electrically coupling the first segment and the third segment, wherein at least a portion of the first segment and at least a portion of the second segment are covered by an electrically insulating material.

[0005] According to an embodiment of a method for manufacturing an electronic device, the method includes: attaching one or more power semiconductor dies and a plurality of sockets to a substrate; providing a plurality of pins, wherein one or more of the pins have a curved profile and include: a first segment and a third segment oriented substantially perpendicular to the substrate and offset from each other by a distance in a direction parallel to the substrate, the first segment including a proximal end of the pin and the third segment including a distal end of the pin; and a second segment interposed between the first segment and the third segment and electrically coupled to the first segment and the third segment; and for each of the plurality of pins, inserting the proximal end of the pin into a plurality of sockets. In a socket; providing one or more pins having a curved profile, wherein at least a portion of a first segment and at least a portion of a second segment are covered by an electrically insulating material, or, before or after inserting the proximal end of each of the one or more pins having a curved profile into one of a plurality of sockets, applying an electrically insulating material to at least a portion of the first segment and at least a portion of the second segment of each of the one or more pins having a curved profile; and encapsulating one or more power semiconductor dies in an electrically insulating housing such that the distal end of each of the plurality of pins is outside the housing and provides an electrical interface for an electronic device.

[0006] Those skilled in the art will recognize additional features and advantages upon reading the following detailed description and upon viewing the accompanying drawings. Attached Figure Description

[0007] The elements in the accompanying drawings are not necessarily proportional to each other. The same reference numerals denote corresponding similar parts. Features of the various illustrated embodiments can be combined unless they are mutually exclusive. Embodiments are depicted in the accompanying drawings and described in detail below.

[0008] Figure 1 A perspective view of an electronic device according to an embodiment is shown.

[0009] Figure 2 A partial side cross-sectional view of an electronic device according to an embodiment is shown.

[0010] Figures 3A-3D A partial side cross-sectional view of an electronic device according to an embodiment is shown.

[0011] Figures 4A-4C A partial side cross-sectional view of an electronic device according to an embodiment is shown.

[0012] Figures 5A-5C A top plan view of an electronic device according to an embodiment is shown.

[0013] Figures 6A-6GA partial side cross-sectional view of a method for manufacturing an electronic device according to an embodiment is shown. Detailed Implementation

[0014] This document describes an electronic device having one or more power semiconductor dies attached to a substrate and a plurality of pins providing an electrical interface for the electronic device. An electrically insulating housing laterally encloses one or more power semiconductor dies within an internal space defined by the substrate and the housing. Each pin has a proximal end that inserts into a socket attached to the substrate and a distal end that is outside the housing. Each socket can be electrically coupled to one or more power semiconductor dies via traces on the substrate, bonding wires, strips, metal clamps, or other means.

[0015] At least one pin providing an electrical interface for an electronic device has a curved profile, wherein the distal end of the pin is offset from the proximal end in a direction parallel to the substrate. The curved pin can be oriented relative to an adjacent pin (a straight pin or another curved pin) such that the distal end of the curved pin is offset from the adjacent pin, and thus increasing the effective spacing between the curved pin and the adjacent pin. This larger effective spacing can improve creepage and / or clearance distances between adjacent pins, making it possible to use a smaller, less expensive substrate by placing pins closer together without exceeding creepage and / or clearance requirements. Additionally, the larger effective spacing between the curved pin and adjacent pins provides greater flexibility in pin arrangement on the substrate, as high-voltage pins can be placed adjacent to low-voltage pins without exceeding creepage and / or clearance requirements. Using curved pins in the manufacture of electronic devices also allows standard external pin layouts to have smaller substrates, potentially reducing the manufacturing cost of electronic devices while maintaining compatibility with existing applications.

[0016] Next, with reference to the accompanying drawings, exemplary embodiments of an electronic device having curved pins are described.

[0017] Figure 1 A perspective view of an electronic device 100 according to an embodiment is shown. The electronic device 100 may be a power semiconductor module, component, or other packaged assembly. The electronic device 100 includes one or more power semiconductor dies 120 attached to a substrate 110. An electrically insulating housing 105 laterally (e.g., in the x and y directions) encloses the substrate 110 and the housing 105 (e.g., the walls 105 of the housing 105). W and top 105 T One or more power semiconductor dies 120 are located within a defined internal space 107. In the following references, a substrate 110 is parallel to the x and y directions.

