A five-axis dispensing device for complex curved surface operations

Abstract

This invention relates to the field of five-axis dispensing technology and discloses a five-axis dispensing device for complex curved surface operations. The device includes an upper frame with a protective frame on its upper end. A control panel is damped and connected to the outer wall of the protective frame. The heating surface of a thermoelectric cooler is attached to the outer wall of the glue reservoir, thus enabling heating of the glue inside the reservoir. The cooling surface of the thermoelectric cooler is located inside the mounting frame. When a small negative pressure fan is activated, the airflow near the fan fluctuates, effectively driving the movement of the cold air generated by the cooling surface. This cold air is then discharged through an exhaust pipe and an exhaust frame. The exhaust frame surrounds the outer wall of the dispensing needle. Since the dispensing needle also discharges the glue and comes into contact with the product, the exhaust frame discharges the gas, forming multiple streams of cooling gas on the outer wall of the dispensing needle. This causes airflow around the product and the glue, thereby accelerating the curing of the glue.

Description

Technical Field

[0001] This invention relates to the field of five-axis dispensing technology, specifically to a five-axis dispensing device for complex curved surface operations. Background Technology

[0002] The five-axis dispensing equipment adds two rotary axes to the traditional three-axis system, enabling five degrees of freedom control of the dispensing head in space. It can flexibly adjust the angle and posture of the dispensing head to meet the dispensing needs of various complex curved surfaces, providing an effective solution for high-quality dispensing of complex curved surface products.

[0003] A search revealed a dual-platform five-axis dispensing device published under publication number CN120205392A. The device is described as an invention in the field of dispensing equipment technology, comprising a four-sided dispensing movement adjustment mechanism and a filling dispensing movement adjustment mechanism arranged in parallel along the X-axis direction.

[0004] In existing technologies, adhesives are generally placed in an adhesive box for use, and dispensing is controlled by a dispensing valve. However, the viscosity of the adhesive is not constant, and fluctuations in ambient temperature have a significant impact on the adhesive. Increased temperature may reduce the viscosity of the adhesive, resulting in a larger amount of adhesive dispensed; conversely, decreased temperature will increase the viscosity and reduce the amount of adhesive dispensed. This causes the actual amount of adhesive dispensed to gradually deviate from the preset value, resulting in inconsistent adhesive amounts on the product. This leads to a series of problems such as weak adhesion, reduced sealing performance, and appearance defects. Therefore, those skilled in the art provide a five-axis dispensing device for complex curved surface operations to solve the problems mentioned in the background art. Summary of the Invention

[0005] The purpose of this invention is to provide a five-axis dispensing device for complex curved surface operations, thereby solving the problems mentioned in the background art.

[0006] The present invention provides the following technical solution: a five-axis dispensing device for complex curved surface operations, including an upper frame, a protective frame provided on the upper end face of the upper frame, a control panel connected to the outer side wall of the protective frame with damping, a multi-axis moving mechanism for driving the product to perform three-axis motion provided at the center of the upper end face of the upper frame, and a temperature control mechanism for ensuring that the glue temperature is kept constant inside the protective frame.

[0007] The temperature control mechanism includes a semiconductor refrigeration chip, and a mounting bracket and an air hood are connected to one side of the refrigeration surface of the semiconductor refrigeration chip. A small negative pressure fan is installed inside the air hood.

[0008] As a preferred embodiment of the above technical solution, it further includes a dual-axis moving unit and a glue spraying mechanism disposed inside the protective frame; the dual-axis moving unit includes an X-axis moving mechanism and a Z-axis moving mechanism arranged in sequence, and the sliding end of the Z-axis moving mechanism is connected to a limit plate; the glue spraying mechanism includes a glue spraying valve mounted on the limit plate and a glue dispensing needle communicating with it.

[0009] As a preferred embodiment of the above technical solution, the outer wall of the limiting plate is provided with an industrial camera for photographing and positioning the workpiece and a light source for assisting the field of view of the industrial camera.

