Electronic component and component internal substrate provided with same

Abstract

In the electronic component, a terminal electrode is formed in a manner that a proper area is exposed from a magnetic element body part. The electronic component is provided with a coil part (111) which is embedded in the magnetic element body part (M), and terminal electrodes (121, 122) of the coil part (111) are respectively exposed on main surfaces (101, 102) of the coil part (111). The conductor layer (L1) includes: terminal patterns (141, 142), the end surfaces of which are respectively exposed on the main surfaces (101, 102); and a coil pattern (C11) connected to the terminal pattern (141). The conductor layer (L2) includes terminal patterns (143, 144), the end surfaces of which are respectively exposed on the main surfaces (101, 102). The terminal patterns (141, 143) are connected to each other via a via conductor (151) having an end surface exposed on the main surface (101), and the terminal patterns (142, 144) are connected to each other via a via conductor (152) having an end surface exposed on the main surface (102). The terminal electrodes (121, 122) are respectively surrounded by an interlayer insulating film (130) on the main surfaces (101, 102).

Description

Technical Field

[0001] This disclosure relates to electronic components and component-embedded substrates having the electronic components. Background Technology

[0002] Patent document 1 discloses a stacked coil array with multiple coil conductors built in.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2006-032425 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] In the stacked coil array described in Patent Document 1, the two ends of the coil conductor are connected to external electrodes disposed on the surface of the magnetic material layer. However, without the addition of external electrodes, since the area of ​​the two ends of the coil conductor exposed on the surface of the magnetic material layer is small, it is difficult to ensure sufficient connection area, for example, when used in a component embedded in a substrate.

[0008] This disclosure describes a technique for forming electrodes of appropriate area in an electronic component with multiple built-in coil sections.

[0009] Technical means to solve technical problems

[0010] An electronic component according to one aspect of this disclosure includes: a magnetic body having a first main surface and a second main surface located opposite to the first main surface; and a plurality of coil portions embedded in the magnetic body, each having a first terminal electrode exposed on the first main surface and a second terminal electrode exposed on the second main surface, wherein the plurality of coil portions are arranged in a first direction parallel to the first main surface, each of the plurality of coil portions having a plurality of conductor layers, the plurality of conductor layers comprising first and second conductor layers stacked in a second direction orthogonal to the first direction and parallel to the first main surface, the first conductor layer of each of the plurality of coil portions comprising: a first terminal pattern having an end face exposed on the first main surface and forming a first portion of a first terminal electrode; a second terminal pattern having an end face exposed on the second main surface and forming a first portion of a second terminal electrode; and a first coil pattern having one end connected to the first terminal pattern, the second conductor layer of each of the plurality of coil portions comprising: The plurality of coil portions contain a third terminal pattern, the end face of which is exposed on the first main surface and constitutes the second part of the first terminal electrode; and a fourth terminal pattern, the end face of which is exposed on the second main surface and constitutes the second part of the second terminal electrode. The first terminal pattern and the third terminal pattern contained in each of the plurality of coil portions are connected to each other via a first through-hole conductor, the first through-hole conductor constituting the third part of the first terminal electrode and having its end face exposed on the first main surface. The second terminal pattern and the fourth terminal pattern contained in each of the plurality of coil portions are connected to each other via a second through-hole conductor, the second through-hole conductor constituting the third part of the second terminal electrode and having its end face exposed on the second main surface. At least a portion of the first conductor layer and the second conductor layer contained in each of the plurality of coil portions are covered by an insulating film. The first terminal electrode contained in each of the plurality of coil portions is surrounded on the first main surface by an interlayer insulating film. The second terminal electrode contained in each of the plurality of coil portions is surrounded on the second main surface by an interlayer insulating film.

[0011] Invention Effects

[0012] According to this disclosure, a technique is available for forming electrodes of appropriate area in an electronic component that incorporates multiple coil sections. Attached Figure Description

[0013] Figure 1 This is a general perspective view showing the appearance of the electronic component 100 according to the first embodiment of the technology disclosed herein.

[0014] Figure 2 It is along Figure 1 The approximate cross-sectional view of line AA is shown.

[0015] Figure 3 It is along Figure 1 The diagram shows a rough cross-section of the BB line.

[0016] Figure 4(a) and (b) are approximate plan views used to illustrate the structure of terminal electrodes 121 and 122, respectively.

[0017] Figure 5 This is a general plan view illustrating the structure of a first modified example of the terminal electrode 121.

[0018] Figure 6 This is a general plan view illustrating the structure of a second modified example of the terminal electrode 121.

[0019] Figure 7 This is a general cross-sectional view used to illustrate the structure of the component-integrated substrate 10 of the built-in electronic component 100.

[0020] Figure 8 This is a general cross-sectional view used to illustrate a first modified example of the coil section 111.

[0021] Figure 9 This is a general cross-sectional view used to illustrate a second modified example of the coil section 111.

[0022] Figure 10 This is a general cross-sectional view used to illustrate the third modified example of the coil section 111.

[0023] Figure 11 This is a general cross-sectional view used to illustrate the fourth modified example of the coil section 111.

[0024] Figure 12 This is a general cross-sectional view used to illustrate the fifth modified example of the coil section 111.

[0025] Figure 13 This is a general cross-sectional view used to illustrate the sixth modified example of the coil section 111.

[0026] Figure 14 This is a general perspective view showing the appearance of the electronic component 200 according to the second embodiment of the technology disclosed herein.

[0027] Figure 15 It is along Figure 14 The approximate cross-sectional view of line AA is shown.

[0028] Figure 16 This is a general perspective view showing the appearance of the electronic component 300 according to the third embodiment of the technology disclosed herein.

[0029] Figure 17 It is along Figure 16 The diagram shows a rough cross-section of the BB line.

[0030] Figure 18 (a) to (d) are approximate plan views showing the shapes of the conductor patterns located in conductor layers L1 to L4 respectively in the third embodiment.

[0031] Figure 19 This is a general perspective view showing the appearance of the electronic component 400 according to the fourth embodiment of the technology disclosed herein.

[0032] Figure 20 It is along Figure 19 The diagram shows a rough cross-section of the BB line.

[0033] Figure 21 (a) to (d) are approximate plan views showing the shapes of the conductor patterns located in conductor layers L1 to L4 respectively in the fourth embodiment.

[0034] Figure 22 This is a general perspective view showing the appearance of the electronic component 500 according to the fifth embodiment of the technology disclosed herein.

[0035] Figure 23 It is along Figure 22 The diagram shows a rough cross-section of the BB line.

