Micro-fluidic chip clamping type temperature control device and control method thereof

Abstract

The invention relates to the technical field of microfluidic detection, in particular to a clamping type temperature control device for a microfluidic chip and a control method of the clamping type temperature control device. The device comprises a first temperature control module and a second temperature control module which are oppositely arranged along a first direction, wherein the second temperature control module is connected with the first temperature control module through a linear bearing and a guide shaft and can move along the first direction; the device is provided with a first elastic piece which is used for applying elastic force towards the first temperature control module to the second temperature control module so as to realize clamping of the micro-fluidic chip; a balance mechanism is further arranged and used for providing anti-inclination force to balance the gravity of the second temperature control module, and the parallel relation between the two modules is maintained. According to the invention, elastic clamping and independent balance are combined, so that the structure is simplified, the cost is reduced, self-adaptive adjustment and overload protection of clamping force are realized, the micro-fluidic chip is effectively prevented from being damaged by pressure, uniform thermal contact is ensured by actively maintaining a parallel relation, and the temperature control efficiency and the device reliability are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of microfluidic detection technology, and in particular to a microfluidic chip clamping temperature control device and its control method. Background Technology

[0002] In automated microfluidic testing systems, the temperature control module needs to be tightly bonded to the surface of the microfluidic chip to achieve efficient heat transfer. Existing clamping solutions mostly employ dual-rail guidance or direct motor-driven clamping. While the dual-rail structure offers good parallelism, it is complex, costly, and space-consuming. Furthermore, differences in friction and fit precision between the two rails can lead to jamming. More importantly, its rigid structure cannot adapt to minor unevenness in the microfluidic chip or mounting surface, potentially resulting in poor contact and low heat transfer efficiency.

[0003] However, the direct-drive clamping method using a motor carries risks of complex control and difficulty in precisely controlling the clamping force. Improper control can easily lead to excessive clamping force that crushes the brittle microfluidic chip, resulting in sample loss and experimental failure. Therefore, there is an urgent need for a temperature control device that combines high-precision guidance, adaptive bonding capabilities, and safe and reliable clamping force. Summary of the Invention

[0004] The purpose of this invention is to provide a microfluidic chip clamping temperature control device and its control method, which solves the problems of complex clamping mechanisms, lack of self-adaptive ability and unsafe clamping force control in the prior art.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a microfluidic chip clamping temperature control device, comprising a first temperature control module and a second temperature control module disposed opposite to each other along a first direction, characterized in that: The second temperature control module is connected to the first temperature control module via at least one linear bearing and a guide shaft passing through it, so that the second temperature control module can move relative to the first temperature control module in a first direction; The device further includes a first elastic element that applies a spring force to the second temperature control module, causing it to move toward the first temperature control module; and The device further includes a balancing mechanism for providing anti-tilting force to balance the gravitational tilt caused by the single-sided suspension state formed by the connection to the first temperature control module and to maintain the parallel relationship between the second temperature control module and the first temperature control module.

[0006] Optionally, the balancing mechanism includes a fixed block, a balancing guide rod connected to the second temperature control module, and a second elastic element acting between the fixed block and the second temperature control module; The balance guide rod passes through the fixed block and is arranged parallel to the guide shaft. When the second temperature control module moves along the guide shaft, the second temperature control module moves along the balance guide rod, or the second temperature control module and the balance guide rod move together relative to the fixed block.

[0007] Optionally, the resultant force of the elastic force of the first elastic element acting on the second temperature control module is greater than the resultant force of the pressure of the second elastic element acting on the second temperature control module.

[0008] Optionally, the first elastic element is a compression spring sleeved on the guide shaft.

[0009] Optionally, there may be multiple linear bearings and guide shafts, and each guide shaft may be arranged in parallel.

