Wind power converter IGBT monitoring system

Abstract

The invention relates to the technical field of wind power generation, in particular to a wind power converter IGBT (Insulated Gate Bipolar Translator) monitoring system, which comprises a multi-sensor data acquisition unit, a data preprocessing and feature extraction unit, a health state evaluation unit, a residual service life prediction unit and an intelligent early warning and decision support unit, the multi-sensor data acquisition unit is used for acquiring multi-source data related to the IGBT health state in real time by using an electrical parameter sensor, a thermal parameter sensor, a driving state sensor and a mechanical parameter sensing unit; the data preprocessing and feature extraction unit is connected with the multi-sensor data acquisition unit and is used for filtering, denoising and aligning the acquired original data; through a comprehensive and accurate data acquisition mode, state information of the IGBT in electrical, thermal, driving, mechanical and other aspects can be acquired, rich and accurate basic data are provided for subsequent analysis and evaluation, equipment damage and maintenance cost are reduced, the utilization rate of equipment is improved, and overall operation and maintenance cost is reduced.

Description

Technical Field

[0001] This invention relates to the technical field of wind power generation, and in particular to a wind power converter IGBT monitoring system. Background Technology

[0002] As a crucial component of clean energy, the reliability and operational efficiency of wind power generation are paramount. The converter is the core power conversion component of a wind turbine, and the IGBT module, as a key power switching device in the converter, operates under harsh conditions of high temperature, high voltage, and high current for extended periods. It is one of the most vulnerable links in the converter, prone to failure. IGBT failure can lead to the shutdown of the entire converter, resulting in significant power generation losses and costly repairs. Therefore, multi-parameter fusion, online health assessment, accurate lifespan prediction, and intelligent early warning systems for IGBTs are essential.

[0003] Currently, in existing IGBT monitoring systems, such as the patent with publication number CN117665526B, the invention relates to the technical field of IGBT monitoring systems, and in particular to a wind power converter IGBT monitoring system, including an electrical variable measurement unit, a magnetic variable measurement unit, a measurement control unit, a data processing unit, a drive signal detection unit, and a cooling unit; the electrical variable measurement unit is used to detect the voltage and current variables of the IGBT in real time.

[0004] Existing monitoring systems have been found to have poor comprehensiveness in monitoring IGBTs and are not convenient for calculating the overall health index of IGBTs, thus reducing their effectiveness. Summary of the Invention

[0005] To address the aforementioned technical issues, this invention provides a comprehensive and accurate data acquisition method capable of obtaining IGBT status information in multiple aspects, including electrical, thermal, drive, and mechanical aspects. This provides rich and accurate basic data for subsequent analysis and evaluation. Based on real-time collected junction temperature fluctuation data, this wind power converter IGBT monitoring system reduces equipment damage and maintenance costs, improves equipment utilization, and lowers overall operation and maintenance costs.

[0006] The present invention provides a wind power converter IGBT monitoring system, comprising a multi-sensor data acquisition unit, a data preprocessing and feature extraction unit, a health status assessment unit, a remaining service life prediction unit, and an intelligent early warning and decision support unit; Multi-sensor data acquisition unit: Utilizes electrical parameter sensors, thermal parameter sensors, drive status sensors, and mechanical parameter sensing units to collect multi-source data related to the health status of IGBTs in real time; Data preprocessing and feature extraction unit: connected to the multi-sensor data acquisition unit, used to filter, denoise, and align the acquired raw data, and extract key feature parameters that can characterize the IGBT degradation state. An increase in the on-state voltage drop at a specific current and junction temperature is a sign of chip aging. An increase in the on-state voltage drop calculated by extracting the junction temperature and case temperature indicates degradation of the bonding wires or solder layer. A drift in the gate threshold voltage reflects the degradation of the gate oxide layer. Health status assessment unit: connected to the data preprocessing and feature extraction unit, used to calculate the comprehensive health index of IGBT based on key feature parameters; Remaining service life prediction unit: connected to the health status assessment unit, used to predict the remaining service life of IGBT based on the damage accumulation model and the data-driven prediction model. The damage accumulation model calculates the damage to the IGBT caused by each power cycle and thermal cycle based on the real-time collected junction temperature fluctuation data. The data-driven prediction model uses the time series data of historical health index and uses the time series prediction algorithm to calculate the time point when the historical health index value drops to the preset failure threshold, which is the predicted remaining service life. Intelligent early warning and decision support unit: connected to the health status assessment unit and the remaining service life prediction unit, used to issue early warning information of different levels based on health index and remaining service life, and provide maintenance suggestions; When the health index value first falls below 0.8 or the remaining service life prediction is lower than the set value, a warning is issued. When the health index value continues to decline and falls below 0.6, or the rate of change of key parameters accelerates, a maintenance plan needs to be prepared. When the health index value approaches the failure threshold or an impending failure is predicted, a shutdown maintenance alarm is immediately issued.

