Component testing device and component testing method

Abstract

The invention provides a component testing device and method, the component testing device comprises a plurality of tool main bodies and a plurality of tool covers, the plurality of tool main bodies are stacked, each tool main body is provided with positioning pin sleeves arranged in an array, and the positioning pin sleeves are internally provided with positioning spaces used for positioning components to be tested; the plurality of tool covers are in one-to-one correspondence with the positioning pin sleeves arranged in an array, and the tool covers sleeve the outer walls of the positioning pin sleeves to block the openings of the positioning pin sleeves and prevent cold air from entering the positioning space during temperature testing, so that frosting in the positioning pin sleeves is avoided, and the accuracy of a test result of a to-be-tested chip can be ensured; and the problem of chip damage caused by frosting is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device testing, in particular to a component testing device and testing method. BACKGROUND

[0002] In the screening process of electronic components, the performance of the components under different environmental conditions needs to be tested, and low-temperature testing is an important testing item. At present, when manually testing the components at low temperature, frost is easily formed on the surface of the components, which affects the testing results of the components. SUMMARY

[0003] Therefore, the present application aims to provide a component testing device and testing method to solve the problem of inaccurate component testing.

[0004] To achieve the above purpose, the first aspect of the present application provides a component testing device, comprising: a plurality of tool main bodies, the plurality of tool main bodies are arranged in layers, and the tool main bodies are provided with an array of positioning pin sleeves, and the positioning pin sleeves are provided with positioning spaces for positioning components to be tested; a plurality of tool covers, the plurality of tool covers correspond to the array of positioning pin sleeves one by one, the tool covers are sleeved on the outer walls of the positioning pin sleeves, and block the openings of the positioning pin sleeves to prevent cold air from entering the positioning spaces during temperature testing.

[0005] Optionally, the side of the tool main body away from the positioning pin sleeve is provided with a plurality of positioning columns, the tool main body is provided with a plurality of insertion slots, and in adjacent tool main bodies, the plurality of positioning columns of the tool main body above are inserted into the plurality of insertion slots of the tool main body below one by one.

[0006] Optionally, the plurality of positioning columns are distributed at the four corners of the tool main body.

[0007] Optionally, the side of the tool main body away from the positioning pin sleeve is provided with a plurality of positioning columns, and in adjacent tool main bodies, the plurality of positioning columns of the tool main body above abut against the tool main body below.

[0008] Optionally, the positioning column is provided with an insertion hole, the insertion holes on the tool main bodies arranged in layers are connected, and when the tool main bodies are in the state of being arranged in layers, a limiting column is inserted into the insertion hole.

[0009] Optionally, the height of the positioning column is H1, the height of the tool cover is H2, and H1≥H2.

[0010] Optionally, the tool cover is provided with a convex block for auxiliary installation.

[0011] Optionally, the device further comprises an auxiliary mounting rod, the auxiliary mounting rod comprises a mounting rod body, a plurality of limiting grooves are arranged on the mounting rod body at equal distances, and a notch is arranged on the protruding block; when the auxiliary mounting rod assists in mounting the tool cover, the limiting grooves are buckled with the notch.

[0012] Optionally, along a first direction, a plurality of positioning grooves are arranged in the positioning space in a large-to-small manner, and the first direction is a height direction of the tool body.

[0013] Optionally, along a second direction, each positioning groove is provided with a gap on one side, the gap is in communication with the corresponding positioning groove, and the second direction is perpendicular to the first direction.

[0014] Based on the same inventive concept, the second aspect of the present application provides a component testing method, comprising: adjusting the temperature of the test box according to the first preset temperature; determining the test position of the to-be-tested component according to the number of to-be-tested components; placing the to-be-tested component into the positioning pin sleeve corresponding to the test position in the test auxiliary device, and covering the tool cover on the positioning pin sleeve on which the to-be-tested component is placed; after a first preset time period, obtaining the first parameter of the to-be-tested component; adjusting the temperature of the test box according to the second preset temperature, and obtaining the second parameter of the to-be-tested component after a second preset time period; determining the working state of the to-be-tested component according to the first parameter and the second parameter.