[0010] Optionally, the first temperature control module includes a first air duct, a first heat-conducting block, a first Peltier and a first cooling fan. The first cooling fan is disposed at one end of the first air duct, and a first vent is provided at the other end of the first air duct. The first heat-conducting block is disposed on one side of the first air duct, and the first Peltier is disposed between the first heat-conducting block and the first air duct. The second temperature control module includes a second air duct, a second heat-conducting block, a second Peltier, and a second cooling fan. The second cooling fan is located at one end of the second air duct, and a second vent is located at the other end of the second air duct. The second heat-conducting block is located on one side of the second air duct, and the second Peltier is located between the second heat-conducting block and the second air duct. After the second temperature control module is connected to the first temperature control module, the first cooling fan and the second cooling fan are arranged in opposite directions.

[0011] Optionally, the first temperature control module further includes a first heat sink, which serves as the side wall of the first air duct facing the second temperature control module or is disposed on the side wall of the first air duct facing the second temperature control module, and the first Peltier is disposed on the first heat sink. The second temperature control module further includes a second heat sink, which serves as the side wall of the second air duct facing the first temperature control module or is disposed on the side wall of the second air duct facing the first temperature control module, and the second Peltier is disposed on the second heat sink.

[0012] Optionally, the first heat-conducting block is provided with a plurality of first protrusions for contacting one side of a plurality of reaction chambers of the microfluidic chip; The second heat-conducting block is provided with a plurality of second protrusions for contacting the other side of the plurality of reaction chambers of the microfluidic chip.

[0013] Optionally, the first temperature control module and the second temperature control module are staggered in a second direction perpendicular to the first direction, such that a portion of the first temperature control module protrudes beyond the second temperature control module in the second direction to form a first gap space, while a portion of the second temperature control module protrudes beyond the first temperature control module in the second direction to form a second gap space.

[0014] Optionally, the device further includes a pull-out module, which includes a drive unit and an actuating part, the actuating part being configured to selectively engage or disengage from the second temperature control module; When in contact, the elastic force of the first elastic element is overcome, pulling the second temperature control module away from the first temperature control module; When detached, the second temperature control module clamps the microfluidic chip under the elastic force of the first elastic element.

[0015] Optionally, the pull-out module further includes a zero-position detection unit for detecting whether the actuating part has reached the initial position for pulling the second temperature control module.

[0016] Optionally, the zero-position detection unit includes a zero-position limiting plate disposed on the actuating part and a photoelectric switch disposed at a fixed position.

[0017] In a second aspect, the present invention also provides a control method for a microfluidic chip clamping temperature control device, used to control any clamping temperature control device with a pull-out module in the first aspect, comprising the following steps: The drive unit is controlled to drive the actuator to move to contact the second temperature control module, and continue to move to overcome the elastic force of the first elastic element, pulling the second temperature control module away from the first temperature control module, thus forming a released state; Inserting or removing the microfluidic chip; The drive unit is controlled to drive in reverse, causing the actuator to move toward the first temperature control module. The second temperature control module automatically resets under the elastic force of the first elastic element. After the second temperature control module contacts the microfluidic chip, it continues to move until the actuator disengages from the second temperature control module, so that the second temperature control module clamps the microfluidic chip under the action of the first elastic element.

[0018] The above-described technical solution of the present invention has the following advantages: The microfluidic chip clamping temperature control device provided by this invention achieves the movement of the second temperature control module through a sliding pair composed of a guide shaft and a linear bearing. A first elastic element provides a constant and flexible clamping force, and an independent balancing mechanism is introduced to counteract the tilting torque caused by gravity. This not only simplifies the structure and reduces costs, but also enables adaptive fitting and overload protection through elastic clamping, effectively preventing damage to the microfluidic chip. Simultaneously, the balancing mechanism actively maintains the parallel relationship between modules, ensuring uniform thermal contact and efficient thermal conductivity, comprehensively improving the reliability and temperature control effect of the device.

[0019] The control method for a microfluidic chip clamping temperature control device provided by this invention automates device operation by controlling the actuator to perform a specific process of "engagement-pulling" to release the microfluidic chip and "disengagement-elastic reset" to clamp the microfluidic chip. The core advantage of this method lies in the decoupling of drive and clamping: in the final clamping state, the actuator disengages from the temperature control module, allowing the clamping force to be provided entirely by the first elastic element, rather than the drive unit. This fundamentally eliminates the risk of over-clamping and ensures the safety of the microfluidic chip. Simultaneously, this streamlined operation improves efficiency and repeatability, making it particularly suitable for automated testing systems. Attached Figure Description

[0020] The accompanying drawings are provided for illustrative purposes only, and the proportions and quantities of the components in the drawings may not be consistent with the actual product.