[0036] Figure 24 (a) to (d) are approximate plan views showing the shapes of the conductor patterns located in conductor layers L1 to L4 respectively in the fifth embodiment.

[0037] Symbol Explanation

[0038] 10 components with built-in substrate

[0039] 11-15 Insulation layer

[0040] Wiring patterns 20-22

[0041] 31, 32 Substrate through-hole conductors

[0042] 100, 200, 300, 400, 500 electronic components

[0043] 101, 102 main surface

[0044] Side view, 103-106

[0045] Coil section 111-118

[0046] Terminal electrodes 121 and 122

[0047] 130-layer interlayer insulation film

[0048] Terminal patterns 140-149

[0049] Through-hole conductors 151-158 and 161-164

[0050] A1, B1 Part 1

[0051] Parts A2 and B2

[0052] Parts A3 and B3

[0053] Part Four (A4, B4)

[0054] Parts A5 and B5

[0055] C11, C12, C21~C24, C31~C33 coil patterns

[0056] L1~L5 conductor layers

[0057] M Magnetic Body Detailed Implementation

[0058] Hereinafter, embodiments of the technology disclosed herein will be described in detail with reference to the accompanying drawings.

[0059] <First Implementation Method>

[0060] Figure 1 This is a general perspective view showing the appearance of the electronic component 100 according to the first embodiment of the technology disclosed herein. Furthermore, Figure 2 It is along Figure 1 The diagram shows a rough cross-section of line AA. Figure 3 It is along Figure 1 The diagram shows a rough cross-section of the BB line.

[0061] exist Figures 1-3 In the example shown, the electronic component 100 of the first embodiment includes a magnetic body portion M and a plurality of coil portions 111 to 118 embedded in the magnetic body portion M. The magnetic body portion M may be made of a composite magnetic material, which is formed by curing magnetic particles made of high permeability materials such as ferrite and permalloy using a resin adhesive. The magnetic body portion M has main surfaces 101 and 102 that form the XZ plane and are located opposite each other; side surfaces 103 and 104 that form the XY plane and are located opposite each other; and side surfaces 105 and 106 that form the YZ plane and are located opposite each other.

[0062] Coil sections 111 to 118 are arranged sequentially in the first direction, i.e., the X direction. In coil sections 111 to 118, terminal electrodes 121 forming one end are exposed from the main surface 101 of the magnetic body section M, and terminal electrodes 122 forming the other end are exposed from the main surface 102 of the magnetic body section M. Figure 1 In the manner shown, since the coil sections 111 to 118 have the same structure, the structure of the coil section 111 will be described below.

[0063] exist Figure 3In the example shown, the coil portion 111 has four conductor layers L1 to L4 stacked in the second direction, i.e., the Z direction. The conductor layers L1 to L4 can all be covered by an interlayer insulating film 130 to prevent them from contacting the magnetic body portion M. An interlayer insulating film 130 is also present between adjacent conductor layers L1 to L4 in the Z direction, thus these conductor layers L1 to L4 are stacked in the Z direction with the interlayer insulating film 130 in between. The conductor layers L1 to L4 are made of a good conductor such as copper (Cu). The interlayer insulating film 130 is made of resin or the like.

[0064] Conductor layer L1 is an end-side conductor layer located in the Z direction, and it is formed first during manufacturing. Figure 3 In the example shown, conductor layer L1 includes terminal patterns 141 and 142 and coil pattern C11. Terminal pattern 141 is a conductor pattern with its XZ end face exposed on the main surface 101 of the magnetic body portion M in the +Y direction, and its width in the X direction is W1. Terminal pattern 142 is a conductor pattern with its XZ end face exposed on the main surface 102 of the magnetic body portion M in the -Y direction, and its width in the X direction is W2. Widths W1 and W2 can be the same. Coil pattern C11 is a straight conductor pattern connecting terminal patterns 141 and 142, and its width W3 in the X direction is smaller than widths W1 and W2. The inductance and DC resistance of coil pattern C11 can be adjusted by its width W3. For example, reducing the width W3 increases the inductance, while increasing the width W3 decreases the DC resistance.

[0065] Conductor layer L2 is the second conductor layer, located starting from one end in the Z direction, and is formed after conductor layer L1 during manufacturing. Figure 3 In the example shown, conductor layer L2 includes terminal patterns 143 and 144 and coil pattern C12. The planar shapes of terminal patterns 143 and 144 and coil pattern C12, viewed from the Z direction, can be the same as the planar shapes of terminal patterns 141 and 142 and coil pattern C11 located in conductor layer L1. The XZ end face of terminal pattern 143 in the +Y direction is exposed on the main surface 101 of the magnetic body portion M, and the XZ end face of terminal pattern 144 in the -Y direction is exposed on the main surface 102 of the magnetic body portion M. Coil pattern C12 is a straight conductor pattern connecting terminal patterns 143 and 144.

[0066] Terminal patterns 141 and 143 are connected to each other via through-hole conductors 151 formed through the interlayer insulating film 130. Similarly, terminal patterns 142 and 144 are connected to each other via through-hole conductors 152 formed through the interlayer insulating film 130. Through-hole conductors 151 and 152 can be formed simultaneously with conductor layer L2, or they can be formed after conductor layer L1 and before conductor layer L2. In the former case, through-hole conductor 151 is integral with terminal pattern 143, and through-hole conductor 152 is integral with terminal pattern 144.

[0067] Conductor layer L3 is the third conductor layer, located from one end in the Z direction, and is formed after conductor layer L2 during manufacturing. Figure 3 In the example shown, conductor layer L3 includes terminal patterns 145 and 146. Terminal patterns 145 and 146 are provided independently within the plane of conductor layer L3 without being connected to other conductor patterns. That is, in conductor layer L3, there are no conductor patterns corresponding to coil patterns C11 and C12, only terminal patterns 145 and 146.

[0068] Terminal patterns 143 and 145 are connected to each other via through-hole conductors 153 formed through the interlayer insulating film 130. Similarly, terminal patterns 144 and 146 are connected to each other via through-hole conductors 154 formed through the interlayer insulating film 130. Through-hole conductors 153 and 154 can be formed simultaneously with conductor layer L3, or they can be formed after conductor layer L2 and before conductor layer L3. In the former case, through-hole conductor 153 is integral with terminal pattern 145, and through-hole conductor 154 is integral with terminal pattern 146.

[0069] Conductor layer L4 is a conductor layer located at the other end in the Z direction, and is formed after conductor layer L3 during manufacturing. Figure 3 In the example shown, conductor layer L4 includes terminal patterns 147 and 148. Terminal patterns 147 and 148 are provided independently within the surface of conductor layer L4 without being connected to other conductor patterns. That is, in conductor layer L4, there are no conductor patterns corresponding to coil patterns C11 and C12, only terminal patterns 147 and 148.

