Support, electronic equipment accessory and support manufacturing method

Abstract

The invention discloses a support which comprises a magnetic assembly and a support body, the support body is formed outside the magnetic assembly so that the magnetic assembly can be embedded into the support body, the magnetic assembly comprises a magnet and a heat shielding layer, and the heat shielding layer wraps the surface of the magnet and separates the magnet from the support body. The heat shielding layer is arranged between the magnet and the support body, so that heat shock of high-temperature molten plastic on the magnet in the injection molding process can be effectively blocked, and the magnet demagnetization phenomenon caused by instantaneous high temperature is avoided. The heat shielding layer ensures that the magnet can still keep stable magnetic performance after a high-temperature injection molding process by reducing the peak temperature of the magnet in the injection molding stage. The invention further discloses an electronic equipment accessory with the support and a manufacturing method of the support.

Description

Technical Field

[0001] This invention relates to the field of equipment accessories technology, and in particular to a bracket, a protective shell, and a method for manufacturing the bracket. Background Technology

[0002] In the consumer electronics field, rare-earth permanent magnets (such as neodymium iron boron (NdFeB)) are widely used in various brackets due to their high magnetic energy product. For example, they are used in brackets for protective cases, giving the bracket magnetic attraction. This magnetic attraction allows for wireless charging of electronic devices inside the case, or for magnetically securing phones to car mounts for navigation while driving. Alternatively, they can hold phones to magnetically attracted surfaces like refrigerators, freeing up users' hands or facilitating photography. To prevent exposed magnets from detaching or being damaged, a protective layer is typically applied to the outside of the magnet. Currently, two main methods are used. The first method involves directly encapsulating the magnet with plastic through injection molding, forming a plastic protective layer. However, this method faces a key challenge: the molten plastic temperature during injection molding typically reaches 300°C to 350°C, while the maximum operating temperature of the magnet is only 80°C to 200°C. This instantaneous high-temperature thermal shock can cause irreversible demagnetization and changes in the metallographic structure of the magnet, leading to a permanent decline in its magnetic properties. Another method involves first electroplating an electroplated layer onto the magnet surface to form a magnet electroplated structure, and then using plastic injection molding to form a support body that encapsulates the magnet electroplated structure. The support body and the electroplated layer together constitute a protective layer. The electroplated layer is often made of a metal material with good thermal conductivity, primarily serving an anti-corrosion function, and is only on the micrometer scale in thickness. Despite its excellent thermal conductivity, under the impact of high-temperature molten metal, heat is rapidly conducted through the electroplated layer to the magnet core, failing to provide effective thermal insulation and thus failing to solve the fundamental problem of high-temperature demagnetization. Summary of the Invention

[0003] In view of this, the present invention provides a bracket, an electronic device accessory, and a method for manufacturing the bracket. By setting a heat shielding layer between the magnet and the bracket body, the peak temperature of the magnet is effectively reduced, thereby ensuring the integrity of the magnetic properties of the magnet after high-temperature injection molding.

[0004] To address the above problems, this application provides the following technical solution: This application provides a bracket, including a magnetic component and a bracket body. The bracket body is formed outside the magnetic component so that the magnetic component is embedded inside the bracket body. The magnetic component includes a magnet and a heat shielding layer. The heat shielding layer wraps around the surface of the magnet and separates the magnet from the bracket body.

[0005] The bracket of this application, by setting a heat shield layer that separates the magnet from the bracket body, can effectively block the thermal shock of the external high-temperature environment to the magnet, especially in high-temperature processing environments such as injection molding, and avoid demagnetization of the magnet due to instantaneous high temperature. This heat shield layer ensures that the magnet maintains stable magnetic properties after high-temperature processing by reducing the peak temperature of the magnet during the high-temperature processing stage.

[0006] This application also provides an electronic device accessory, including an accessory body and a bracket as described above, the bracket being rotatably connected to the accessory body.

[0007] The electronic device accessory of this application, having included the bracket as described above, has the beneficial effects of the bracket as shown above.

[0008] This application also provides a method for manufacturing a support, comprising the following steps: Provide magnets; A heat shielding layer is machined onto the surface of the magnet to encapsulate the magnet, thereby obtaining a magnetic assembly; The bracket body is injection molded onto the magnetic component using an injection molding process to obtain the bracket.

[0009] The bracket manufacturing method of this application is simple in steps. First, a heat shielding layer is processed on the outer surface of the magnet to obtain a magnetic component. Then, the bracket body is injection molded onto the magnetic component to obtain the bracket. Moreover, before the bracket body is injection molded, the heat shielding layer is pre-processed on the surface of the magnet. This heat shielding layer can effectively block the transfer of heat energy from the high-temperature melt to the magnet, significantly reducing the peak temperature of the magnet during the molding process, thereby ensuring the integrity and long-term stability of its magnetic properties under high-temperature environments. In addition, this manufacturing method integrates the magnet and the heat shielding layer into a single insert. This insert enters the injection mold as a standard unit, simplifying the control of the injection molding process and improving production consistency and reliability. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural schematic diagram of the bracket shown in one embodiment of this application; Figure 2 for Figure 1 The exploded view of the support shown; Figure 3 for Figure 1 A schematic cross-sectional view of the support structure shown; Figure 4 for Figure 3 An enlarged view of the area circled in circle A; Figure 5 This is a three-dimensional structural schematic diagram of the bracket shown in another embodiment of this application; Figure 6 for Figure 5 A schematic cross-sectional view of the support structure shown; Figure 7 for Figure 6 An enlarged view of the area circled by circle B in the middle; Figure 8 for Figure 5 The diagram shows the exploded disassembly structure of the support. Figure 9 This is an exploded view of the packaging of the heat-insulating metal casing shown in the embodiment of this application; Figure 10 This is a simplified flowchart illustrating the bracket fabrication method shown in an embodiment of this application; Figure 11 for Figure 10 A flowchart illustrating step S10 in the diagram; Figure 12 for Figure 10 A detailed flowchart illustrating the bracket fabrication method is shown below. Figure 1 ; Figure 13 for Figure 12 A flowchart of step S33a in the diagram; Figure 14 for Figure 12 A flowchart illustrating step S34a in the diagram; Figure 15 for Figure 12 A flowchart illustrating step S35a in the diagram; Figure 16 for Figure 10 A detailed flowchart illustrating the bracket fabrication method is shown below. Figure 2 .

[0011] In the picture: 10. Magnet; 20. Magnetic conductor; 21. Positioning groove; 30. Heat shielding layer; 31. Electroplating layer; 32. Heat insulation coating; 40. Support body; 41. Perforation; 50. Heat insulation metal shell; 51. Shell body; 511. Placement cavity; 512. Guide chamfer; 52. Cover; 521. Positioning hole; 60. Connector; 61. First part; 62. Second part; 70. Filler; 80. Outer coating. Detailed Implementation

[0012] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0013] It should be noted that all directional indications (such as up, down, left, right, front, back, inside, outside, top, bottom, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship between the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0014] It should also be noted that when a component is referred to as "fixed to" or "set on" another component, the component may be directly on the other component or there may be an intervening component present. When a component is referred to as "connected to" another component, it may be directly connected to the other component or there may be an intervening component present.

[0015] Please see Figures 1 to 9 This is a bracket as shown in an embodiment of the present invention, such as... Figure 2 As shown, the bracket includes a magnetic component and a bracket body 40. The bracket body 40 is formed outside the magnetic component so that the magnetic component is embedded inside the bracket body 40. The magnetic component includes a magnet 10 and a heat shielding layer 30. The heat shielding layer 30 wraps around the surface of the magnet 10 and separates the magnet 10 from the bracket body 40.

[0016] This application effectively blocks the thermal shock of the magnet 10 to the magnet 10 by setting a heat shield layer 30 that separates the magnet 10 from the support body 40. Especially in high-temperature processing environments such as injection molding, it avoids the demagnetization of the magnet 10 caused by instantaneous high temperature. The heat shield layer 30 reduces the peak temperature of the magnet 10 during the high-temperature processing stage, ensuring that the magnet 10 can maintain stable magnetic properties after high-temperature processing.

[0017] In some embodiments, such as Figure 2 or Figure 8 As shown, the support body 40 is ring-shaped, and the magnetic assembly also includes a magnetic guide 20. The magnetic guide 20 has an arc-shaped sheet structure, and multiple magnets 10 are fixed on the magnetic guide 20. The multiple magnets 10 are arranged sequentially along the length direction of the magnetic guide 20. This arrangement integrates the dispersed magnets 10 into a stable whole unit through the connecting effect of the magnetic guide 20, which helps to simplify the subsequent processing. For example, when wrapping the magnets 10 and forming the heat shield layer 30, the stability of the overall structure eliminates the tedious operation of handling each magnet 10 individually, improving processing efficiency and reliability. Furthermore, the number of magnetic guides 20 is at least two, and all magnetic guides 20 are arranged circumferentially along the support body 40. In a specific embodiment, as shown... Figure 2As shown, there are two magnetic conductive elements 20, which are arranged symmetrically along the circumference of the bracket. The magnet 10 is fixed to the magnetic conductive element 20 by magnetic attraction, or by bonding the magnet 10 and the magnetic conductive element 20 together with an adhesive, such as glue, after the magnet 10 is magnetically attracted to the magnetic conductive element 20.