[0010] As a preferred embodiment of the above technical solution, the glue spraying mechanism further includes a glue storage tube connected to the glue spraying valve, and a limiting clamp for clamping and fixing the glue storage tube, and the bottom end of the glue spraying valve is provided with a bottom chamber for supporting the glue storage tube.

[0011] As a preferred embodiment of the above technical solution, the heating surface of the semiconductor cooling chip is in contact with the outer wall of the glue storage tube, and the small negative pressure fan is connected to an exhaust frame that is ring-shaped on the outer wall of the glue dispensing needle through an exhaust pipe.

[0012] As a preferred embodiment of the above technical solution, the exhaust frame is rotatably connected to the bottom chamber of the glue spraying mechanism via a fixed bracket. Electromagnets and magnets are correspondingly provided on the exhaust frame and the bottom chamber. The exhaust frame is driven to swing relative to the glue dispensing needle by controlling the current direction of the electromagnet.

[0013] As a preferred embodiment of the above technical solution, it further includes a weighing and cleaning mechanism disposed on the upper frame. The weighing and cleaning mechanism includes a precision weighing platform and a weighing cup placed thereon for weighing and calibrating the dispensing amount; it also includes a cleaning chamber for storing a solvent sponge for cleaning the dispensing needle.

[0014] As a preferred embodiment of the above technical solution, the weighing cup is provided with a protective ring and a cover plate on the outside, and the cover plate has a hole in the center for glue to fall in.

[0015] As a preferred embodiment of the above technical solution, a damping spring is also connected between the exhaust frame and the bottom chamber to provide a restoring force when the electromagnet and the magnet repel each other.

[0016] As a preferred embodiment of the above technical solution, the switching between the heating and cooling surfaces is changed by controlling the current direction of the semiconductor cooling chip, and this is used to cool or heat the glue inside the glue storage tube.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. This invention incorporates a temperature control mechanism. Depending on the composition of the adhesive used, heating or constant-temperature treatment of the adhesive is required. The user can activate the semiconductor cooling chip, whose heating surface is in contact with the outer wall of the adhesive storage tube, thus heating the adhesive inside the tube. The cooling surface of the semiconductor cooling chip is located inside the mounting bracket. Simultaneously, a small negative pressure fan is activated. As the airflow near the small negative pressure fan fluctuates, it effectively drives the movement of the cold air generated by the cooling surface, which is then discharged through the exhaust pipe and exhaust frame. The exhaust frame surrounds the outer wall of the dispensing needle. Since the dispensing needle also dispenses adhesive and comes into contact with the product, multiple streams of cooling gas are formed on the outer wall of the dispensing needle after the exhaust frame discharges the gas, causing airflow around the product and the adhesive, thereby accelerating the curing of the adhesive.

[0019] 2. This invention incorporates a weighing and cleaning mechanism. After the dispensing needle has been used for a period of time (e.g., after performing the dispensing action fifty to one hundred times), it can be moved above the weighing and cleaning mechanism by a dual-axis moving unit and perform a standard dispensing action, dispensing a certain amount of glue into the weighing cup. The precise weighing platform measures the weight of this dispensing in real time and uploads the data to the control panel. The control panel compares the measured weight with the preset target weight range. If the measured weight exceeds the allowable tolerance range, the control panel immediately issues an alarm signal (system prompt) and can selectively pause the dispensing process, awaiting operator intervention. As the amount of glue inside the glue reservoir decreases, it is necessary to change its internal temperature. Due to the change in glue weight, the temperature of the remaining glue will rise. The weighing and cleaning mechanism can effectively control the temperature of the weighing and cleaning mechanism. After each glue weighing is completed, the control panel can control the current entering the semiconductor cooling chip, thereby controlling the temperature of the heating surface of the semiconductor cooling chip.