[0070] Terminal patterns 145 and 147 are connected to each other via through-hole conductors 155 formed through the interlayer insulating film 130. Similarly, terminal patterns 146 and 148 are connected to each other via through-hole conductors 156 formed through the interlayer insulating film 130. Through-hole conductors 155 and 156 can be formed simultaneously with conductor layer L4, or they can be formed after conductor layer L3 and before conductor layer L4. In the former case, through-hole conductor 155 is integral with terminal pattern 147, and through-hole conductor 156 is integral with terminal pattern 148.

[0071] Figure 4 (a) and (b) are approximate plan views illustrating the structure of terminal electrodes 121 and 122, respectively. Figure 4 In the examples shown in (a) and (b), the through-hole conductors 151 to 156 are integrated with the terminal patterns 143 to 148, respectively.

[0072] exist Figure 4 In the example shown in (a), the terminal electrode 121 is formed by a portion consisting of the XZ end faces of the terminal patterns 141, 143, 145, and 147 exposed from the main surface 101 of the magnetic body portion M, and a portion consisting of the XZ end faces of the through-hole conductors 151, 153, and 155 exposed from the main surface 101 of the magnetic body portion M. In the terminal electrode 121, the portions formed by the XZ end faces of the terminal patterns 141, 143, and 145 constitute the first portion A1, the second portion A2, and the fourth portion A4, respectively. In the terminal electrode 121, the portions formed by the XZ end faces of the through-hole conductors 151 and 153 constitute the third portion A3 and the fifth portion A5, respectively. The terminal electrode 121 having this structure is surrounded on the main surface 101 of the magnetic body portion M by an interlayer insulating film 130. The width W4 in the X direction of the through-hole conductors 151, 153, and 155 exposed from the main surface 101 of the magnetic body part M can be more than 3 / 4 of the width W1 in the X direction of the terminal patterns 141, 143, 145, and 147 exposed from the main surface 101 of the magnetic body part M. With this structure, the area of ​​the terminal electrode 121 can be sufficiently ensured.

[0073] The widths W1 of terminal patterns 141, 143, 145, and 147 do not need to be exactly the same; differences may exist between them. In this case, the widths W1 of terminal patterns 141, 143, 145, and 147 can be defined by an average value. Similarly, the widths W4 of through-hole conductors 151, 153, and 155 do not need to be exactly the same; differences may exist between them. In this case, the widths W4 of through-hole conductors 151, 153, and 155 can be defined by an average value. Differences may also exist in the Z-direction thickness of terminal patterns 141, 143, 145, and 147.

[0074] exist Figure 4 In the example shown in (b), the terminal electrode 122 is formed by a portion consisting of the XZ end faces of the terminal patterns 142, 144, 146, and 148 exposed from the main surface 102 of the magnetic body portion M, and a portion consisting of the XZ end faces of the through-hole conductors 152, 154, and 156 exposed from the main surface 102 of the magnetic body portion M. In the terminal electrode 122, the portions formed by the XZ end faces of the terminal patterns 142, 144, and 146 constitute the first portion B1, the second portion B2, and the fourth portion B4, respectively. In the terminal electrode 122, the portions formed by the XZ end faces of the through-hole conductors 152 and 154 constitute the third portion B3 and the fifth portion B5, respectively. The terminal electrode 122 having this structure is surrounded on the main surface 102 of the magnetic body portion M by an interlayer insulating film 130. The width W5 in the X direction of the through-hole conductors 152, 154, and 156 exposed from the main surface 102 of the magnetic body portion M can be more than 3 / 4 of the width W2 in the X direction of the terminal patterns 142, 144, 146, and 148 exposed from the main surface 102 of the magnetic body portion M. With this structure, the area of ​​the terminal electrode 122 can be sufficiently ensured. Widths W4 and W5 can be the same.

[0075] The widths W2 of terminal patterns 142, 144, 146, and 148 do not need to be exactly the same; differences may exist between them. In this case, the widths W2 of terminal patterns 142, 144, 146, and 148 can be defined by an average value. Similarly, the widths W5 of through-hole conductors 152, 154, and 156 do not need to be exactly the same; differences may exist between them. In this case, the widths W5 of through-hole conductors 152, 154, and 156 can be defined by an average value.

[0076] The surface of terminal electrode 121 may be on the same plane as the main surface 101 of magnetic body part M, or it may be recessed relative to the main surface 101 of magnetic body part M. Similarly, the surface of terminal electrode 122 may be on the same plane as the main surface 102 of magnetic body part M, or it may be recessed relative to the main surface 102 of magnetic body part M.

[0077] Figure 5 This is a general plan view illustrating the structure of a first modified example of the terminal electrode 121.

[0078] exist Figure 5 In the example shown, terminal patterns 141, 143, 145, 147 and through-hole conductors 151, 153, 155 are made of different conductive materials. As described above, such a structure is obtained by forming through-hole conductor 151 before forming terminal pattern 143, forming through-hole conductor 153 before forming terminal pattern 145, and forming through-hole conductor 155 before forming terminal pattern 147. According to this structure, the portions of terminal electrodes 121 formed by the exposed surfaces of terminal patterns 141, 143, 145, 147 and the portions formed by the exposed surfaces of through-hole conductors 151, 153, 155 can be given different characteristics.

[0079] Figure 6 This is a general plan view illustrating the structure of a second modified example of the terminal electrode 121.

[0080] exist Figure 6 In the example shown, the positions of the through-hole conductors 151 and 155 in the X direction are different from the position of the through-hole conductor 153 in the X direction. Figure 6 In the example shown, the positions of the through-hole conductors 151 and 155 in the X direction are offset from the center of the terminal electrode 121 in the +X direction, and the position of the through-hole conductor 153 in the X direction is offset from the center of the terminal electrode 121 in the -X direction. According to this structure, the adhesion between the terminal electrode 121 and the interlayer insulating film 130 can be improved while ensuring the exposed area of ​​the terminal electrode 121.

[0081] As explained above, the electronic component 100 of this embodiment constitutes a coil array with eight built-in coil sections 111 to 118. The arrangement spacing of the coil sections 111 to 118 in the X direction can be fixed, or it can be arranged as follows: Figure 1 and Figure 2 As shown, coil portions 111-114 and coil portions 115-118 are arranged in the X direction at a certain interval, and the interval between coil portions 114 and 115 in the X direction is wider than the interval between other coil portions. By widening the interval between coil portions 114 and 115 in the X direction, the coupling between coil portions 114 and 115 can be reduced.