[0018] In other feasible embodiments, the magnetic conductor 20 can be removed, and multiple magnets 10 can be provided, with the multiple magnets 10 arranged circumferentially along the ring-shaped support body 40. Furthermore, the multiple magnets 10 are divided into two groups, preferably evenly divided into two groups, and the two groups of magnets 10 are symmetrically arranged.

[0019] In some embodiments, such as Figures 1 to 4 As shown, the heat shielding layer 30 includes an electroplated layer 31 and a heat insulation coating 32, such as Figure 4 As shown, the electroplated layer 31 is attached to the surface of the magnet 10 through an electroplating process, and the heat-insulating coating 32 is wrapped around the electroplated layer 31. The electroplated layer 31 and the heat-insulating coating 32 together form a composite protective and heat-insulating system. The electroplated layer 31 can play the roles of corrosion prevention, heat insulation, and facilitating the adhesion of the heat-insulating coating 32. In terms of heat insulation, the electroplated layer 31 reflects the high-temperature heat radiation from the outside through its high reflectivity, thereby blocking the thermal shock of the external high temperature to the magnet 10. The role of the heat-insulating coating 32 is to further enhance the heat insulation. It is usually made of high-temperature resistant materials and can form a dense protective layer. It can not only insulate heat but also resist the mechanical impact of high temperature, providing additional protection for the electroplated layer 31. Together, they ensure the stable performance of the magnet 10 in extreme high-temperature environments.

[0020] Optionally, the heat-insulating coating 32 is a polymer heat-insulating functional coating with a thermal conductivity of less than 0.2 W / (m·K). Polymer heat-insulating functional coatings have high thermal radiation reflectivity; most polymer heat-insulating functional coatings typically achieve a thermal radiation reflectivity of over 80%-90% in the infrared band (400-2500 nm). Polymer heat-insulating functional coatings with thermal conductivity in this range exhibit both high thermal radiation reflectivity and low thermal conductivity. Their high thermal radiation reflectivity effectively reflects high-temperature infrared radiation from the outside environment, significantly reducing the peak temperature on the surface of the magnet 10. Simultaneously, the low thermal conductivity inhibits heat conduction within the heat-insulating coating, thereby delaying the transfer of heat energy to the magnet 10. Furthermore, the polymer heat-insulating functional coating also possesses good mechanical and impact properties, can withstand high-pressure stress in the injection molding environment, and achieves good chemical compatibility with the subsequent electroplated layer 31, forming a dense, uniform, and non-delamination-free composite protective structure, further ensuring the durability and reliability of the heat insulation effect of the heat-insulating coating 32.

[0021] Preferably, the polymer thermal insulation coating is made of one or more of the following materials: high-temperature epoxy resin, polyetheretherketone (PEEK), and Teflon. These materials all possess high thermal reflectivity and low thermal conductivity. More preferably, the polymer thermal insulation layer is made of Teflon, which outperforms high-temperature epoxy resin and PEEK in high-temperature environments. Specifically, its long-term operating temperature range is significantly higher than these two materials, and its mechanical stability under high-temperature conditions is more outstanding. Since the thermal insulation effect is closely related to the material's temperature resistance and high-temperature mechanical stability, using Teflon as the material for the thermal insulation coating 32 can more effectively resist performance degradation under high-temperature environments, thereby achieving superior thermal insulation performance.

[0022] Optionally, the thickness of the heat-insulating coating 32 is equal to the thickness of the electroplated layer 31, and the thickness of the heat-insulating coating 32 is 15-30 micrometers, such as 15 micrometers, 20 micrometers, 25 micrometers, 30 micrometers, etc. Experimental testing has shown that a thickness less than 15 μm results in insufficient heat insulation, with the demagnetization rate of the magnet 10 exceeding 5%; while a thickness greater than 30 μm provides better heat insulation, it increases costs, affects the dimensional accuracy of component assembly, and excessively thick heat-insulating coating 32 increases internal stress at high temperatures, increasing the risk of cracking. The thickness range of 15-30 micrometers achieves the optimal balance between heat insulation effect and process feasibility, ensuring that the demagnetization rate of the magnet 10 is less than 5%. Setting the thicknesses of the heat-insulating coating 32 and the electroplated layer 31 to be equal reduces stress concentration caused by differences in thermal expansion coefficients, preventing cracking or peeling of the heat-insulating coating 32.

[0023] Optionally, the heat insulation coating 32 has an uneven structure on the side near the support body 40. The uneven structure can improve the physical adhesion of the heat insulation coating 32, allowing it to adhere more firmly to the electroplated layer 31. More preferably, the size of the uneven structure is at the micrometer level. Setting the size of the uneven structure to the micrometer level can avoid delamination, and at the micrometer level, it can increase the contact area and mechanical interlocking effect, achieving strong adhesion of the heat insulation coating 32, without affecting the uniformity of the heat insulation coating 32 and the overall thermal barrier performance due to excessive size.

[0024] In some other feasible embodiments, such as Figures 5 to 8 As shown, the heat shield layer 30 is a heat-insulating metal shell 50, which wraps around the magnet 10. Furthermore, the heat-insulating metal shell 50 is interference-fitted with the magnet 10, forming a microscopic spatial gap between them. The heat-insulating metal shell 50 has a thermal conductivity of 14.5-16.5 W / (m·K) and a specific heat capacity of 480-520 J / (kg·K). This configuration enables the heat-insulating metal shell 50 to form a heat shield structure, achieving a multi-layered heat insulation mechanism of "thermal absorption + contact thermal resistance + material thermal resistance." The specific working principle is as follows: Heat absorption mechanism of hot melt: Because the specific heat capacity of the heat-insulating metal shell 50 is 480-520J / (kg·K), which is relatively high, it will quickly absorb a large amount of heat at the moment of contact with molten plastic, forming a heat buffer, slowing down the rate at which heat is transferred to magnet 10, and protecting magnet 10 from damage.

[0025] Material thermal resistance mechanism: Because the thermal conductivity of the heat insulation metal shell is 14.5-16.5W / (m·K), which is relatively low, the thermal conductivity of the heat insulation metal shell 50 is also relatively poor. The low thermal conductivity significantly hinders the heat from being conducted from the outer wall to the inner wall of the heat insulation metal shell 50.

[0026] Contact thermal resistance mechanism: There is an air gap between the interface where the heat-insulating metal shell 50 and the magnet 10 are in contact. Even if the heat-insulating metal shell 50 and the magnet 10 are interference-fitted, there are still many tiny air gaps. The air in the air gap is an excellent heat insulator. The air gap constitutes a highly efficient "heat insulation layer" that can help the heat-insulating metal shell 50 prevent the external high temperature from being transferred to the magnet 10.

[0027] Under the action of the above three mechanisms, the damage of high temperature to magnet 10 can be effectively blocked. In addition, the magnet 10 and the heat-insulating metal shell 50 are assembled into an integral insert. This insert can be entered into the mold as a standard unit. This modular design transforms the complex heat insulation problem of magnet 10 into a structural problem and pressing process problem of a standard insert, which can greatly simplify the control difficulty of the injection molding process and improve the consistency and reliability of production.

[0028] Preferably, the heat-insulating metal outer shell 50 is made of austenitic stainless steel. Austenitic stainless steel is a non-magnetic ferromaterial with very low magnetic permeability, very close to that of air. It has almost no effect on the magnetic force of the magnet 10. It will not cause the magnet 10 to "magnetically short-circuit" like ordinary steel, nor will it provide a significant magnetic barrier. It is an excellent metal material with low thermal conductivity and high specific heat capacity.

[0029] Preferably, the wall thickness of the heat-insulating metal outer shell 50 is 0.2-0.5 mm, such as 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc. This size setting can achieve the heat insulation performance requirement that the demagnetization rate of the magnet 10 does not exceed 5%, while avoiding the size of the heat-insulating metal outer shell 50 being too large, ultimately achieving the goal of cost control.

[0030] In this embodiment, as Figure 9As shown, the heat-insulating metal casing 50 includes a casing body 51 and a cover 52. A placement cavity 511 is formed within the casing body 51, and a magnet 10 is placed within the placement cavity 511. One side of the placement cavity 511 is open. The cover 52 is connected to the casing body 51 and seals the opening of the placement cavity 511. This arrangement facilitates the installation of the magnet 10 within the heat-insulating metal casing 50. During installation, the magnet 10 is first installed in the placement cavity 511, and then the cover 52 is installed on the casing body 51 to seal the opening of the placement cavity 511.

[0031] To ensure the airtightness of the placement cavity 511 and prevent the molten material used to make the bracket body from entering the placement cavity 511 and damaging the magnet 10, in this embodiment, the cover 52 is connected to the outer shell body 51 by welding so that the gap between the cover 52 and the outer shell body 51 is sealed by welding material.

