Exhaust pipe group of semiconductor drying chamber
By using an aluminum alloy tube body with a built-in thin-film heating element and an external heat insulation plate in the semiconductor drying chamber exhaust pipe assembly, combined with a telescopic kit, the problems of blockage caused by high-temperature exhaust gas crystallization and thermal expansion and contraction are solved, thereby improving the stability and durability of the exhaust pipe assembly.
Patent Information
- Application Number
- CN202411108366.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2026-02-17
AI Technical Summary
The exhaust pipe assembly of the semiconductor drying chamber is prone to crystallization blockage and structural damage due to thermal expansion and contraction during the high-temperature exhaust process.
The exhaust horizontal pipe design features an aluminum alloy tube body with an internal thin-film heating element and an external heat insulation plate. Combined with a telescopic kit, it buffers thermal expansion and contraction, maintains temperature, and provides expansion margin.
It effectively avoids pipe blockage caused by cooling crystallization and reduces structural damage caused by thermal expansion and contraction, thus improving the durability and reliability of the exhaust pipe assembly.
Smart Images

Figure CN121534901A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an improved technology for the exhaust pipe assembly structure of a drying chamber required for the drying process of a semiconductor after it has been coated with epoxy resin (photoresist). Background Technology
[0002] In semiconductor manufacturing, there is a surface treatment process, such as coating with a specific coating. After coating, a drying process is required. This process involves sending the semiconductor into a semiconductor drying chamber equipped with heating equipment for hot air drying. An exhaust pipe assembly is installed outside the semiconductor drying chamber for ventilation. Figure 1 As shown, an exhaust pipe assembly 10 is provided on one side of the semiconductor drying chamber 1. The exhaust pipe assembly 10 mainly consists of an exhaust vertical pipe 14 with an upper and lower connector 15 that connects to an upper exhaust horizontal pipe 12 and a lower exhaust horizontal pipe 13 respectively. Multiple bent connectors 11 are provided on the upper and lower exhaust horizontal pipes 12 and 13. The bent connectors 11 are connected to the outside side of the semiconductor drying chamber 1 and communicate with the inside of the semiconductor drying chamber 1. The end of the exhaust vertical pipe 14 is connected to the exhaust fan 2.
[0003] However, since the exhaust gas extracted from the exhaust pipe assembly 10 is hot gas with a certain temperature, the temperature of the exhaust gas gradually decreases when it enters the exhaust horizontal pipes 12 and 13 through the curved connector 11, often resulting in crystallization. These crystals accumulate inside the pipes, and over time, this can cause blockages and poor exhaust performance. Furthermore, the exhaust pipe assembly 10 is typically made of metal, which expands and contracts with temperature changes. Prolonged operation may lead to metal fatigue or excessive heating, causing structural damage, leaks, or other adverse effects, thus necessitating improvement. Summary of the Invention
[0004] The main objective of this invention is to provide a buffer structure for the exhaust pipe assembly of a semiconductor drying chamber, which aims to solve the problems of crystallization blockage caused by cooling in the aforementioned conventional semiconductor drying chamber exhaust pipe assembly, and structural damage that may occur due to continuous thermal expansion and contraction caused by its rigid structure.
[0005] This invention provides an exhaust pipe assembly for a semiconductor drying chamber, installed outside the semiconductor drying chamber, comprising an exhaust vertical pipe combined with multiple sets of exhaust horizontal pipes, characterized in that it includes:
[0006] Multiple air duct groups are connected to the outside side of the semiconductor drying chamber and are in communication with the inside of the semiconductor drying chamber. The outside of each air duct group is covered with a heating cloth.
[0007] The aforementioned exhaust horizontal pipes are connected to the aforementioned air guide pipe group to form an internal connection. The main body of each exhaust horizontal pipe is an aluminum alloy tube with a built-in thin film heating element, and the outside is covered with a heat insulation plate.
[0008] It also includes a plurality of pipe telescopic components, which are respectively connected to the tail end of each exhaust horizontal pipe. Each pipe telescopic component has a fixed base and a bushing. A convex shaft extends from one side of the fixed base. The open end of the bushing fits onto the outside of the shaft to form a slidable combination. The other end of the bushing is connected to the exhaust horizontal pipe.
[0009] This structural design allows the exhaust pipe assembly to maintain a certain temperature, preventing cooling and crystallization blockage. When hot exhaust gas is extracted from the semiconductor drying chamber, the exhaust horizontal and vertical pipes have a margin of expansion and contraction due to thermal expansion, thus avoiding structural damage. Attached Figure Description
[0010] Figure 1 A schematic diagram showing the configuration of the exhaust pipe assembly for a conventional semiconductor drying chamber.