[0020] 3. This invention incorporates a temperature control mechanism. After the dispensing needle has been used for a period of time, some colloid will remain on its surface. At this point, the temperature difference between the hot and cold ends can be achieved by changing the direction of the current entering the semiconductor cooling chip. The gas discharged from the exhaust frame is hot gas. Then, the direction of the current entering the electromagnet is changed to achieve a change in magnetic poles. The electromagnet will then generate a repulsive force on the magnet. Due to the influence of the repulsive force, the exhaust frame will tilt, and at least one outlet of the exhaust frame will face the dispensing needle. The discharged hot gas will soften the colloid on the outer wall of the dispensing needle. The dual-axis moving unit controls the dispensing mechanism to move above the wiping chamber and inserts the dispensing needle into the wiping chamber. Since the wiping chamber contains a solvent sponge that can absorb colloid, the solvent sponge can effectively remove the softened colloid under the influence of friction when it comes into contact with the dispensing needle. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a five-axis dispensing device for complex curved surface operations;

[0022] Figure 2 A schematic diagram of a five-axis dispensing device for complex curved surface operations with the protective frame removed.

[0023] Figure 3 This is a schematic diagram of the upper frame of a five-axis dispensing device used for complex curved surface operations;

[0024] Figure 4 This is a schematic diagram of the upper frame of a five-axis dispensing device used for complex curved surface operations;

[0025] Figure 5 This is a schematic diagram of the structure of a dual-axis moving unit in a five-axis dispensing device for complex curved surface operations;

[0026] Figure 6 This is a schematic diagram of the weighing and cleaning mechanism in a five-axis dispensing device used for complex curved surface operations;

[0027] Figure 7 This is a schematic diagram showing the disassembled structure of a precision weighing platform and weighing cup in a five-axis dispensing device for complex curved surface operations.

[0028] Figure 8 This is a schematic diagram of the connection between the Z-axis movement mechanism and the glue spraying mechanism in a five-axis dispensing device for complex curved surface operations.

[0029] Figure 9 This is a schematic diagram of the temperature control mechanism in a five-axis dispensing device used for complex curved surface operations;

[0030] Figure 10 This is a schematic diagram of the local temperature control mechanism in a five-axis dispensing device used for complex curved surface operations;

[0031] Figure 11 This is a schematic diagram of the dispensing needle in a five-axis dispensing device used for complex curved surface operations;

[0032] Legend:

[0033] 1. Mounting rack; 2. Protective frame; 3. Control panel;

[0034] 4. Dual-axis moving unit; 41. Support leg; 42. X-axis moving mechanism; 43. Z-axis moving mechanism; 431. Limiting plate; 44. Industrial camera; 45. Light source;

[0035] 5. Glue spraying mechanism; 51. Mounting plate; 52. Base compartment; 53. Glue storage pipe; 531. Limit clamp; 54. Glue dispensing needle; 55. Glue spraying valve;

[0036] 6. Temperature control mechanism; 61. Semiconductor cooling chip; 62. Mounting bracket; 63. Air hood; 64. Exhaust pipe; 65. Small negative pressure fan; 66. Exhaust rack; 661. Fixed bracket; 662. Positioning bracket; 67. Fixing plate; 68. Electromagnet; 69. Magnet;

[0037] 7. Weighing and cleaning mechanism; 71. Support frame; 72. Precision weighing platform; 73. L-shaped bracket; 74. Glue wiping bin; 75. Weighing cup; 76. Protective ring; 77. Cover plate;

[0038] 8. Multi-axis moving mechanism. Detailed Implementation

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0040] Please see Figure 1 - Figure 11 As shown, the present invention provides a technical solution: a five-axis dispensing device for complex curved surface operations, including an upper frame 1, a protective frame 2 is provided on the upper end face of the upper frame 1, a control panel 3 is connected to the outer side wall of the protective frame 2 with damping, a multi-axis moving mechanism 8 for driving the product to perform three-axis motion is provided at the center of the upper end face of the upper frame 1, a glue spraying mechanism 5 for discharging glue is provided inside the protective frame 2, and a temperature control mechanism 6 for ensuring that the glue temperature is kept at a constant temperature is provided inside the protective frame 2;

[0041] The temperature control mechanism 6 includes a semiconductor cooling chip 61. A mounting bracket 62 is provided on the outer wall of the semiconductor cooling chip 61. An air shroud 63 is provided at the center of the side of the mounting bracket 62 away from the semiconductor cooling chip 61. The cooling surface of the semiconductor cooling chip 61 is located inside the mounting bracket 62.