[0032] Optional, such as Figure 9 As shown, the edge of the opening of the placement cavity 511 is provided with a guide chamfer 512. This design facilitates the pressing of the magnet 10 into the placement cavity 511 and prevents the magnet 10 from being damaged by collision with the edge of the outer shell body 51. If the magnet 10 is fixed on the magnetic guide 20, the magnetic guide 20 is pressed together with the magnet 10 into the placement cavity 511.

[0033] In some embodiments where the heat shielding layer 30 includes an electroplated layer 31 and a heat-insulating coating 32, and the magnet 10 is fixed to the magnetic conductive element 20, the support body 40 is formed using an injection molding process, such as... Figure 4 As shown, the magnetic conductive component 20 is provided with a positioning groove 21, and the heat shielding layer 30 covers the hole wall of the positioning groove 21; the bracket body 40 is provided with a through hole 41 communicating with the positioning groove 21. The bracket also includes a filler 70, which fills the hole formed by the positioning groove 21 and the through hole 41. The side of the filler 70 away from the magnet 10 is flush with the outer surface of the bracket body 40. After the magnetic component composed of the magnet 10, the electroplating layer 31 and the heat insulation coating 32 are placed into the injection mold, the positioning groove 21 cooperates with the positioning structure in the injection mold to ensure that the magnetic component is accurately positioned in the injection mold, so that the bracket body 40 can be accurately injection molded on the outer surface of the magnetic component; after the bracket body 40 is injection molded, the bracket is obtained. After the bracket is pulled out of the injection mold, the part of the bracket body 40 corresponding to the positioning structure of the mold will form a through hole 41 communicating with the positioning groove 21. Subsequently, the hole consisting of the positioning groove 21 and the perforation 41 is sealed by the filler 70 to eliminate the adverse effect of the hole on the appearance of the bracket.

[0034] In some embodiments where the heat shielding layer 30 is a heat-insulating metal shell 50 and the magnet 10 is fixed to the magnetic conductive element 20, such as Figure 7As shown, the magnetic conductor 20 faces the cover 52, and the cover 52 has a positioning hole 521 corresponding to the positioning groove 21. The bracket body 40 has a through hole 41 communicating with the positioning hole 521. The bracket also includes a filler 70, which fills the hole formed by the communicating positioning hole 521 and the through hole 41. The side of the filler 70 away from the magnet 10 is flush with the outer surface of the bracket. After the magnetic component consisting of the magnet 10 and the heat-insulating metal shell 50 is placed into the injection mold, the positioning hole 521 and the positioning structure in the injection mold cooperate to ensure that the magnetic component is accurately positioned, so that the bracket body 40 can be accurately formed on the outer surface of the magnetic component. After the bracket body 40 is injection molded, the bracket is obtained. After the bracket is pulled out of the injection mold, due to the effect of the positioning structure, the part of the bracket body 40 corresponding to the positioning structure of the mold will have a through hole 41 communicating with the positioning hole 521. Subsequently, the holes consisting of the interconnected positioning holes 521 and the perforation 41 are sealed by the filler 70, which can reduce the adverse effects of the holes on the appearance of the bracket.

[0035] In some embodiments, such as Figure 1 and Figure 2 As shown, or as Figure 5 and Figure 8 As shown, the support also includes an outer coating 80, which covers the support body 40 and the filler 70. The outer coating 80 can conceal the filler 70, thereby further improving the aesthetics of the support. The thickness of the outer coating 80 is preferably 10–30 μm.

[0036] In other feasible embodiments, a patch may replace the filler 70 and the outer coating 80. The patch is applied to the outer surface of the support body 40 and covers the entire outer surface of the support body 40 and all openings. The patch may be, for example, Mylar, PET, etc.

[0037] In some embodiments, such as Figure 1 and Figure 2 As shown, or as Figure 5 and Figure 8 As shown, the bracket also includes a connector 60, which has a first part 61 and a second part 62 connected to each other. The first part 61 is connected to the bracket body 40, and the second part 62 is used to connect to an external structure. The connector 60 can be a hinge structure or other structure that can be rotatably connected to the accessory body. If the bracket includes an outer coating 80, the outer coating 80 can cover not only the outer surface of the filler 70 and the bracket body 40, but also the outer surface of the first part 61 of the connector 60, thus hiding the first part 61 of the connector 60 and improving the overall aesthetics of the bracket.

[0038] The present invention also provides an electronic device accessory, which includes an accessory body and a bracket as shown in the above embodiment, the bracket being rotatably connected to the electronic accessory body.

[0039] Because the electronic device accessories include the bracket shown in the above embodiment, they have the beneficial effects of the bracket shown in the above embodiment.

[0040] The present invention also provides a method for manufacturing a support, such as Figure 10 As shown, the method for manufacturing this support includes the following steps: S20, Provides 10 magnets; S30. A heat shielding layer 30 is processed on the surface of the magnet 10 to enclose the magnet 10, thereby obtaining a magnetic component; S70. The bracket body 40 is injection molded onto the magnetic component using an injection molding process to obtain the bracket.

[0041] The bracket manufacturing method of this application is simple in steps. First, a heat shielding layer 30 is processed on the outer surface of the magnet 10 to obtain a magnetic component. Then, the bracket body 40 is injection molded onto the magnetic component to obtain the bracket. Moreover, in this bracket manufacturing method, the heat shielding layer 30 is pre-processed on the surface of the magnet before the bracket body 40 is injection molded. This heat shielding layer 30 can effectively block the transfer of heat energy from the high-temperature melt to the magnet 10, significantly reducing the peak temperature of the magnet 10 during the molding process, thereby ensuring the integrity and long-term stability of its magnetic properties under high-temperature environments. Furthermore, this manufacturing method integrates the magnet 10 and the heat shielding layer 30 into a single insert. This insert enters the injection mold as a standard unit, simplifying the control difficulty of the injection molding process and improving production consistency and reliability.

[0042] In some embodiments, such as Figure 11 As shown, step S20 includes the following steps: S21. Select a preset number of magnets, 10; S22. Arrange and fix the magnets 10 on the magnetic conductor 20.

[0043] In S21, a magnet 10 of the required shape is provided. Conventional magnets such as N52 magnets may demagnetize at high temperatures, so a magnet 10 grade with a high operating temperature, such as N52SH, is selected. In S20, the magnet 10 can be fixed to the magnetic conductor 20 by magnetic attraction and adhesion, or it can be fixed to the magnetic conductor 20 by magnetic attraction alone. The magnetic conductor 20 has a ring-shaped sheet structure, and multiple magnets 10 are fixed on each magnetic conductor 20. The number of magnetic conductors 20 can be one or at least two. When the number of magnetic conductors 20 is at least two, the number of magnets 10 on each magnetic conductor 20 is arranged equally. The magnetic conductor 20 is provided with a positioning groove 21, which is used to cooperate with the positioning structure of the injection mold, so that the magnetic component composed of the magnet 10, the electroplated layer 31 and the heat insulation coating 32 can be accurately positioned in the injection mold, thereby enabling the support body 40 to be accurately injection molded on the outer surface of the magnetic component.

[0044] In some embodiments, in step S30, the heat shield layer 30 includes an electroplated layer 31 and a heat insulation coating 32, such as Figure 12 As shown, step S30 specifically includes the following steps: S31a. An electroplating layer 31 is formed on the surface of the magnet 10 by an electroplating process; Specifically, the electroplating layer 31 encapsulates each magnet 10. If the magnet 10 is fixed to the magnetic conductive component 20, and the magnetic conductive component 20 has a positioning groove 21, the electroplating range should be extended to cover the entire outer surface of the magnetic conductive component 20. Simultaneously, it should be ensured that the walls of the positioning groove 21 are also completely encapsulated by the electroplating layer 31 to form a continuous, defect-free electroplating layer 31. It should be noted that the electroplating process should not completely fill the positioning groove 21; its internal space should be preserved so that the positioning groove 21 can still perform its precise positioning function in subsequent injection molding processes. The electroplating process adopts a nickel-copper-nickel three-layer composite electroplating layer 31 structure, where the bottom layer is a nickel plating layer to enhance the adhesion to the substrate, the middle layer is a copper plating layer to provide conductive buffering, and the top layer is a nickel plating layer to ensure corrosion resistance.

[0045] S34a, A heat-insulating coating 32 is formed by spraying on the surface of the electroplated layer 31 through a spraying process.

[0046] Optionally, after step S31a and before step S34a, the following step is also included: S32a, inspection of electroplated layer 31.

[0047] Specifically, after the electroplated layer 31 is formed, the inspection of whether the formed electroplated layer 31 meets the requirements requires that the electroplated layer 31 strictly meet the "three no's and one clean" standard, as follows: Oil-free: The surface must be free of contaminants such as grease and mold release agents; Rust-free: Electroplating layer 31 must completely cover the substrate to avoid oxidation or corrosion defects; No peeling of electroplated layer 31: The electroplated layer 31 is firmly bonded to the substrate, with no peeling or flaking. Surface clean and free of impurities: The surface of the electroplated layer 31 is smooth and uniform, free of defects such as particles, bubbles, or scratches. If the electroplated layer 31 does not meet the above standards, it shall be returned to S31a and electroplated again.

