Laser forming system and forming method for special-shaped circuit board

Abstract

The invention discloses a laser forming system and method for a special-shaped circuit board, and relates to the field of laser cutting, the laser forming system comprises a forming workbench, a mold cooling device and a trimming and polishing device are arranged on the forming workbench, the mold cooling device comprises a pressing mold, and the pressing mold is used for pressing the circuit board on the forming workbench; the appearance shape and the appearance size of the downward pressing mold are matched with those of a standard special-shaped circuit board, the trimming and polishing device comprises a gantry conveying assembly and a trimming and polishing assembly installed on the gantry conveying assembly, and the trimming and polishing assembly comprises a laser cutting head and a polishing grinding shaft. Firstly, a laser cutting head is used for trimming a circuit board through a track of a downward pressing die, a polishing allowance is formed between the track of the laser cutting head and the downward pressing die, then the polishing allowance is removed through a polishing grinding shaft, and a method of laser cutting allowance remaining and polishing grinding shaft precision processing is adopted, so that the obtained special-shaped circuit board is flat and smooth in edge and high in yield. And the high-precision assembly requirement is met.

Description

Technical Field

[0001] This invention relates to the field of laser cutting, specifically to a laser forming system and method for irregularly shaped circuit boards. Background Technology

[0002] With the rapid development of electronic information technology, irregularly shaped circuit boards are increasingly widely used in high-end manufacturing fields such as consumer electronics, automotive electronics, and aerospace due to their high space utilization and strong adaptability. The complex and diverse shapes of irregularly shaped circuit boards typically require customized design based on the assembly space of the final product, which places extremely high demands on the precision, efficiency, and stability of their molding and processing.

[0003] Currently, the forming and processing of irregularly shaped circuit boards mainly relies on a combination of traditional mechanical cutting and manual polishing, or laser cutting technology alone. Traditional mechanical cutting uses a cutting tool to directly shape the circuit board. However, since circuit boards are mostly made of a combination of composite fiber substrate and copper foil, mechanical cutting tools are prone to burrs and delamination during the cutting process. Furthermore, the tools wear out quickly and require frequent replacement, affecting processing accuracy and leading to low production efficiency. Secondly, the mechanical cutting tool applies significant force to the circuit board during cutting, easily causing cracks. Simultaneously, the edges of mechanically cut circuit boards often lack smoothness, requiring subsequent manual polishing. Manual operation is not only labor-intensive but also makes it difficult to ensure consistent polishing, easily resulting in over-polishing or under-polishing, severely impacting product quality stability.

[0004] While laser cutting technology enables non-contact processing and reduces mechanical stress damage to circuit boards, the high-energy focusing of the laser during the cutting process generates instantaneous temperatures of hundreds to thousands of degrees Celsius in the cutting area. This can cause scorching and carbonization at the edges of the circuit board, especially for thicker or multi-layered irregularly shaped circuit boards, where the effects of high temperatures are more pronounced, directly reducing the electrical performance and mechanical strength of the circuit board. Furthermore, the edges after laser cutting still retain micro-slag and roughness, failing to meet the edge smoothness requirements of high-precision assembly. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a laser forming system and method for irregularly shaped circuit boards to solve the deficiencies of the prior art.

[0006] The objective of this invention is achieved through the following technical solution: a laser forming system for irregularly shaped circuit boards, comprising a forming worktable, wherein a mold cooling device and an edge-cutting and polishing device are provided on the forming worktable. The mold cooling device includes a pressing mold, which is used to press the circuit board onto the forming worktable. The shape and dimensions of the pressing mold match those of a standard irregularly shaped circuit board. The pressing mold has a cooling cavity inside, which is filled with coolant or cooling gas to form a low-temperature zone of -20℃ to 25℃ around the contact area with the circuit board. The edge-cutting and polishing device includes a gantry conveyor assembly and an edge-cutting and polishing assembly mounted on the gantry conveyor assembly. The edge-cutting and polishing assembly includes a mounting base, an edge-cutting plate, and a polishing plate. Both the edge-cutting plate and the polishing plate are fixed on the mounting base. A laser cutting head is mounted on the edge-cutting plate, and a polishing grinding shaft is rotatably mounted on the polishing plate. First, the laser cutting head cuts the circuit board along the trajectory of the pressing mold, and a polishing allowance is formed between the trajectory of the laser cutting head and the pressing mold. Then, the polishing allowance is removed by the polishing grinding shaft to obtain the desired irregularly shaped circuit board.

[0007] Furthermore, the polishing plate includes a fixed plate and a sliding plate. The fixed plate is fixedly connected to the mounting base. An installation opening is formed through the fixed plate along its thickness direction. The sliding plate is disposed within the installation opening. A sliding groove is formed on the side wall of the installation opening. The sliding groove extends horizontally. A slider is slidably disposed within the sliding groove. The slider is fixedly connected to the sliding plate. The polishing shaft is rotatably mounted on the bottom of the sliding plate via a bearing. A polishing motor is mounted on the top of the sliding plate. The output shaft of the polishing motor is drively connected to the polishing shaft.

[0008] Furthermore, a push cylinder is horizontally mounted on the fixed plate, and the telescopic shaft of the push cylinder passes through the mounting port and is connected to a spring, which is connected to a sliding plate.