[0007] Preferably, it also includes a cooling unit and an intelligent cooling control unit; The cooling unit is connected to the intelligent cooling control unit. The intelligent cooling control unit can send cooling commands to the cooling unit and make the cooling unit perform cooling operations at different power according to the actual operating temperature of the IGBT. The intelligent cooling control unit is also connected to a multi-sensor data acquisition unit. By receiving and analyzing the IGBT temperature data collected by the multi-sensor data acquisition unit, it precisely controls the operating power of the cooling unit based on the actual operating temperature of the IGBT. Specifically, when the IGBT is operating at a low temperature, the cooling unit is controlled to operate at low power; when the IGBT is operating at a high temperature, the cooling unit is controlled to operate at high power. During the execution of commands by the cooling unit, the multi-sensor data acquisition unit continuously collects the IGBT temperature data and feeds it back to the intelligent cooling control unit. The intelligent cooling control unit adjusts the operating power of the cooling unit in real time based on the feedback temperature information, forming a closed-loop control system. This feedback adjustment mechanism ensures that the IGBT temperature is always kept within a safe and reasonable range, and can respond quickly even when operating conditions change, ensuring the stability and reliability of the system.

[0008] Preferably, the health status assessment unit includes a digital twin module and a health status assessment module; Digital twin module: Based on the physical characteristics and historical operating data of IGBT, a high-precision model of IGBT is constructed, which includes electrical, thermal and mechanical stress coupling. This model simulates the internal state of IGBT according to real-time operating conditions. Health status assessment module: It compares and analyzes the key feature parameters extracted in real time with the output value of the digital twin model and the initial baseline value of the IGBT. Through a preset weighted average fusion algorithm, it calculates a comprehensive health index. The health index value ranges from 0 to 1, where 0 indicates complete failure and 1 indicates a completely new state.

[0009] Preferably, the electrical parameter sensor is used to collect the collector-emitter voltage Vce, gate-emitter voltage Vge, and load current Ic data of the IGBT; The thermal parameter sensor: uses a temperature sensor installed on the IGBT module to collect the operating temperature, case temperature Tc and junction temperature Tj of the IGBT module in real time. The drive state sensor is used to monitor the gate drive voltage and drive resistance status of the drive circuit. The mechanical parameter sensing unit monitors abnormal vibrations caused by loose bonding wires or cracked solder layers via vibration sensors installed on the IGBT module.

[0010] Preferably, the following workflow is included: S1. Self-test and parameter initialization: Load the initial baseline parameters and digital twin model of the IGBT. S2. The multi-sensor data acquisition unit synchronously acquires collector-emitter voltage Vce, load current Ic, case temperature Tc, and junction temperature Tj data at a high sampling rate. S3. The data preprocessing and feature extraction unit uses the collected current and voltage data to sample the collector-emitter voltage Vce value as an estimate of the saturation voltage drop Vce(sat) when the current reaches a specific proportion of the rated value in each switching cycle, and performs temperature compensation. The junction temperature Tj is estimated in real time through a thermal model or a lookup table method of saturation voltage drop Vce(sat) - junction temperature Tj. S4. The health status assessment module calculates the health index HI every minute, using the following simplified formula: HI=w1*(1-ΔVce(sat))+w2*(1-ΔRth)+w3*(1-ΔVge(th)), Where Δ represents the normalized change relative to the initial value, w1, w2, w3 are the weighting coefficients of each parameter, and w1 + w2 + w3 = 1, Vce(sat) is the saturation voltage drop, Rth is the thermal resistance, and Vge(th) is the emitter threshold voltage. The weights can be adjusted according to the sensitivity of the actual device to different failure modes. S5. The remaining service life prediction unit runs once per hour. First, based on the junction temperature fluctuation Δjunction temperature Tj in the past hour, the number of cycles is counted using the rainflow counting method, and the damage degree is calculated. Then, combined with the downward trend of the health index HI, the LSTM network is used to perform rolling prediction and output the RUL value. S6. The intelligent early warning and decision support unit compares the HI and RUL values ​​with preset thresholds. If an early warning condition is triggered, the alarm information is displayed on the local HMI. At the same time, the alarm code, HI value, RUL predicted value, and suggested measures are packaged and sent to the remote monitoring center through the communication module.