[0048] Furthermore, after step S32a and before step S34a, the procedure also includes step S33a, pretreatment of the electroplated layer 31. Wherein, as... Figure 13 As shown, the pretreatment of electroplated layer 31 includes the following steps: S331, surface cleaning of electroplated layer 31; Use high-purity volatile solvents, such as acetone and isopropanol, preferably low-residue solvents, and use a lint-free cloth to thoroughly clean the outer surface of the electroplated layer 31 by "one-way wiping" to remove all contaminants such as fingerprints, grease, and dust particles, and avoid residues affecting coating adhesion. You can repeat wiping 2-3 times to ensure cleaning effect.

[0049] S332, Roughening treatment: The outer surface of the electroplated layer 31 is roughened to form an uneven structure; Specifically, the side of the electroplated layer 31 facing away from the magnet 10 is relatively smooth. This side is roughened to create a textured structure, increasing the bonding area between the heat-insulating coating 32 and the electroplated layer 31, thus increasing the adhesion of the heat-insulating coating 32. Preferably, a uniform micro-textured textured structure is constructed through micron-level roughening to enhance the physical adhesion of the heat-insulating coating 32 to the electroplated layer 31. The textured structure can be processed using two methods: sandblasting with fine white corundum abrasive for gentle sandblasting, controlling the air pressure and blasting time to avoid excessive impact; and chemical etching using a special chemical etchant for the heat-insulating coating 32, strictly following the etchant instructions to control the processing time and temperature. The resulting textured structure must be evenly distributed, with no obvious scratches or pitting visible to the naked eye, and must not damage the underlying nickel-copper-nickel electroplated layer, i.e., no exposed substrate and no peeling of the electroplated layer 31.

[0050] S333, Cleaning and drying after roughening; Specifically, after the surface roughening is completed, the above-mentioned high-purity solvent is used again to wipe away the sand particles, etching residues and other substances generated during the roughening process. After cleaning, the structure composed of magnet 10 and electroplated layer 31 is placed in an oven and dried at a low temperature of 60-80℃. The drying time is adjusted according to the size of the structure composed of magnet 10 and electroplated layer 31 (usually 30-60 minutes) to ensure that the surface of the structure composed of magnet 10 and electroplated layer 31 is completely free of moisture residue. After drying, it is cooled to room temperature before proceeding to the next process.

[0051] In some embodiments of this application, such as Figure 14As shown, step S34a further includes the following steps: S341. Coating preparation: Mix the coating and thinner according to a preset ratio and stir to obtain the coating, wherein the stirring time is greater than or equal to 10 minutes. Specifically, the coating is selected from polymeric thermal insulation materials with a thermal conductivity of less than 0.2 W / (m·K). These materials can be made from one or more of the following: high-temperature epoxy resin, polyetheretherketone (PEEK), and Teflon. During coating preparation, it is ensured that the coating is completely uniform, free of flocculation and undispersed particles. Furthermore, filtration is performed during or after stirring to further remove impurities.

[0052] S342. Viscosity test: Use a viscometer to measure the viscosity of the coating to ensure that the viscosity of the coating is within the preset range. If the viscosity of the coating is not within the preset range, adjust the ratio of thinner to correct the viscosity. S343. Fixture fixing: Securely install magnet 10 on the rotating fixture to ensure that all surfaces to be sprayed are unobstructed and do not loosen during rotation; S344. Spraying operation: Start the spray gun, calibrate the key parameters to the preset values, keep the distance between the spray gun and the surface of the magnet 10 at 15-25 cm, and spray at a uniform speed and a smooth straight or circular trajectory to prevent local heat insulation coating 32 from accumulating.

[0053] S345. Thickness monitoring: During the spraying process, the thickness of the heat insulation coating 32 is sampled and tested, or after spraying and before curing, the thickness of the heat insulation coating 32 is tested. The thickness of the heat insulation coating 32 is controlled within the range of 15-30 micrometers by adjusting the number of spraying passes and the spray gun flow rate.

[0054] Optionally, step S344 may further include the following steps: First, spray on a layer of primer; Let it stand for 5-10 minutes to allow the primer surface to dry; Spray 1-2 coats of topcoat over the primer.

[0055] Specifically, a very thin layer of primer is first sprayed to enhance the adhesion of subsequent coatings. After the primer surface dries, 1-2 layers of topcoat are sprayed to ensure no missed areas or dead corners, so that the heat insulation coating 32 can completely cover the outer surface of the electroplated layer 31.

[0056] Optionally, after step S34a, the following step is also included: S35a, curing the heat insulation coating 32.

[0057] Specifically, in step S35a, such as Figure 15 As shown, the curing process includes the following steps: S351. After the spraying is completed, leave magnet 10 in a dust-free environment for 10-20 minutes. S352. Transfer magnet 10 to an oven and preheat it at 100°C for 15-20 minutes to allow the solvent in the coating to evaporate slowly. S353. Gradually increase the temperature to the coating sintering temperature, and hold the temperature at this temperature for 20-30 minutes to ensure that the coating is fully cross-linked and cured. S354. Turn off the heating and allow magnet 10 to cool naturally to room temperature with the oven.

[0058] During the curing process, the temperature difference between different areas inside the oven must be less than or equal to 5°C, and the oven exhaust function must be turned on during the curing process.

[0059] Optionally, before step S20, the following steps are also included: S10, equipment environment preparation and coating selection.

[0060] Specifically, in the equipment environment preparation, the necessary equipment is prepared, including a precision spray gun, a curing oven, ventilation facilities, and special hanging fixtures. The precision spray gun is used to spray paint onto the outer surface of the electroplated layer 31 to form a heat-insulating coating 32 on the outer surface of the electroplated layer 31, thus obtaining a magnetic component. The curing oven is used to dry the sprayed heat-insulating coating 32. The ventilation facilities are used to remove volatile substances generated during spraying. The special hanging fixtures are used to clamp the structure to be composed of the magnet 10 and the electroplated layer 31 to avoid obstructing the spraying surface.

[0061] The coating material can be made from one or more of the following: high-temperature epoxy resin, polyetheretherketone, and Teflon. The selected coating material must meet the following three characteristics: High temperature resistance: Short-term tolerance temperature must exceed 300℃; High insulation: The insulation resistance of the finished product must meet the standard; Low coefficient of friction: meets the friction requirements of the product's usage scenarios.

[0062] In some other embodiments, the heat shielding layer 30 is a heat-insulating metal outer shell 50, therefore, as Figure 16 Step S30 shown includes: S31b. The shape of the heat-insulating metal shell 50 is designed according to the shape of the magnet 10. The heat-insulating metal shell 50 includes a shell body 51 and a cover 52. A placement cavity 511 is formed inside the shell body 51. The bottom is closed and the top is open. A guide chamfer 512 is provided at the edge of the open. Specifically, the thermal insulation metal shell 50 is preferably made of a metal material with a thermal conductivity of 14.5-16.5 W / (m·K) and a specific heat capacity of 480-520 J / (kg·K), such as austenitic stainless steel. 304 or 316 austenitic stainless steel are the optimal choices, as their thermal conductivity is far superior to aluminum or copper, effectively blocking heat transfer in subsequent processes. A guide chamfer 512 is provided at the open edge to facilitate the subsequent pressing of the magnet 10 into the placement cavity 511 and to prevent damage to the magnet 10 from impact with the edge of the shell body 51. In the design of the thermal insulation metal shell 50, the wall thickness is determined through thermal analysis and structural strength calculations, with a typical range of 0.2-0.5 mm. This thickness range ensures the thermal insulation effect without making the size of the thermal insulation metal shell 50 too large. Too thin a wall will reduce the thermal insulation effect, while too thick a wall will increase the overall size and production cost; precise control is required.

[0063] S32b. The heat-insulating metal shell 50 is manufactured by stamping or machining, wherein the wall thickness of the heat-insulating metal shell 50 is in the range of 0.2-0.5 mm, and the dimensional tolerance must be controlled within ±0.01 mm; Specifically, the heat-insulating metal shell 50 is manufactured using high-precision stamping or machining. Strict guarantees are maintained for the smoothness and roundness of the inner wall of the heat-insulating metal shell 50, with dimensional tolerances controlled within ±0.01 mm. These requirements are crucial for ensuring smooth assembly and the final product performance. The shell body 51 and the cover 52 are machined separately. The cover 52 has positioning holes 521 machined for injection molding positioning. These positioning holes 521 engage with the positioning structure in the injection mold to position the magnetic components subsequently placed in the mold, ensuring the precise forming of the support body 40. The positioning holes 521 can be machined by cutting and drilling.

[0064] S33b, Fix the outer casing 51 onto the press-fit fixture with the opening of the outer casing 51 facing upwards, and precisely place the magnet 10 directly above the opening.

[0065] S34b, Press the magnet 10 vertically into the outer casing 51 at a constant low speed of 1-5 mm / s; Specifically, a precision press (such as a pneumatic press or a servo press) is started to ensure stable and controllable pressure output. The press head vertically presses the magnet 10 into the placement cavity 511 of the housing body 51 at a constant low speed of 1-5 mm / s, minimizing the impact of mechanical stress on the magnet 10.