[0015] Optionally, the determination of the test position of the to-be-tested component according to the number of to-be-tested components comprises: determining the number of tool bodies according to the number of to-be-tested components and the number of positioning pin sleeves on each tool body; distributing the to-be-tested components on the determined tool bodies according to a preset rule to determine the test position of the to-be-tested components.

[0016] It can be seen from the above that the device testing device and the testing method provided by the application, the device testing device comprises a plurality of tool bodies and a plurality of tool covers, the plurality of tool bodies are arranged in layers, each tool body is provided with an array of positioning pin sleeves, and the positioning pin sleeve is provided with a positioning space for positioning the to-be-tested component; the plurality of tool covers correspond to the array of positioning pin sleeves one by one, the tool cover is sleeved outside the outer wall of the positioning pin sleeve, and the opening of the positioning pin sleeve is blocked to prevent cold air from entering the positioning space during temperature testing, thereby avoiding frosting inside the positioning pin sleeve, ensuring the accuracy of the test results of the to-be-tested chip, and avoiding the problem of chip damage caused by frosting. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the application or related art, the drawings needed to be used in the embodiments or related art description will be briefly introduced. Obviously, the drawings in the following description are only embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 A component testing device structure schematic diagram of an embodiment of the application; Figure 2 A tool body structure and tool cover cooperation structure schematic diagram of an embodiment of the application; Figure 3 A tool body structure schematic diagram of an embodiment of the application; Figure 4 A tool cover and auxiliary mounting rod cooperation structure schematic diagram of an embodiment of the application; Figure 5 A positioning pin sleeve structure schematic diagram of an embodiment of the application; Figure 6 Another component testing device structure schematic diagram of an embodiment of the application; Figure 7 Another tool body structure and tool cover cooperation structure schematic diagram of an embodiment of the application; Figure 8 A component testing method flowchart schematic diagram of an embodiment of the application; Figure 9 An electronic equipment hardware structure schematic diagram of an embodiment of the application.

[0019] Reference signs: 1, tool body; 11, slot; 12, positioning column; 14, insertion hole; 15, limiting column; 2, positioning pin sleeve; 21, positioning space; 3, tool cover; 31, protrusion; 32, notch; 4, auxiliary mounting rod; 41, mounting rod body; 42, limiting groove; A, positioning groove; B, opening; A1, first positioning groove; A2, second positioning groove; A3, third positioning groove; A4, fourth positioning groove; B1, first opening; B2, second opening; B3, third opening; B4, fourth opening. DETAILED DESCRIPTION

[0020] To make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to specific examples and drawings.

[0021] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be understood as the general meaning understood by those skilled in the art to which the present application belongs. The terms "first", "second" and the like used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. The terms "include" or "contain" and the like mean that the elements or objects before the terms cover the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and the like are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect. The terms "up", "down", "left", "right" and the like are only used to represent relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0022] Based on the background art, in the prior art, when performing manual low-temperature testing of components, such as directly placing the components into a low-temperature chamber, frost is easily formed on the surface of the components due to the low ambient temperature of the chamber cavity. Frosting brings many problems, such as affecting the stability of the electrical connection between the components and the test tool, leading to inaccurate test data; the accumulation of frost layer can also increase the weight and volume of the components, affecting the convenience of operation; in addition, performing electrical performance testing when frosting can also damage the test sub-plate and reduce the service life of the test sub-plate. Therefore, how to effectively solve the problem of low-temperature frosting of components is a technical problem that needs to be solved in the current low-temperature testing of components.

[0023] Figure 1 A structure diagram of a component testing device according to an embodiment of the present application is shown. Figure 2 And Figure 3 A structure diagram of a tool body 1 is shown.