[0009] Furthermore, the mold cooling device also includes two sets of switching connection components arranged opposite to each other. The pressing mold is located between the two sets of switching connection components. The switching connection component includes a lifting cylinder, a horizontal cylinder, and a plug-in block. The cylinder body of the lifting cylinder is vertically mounted on the forming worktable, and the telescopic shaft of the lifting cylinder is connected to a lifting seat. The cylinder body of the horizontal cylinder is horizontally mounted on the lifting seat, and the telescopic shaft of the horizontal cylinder is connected to the plug-in block. The side wall of the pressing mold has plug-in slots at the positions corresponding to the two sets of switching connection components. The plug-in block is adapted to the plug-in slot. A connecting block slides through the top of the plug-in block. A connecting groove is formed on the inner top wall of the plug-in slot. When the plug-in block is adapted to the plug-in slot, the connecting block is adapted to the connecting groove. The two sets of switching connection components alternately connect the pressing mold.

[0010] Furthermore, the top of the plug-in block is provided with an installation groove, an electromagnet is installed in the installation groove, one end of the connecting block is inserted into the installation groove and connected to a permanent magnet, the electromagnet generates a magnetic pole with opposite magnetic properties to the permanent magnet when energized, a switching spring is provided in the installation groove, the two ends of the switching spring are respectively connected to the plug-in block and the connecting block, the top surface of the connecting block near the lower die is provided with a wedge-shaped surface, when the connecting block is fitted into the connecting groove, the switching spring is in a compressed state.

[0011] Furthermore, the forming worktable has an inner cavity, and an adjustable support mechanism is provided inside the inner cavity. The adjustable support mechanism includes a mounting plate and support columns. The mounting plate is fixedly connected to the forming worktable, and a plurality of support columns are slidably passed through the mounting plate. The support columns are vertically arranged, and the top of the support columns moves out through the top surface of the forming worktable. The support columns located within the cutting edge trajectory move upward to support the circuit board, so that the circuit board is in a suspended state, and the support columns located outside the cutting edge trajectory are below the circuit board, so as to avoid the cutting edge polishing device.

[0012] Furthermore, the adjustable support mechanism also includes a lifting push plate and a push plate cylinder. The push plate cylinder is vertically installed in the inner cavity. The telescopic shaft of the push plate cylinder is connected to the lifting push plate. The lifting push plate is located below the support column. The support column is located on the moving path of the lifting push plate. The support column includes a primary lifting column and a secondary lifting column. The primary lifting column slides through the mounting plate. A support spring is sleeved on the primary lifting column. The two ends of the support spring are respectively connected to the mounting plate and the primary lifting column. The bottom of the primary lifting column has a small-diameter hole and a large-diameter hole along its own axial direction. A counterweight is slidably arranged in the large-diameter hole. One end of the secondary lifting column is fixedly connected to the counterweight, and the other end moves out through the small-diameter hole. A docking block is slidably arranged on the side wall of the secondary lifting column. The docking block has the freedom to move radially along the secondary lifting column. A docking hole is opened on the side wall of the small-diameter hole. When the docking block is fitted into the docking hole, the primary lifting column is connected to the secondary lifting column. When the docking block and the docking hole are separated, the secondary lifting column can slide within the primary lifting column.

[0013] Furthermore, the gantry conveyor assembly includes lifting columns and lifting beams. Both ends of the bottom of the lifting beam are connected to lifting columns. The lifting columns have the freedom to move along the length of the forming worktable. The mounting base is slidably mounted on the lifting beam and has the freedom to move along the width of the forming worktable.

[0014] Furthermore, a linear drive module is installed below the lifting support column, and the lifting support column is vertically mounted on the slide of the linear drive module. The lifting support column includes a fixed support column and a sliding support column. The top of the fixed support column is slidably fitted with a sliding support column. A support column lifting cylinder is vertically installed on the side wall of the fixed support column. The telescopic shaft of the support column lifting cylinder is connected to the sliding support column. A lead screw groove is opened at the bottom of the lifting beam. A lead screw is rotatably installed in the lead screw groove. A lead screw nut is threaded onto the lead screw. The mounting base is connected to the lead screw nut. A lead screw motor is installed at one end of the lifting beam. The output shaft of the lead screw motor is connected to the lead screw.

[0015] A laser forming method for irregularly shaped circuit boards, utilizing the aforementioned laser forming system for irregularly shaped circuit boards, includes the following steps:

[0016] S1. First, replace the pressing die with a matching one according to the irregular cut edge shape of the circuit board;

[0017] S2. Place the circuit board fixture on the forming worktable and use the pressing mold to limit the pressing position;

[0018] S3. The laser cutting head uses the pressing mold as a reference to cut the edge of the circuit board, so that the cutting trajectory shape of the laser cutting head corresponds to the outer trajectory shape of the pressing mold, and a polishing allowance is formed between the cutting trajectory of the laser cutting head and the outer trajectory of the pressing mold.

[0019] S4. Polish the sides of the circuit board using a polishing grinding shaft. The amount of polishing is equal to the polishing allowance, thus obtaining a standard irregular-shaped circuit board.

[0020] The beneficial effects of this invention are:

[0021] 1. A combined process of "laser cutting with allowance + polishing and grinding" is adopted. The laser cutting head cuts along the trajectory of the pressure mold and leaves a polishing allowance, which is then precisely removed by the polishing and grinding shaft. This method avoids the edge slag and roughness problems of laser cutting alone, and solves the defects of burrs, delamination, and cracks in traditional mechanical cutting. The final irregularly shaped circuit board has smooth and clean edges, and the dimensional accuracy and design deviation can be controlled within a very small range to meet the requirements of high-precision assembly.

[0022] 2. The cooling chamber inside the pressure die is filled with coolant or cooling gas to create a low-temperature environment in the contact area of ​​the circuit board. This design can absorb the heat generated during laser cutting in real time, avoiding scorching and carbonization of the cutting area due to high temperatures. It significantly reduces thermal damage to the edges of the circuit board, ensuring the electrical performance and mechanical strength of irregularly shaped circuit boards. It is especially suitable for processing high-precision circuit boards with large thickness or multi-layer structures.