[0021] Figure 1 This is a schematic diagram of the structure of a microfluidic chip clamping temperature control device according to Embodiment 1 of the present invention; Figure 2 yes Figure 1 Another structural diagram of the medium temperature control device; Figure 3 yes Figure 1 Another angled structural diagram of the medium temperature control device; Figure 4 yes Figure 3 A schematic diagram of the AA cross-section of the medium temperature control device; Figure 5 yes Figure 4 Enlarged schematic diagram of part C in the diagram; Figure 6 yes Figure 3 BB cross-sectional schematic diagram of the medium temperature control device; Figure 7 yes Figure 6 Enlarged schematic diagram of part D in the diagram; Figure 8 yes Figure 6 Enlarged schematic diagram of part E in the diagram; Figure 9 This is a schematic diagram of the structure of a first temperature control module according to Embodiment 1 of the present invention; Figure 10 This is a schematic diagram of the structure of a support plate according to Embodiment 1 of the present invention; Figure 11 This is a schematic diagram of the structure of a microfluidic chip clamping temperature control device according to Embodiment 2 of the present invention; Figure 12 yes Figure 11 Another structural diagram of the medium temperature control device; Figure 13 yes Figure 12 A schematic diagram of the FF cross-section of the medium temperature control device.

[0022] In the picture: 1: First temperature control module; 11: First air duct; 12: First heat conduction block; 121: First boss; 13: First Peltier; 14: First cooling fan; 15: First heat sink; 2: Second temperature control module; 21: Second air duct; 22: Second heat conduction block; 221: Second boss; 23: Second Peltier; 24: Second cooling fan; 25: Second heat sink; 3: Linear bearings; 4: Guide shaft; 5: First elastic element; 6: Balancing mechanism; 61: Fixed block; 62: Balancing guide rod; 63: Second elastic element; 7: Pull-out module; 71: Drive unit; 72: Base; 73: Actuator; 74: Zero-position detection unit; 741: Zero-position limit plate; 742: Photoelectric switch; 8: Support plate; 81: Support part; 82: Mounting part; 83: Limiting part; 9: Fixing plate; 100: First gap space; 200: Second gap space. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] This invention aims to provide a microfluidic chip temperature control device that combines adaptive clamping force, high parallelism assurance, and automated operation. Its core consists of a relatively movable temperature control module that works in conjunction with an elastic element to provide safe clamping under elastic preload. An independent balancing mechanism overcomes tilting caused by gravity, thus comprehensively solving problems such as difficulty in clamping force control, poor thermal contact, and complex structure in existing technologies.

[0025] The concept of the present invention will be further explained below through specific embodiments.

[0026] Example 1 like Figures 1 to 4 As shown, the microfluidic chip clamping temperature control device provided in this embodiment of the invention includes a first temperature control module 1 and a second temperature control module 2 arranged opposite to each other. The second temperature control module 2 is connected to the first temperature control module 1 (or a frame fixed to the first temperature control module 1, such as a fixing plate 9) via a guide assembly. In this embodiment, specifically, the guide assembly includes at least one linear bearing 3 and a guide shaft 4 passing through it. The linear bearing 3 is fixedly mounted on the second temperature control module 2, and the guide shaft 4 is fixedly connected to the first temperature control module 1 after passing through the linear bearing 3. The second temperature control module 2 can move along the guide shaft 4. Thus, the second temperature control module 2 can move stably along the axial direction of the guide shaft 4 (i.e., the first direction, which is also the clamping direction), thereby moving closer to or away from the first temperature control module 1 to achieve the clamping and release of the microfluidic chip. This guide assembly has a compact structure and is integrated between the two temperature control modules, without occupying additional external space of the system, which is beneficial for optimizing the overall layout.