[0066] The pressure-displacement curve of magnet 10 is recorded in real time by pressure and displacement sensors. During normal pressing, the pressure-displacement curve rises steadily. If fluctuations occur in the pressure-displacement curve, the machine must be stopped immediately for inspection. Specifically, the press is equipped with pressure and displacement sensors. During the pressing process of magnet 10 into the placement cavity 511 of the outer casing 51, the pressure sensor measures the pressure change on magnet 10, and the displacement sensor measures the depth of magnet 10 into the placement cavity 511, recording the pressure-displacement curve in real time. During normal pressing, the pressure-displacement curve should rise steadily. If a sudden increase in pressure occurs, the machine must be stopped immediately for inspection, as there may be a risk of jamming or breakage of magnet 10.

[0067] S35b When the pressure reaches the preset value, it is determined that the pressing is in place. At this time, the bottom of the magnet 10 is in contact with the bottom of the placement cavity 511. S36b, Weld the edge of the cover 52 to the edge of the opening and fix it, and seal the placement cavity 511 with the cover 52.

[0068] In some embodiments, step S70 further includes: The mold design incorporates a dedicated magnet cavity for the magnetic component. This cavity is connected to the main runner and the cavity body (primarily used to form the support body 40) via narrow flow channels. This prevents the high-temperature molten metal from directly and extensively impacting the magnetic component. An efficient cooling water system is designed around the magnetic component. During the pre-, mid-, and post-injection stages, the magnetic component is continuously and forcibly cooled with cooling water (even chilled water from an ice machine) to ensure that the magnet 10 remains below a safe temperature. A vacuum exhaust structure is incorporated into the mold. Air around the magnetic component can form hotspots when heated; a good vacuum exhaust system removes air, reduces thermal resistance, and ensures more uniform cooling.

[0069] Injection molds are manufactured according to the design; The magnetic component is placed into the magnet cavity of the injection mold. A hot runner system is used, along with a valve needle, to control the timing and speed at which the raw material melt used to make the support body 40 enters the cavity body, thereby forming the support body 40 that encloses the magnetic component.

[0070] Optionally, in injection molding, provided that the molten material can fully fill the mold cavity, the barrel temperature for placing the molten material is 280°C-300°C. This temperature range is significantly lower than the conventional melt temperature of 300°C-350°C, thereby reducing the risk of melt thermal degradation and avoiding material performance deterioration caused by molecular chain breakage; it also reduces energy consumption and inhibits material oxidation caused by high temperatures during injection molding.

[0071] Optionally, the mold temperature can be adjusted to a higher range, such as 120°C-150°C. A higher mold temperature prevents the molten material from cooling too quickly upon contact with the mold surface, allowing for a lower molten material temperature and enabling faster injection speeds for filling. The purpose of this design is to allow the molten material to flow quickly over the surface of the magnetic component, preventing it from lingering on the surface and transferring heat to the component. This avoids the negative impact of high temperatures on the magnetic component and also results in a smoother product surface, reducing fiber sludge.

[0072] Optionally, high injection speed and high injection pressure are used to instantly fill the mold cavity with the high-temperature molten material. The technical principle is to complete the filling before the magnet 10 absorbs a large amount of heat, significantly reducing heat transfer time; avoiding melt cooling and solidification caused by slow filling, thus ensuring the structural integrity of the product. Preferably, the speed at which the molten material enters the mold cavity is 90%-100% of the maximum injection speed of the injection molding machine. The injection pressure is above 80% of the maximum pressure of the injection molding machine, and the filling time is 0.2-0.6 seconds.

[0073] Optionally, the pressure inside the cavity of the injection mold is controlled at 20%-40% of the injection pressure, and the pressure is maintained for 0.5-1 second. This setting can reduce the heat transfer from the raw material melt to the mold during the holding pressure stage, reduce the total heat input to the injection mold, and avoid the accumulation of internal stress in the material due to excessive holding pressure, thereby reducing the risk of product deformation.

[0074] Optionally, before placing the magnetic component into the injection mold, preheat it to 80°C-100°C in an oven. The purpose of preheating is twofold: one is to remove any moisture that may be adsorbed on the surface of the magnetic component, and the other is to reduce the temperature difference between the magnet 10 in the magnetic component and the raw material melt, thereby reducing thermal shock and preventing the magnet 10 from cracking due to excessive instantaneous temperature difference. It can also slightly reduce the heat absorbed by the magnet 10 from the raw material melt.

[0075] In some embodiments, such as Figure 10As shown, after step S30 and before step S70, the following step is also included: S40, inspecting the magnetic components. If the heat shielding layer 30 includes an electroplated layer 31 and a heat insulation coating 32, then S40 specifically involves inspecting the heat insulation coating 32. The inspection of the heat insulation coating 32 is carried out in three ways. The first method is visual inspection. Under strong light, the surface of the heat insulation coating 32 is inspected visually or with a 10x magnifying glass. If the surface is smooth, the color is uniform, there are no bubbles, no particulate impurities, no drips, no peeling, no scratches, and the thickness of the heat insulation coating 32 in all test areas is within the specification range of 15-30μm, without exceeding the upper or lower limit, then it is considered qualified. The second method is a random adhesion test, using the cross-cut adhesion test (ISO 2409 standard) – using a utility knife to make 100 squares of 1 mm × 1 mm on the coating surface, from the heat insulation coating 32 to the electroplated layer 31, applying 3M special test tape, pressing firmly and then quickly peeling it off; if the area of ​​heat insulation coating 32 peeling off is <5%, it is qualified; the third method is a random insulation test, using a megohmmeter to randomly select magnet 10 to check the heat insulation coating 32, measuring whether the resistance of the heat insulation coating 32 is greater than 100MΩ to detect whether the heat insulation coating 32 meets the standard.

[0076] If the heat shield layer 30 is a heat-insulating metal outer shell 50, then S40 specifically refers to a comprehensive inspection after press-fitting. The comprehensive inspection after press-fitting includes the following inspection methods: Dimensional accuracy verification: Use calipers, height gauges or coordinate measuring machines to check the overall height and key dimensions of the finished product to ensure that it conforms to the design drawings. Appearance quality inspection: Visually inspect the heat-insulating metal casing 50 with the aid of a magnifying glass to confirm that there are no appearance defects such as dents, scratches, or deformation. Internal sampling inspection: Non-destructive testing was performed using an X-ray imaging instrument to verify whether the installation position of magnet 10 inside the heat-insulating metal shell 50 was accurate, and to check whether hidden cracks were caused inside magnet 10 due to pressure stress.

[0077] Furthermore, such as Figure 10 As shown, after step S30 and before step S70, the following step is also included: S50, packing the qualified magnetic components into a packaging box.

[0078] Specifically, the inspected and qualified magnetic components are packaged in boxes primarily to facilitate storage and handling, protecting them from external damage during storage and transportation. Qualified magnetic components must be placed in anti-static, individually divided boxes (such as those with pearl cotton dividers), with each component placed separately to prevent collisions and friction during transportation and storage, which could scratch the heat-insulating metal casing 50. After packaging, they must be stored in a dry, ventilated environment free of corrosive gases to prevent high temperature and humidity from affecting the performance of the heat-insulating metal casing 50.

[0079] Furthermore, such as Figure 10 As shown, after step S50, the process includes step S60: removing the magnetic component from the packaging box during injection molding. This step is mainly to prepare the magnetic component for injection molding.

[0080] In some embodiments, the bracket further includes a connector 60, which includes a first portion 61 and a second portion 62 connected to each other. The first portion 61 is used to connect to the bracket body 40, and the second portion 62 is used to rotatably connect to an electronic device, an accessory body of an electronic device accessory, or other structure. Electronic devices include, for example, power banks, mobile phones, and tablets, while accessory bodies include, for example, protective cases.

[0081] Therefore, as Figure 10 As shown, after step S70, the following step is also included: S80, a connector 60 is provided, the connector 60 including a first part 61 and a second part 62 that are connected to each other.

[0082] S90. Connect the first part 61 of the connector 60 to the bracket body 40.

[0083] In step S80, the first part 61 is connected to one side of the support body 40 along its own thickness direction. In step S90, the first part 61 can be connected to the support body 40 by riveting, screws, or fasteners.

[0084] In some embodiments where the heat shielding layer 30 includes an electroplated layer 31 and a heat insulation coating 32, and the magnetic conductive component 20 is provided with a positioning groove 21, in step S70, a through hole 41 communicating with the positioning groove 21 is formed on the bracket body 40, and the communicating positioning groove 21 and through hole 41 form a hole. During injection molding, after the magnetic component composed of the magnet 10, the electroplated layer 31 and the heat insulation coating 32 is placed into the injection mold, the positioning groove 21 cooperates with the positioning structure in the injection mold to ensure that the magnetic component is accurately positioned in the injection mold, so that the bracket body 40 can be accurately injection molded on the outer surface of the magnetic component; after the bracket body 40 is injection molded, the bracket is obtained. After the bracket is pulled out from the injection mold, the through hole 41 communicating with the positioning groove 21 will be formed on the part of the bracket body 40 corresponding to the positioning structure of the mold.