[0018] One or more power semiconductor dies 120 may each include one or more devices, including transistors, diodes, resistors, capacitors, and / or other types of active or passive devices. One or more power semiconductor dies 120 may be vertical power semiconductor dies (e.g., vertical power transistor dies). For vertical power transistor dies, the primary current flow path is between the front and back sides of the power semiconductor die 120 (along...). Figure 1 (in the z-direction). In one embodiment, one or more power semiconductor dies 120 are SiC transistor dies, such as SiC power MOSFETs (metal-oxide-semiconductor field-effect transistors). One or more power semiconductor dies 120 may be Si power MOSFET dies, HEMT (high electron mobility transistor) dies, IGBT (insulated gate bipolar transistor) dies, JFET (junction field-effect transistor) dies, etc. Power semiconductor dies 120 attached to substrate 110 may all have similar or identical designs (e.g., device type, structure, material, size, etc.), or some or each of the power semiconductor dies 120 may have different designs. Various arrangements of the power semiconductor dies 120 on substrate 110 are considered. One or more power semiconductor dies 120 and / or their constituent devices may be arranged to form all or part of a power electronic circuit (e.g., DC / AC inverter, DC / DC converter, AC / DC converter, AC / AC converter, multiphase inverter, H-bridge, motor driver, etc.). In some examples, the power electronic circuit including one or more power semiconductor dies 120 is a half-bridge or full-bridge circuit.

[0019] Examples of substrate 110 include DCB (direct copper bonding) or AMB (active metal bonding) substrates, printed circuit boards (PCBs), lead frames, or other substrates (e.g., insulated metal substrates (IMS)). Substrate 110 may include one or more insulating layers (e.g., ceramic, polyimide, etc.) and metallization layers (e.g., contact pads and / or traces electrically coupled to one or more power semiconductor dies 120).

[0020] Figure 1 The housing 105 may be a frame housing. The frame housing may include one or more pieces of metal, plastic, composite material, and / or other suitable material constructed and arranged to encapsulate one or more power semiconductor dies 120. The walls 105 of the housing... W and top 105 T It can be part of a single item, or it can be several separate items. For example, the top 105 TIt can be a cover. In some examples, the outer casing 105 is a molded casing attached to the substrate 110. That is, the wall 105 W And / or top 105 T Molding compounds can be formed from molding compounds. Molding compounds are typically plastic encapsulants formed from organic resins (such as epoxy resins). Plastic encapsulants may include fillers (such as non-molten inorganic materials). Catalysts can be used to accelerate the curing reaction of the organic resin. If appropriate, other materials such as flame retardants, adhesion promoters, ion trapping agents, stress relievers, colorants, etc., can be added to the plastic encapsulant. Molding compounds can be formed through injection molding, compression molding, film-assisted molding (FAM), reaction injection molding (RIM), resin transfer molding (RTM), blow molding, etc.

[0021] Electronic device 100 includes a plurality of sockets 130 attached to substrate 110. The sockets 130 may be formed of a metal or metal alloy such as copper or aluminum, and may also include an electrically insulating covering or coating. One or more sockets 130 may be attached to and electrically coupled to a metallization layer (e.g., pads, traces) of substrate 110. Each of a plurality of pins 140 is inserted into one of the sockets 130. Each of the plurality of pins 140 protrudes through housing 105 such that the distal end 140 of each pin 140... DE Located outside the housing 105, pin 140 provides an electrical interface for electronic device 100. Pin 140 may be formed of copper, aluminum, an alloy (e.g., a nickel-tin alloy), or another conductive material.

[0022] According to an embodiment, one or more of the pins 140 have a curved profile. Hereafter, the pin 140 with the curved profile may be referred to as a curved pin 140. B The pin 140 with a straight profile can be referred to as the straight pin 140. S . Figure 1 The electronic device 100 in the middle shows a bent pin 140 B and straight pin 140 S Examples of both.

[0023] Figure 2 A partial side cross-sectional view of an electronic device 100 according to an embodiment is shown. The substrate 110 includes an insulating layer 114 and metallization layers 112 and 116. The insulating layer 114 may include ceramics, polymers (e.g., polyimide), etc. The metallization layers 112 and 116 may each include copper, aluminum, alloys, etc. Figure 2 The power semiconductor die 120 shown is attached to a metallization layer 112. The metallization layer 112 may include one or more traces and / or contact pads. Figure 2The socket 130 is also attached to the metallization layer 112 and can be electrically coupled to the power semiconductor die 120 (e.g., for a power semiconductor die 120 including a vertical power transistor) via the metallization layer 112. In other examples, the semiconductor die 120 and the socket 130 may be attached to different islands (e.g., pads or traces) of the metallization layer 112 and may be electrically coupled to each other by other means such as (one or more) bonding wires, (one or more) strips, metal clamps, etc. The metallization layer 116 may be configured to attach the electronic device 100 to a module or other component, such as a heat sink (e.g., by soldering). Other arrangements of the metallization layers 112 and / or 116, the insulating layer 114, and other metallization layers and / or insulating layers of the substrate 110 are contemplated.

[0024] 140 bent pins B It includes a first segment 141, a second segment 142, and a third segment 143. The first segment 141 and the third segment 143 are oriented to be substantially perpendicular to the substrate 110 and offset from each other by a distance d in the x direction (i.e., parallel to the substrate 110).