[0011] Figure 2 This is a schematic diagram showing the configuration of the exhaust pipe assembly structure for the semiconductor drying chamber of the present invention.
[0012] Figure 3 This is a schematic cross-sectional view of the air duct assembly of the present invention.
[0013] Figure 4 This is a schematic diagram of the cross-sectional structure of the exhaust horizontal pipe of the present invention.
[0014] Figure 5 , Figure 6 This is a schematic diagram of the structure of the telescopic kit at the tail end of the exhaust horizontal pipe of the present invention.
[0015] Explanation of reference numerals in the attached drawings: 1 Semiconductor drying chamber; 2 Exhaust equipment; 10 Exhaust pipe assembly; 11 Bent pipe; 12 Upper exhaust horizontal pipe; 13 Lower exhaust horizontal pipe; 14 Exhaust vertical pipe; 15 Connector; 20 Exhaust horizontal pipe; 21 Thin film heating element; 22 Heat insulation plate; 30 Telescopic kit; 31 Fixing base; 32 Shaft column; 33 Shaft sleeve; 40 Air guide pipe assembly; 41 Heating cloth bag. Detailed Implementation
[0016] like Figures 2-4 As shown, the present invention provides an exhaust pipe assembly for a semiconductor drying chamber, which mainly includes several air guide pipe assemblies 40 arranged on the side of the semiconductor drying chamber. Each air guide pipe assembly 40 is covered with a heating cloth 41 and is respectively connected to an exhaust horizontal pipe 20 to form an internally connected state. Each exhaust horizontal pipe 20 is made of aluminum alloy as the main body, with a thin film heating element 21 built in, and is covered with a heat insulation plate 22 on the outside. The tail end of each exhaust horizontal pipe 20 is connected to a telescopic kit 30.
[0017] Please refer to the following: Figures 5-6As shown, the telescopic assembly 30 is connected to the tail end of the exhaust horizontal pipe 20. It has a fixed base 31 and a bushing 33. A convex shaft post 32 extends from one side of the fixed base 31. The open end of the bushing 33 fits onto the outside of the shaft post 32, forming a slidable assembly. The other end of the bushing is connected to the exhaust horizontal pipe 20. Therefore, when the exhaust horizontal pipe 20 expands due to heat, it will grow slightly, causing the bushing 33 to move towards the fixed base 31 (e.g., ...). Figure 5 As shown); and when the temperature decreases, it moves in the opposite direction (as shown). Figure 6 As shown in the figure, the exhaust horizontal pipe 20 of the present invention can avoid damage to its structure due to repeated thermal expansion and contraction.
[0018] In summary, the present invention employs a temperature-maintaining structural design to prevent the extracted exhaust gas from crystallizing due to cooling as it passes through the air guide pipe assembly 40 and the exhaust horizontal pipe 20, thus overcoming the adverse effects of pipe blockage. Furthermore, the use of a buffer structure design effectively reduces the likelihood of structural damage to the exhaust pipe assembly under repeated thermal expansion and contraction. The above description only illustrates preferred embodiments of the present invention, but the present invention is not limited to these embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and all such equivalent modifications or substitutions are included within the scope of protection of the present invention.
Claims
1. A semiconductor drying chamber exhaust pipe set installed outside a semiconductor drying chamber, comprising an exhaust vertical pipe combined with a plurality of exhaust horizontal pipe sets, characterized in that, It comprises: A plurality of air duct groups are connected to one side of the exterior of the semiconductor drying chamber and are in communication with the interior of the semiconductor drying chamber, and the exterior of each air duct group is covered with a heating cloth. The aforementioned exhaust horizontal pipes are connected to the aforementioned air duct groups to form internal communication, the main body of each exhaust horizontal pipe is an aluminum alloy pipe, and a thin film heating sheet is built in, and the exterior is further covered with a heat insulation plate.
2. The semiconductor dry chamber exhaust pipe set according to claim 1, wherein: It comprises a plurality of pipe extension and retraction sets, each of which is connected to the tail end of each exhaust horizontal pipe, each pipe extension and retraction set has a fixed seat and a shaft sleeve, one side of the fixed seat extends a convex shaft column, the open end of the shaft sleeve is sleeved outside the shaft column to form a slidable combined state, and the other end of the shaft sleeve is connected to the exhaust horizontal pipe.