[0085] Furthermore, such as Figure 12 As shown, after step S60, the following steps are included: S100, closing the hole formed by the interconnected positioning groove 21 and the through hole 41 by filling body 70.

[0086] Specifically, the holes are first filled with filler (such as epoxy resin) to form filler 70 inside the holes, and then the surface of filler 70 is polished to ensure that filler 70 is flush with the surface of the support.

[0087] Furthermore, after step S100, the process also includes step S110: spraying the bracket to form an outer coating 80 covering the bracket body 40 and the filler 70 on the outer surface of the bracket.

[0088] After the holes are filled, the bracket is then sprayed with a coating according to requirements to form a shape such as... Figure 4 The outer coating 80 shown covers the entire support structure, blocking the filler 70 and achieving the beneficial effect of sealing the holes and beautifying the entire support structure. The thickness of the outer coating 80 is generally 10 to 30 μm.

[0089] In other feasible embodiments, step S100 can be replaced by directly attaching a patch to the entire outer surface of the support to form an outer protective layer, which covers the outer surface of the support body 40 and the filler 70. This also achieves the effect of beautifying the support. The patch can be, for example, Mylar or PET sheet.

[0090] Steps S80 and S90 can be performed before or after step S70. If it is before step S70, the first part 61 of the connector 60 is exposed outside the bracket. If it is after step S80, the outer coating 80 still covers the first part 61 of the connector 60. Then S100 can be: spraying the bracket to form an outer coating 80 covering the bracket body 40, the filler 70 and the first part 61 of the connector 60 on the outer surface of the bracket.

[0091] In some embodiments where the heat shielding layer 30 is a heat-insulating metal shell 50 and the heat-insulating metal shell 50 is provided with positioning holes 521, in step S70, a through hole 41 communicating with the positioning hole 521 is formed on the bracket body 40, and the communicating positioning hole 521 and through hole 41 form a hole. During injection molding, after the magnetic component composed of magnet 10 and heat-insulating metal shell 50 is placed into the injection mold, the positioning hole 521 cooperates with the positioning structure in the injection mold to ensure that the magnetic component is accurately positioned in the injection mold, so that the bracket body 40 can be accurately injection molded on the outer surface of the magnetic component; after the bracket body 40 is injection molded, the bracket is obtained. After the bracket is pulled out from the injection mold, the through hole 41 communicating with the positioning hole 521 will be formed on the part of the bracket body 40 corresponding to the positioning structure of the mold.

[0092] Furthermore, such as Figure 16 As shown, after step S60, the following steps are included: S100, sealing the hole formed by the interconnected positioning hole 521 and perforation 41 assembly by filling material.

[0093] Specifically, the holes are first filled with filler (such as epoxy resin) to form filler 70 inside the holes, and then the surface of filler 70 is polished to ensure that filler 70 is flush with the surface of the support.

[0094] Furthermore, after step S100, the process also includes step S110: spraying the bracket to form an outer coating 80 covering the bracket body 40 and the filler 70 on the outer surface of the bracket.

[0095] Steps S80 and S90 can be performed before or after step S70. If it is before step S70, the first part 61 of the connector 60 is exposed outside the bracket. If it is after step S80, the outer coating 80 still covers the first part 61 of the connector 60. Then S100 is specifically: spraying the bracket to form an outer coating 80 covering the bracket body 40, the filler 70 and the first part 61 of the connector 60 on the outer surface of the bracket.

[0096] In other feasible embodiments, step S100 can be replaced by directly attaching a patch to the entire outer surface of the support to form an outer protective layer, which covers the outer surface of the support body 40 and the filler 70. This also achieves the effect of beautifying the support. The patch can be, for example, Mylar or PET film.

[0097] The following examples illustrate the method for manufacturing the support structure according to the present invention.

[0098] Example 1 like Figures 1 to 4As shown, the support to be manufactured in this embodiment includes a magnetic component and a support body 40. The support body 40 is formed outside the magnetic component so that the magnetic component is embedded inside the support body 40. The magnetic component includes a magnet 10 and a heat shielding layer 30. The heat shielding layer 30 wraps around the surface of the magnet 10 and separates the magnet 10 from the support body 40. The heat shielding layer 30 includes an electroplated layer 31 and a heat insulation coating 32. The electroplated layer 31 is attached to the surface of the magnet 10 by an electroplating process, and the heat insulation coating 32 wraps around the electroplated layer 31.

[0099] The magnetic component also includes a magnetic conductor 20, which is an arc-shaped sheet structure. Multiple magnets 10 are fixed on the magnetic conductor 20 and are arranged sequentially along the length of the magnetic conductor 20.

[0100] The magnetic conductor 20 has a positioning groove 21 on the side facing away from the magnet 10, and the heat shielding layer 30 covers the hole wall of the positioning groove 21; the bracket body 40 has a through hole 41 that connects to the positioning groove 21, and the bracket also includes a filler 70, which fills the hole formed by the connected positioning groove 21 and the through hole 41.

[0101] The bracket also includes a connector 60, which includes a first part 61 and a second part 62 connected to each other. The first part 61 is connected to one side of the bracket body 40.

[0102] The bracket also includes an outer coating 80, which covers the first part 61 of the bracket body 40, the filler 70 and the connector 60.

[0103] like Figure 12 As shown, the method for manufacturing the support in this embodiment includes the following steps: S10. Equipment environment preparation and coating selection.

[0104] S21. Select a preset number of magnets, 10; S22. Arrange and fix the magnets 10 on the magnetic guide 20, which has a positioning groove 21.

[0105] S31a. An electroplating layer 31 is formed on the surface of the magnet 10 by an electroplating process; S32a, Electroplating layer 31 inspection.

[0106] S33a, Electroplating layer 31 pretreatment.

[0107] S34a, A heat-insulating coating 32 is formed by spraying on the surface of the electroplated layer 31 through a spraying process.

[0108] S35a, Curing the heat insulation coating 32.

[0109] S40, Insulation Coating 32 Inspection.

[0110] S50. Pack the qualified magnetic components into a packaging box.

[0111] S60. Remove the magnetic components from the packaging box during injection molding.

[0112] S70. The bracket body 40 is injection molded on the magnetic component by injection molding process to obtain the bracket, wherein the bracket body 40 has a through hole 41 that connects to the positioning groove 21.

[0113] S80, a connector 60 is provided, the connector 60 including a first part 61 and a second part 62 that are connected to each other.

[0114] S90. Connect the first part 61 of the connector 60 to the bracket body 40.

[0115] S100, the hole consisting of the interconnected positioning groove 21 and the perforation 41 is closed by the filler 70.

[0116] S110, Spray coating the bracket to form an outer coating 80 on the outer surface of the bracket, covering the first part 61 of the bracket body 40, the filler 70 and the connector 60.

[0117] Among them, such as Figure 13 As shown, step S33 specifically includes the following steps: S331, surface cleaning of electroplated layer 31; S332, Roughening treatment: The outer surface of the electroplated layer 31 is roughened to form an uneven structure; S333, Cleaning and drying after roughening.

[0118] like Figure 14 As shown, step S34a specifically includes the following steps: S341. Coating preparation: Mix the coating and thinner according to a preset ratio and stir to obtain the coating, wherein the stirring time is greater than or equal to 10 minutes. S342. Viscosity test: Use a viscometer to measure the viscosity of the coating to ensure that the viscosity of the coating is within the preset range. If the viscosity of the coating is not within the preset range, adjust the ratio of thinner to correct the viscosity. S343. Fixture fixing: Securely install magnet 10 on the rotating fixture to ensure that all surfaces to be sprayed are unobstructed and do not loosen during rotation; S344. Spraying operation: Start the spray gun, calibrate the key parameters to the preset values, keep the distance between the spray gun and the surface of magnet 10 at 15-25 cm, and spray in a uniform speed and a smooth straight or circular trajectory. S345. Thickness monitoring: During the spraying process, the thickness of the heat insulation coating 32 is sampled and tested, or after spraying and before curing, the thickness of the heat insulation coating 32 is tested. The thickness of the heat insulation coating 32 is controlled within the range of 15-30 micrometers by adjusting the number of spraying passes and the spray gun flow rate.

[0119] like Figure 15 As shown, step S35 specifically includes the following steps: S351. After the spraying is completed, leave magnet 10 in a dust-free environment for 10-20 minutes. S352. Transfer magnet 10 to an oven and preheat it at 100°C for 15-20 minutes to allow the solvent in the coating to evaporate slowly. S353, gradually increase the temperature to the special coating sintering temperature, and hold the temperature at this temperature for 20-30 minutes to ensure that the coating is fully cross-linked and cured; S354. Turn off the heating and allow magnet 10 to cool naturally to room temperature with the oven.

[0120] In step 70, the following scheme is adopted during injection molding: 1. Under the premise of ensuring that the raw material melt can fully fill the main body of the mold cavity, the barrel temperature for placing the raw material melt is 280°C-300°C. This temperature range is significantly lower than the melt temperature of 300°C-350°C in conventional processes, thereby reducing the risk of melt thermal degradation and avoiding material performance deterioration caused by molecular chain breakage; at the same time, it can reduce energy consumption and inhibit material oxidation caused by high temperature during injection molding.