[0023] 3. The pressing die provides stable downward pressure and limit to the circuit board, and combined with the upward support of the support columns within the cutting trajectory, ensures that the circuit board remains in a stable suspended state throughout the cutting and polishing process, avoiding displacement and deformation problems caused by traditional clamping or adsorption methods. Simultaneously, the non-contact nature of laser cutting and the flexible pressure of the polishing shaft (achieved through spring buffering) significantly reduce the mechanical stress on the circuit board, effectively minimizing the risk of cracking.

[0024] 4. The adjustable support mechanism features a graded design with primary and secondary lifting columns. Combined with the clutch control of the docking block and docking hole, this allows for precise control of the support columns within the cutting trajectory to rise and support the circuit board, while those outside the trajectory lower to avoid the cutting and polishing device. This design adapts to the support needs of any irregular shape, avoids interference between the support structure and the cutting and polishing processes, and improves the equipment's adaptability to complex irregular circuit boards. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a laser forming system for irregularly shaped circuit boards according to the present invention. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of the structure of a laser forming system for irregularly shaped circuit boards according to the present invention. Figure 2 ;

[0027] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0028] Figure 4 This is a schematic diagram of the internal structure of the pressure mold in a laser forming system for irregularly shaped circuit boards according to the present invention.

[0029] Figure 5 This is a schematic diagram of the internal structure of the connector block in a laser forming system for irregularly shaped circuit boards according to the present invention.

[0030] Figure 6 This is a partial structural schematic diagram of a laser forming system for irregularly shaped circuit boards according to the present invention;

[0031] Figure 7 This is a schematic diagram of the internal structure of the support column in a laser forming system for an irregularly shaped circuit board according to the present invention.

[0032] Figure 8 for Figure 7 Enlarged view at point B in the middle;

[0033] Figure 9 This is a schematic diagram of the structure of a laser forming system for irregularly shaped circuit boards according to the present invention. Figure 3 ;

[0034] In the diagram, 1-forming worktable, 2-pressing mold, 3-cooling cavity, 4-mounting base, 5-edge cutting plate, 6-polishing plate, 7-laser cutting head, 8-polishing grinding shaft, 9-fixed plate, 10-sliding plate, 11-mounting port, 12-slide groove, 13-slider, 14-polishing motor, 15-push cylinder, 16-spring, 17-lifting cylinder, 18-horizontal cylinder, 19-plug block, 20-plug groove, 21-connecting block, 22-connecting groove, 23-mounting groove, 24-electromagnet, 25-permanent magnet, 26-switching spring, 27-wedge surface, 28-inner cavity, 29-mounting plate, 30-support column, 31-push plate cylinder, 32-first stage lift 33-Secondary lifting column, 34-Small diameter hole, 35-Large diameter hole, 36-Counterweight, 37-Connecting block, 38-Connecting hole, 39-Support spring, 40-Lifting support column, 41-Lifting crossbeam, 42-Linear drive module, 43-Fixed support column, 44-Sliding support column, 45-Support column lifting cylinder, 46-Screw groove, 47-Screw, 48-Screw motor, 49-Lifting push plate, 50-Control drive cavity, 51-Ring electromagnet, 52-Axial drive rod, 53-Fixed base plate, 54-Radial groove, 55-Drive inclined plane, 56-Drive permanent magnet, 57-Axial return spring, 58-Pull wire, 59-Guide pulley, 60-Lifting seat. Detailed Implementation

[0035] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0036] Example 1

[0037] like Figures 1 to 9As shown, a laser forming system for irregularly shaped circuit boards includes a forming worktable 1. The forming worktable 1 is equipped with a mold cooling device and an edge-cutting and polishing device. The mold cooling device includes a pressing mold 2, which is used to press the circuit board onto the forming worktable 1. The shape and dimensions of the pressing mold 2 match those of a standard irregularly shaped circuit board. The pressing mold 2 has a cooling cavity 3 inside, filled with coolant or cooling gas, to create a low-temperature zone around the contact area with the circuit board. The edge-cutting and polishing device includes a gantry conveyor assembly and a component mounted on the gantry conveyor. The edge-cutting and polishing assembly includes a mounting base 4, an edge-cutting plate 5, and a polishing plate 6. Both the edge-cutting plate 5 and the polishing plate 6 are fixed on the mounting base 4. A laser cutting head 7 is mounted on the edge-cutting plate 5, and a polishing grinding shaft 8 is rotatably mounted on the polishing plate 6. First, the laser cutting head 7 cuts the circuit board along the trajectory of the pressing mold 2, and a polishing allowance is formed between the trajectory of the laser cutting head 7 and the pressing mold 2. Then, the polishing allowance is removed by the polishing grinding shaft 8 to obtain the desired irregular-shaped circuit board. The circuit board to be cut is placed on the forming worktable 1, and then pressed down... Mold 2 presses the circuit board firmly onto the forming worktable 1, preventing the circuit board from shifting during trimming and polishing. The pressing position of the lower mold 2 is located in the middle area of ​​the circuit board, leaving sufficient length for trimming as the circuit board is positioned on the outer side of the lower mold 2. Since the lower mold 2 matches the standard dimensions of the irregularly shaped circuit board, and the pressing position of the lower mold 2 on the circuit board remains unchanged, only the position of the circuit board needs to be adjusted during loading to ensure it covers the lower mold 2. Therefore, the position coordinates of the lower mold 2 are known, and its external dimensions can be used to determine its position. The laser cutting head 7 is designed with coordinate system dimensions to plan the cutting path. This path is based on the external dimensions of the pressing mold 2, with an added polishing allowance. After the laser cutting head 7 completes the edge trimming of the circuit board, a polishing allowance is formed between the side of the circuit board and the pressing mold 2. This allowance is then removed by the polishing grinding shaft 8. This avoids the edge slag and roughness problems associated with single laser cutting and solves the burr, delamination, and crack defects of traditional mechanical cutting. The resulting irregularly shaped circuit board has smooth and clean edges, and its dimensional accuracy and design deviation can be controlled within a very small range, meeting high-precision assembly requirements. In practice, the pressing mold 2 is connected to a nitrogen cylinder via an inlet pipe and to a nitrogen collection bottle via an exhaust pipe. Both the inlet and exhaust pipes are connected to the cooling chamber 3, and both are equipped with electromagnetic valves. Before the laser cutting head 7 trims the circuit board, low-temperature nitrogen is introduced into the cooling chamber 3 through the nitrogen cylinder, creating a low-temperature environment in the contact area of ​​the circuit board. This design can absorb the heat generated during laser cutting in real time, avoiding scorching and carbonization of the cutting area due to high temperature, improving the laser cutting effect, significantly reducing thermal damage to the circuit board edge, and ensuring the electrical performance and mechanical strength of irregularly shaped circuit boards. It is especially suitable for processing high-precision circuit boards with large thickness or multi-layer structure.