[0025] The first segment 141 includes pin 140 B The proximal end 140 of the insertion sleeve 130 PE In this example, pin 140 B 140 proximal end PE It is a press-fit end having an anchoring portion 144 in the insert sleeve 130. The proximal end 140 is considered. PE Examples of soldering to the socket 130 or directly to the substrate 110.

[0026] The third segment 143 includes pin 140 B The distal end 140 outside the outer casing 105 DE In this example, the third segment 143 protrudes through the top 105 of the housing 105. T .

[0027] The second segment 142 is inserted between the first segment 141 and the third segment 143 and electrically coupled to the first segment 141 and the third segment 143. In this example, the second segment 142 extends in the x-direction between the first segment 141 and the third segment 143, such that the second segment 142 is substantially parallel to the substrate 110. That is, in Figure 2 In the example, the second segment 142 is oriented at approximately 90 degrees relative to the first segment 141 and the third segment 143. This is just an example, and the second segment 142 does not need to be substantially parallel to the substrate 110 and may be oriented at other angles relative to the first segment 141 and the third segment 143.

[0028] In this example, Figure 2 The bent pin 140 B 140 at the far end DE It is a press-fit end, which includes a pointed portion 146 and a deformable portion 148 adjacent to the pointed portion 146. The pointed portion 146 has a proximal region 146 adjacent to the deformable portion 148. P And the proximal region 146 P (For example, in the x-direction) narrow distal region 146 D The tip portion 146 is configured to guide the press-fit terminal, for example, into the opening 211 of the printed circuit board 210. The deformable portion 148 is configured to deform upon insertion into the opening 211 of the printed circuit board 210. Note that the printed circuit board 210 is included herein for illustrative purposes and not as a requirement of the electronic device 100. In other examples, the bent lead 140 B 140 at the far end DE It can be configured to be soldered to printed circuit board 210.

[0029] Figures 3A-3D A partial side cross-sectional view of an electronic device 100 according to an embodiment is shown. Figures 3A-3D Specifically, the structural support for the bent pin 140 is shown. B (For example, when the near end is 140) PE Insert into the socket and / or when the distal end is 140 DE Inserted into a printed circuit board (e.g., Figure 2 Examples of resistance to torque and bending in printed circuit boards 210 or other devices.

[0030] Figure 3A and Figure 3B The housing 105 is shown to be a molded frame 105 with bent pins 140. B An example partially embedded in the molded frame 105. Figure 3A In the middle, portions of the second segment 142 and the third segment 143 are embedded in the molding frame 105, and the third segment 143 extends from the wall 105 of the molding frame 105 in the z-direction. W Prominent. In Figure 3B In the middle, the second segment 142 extends in the x-direction through the wall 105 of the molded frame 105. W In these examples, the first segment 141 is not embedded in the molded frame 105, but examples are considered where at least a portion of the first segment 141 is embedded in the molded frame 105. Bent pin 140 B It can be partially embedded in the molding frame 105 during the formation of the molding frame 105 (e.g., by bending the pin 140). B Inserted into the molded part and bent at pin 140 B(A portion of the surrounding liquefied molding compound is injected).

[0031] exist Figure 3C In the example, the bent pin 140 B The second section 142 and the third section 143 are separated by the wall 105 of the outer casing 105. W Flange 105 L support.

[0032] exist Figure 3D In the example, the bent pin 140 B Supported by support member 160, which is separate from housing 105 and inserted into substrate 110 and pins 140. B Between the second segment 142 and the third segment 143. In other examples, the support 160 may be inserted only between the second segment 142 and the substrate 110 or only between the third segment 143 and the substrate 110. The support 160 may be a block, pillar, or other structure of material (e.g., an electrically insulating material) attached to the substrate 110.

[0033] Figures 4A-4C A partial side cross-sectional view of an electronic device 100 according to an embodiment is shown. Figures 4A-4C Specifically, the bent pin 140 is shown. B An example where a portion is covered by an electrically insulating material, which is the bent pin 140. B An isolation layer is provided. For example... Figures 4A-4C As shown, the bent pin 140 in any of the examples described herein B One or more bent pins 140 B It can be covered by electrical insulating materials.

[0034] exist Figure 4A In the example, at least a portion of the first segment 141, the second segment 142, the third segment 143, and the socket 130 is covered by the first electrical insulating layer 151. When bending the pin 140... B After insertion into the sleeve 130, the first electrical insulating layer 151 can be applied, for example, by spraying, misting, or other types of deposition or lamination processes. In some examples, the first electrical insulating layer 151 may be an enamel coating or other coating, tape, or film (e.g., a polyimide coating, tape, or film). Other examples are considered, including instances where portions of the first segment 141, the second segment 142, and / or the third segment 143 are uncovered or covered by different materials (e.g., the first electrical insulating layer 151 covering the first segment 141 comprises a first material, and the first electrical insulating layer 151 covering the second segment 142 and / or the third segment 143 comprises a second, different material).

