LED lamp bead chip mounter

Abstract

An LED lamp bead chip mounter disclosed by the present invention comprises a first conveying mechanism, the first conveying mechanism is provided with a solder paste printing mechanism, a chip mounting mechanism, a feeding mechanism, a detection mechanism, a transfer mechanism and a plurality of groups of photoelectric sensors, a jacking mechanism is arranged below the solder paste printing mechanism, and the chip mounting mechanism comprises a linear driving assembly and a first electric cylinder. The linear driving assembly and the first electric cylinder are both used for driving the multiple sets of vacuum suction nozzles at the tail end. The technical key points are as follows: the chip mounter integrates solder paste printing, chip mounting and detection, the PCB does not need to be transferred for multiple times, the flatness and the positioning reference of a transmission belt are consistent, the flow is smoothly linked, the production takt is matched, defects are controlled in a mounting link, defective products are prevented from flowing to subsequent procedures, the quality of finished products is improved, and the production efficiency is improved. The solder paste printing mechanism, the chip mounting mechanism and the detection mechanism are arranged at equal intervals, during continuous chip mounting, solder paste printing, chip mounting and detection are synchronously carried out, and the working efficiency of the chip mounter is improved.

Description

Technical Field

[0001] This invention relates to the field of surface mount technology, and in particular to an LED chip mounting machine. Background Technology

[0002] LED chip mounters are automated equipment specifically designed for surface mount technology (SMT) of LED chips. Their core function is to precisely and efficiently mount LED chips onto PCB circuit boards, and they are widely used in LED lighting, displays, backlight modules, automotive electronics, and other fields.

[0003] In LED chip manufacturing, solder paste printing, chip mounting, and post-mount quality inspection are all operated as independent equipment, which can easily lead to inefficient process connections, mismatched production cycles, and when PCBs are transferred between different devices, inconsistencies in positioning references, such as differences in conveyor belt flatness and fixtures, can cause solder paste printing to shift, which in turn can cause chip mounting to shift, ultimately leading to a chain reaction of quality inspection misjudgments. During the mounting process, if defective products are not intercepted in time, it can cause problems in subsequent soldering and assembly. Summary of the Invention

[0004] Technical problems to be solved:

[0005] To address the shortcomings of existing technologies, this invention provides an LED chip mounter that integrates solder paste printing, mounting, and inspection. It eliminates the need for multiple transfers of the PCB board, ensures consistent flatness and positioning of the conveyor belt, smooth process flow, and matched production cycle time. Defects are controlled at the mounting stage, preventing defective products from flowing to subsequent processes and improving finished product quality. The solder paste printing mechanism, mounting mechanism, and inspection mechanism are equally spaced, allowing for simultaneous solder paste printing, mounting, and inspection during continuous mounting, thus improving the machine's efficiency and solving the technical problems mentioned in the background section.

[0006] Technical solution:

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] An LED chip mounter includes a first conveying mechanism, on which are mounted a solder paste printing mechanism, a chip mounter, a feeding mechanism, a detection mechanism, a transfer mechanism, and multiple sets of photoelectric sensors. A lifting mechanism is located below the solder paste printing mechanism. The chip mounter includes a linear drive assembly and a first electric cylinder, both used to drive multiple sets of vacuum nozzles at the end. The feeding mechanism includes a side plate, on which a second motor is mounted. The output shaft of the second motor is fixedly connected to a winding roller, which is connected to LED chip tape. Multiple sets of vacuum nozzles... The nozzles correspond one-to-one with the mounting positions on the PCB board. The inspection mechanism includes an inspection frame with a CCD camera mounted on it. The transfer mechanism includes a third motor and a third cylinder, both of which drive the negative pressure suction tube at the end. A second conveying mechanism is provided on one side of the transfer mechanism. The lifting mechanism includes a second electric cylinder, with the push rod of the second electric cylinder fixedly connected to a suction cup. The suction cup has a negative pressure adsorption hole. The solder paste printing mechanism, the placement mechanism, and the inspection mechanism share a single conveyor line. The placement machine integrates solder paste printing, placement, and inspection into one unit.

[0009] In one possible implementation, the solder paste printing mechanism includes a fixed frame and a linear motor. The slide of the linear motor is fixedly connected to a drive frame. A first cylinder and a second cylinder are mounted on the drive frame. The push rod of the first cylinder is fixedly connected to a first scraper, and the push rod of the second cylinder is fixedly connected to a second scraper. The first and second scrapers are inclined in opposite directions. The two scrapers move in opposite directions and alternately squeeze the solder paste to fill the openings of the stencil printing slot, making the solder paste distribution more even and improving the printing quality.

[0010] In one possible implementation, a steel mesh is provided on the fixing frame, and a printing groove is formed on the steel mesh, which is adapted to the mounting position on the PCB board.

[0011] In one possible implementation, the linear drive assembly includes a U-shaped base. A first motor is mounted on one end face of the U-shaped base, and the output shaft of the first motor is fixedly connected to a lead screw. A slide rod is fixedly mounted on the U-shaped base, and the slide rod is located above the lead screw. Both the slide rod and the lead screw pass through the slide base, and the slide base and the slide rod are slidably connected. A drive arm is fixedly connected to the slide base, and a fixed plate is fixedly connected to the drive arm. A first electric cylinder is mounted on the fixed plate, and the push rod of the first electric cylinder is fixedly connected to a negative pressure drive base. The negative pressure drive base has a built-in vacuum pump assembly and is mounted on a substrate. Multiple sets of vacuum nozzles are provided on the lower end face of the substrate. The height of the multiple sets of vacuum nozzles is adjusted by the first electric cylinder, and the horizontal position of the multiple sets of vacuum nozzles is adjusted by the linear drive assembly to achieve LED bead pickup.