[0038] Furthermore, such as Figure 1 , Figure 2 and Figure 9 As shown, the gantry conveyor assembly includes a lifting column 40 and a lifting beam 41. Both ends of the bottom of the lifting beam 41 are connected to the lifting column 40. The lifting column 40 has a degree of freedom to move along the length of the forming worktable 1. The mounting base 4 is slidably mounted on the lifting beam 41 and has a degree of freedom to move along the width of the forming worktable 1. A linear drive module 42 is mounted below the lifting column 40. The lifting column 40 is vertically mounted on the slide of the linear drive module 42. The lifting column 40 includes a fixed column 43 and a sliding column 44. The top of the fixed column 43 is slidably fitted with the sliding column 44. A column lifting cylinder 45 is vertically mounted on the side wall of the fixed column 43. The telescopic shaft of the column lifting cylinder 45 is connected to the sliding column 44. A screw groove 46 is opened at the bottom of the lifting beam 41, and a screw 47 is rotatably mounted in the screw groove 46. A lead screw nut is threaded onto rod 47, and the mounting base 4 is connected to the lead screw nut. A lead screw motor 48 is installed at one end of the lifting beam 41. The output shaft of the lead screw motor 48 is connected to the lead screw 47. The linear drive module 42 drives the lifting column 40 to move along the length of the forming worktable 1, thereby driving the mounting base 4 to move along the length of the forming worktable 1 via the lifting beam 41. The column lifting cylinder 45 drives the sliding column 44 to move up and down, thereby driving the mounting base 4 to move up and down via the lifting beam 41. The lead screw motor 48 drives the lead screw 47 to rotate, causing the lead screw nut to drive the mounting base 4 to move along the width of the forming worktable 1. This allows the edge trimming and polishing assembly to have degrees of freedom to move along the X, Y, and Z axes in the spatial coordinate system. With the coordination of the three degrees of freedom, the edge trimming and polishing assembly completes the edge trimming and polishing operations of the irregularly shaped circuit board.

[0039] Example 2

[0040] When the polishing shaft 8 polishes the circuit board, sufficient working space needs to be left below the circuit board to avoid interference between the polishing shaft 8 and the forming worktable 1. Simultaneously, the polishing shaft 8 should be able to cover the thickness direction of the circuit board for polishing. Secondly, it is also necessary to avoid the laser cutting head 7 affecting the forming worktable 1. Therefore, based on Embodiment 1, as follows... Figure 1 and Figure 6As shown, the forming worktable 1 has an inner cavity 28, and an adjustable support mechanism is provided inside the inner cavity 28. The adjustable support mechanism includes a mounting plate 29 and support columns 30. The mounting plate 29 is fixedly connected to the forming worktable 1, and several support columns 30 are slidably passed through the mounting plate 29. The support columns 30 are vertically arranged, and the top of the support columns 30 moves out from the top surface of the forming worktable 1. The support columns 30 located within the cutting edge trajectory move upward to support the circuit board, so that the circuit board is in a suspended state, and the support columns 30 located outside the cutting edge trajectory are below the circuit board to avoid the cutting edge polishing device. The circuit board is supported by the support columns 30, so that the circuit board is relatively stable relative to the forming worktable 1. The worktable 1 is suspended in the air, and the moving height of each support column 30 is controllable. Thus, the support column 30 at the corresponding position is adjusted according to the coordinate position of the pressing mold 2. The support columns 30 within the coverage area of ​​the pressing mold 2 move upward to support the circuit board, while the support columns 30 outside the coverage area of ​​the pressing mold 2 are located below the circuit board. This keeps the circuit board suspended in the air, and there are no upward-moving support columns 30 within the working range of the laser cutting head 7 and the polishing grinding shaft 8. This allows it to adapt to the support requirements of any irregular contour, avoids interference of the support structure with the cutting and polishing processes, and improves the adaptability of the equipment to complex irregular circuit boards.