[0082] Figure 7 This is a general cross-sectional view used to illustrate the structure of the component-integrated substrate 10 of the electronic component 100 in this embodiment.

[0083] Figure 7 The embedded substrate 10 shown includes: sequentially stacked insulating layers 11-15, a plurality of wiring patterns 20 formed on the surfaces of the insulating layers 11-15, and an electronic component 100 embedded in the insulating layer 13. The wiring patterns 20 include eight wiring patterns 21 located between the insulating layers 13 and 14, and eight wiring patterns 22 located between the insulating layers 12 and 13. The eight wiring patterns 21 are respectively disposed at positions overlapping with terminal electrodes 121 of the electronic component 100, and are respectively connected to the corresponding terminal electrodes 121 via substrate through-hole conductors 31. Similarly, the eight wiring patterns 22 are respectively disposed at positions overlapping with terminal electrodes 122 of the electronic component 100, and are respectively connected to the corresponding terminal electrodes 122 via substrate through-hole conductors 32.

[0084] Thus, the electronic component 100 of this embodiment is not mounted on the surface of a circuit board using solder or the like, but can be used by embedding it within the component-in-place substrate 10. When the electronic component 100 is used by embedding it within the component-in-place substrate 10, the end faces of the terminal patterns 141, 143, 145, and 147 exposed from the main surface 101 of the magnetic body portion M are directly used as terminal electrodes 121, and the end faces of the terminal patterns 142, 144, 146, and 148 exposed from the main surface 102 of the magnetic body portion M are directly used as terminal electrodes 122. Furthermore, in this embodiment, since not only the end faces of the conductor layers L1 and L2 with coil patterns C11 and C12 are exposed, but also the end faces of the conductor layers L3 and L4 without coil patterns are exposed, the area of ​​the terminal electrodes 121 and 122 can be sufficiently ensured.

[0085] Furthermore, since not only the end faces of terminal patterns 141, 143, 145, and 147 are exposed from the main surface 101 of the magnetic body portion M, but also the end faces of through-hole conductors 151, 153, and 155 are exposed from the main surface 101 of the magnetic body portion M, the terminal electrode 121 is not divided into multiple parts by the interlayer insulating film 130 on the main surface 101 of the magnetic body portion M. Similarly, since not only the end faces of terminal patterns 142, 144, 146, and 148 are exposed from the main surface 102 of the magnetic body portion M, but also the end faces of through-hole conductors 152, 154, and 156 are exposed from the main surface 102 of the magnetic body portion M, the terminal electrode 122 is not divided into multiple parts by the interlayer insulating film 130 on the main surface 102 of the magnetic body portion M.

[0086] Furthermore, since the terminal electrodes 121 and 122 are surrounded by the interlayer insulating film 130 on the main surfaces 101 and 102 of the magnetic body portion M, the insulation withstand voltage between adjacent terminal electrodes 121 in the X direction and between adjacent terminal electrodes 122 in the X direction can also be improved. Additionally, when the surface of the terminal electrode 121 is recessed relative to the main surface 101 of the magnetic body portion M, the connection reliability between the terminal electrode 121 and the substrate via conductor 31 can also be improved. Similarly, when the surface of the terminal electrode 122 is recessed relative to the main surface 102 of the magnetic body portion M, the connection reliability between the terminal electrode 122 and the substrate via conductor 32 can also be improved.

[0087] Figure 8 This is a general cross-sectional view used to illustrate a first modified example of the coil section 111, corresponding to the direction along... Figure 1 The cross-section of the BB line is shown.

[0088] Figure 8 The first modified example shown differs from the coil portion 111 described above in that a conductor layer L5 is added. Conductor layer L5 is a conductor layer located at the other end side in the Z direction, and is formed after conductor layer L4 during manufacturing. Figure 8 In the example shown, conductor layer L5 includes terminal patterns 149 and 140. Terminal patterns 149 and 140 are provided independently within the surface of conductor layer L5 without being connected to other conductor patterns. That is, in conductor layer L5, there are no conductor patterns corresponding to coil patterns C11 and C12, only terminal patterns 149 and 140.

[0089] Terminal patterns 147 and 149 are connected to each other via through-hole conductors 157 formed through the interlayer insulating film 130. Similarly, terminal patterns 148 and 140 are connected to each other via through-hole conductors 158 formed through the interlayer insulating film 130. Through-hole conductors 157 and 158 can be formed simultaneously with conductor layer L5, or they can be formed after conductor layer L4 and before conductor layer L5. In the former case, through-hole conductor 157 is integral with terminal pattern 149, and through-hole conductor 158 is integral with terminal pattern 140.

[0090] The XZ end faces of terminal pattern 149 and through-hole conductor 157 are exposed from the main surface 101 of magnetic body portion M, thereby forming part of terminal electrode 121. Similarly, the XZ end faces of terminal pattern 140 and through-hole conductor 158 are exposed from the main surface 102 of magnetic body portion M, thereby forming part of terminal electrode 122.

[0091] like Figure 8As shown in the first modified example, the number of conductor layers L3 to L5 without coil patterns can be greater than the number of conductor layers L1 and L2 with coil patterns. Based on this structure, the area of ​​terminal electrodes 121 and 122 can be further increased.

[0092] Figure 9 This is a general cross-sectional view used to illustrate a second modified example of the coil section 111, corresponding to the direction along... Figure 1 The cross-section of the BB line is shown.

[0093] Figure 9 The second variation shown differs from the coil portion 111 described above in that the conductor layer L3 includes a coil pattern C13. The coil pattern C13 is a straight conductor pattern connecting the terminal pattern 145 and the terminal pattern 146, and its planar shape may be the same as the planar shape of the coil pattern C11 located in the conductor layer L1 and the planar shape of the coil pattern C12 located in the conductor layer L2.

[0094] like Figure 9 As shown in the second variation, the number of conductor layers L4 without coil patterns can be less than the number of conductor layers L1 to L3 with coil patterns. According to this structure, the DC resistance of the coil sections 111 to 118 can be further reduced.

[0095] Figure 10 This is a general cross-sectional view used to illustrate a third modified example of the coil section 111, corresponding to the section along... Figure 1 The cross-section of the BB line is shown.

[0096] Figure 10 The third variation shown differs from the electronic component 100 described above in that the conductor layer L2 does not contain the coil pattern C12. That is, the terminal patterns 143 and 144 located in the conductor layer L2 are independently provided without being connected to other conductor patterns within the surface of the conductor layer L2. In other words, only the terminal patterns 143 and 144 exist in the conductor layer L2.