[0011] Preferably, the cooling unit includes a cooling device, a temperature regulating device, a conveying device, a housing, a support, a first heat-conducting plate, a first air intake channel, a second air intake channel, an air volume regulating plate, and a filter screen; An exhaust port is located at the top of the enclosure, and an air inlet is located at the bottom of the enclosure. The bracket is installed on the inner side wall of the box. The first heat-conducting plate is mounted on the top of the bracket, and the IGBT is mounted on the first heat-conducting plate. The first and second air intake channels are respectively connected and installed at the air inlet of the box. A cooling device is installed in the second air intake channel. Two sets of air volume regulating plates are respectively rotatably installed inside the first air intake channel and the second air intake channel; The temperature regulating device is connected to the first heat-conducting plate, and the temperature regulating device adjusts the rotation and opening of the two sets of air volume regulating plates according to the temperature of the IGBT. Two sets of filters are respectively installed at the bottom openings of the first and second air intake channels. The conveying device is located at the upper part of the enclosure and is used to transport and circulate the air inside the enclosure. The IGBT is mounted on the first heat-conducting plate. The conveying device transports the air inside the enclosure, allowing outdoor air to enter the enclosure through the first and second air intake channels. The air inside the enclosure is discharged outward through the exhaust port, achieving airflow to dissipate heat and cool the IGBT. The heat generated by the IGBT during operation is transferred to the first heat-conducting plate. The temperature regulating device senses the temperature of the first heat-conducting plate. When the IGBT temperature is high, the temperature regulating device controls the rotation and opening angle of the two sets of airflow regulating plates, increasing the air intake of the second air intake channel and decreasing the air intake of the first air intake channel. Because the cooling device cools the second air intake channel, it increases the amount of low-temperature air entering the enclosure, achieving high-power cooling for the IGBT. When the IGBT operating temperature is low, it decreases the air intake of the second air intake channel and increases the amount of room-temperature air entering the first air intake channel, achieving low-power cooling for the IGBT. This improves the intelligent effect of IGBT cooling control and reduces the cooling energy consumption of the IGBT.

[0012] Preferably, the temperature regulating device includes a cylinder, a piston, a connecting frame, a spring, a rack, and a gear; The cylinder is installed on the inner side wall of the box, and the top of the cylinder is connected to the bottom of the first heat-conducting plate. The piston is slidably mounted inside the cylinder, and mercury is placed inside the cylinder at the top of the piston; The top of the connecting bracket is connected to the bottom of the piston, and the lower part of the connecting bracket is slidably installed on the outer wall of the first and second air intake channels. The spring is fitted onto the connecting bracket; Both sets of racks are installed at the bottom of the connecting frame; Two sets of gears are concentrically connected to two sets of airflow regulating plates, and the two sets of gears mesh with two sets of racks respectively. The temperature of the IGBT is transferred to the first heat-conducting plate. When the temperature of the IGBT rises, the first heat-conducting plate heats the mercury, causing it to expand. The mercury pushes the piston downward. After the piston moves downward, it drives the two sets of racks downward and drives the two sets of gears to rotate. After the two sets of gears rotate, they drive the two sets of airflow regulating plates to rotate in opposite directions, thereby increasing the airflow of the second air intake channel and decreasing the airflow of the first air intake channel. By varying the temperature, the different opening and closing angles of the two sets of airflow regulating plates are controlled.

[0013] Preferably, the cooling device includes a delivery box, a first heat exchange tube, a second heat exchange tube, a cooling box, a semiconductor refrigeration plate, a second heat conduction plate, a cooling fan, and a delivery pump; Both sets of delivery boxes are installed on the inner wall of the second air intake channel; Multiple sets of first heat exchange tubes are connected and installed between two sets of conveyor boxes; The top of the second heat exchange tube is connected to the two sets of conveying boxes. The lower part of the second heat exchange tube is arranged in a serpentine shape inside the cooling box. Liquid medium is placed inside the second heat exchange tube, the conveying box and the first heat exchange tube. The cooling tank contains coolant; The second heat-conducting plate is connected to the cooling box, and the semiconductor refrigeration plate is installed on the outer wall of the second heat-conducting plate. The heat dissipation end of the semiconductor refrigeration plate is provided with fins. The cooling fan is installed on the outer wall of the cooling box; The delivery pump is connected to the second heat exchange tube. By turning on the delivery pump, the liquid medium circulates in the delivery box, the first heat exchange tube, and the second heat exchange tube. The coolant in the cooling box cools the second heat exchange tube, which in turn cools the liquid medium. The liquid medium then cools the first heat exchange tube, which in turn cools the air flowing in the second air intake channel. The semiconductor cooling plate continuously cools the coolant, improving the constant temperature effect of air cooling.

[0014] Preferably, it also includes a guide rail, a magnetic block, and a position sensor; The guide rail is installed on the outer wall of the cylinder; The magnetic block is mounted on the guide rail and slides up and down, and is magnetically connected to the piston. Multiple position sensors are installed on the outer wall of the guide rail; after the piston moves downward, it drives the magnetic block to move. The position sensor senses the movement position of the magnetic block and then sends the position signal of the piston to the controller. The controller controls the operating power of the cooling device according to the downward stroke of the piston.

[0015] Preferably, the conveying device includes a flow guide, a ventilation fan, and louvers; The air deflector is located in the upper part of the housing; The ventilation fan is mounted on the air deflector. Louvers are installed at the exhaust vent of the enclosure; the ventilation fan delivers air into the enclosure, improving the airflow for heat dissipation and cooling of the IGBTs.