[0041] Example 3

[0042] Based on Example 2, such as Figures 1 to 8As shown, the adjustable support mechanism also includes a lifting push plate 49 and a push plate cylinder 31. The push plate cylinder 31 is vertically installed in the inner cavity 28. The telescopic shaft of the push plate cylinder 31 is connected to the lifting push plate 49. The lifting push plate 49 is located below the support column 30. The support column 30 is located on the moving path of the lifting push plate 49. The support column 30 includes a primary lifting column 32 and a secondary lifting column 33. The primary lifting column 32 slides through the mounting plate 29. A support spring 39 is sleeved on the primary lifting column 32. The two ends of the support spring 39 are respectively connected to the mounting plate 29 and the primary lifting column 32. The bottom of the primary lifting column 32 has a small diameter hole 34 and a large diameter hole 35 along its own axial direction. A matching device is slidably arranged in the large diameter hole 35. The counterweight 36 is fixedly connected to one end of the secondary lifting column 33, and the other end moves through the small-diameter hole 34. A docking block 37 is slidably provided on the side wall of the secondary lifting column 33, and the docking block 37 has the freedom to move radially along the secondary lifting column 33. A docking hole 38 is provided on the side wall of the small-diameter hole 34. When the docking block 37 fits into the docking hole 38, the primary lifting column 32 connects to the secondary lifting column 33. When the docking block 37 is separated from the docking hole 38, the secondary lifting column 33 can slide within the primary lifting column 32. Under normal conditions, the secondary lifting column 33 moves to its lower limit position under the action of the counterweight 36. At this time, the docking hole 38 is located on the moving path of the docking block 37. Due to the support column 3... Since the horizontal coordinates remain unchanged, the horizontal coordinates of the support columns 30 are known. Based on the horizontal coordinates of the pressing die 2, it can be determined which support columns 30 need to be moved upwards to support the circuit board. That is, the support columns 30 within the edge trajectory range of the pressing die 2 need to be in working condition to support the circuit board. The mating blocks 37 corresponding to the tooling-state support columns 30 are inserted into the mating holes 38, thereby connecting the primary lifting column 32 and the secondary lifting column 33 together. The support columns 30 outside the edge trajectory range of the pressing die 2 are in a non-working state. The secondary lifting column 33 of this support column 30 can slide within the primary lifting column 32, driving the lifting push plate 49 upwards via the push plate cylinder 31. The lifting push plate 49 acts on all the support columns 30. When a support column 30 is in operation, the lifting push plate 49 pushes the secondary lifting column 33 upwards. The secondary lifting column 33 then pushes the primary lifting column 32 to compress the support spring 39, causing the top surface of the secondary lifting column 33 to contact the circuit board for support. When a support column 30 is not in operation, the lifting push plate 49 pushes the secondary lifting column 33 upwards, causing it to slide within the primary lifting column 32. That is, the primary lifting column 32 does not follow the secondary lifting column 33 upwards. Thus, a single power source can control the drive of all the support columns 30 and can control the working state of the support columns 30 according to the size of the irregularly shaped circuit board. Preferably, the inner diameter of the small-diameter hole 34 is φ3-φ8mm, the inner diameter of the large-diameter hole 35 is φ6-φ14mm, and the width of the mating hole 38 is 2-4mm.

[0043] Example 4

[0044] Based on Example 3, such as Figures 1 to 8 As shown, a control drive cavity 50 is provided within the secondary lifting column 33 along its own axial direction. An axial drive assembly is installed within the control drive cavity 50. The axial drive assembly includes a ring electromagnet 51, an axial drive rod 52, and a fixed base plate 53. The fixed base plate 53 is fixedly connected to the secondary lifting column 33. The axial drive rod 52 slides through the fixed base plate 53. A radial groove 54 communicating with the control drive cavity 50 is opened on the side wall of the secondary lifting column 33. A docking block 37 is slidably disposed within the radial groove 54. A driving inclined surface 55 is provided on the end face of the docking block 37 near the axial drive rod 52. The driving inclined surface 55 is located within the axial drive... Along the movement path of rod 52, a driving permanent magnet 56 is connected to the bottom of the axial drive rod 52, and a ring electromagnet 51 is installed directly below the driving permanent magnet 56. An axial return spring 57 is sleeved on the axial drive rod 52, and the two ends of the axial return spring 57 are respectively connected to the fixed base plate 53 and the axial drive rod 52. A pull wire 58 is connected to the end of the docking block 37 near the control drive cavity 50. A guide pulley 59 is installed on the inner wall of the control drive cavity 50. The pull wire 58 passes around the guide pulley 59 and connects to the side wall of the axial drive rod 52. When the axial return spring 57 is in its normal state, the docking block 37 disengages from the docking block 52. When it is necessary to connect the primary lifting column 32 and the secondary lifting column 33, the annular electromagnet 51 is energized to generate magnetic poles with the same magnetism as the driving permanent magnet 56. This causes the driving permanent magnet 56 to be repelled, driving the axial drive rod 52 to move upward. The axial drive rod 52 compresses the axial return spring 57 and presses the driving inclined surface 55 of the docking block 37. Under the action of the driving inclined surface 55, the docking block 37 moves towards the docking hole 38, allowing it to insert into the docking hole 38 and complete the connection between the primary lifting column 32 and the secondary lifting column 33. During the upward movement of the axial drive rod 52, the pull wire 58 is in a relaxed state. In the relaxed state, the docking block 37 can smoothly align with the docking hole 38. At this time, the docking block 37 drives the pull wire 58 to move. When it is necessary to disconnect the connection between the first-stage lifting column 32 and the second-stage lifting column 33, the annular electromagnet 51 is de-energized, causing the force between the annular electromagnet 51 and the driving permanent magnet 56 to disappear. The axial drive rod 52 moves downward under the reaction force of the axial return spring 57, pulling the pull wire 58 downward. Under the action of the guide pulley 59, the pull wire 58 can smoothly pull the docking block 37 into the radial groove 54, separating the docking block 37 from the docking hole 38. Since the radial space of the second-stage lifting column 33 is small, it is impossible to install a drive component to control the movement of the docking block 37. Therefore, an axial drive assembly is set up to utilize the axial space of the second-stage lifting column 33 to install the drive component to control the movement of the docking block 37 and complete the switching of the working state of the support column 30.