[0042] It should be noted that the dual-axis moving unit 4 can drive the glue spraying mechanism 5 to perform dual-axis movement, and cooperate with the multi-axis moving mechanism 8 to form a five-axis linkage, which further expands the flexibility and freedom of glue dispensing, easily handles glue dispensing tasks on various complex curved surfaces, effectively reduces glue dispensing dead angles, and the temperature control mechanism 6 can ensure that the glue temperature is within a reasonable range, avoid the influence of temperature fluctuations on glue performance, ensure stable glue viscosity, make the glue dispensing quality uniform and consistent, and improve the reliability and stability of product glue dispensing.

[0043] As one implementation method in this embodiment, please refer to Figure 3 , Figure 5 and Figure 8As shown, the protective frame 2 is equipped with a dual-axis moving unit 4 that drives the glue spraying mechanism 5 to perform dual-axis movement. The dual-axis moving unit 4 includes two support legs 41 symmetrically arranged on the upper end face of the upper frame 1. The upper end face of the two support legs 41 is jointly provided with an X-axis moving mechanism 42. The sliding end of the X-axis moving mechanism 42 is provided with a Z-axis moving mechanism 43. The sliding end of the Z-axis moving mechanism 43 is provided with a limit plate 431. The outer wall of the limit plate 431 is provided with an industrial camera 44 for photographing and positioning the workpiece. The outer wall of the limit plate 431 is located below the industrial camera 44 and is provided with a light source 45 to assist the field of view of the industrial camera 44.

[0044] It should be noted that the Z-axis moving mechanism 43 is set on the upper surface of the two support legs 41. Its sliding end can drive the subsequent components to move precisely along the Z-axis direction, realize the vertical position adjustment, meet the dispensing needs of workpieces of different heights, and expand the working range of the equipment. The limiting plate 431 is fixed on the sliding end of the Z-axis moving mechanism 43, which plays the role of precise positioning and stable connection. The industrial camera 44 is fixed on the outer wall of the limiting plate 431, which can take pictures and position the workpiece, quickly obtain information such as the position and shape of the workpiece, provide data support for precise dispensing, and greatly improve the accuracy of dispensing. The light source 45 is located below the industrial camera 44 and fixed on the outer wall of the limiting plate 431, which can help the industrial camera 44 obtain a clearer field of view. Even in poor lighting conditions, it can ensure the camera shooting effect and further improve the positioning accuracy.

[0045] As one implementation method in this embodiment, please refer to Figure 3 - Figure 8 As shown, the glue spraying mechanism 5 includes a mounting plate 51 located on the outer wall of the limiting plate 431 on one side of the industrial camera 44. A glue spraying valve 55 is provided on the side of the mounting plate 51 away from the limiting plate 431. A bottom chamber 52 is provided at the bottom end of the glue spraying valve 55. A glue dispensing needle 54 is provided at the glue dispensing end of the glue spraying valve 55 to dispense glue. A glue storage tube 53 for storing glue is threadedly connected to the top end of the bottom chamber 52 on one side of the glue spraying valve 55. A limiting clamp 531 for stabilizing the position of the glue storage tube 53 is provided on the side of the glue spraying valve 55 near the glue storage tube 53. The limiting clamp 531 is clamped on the curved surface of the outer wall of the glue storage tube 53.