[0097] like Figure 10 As shown in the third variation, the conductor layer with the coil pattern can be only one layer, depending on the required characteristics.

[0098] Figure 11 This is a general cross-sectional view used to illustrate the fourth modified example of the coil section 111, corresponding to the section along... Figure 1 The cross-section of the BB line is shown.

[0099] Figure 11 The fourth variation shown is the same as Figure 7The difference in the second variation shown is that the conductor layer L1 does not contain the coil pattern C11. That is, the terminal patterns 141 and 142 located in the conductor layer L1 are independently provided without being connected to other conductor patterns within the surface of the conductor layer L1. In other words, only the terminal patterns 141 and 142 exist in the conductor layer L1.

[0100] exist Figure 11 In the example shown, the portion corresponding to coil pattern C11 is filled with interlayer insulating film 130. This is because, when the conductor layer L1 is formed first, depending on the manufacturing method, sometimes a certain component is needed to form the base of coil pattern C12. Figure 11 In the example shown, the interlayer insulating film 130 is used as the substrate for the coil pattern C12.

[0101] like Figure 11 As shown in the fourth variation, the conductor layers L1 and L4 at both ends in the Z direction do not form coil patterns. According to this structure, the coil pattern can be positioned more centrally in the Z direction of the magnetic body portion M.

[0102] Figure 12 This is a general cross-sectional view used to illustrate the fifth modified example of the coil section 111, corresponding to the section along... Figure 1 The cross-section of the BB line is shown.

[0103] Figure 12 The fifth variation shown is the same as Figure 11 The difference in the fourth variation shown is that the portion corresponding to the base of the coil pattern C12 is not composed of the interlayer insulating film 130 but rather of a magnetic body portion M. Such a structure can be obtained, for example, by pre-setting a dummy conductor pattern in the portion that forms the base of the coil pattern C12 and removing the dummy conductor pattern after forming the conductor layers L1 to L4. According to this structure, since the volume of the magnetic body portion M is increased, a larger... Figure 11 The fourth variation shown has a larger inductance.

[0104] Figure 13 This is a general cross-sectional view used to illustrate the sixth modified example of the coil section 111, corresponding to the direction along... Figure 1 The cross-section of the BB line is shown.

[0105] Figure 13 The sixth variation shown is the same as Figure 8The difference in the first modified example shown is that the terminal pattern 149 is omitted. That is, only the terminal pattern 140 exists in the conductor layer L5. As a result, the terminal electrode 121 exposed from the main surface 101 of the magnetic body portion M is composed of four layers of terminal patterns 141, 143, 145, 147 and three through-hole conductors 151, 153, 155 connecting them. In contrast, the terminal electrode 122 exposed from the main surface 102 of the magnetic body portion M is composed of five layers of terminal patterns 142, 144, 146, 148, 140 and four through-hole conductors 152, 154, 156, 158 connecting them. As a result, in the sixth modified example, the dimension of the terminal electrode 122 in the Z direction is larger than the dimension of the terminal electrode 121 in the Z direction.

[0106] like Figure 13 As shown in the sixth variation, the dimensions of terminal electrode 121 and terminal electrode 122 do not need to be the same; they can be designed to have different dimensions depending on the required characteristics.

[0107] <Second Implementation Method>

[0108] Figure 14 This is a general perspective view showing the appearance of the electronic component 200 according to the second embodiment of the technology disclosed herein. Furthermore, Figure 15 It is along Figure 14 The diagram shows a rough cross-section of line AA. Along... Figure 14 The cross section of the BB line shown is... Figure 3 same.

[0109] exist Figure 14 and Figure 15 In the example shown, the electronic component 200 of the second embodiment differs from the electronic component 100 of the first embodiment in that the coil patterns C11 and C12 included in coil sections 111-114 are offset in the -X direction, and the coil patterns C11 and C12 included in coil sections 115-118 are offset in the +X direction. The other basic structures are the same as those of the electronic component 100 of the first embodiment; therefore, the same symbols are used for the same elements, and repeated descriptions are omitted.

[0110] exist Figure 14 and Figure 15 In the example shown, the edge positions of the coil patterns C11 and C12 included in coil sections 111 to 114 in the -X direction coincide with the edge positions of the terminal patterns 141 to 148 in the -X direction. Conversely, the edge positions of the coil patterns C11 and C12 included in coil sections 115 to 118 in the +X direction coincide with the edge positions of the terminal patterns 141 to 148 in the +X direction.

[0111] As shown in the electronic component 200 of the second embodiment, the shapes of the coil portions 111 to 118 need not all be identical. Furthermore, according to the structure of the electronic component 200 of the second embodiment, the coupling between the coil portion 114 and the coil portion 115 can be further reduced.

[0112] <Third Implementation Method>

[0113] Figure 16 This is a general perspective view showing the appearance of the electronic component 300 according to the third embodiment of the technology disclosed herein. Furthermore, Figure 17 It is along Figure 16 The diagram shows a rough cross-section of the BB line.

[0114] exist Figure 16 and Figure 17 In the example shown, the electronic component 300 of the third embodiment differs from the electronic component 100 of the first embodiment in that the coil pattern C11 contained in the conductor layer L1 is replaced with the coil pattern C21, and the coil pattern C12 contained in the conductor layer L2 is replaced with the coil pattern C22. The other basic structures are the same as those of the electronic component 100 of the first embodiment; therefore, the same symbols are used to label the same elements, and repeated descriptions are omitted.

[0115] Figure 18 (a) to (d) are approximate plan views showing the shapes of the conductor patterns located in conductor layers L1 to L4 respectively in the third embodiment.

[0116] exist Figure 18 In the example shown in (a), conductor layer L1 includes terminal patterns 141, 142, and a coil pattern C21 connected at one end to terminal pattern 141. Terminal pattern 142 is disposed independently within the surface of conductor layer L1 without being connected to other conductor patterns. Coil pattern C21 is a loop-shaped conductor pattern wound with approximately 3 / 4 turns. Figure 18 In the example shown in (b), conductor layer L2 includes terminal patterns 143 and 144, and a coil pattern C22 connected at one end to terminal pattern 144. Terminal pattern 143 is disposed independently within the surface of conductor layer L2 without being connected to other conductor patterns. Coil pattern C22 is a loop-shaped conductor pattern wound with approximately 3 / 4 turns. The other end of coil pattern C22 is connected to the other end of coil pattern C21 via through-hole conductor 161. Thus, coil pattern C21 and coil pattern C22 are connected in series between terminal pattern 141 and terminal pattern 144.