[0024] To solve the above technical problems, such as Figure 1As shown, the application provides a component testing device, comprising: A plurality of tool bodies 1 are stacked, and the tool bodies 1 are provided with arrayed positioning pin sleeves 2, and the positioning pin sleeves 2 are provided with positioning spaces 21 for positioning the components to be tested. A plurality of tool covers 3 correspond to the arrayed positioning pin sleeves 2 one by one, the tool covers 3 are sleeved on the outer walls of the positioning pin sleeves 2 and block the openings of the positioning pin sleeves 2, so as to block cold air from entering the positioning spaces 21 during temperature testing.

[0025] Specifically, the number of the plurality of tool bodies 1 can be two or more. The plurality of tool bodies 1 are stacked along the height direction of the tool bodies 1 to test more components to be tested. The top of each tool body 1 is provided with arrayed positioning pin sleeves 2, which are used for positioning or carrying the components to be tested. The positioning pin sleeves 2 can be rectangular, square, circular, rhombic, etc., which are set according to the specific components to be tested. The positioning pin sleeves 2 are provided with positioning spaces 21 for positioning the components to be tested. When testing the components to be tested, the components to be tested are placed in the positioning spaces 21, which facilitates the testing of the components to be tested. Each component is located in a positioning pin sleeve 2, which can ensure that the single components are independent and do not interfere with each other, facilitating the taking and placing operations of the workers, and the signals between the tests will not cause cross talk. The plurality of tool covers 3 correspond to the arrayed positioning pin sleeves 2 one by one, the tool covers 3 are sleeved on the outer walls of the positioning pin sleeves 2 and block the openings of the positioning pin sleeves 2, that is, the tool covers 3 cover the positioning pin sleeves 2, so that the positioning spaces 21 in the positioning pin sleeves 2 form sealed spaces. The tool covers 3 are used for blocking cold air from entering the positioning spaces 21 during temperature testing, thereby avoiding frost formation in the positioning pin sleeves 2, ensuring the accuracy of the test results of the components to be tested, and avoiding the problem of component damage caused by frost formation.

[0026] Specifically, the tool body 1 is made of a metal material with good heat conductivity and certain strength, such as aluminum alloy.

[0027] In some embodiments, as shown in Figure 1 , Figure 2 and Figure 3 , the side of the tool body 1 away from the positioning pin sleeve 2 is provided with a plurality of positioning columns 12, and the tool body 1 is provided with a plurality of insertion slots 11. In adjacent tool bodies 1, the plurality of positioning columns 12 of the upper tool body 1 are inserted into the plurality of insertion slots 11 of the lower tool body 1 one by one.

[0028] Exemplarily, the top of the tool body 1 is provided with an array of positioning pin sleeves 2, and the side of the tool body 1 away from the positioning pin sleeves 2 is the bottom of the tool body 1. A plurality of positioning columns 12 are arranged on the bottom of the tool body 1, and the top of the tool body 1 is provided with a plurality of insertion slots 11 corresponding to the positioning columns 12. In adjacent tool bodies 1, the positioning columns 12 of the upper tool body 1 are inserted into the insertion slots 11 of the lower tool body 1. In this way, a gap can be ensured between adjacent tool bodies 1, and temperature test air can enter each layer of tool bodies 1 to achieve accurate testing of the components on each layer of tool bodies 1.

[0029] Further, the plurality of positioning columns 12 are arranged at the four corners of the tool body 1. Exemplarily, the plurality of positioning columns 12 can be four or two. When the positioning columns 12 are two, the two positioning columns 12 are arranged at opposite corners, and the orthographic projections of the two positioning columns 12 of adjacent tool bodies 1 on the tool body 1 are arranged in a cross shape. In this way, when the tool body 1 is moved, the two positioning columns 12 are not arranged at the same corner, and the other two corners are offset, which is not convenient for movement. When the positioning columns 12 are two, sufficient test air can enter between each layer of tool bodies 1, and the testing efficiency is improved. When the plurality of positioning columns 12 are four, the four positioning columns 12 are arranged at the four corners of the tool body 1 and are inserted into the insertion slots 11 of adjacent tool bodies 1, which can ensure stable installation between the tool bodies 1.

[0030] Figure 6 Another component testing device structure diagram is shown. Figure 7 Another tool body 1 structure diagram is shown.