[0035] Figure 4B A first electrical insulating layer 151 covers the socket 130 and a second electrical insulating layer 152 covers the bent pin 140. B For example, in bending pin 140. B After insertion into the socket 130, the first electrical insulating layer 151 and the second electrical insulating layer 152 can be applied to the socket 130 and the bent pin 140, respectively. B So that the socket 130 and the bent pin 140 B An adhesive joint is formed between them. In some examples, the 140-degree bend is used. B A previously applied electrical insulating layer 152 may be provided. The second electrical insulating layer 152 may be a coating, tape, film, sleeve, or other structure. The second electrical insulating layer 152 may include a polymer (e.g., polyimide). In this example, the second electrical insulating layer 152 covers at least a portion of the first segment 141, the second segment 142, and the third segment 143. Examples are considered where portions of the first segment 141, the second segment 142, and / or the third segment 143 are not covered by the second electrical insulating layer 152 and / or are covered by a different material (e.g., the first electrical insulating layer 151).

[0036] exist Figure 4A and Figure 4B In the example, for instance, bent pin 140 B 140 at the far end DE Not covered, so that the remote 140 DE Able to attach and electrically couple to a printed circuit board (e.g., Figure 2 Printed circuit board 210 in the middle.

[0037] Figure 4C The 140-pin cover is shown. B A portion of the electrical insulating material is an example of a potting compound 153 that at least partially fills the internal space 107 defined by the housing 105 and the substrate 110.

[0038] Figures 5A-5C A top plan view of an electronic device 100 according to an embodiment is shown. Figures 5A-5C An example shows that the bending pin 140 in the electronic device 100 can be used. B This section describes some of the exemplary arrangements and specific advantages provided. Note that, for better illustration of the features, Figures 5A-5C The top 105 of the outer casing 105 is omitted. T .

[0039] Figure 5A The electronic device 100 includes bent pins 140 B,1 140 B,2 140 B,3140 B,4 and 140 B,5 and straight pin 140 S,1 140 S,2 and 140 S,3 140-degree bent pin B,1 140 B,2 140 B,3 140 B,4 and 140 B,5 and straight pin 140 S,1 140 S,2 and 140 S,3 Each of them is inserted into a socket 130 attached to the metallization layer 112. Each socket 130 is attached to the metallization layer 112 (e.g., an island of the metallization layer 112). The respective island of the metallization layer 112 can be directly electrically coupled to one of the power semiconductor dies 120 (e.g., a power semiconductor die 120 mounted on an island of the metallization layer), or can be electrically coupled to the power semiconductor die 120 in another manner (e.g., by bonding wire 118) such that the bent pin 140 inserted into the socket 130 attached to the respective island of the metallization layer 112... B Or straight pin 140 S Electrically coupled to power semiconductor die 120.

[0040] Although not specifically shown, Figure 5A The bent pin 140 B,1 140 B,2 140 B,3 140 B,4 and 140 B,5 and / or straight pin 140 S,1 140 S,2 and 140 S,3 Any of them may be at least partially covered by one or more electrical insulating layers, for example, such as Figures 4A-4C As shown. Bent pin 140 B,1 140 B,2 140 B,3 140 B,4 and 140 B,5 and / or straight pin 140 S,1 140 S,2 and 140 S,3 Any part of (e.g., the distal end 140 of the third segment 143) DE It can be left unwritten.

[0041] Figure 5A Perimeters P and P' are shown. Perimeter P is the outer perimeter of the electronic device 100 shown in the figure, and in this example and Figure 5B and Figure 5C In the example, it can also represent the outer perimeter of housing 105 and / or substrate 110. Perimeter P' represents the boundary if the bent pin 140 is not used. B And all pins are straight pins, 140. S Then it has the same external layout as pin 140 (e.g., far end 140). DE The area required by comparable electronic devices (at the location). That is, for the layout shown, only straight pins 140 are used. S Requires a straight pin 140 S And socket 130 with bent pin 140 respectively B,1 140 B,2 140 B,3 140 B,4 140 B,5 The third sections 1431, 1432, 1433, 1434, and 1435 are placed on the substrate 110 at the same xy positions, thus requiring the housing 105 and the substrate 110 to extend at least to the perimeter P'. It should be noted that the perimeter P' represents the area to be accommodated on the substrate of a comparable electronic device for housing the straight pin 140. S The area required for the socket 130, the straight pin 140 S Placed with Figure 5A The bent pin 140 in the electronic device 100 B At the same location as the third segment 143. Therefore, the area marked by regions R1, R2, and R3 between perimeters P and P' represents the area that can be reached using the bent pin 140 described herein. B The area provided is increased. Specifically, this is achieved by bending the pin 140. B,1 140 B,2 and 140 B,4 The second sections 1421, 1422 and 1424 extend through the wall 105 of the outer casing 105, respectively. W This allows the corresponding third segments 1431, 1432, and 1434 to be located outside the perimeter P, thereby increasing the area in regions R1 and R2. This is achieved by bending pin 140. B,3 The second section 1423 extends partially through the wall 105 of the outer casing 105. W Makes the bent pin 140 B,3 140 at the far end DE,3 In the z-direction, 105 with the wall W Alignment is used to provide an increase in area within region R3. Bend pin 140 is used. BThe increased area that can be provided allows the electronic device 100 to have a smaller substrate 110 and housing 105 using the same external layout of pins 140, thereby potentially reducing the cost of manufacturing the electronic device 100 while maintaining compatibility with existing applications.