[0117] The other basic structures are the same as those of the electronic component 100 in the first embodiment. Therefore, terminal pattern 143 is connected to terminal pattern 141 via through-hole conductor 151. Terminal pattern 144 is connected to terminal pattern 142 via through-hole conductor 152. Terminal pattern 145 is connected to terminal pattern 143 via through-hole conductor 153. Terminal pattern 146 is connected to terminal pattern 144 via through-hole conductor 154. Terminal pattern 147 is connected to terminal pattern 145 via through-hole conductor 155. Terminal pattern 148 is connected to terminal pattern 146 via through-hole conductor 156.

[0118] As shown in the electronic component 300 of the third embodiment, the coil pattern included in the coil section does not have to be linear; it can also be circular. Furthermore, in this embodiment, since the coil patterns C21 and C22 formed on the two conductor layers L1 and L2 are connected in series, a larger inductance can be obtained.

[0119] <Fourth Implementation Method>

[0120] Figure 19 This is a general perspective view showing the appearance of the electronic component 400 according to the fourth embodiment of the technology disclosed herein. Furthermore, Figure 20 It is along Figure 19 The diagram shows a rough cross-section of the BB line.

[0121] exist Figure 19 and Figure 20 In the example shown, the electronic component 400 of the fourth embodiment differs from the electronic component 300 of the third embodiment in that a coil pattern C23 is added to the conductor layer L3 and a coil pattern C24 is added to the conductor layer L4. The other basic structures are the same as those of the electronic component 300 of the third embodiment; therefore, the same symbols are used to label the same elements, and repeated descriptions are omitted.

[0122] Figure 21 (a) to (d) are approximate plan views showing the shapes of the conductor patterns located in conductor layers L1 to L4 respectively in the fourth embodiment.

[0123] exist Figure 21 In the example shown in (c), conductor layer L3 includes terminal patterns 145 and 146, and a coil pattern C23 connected at one end to terminal pattern 145. Terminal pattern 146 is disposed independently within the surface of conductor layer L3 without being connected to other conductor patterns. Coil pattern C23 is a loop-shaped conductor pattern wound with approximately 3 / 4 turns, and may have the same planar shape as coil pattern C21 located in conductor layer L1. Figure 21In the example shown in (d), conductor layer L4 includes terminal patterns 147 and 148, and a coil pattern C24 connected at one end to terminal pattern 148. Terminal pattern 147 is disposed independently within the surface of conductor layer L4 without being connected to other conductor patterns. Coil pattern C24 is a loop-shaped conductor pattern wound with approximately 3 / 4 turns, and may have the same planar shape as coil pattern C22 located in conductor layer L2. The other end of coil pattern C24 is connected to the other end of coil pattern C23 via through-hole conductor 162. Thus, coil pattern C23 and coil pattern C24 are connected in series between terminal patterns 145 and 148.

[0124] The other basic structures are the same as those of the electronic component 300 in the third embodiment. Therefore, the inductors formed by coil patterns C21 and C22 and the inductors formed by coil patterns C23 and C24 are connected in parallel between terminal electrodes 121 and 122. As a result, the series resistance can be further reduced compared to the electronic component 300 in the third embodiment.

[0125] <Fifth Implementation Method>

[0126] Figure 22 This is a general perspective view showing the appearance of the electronic component 500 according to the fifth embodiment of the technology disclosed herein. Furthermore, Figure 23 It is along Figure 22 The diagram shows a rough cross-section of the BB line.

[0127] exist Figure 22 and Figure 23 In the example shown, the electronic component 500 of the fifth embodiment differs from the electronic component 300 of the third embodiment in that the coil pattern C21 contained in the conductor layer L1 is replaced with the coil pattern C31, the coil pattern C22 contained in the conductor layer L2 is replaced with the coil pattern C32, and a coil pattern C33 is added to the conductor layer L3. The other basic structures are the same as those of the electronic component 300 of the third embodiment; therefore, the same symbols are used for the same elements, and repeated descriptions are omitted.

[0128] Figure 24 (a) to (d) are approximate plan views showing the shapes of the conductor patterns located in conductor layers L1 to L4 respectively in the fifth embodiment.

[0129] exist Figure 24 In the example shown in (a), conductor layer L1 includes terminal patterns 141, 142, and a coil pattern C31 with one end connected to terminal pattern 141. Terminal pattern 142 is disposed independently within the surface of conductor layer L1 without being connected to other conductor patterns. Coil pattern C21 is a loop-shaped conductor pattern wound with approximately one turn. Figure 24In the example shown in (b), conductor layer L2 includes terminal patterns 143, 144 and coil pattern C32. Terminal patterns 143, 144 and coil pattern C32 are all independently disposed within the surface of conductor layer L2 without being connected to other conductor patterns. Coil pattern C32 is a loop-shaped conductor pattern wound approximately one turn. The other end of coil pattern C32 is connected to the other end of coil pattern C31 via through-hole conductor 163. Figure 24 In the example shown in (c), conductor layer L3 includes terminal patterns 145 and 146, and a coil pattern C33 connected at one end to terminal pattern 146. Terminal pattern 145 is disposed independently within the surface of conductor layer L3 without being connected to other conductor patterns. Coil pattern C33 is a loop-shaped conductor pattern wound with approximately 1 / 2 turn. The other end of coil pattern C33 is connected to the other end of coil pattern C32 via through-hole conductor 164. Thus, coil patterns C31, C32, and C33 are connected in series between terminal patterns 141 and 146.

[0130] The other basic structures are the same as those of the electronic component 300 in the third embodiment. In this embodiment, since the inductors composed of coil patterns C31, C32, and C33 are connected in series between terminal electrodes 121 and 122, a larger inductance can be obtained compared to the electronic component 300 in the third embodiment.

[0131] The above describes the implementation of the technology disclosed herein. However, the technology disclosed herein is not limited to the above implementation. Various modifications can be made without departing from its spirit, and obviously these modifications are also included within the scope of the technology disclosed herein.

[0132] The technology disclosed herein includes the following structural examples, but is not limited thereto.