[0027] See Figure 6 and Figure 7 The device also includes a first elastic element 5. The first elastic element 5 is configured to continuously apply a spring force to the second temperature control module 2, causing it to move towards the first temperature control module 1. This spring force directly constitutes the preload force for clamping the microfluidic chip. Because this force is generated by an elastic element, rather than being rigidly driven, it can adapt to minute changes in the thickness of the microfluidic chip and naturally possesses overload protection, effectively preventing the crushing of the brittle microfluidic chip. In a specific example, such as... Figure 6 and Figure 7 As shown, the first elastic element 5 is a compression spring sleeved on the guide shaft 4. It can be understood that the first elastic element 5 can also be a disc spring, an elastic rubber column, or other elastic elements that can provide pressure.

[0028] In this embodiment, a linear bearing is mounted on the second temperature control module 2, and a guide shaft 4 passes through the linear bearing 3 and is fixedly connected to the first temperature control module 1, allowing the second temperature control module 2 to move along the guide shaft 4. The second temperature control module 2 is connected to the first temperature control module 1 (or a frame fixed to the first temperature control module 1, such as a fixing plate 9) only through the guide shaft 4 passing through the linear bearing 3, forming a single-sided suspended layout. In this state, the second temperature control module 2 has a natural tendency to tilt under the action of gravity, and its tilting amplitude is affected by the fit clearance between the linear bearing 3 and the guide shaft 4. Although this tilt does not affect the normal movement of the second temperature control module 2 along the guide shaft direction, in the application of double-sided heated microfluidic chips, if the two temperature control modules are not kept parallel, it may affect the uniformity of heating of the microfluidic chip. To achieve uniform heat conduction, the key is to ensure the parallelism of the two temperature control modules when clamped. For this reason, the device in this embodiment is also equipped with an independent balancing mechanism 6. The balancing mechanism 6 is used to provide an anti-tilting force, which is mainly used to balance the weight of the second temperature control module 2 itself, thereby maintaining the parallel relationship between the second temperature control module 2 and the first temperature control module 1 throughout the entire process of moving and clamping the second temperature control module 2, and avoiding tilting of the module due to gravitational torque.

[0029] Figures 3 to 5 A preferred embodiment of the balancing mechanism is shown. The balancing mechanism includes a fixed block 61 (fixed to a fixed plate 9 or fixed to the fixed plate 9 via a base), a balancing guide rod 62 connected to a second temperature control module 2, and a second elastic element 63. The balancing guide rod 62 passes through the fixed block 61 and is arranged parallel to the guide shaft 4. The second elastic element 63 (e.g., a compression spring) acts between the fixed block 61 and the second temperature control module 2. During assembly, the second elastic element 63 has a certain preload to resist the tilting tendency of the second temperature control module 2 due to gravity. When the second temperature control module 2 moves along the guide shaft 4, in one example, the second temperature control module 2 can slide relative to the balancing guide rod 62, that is, the second temperature control module 2 moves simultaneously along the balancing guide rod 62. During the movement, the second elastic element 63 deforms, always providing the required anti-tilting force. Preferably, the balancing guide rod 62 is connected to the second temperature control module 2 via a linear bearing, and one end of the balancing guide rod 62 is threadedly connected to the fixed block.

[0030] In another example, the balance guide rod 62 is slidably connected to the fixed block 61, and the balance guide rod 62 is fixedly connected to the second temperature control module 2. The balance guide rod 62 and the second temperature control module 2 move synchronously relative to the fixed block 61. Preferably, the balance guide rod 62 is connected to the fixed block 61 via a linear bearing.

[0031] like Figure 4 and Figure 5As shown, preferably, the second elastic element 63 is a compression spring sleeved on the balance guide rod 62. It can be understood that the second elastic element 63 can also be a disc spring, an elastic rubber column, or other elastic elements that can provide pressure.

[0032] To balance the gravitational tilt caused by the unilateral suspension of the second temperature control module and maintain the parallel relationship between the second and first temperature control modules, while further ensuring reliable clamping, in one example, the resultant force of the elastic force of the first elastic element 5 acting on the second temperature control module 2 is greater than the resultant force of the pressure of the second elastic element 63 acting on the second temperature control module 2. This ensures that after balancing gravity, there is still sufficient net clamping force to guarantee contact of the microfluidic chip, while avoiding the inability to close the modules or uneven clamping force due to excessive force from the second elastic element 63.