[0046] It should be noted that the mounting plate 51 is fixed to the side of the industrial camera 44 on the outer wall of the limiting plate 431, providing a stable mounting base for the entire glue spraying mechanism 5, ensuring structural stability during operation, and reducing the impact of shaking on dispensing accuracy. The glue spraying valve 55 is fixed to the side of the mounting plate 51 away from the limiting plate 431. It is the core control component for glue discharge, which can accurately control the glue flow rate and discharge timing, ensuring uniform glue amount each time and improving dispensing quality. The glue storage tube 53 is threaded to the top of the glue spraying valve 55 on the bottom tank 52. On one side, glue can be conveniently stored, and the threaded connection makes it easy to disassemble and replace, allowing for quick glue replenishment and improving work efficiency. The limiting clamp 531 is fixed on the side of the glue spray valve 55 near the glue storage tube 53 and clamps the curved surface of the outer wall of the glue storage tube 53, which can stabilize the position of the glue storage tube 53 and prevent it from shaking or shifting during operation, ensuring a stable glue supply. The glue dispensing needle 54 is connected to the glue discharge end of the glue spray valve 55, which can accurately discharge the glue. In conjunction with other mechanisms, it can easily handle the dispensing of glue on complex curved surfaces and improve the product qualification rate.

[0047] As one implementation method in this embodiment, please refer to Figure 9 - Figure 11 As shown, the thermoelectric cooler 61 is set on the outer curved surface of the limiting clamp 531 via two positioning clamps. The heating surface of the thermoelectric cooler 61 abuts against the outer wall of the glue storage tube 53. A small negative pressure fan 65 is installed inside the gas cover 63. An exhaust pipe 64 is installed at the exhaust end of the gas cover 63. A U-shaped exhaust frame 66 is installed on the outer wall of the glue dispensing needle 54. The end of the exhaust pipe 64 away from the gas cover 63 is connected to the air inlet end of the exhaust frame 66. The multiple exhaust ports of the exhaust frame 66 are aligned with the glue dispensing end of the glue dispensing needle 54. Multiple air holes (not shown in the figure) can be opened on the outer wall of the gas cover 63 and are connected to the interior of the gas cover 63. When the small negative pressure fan 65 is working, it can effectively introduce the gas outside the gas cover 63 into its interior, thereby driving the gas around the thermoelectric cooler 61.

[0048] It should be noted that the thermoelectric cooler 61 is fixed to the outer curved surface of the positioning clamp and the limiting clamp 531. Its heating surface is in contact with the outer wall of the glue storage tube 53, which can precisely control the temperature of the glue inside the glue storage tube 53. When the ambient temperature is low, the heating surface can heat up the glue in time to prevent the glue from thickening or solidifying due to low temperature, ensuring good glue flow, smooth dispensing, and avoiding problems such as glue breakage. The cooling surface of the thermoelectric cooler 61 is located inside the mounting bracket 62. With the help of the small negative pressure fan 65 in the air cover 63, the cold energy generated by the cooling surface can be quickly dissipated to maintain the stable working state of the thermoelectric cooler 61 and improve the temperature control efficiency. Simultaneously, the direction of the current entering the thermoelectric cooler 61 can be changed to achieve temperature difference conversion between the hot and cold ends. This operation can effectively reduce the temperature inside the glue storage tube 53 when the temperature is too high. Furthermore, the heating end of the thermoelectric cooler 61 can also work with the small negative pressure fan 65 to expel heat, and the expelled heat blows onto the outer wall of the glue dispensing needle 54, heating the glue dispensing needle 54 and thus softening the adhesive. The multiple exhaust ports of the exhaust frame 66 are aligned with the glue dispensing end of the glue dispensing needle 54. During dispensing, the airflow can assist in cooling the glue, further stabilizing the glue temperature and improving the curing effect.