[0031] In some embodiments, as shown in Figure 6 and Figure 7 the side of the tool body 1 away from the positioning pin sleeves 2 is provided with a plurality of positioning columns 12, and in adjacent tool bodies 1, the plurality of positioning columns 12 of the upper tool body 1 abut against the tool body 1 below.

[0032] Exemplarily, the plurality of positioning columns 12 include two. During temperature detection, a plurality of tool bodies 1 are arranged in layers. In order to enable sufficient air at the testing temperature to enter each layer of tool bodies 1, the two positioning columns 12 are arranged at the middle positions of the two ends of the tool body 1. In this way, the number of positioning columns 12 is small, the area of the air entering each layer of tool bodies 1 is small, and sufficient air at the set temperature can enter between each layer of tool bodies 1, which can improve the testing efficiency.

[0033] In some embodiments, as shown in Figure 6 and Figure 7As shown, the positioning column 12 is provided with a socket 14, and the sockets 14 of the stacked tool bodies 1 are connected in communication. When the tool body 1 is in a stacked state, the socket 14 is inserted with a limiting column 15.

[0034] As shown, the socket 14 is arranged through the tool body 1, and the sockets 14 between adjacent tool bodies 1 are connected in communication. When multiple tool bodies 1 are used in testing, the multiple tool bodies 1 are stacked, and at this time, the socket 14 is inserted with the limiting column 15, so that the limiting column 15 limits the multiple tool bodies 1, ensures the stability between the tool bodies 1 of each layer, and avoids the sliding of the tool body 1 in the testing process, thereby affecting the test result. Figure 6 Figure 7 As shown, the socket 14 is arranged through the tool body 1, and the sockets 14 between adjacent tool bodies 1 are connected in communication. When multiple tool bodies 1 are used in testing, the multiple tool bodies 1 are stacked, and at this time, the socket 14 is inserted with the limiting column 15, so that the limiting column 15 limits the multiple tool bodies 1, ensures the stability between the tool bodies 1 of each layer, and avoids the sliding of the tool body 1 in the testing process, thereby affecting the test result.

[0035] As shown, the height of the positioning column 12 is H1, and the height of the tool cover 3 is H2, and H1≥H2. Figure 2 Figure 7 As shown, the height of the positioning column 12 is H1, and the height of the tool cover 3 is H2, and H1≥H2.

[0036] As shown, the height of the positioning column 12 is H1, and the height of the tool cover 3 is H2, and H1≥H2.

[0037] In some embodiments, the tool cover 3 is provided with a protrusion 31 for assisting installation.

[0038] As shown, the height of the positioning column 12 is H1, and the height of the tool cover 3 is H2, and H1≥H2.

[0039] Figure 4 As shown, the height of the positioning column 12 is H1, and the height of the tool cover 3 is H2, and H1≥H2.

[0040] In some embodiments, the device further comprises an auxiliary installation rod 4, and the auxiliary installation rod 4 comprises an installation rod body 41 provided with a plurality of limiting grooves 42 arranged at equal distances, and the protrusion 31 is provided with a slot 32, and when the auxiliary installation rod 4 assists the installation of the tool cover 3, the limiting grooves 42 are buckled with the slot 32.

[0041] ​​Exemplarily, the auxiliary mounting rod 4 is used for mounting the tool cover 3. The tool cover 3 is provided with a notch 32 on the protrusion 31, and the notch 32 can be buckled on the auxiliary mounting rod 4. The auxiliary mounting rod 4 is provided with a plurality of limiting grooves 42, and the distance between each limiting groove 42 corresponds to the distance between the arrayed positioning pin sleeves 2, so that the tool cover 3 can be accurately covered on each positioning pin sleeve 2 after being buckled on the auxiliary mounting rod 4. Since the number of the positioning pin sleeves 2 is large, when a large number of components are tested, the auxiliary mounting rod 4 can be used to mount a row or a column of tool covers 3. It should be noted that when the components are tested, if the number is small, the components can be arranged in an interval row or an interval column. Therefore, the auxiliary mounting rod 4 can be used to mount a row or a column of tool covers 3, thereby improving the test efficiency.