[0033] It is worth noting that the balancing mechanism 6 is not limited to the "guide rod + spring" form. In this embodiment, a magnetic balancing mechanism (such as like pole magnets repelling each other to provide repulsive force) is used. All these mechanisms that can provide "anti-tilting force" fall within the scope of the present invention.

[0034] To further enhance motion stability, see one example. Figure 6 As shown, the number of linear bearings 3 and guide shafts 4 can be multiple (e.g., two), and each of the guide shafts 4 is arranged parallel to each other.

[0035] To enable automated operation, in one example, the temperature control device also includes a pull-out module 7, see [link / reference]. Figure 1 , Figure 2 , Figure 4 and Figure 6 The pull-out module 7 includes a drive unit 71 (such as a lead screw motor), a base 72, and an actuating part 73 (such as a tension block mounted on the lead screw) driven by the drive unit 71 and movable relative to the base 72. The actuating part 73 is configured to selectively engage or disengage from the second temperature control module 2.

[0036] The following explanation, using a telescopic lead screw stepper motor as an example of the drive unit 71, further illustrates the working process of the pull-out module 7. When it is necessary to insert or remove the microfluidic chip, the telescopic lead screw stepper motor operates, and the actuator 73 moves linearly with the lead screw, abutting against the second temperature control module 2 and overcoming the elastic force of the first elastic element 5, pulling the second temperature control module 2 away from the first temperature control module 1. During this process, the second temperature control module 2 compresses the first elastic element 5, giving it a greater preload. At this point, the device enters a release state, facilitating the insertion and removal of the microfluidic chip. When clamping is required, the lead screw of the telescopic lead screw stepper motor moves in the opposite direction, causing the actuator 73 to move towards the first temperature control module 1. During this process, the first elastic element 5 gradually releases its elastic force, and the second temperature control module 2 automatically resets under the action of the elastic force of the first elastic element 5. The device enters a clamping state and continues to move until the actuator 73 disengages from the second temperature control module 2, allowing the second temperature control module 2 to clamp the microfluidic chip under the action of the first elastic element 5. This example does not use rigid clamping; instead, it uses the elasticity of the first elastic element to achieve clamping, thus avoiding damage to the microfluidic chip.

[0037] In this embodiment, the actuating part 73 is not limited to a mechanical push / pull block, but can be an electromagnet attraction / disengagement structure, or any form that can be coupled with a corresponding structure (such as a groove or a magnet) on the second temperature control module 2.

[0038] To ensure control accuracy, the pull-out module 7 may further include a zero-position detection unit 74, used to detect whether the actuating part 73 has reached the initial position for pulling the second temperature control module 2. In one specific embodiment, the zero-position detection unit 74 includes a zero-position limiting piece 741 disposed on the actuating part 73 and a photoelectric switch 742 fixedly disposed on the base 72 or other fixed structure (e.g., fixed plate 9). When the zero-position limiting piece 741 enters or interrupts the light path of the photoelectric switch 742, it is determined that the actuating part 73 has reached the initial position (returned to zero).

[0039] In one example, a preferred structure for a temperature control module is provided, see [link to example]. Figure 1 , Figure 2 , Figure 4 , Figure 8 and Figure 9 The first temperature control module 1 includes a first air duct 11, a first heat-conducting block 12, a first Peltier 13, and a first cooling fan 14. The first cooling fan 14 is disposed at one end of the first air duct 11, and has a vent at the other end. The first heat-conducting block 12 is used to contact the microfluidic chip, and the first Peltier 13 is disposed between the first heat-conducting block 12 and the first air duct 11 for cooling or heating.

[0040] Similarly, the second temperature control module 2 includes a second air duct 21, a second heat-conducting block 22, a second Peltier 23, and a second cooling fan 24.

[0041] To optimize airflow and avoid mutual interference, when the first temperature control module 1 and the second temperature control module 2 are connected, the first cooling fan 14 and the second cooling fan 24 are arranged in opposite directions (e.g., one blows air and the other exhausts air; or the airflow directions are at a 180-degree angle). This not only refers to strict reversal, but also includes any different airflow directions that can form an effective flow channel and prevent hot air backflow.