[0016] Compared with existing technologies, the beneficial effects of this invention are as follows: By collecting multi-source data related to the health status of IGBTs in real time, and through a comprehensive and accurate data collection method, it is possible to obtain IGBT status information in multiple aspects such as electrical, thermal, drive, and mechanical aspects, providing rich and accurate basic data for subsequent analysis and evaluation. Based on the real-time collected junction temperature fluctuation data, the damage caused to the IGBT by each power cycle and thermal cycle can be calculated. The data-driven prediction model uses time series data of historical health indices and uses a time series prediction algorithm to calculate the time point when the historical health index value drops to a preset failure threshold, which is the predicted remaining service life. The prediction method can help maintenance personnel plan maintenance plans in advance, reasonably arrange equipment replacement time, avoid production interruptions and losses caused by sudden IGBT failures, reduce equipment damage and repair costs, and at the same time, a reasonable maintenance plan can extend the service life of IGBTs, improve equipment utilization, and reduce overall maintenance costs. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the system structure of the present invention; Figure 2 This is a schematic diagram showing the connection between the multi-sensor data acquisition unit and the data preprocessing and feature extraction unit; Figure 3 This is a schematic diagram of the health status assessment unit; Figure 4 This is a partial isometric structural diagram of the connection between the housing and the first air intake channel, etc. Figure 5 This is an isometric structural diagram of the connection between the bracket and the first heat-conducting plate, etc. Figure 6 This is an isometric structural diagram of the connection between the first heat-conducting plate and the cylinder, etc. Figure 7 This is a partial isometric structural diagram of the connection between the connecting frame and the rack, etc. Figure 8 This is a partial isometric structural diagram of the connection between the semiconductor cooling plate and the second heat-conducting plate, etc. Figure 9 This is a partial isometric structural diagram of the connection between the piston and the connecting frame, etc. Figure 10 This is a partial isometric structural diagram showing the connection between the air deflector and the ventilation fan, etc.

[0018] The attached diagram is labeled as follows: 101, housing; 102, bracket; 103, first heat-conducting plate; 104, first air intake channel; 105, second air intake channel; 106, airflow regulating plate; 107, filter screen; 201, cylinder; 202, piston; 203, connecting frame; 204, spring; 205, rack; 206, gear; 301, conveying box; 302, first heat exchange tube; 303, second heat exchange tube; 304, cooling box; 305, semiconductor refrigeration plate; 306, second heat-conducting plate; 307, cooling fan; 308, conveying pump; 401, guide rail; 402, magnetic block; 403, position sensor; 501, air guide cover; 502, ventilation fan; 503, louver. Detailed Implementation