[0045] Example 5

[0046] Based on Example 4, such as Figures 1 to 3 As shown, the polishing plate 6 includes a fixed plate 9 and a sliding plate 10. The fixed plate 9 is fixedly connected to the mounting base 4. An installation opening 11 is provided through the fixed plate 9 along its thickness direction. The sliding plate 10 is disposed in the installation opening 11. A groove 12 is provided on the side wall of the installation opening 11, extending horizontally. A slider 13 is slidably disposed in the groove 12, and the slider 13 is fixedly connected to the sliding plate 10. The polishing grinding shaft 8 is rotatably mounted on the bottom of the sliding plate 10 through bearings. A polishing motor 14 is mounted on the top of the sliding plate 10. The output shaft of the polishing motor 14 is connected to the polishing grinding shaft 8. A push cylinder 15 is horizontally mounted on the fixed plate 9. The telescopic shaft of the push cylinder 15 passes through the installation opening 11 and is connected to a spring 16. The spring 16 is connected to the sliding plate 10. The push cylinder 15 drives the sliding plate 10 to move, so that the sliding plate 10 and the laser cutting head 7 are staggered in the horizontal direction, so that the laser beam emitted by the laser cutting head 7 can act on the circuit board through the installation opening 11. After the circuit board is cut, the laser cutting head... 7. When closed, the cylinder 15 is pushed to drive the sliding plate 10 to reset. After reset, the axis of the polishing shaft 8 is coaxial with the axis of the laser beam, thus determining the polishing path of the polishing shaft 8. The polishing motor 14 drives the polishing shaft 8 to rotate to complete the polishing of the side of the circuit board. The cylinder 15 is pushed to feed the polishing shaft 8 to remove the polishing allowance and achieve high-precision polishing. To avoid errors, the pressure mold 2 is made of wear-resistant materials, such as hard alloy, wear-resistant steel, etc. Even if the feed amount of the polishing shaft 8 is greater than the polishing allowance, the polishing shaft 8 will act on the pressure mold 2. Due to the wear-resistant characteristics of the pressure mold 2 and the buffer of the spring 16, the polishing shaft 8 cannot continue to polish the circuit board. When setting the feed amount of the polishing shaft 8, the error value is added to the original polishing allowance to ensure that the feed amount is not less than the polishing allowance, and the excess part is absorbed by the spring 16, which greatly improves the polishing accuracy and makes the size of the formed circuit board closer to the standard value.

[0047] Example 6

[0048] Based on Example 5, such as Figures 1 to 5As shown, the mold cooling device also includes two sets of switching connection components arranged opposite to each other. The pressing mold 2 is located between the two sets of switching connection components. The switching connection components include a lifting cylinder 17, a horizontal cylinder 18, and a plug-in block 19. The cylinder body of the lifting cylinder 17 is vertically mounted on the forming worktable 1, and the telescopic shaft of the lifting cylinder 17 is connected to a lifting seat 60. The cylinder body of the horizontal cylinder 18 is horizontally mounted on the lifting seat 60, and the telescopic shaft of the horizontal cylinder 18 is connected to the plug-in block 19. The side wall of the pressing mold 2 is provided with plug-in slots 20 at the positions corresponding to the two sets of switching connection components. The plug-in block 19 is adapted to the plug-in slot 20. A connecting block 21 is slidably inserted through the top of the plug-in block 19. A connecting groove 22 is provided on the inner top wall of the plug-in slot 20. When the plug-in block 19 is adapted to the plug-in slot... When the circuit board is in the connecting groove 22, the connecting block 21 fits into the connecting groove 22. The two sets of switching connecting components alternately connect the pressing mold 2. The top of the plug-in block 19 has a mounting groove 23, and an electromagnet 24 is installed in the mounting groove 23. One end of the connecting block 21 passes through the mounting groove 23 and is connected to a permanent magnet 25. When the electromagnet 24 is energized, it generates a magnetic pole that is opposite to the magnetic field of the permanent magnet 25. A switching spring 26 is set in the mounting groove 23. The two ends of the switching spring 26 are respectively connected to the plug-in block 19 and the connecting block 21. The top surface of the connecting block 21 near the pressing mold 2 has a wedge-shaped surface 27. When the connecting block 21 fits into the connecting groove 22, the switching spring 26 is in a compressed state. In order for the circuit board to be placed smoothly on the support column 30, the pressing mold 2 has a horizontal and a vertical orientation. The linear movement freedom is such that, on the feeding circuit board, the horizontal cylinder 18 drives the pressing mold 2 to move to one side of the support column 30, allowing the circuit board to be fed from above the support column 30. Once the circuit board is placed on the support column 30, the horizontal cylinder 18 drives the pressing mold 2 to move directly above the circuit board, and then the lifting cylinder 17 drives the pressing mold 2 downwards, thus suspending and pressing the circuit board firmly onto the support column 30. Since the laser cutting head 7 and the polishing shaft 8 will rotate around the circuit board, two sets of switching connection components are symmetrically arranged to ensure that the switching connection components do not interfere with the edge-cutting and polishing components. These two sets of switching connection components alternately connect to the pressing mold 2 to control it. When the edge-cutting and polishing components... When the component is about to reach the area of ​​a switching connection assembly, another switching connection assembly first engages with the pressing mold 2. Then, the first switching connection assembly separates from the pressing mold 2, and the horizontal cylinder 18 of the switching connection assembly resets, creating space between the horizontal cylinder 18 and the pressing mold 2 for the edge-cutting and polishing assembly to operate. When the edge-cutting and polishing assembly reaches the next switching connection assembly, the two sets of switching connection assemblies engage and switch again. This completes the limiting and positioning cutting of the circuit board while ensuring the stable operation of each mechanism. Specifically, during the engagement process, the horizontal cylinder 18 drives the insertion block 19 to move closer to the insertion slot 20 of the pressing mold 2. During the movement, the pressing mold 2 squeezes the wedge-shaped surface 27. Under the action of the wedge-shaped surface 27...The connecting block 21 compresses the switching spring 26 and moves into the mounting groove 23, allowing the plug-in block 19 to fit smoothly into the plug-in groove 20. After the plug-in block 19 is inserted into the groove, the connecting block 21 is inserted into the connecting groove 22 under the force of the switching spring 26, thereby connecting the switching connection assembly with the pressing mold 2 and controlling the movement of the pressing mold 2. When it is necessary to disconnect, the electromagnet 24 is energized to attract the permanent magnet 25, causing the permanent magnet 25 to drive the connecting block 21 to compress the switching spring 26 and move into the mounting groove 23. Then, the horizontal cylinder 18 drives the plug-in block 19 away from the pressing mold 2. Under the restriction of the pressing mold 2 by another switching connection assembly, the plug-in block 19 can smoothly disengage from the plug-in groove 20 to complete the disconnection operation. In practical implementation, the top of the pressing mold 2 is integrally formed with a mounting part. The size of the mounting part is smaller than the size of the pressing mold 2, so that the mounting part is located on the inner ring of the pressing mold 2. The insertion groove 20 is formed on the mounting part, which is cuboid in shape. This avoids the influence of the irregular sidewalls of the pressing mold 2 on the docking effect of the switching connection components.