[0042] To further improve heat dissipation efficiency, the first temperature control module 1 may also include a first heat sink 15 (typically a finned structure of the air duct wall, for example, in the figure, Figure 1 The spacer-like structure within the first air duct is a fin, and the substrate connected to the fin is the air duct wall. The first heat sink 15 can serve as the side wall of the first air duct 11 facing the second temperature control module 2, or it can be attached to the side wall. The first Peltier 13 is disposed on the first heat sink 15.

[0043] The second temperature control module 2 may also include a second heat sink 25 (typically a finned structure of the air duct wall in the figure, for example, Figure 2 The spacer-like structure within the second air duct is a fin, and the substrate connected to the fin is the air duct wall. The second heat sink 25 can serve as the side wall of the second air duct 21 facing the first temperature control module 1, or it can be attached to the side wall. The second Peltier 23 is disposed on the second heat sink 25.

[0044] To achieve precise and rapid temperature control of multiple reaction chambers on a microfluidic chip, see [reference needed]. Figure 8 and Figure 9 The first heat-conducting block 12 has multiple first protrusions 121, and the second heat-conducting block 22 has multiple second protrusions 221. These protrusions are designed to make corresponding contact with the various reaction chambers of the microfluidic chip, thereby reducing heat capacity, increasing heat flux density, and achieving rapid heating and cooling and zoned temperature control. In addition, the fit with the reaction chambers is further improved.

[0045] In one example, the first temperature control module 1 is fixed to the fixed plate 9 or other structure (such as the housing of the microfluidic detection system) by two support plates 8. The two support plates 8 are spaced apart, which not only provides support but also minimizes space occupation and facilitates the arrangement of other modules of the microfluidic detection system.

[0046] See one example. Figure 1 and Figure 10The support plate 8 includes a support portion 81, a mounting portion 82, and a limiting portion 83. The mounting portion 82 is used to connect and fix with the fixing plate 9. The support portion 81 is vertically mounted to the 82 and extends outward, with a certain distance between it and the fixing plate 9, forming a space under the support portion 81 to facilitate the installation and arrangement of other modules. The first temperature control module 1 is mounted on the support portion 81. The limiting portion 83 is located between the first temperature control module 1 and the second temperature control module 2, which limits the travel of the second temperature control module 2 to prevent it from colliding with the first temperature control module 1 or other modules in the microfluidic detection system when moving towards the first temperature control module 1 without the microfluidic chip inserted.

[0047] Example 2 See Figures 11 to 13 As shown, this second embodiment is basically the same as the first embodiment, and the similarities will not be repeated. The difference is that: the first temperature control module 1 and the second temperature control module 2 are along the first direction (clamping direction). Figure 13 The first temperature control module 1 and the second temperature control module 2 are positioned relative to each other in a second direction perpendicular to the first direction (in the left-right direction). Figure 13 The components are staggered in the vertical direction, such that a portion of the first temperature control module 1 protrudes beyond the second temperature control module 2 in the second direction, forming a first notch space 100. Simultaneously, a portion of the second temperature control module 2 protrudes beyond the first temperature control module 1 in the second direction, forming a second notch space 200. Both the first notch space 100 and the second notch space 200 can be used to arrange other modules or components of the microfluidic chip detection system. In this embodiment, the first notch space 100 and the second notch space 200 provide space for arranging other functional modules, providing a foundation for implementing more functions, optimizing the spatial layout, and achieving multi-functional integration. This is a key design feature for system miniaturization.

[0048] In this embodiment, the first notch space 100 and the second notch space 200 are configured as functional accommodating spaces. In constructing a complete microfluidic detection system, in one example, the first notch space 100 can be used to accommodate a sample driving module (e.g., a high-precision syringe pump or pipetting mechanism), allowing its drive shaft or needle to approach the held microfluidic chip from the side, enabling automated control of the liquid within the microfluidic chip. The second notch space 200 can be used to accommodate a scanning detection module (e.g., a fluorescence excitation light source, an optical lens, or a detection sensor), allowing its optical path to be aligned with the reaction detection area of ​​the microfluidic chip from below. This layout allows the three core functions of temperature control, sample loading, and detection to be spatially interleaved, greatly optimizing the system layout and space utilization.