[0042] Figure 5 The structure of the positioning pin sleeve 2 is shown.

[0043] In some embodiments, along a first direction, the positioning space 21 includes a plurality of positioning grooves A arranged in a large-to-small stack, and the first direction is the height direction of the tool body 1.

[0044] Exemplarily, as shown in Figure 5 the first direction is the Z direction in the drawing, that is, the first direction is the height direction of the positioning pin sleeve 2. In the positioning space 21 of the positioning pin sleeve 2, a plurality of positioning grooves A arranged in a large-to-small stack are arranged along the first direction (that is, the height direction), and the largest positioning groove A is located at the top and the smallest positioning groove A is located at the bottom. In this way, a plurality of models of components can be placed in the positioning pin sleeve 2, so that the test device can test a plurality of models of components, thereby improving the test efficiency.

[0045] Exemplarily, the plurality of positioning grooves A include a first positioning groove A1, a second positioning groove A2, a third positioning groove A3, and a fourth positioning groove A4. The four positioning grooves A can be used to place four different models of components. One positioning pin sleeve 2 can place four models of components, and the number of times of replacing the test tool can be reduced when different components are tested, thereby saving test time.

[0046] In some embodiments, along a second direction, each of the positioning grooves A is provided with a notch B, the notch B is in communication with the corresponding positioning groove A, and the second direction is perpendicular to the first direction.

[0047] Exemplarily, as shown in Figure 5 the second direction is the Y direction in the drawing. Figure 5The Y direction, also known as the second direction, is the length direction of the positioning pin sleeve 2. A notch B is opened on one side of each positioning groove A along the second direction so that the notch B is connected to the positioning groove A. In this way, when the component is located in the positioning groove A, it is not convenient to take it out. A tool can be used to take out the component through the notch B.

[0048] Based on the above embodiments, positioning groove A includes a first positioning groove A1, a second positioning groove A2, a third positioning groove A3, and a fourth positioning groove A4. The first positioning groove A1 has a first notch B1 on one side, which can be used to remove a device located within it. The second positioning groove A2 has a second notch B2 on one side, which can be used to remove a device located within it. The third positioning groove A3 has a third notch B3 on one side, which can be used to remove a device located within it. The fourth positioning groove A4 has a fourth notch B4 on one side, which can be used to remove a device located within it.

[0049] The specific usage process of the component testing device in this application is as follows: First, set the high and low temperature test chamber to the required temperature. Place the components inside the positioning pin sleeve 2 of the test auxiliary fixture and cover it with the fixture cover 3. When covering the fixture cover 3, if there are a large number of devices under test, the auxiliary mounting rod 4 can be used to secure the fixture cover 3 inside the positioning pin sleeve 2. Place the fixture body 1 containing the devices under test into the high and low temperature test chamber for cooling. After placing it in the high and low temperature test chamber for a period of time, when the surface temperature of the devices under test reaches the preset temperature, remove the devices under test for low temperature testing. During the test, observe the test data and the working status of the test board to ensure the smoothness of the test process and the accuracy of the data. After the test, the fixture cover 3 of the array can also be removed with the help of the auxiliary mounting rod 4 to continue testing other devices under test, repeating the operation.

[0050] Based on the same inventive concept, such as Figure 8 As shown, the second aspect of this application provides a component testing method, including the following steps: Step 102: Adjust the temperature of the test chamber according to the first preset temperature.

[0051] In this step, the test chamber has a temperature control function. Its first preset temperature can be 0°C. The first preset temperature is used to cool the components.

[0052] Step 104: Determine the test location of the components under test based on the number of components under test.

[0053] In this step, if the number of components under test reaches 50 or more, it is considered that a low-temperature test is being performed on a batch of components. To improve the testing efficiency of the components under test, a large number of components can be arranged in alternating rows or columns within the positioning pin sleeves of the fixture body. This alternating row or column arrangement allows for better airflow of cold air, enabling the temperature within the positioning pin sleeves to drop rapidly and allowing the positioning space where the components under test are located to quickly reach the required test temperature.