[0049] A laser forming method for irregularly shaped circuit boards, utilizing the aforementioned laser forming system for irregularly shaped circuit boards, includes the following steps:

[0050] S1. First, replace the matching pressing mold 2 according to the irregular cut edge shape of the circuit board;

[0051] S2. Place the circuit board fixture on the forming worktable 1 and press it down using the pressing mold 2;

[0052] S3. The laser cutting head 7 uses the pressing mold 2 as a reference to cut the edge of the circuit board, so that the cutting trajectory shape of the laser cutting head 7 corresponds to the outer trajectory shape of the pressing mold 2, and a polishing allowance is formed between the cutting trajectory of the laser cutting head 7 and the outer trajectory of the pressing mold 2.

[0053] S4. Polish the sides of the circuit board using a polishing grinding shaft. The amount of polishing is equal to the polishing allowance, thus obtaining a standard irregular-shaped circuit board.

Claims

1. A laser forming system for a profiled circuit board, characterized by The application relates to a forming workbench (1) provided with a mold cooling device and a trimming and polishing device, wherein the mold cooling device comprises a lower pressing mold (2) used for pressing a circuit board lower pressing tool on the forming workbench (1), the lower pressing mold (2) is matched with a standard special-shaped circuit board in shape and size, a cooling cavity (3) is arranged in the lower pressing mold (2), the cooling cavity (3) is filled with cooling liquid or cooling gas, and a low-temperature area is formed around the circuit board, the trimming and polishing device comprises a gantry conveying assembly and a trimming and polishing assembly arranged on the gantry conveying assembly, the trimming and polishing assembly comprises a mounting base (4), a trimming plate (5) and a polishing plate (6), the trimming plate (5) and the polishing plate (6) are fixed on the mounting base (4), a laser cutting head (7) is arranged on the trimming plate (5), the polishing plate (6) is rotationally provided with a polishing grinding shaft (8), the trimming and polishing assembly is used for trimming the circuit board along the track of the lower pressing mold (2) through the laser cutting head (7), a polishing allowance is formed between the track of the laser cutting head (7) and the lower pressing mold (2), and then the polishing allowance is removed through the polishing grinding shaft (8) to obtain the required special-shaped circuit board.

2. The laser forming system of a profiled circuit board according to claim 1, characterized in that, The polishing plate (6) comprises a fixed plate (9) and a sliding plate (10), the fixed plate (9) is fixedly connected with the mounting base (4), the fixed plate (9) is provided with a mounting hole (11) penetrating through the fixed plate (9) along the thickness direction of the fixed plate (9), the sliding plate (10) is arranged in the mounting hole (11), a sliding groove (12) is formed in the side wall of the mounting hole (11), the sliding groove (12) extends horizontally, a sliding block (13) is slidably arranged in the sliding groove (12), the sliding block (13) is fixedly connected with the sliding plate (10), the polishing grinding shaft (8) is rotatably arranged at the bottom of the sliding plate (10) through a bearing, a polishing motor (14) is arranged at the top of the sliding plate (10), and the output shaft of the polishing motor (14) is connected with the polishing grinding shaft (8).

3. The laser forming system of claim 2, wherein the laser beam is shaped to have a cross-section that is substantially the same as the cross-section of the profiled circuit board. The fixed plate (9) is horizontally provided with a pushing air cylinder (15), the telescopic shaft of the pushing air cylinder (15) penetrates into the mounting hole (11) and is connected with a spring (16), and the spring (16) is connected with the sliding plate (10). ​ 4. The laser forming system of claim 1, wherein, The mold cooling device further comprises two groups of switch connection assemblies oppositely arranged, the lower pressing mold (2) is located between the two groups of switch connection assemblies, the switch connection assembly comprises a lifting cylinder (17), a horizontal cylinder (18) and a plug-in block (19), the cylinder body of the lifting cylinder (17) is vertically installed on the forming workbench (1), the telescopic shaft of the lifting cylinder (17) is connected with a lifting seat (60), the cylinder body of the horizontal cylinder (18) is horizontally installed on the lifting seat (60), the telescopic shaft of the horizontal cylinder (18) is connected with the plug-in block (19), the side wall of the lower pressing mold (2) is provided with a plug-in groove (20) at the position corresponding to the two groups of switch connection assemblies, the plug-in block (19) is matched with the plug-in groove (20), the top of the plug-in block (19) is slidably provided with a connecting block (21), the inner top wall of the plug-in groove (20) is provided with a connecting groove (22), when the plug-in block (19) is matched in the plug-in groove (20), the connecting block (21) is matched in the connecting groove (22), and the two groups of switch connection assemblies are alternately connected with the lower pressing mold (2).