[0049] The staggered layout of the first temperature control module 1 and the second temperature control module 2 in this embodiment can be applied to any of the microfluidic chip clamping temperature control devices in embodiment 1.

[0050] The temperature control device in this embodiment not only solves the problems of pressure loss and uneven contact of microfluidic chips through elastic clamping, but also provides physical integration space for other key functional modules of the microfluidic detection system (such as sample addition or sample operation, optical detection) without increasing the size of the device through a unique staggered layout, thus realizing system-level miniaturization and functional integration.

[0051] Example 3 This embodiment also provides a control method for a microfluidic chip clamping temperature control device, used to control the microfluidic chip clamping temperature control device with pull-out module 7 as described above, the steps of which are as follows: The control drive unit 71 drives the actuating part 73 to move to contact the second temperature control module 2, and continues to move to overcome the elastic force of the first elastic member 5, pulling the second temperature control module 2 away from the first temperature control module 1, forming a released state; Inserting or removing the microfluidic chip; The control drive unit 71 drives in reverse, causing the actuator 73 to move toward the first temperature control module 1. The first elastic element 5 gradually releases its elastic force, and the second temperature control module 2 automatically resets under the action of the elastic force of the first elastic element 5. After the second temperature control module 2 contacts the microfluidic chip, it continues to move until the actuator 73 disengages from the second temperature control module 2, so that the second temperature control module 2 clamps the microfluidic chip under the action of the first elastic element 5.

[0052] In summary, the microfluidic chip clamping temperature control device of the present invention replaces rigid drive with elastic pre-tightening force, prevents microfluidic chip breakage, adapts to thickness, and achieves fully adaptive clamping.

[0053] An independent balancing mechanism actively counteracts gravity tilt, ensuring that the two modules are parallel, resulting in uniform and efficient thermal contact and achieving high-precision heat transfer.

[0054] The multi-axis parallel guide structure ensures smooth and uninterrupted movement, achieving stable and reliable guidance while reducing space occupation and optimizing spatial layout.

[0055] The fan is arranged in reverse to optimize heat dissipation; the boss design enables fast and localized temperature control, achieving efficient heat dissipation and precise temperature control.

[0056] By adjusting the module settings, the opening and closing of the device is automated and highly repeatable.

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that not every embodiment contains only one independent technical solution, and in the absence of conflict between solutions, the various technical features mentioned in each embodiment can be combined in any way to form other implementation methods that can be understood by those skilled in the art.

[0058] Furthermore, without departing from the scope of the present invention, modifications to the technical solutions described in the foregoing embodiments, or equivalent substitutions of some of the technical features, shall not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A microfluidic chip clamping temperature control device, comprising a first temperature control module and a second temperature control module disposed opposite to each other along a first direction, characterized in that: The second temperature control module is connected to the first temperature control module through at least one linear bearing and a guide shaft passing through it, so that the second temperature control module can move relative to the first temperature control module in a first direction, so that the two can move closer or further apart, thereby clamping or releasing the microfluidic chip. The device further includes a first elastic element that applies a spring force to the second temperature control module, causing it to move toward the first temperature control module; and It also includes a balancing mechanism to provide anti-tilt force to balance the gravitational tilt caused by the second temperature control module being connected to the first temperature control module in a unilateral suspension state and to maintain the parallel relationship between the second temperature control module and the first temperature control module.

2. The microfluidic chip clamping temperature control device according to claim 1, characterized in that: The balancing mechanism includes a fixed block, a balancing guide rod connected to the second temperature control module, and a second elastic element acting between the fixed block and the second temperature control module; The balance guide rod passes through the fixed block and is arranged parallel to the guide shaft. When the second temperature control module moves along the guide shaft, the second temperature control module moves along the balance guide rod, or the second temperature control module and the balance guide rod move together relative to the fixed block.