[0042] Figure 5A The layout shown in the image illustrates the use of bent pins 140. B Examples that can provide improved creepage and clearance for electronic device 100 include a bent pin 140 inserted into an adjacent socket 130. B,1 and straight pin 140 S,1 140-degree bent pin B,1 and straight pin 140 S,1 The insertion points in socket 130 are spaced apart by a distance d1. Bend pin 140. B,1 The uncovered portion (e.g., the distal end 140 of the third segment 1431) DE,1 ) and straight pin 140 S,1 The gap between the uncovered portions is formed by straight pin 140. S,1 The uncovered portion and the bent pin 140 B,1 The effective spacing d between the uncovered portions of the third segment 1431 1,eff Determined, not by straight pin 140 S,1 With bent pin 140 B,1 The spacing d1 between the positions in the insertion socket 130 is determined (e.g., for two adjacent straight pins 140). S (The situation). That is, using bent pin 140. B,1 Clearance and potential creepage can be improved by providing a larger effective spacing between adjacent pins 140 without increasing the spacing between adjacent pins 140 and socket 130 on substrate 110. This allows for a reduced spacing between adjacent pins 140 on substrate 110, and thus enables a reduction in the size of substrate 110 while still meeting creepage and clearance requirements, potentially leading to reduced manufacturing costs. Alternatively or by using one or more bent pins 140... B Increasing the effective spacing between adjacent pins 140 allows the high-voltage pin 140 to be placed closer to the low-voltage pin 140. For example, bending pin 140. B,1 It can be assigned a low voltage (e.g., DC potential or ground) and has a straight pin 140. S,1 High voltages (e.g., DC + potential) can be applied. Alternatively, the 140-degree bend of the pin can be used. B,1 It can be supplied with high voltage and has a straight pin 140. S,1 It can be assigned a low voltage.

[0043] Using bent pin 140 B Another example of improving the creepage and / or clearance of electronic device 100 is shown as having a bent pin 140 inserted into an adjacent socket 130. B,3 and 140 B,4 140-degree bent pin B,3 and 140 B,4 The insertion points in socket 130 are spaced apart by a distance d2. In this example, the bent pin 140... B,3 The second segment 1423 extends in the x direction and bends pin 140. B,4 The second segment 1424 extends in the y direction, causing the bent pin 140 to... B,3 and 140 B,4 The uncovered far end is separated by an effective distance d 2,eff Although an example was considered where the second segments 1423 and 1424 were not orthogonal, in this example, the second segments 1423 and 1424 are substantially orthogonal to each other. In this example, the bent pin 140 B,3 It can be assigned a low voltage and has a 140-degree bend in the pin. B,4 High voltage can be applied. Alternatively, bend pin 140. B,3 It can be supplied with high voltage and has a 140° bendable pin. B,4 It can be assigned a low voltage.

[0044] Figure 5B The electronic device 100 includes bent pins 140 B,1 140 bent pins B,1 Inserted into the first socket 1301 provided along the outer perimeter P of the substrate 110. Straight pin 140 S,1 Inserted into a second socket 1302 spaced inward from the outer perimeter P. In some examples, the bent pin 140 B,1 It can be assigned a low voltage and has a straight pin 140. S,1 High voltage can be applied. Alternatively, bend pin 140. B,1 It can be supplied with high voltage and has a straight pin 140. S,1 It can be assigned a low voltage.

[0045] Figure 5C The electronic device 100 includes a plurality of bent pins 140 B Multiple bent pins 140 B The second segment 142 has a radial arrangement. Each of the radially arranged second segments 142 is oriented along a direction extending from the center point C within the outer perimeter P of the substrate 110.

[0046] Considered Figures 5A-5COther arrangements of the features shown.

[0047] Figures 6A-6G A partial side cross-sectional view of a method for producing an electronic device 100 according to an embodiment is shown.

[0048] Figure 6A The diagram shows the attachment of a power semiconductor die 120 and a plurality of sockets 130 to a substrate 110.

[0049] Figure 6B The diagram shows a plurality of pins 140. In this example, one of the pins 140 is a bent pin 140. B And one of the pins is a straight pin 140. S .

[0050] Figure 6C It shows Figure 6B The bent pin 140 provided in B An alternative example. In this example, pin 140 is bent. B An electrically insulating material 152 is provided covering a portion of the first section 141, a portion of the second section 142, and a portion of the third section 143 (e.g., Figure 4B The second electrical insulating material 152 in the process. Although subsequent examples of the method show, as in Figure 6B The bent pin 140 provided in B However, any examples in this article may alternatively include those provided. Figure 6C The bent pin 140 B .