[0049] As one implementation method in this embodiment, please refer to Figure 9 - Figure 11 As shown, two positioning frames 662 are symmetrically arranged on the upper end face of the exhaust frame 66 at the positions of the two extension arms. Each positioning frame 662 has a fixed bracket 661 rotatably sleeved on its outer wall. The two fixed brackets 661 are positioned on the lower end face of the bottom chamber 52. Both the exhaust frame 66 and the outer wall of the bottom chamber 52 are equipped with fixing plates 67. An electromagnet 68 and a magnet 69 are respectively arranged on the side of the two fixing plates 67 that are close to each other. The electromagnet 68 is located above the magnet 69, and the electromagnet 68 and magnet 69 are magnetically connected. Two damping springs are symmetrically rotatably connected on the side of the two fixing plates 67 that are close to each other. When the electromagnet 68 and magnet 69 are attracted, the damping springs are in a normal state. When the electromagnet 68 repels the magnet 69, the damping springs are in a stretched state. (The damping springs are not labeled in the figure, but...) Figure 11 Its location can be seen from the image.

[0050] It should be noted that the two positioning frames 662 are symmetrically fixed at the position of the upper end extension arm, and the outer wall is rotatably sleeved with the fixed bracket 661. The fixed bracket 661 is fixed to the lower end face of the bottom chamber 52. This structure allows the exhaust frame 66 to rotate flexibly and adjust the angle according to the actual operation requirements, accurately control the airflow direction, better assist the dispensing needle 54 in dispensing glue, and improve the dispensing accuracy. Electromagnets 68 and magnets 69 are respectively set on the fixed plate 67 on the outer wall of the exhaust frame 66 and the bottom chamber 52. The two are magnetically connected, which can quickly achieve a stable connection and convenient separation between the exhaust frame 66 and the bottom chamber 52, thereby achieving the purpose of adjusting the angle of the exhaust frame 66.

[0051] When electromagnet 68 and magnet 69 are attracted, the damping spring is in normal condition, which plays a role in stabilizing the structure and reducing shaking during equipment operation. When electromagnet 68 repels magnet 69 and the damping spring is stretched, and exhaust frame 66 needs to be reset, electromagnet 68 no longer repels magnet 69, and the damping spring drives exhaust frame 66 to reset. At this time, electromagnet 68 re-attracts magnet 69. This operation can effectively control the angle and reset status of exhaust frame 66.

[0052] As one implementation method in this embodiment, please refer to Figure 3 - Figure 7 As shown, a weighing and cleaning mechanism 7 for weighing glue is provided on the upper end face of the upper frame 1, located on one side of the multi-axis moving mechanism 8. The weighing and cleaning mechanism 7 includes a support frame 71 provided on the upper end face of the upper frame 1. The support frame 71 is located on one side of the multi-axis moving mechanism 8. A precision weighing platform 72 is provided on the upper end face of the support frame 71. A weighing cup 75 for storing glue is placed at the position of the weighing sensor corresponding to the precision weighing platform 72. A protective ring 76 is provided on the outer wall of the weighing cup 75 on the upper end face of the precision weighing platform 72. A cover plate 77 is provided on the top top of the protective ring 76. A hole is opened at the center of the top top of the cover plate 77 to facilitate the glue to enter the weighing cup 75. An L-shaped bracket 73 is provided on the outer wall of the support frame 71. A glue-wiping chamber 74 for storing solvent sponge is provided on the upper end face of the L-shaped bracket 73. The solvent sponge can remove the glue on the surface of the glue dispensing needle 54.

[0053] It should be noted that the weighing and cleaning mechanism 7 can weigh the glue, accurately control the amount of glue used, and at the same time, promptly remove any adhered glue to prevent glue residue from affecting subsequent equipment operation and product quality. The precision weighing platform 72 is located on the upper surface of the support frame 71, and together with the weighing sensor and weighing cup 75, it can accurately measure the weight of the glue. If the measured weight exceeds the allowable tolerance range, the control panel 3 will automatically alarm, indicating that the glue dispensing needle 54 is unusable. Furthermore, the data will be uploaded to the control panel 3 after each weighing. The system records the data when the glue is weighed again and compares it with the previous data. If the difference between the two exceeds the tolerance, an alarm will still be triggered. The L-shaped bracket 73 is fixed to the outer wall of the support frame 71. The glue-wiping chamber 74 on its upper surface is used to store the solvent sponge. Before the weighing operation, the solvent sponge can quickly remove the glue from the surface of the glue dispensing needle 54 to prevent the glue from solidifying and clogging the needle. After the glue is removed, there will be no glue on the surface of the glue dispensing needle 54. Therefore, the weighing data is accurate and can effectively ensure that the data uploaded to the control panel 3 is accurate.