[0019] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. Example 1

[0020] like Figures 1 to 3 As shown, the wind power converter IGBT monitoring system of the present invention includes a multi-sensor data acquisition unit, a data preprocessing and feature extraction unit, a health status assessment unit, a remaining service life prediction unit, and an intelligent early warning and decision support unit. Multi-sensor data acquisition unit: Utilizes electrical parameter sensors, thermal parameter sensors, drive status sensors, and mechanical parameter sensing units to collect multi-source data related to the health status of IGBTs in real time; Data preprocessing and feature extraction unit: connected to the multi-sensor data acquisition unit, used to filter, denoise, and align the acquired raw data, and extract key feature parameters that can characterize the IGBT degradation state. An increase in the on-state voltage drop at a specific current and junction temperature is a sign of chip aging. An increase in the on-state voltage drop calculated by extracting the junction temperature and case temperature indicates degradation of the bonding wires or solder layer. A drift in the gate threshold voltage reflects the degradation of the gate oxide layer. Health status assessment unit: connected to the data preprocessing and feature extraction unit, used to calculate the comprehensive health index of IGBT based on key feature parameters; Remaining service life prediction unit: connected to the health status assessment unit, used to predict the remaining service life of IGBT based on the damage accumulation model and the data-driven prediction model. The damage accumulation model calculates the damage to the IGBT caused by each power cycle and thermal cycle based on the real-time collected junction temperature fluctuation data. The data-driven prediction model uses the time series data of historical health index and uses the time series prediction algorithm to calculate the time point when the historical health index value drops to the preset failure threshold, which is the predicted remaining service life. Intelligent early warning and decision support unit: connected to the health status assessment unit and the remaining service life prediction unit, used to issue early warning information of different levels based on health index and remaining service life, and provide maintenance suggestions; When the health index value first falls below 0.8 or the remaining service life prediction is lower than the set value, a warning is issued. When the health index value continues to decline and falls below 0.6, or the rate of change of key parameters accelerates, a maintenance plan needs to be prepared. When the health index value approaches the failure threshold or an impending failure is predicted, a shutdown maintenance alarm is immediately issued. It also includes a cooling unit and an intelligent cooling control unit; The cooling unit is connected to the intelligent cooling control unit. The intelligent cooling control unit can send cooling commands to the cooling unit and make the cooling unit perform cooling operations at different power according to the actual operating temperature of the IGBT. The intelligent cooling control unit is also connected to a multi-sensor data acquisition unit. By receiving and analyzing the IGBT temperature data collected by the multi-sensor data acquisition unit, it precisely controls the operating power of the cooling unit based on the actual operating temperature of the IGBT. Specifically, when the IGBT is operating at a low temperature, the cooling unit is controlled to operate at low power; when the IGBT is operating at a high temperature, the cooling unit is controlled to operate at high power. During the execution of commands by the cooling unit, the multi-sensor data acquisition unit continuously collects the IGBT temperature data and feeds it back to the intelligent cooling control unit. The intelligent cooling control unit adjusts the operating power of the cooling unit in real time based on the feedback temperature information, forming a closed-loop control system. This feedback adjustment mechanism ensures that the IGBT temperature is always kept within a safe and reasonable range, and can respond quickly even when operating conditions change, ensuring the stability and reliability of the system. The health status assessment unit includes a digital twin module and a health status assessment module; Digital twin module: Based on the physical characteristics and historical operating data of IGBT, a high-precision model of IGBT is constructed, which includes electrical, thermal and mechanical stress coupling. This model simulates the internal state of IGBT according to real-time operating conditions. Health status assessment module: It compares and analyzes the key feature parameters extracted in real time with the output value of the digital twin model and the initial baseline value of the IGBT. Through a preset weighted average fusion algorithm, it calculates a comprehensive health index. The health index value ranges from 0 to 1, where 0 indicates complete failure and 1 indicates a brand new state. The electrical parameter sensor is used to collect the collector-emitter voltage Vce, gate-emitter voltage Vge, and load current Ic data of the IGBT. The thermal parameter sensor: uses a temperature sensor installed on the IGBT module to collect the operating temperature, case temperature Tc and junction temperature Tj of the IGBT module in real time. The drive state sensor is used to monitor the gate drive voltage and drive resistance status of the drive circuit. The mechanical parameter sensing unit monitors abnormal vibrations caused by loose bonding wires or cracked solder layers through a vibration sensor installed on the IGBT module. The workflow includes the following: S1. Self-test and parameter initialization: Load the initial baseline parameters and digital twin model of the IGBT. S1. Self-test and parameter initialization: Load the initial baseline parameters and digital twin model of the IGBT. S2. The multi-sensor data acquisition unit synchronously acquires collector-emitter voltage Vce, load current Ic, case temperature Tc, and junction temperature Tj data at a high sampling rate. S3. The data preprocessing and feature extraction unit uses the collected current and voltage data to sample the collector-emitter voltage Vce value as an estimate of the saturation voltage drop Vce(sat) when the current reaches a specific proportion of the rated value in each switching cycle, and performs temperature compensation. The junction temperature Tj is estimated in real time through a thermal model or a lookup table method of saturation voltage drop Vce(sat) - junction temperature Tj. S4. The health status assessment module calculates the health index HI every minute, using the following simplified formula: HI=w1*(1-ΔVce(sat))+w2*(1-ΔRth)+w3*(1-ΔVge(th)), Where Δ represents the normalized change relative to the initial value, w1, w2, w3 are the weighting coefficients of each parameter, and w1 + w2 + w3 = 1, Vce(sat) is the saturation voltage drop, Rth is the thermal resistance, and Vge(th) is the emitter threshold voltage. The weights can be adjusted according to the sensitivity of the actual device to different failure modes. S5. The remaining service life prediction unit runs once per hour. First, based on the junction temperature fluctuation Δjunction temperature Tj in the past hour, the number of cycles is counted using the rainflow counting method, and the damage degree is calculated. Then, combined with the downward trend of the health index HI, the LSTM network is used to perform rolling prediction and output the RUL value. S6. The intelligent early warning and decision support unit compares the HI and RUL values ​​with preset thresholds. If the early warning condition is triggered, the alarm information is displayed on the local HMI. At the same time, the alarm code, HI value, RUL predicted value and suggested measures are packaged and sent to the remote monitoring center through the communication module. In this embodiment, by collecting multi-source data related to the health status of IGBTs in real time, the comprehensive and accurate data collection method can obtain IGBT status information in various aspects such as electrical, thermal, drive, and mechanical aspects, providing rich and accurate basic data for subsequent analysis and evaluation. Based on the real-time collected junction temperature fluctuation data, the damage caused to the IGBT by each power cycle and thermal cycle is calculated. The data-driven prediction model uses the time series data of historical health index to calculate the time point when the historical health index value drops to the preset failure threshold through the time series prediction algorithm, which is the predicted remaining service life. The prediction method can help maintenance personnel plan maintenance plans in advance, reasonably arrange equipment replacement time, avoid production interruptions and losses caused by sudden IGBT failures, reduce equipment damage and repair costs, and at the same time, reasonable operation and maintenance planning can extend the service life of IGBTs, improve equipment utilization, and reduce overall operation and maintenance costs. Example 2