[0133] An electronic component according to one aspect of this disclosure includes: a magnetic body having a first main surface and a second main surface located opposite to the first main surface; and a plurality of coil portions embedded in the magnetic body, each having a first terminal electrode exposed on the first main surface and a second terminal electrode exposed on the second main surface. The plurality of coil portions are arranged in a first direction parallel to the first main surface. Each of the plurality of coil portions has a plurality of conductor layers, which include first and second conductor layers stacked in a second direction orthogonal to the first direction and parallel to the first main surface. The first conductor layer included in each of the plurality of coil portions includes: a first terminal pattern whose end face is exposed on the first main surface and forms a first portion of the first terminal electrode; a second terminal pattern whose end face is exposed on the second main surface and forms a first portion of the second terminal electrode; and a first coil pattern whose one end is connected to the first terminal pattern. The second conductor layer included in each of the plurality of coil portions includes: a third... The system comprises a terminal pattern, the end face of which is exposed on a first main surface and constitutes a second portion of a first terminal electrode; and a fourth terminal pattern, the end face of which is exposed on a second main surface and constitutes a second portion of a second terminal electrode. The first and third terminal patterns included in each of the plurality of coil portions are interconnected via a first through-hole conductor, which constitutes a third portion of the first terminal electrode and has its end face exposed on the first main surface. The second and fourth terminal patterns included in each of the plurality of coil portions are interconnected via a second through-hole conductor, which constitutes a third portion of the second terminal electrode and has its end face exposed on the second main surface. At least a portion of the first conductor layer and the second conductor layer included in each of the plurality of coil portions are covered by an insulating film. The first terminal electrodes included in each of the plurality of coil portions are surrounded on the first main surface by an interlayer insulating film, and the second terminal electrodes included in each of the plurality of coil portions are surrounded on the second main surface by an interlayer insulating film. According to this structure, electrodes (first and second terminal electrodes) of appropriate area can be formed. Specifically, for example, the first and second terminal electrodes can be formed in such a way that an appropriate area is exposed from the magnetic body portion.

[0134] In the aforementioned electronic component, each of the plurality of coil portions may have a first conductor layer and a second conductor layer stacked in a second direction with at least a portion separated by an interlayer insulating film. According to this structure, the first conductor layer and the second conductor layer can be connected via a through-hole conductor that penetrates the interlayer insulating film.

[0135] In the aforementioned electronic components, the third terminal pattern may be independently disposed within the surface of the second conductor layer without being connected to other conductor patterns. According to this structure, the third terminal pattern functions as an auxiliary pattern.

[0136] In the aforementioned electronic component, the fourth terminal pattern may be independently disposed within the surface of the second conductor layer without being connected to other conductor patterns. According to this structure, the fourth terminal pattern functions as an auxiliary pattern.

[0137] In the aforementioned electronic component, one end of the first coil pattern may be connected to the second terminal pattern. Based on this structure, the first coil pattern can, for example, be configured as a straight line.

[0138] In the aforementioned electronic component, the second conductor layer may consist only of a third terminal pattern and a fourth terminal pattern. According to this structure, the third and fourth terminal patterns function as auxiliary patterns.

[0139] In the aforementioned electronic component, the multiple conductor layers may further include a third conductor layer. Each of the multiple coil portions includes a third conductor layer comprising: a fifth terminal pattern, the end face of which is exposed on a first main surface and constitutes a fourth portion of the first terminal electrode; and a sixth terminal pattern, the end face of which is exposed on a second main surface and constitutes a fourth portion of the second terminal electrode. The third and fifth terminal patterns of each of the multiple coil portions are interconnected via a third through-hole conductor, which constitutes the fifth portion of the first terminal electrode and has its end face exposed on the first main surface. The fourth and sixth terminal patterns of each of the multiple coil portions are interconnected via a fourth through-hole conductor, which constitutes the fifth portion of the second terminal electrode and has its end face exposed on the second main surface. According to this structure, the area of ​​the first and second terminal electrodes can be further increased.

[0140] In the aforementioned electronic component, the third portion and the fifth portion of the first terminal electrode may be positioned differently in the first direction. This structure improves the adhesion between the first terminal electrode and the interlayer insulating film.

[0141] In the aforementioned electronic component, the second conductor layer may consist only of the third and fourth terminal patterns, and the third conductor layer may consist only of the fifth and sixth terminal patterns. According to this structure, the first coil pattern can be positioned closer to the center of the magnetic body portion.

[0142] In the aforementioned electronic components, the second terminal pattern may be independently disposed within the surface of the first conductor layer without being connected to other conductor patterns, and the third terminal pattern may be independently disposed within the surface of the second conductor layer without being connected to other conductor patterns. According to this structure, the first coil pattern can be, for example, configured as a ring.

[0143] In the aforementioned electronic component, each of the multiple coil sections may contain a second conductor layer that further includes a second coil pattern connected to a fourth terminal pattern, and the first coil patterns and second coil patterns of each of the multiple coil sections are connected in series. According to this structure, a larger inductance can be obtained.

[0144] In the aforementioned electronic component, the multiple conductor layers may further include a third conductor layer. Each of the multiple coil portions includes a third conductor layer comprising: a fifth terminal pattern, the end face of which is exposed on a first main surface and constitutes a fourth portion of a first terminal electrode; a sixth terminal pattern, the end face of which is exposed on a second main surface and constitutes a fourth portion of a second terminal electrode; and a third coil pattern. The third terminal patterns and fifth terminal patterns of each of the multiple coil portions are connected to each other via a third through-hole conductor, which constitutes a fifth portion of the first terminal electrode and has its end face exposed on the first main surface. The fourth terminal patterns and sixth terminal patterns of each of the multiple coil portions are connected to each other via a fourth through-hole conductor, which constitutes a fifth portion of the second terminal electrode and has its end face exposed on the second main surface. The second coil patterns and third coil patterns of each of the multiple coil portions are connected in series. According to this structure, a further increased inductance can be obtained.

[0145] In the aforementioned electronic component, the widths of the first terminal electrodes and the second terminal electrodes included in each of the multiple coil sections may differ in a second direction. According to this structure, required characteristics such as heat dissipation can be satisfied.

[0146] In the aforementioned electronic component, the width of the third portion of the first terminal electrode in the first direction may be at least 3 / 4 of the width of the first portion of the first terminal electrode in the first direction and the width of the second portion of the first terminal electrode in the first direction. This structure ensures sufficient area for the first terminal electrode.

[0147] In the aforementioned electronic component, the surface of the first terminal electrode included in each of the plurality of coil portions may be recessed compared to the first main surface. According to this structure, when embedded in a substrate within the component, the adhesion between the first terminal electrode and the through-hole conductor of the substrate can be improved.

[0148] One aspect of this disclosure is a component-embedded substrate in which the aforementioned electronic components are embedded, comprising: a plurality of first wiring patterns; a plurality of second wiring patterns; a plurality of first substrate through-hole conductors connecting the plurality of first wiring patterns to first terminal electrodes included in each of the plurality of coil portions; and a plurality of second substrate through-hole conductors connecting the plurality of second wiring patterns to second terminal electrodes included in each of the plurality of coil portions. According to this structure, the contact area between the first terminal electrodes and the first substrate through-hole conductors can be sufficiently ensured, and the contact area between the second terminal electrodes and the second substrate through-hole conductors can also be sufficiently ensured.