[0121] 2. Optionally, the mold temperature can be adjusted to a higher range, such as 120°C-150°C. A higher mold temperature prevents the molten material from cooling too quickly upon contact with the mold surface, allowing for a lower molten material temperature and enabling faster injection speeds for filling. The purpose of this design is to allow the molten material to flow quickly over the surface of the magnetic component, preventing it from lingering on the surface and transferring heat to the magnetic component. This avoids the negative impact of high temperatures on the magnetic component and also results in a smoother product surface, reducing fiber sludge.

[0122] 3. High injection speed and high injection pressure are used to instantly fill the mold cavity with high-temperature molten raw material. The technical principle is to complete the filling before the magnet 10 absorbs a large amount of heat, significantly reducing heat transfer time; avoiding melt cooling and solidification caused by slow filling, ensuring the integrity of the product structure. Preferably, the speed at which the molten raw material enters the main body of the mold cavity is 90%-100% of the maximum injection speed of the injection molding machine. The injection pressure is more than 80% of the maximum pressure of the injection molding machine, and the filling time is 0.2-0.6 seconds.

[0123] 4. The pressure inside the cavity of the injection mold is controlled at 20%-40% of the injection pressure, and the pressure is maintained for 0.5-1 second. This setting can reduce the heat transfer from the raw material melt to the mold during the holding pressure stage, reduce the total heat input to the injection mold, and avoid the accumulation of internal stress in the material due to excessive holding pressure, thereby reducing the risk of product deformation.

[0124] 5. Before placing the magnetic components into the mold, preheat them to 80°C-100°C in an oven. The purpose of preheating is twofold: first, to remove any moisture that may be adsorbed on the surface of the high-temperature resistant magnet 10 insert; and second, to reduce the temperature difference between the magnet 10 in the high-temperature resistant magnet 10 insert and the melt, thereby reducing thermal shock and preventing the magnet 10 from cracking due to excessive instantaneous temperature difference. It also slightly reduces the heat absorbed by the magnet 10 from the melt.

[0125] Example 2: like Figures 5 to 9 As shown, the support structure to be manufactured in this embodiment includes a magnetic component and a support body 40. The support body 40 is formed outside the magnetic component so that the magnetic component is embedded inside the support body 40. The magnetic component includes a magnet 10 and a heat shielding layer 30. The heat shielding layer 30 wraps around the surface of the magnet 10 and separates the magnet 10 from the support body 40. The heat shielding layer 30 is a heat-insulating metal shell 50, which wraps around the magnet 10. The thermal conductivity of the heat-insulating metal shell 50 is 14.5-16.5 W / (m·K), and the specific heat capacity is 480-520 J / (kg·K).

[0126] The heat-insulating metal casing 50 includes a casing body 51 and a cover 52. A placement cavity 511 is formed inside the casing body 51. A magnet 10 is placed inside the placement cavity 511. One side of the placement cavity 511 is open, and a guide chamfer 512 is provided at the edge of the open side. The cover 52 is connected to the casing body 51 and covers the open side of the placement cavity 511.

[0127] The magnetic component also includes a magnetic conductor 20, which is an arc-shaped sheet structure. Multiple magnets 10 are fixed on the magnetic conductor 20 and are arranged sequentially along the length of the magnetic conductor 20.

[0128] The cover 52 of the heat-insulating metal shell 50 is provided with a positioning hole 521; the bracket body 40 is provided with a through hole 41 that connects to the positioning hole 521; the bracket also includes a filler 70, which fills the hole formed by the connected positioning hole 521 and the through hole 41.

[0129] The bracket also includes a connector 60, which includes a first part 61 and a second part 62 connected to each other. The first part 61 is connected to one side of the bracket body 40.

[0130] The bracket also includes an outer coating 80, which covers the first part 61 of the bracket body 40, the filler 70 and the connector 60.

[0131] like Figure 16 As shown, the method for manufacturing the support in this embodiment includes the following steps: S21. Select a preset number of magnets, 10.

[0132] S22. Arrange and fix the magnets 10 on the magnetic conductor 20.

[0133] S31b. The shape of the heat-insulating metal shell 50 is designed according to the shape of the magnet 10. The heat-insulating metal shell 50 includes a shell body 51 and a cover 52. A placement cavity 511 is formed inside the shell body 51. The bottom is closed and the top is open. A guide chamfer 512 is provided at the edge of the open. The cover 52 has a positioning hole 521.

[0134] S32b. The heat-insulating metal shell 50 is manufactured by stamping or machining. The wall thickness of the heat-insulating metal shell 50 is in the range of 0.2-0.5 mm, and the dimensional tolerance must be controlled within ±0.01 mm.

[0135] S33b, Fix the outer casing 51 onto the press-fit fixture with the opening of the outer casing 51 facing upwards, and precisely place the magnet 10 directly above the opening.

[0136] S34b: Press the magnet 10 vertically into the outer casing 51 at a constant low speed of 1-5 mm / s.

[0137] S35b When the pressure reaches the preset value, it is determined that the pressing is in place. At this time, the bottom of the magnet 10 is in contact with the bottom of the placement cavity 511.

[0138] S36b, Weld the edge of the cover 52 to the edge of the opening and fix it, and seal the placement cavity 511 with the cover 52.

[0139] S40. Comprehensive inspection after pressing.

[0140] S50. Pack the qualified magnetic components into a packaging box.

[0141] S60. Remove the magnetic components from the packaging box during injection molding.

[0142] S70. The bracket body 40 is injection molded on the magnetic component through injection molding process to obtain the bracket, wherein the bracket body 40 has a through hole 41 that connects to the positioning hole 521.

[0143] S80, a connector 60 is provided, the connector 60 including a first part 61 and a second part 62 that are connected to each other.

[0144] S90. Connect the first part 61 of the connector 60 to the bracket body 40.

[0145] S100, the hole formed by the interconnected positioning hole 521 and perforation 41 is closed by the filler 70.

[0146] S110, Spray coating the bracket to form an outer coating 80 on the outer surface of the bracket, covering the first part 61 of the bracket body 40, the filler 70 and the connector 60.

[0147] In step 70, the following scheme is adopted during injection molding: 1. Under the premise of ensuring that the raw material melt can fully fill the main body of the mold cavity, the barrel temperature for placing the raw material melt is 280°C-300°C. This temperature range is significantly lower than the melt temperature of 300°C-350°C in conventional processes, thereby reducing the risk of melt thermal degradation and avoiding material performance deterioration caused by molecular chain breakage; at the same time, it can reduce energy consumption and inhibit material oxidation caused by high temperature during injection molding.

[0148] 2. Optionally, the mold temperature can be adjusted to a higher range, such as 120°C-150°C. A higher mold temperature prevents the molten material from cooling too quickly upon contact with the mold surface, allowing for a lower molten material temperature and enabling faster injection speeds for filling. The purpose of this design is to allow the molten material to flow quickly over the surface of the magnetic component, preventing it from lingering on the surface and transferring heat to the magnetic component. This avoids the negative impact of high temperatures on the magnetic component and also results in a smoother product surface, reducing fiber sludge.

[0149] 3. High injection speed and high injection pressure are used to instantly fill the mold cavity with high-temperature molten raw material. The technical principle is to complete the filling before the magnet 10 absorbs a large amount of heat, significantly reducing heat transfer time; avoiding melt cooling and solidification caused by slow filling, ensuring the integrity of the product structure. Preferably, the speed at which the molten raw material enters the main body of the mold cavity is 90%-100% of the maximum injection speed of the injection molding machine. The injection pressure is more than 80% of the maximum pressure of the injection molding machine, and the filling time is 0.2-0.6 seconds.

[0150] 4. The pressure inside the cavity of the injection mold is controlled at 20%-40% of the injection pressure, and the pressure is maintained for 0.5-1 second. This setting can reduce the heat transfer from the raw material melt to the mold during the holding pressure stage, reduce the total heat input to the injection mold, and avoid the accumulation of internal stress in the material due to excessive holding pressure, thereby reducing the risk of product deformation.

[0151] 5. Before placing the magnetic components into the mold, preheat them to 80°C-100°C in an oven. The purpose of preheating is twofold: first, to remove any moisture that may be adsorbed on the surface of the high-temperature resistant magnet 10 insert; and second, to reduce the temperature difference between the magnet 10 in the high-temperature resistant magnet 10 insert and the melt, thereby reducing thermal shock and preventing the magnet 10 from cracking due to excessive instantaneous temperature difference. It also slightly reduces the heat absorbed by the magnet 10 from the melt.

[0152] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A stent, characterized by, The device includes a magnetic component and a support body. The support body is formed outside the magnetic component so that the magnetic component is embedded inside the support body. The magnetic component includes a magnet and a heat shielding layer. The heat shielding layer wraps around the surface of the magnet and separates the magnet from the support body.

2. The stent of claim 1, wherein The heat shielding layer includes a heat insulation coating and an electroplating layer. The electroplating layer is attached to the surface of the magnet by an electroplating process, and the heat insulation coating is wrapped around the electroplating layer.