5. The laser forming system of claim 4, wherein the laser beam is shaped to have a cross-section that is substantially the same as the cross-section of the profiled circuit board. The top of the plug-in block (19) is provided with a mounting groove (23), the mounting groove (23) is provided with an electromagnet (24), one end of the connecting block (21) penetrates into the mounting groove (23) and is connected with a permanent magnet (25), the electromagnet (24) is electrified to generate a magnetic pole different from that of the permanent magnet (25), the mounting groove (23) is provided with a switch spring (26), both ends of the switch spring (26) are connected with the plug-in block (19) and the connecting block (21) respectively, the top surface of one end of the connecting block (21) close to the lower pressing mold (2) is provided with a wedge surface (27), when the connecting block (21) is matched in the connecting groove (22), the switch spring (26) is in a compressed state. ​ 6. The laser forming system of claim 1, wherein, The forming workbench (1) is provided with an inner cavity (28), the inner cavity (28) is provided with an adjustable supporting mechanism, the adjustable supporting mechanism comprises an installation plate (29) and a supporting column (30), the installation plate (29) is fixedly connected with the forming workbench (1), a plurality of supporting columns (30) are slidably provided on the installation plate (29), the supporting columns (30) are vertically arranged, the top of the supporting column (30) is movably penetrated out of the top surface of the forming workbench (1), the supporting column (30) located in the edge cutting track moves upward to support the circuit board, so that the circuit board is in a suspended state, and the supporting column (30) located outside the edge cutting track is below the circuit board, so as to avoid the edge cutting polishing device.

7. The laser forming system of claim 6, wherein the laser beam is shaped to have a cross-section that is substantially the same as the cross-section of the profiled circuit board. The adjustable support mechanism further comprises a lifting push plate (49) and a push plate cylinder (31), the push plate cylinder (31) is vertically installed in the inner cavity (28), the telescopic shaft of the push plate cylinder (31) is connected with the lifting push plate (49), the lifting push plate (49) is located below the support column (30), the support column (30) is located on the moving path of the lifting push plate (49), the support column (30) comprises a first lifting column (32) and a second lifting column (33), the first lifting column (32) is slidably arranged on the mounting plate (29), the first lifting column (32) is sleeved with a support spring (39), the two ends of the support spring (39) are respectively connected with the mounting plate (29) and the first lifting column (32), the bottom of the first lifting column (32) is provided with a small-diameter hole (34) and a large-diameter hole (35) along the axial direction of the first lifting column (32), the large-diameter hole (35) is slidably provided with a counterweight (36), one end of the second lifting column (33) is fixedly connected with the counterweight (36), the other end is movably arranged through the small-diameter hole (34), the side wall of the second lifting column (33) is slidably provided with a butt joint block (37), the butt joint block (37) has a freedom degree of moving along the radial direction of the second lifting column (33), the side wall of the small-diameter hole (34) is provided with a butt joint hole (38), when the butt joint block (37) is fitted in the butt joint hole (38), the first lifting column (32) is connected with the second lifting column (33), when the butt joint block (37) and the butt joint hole (38) are in a separated state, the second lifting column (33) can slide in the first lifting column (32).

8. The laser forming system of claim 1, wherein, The gantry conveying assembly comprises a lifting support column (40) and a lifting cross beam (41), both ends of the bottom of the lifting cross beam (41) are connected with the lifting support column (40), the lifting support column (40) has a freedom degree of moving along the length direction of the forming workbench (1), the mounting base (4) is slidably arranged on the lifting cross beam (41), and the mounting base (4) has a freedom degree of moving along the width direction of the forming workbench (1).

9. The laser forming system of claim 8, wherein the laser beam is shaped to form the profiled circuit board. A linear drive module (42) is installed below the lifting support column (40), the lifting support column (40) is vertically installed on the sliding seat of the linear drive module (42), the lifting support column (40) comprises a fixed support column (43) and a sliding support column (44), the top of the fixed support column (43) is slidably provided with the sliding support column (44), the side wall of the fixed support column (43) is vertically installed with a support column lifting cylinder (45), the telescopic shaft of the support column lifting cylinder (45) is connected with the sliding support column (44), the bottom of the lifting cross beam (41) is provided with a lead screw groove (46), the lead screw groove (46) is rotatably provided with a lead screw (47), the lead screw (47) is threadedly sleeved with a lead screw nut, the mounting base (4) is connected with the lead screw nut, one end of the lifting cross beam (41) is provided with a lead screw motor (48), and the output shaft of the lead screw motor (48) is drivingly connected with the lead screw (47).

10. A method for laser forming a profiled circuit board using the laser forming system for a profiled circuit board according to claim 1, wherein The method comprises the following steps: S1, according to the shape of the irregular cutting edge of the circuit board, replace the matching lower mold (2); S2, the circuit board is fixed on the forming workbench (1), and the lower mold (2) is used for limiting; S3, the laser cutting head (7) is used for cutting edge processing of the circuit board with the lower mold (2) as reference, so that the cutting track shape of the laser cutting head (7) corresponds to the outer track shape of the lower mold (2), and the cutting track of the laser cutting head (7) and the outer track of the lower mold (2) form a polishing allowance; S4, the side edge of the circuit board is polished by polishing grinding shaft, and the polishing amount is equal to the polishing allowance, so that the standard irregular circuit board is obtained.

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