[0021] Based on Example 1, such as Figures 4 to 10 As shown, the present invention provides a wind power converter IGBT monitoring system, wherein the cooling unit includes a cooling device, a temperature regulating device, a conveying device, a housing 101, a bracket 102, a first heat-conducting plate 103, a first air intake channel 104, a second air intake channel 105, an air volume regulating plate 106, and a filter screen 107. An exhaust port is provided on the upper part of the housing 101, and an air inlet is provided on the lower part of the housing 101; The bracket 102 is installed on the inner side wall of the housing 101; The first heat-conducting plate 103 is installed on the top of the bracket 102, and the IGBT is installed on the first heat-conducting plate 103; The first air intake channel 104 and the second air intake channel 105 are respectively connected to the air intake of the box 101, and a cooling device is installed in the second air intake channel 105. Two sets of air volume regulating plates 106 are respectively rotatably installed inside the first air intake channel 104 and the second air intake channel 105; The temperature regulating device is connected to the first heat-conducting plate 103. The temperature regulating device adjusts the rotation and opening of the two sets of air volume regulating plates 106 according to the temperature of the IGBT. Two sets of filters 107 are respectively installed at the bottom openings of the first air intake channel 104 and the second air intake channel 105. The conveying device is installed in the upper part of the housing 101 and is used to convey and circulate the air inside the housing 101. The temperature regulating device includes a cylinder 201, a piston 202, a connecting frame 203, a spring 204, a rack 205, and a gear 206; The cylinder 201 is installed on the inner side wall of the box 101, and the top of the cylinder 201 is connected to the bottom of the first heat-conducting plate 103; The piston 202 is slidably installed inside the cylinder 201, and mercury is provided inside the cylinder 201 at the top of the piston 202; The top of the connecting bracket 203 is connected to the bottom of the piston 202, and the lower part of the connecting bracket 203 is slidably installed on the outer wall of the first air intake channel 104 and the second air intake channel 105. Spring 204 is fitted onto connector 203; Both sets of racks 205 are installed at the bottom of the connecting frame 203; The two sets of gears 206 are concentrically connected to the two sets of air volume regulating plates 106 respectively, and the two sets of gears 206 mesh with the two sets of racks 205 respectively; The cooling device includes a conveying box 301, a first heat exchange tube 302, a second heat exchange tube 303, a cooling box 304, a semiconductor refrigeration plate 305, a second heat conduction plate 306, a cooling fan 307, and a conveying pump 308. Both sets of conveyor boxes 301 are installed on the inner side wall of the second air intake channel 105; Multiple sets of first heat exchange tubes 302 are connected and arranged between two sets of conveyor boxes 301; The top of the second heat exchange tube 303 is connected to the two sets of conveying boxes 301. The lower part of the second heat exchange tube 303 is arranged in a serpentine shape inside the cooling box 304. Liquid medium is provided in the second heat exchange tube 303, the conveying box 301 and the first heat exchange tube 302. Coolant is contained inside the cooling tank 304; The second heat-conducting plate 306 is connected to the cooling box 304, and the semiconductor cooling plate 305 is installed on the outer wall of the second heat-conducting plate 306. The heat dissipation end of the semiconductor cooling plate 305 is provided with fins. Cooling fan 307 is mounted on the outer wall of cooling box 304; The delivery pump 308 is connected to the second heat exchange tube 303; It also includes a guide rail 401, a magnetic block 402, and a position sensor 403; Guide rail 401 is installed on the outer wall of cylinder 201; The magnetic block 402 is slidably mounted on the guide rail 401, and the magnetic block 402 is magnetically connected to the piston 202; Multiple position sensors 403 are mounted on the outer wall of the guide rail 401; The conveying device includes a flow guide 501, a ventilation fan 502, and louvers 503; The air deflector 501 is installed in the upper part of the housing 101; The ventilation fan 502 is mounted on the air guide shroud 501; Louver 503 is installed at the exhaust port of housing 101; In this embodiment, the IGBT is mounted on the first heat-conducting plate 103. An airflow device transports air from the housing 101, allowing outdoor air to enter the housing 101 through the first air intake channel 104 and the second air intake channel 105. The air inside the housing 101 is then exhausted through the exhaust port, achieving airflow to dissipate heat and cool the IGBT. The heat generated by the IGBT during operation is transferred to the first heat-conducting plate 103. A temperature regulating device senses the temperature of the first heat-conducting plate 103. When the IGBT temperature is high, the temperature regulating device controls the two... The rotation angle of the airflow regulating plate 106 increases the air intake of the second air intake channel 105 and decreases the air intake of the first air intake channel 104. Because the cooling device cools the second air intake channel 105, it increases the amount of low-temperature air entering the housing 101, achieving high-power cooling for the IGBT. When the IGBT operating temperature is low, the air intake of the second air intake channel 105 is reduced and the amount of ambient temperature air entering the first air intake channel 104 is increased, achieving low-power cooling for the IGBT, improving the intelligent effect of IGBT cooling control, and reducing the impact on IGBT performance. The cooling energy consumption of the IGBT is as follows: the temperature of the IGBT is transferred to the first heat-conducting plate 103. When the temperature of the IGBT rises, the first heat-conducting plate 103 heats the mercury, causing it to expand. The mercury pushes the piston 202 downward. After the piston 202 moves downward, it drives the two sets of racks 205 downward and drives the two sets of gears 206 to rotate. After the two sets of gears 206 rotate, they drive the two sets of airflow regulating plates 106 to rotate in opposite directions. This increases the airflow of the second air intake channel 105 and decreases the airflow of the first air intake channel 104. By varying the temperature, the airflow of the two sets of airflow regulating plates is controlled. The different opening and closing angles of the flow control plate 106 control the liquid medium to circulate in the delivery box 301, the first heat exchange tube 302, and the second heat exchange tube 303 by turning on the delivery pump 308. The coolant in the cooling box 304 cools the second heat exchange tube 303, which in turn cools the liquid medium. The liquid medium then cools the first heat exchange tube 302, which in turn cools the air flowing in the second air intake channel 105. The semiconductor cooling plate 305 continuously cools the coolant, improving the constant temperature effect of air cooling.