3. The microfluidic chip clamping temperature control device according to claim 2, characterized in that: The resultant force of the elastic force exerted by the first elastic element on the second temperature control module is greater than the resultant force of the pressure exerted by the second elastic element on the second temperature control module.

4. The microfluidic chip clamping temperature control device according to claim 1, characterized in that: The first elastic element is a compression spring sleeved on the guide shaft.

5. The microfluidic chip clamping temperature control device according to claim 1, characterized in that: The linear bearings and guide shafts are of multiple types, and the guide shafts are arranged in parallel.

6. The microfluidic chip clamping temperature control device according to claim 1, characterized in that: The first temperature control module includes a first air duct, a first heat-conducting block, a first Peltier and a first cooling fan. The first cooling fan is disposed at one end of the first air duct, and a first vent is provided at the other end of the first air duct. The first heat-conducting block is disposed on one side of the first air duct, and the first Peltier is disposed between the first heat-conducting block and the first air duct. The second temperature control module includes a second air duct, a second heat-conducting block, a second Peltier, and a second cooling fan. The second cooling fan is located at one end of the second air duct, and a second vent is located at the other end of the second air duct. The second heat-conducting block is located on one side of the second air duct, and the second Peltier is located between the second heat-conducting block and the second air duct. After the second temperature control module is connected to the first temperature control module, the first cooling fan and the second cooling fan are arranged in opposite directions.

7. The microfluidic chip clamping temperature control device according to claim 6, characterized in that: The first temperature control module further includes a first heat sink, which serves as the side wall of the first air duct facing the second temperature control module or is disposed on the side wall of the first air duct facing the second temperature control module, and the first Peltier is disposed on the first heat sink. The second temperature control module further includes a second heat sink, which serves as the side wall of the second air duct facing the first temperature control module or is disposed on the side wall of the second air duct facing the first temperature control module, and the second Peltier is disposed on the second heat sink.

8. The microfluidic chip clamping temperature control device according to claim 6, characterized in that: The first heat-conducting block is provided with a plurality of first protrusions for contacting one side of a plurality of reaction chambers of the microfluidic chip; The second heat-conducting block is provided with a plurality of second protrusions for contacting the other side of the plurality of reaction chambers of the microfluidic chip.

9. The microfluidic chip clamping temperature control device according to claim 1, characterized in that: The first temperature control module and the second temperature control module are staggered in a second direction perpendicular to the first direction, such that a part of the first temperature control module protrudes from the second temperature control module in the second direction to form a first gap space, while a part of the second temperature control module protrudes from the first temperature control module in the second direction to form a second gap space.

10. The microfluidic chip clamping temperature control device according to any one of claims 1 to 9, characterized in that: It also includes a pull-out module, which includes a drive unit and an actuating part, the actuating part being configured to selectively engage or disengage from the second temperature control module; When in contact, the elastic force of the first elastic element is overcome, pulling the second temperature control module away from the first temperature control module; When detached, the second temperature control module clamps the microfluidic chip under the elastic force of the first elastic element.

11. The microfluidic chip clamping temperature control device according to claim 10, characterized in that: The pull-out module also includes a zero-position detection unit, used to detect whether the actuating part has reached the initial position for pulling the second temperature control module.

12. The microfluidic chip clamping temperature control device according to claim 11, characterized in that: The zero-position detection unit includes a zero-position limiting plate disposed on the actuating part and a photoelectric switch disposed at a fixed position.

13. A control method for a microfluidic chip clamping temperature control device, used to control the clamping temperature control device as described in any one of claims 10 to 12, characterized in that, Includes the following steps: The drive unit is controlled to drive the actuator to move to contact the second temperature control module, and continue to move to overcome the elastic force of the first elastic element, pulling the second temperature control module away from the first temperature control module, thus forming a released state; Inserting or removing the microfluidic chip; The drive unit is controlled to drive in reverse, causing the actuator to move toward the first temperature control module. The second temperature control module automatically resets under the elastic force of the first elastic element. After the second temperature control module contacts the microfluidic chip, it continues to move until the actuator disengages from the second temperature control module, so that the second temperature control module clamps the microfluidic chip under the action of the first elastic element.

Images