3. The stent of claim 2, wherein, The heat insulation coating is a polymer heat insulation functional coating with a thermal conductivity of less than 0.2 W / (m·K), and the polymer heat insulation functional coating is made of one or more of the following materials: high-temperature epoxy resin, polyether ether ketone, and Teflon.

4. The stent of claim 2, wherein The thickness of the electroplated layer is equal to the thickness of the heat-insulating coating, wherein the thickness of the heat shielding layer is 15-30 micrometers.

5. The stent defined in any one of claims 2-4, wherein, The main body of the support is a ring structure, and there are multiple magnets arranged around the circumference of the main body of the support. Each magnet is covered with a heat shielding layer.

6. The stent defined in Claim 1, wherein, The heat shielding layer is a heat-insulating metal shell, which is wrapped around the magnet, and the magnet is fixed inside the heat-insulating metal shell.

7. The stent defined in Claim 6, wherein, The thermal conductivity of the heat-insulating metal shell is 14.5-16.5 W / (m·K), and the specific heat capacity is 480-520 J / (kg·K).

8. The stent defined in Claim 6, wherein, The heat-insulating metal outer shell is made of austenitic stainless steel; and / or the wall thickness of the heat-insulating metal outer shell is 0.2-0.5 mm.

9. The stent of claim 6, wherein, The heat-insulating metal shell includes a shell body and a cover. A placement cavity is formed in the shell body, and the magnet is placed in the placement cavity. One side of the placement cavity is open. The cover is connected to the shell body and covers the opening of the placement cavity.

10. The stent of claim 9, wherein, The edge of the cap is welded and fixed to the edge of the opening of the placement cavity, and the cap seals the placement cavity.

11. The stent defined in claims 9 or 10, wherein, The support body has a ring-shaped structure, and the magnets include multiple magnets, which are arranged circumferentially within the placement cavity.

12. The stent defined in any one of claims 1-4, 6-10, wherein, The magnetic component also includes a magnetic conductor, which is an arc-shaped sheet structure. There are multiple magnets, which are arranged along the length of the magnetic conductor and fixed on the magnetic conductor.

13. An electronic device accessory, characterized in that It includes a main body of the accessory and a bracket as described in any one of claims 1 to 12, wherein the bracket is rotatably connected to the main body of the accessory.

14. A stent fabrication method for fabricating the stent according to any one of claims 1 to 12, characterized by, Includes the following steps: Provide magnets; A heat shielding layer is machined onto the surface of the magnet to encapsulate the magnet, thereby obtaining a magnetic assembly; The bracket body is injection molded onto the magnetic component using an injection molding process to obtain the bracket.

15. The stent fabrication method of claim 14, wherein, The process of forming a heat shield layer around the magnet on its surface includes: An electroplating layer is formed on the surface of the magnet using an electroplating process; A heat-insulating coating is formed by spraying the surface of the electroplated layer using a spraying process. The heat shield layer includes the heat insulation coating and the electroplating layer.

16. The stent fabrication method of claim 15, wherein, The process of spraying a heat-insulating coating onto the surface of the electroplated layer using a spraying process includes: Paint preparation involves mixing the paint and thinner according to a preset ratio and stirring to obtain the paint, wherein the stirring time is greater than or equal to 10 minutes; Viscosity test, the viscosity of the paint is measured by using a viscometer, to ensure that the viscosity of the paint is within the preset range, if the viscosity of the paint is not within the preset range, adjust the proportion of diluent to correct the viscosity; Clamp fixation, firmly install the magnet on the rotating clamp, ensure that all the surfaces to be sprayed are not blocked, and there is no looseness during rotation; Spraying operation, start the spray gun, calibrate the key parameters to the preset value, keep the distance between the spray gun and the surface of the magnet at 15-25 cm, and spray at a uniform speed, smooth straight line or circular trajectory; Thickness monitoring, sample the thickness of the thermal insulation coating during spraying, or detect the thickness of the thermal insulation coating before curing after spraying is completed, wherein the thickness of the thermal insulation coating is controlled within the range of 15-30 microns by adjusting the spraying times and the flow rate of the spray gun.

17. The stent fabrication method of claim 16, wherein, The spraying operation comprises: First, spray a layer of primer; Let it stand for 5-10 minutes to dry the surface of the primer; Spray 1-2 layers of topcoat on the surface of the primer.

18. The stent production method according to claim 15 or 16, wherein After the thermal insulation coating is formed on the surface of the electroplated layer by the spraying process, the thermal insulation coating needs to be cured, which comprises the following steps: After spraying is completed, leave the magnet in a dust-free environment for 10-20 minutes; Transfer the magnet to the oven and preheat at 100°C for 15-20 minutes to slowly volatilize the solvent in the paint; Stepwise heating to the sintering temperature of the paint, and keeping the temperature constant for 20-30 minutes to ensure that the paint is fully crosslinked and cured; Turn off the heating and let the magnetic assembly cool naturally to room temperature with the oven.

19. The stent fabrication method of claim 18, wherein, In the curing step, the temperature difference between each area in the oven is less than or equal to 5°C, and the exhaust function of the oven needs to be turned on during the curing process.

20. The stent fabrication method of claim 14, wherein, The heat shield layer is a thermal insulation metal shell, and the heat shield layer wrapping the magnet is processed on the surface of the magnet, comprising: Design the shape of the thermal insulation metal shell according to the shape of the magnet, wherein the thermal insulation metal shell comprises a shell body and a cover, the shell body forms a placement cavity inside, the bottom is closed, the top is open, and a guide chamfer is arranged on the edge of the opening; The thermal insulation metal shell is made by stamping or machining, wherein the wall thickness of the thermal insulation metal shell is 0.2-0.5 mm, and the dimensional tolerance needs to be controlled within ±0.01 mm; Fix the shell body on the press-fit clamp, with the opening of the shell body facing upwards, and place the magnet exactly above the opening; Vertically press the magnet into the shell body at a constant low speed of 1-5 mm / s; When the pressure reaches the preset value, it is determined that the press-fitting is in place, at which time the bottom of the magnet is in contact with the bottom of the placement cavity; Weld the edge of the cover to the edge of the opening, and seal the placement cavity with the cover.

21. The stent production method according to claim 20, wherein In the process of vertically pressing the magnet into the shell body at a constant low speed of 1-5 mm / s, the "pressure-displacement curve" of the magnet is recorded in real time by the pressure sensor and the displacement sensor, and the "pressure-displacement curve" rises smoothly under normal press-fitting, if the "pressure-displacement curve" fluctuates, stop immediately for inspection.

22. The stent fabrication method of claim 20, wherein, After welding the edge of the cover to the edge of the opening and sealing the placement cavity with the cover, a comprehensive inspection is also included, which comprises: Dimensional accuracy verification: using calipers, height gauge or three coordinate measuring instrument, detection of the overall height and shape of the finished product key size, to ensure that the design drawings requirements; Appearance quality inspection: visual or with the help of magnifying glass, check the thermal insulation metal shell, confirm no pressure injury, scratch, deformation and other appearance defects; Sampling internal detection: X-ray image instrument for nondestructive testing, verify the installation position of the magnet in the thermal insulation metal shell is accurate, while checking whether the magnet internal hidden cracks due to the stress caused.

23. The stent fabrication method of claim 14, wherein, The support body is injected on the magnetic assembly by the injection molding process, comprising: Injection mold design, a separate magnet cavity position is designed for the magnetic assembly in the injection mold, the magnet cavity position is connected with the main runner and the cavity body through a small flow channel; an efficient cooling water channel is designed around the magnet cavity position; during the pre-injection, middle injection and post-injection stages, the cooling water channel is continuously forced cooled by cooling water, so as to ensure that the temperature of the magnet assembly is always below the safe temperature; According to the design, the injection mold is made; The magnetic assembly is placed in the magnet cavity position of the injection mold, a hot runner system is used, and a valve needle is used to control the timing and speed of the raw material melt for making the support body into the cavity body.

24. The stent production method according to claim 23, wherein The temperature range of the barrel for placing the raw material melt is 280°C-300°C; and / or, when the raw material melt is injected into the injection mold, the injection mold can be preheated first, so that the temperature of the injection mold reaches 120°C-150°C.

25. The stent fabrication method of claim 23, wherein, The speed of the raw material melt into the cavity body is 90%-100% of the maximum injection speed of the injection machine, the injection pressure is more than 80% of the maximum pressure of the injection machine, and the filling time is 0.2-0.6 seconds; and / or, when the injection operation is performed, the pressure in the cavity body of the injection mold is controlled at 20%-40% of the injection pressure, and the pressure maintaining time is 0.5-1 second.

26. The stent fabrication method of claim 23, wherein, Before the magnetic assembly is placed in the magnet cavity position of the injection mold, it further comprises: first, the magnetic assembly is placed in an oven and preheated to 80°C-100°C.

27. The stent fabrication method of claim 14, wherein, The magnet is provided, comprising: Selecting a predetermined number of magnets; The magnets are arranged and fixed on the magnetic guide.

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