[0054] Furthermore, determining the test location of the component under test based on the number of components under test includes: The number of fixture bodies is determined based on the number of components under test and the number of locating pins on each fixture body; the components under test are evenly arranged on the determined fixture bodies according to preset rules to determine the test positions of the components under test.

[0055] For example, consider a 7x9 array of locating pins on each fixture body, resulting in 63 locating pins. The number of components under test (DUTs) is 105. The preset rule is to test the DUTs in alternating columns. The DUTs are placed in the locating pins in columns 1, 3, 5, 7, and 9 of each fixture body. That is, 35 locating pins from each fixture body can be used, so two fixture bodies can be used for the 105 DUTs. Therefore, the number of fixture bodies is determined based on the number of DUTs and the number of locating pins on each fixture body. Following the rule of testing the DUTs in alternating columns, the DUTs are evenly distributed on the determined fixture bodies, thus determining the test positions of the DUTs. This testing method can improve testing efficiency.

[0056] Step 106: Place the component under test into the positioning pin sleeve corresponding to the test position in the test auxiliary device, and cover the positioning pin sleeve containing the component under test with the tooling cover.

[0057] In this step, according to the above embodiment, 105 components under test (DUTs) are placed in the locating pin sleeves of the two fixture bodies in a spaced-out arrangement, and the fixture cover is only placed on the locating pin sleeves containing the DUTs. The locating pin sleeves without DUTs are not covered with the fixture cover. This ensures that the cold air around the locating pin sleeves containing the DUTs circulates, allowing the temperature of the locating space inside the locating pin sleeves to quickly reach the set requirements.

[0058] Step 108: After the first preset time period is reached, obtain the first parameter of the component under test.

[0059] In this step, the first preset duration can be 20 minutes, 30 minutes, or 1 hour, depending on the specific experimental requirements. For example, the first parameter of the component under test is obtained using an external device such as a voltmeter or ammeter.

[0060] Step 110: Adjust the temperature of the test chamber according to the second preset temperature. After reaching the second preset time, obtain the second parameter of the component under test.

[0061] In this step, the second preset temperature is lower than the first preset temperature. For example, the second preset temperature can be -40°C, and the test chamber temperature is adjusted accordingly. For example, the second preset duration can be 20 minutes, 30 minutes, or 1 hour, set according to specific experimental requirements. The second parameter of the component under test is obtained by using an external device such as a voltmeter or ammeter. The first and second parameters are of the same type; for example, if the first parameter is a voltage value, then the second parameter is also a voltage value. If the first parameter is a current value, then the second parameter is also a current value.

[0062] Step 112: Determine the working state of the component under test based on the first parameter and the second parameter.

[0063] In this step, after obtaining the first and second parameters, the two parameters are compared. If the difference between the two parameters is greater than a preset threshold, it is determined that the operating state of the component under test is abnormal, indicating that the component under test is malfunctioning at cold temperatures. If the difference between the two parameters is less than the preset threshold, it is determined that the operating state of the component under test is normal.

[0064] It should be noted that the method in this embodiment can be executed by a single device, such as a computer or server. The method can also be applied in a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method in this embodiment, and the multiple devices will interact with each other to complete the method described.

[0065] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0066] For ease of description, the above devices are described in terms of function, divided into various modules. Of course, in implementing this application, the functions of each module can be implemented in one or more software and / or hardware.

[0067] The apparatus of the above embodiments is used to implement a corresponding component testing method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0068] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement a component testing method as described in any of the above embodiments.

[0069] Figure 9 This embodiment illustrates a more specific hardware structure of an electronic device. The device may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0070] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0071] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0072] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.

[0073] The communication interface 1040 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0074] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0075] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0076] The electronic devices described above are used to implement a corresponding component testing method in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0077] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing the computer to execute a component testing method as described in any of the above embodiments.