[0051] Figure 6D An alternative example is shown that provides multiple pins 140. In this example, the pins 140 are bent. B and straight pin 140 S It is configured to be partially embedded in the electrically insulating housing 105. For example, Figure 6D The housing 105 in the design can be a molded frame 105 (e.g., as shown in the image). Figure 3A and Figure 3B (as shown and described), and bent pin 140 B and straight pin 140 S It can be partially embedded in the molding frame 105 during the formation of the molding frame 105 (e.g., by bending the pin 140). B and straight pin 140 S Inserted into the molded part and bent at pin 140 B Part of and straight pin 140 S (A portion of the surrounding liquefied molding compound is injected). Although subsequent examples of this method show, as... Figure 6BThe bent pin 140 provided in B and straight pin 140 S However, any examples in this article may optionally include providing, for example... Figure 6D The bent pin 140 shown is at least partially embedded in the housing 105. B and straight pin 140 S .

[0052] Figure 6E The diagram shows the bending pin 140. B and straight pin 140 S 140 proximal ends of each PE Insert into one of the plurality of sockets 130. As previously described, bend pin 140. B Or straight pin 140 S The proximal end of one or both of them 140 PE It can be the press-fit end inserted into the socket 130.

[0053] Figure 6F This illustrates the use of electrical insulating material 151 (e.g., Figure 4B The first electrical insulating material 151) is applied to the bent pin 140. B A portion of the first segment 141, a portion of the second segment 142, and a portion of the third segment 143. In this example, electrical insulating material 151 is also applied to the straight pin 140. S Part of and socket 130. As previously described, bent pin 140. B It can be configured with a 140° coverage bend pin. B A portion of the electrical insulation material (e.g., such as Figure 6C (As shown and described). In these examples, the application of electrical insulating material 151 at this stage can be omitted, or can be limited to application to the bent pin 140. B Partial, straight pin 140 S The portion and / or the portion of the socket 130.

[0054] Figure 6G This illustration shows a power semiconductor die 120 encapsulated in an electrically insulating housing 105 to create an electronic device 100. The housing 105 is arranged such that the distal end 140 of each of a plurality of pins 140 DE The power semiconductor die 120 is located outside the housing 105 and provides an electrical interface for the electronic device 100. Encapsulating the power semiconductor die 120 within the housing 105 may include encapsulating the wall 105. W Attached to substrate 110 and top 105 T (For example, the cover) is attached to wall 105 W .exist Figure 6DIn an example of multiple pins 140 and a molded frame 105 (wherein, the bent pins 140) B and straight pin 140 S (Set to be partially embedded in the molded frame 105), encapsulating the power semiconductor die 120 within the housing 105 may include: bending the leads 140 B and straight pin 140 S 140 proximal ends of each PE Simultaneously inserting one of the multiple sockets 130 (e.g., such as...) Figure 6E (shown and described), and encapsulating the power semiconductor die 120 in a housing 105 (e.g., by encapsulating the housing (e.g., wall 105)). W ) Attached to substrate 110).

[0055] Although this disclosure is not limited thereto, the examples numbered below illustrate one or more aspects of this disclosure.

[0056] Example 1. An electronic device includes: a substrate; one or more power semiconductor dies attached to the substrate; an electrically insulating housing that laterally encapsulates the one or more power semiconductor dies; a plurality of sockets attached to the substrate; and a plurality of pins providing an electrical interface for the electronic device, each pin having a distal end and a proximal end inserted into one of the plurality of sockets, wherein one or more of the pins have a curved profile and include: a first segment and a third segment oriented substantially perpendicular to the substrate and offset from each other by a distance in a direction parallel to the substrate, the first segment including the proximal end of the pin and the third segment including the distal end of the pin; and a second segment inserted between and electrically coupling the first and third segments, wherein at least a portion of the first segment and at least a portion of the second segment are covered by an electrically insulating material.

[0057] Example 2. The electronic device according to Example 1, wherein, for at least one pin having a curved profile, the proximal end of the pin is a press-fit end, the press-fit end including an anchoring portion that is inserted into one of a plurality of sockets.

[0058] Example 3. According to the electronic device of Example 1 or 2, wherein, for at least one pin having a curved profile, the distal end of the pin is a press-fit terminal, the press-fit terminal comprising: a tip portion configured to guide the press-fit terminal into an opening in a printed circuit board; and a deformable portion adjacent to the tip portion and configured to deform upon insertion into the opening in the printed circuit board, wherein the tip portion has a proximal region adjacent to the deformable portion and a distal region narrower than the proximal region.

[0059] Example 4. An electronic device according to any one of Examples 1 to 3, wherein, for at least one pin having a curved profile, the distal end of the pin is configured to be soldered to a printed circuit board.

[0060] Example 5. The electronic device according to any one of Examples 1 to 4 further includes: a support member, wherein, for at least one pin having a curved shape, the support member is separate from the housing and inserted between the substrate and a second and / or third segment of the pin.