[0022] The main functions achieved by this invention are: 1. By collecting multi-source data related to IGBT health status in real time, the comprehensive and accurate data collection method can obtain IGBT status information in multiple aspects such as electrical, thermal, drive and mechanical aspects, providing rich and accurate basic data for subsequent analysis and evaluation; 2. Achieve low-power cooling for IGBTs, improve the intelligent effect of IGBT cooling control, and reduce the cooling energy consumption of IGBTs.

[0023] The semiconductor cooling plate 305, cooling fan 307, delivery pump 308, position sensor 403, and ventilation fan 502 of the wind power converter IGBT monitoring system of the present invention are commercially available. Technical personnel in this industry only need to install and operate them according to the accompanying instruction manual, without requiring any creative work from those skilled in the art.

[0024] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A wind power converter IGBT monitoring system, characterized by, The system comprises a multi-sensor data acquisition unit, a data preprocessing and feature extraction unit, a health state evaluation unit, a residual service life prediction unit, and an intelligent early warning and decision support unit. The multi-sensor data acquisition unit acquires multi-source data related to the health state of the IGBT in real time by using electrical parameter sensors, thermal parameter sensors, driving state sensors, and mechanical parameter sensors. The data preprocessing and feature extraction unit is connected to the multi-sensor data acquisition unit and is used to filter, denoise, and align the collected raw data, and extract key feature parameters that can represent the degradation state of the IGBT. The increase in the on-state voltage drop under a specific current and junction temperature is a sign of chip aging, the increase in the junction temperature and case temperature indicates the degradation of the bonding wire or solder layer, and the drift of the gate threshold voltage reflects the degradation of the gate oxide layer. The health state evaluation unit is connected to the data preprocessing and feature extraction unit and is used to calculate the comprehensive health index of the IGBT based on the key feature parameters. The residual service life prediction unit is connected to the health state evaluation unit and is used to predict the residual service life of the IGBT based on a damage accumulation model and a data-driven prediction model. The damage accumulation model calculates the damage caused to the IGBT by each power cycle and thermal cycle according to the real-time collected junction temperature fluctuation data, and the data-driven prediction model uses the time series data of the historical health index to calculate the time point when the historical health index value drops to the preset failure threshold by using a time series prediction algorithm, which is the predicted residual service life. The intelligent early warning and decision support unit is connected to the health state evaluation unit and the residual service life prediction unit and is used to issue early warning information of different levels based on the health index and the residual service life, and provide maintenance recommendations.

2. A wind power converter IGBT monitoring system as claimed in claim 1, characterized in that, When the health index value is lower than 0.8 for the first time or the predicted residual service life is lower than the set value, attention is prompted, when the health index value continues to decrease and is lower than 0.6 or the change rate of the key parameters accelerates, a maintenance plan needs to be prepared, and when the health index value approaches the failure threshold or a failure is predicted to occur soon, a shutdown maintenance alarm is immediately issued. The system further comprises a cooling unit and an intelligent cooling control unit. The cooling unit is connected to the intelligent cooling control unit, which can issue cooling instructions to the cooling unit to operate at different powers according to the actual operating temperature of the IGBT.

3. A wind power converter IGBT monitoring system as claimed in claim 1, characterized in that, The intelligent cooling control unit is also connected to the multi-sensor data acquisition unit and can accurately control the operating power of the cooling unit by receiving and analyzing the IGBT temperature data collected by the multi-sensor data acquisition unit according to the actual operating temperature of the IGBT. The health state evaluation unit comprises a digital twin module and a health state evaluation module. The digital twin module is based on the temperature data physical properties and historical operation data of the IGBT and constructs a high-precision IGBT model that couples electrical, thermal, and mechanical stress, which simulates the internal state of the IGBT according to the real-time operating conditions. The health state evaluation module: the key feature parameters extracted in real time are compared and analyzed with the output values of the digital twin model and the initial reference values of the IGBT, and a comprehensive health index is calculated through a preset weighted average fusion algorithm. The health index value ranges from 0 to 1, 0 represents complete failure, and 1 represents a brand-new state.