[0078] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0079] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute a component testing method as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0080] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0081] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0082] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0083] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A component testing apparatus, characterized by comprising: The device comprises: a plurality of tool bodies (1), the plurality of tool bodies (1) are arranged in layers, and the tool bodies (1) are provided with positioning pin sleeves (2) arranged in an array, and the positioning pin sleeves (2) are provided with positioning spaces (21) for positioning the to-be-tested components; a plurality of tool covers (3), the plurality of tool covers (3) correspond to the positioning pin sleeves (2) arranged in an array one by one, the tool covers (3) are sleeved on the outer walls of the positioning pin sleeves (2) and block the openings of the positioning pin sleeves (2), and are used for blocking cold air from entering the positioning spaces (21) during temperature testing.

2. The device under test apparatus of claim 1, wherein The side of the tool body (1) away from the positioning pin sleeve (2) is provided with a plurality of positioning columns (12), the tool body (1) is provided with a plurality of insertion grooves (11), and in adjacent tool bodies (1), the plurality of positioning columns (12) of the tool body (1) located above are inserted into the plurality of insertion grooves (11) of the tool body (1) located below one by one.

3. A device under test apparatus according to claim 2, wherein, The plurality of positioning columns (12) are distributed at four corners of the tool body (1).

4. The device under test apparatus of claim 2, wherein, The side of the tool body (1) away from the positioning pin sleeve (2) is provided with a plurality of positioning columns (12), and in adjacent tool bodies (1), the plurality of positioning columns (12) of the tool body (1) located above are in abutment with the tool body (1) located below.

5. A device under test apparatus according to claim 4, wherein, The positioning column (12) is provided with an insertion hole (14), the insertion holes (14) on the tool bodies (1) arranged in layers are communicated, and the insertion hole (14) is inserted into a limiting column (15) when the tool body (1) is in a layered state.

6. The device under test apparatus of claim 1, wherein The height of the positioning column (12) is H1, the height of the tool cover (3) is H2, and H1≥H2.

7. The device under test apparatus of claim 1, wherein The tool cover (3) is provided with a convex block (31) for assisting installation.

8. The device under test apparatus of claim 7, wherein, The device further comprises an auxiliary installation rod (4), the auxiliary installation rod (4) comprises a rod body (41), the rod body (41) is provided with a plurality of limiting grooves (42) arranged at equal distances, the convex block (31) is provided with a slot (32), and when the auxiliary installation rod (4) assists the installation of the tool cover (3), the limiting grooves (42) are buckled with the slot (32).

9. The device under test apparatus of claim 1, wherein, In a first direction, the positioning space (21) comprises a plurality of positioning grooves (A) arranged in layers from large to small, and the first direction is the height direction of the tool body (1).

10. The device under test apparatus of claim 9, wherein, In a second direction, each positioning groove (A) is provided with a notch (B) on one side, the notch (B) is communicated with the corresponding positioning groove (A), and the second direction is perpendicular to the first direction.

11. A component testing method using the component testing apparatus according to any one of claims 1 to 10, characterized by, The device comprises: adjusting the temperature of a test box according to a first preset temperature; determining the test position of the to-be-tested components according to the number of the to-be-tested components; placing the to-be-tested components into the positioning pin sleeves (2) corresponding to the test position in the test auxiliary device, and covering the positioning pin sleeves (2) on which the to-be-tested components are placed with tool covers (3); after a first preset time period, obtaining the first parameter of the to-be-tested components; According to the second preset temperature, the temperature of the test chamber is adjusted, and a second parameter of the to-be-tested component is obtained after a second preset time length; According to the first parameter and the second parameter, the working state of the to-be-tested component is determined.

12. The method of claim 11, wherein, The determination of the test position of the to-be-tested component according to the number of to-be-tested components comprises: According to the number of to-be-tested components and the number of positioning pin sleeves (2) on each tool body (1), the number of tool bodies (1) is determined; According to a preset rule, the to-be-tested components are evenly arranged on the determined tool bodies (1) to determine the test positions of the to-be-tested components.

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