[0061] Example 6. An electronic device according to any one of Examples 1 to 5, wherein the second segment extends between the first segment and the third segment in a direction substantially parallel to the substrate.

[0062] Example 7. An electronic device according to any one of Examples 1 to 6, wherein, for at least one pin having a curved shape, the third segment is located outside the outer perimeter of the substrate.

[0063] Example 8. An electronic device according to any one of Examples 1 to 7, wherein the first pin inserted into the first socket is a pin having a curved shape, and wherein the second pin inserted into the second socket adjacent to the first socket has a straight shape.

[0064] Example 9. The electronic device according to Example 8, wherein a lower voltage is assigned to the first pin compared to the second pin, or wherein a higher voltage is assigned to the first pin compared to the second pin.

[0065] Example 10. An electronic device according to any one of Examples 1 to 9, wherein a first pin inserted into a first socket disposed along the outer perimeter of a substrate is a pin having a curved shape, and wherein a second pin inserted into a second socket spaced inward from the outer perimeter has a straight shape.

[0066] Example 11. An electronic device according to any one of Examples 1 to 10, wherein a second segment of a first pin having a curved shape extends in a first direction, and wherein a second segment of a second pin having a curved shape extends in a second direction different from the first direction.

[0067] Example 12. The electronic device according to Example 11, wherein the first direction and the second direction are substantially parallel to the substrate.

[0068] Example 13. An electronic device according to any one of Examples 1 to 12, wherein a second segment having a plurality of pins with a curved shape has a radial arrangement, each of the radially arranged second segments being oriented along a direction extending from a center point within the outer perimeter of the substrate.

[0069] Example 14. An electronic device according to any one of Examples 1 to 13, wherein the electrically insulating material is a coating.

[0070] Example 15. An electronic device according to any one of Examples 1 to 13, wherein the electrically insulating material is a polyimide film.

[0071] Example 16. An electronic device according to any one of Examples 1 to 13, wherein the electrical insulating material is a potting compound that at least partially fills the internal space defined by the housing and the substrate.

[0072] Example 17. An electronic device according to any one of Examples 1 to 16, wherein one or more power semiconductor dies are SiC transistor dies.

[0073] Example 18. An electronic device according to any one of Examples 1 to 17, wherein the housing is a molded frame attached to a substrate, and wherein, for at least one pin having a curved profile, the pin is partially embedded in the molded frame.

[0074] Example 19. The electronic device according to Example 18, wherein for each pin having a curved shape and partially embedded in a molded frame, at least a portion of a second segment of the pin is embedded in the molded frame, and a first segment is not embedded in the molded frame.

[0075] Example 20. A method for manufacturing an electronic device includes: attaching one or more power semiconductor dies and a plurality of sockets to a substrate; providing a plurality of pins, wherein one or more of the pins have a curved profile and include: a first segment and a third segment oriented substantially perpendicular to the substrate and offset from each other by a distance in a direction parallel to the substrate, the first segment including a proximal end of the pin and the third segment including a distal end of the pin; and a second segment interposed between the first segment and the third segment and electrically coupled to the first segment and the third segment; for each of the plurality of pins, inserting the proximal end of the pin into one of the plurality of sockets. The invention comprises: providing one or more pins having a curved profile, wherein at least a portion of a first segment and at least a portion of a second segment are covered by an electrically insulating material; or, before or after inserting the proximal end of each of the one or more pins having a curved profile into one of a plurality of sockets, applying an electrically insulating material to at least a portion of the first segment and at least a portion of the second segment of each of the one or more pins having a curved profile; and encapsulating one or more power semiconductor dies in an electrically insulating housing such that the distal end of each of the plurality of pins is outside the housing and provides an electrical interface for an electronic device.

[0076] Terms such as "first," "second," etc., are used to describe various elements, regions, sections, etc., and are not intended to be limiting. Throughout the specification, the same term refers to the same element.

[0077] As used herein, the terms “having,” “containing,” “including,” “comprising,” etc., are open-ended terms indicating the presence of the said element or feature, but do not exclude additional elements or features. Unless the context clearly indicates otherwise, the articles “a” and “said” are intended to include both plural and singular forms.

[0078] Unless otherwise expressly stated, the expression “and / or” shall be interpreted to include all possible joint and separate combinations. For example, the expression “A and / or B” shall be interpreted to mean only A, only B, or both A and B. Unless otherwise expressly stated, the expression “at least one” shall be interpreted in the same manner as “and / or”. For example, the expression “at least one of A and B” shall be interpreted to mean only A, only B, or both A and B.

[0079] It should be understood that, unless otherwise specifically indicated, the features of the various embodiments described herein can be combined with each other.

[0080] Although specific embodiments have been shown and described herein, those skilled in the art will understand that various alternative and / or equivalent implementations may replace the specific embodiments shown and described without departing from the scope of the invention. This application is intended to cover any modifications or variations of the specific embodiments discussed herein. Therefore, the invention is intended to be limited only by the claims and their equivalents.