[0149] This application claims priority to Japanese Patent Application No. 2023-117669, filed on July 19, 2023, the entire disclosure of which is incorporated herein by reference.

Claims

1. An electronic component, wherein, have: A magnetic body portion having a first main surface and a second main surface located on the opposite side of the first main surface; and Multiple coil sections are embedded in the magnetic body section, each with its first terminal electrode exposed on the first main surface and its second terminal electrode exposed on the second main surface. The plurality of coil portions are arranged in a first direction parallel to the first main surface. Each of the plurality of coil portions has a plurality of conductor layers, the plurality of conductor layers comprising first and second conductor layers stacked in a second direction, the second direction being orthogonal to the first direction and parallel to the first main surface. Each of the plurality of coil portions includes the following first conductor layer: a first terminal pattern, the end face of which is exposed on the first main surface and forms a first portion of the first terminal electrode; a second terminal pattern, the end face of which is exposed on the second main surface and forms a first portion of the second terminal electrode; and a first coil pattern, one end of which is connected to the first terminal pattern. Each of the plurality of coil portions includes a second conductor layer comprising: a third terminal pattern, the end face of which is exposed on the first main surface and constitutes a second portion of the first terminal electrode; and a fourth terminal pattern, the end face of which is exposed on the second main surface and constitutes a second portion of the second terminal electrode. The first terminal pattern and the third terminal pattern included in each of the plurality of coil portions are connected to each other via a first through-hole conductor, the first through-hole conductor forming a third portion of the first terminal electrode and the end face being exposed on the first main surface. The second terminal pattern and the fourth terminal pattern included in each of the plurality of coil portions are connected to each other via a second through-hole conductor, the second through-hole conductor forming a third portion of the second terminal electrode and having its end face exposed on the second main surface. At least a portion of the first conductor layer and the second conductor layer of each of the plurality of coil portions are covered by an interlayer insulating film. The first terminal electrode included in each of the plurality of coil sections is surrounded by the interlayer insulating film on the first main surface. The second terminal electrode included in each of the plurality of coil sections is surrounded by the interlayer insulating film on the second main surface.

2. The electronic component according to claim 1, wherein, The first conductor layer and the second conductor layer included in each of the plurality of coil portions are stacked in the second direction in at least a portion separated by the interlayer insulating film.

3. The electronic component according to claim 1, wherein, The third terminal pattern is set independently within the surface of the second conductor layer without being connected to other conductor patterns.

4. The electronic component according to claim 3, wherein, The fourth terminal pattern is set independently within the surface of the second conductor layer without being connected to other conductor patterns.

5. The electronic component according to claim 1, wherein, The other end of the first coil pattern is connected to the second terminal pattern.

6. The electronic component according to claim 5, wherein, The second conductor layer consists only of the third terminal pattern and the fourth terminal pattern.

7. The electronic component according to claim 1, wherein, The plurality of conductor layers further include a third conductor layer. Each of the plurality of coil portions includes a third conductor layer comprising: a fifth terminal pattern, the end face of which is exposed on the first main surface and constitutes a fourth portion of the first terminal electrode; and a sixth terminal pattern, the end face of which is exposed on the second main surface and constitutes a fourth portion of the second terminal electrode. The third terminal pattern and the fifth terminal pattern included in each of the plurality of coil portions are connected to each other via a third through-hole conductor, the third through-hole conductor forming the fifth portion of the first terminal electrode and having its end face exposed on the first main surface. The fourth terminal pattern and the sixth terminal pattern included in each of the plurality of coil portions are connected to each other via a fourth through-hole conductor, the fourth through-hole conductor forming the fifth part of the second terminal electrode and the end face being exposed on the second main surface.

8. The electronic component according to claim 7, wherein, The third portion and the fifth portion of the first terminal electrode are located differently from each other in the first direction.

9. The electronic component according to claim 7, wherein, The second conductor layer consists only of the third terminal pattern and the fourth terminal pattern. The third conductor layer consists only of the fifth terminal pattern and the sixth terminal pattern.

10. The electronic component according to claim 1, wherein, The second terminal pattern is independently disposed within the surface of the first conductor layer without being connected to other conductor patterns. The third terminal pattern is set independently within the surface of the second conductor layer without being connected to other conductor patterns.

11. The electronic component according to claim 10, wherein, Each of the plurality of coil portions includes a second conductor layer that further includes a second coil pattern connected to the fourth terminal pattern. The first coil pattern contained in each of the plurality of coil sections and the second coil pattern contained in each of the plurality of coil sections are connected in series.

12. The electronic component according to claim 11, wherein, The plurality of conductor layers further include a third conductor layer. The third conductor layer included in each of the plurality of coil portions comprises: a fifth terminal pattern, the end face of which is exposed on the first main surface and constitutes a fourth portion of the first terminal electrode; a sixth terminal pattern, the end face of which is exposed on the second main surface and constitutes a fourth portion of the second terminal electrode; and a third coil pattern. The third terminal pattern and the fifth terminal pattern included in each of the plurality of coil portions are connected to each other via a third through-hole conductor, the third through-hole conductor forming the fifth portion of the first terminal electrode and having its end face exposed on the first main surface. The fourth terminal pattern and the sixth terminal pattern included in each of the plurality of coil portions are connected to each other via a fourth through-hole conductor, the fourth through-hole conductor forming the fifth part of the second terminal electrode and the end face being exposed on the second main surface. The second coil pattern contained in each of the plurality of coil sections and the third coil pattern contained in each of the plurality of coil sections are connected in series.

13. The electronic component according to claim 1, wherein, The widths of the first terminal electrode and the second terminal electrode included in each of the plurality of coil portions are different from each other in the second direction.

14. The electronic component according to claim 1, wherein, The width of the third portion of the first terminal electrode in the first direction is more than 3 / 4 of the width of the first portion of the first terminal electrode in the first direction and the width of the second portion of the first terminal electrode in the first direction.

15. The electronic component according to claim 1, wherein, The surface of the first terminal electrode included in each of the plurality of coil portions is recessed compared to the first main surface.

16. A component with a built-in substrate, wherein, The component has an electronic component embedded in its built-in substrate according to any one of claims 1 to 15, and the built-in substrate comprises: Multiple first wiring patterns; Multiple second wiring patterns; A plurality of first substrate through-hole conductors that connect the plurality of first wiring patterns to the first terminal electrodes included in each of the plurality of coil portions; and A plurality of second substrate through-hole conductors that connect the plurality of second wiring patterns to the second terminal electrodes included in each of the plurality of coil portions.

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