[0054] Working Principle: During the operation of the five-axis dispensing equipment, the adhesive needs to be heated or kept at a constant temperature due to different adhesive compositions. The user activates the semiconductor cooling chip 61, whose heating surface is in contact with the outer wall of the adhesive storage tube 53, directly heating the adhesive inside the tube. Simultaneously, the cooling surface of the semiconductor cooling chip 61 is located inside the mounting bracket 62, and the small negative pressure fan 65 is activated at the same time. Due to the vents on the outer wall of the air hood 63 (not shown in the figure), gas enters the air hood 63 through the vents driven by the small negative pressure fan 65. Inside, the airflow fluctuations cause the cold air generated by the cooling surface to move and be discharged through the exhaust pipe 64 and the exhaust frame 66. Since the exhaust frame 66 surrounds the outer wall of the dispensing needle 54, the discharged gas forms multiple downward cooling gases on the outer wall of the dispensing needle 54. After the dispensing needle 54 discharges the glue, the cooling gas follows closely behind, which can accelerate the airflow around the product and the glue, thereby accelerating the curing of the glue. This operation can flexibly adjust the temperature according to different glues to ensure that the glue is working in the best condition, improve the dispensing quality, and adapt to the needs of complex curved surface operations.

[0055] After a period of use, adhesive residue will remain on the surface of the dispensing needle 54. Changing the direction of the current entering the semiconductor cooling chip 61 achieves temperature conversion between the hot and cold ends. At this time, the gas discharged from the exhaust frame 66 becomes hot gas. Changing the direction of the current entering the electromagnet 68 causes the electromagnet 68's magnetic poles to change, generating a repulsive force on the magnet 69. The exhaust frame 66, in coordination with the rotation of the fixed bracket 661 and the positioning frame 662, will make a small-range arc-shaped movement as it descends. Simultaneously, the damping spring will be stretched during this arc-shaped movement. At least one outlet will face the dispensing needle 54. The discharged hot gas softens the adhesive on the outer wall of the dispensing needle 54. The dual-axis movement unit 4 controls the dispensing mechanism. 5. Move the nozzle 54 above the glue dispensing tank 74 and insert the dispensing needle 54 into the glue dispensing tank 74. The internal solvent sponge absorbs the glue and removes the softened glue under the action of friction. This process can clean the glue on the surface of the dispensing needle 54 in time, prevent blockage, ensure smooth dispensing, extend the service life of the equipment, and improve the stability and reliability of dispensing operations on complex curved surfaces. When it is necessary to reset the exhaust frame 66, disconnect the current entering the electromagnet 68. Then, under the action of the damping spring, the exhaust frame 66 can be reset. Then, the magnetic poles of the electromagnet 68 are adjusted and reset so that the electromagnet 68 can generate attraction force on the magnet 69 again. This operation can ensure the stability of the exhaust frame 66 during operation.

[0056] After the adhesive on the surface of the dispensing needle 54 is removed, and the dispensing needle 54 has been used for a period of time (such as after performing the dispensing action fifty to one hundred times), the dual-axis moving unit 4 moves it above the weighing and cleaning mechanism 7 to perform a standard dispensing action, dispensing a certain amount of adhesive into the weighing cup 75. The precision weighing platform 72 measures the dispensing weight in real time, and the data is uploaded to the control panel 3. The control panel 3 compares the measured weight with the preset target weight range. If the measured weight exceeds the allowable tolerance range, an alarm signal is immediately issued, and the dispensing process can be paused for operator intervention. Before weighing the adhesive dispensed by the dispensing needle 54 each time, it is necessary to ensure that the frequency of use is the same each time. Only when the frequency is the same can the adhesive be weighed. As the amount of adhesive in the glue storage tube 53 decreases, the temperature of the remaining adhesive rises. The weighing and cleaning mechanism 7 can effectively control the temperature. After each weighing of the adhesive, the control panel 3 controls the current entering the semiconductor cooling chip 61 to adjust its heating surface temperature, ensuring the adhesive temperature is stable, improving dispensing accuracy, and reducing quality problems caused by adhesive temperature changes.