Claims

1. An electronic device comprising: a substrate; one or more power semiconductor dies attached to the substrate; an electrically insulating enclosure laterally enclosing the one or more power semiconductor dies; a plurality of bushings attached to the substrate; and a plurality of pins providing an electrical interface for the electronic device, each pin having a distal end and a proximal end inserted into one of the plurality of bushings, wherein one or more of the pins has a curved profile and comprises: a first section and a third section oriented substantially perpendicular to the substrate and offset from each other by a distance in a direction parallel to the substrate, the first section comprising the proximal end of the pin and the third section comprising the distal end of the pin; and a second section interposed between and electrically coupling the first section and the third section, wherein at least a portion of the first section and at least a portion of the second section are covered by an electrically insulating material. For at least one of the pins having the curved profile, the proximal end of the pin is a press-fit end comprising an anchoring portion inserted into one of the plurality of bushings. 2.The electronic device of claim 1, wherein, For at least one of the pins having the curved profile, the distal end of the pin is a press-fit end comprising: 3.The electronic device of claim 1, wherein a tip portion configured to guide the press-fit end into an opening of a printed circuit board; and a deformable portion adjoining the tip portion and configured to deform upon insertion into the opening of the printed circuit board; wherein the tip portion has a proximal region adjoining the deformable portion and a distal region narrower than the proximal region. For at least one of the pins having the curved profile, the distal end of the pin is configured to be soldered to a printed circuit board. 4.The electronic device of claim 1, wherein 5. The electronic device of claim 1, further comprising: a support, wherein for at least one of the pins having the curved profile, the support is separate from the enclosure and interposed between the substrate and the second section and / or the third section of the pin. The second section extends between the first section and the third section in a direction substantially parallel to the substrate. 6.The electronic device of claim 1, wherein For at least one of the pins having the curved profile, the third section is located outside an outer perimeter of the substrate. 7.The electronic device of claim 1, wherein 8. The electronic device of claim 1, a first pin inserted into a first bushing is one of the pins having the curved profile, and wherein wherein a second pin inserted into a second bushing adjacent to the first bushing has a straight profile.

9. The electronic device of claim 8, the first pin is assigned a lower voltage than the second pin, or wherein, wherein the first pin is assigned a higher voltage than the second pin.

10. The electronic device of claim 1, ​ wherein The first pin inserted into the first socket disposed along the outer perimeter of the substrate is one of the pins having the curved shape, and The second pin inserted into the second socket spaced inward from the outer perimeter has a straight shape.

11. The electronic device according to claim 1, wherein, The second segment of the first pin having the curved shape extends in the first direction, and The second segment of the second pin having the curved shape extends in a second direction different from the first direction. 12.The electronic device of claim 11, wherein, The first direction and the second direction are substantially parallel to the substrate.

13. The electronic device according to claim 1, wherein The second segment of the plurality of pins having the curved shape has a radial arrangement, and each of the radially arranged second segments is oriented along a direction extending from a center point within the outer perimeter of the substrate. 14.The electronic device of claim 1, wherein, The electrical insulating material is a coating. 15.The electronic device of claim 1, wherein, The electrical insulating material is a polyimide film. 16.The electronic device of claim 1, wherein, The electrical insulating material is a potting compound that at least partially fills the internal space defined by the housing and the substrate. 17.The electronic device of claim 1, wherein, The one or more power semiconductor dies are SiC transistor dies. 18.The electronic device of claim 1, wherein, The housing is a molded frame attached to the substrate, and wherein, for at least one of the pins having the curved shape, the pin is partially embedded in the molded frame. 19.The electronic device of claim 18, wherein, For each pin having the curved shape and partially embedded in the molding frame, at least a portion of the second segment of the pin is embedded in the molding frame, and the first segment is not embedded in the molding frame.

20. A method for manufacturing an electronic device, comprising: Attach one or more power semiconductor dies and multiple sockets to a substrate; A plurality of pins are provided, wherein one or more of the pins have a curved profile and include: a first segment and a third segment oriented substantially perpendicular to the substrate and offset from each other by a distance in a direction parallel to the substrate, the first segment including the proximal end of the pin and the third segment including the distal end of the pin; and a second segment interposed between the first segment and the third segment and electrically coupled to the first segment and the third segment; For each of the plurality of pins, the proximal end of the pin is inserted into one of the plurality of sockets; Provide one or more pins having the curved profile, wherein at least a portion of the first segment and at least a portion of the second segment are covered with an electrically insulating material, or, before or after inserting the proximal end of each of the one or more pins having the curved profile into one of the plurality of sockets, apply an electrically insulating material to at least a portion of the first segment and at least a portion of the second segment of each of the one or more pins having the curved profile; and encapsulating the one or more power semiconductor dies in an electrically insulating enclosure such that a distal end of each pin of the plurality of pins is outside the enclosure and provides an electrical interface for the electronic device.

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