4. A wind power converter IGBT monitoring system as claimed in claim 1, characterized in that, The electrical parameter sensor: used for collecting collector-emitter voltage Vce, gate-emitter voltage Vge and load current Ic data of the IGBT; The thermal parameter sensor: using a temperature sensor installed on the IGBT module, the operating temperature, case temperature Tc and junction temperature Tj of the IGBT module are collected in real time; The driving state sensor: used for monitoring the gate driving voltage and driving resistance state of the driving circuit; The mechanical parameter sensing unit: through the vibration sensor installed on the IGBT module, abnormal vibration caused by loose bonding wire or crack in the solder layer is monitored.

5. A wind power converter IGBT monitoring system as claimed in claim 2, characterized in that, The cooling unit includes a cooling device, a temperature adjusting device, a conveying device, a box body (101), a support (102), a first heat conduction plate (103), a first air inlet channel (104), a second air inlet channel (105), an air volume adjusting plate (106) and a filter screen (107); An air outlet is arranged on the upper part of the box body (101), and an air inlet is arranged on the lower part of the box body (101); The support (102) is installed on the inner side wall of the box body (101); The first heat conduction plate (103) is installed at the top end of the support (102), and the IGBT is installed on the first heat conduction plate (103); The first air inlet channel (104) and the second air inlet channel (105) are respectively arranged at the air inlets of the box body (101) in a communication mode, and the cooling device is arranged in the second air inlet channel (105); Two groups of air volume adjusting plates (106) are respectively rotatably installed in the first air inlet channel (104) and the second air inlet channel (105); The temperature adjusting device is connected with the first heat conduction plate (103), and the rotation opening of the two groups of air volume adjusting plates (106) is adjusted according to the temperature of the IGBT; Two groups of filter screens (107) are respectively arranged at the bottom openings of the first air inlet channel (104) and the second air inlet channel (105); The conveying device is arranged at the upper part in the box body (101), and is used for conveying and flowing the air in the box body (101).

6. A wind power converter IGBT monitoring system as claimed in claim 5, characterized in that, The temperature adjusting device includes a cylinder body (201), a piston (202), a connecting frame (203), a spring (204), a rack (205) and a gear (206); The cylinder body (201) is installed on the inner side wall of the box body (101), and the top end of the cylinder body (201) is in communication with the bottom end of the first heat conduction plate (103); The piston (202) is slidably installed in the cylinder body (201), and mercury is arranged in the cylinder body (201) at the top end of the piston (202); The top end of the connecting frame (203) is connected with the bottom end of the piston (202), and the lower part of the connecting frame (203) is slidably installed on the outer side wall of the first air inlet channel (104) and the second air inlet channel (105); The spring (204) is fitted on the connecting frame (203); Two groups of racks (205) are installed at the bottom end of the connecting frame (203); Two groups of gears (206) are concentrically connected with two groups of air volume adjusting plates (106), and the two groups of gears (206) are engaged with the two groups of racks (205).

7. A wind power converter IGBT monitoring system as claimed in claim 5, characterized in that, The cooling device comprises a conveying box (301), a first heat exchange pipe (302), a second heat exchange pipe (303), a cooling box (304), a semiconductor refrigeration plate (305), a second heat conduction plate (306), a heat dissipation fan (307) and a conveying pump (308); Two groups of conveying boxes (301) are installed on the inner side wall of the second air inlet channel (105); A plurality of first heat exchange pipes (302) are connected and arranged between the two groups of conveying boxes (301); The top end of the second heat exchange pipe (303) is in communication with the two groups of conveying boxes (301), and the lower part of the second heat exchange pipe (303) is arranged in a serpentine shape in the cooling box (304). The second heat exchange pipe (303), the conveying box (301) and the first heat exchange pipe (302) are provided with liquid medium; The cooling box (304) is provided with cooling liquid; The second heat conduction plate (306) is connected and arranged on the cooling box (304), the semiconductor refrigeration plate (305) is installed on the outer side wall of the second heat conduction plate (306), and the heat dissipation end of the semiconductor refrigeration plate (305) is provided with fins; The heat dissipation fan (307) is installed on the outer side wall of the cooling box (304); The conveying pump (308) is connected and arranged on the second heat exchange pipe (303).

8. A wind power converter IGBT monitoring system as claimed in claim 6, characterized in that, It also includes a guide rail (401), a magnetic block (402) and a position sensor (403); The guide rail (401) is installed on the outer side wall of the cylinder (201); The magnetic block (402) is slidably installed on the guide rail (401) and is magnetically connected with the piston (202); A plurality of position sensors (403) are arranged on the outer side wall of the guide rail (401).

9. A wind power converter IGBT monitoring system as claimed in claim 5, characterized in that, The conveying device comprises a flow guide cover (501), a ventilation fan (502) and a louver (503); The flow guide cover (501) is arranged at the upper part of the box body (101); The ventilation fan (502) is installed on the flow guide cover (501); The louver (503) is installed at the exhaust port of the box body (101).

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