[0057] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it.

Claims

1. A five-axis dispensing device for complex curved surface operations, comprising an upper frame (1), characterized in that: The upper end face of the upper frame (1) is provided with a protective frame (2) and a glue spraying mechanism (5) inside the protective frame (2). The outer side wall of the protective frame (2) is connected to a control panel (3). The center of the upper end face of the upper frame (1) is provided with a multi-axis moving mechanism (8) for driving the product to perform three-axis motion. The inside of the protective frame (2) is provided with a temperature control mechanism (6) to ensure that the glue temperature is kept constant. It also includes a dual-axis moving unit (4) disposed inside the protective frame (2). The dual-axis moving unit (4) includes an X-axis moving mechanism (42) and a Z-axis moving mechanism (43) disposed in sequence. The sliding end of the Z-axis moving mechanism (43) is connected to a limit plate (431). The glue spraying mechanism (5) includes a glue spraying valve (55) installed on the limiting plate (431) and a glue dispensing needle (54) connected thereto. The glue spraying mechanism (5) also includes a glue storage tube (53) connected to the glue spraying valve (55) and a limiting clamp (531) for clamping and fixing the glue storage tube (53). The bottom end of the glue spraying valve (55) is provided with a bottom chamber (52) for supporting the glue storage tube (53). The temperature control mechanism (6) includes a semiconductor cooling chip (61). A mounting bracket (62) and an air hood (63) are connected to the cooling side of the semiconductor cooling chip (61). A small negative pressure fan (65) is provided inside the air hood (63). The heating side of the semiconductor cooling chip (61) is in contact with the outer wall of the glue storage tube (53). The small negative pressure fan (65) is connected to an exhaust frame (66) that is ringed on the outer wall of the glue dispensing needle (54) through an exhaust pipe (64). The exhaust frame (66) is rotatably connected to the bottom chamber (52) of the glue spraying mechanism (5) through a fixed bracket (661). An electromagnet (68) and a magnet (69) are correspondingly provided on the exhaust frame (66) and the bottom chamber (52). The exhaust frame (66) is driven to swing relative to the glue dispensing needle (54) by controlling the current direction of the electromagnet (68).

2. The five-axis dispensing equipment for complex curved surface operations according to claim 1, characterized in that: The outer wall of the limiting plate (431) is provided with an industrial camera (44) for photographing and positioning the workpiece and a light source (45) for assisting the field of view of the industrial camera (44).

3. A five-axis dispensing device for complex curved surface operations according to claim 2, characterized in that: It also includes a weighing and cleaning mechanism (7) set on the upper frame (1), the weighing and cleaning mechanism (7) includes a precision weighing platform (72) and a weighing cup (75) placed thereon, for weighing and calibrating the amount of glue dispensing; it also includes a glue wiping bin (74) for storing a solvent sponge for cleaning the glue dispensing needle (54).

4. A five-axis dispensing device for complex curved surface operations according to claim 3, characterized in that: The weighing cup (75) is provided with a protective ring (76) and a cover plate (77) on the outside. The cover plate (77) has a hole in the center for glue to fall in.

5. A five-axis dispensing device for complex curved surface operations according to claim 1, characterized in that: A damping spring is also connected between the exhaust frame (66) and the bottom chamber (52) to provide a restoring force when the electromagnet (68) and the magnet (69) repel each other.

6. A five-axis dispensing device for complex curved surface operations according to claim 1, characterized in that: The switching between the heating and cooling surfaces is changed by controlling the current direction of the semiconductor cooling chip (61), and is used to cool or heat the glue inside the glue storage tube (53).

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