[0012] In one possible implementation, the LED bead tape is provided with multiple sets of LED beads. Several LED beads are embedded in the cavity of the carrier tape at a fixed interval and in a fixed arrangement to form a continuous roll packaging form. When the second motor is working, it drives the roller at one end to rotate. The roller winds the LED bead tape, drives multiple sets of LED beads to the feeding position, and they are precisely peeled off during the bonding process.

[0013] In one possible implementation, the suction cup is connected to a vacuum pump assembly via a second flexible hose. The vacuum pump assembly operates to generate negative pressure suction force through the negative pressure suction holes on the suction cup, and the PCB board is fixed by relying on this negative pressure suction force.

[0014] In one possible implementation, the transfer mechanism includes a transfer frame on which a third motor is mounted. The output shaft of the third motor is fixedly connected to a transfer arm, which is fixedly connected to a mounting plate. A third cylinder is mounted on the mounting plate, and the push rod of the third cylinder is fixedly connected to a negative pressure suction tube. When the PCB board in the detection area is not properly mounted, the transfer mechanism picks up the PCB board, moves it out, and transfers it to the second conveying mechanism.

[0015] In one possible implementation, the negative pressure suction tube is connected to a vacuum pump assembly via a first flexible tube, and the vacuum pump assembly operates to generate negative pressure suction force in the negative pressure suction tube.

[0016] In one possible implementation, both the first and second conveying mechanisms include side frames, on which multiple sets of conveying rollers are mounted, and the conveying rollers are connected to the side frames via bearings. One set of the conveying rollers is connected to the output shaft of a motor, and a conveyor belt is provided on the conveying rollers. The spacing between the side frames on both sides of the conveying mechanism is adapted to the size of the PCB board. When the PCB board is conveyed by the conveying mechanism, the side frames on both sides limit the PCB board to prevent the PCB board from deviating from the designated path.

[0017] In one possible implementation, the photoelectric sensor includes a transmitter and a receiver. A groove is provided on the side frame. The transmitter and receiver are respectively installed on the side frames on both sides of the first conveying mechanism and located in the groove of the side frame. The photoelectric sensor determines the existence or position change of the PCB board by emitting light signals and receiving changes in reflected light signals. It converts the spatial position of the PCB board into the on / off changes of light signals, and then converts them into electrical signals through circuit processing. Finally, the control system parses them into position data.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] 1. The solder paste printing mechanism, placement mechanism and inspection mechanism of the present invention share a single conveyor line. Photoelectric sensors are installed in the solder paste printing area, placement area and inspection area. Multiple sets of photoelectric sensors are used to accurately position the PCB board. The placement machine integrates solder paste printing, placement and inspection into one unit. There is no need to transfer the PCB board multiple times. The flatness of the conveyor belt and the positioning reference are consistent. The process is smooth and the production cycle is matched.

[0020] 2. In this invention, the PCB board after mounting is inspected by the inspection agency, and the transfer mechanism is used as the execution mechanism. When defective products are detected, the transfer mechanism picks up and transfers the defective products, thereby controlling the defects at the mounting stage, preventing defective products from flowing to subsequent processes, and improving the quality of finished products.

[0021] 3. In this invention, the solder paste printing mechanism, the placement mechanism, and the inspection mechanism are arranged at equal intervals. During continuous placement, solder paste printing, placement, and inspection are carried out simultaneously, which improves the working efficiency of the placement machine. Attached Figure Description

[0022] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0023] Figure 1 This is a schematic diagram of one side view of the structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure from another side view of the present invention;

[0025] Figure 3 This is a schematic diagram of the lifting mechanism of the present invention;

[0026] Figure 4 This is a schematic diagram of the solder paste printing mechanism of the present invention;

[0027] Figure 5 This is a schematic diagram of the steel mesh structure of the present invention;

[0028] Figure 6 This is a schematic diagram of the patch mechanism of the present invention;

[0029] Figure 7 This is a schematic diagram of the feeding mechanism of the present invention;

[0030] Figure 8 This is a schematic diagram of the detection mechanism of the present invention;

[0031] Figure 9 This is a schematic diagram of the transfer mechanism of the present invention;

[0032] Figure 10This is a schematic diagram of the photoelectric sensor of the present invention.

[0033] In the diagram: 1. First conveying mechanism; 2. Solder paste printing mechanism; 3. SMT placement mechanism; 4. Feeding mechanism; 5. Detection mechanism; 6. Transfer mechanism; 7. Second conveying mechanism; 8. Lifting mechanism; 9. Photoelectric sensor; 11. Side frame; 12. Conveyor roller; 13. Conveyor belt; 21. Fixed frame; 22. Linear motor; 23. Drive frame; 24. First cylinder; 25. Second cylinder; 26. First scraper; 27. Second scraper; 28. Stencil; 29. ​​Printing tank; 31. Linear drive assembly; 32. Drive arm; 33. Fixed plate; 34. First electric cylinder; 35. Negative pressure drive base; 6. Substrate; 37. Vacuum nozzle; 311. U-shaped seat; 312. First motor; 313. Lead screw; 314. Slide rod; 315. Slide block; 41. Side plate; 42. Second motor; 43. Roller; 44. LED bead tape; 45. LED bead; 51. Detection frame; 52. CCD camera; 61. Transfer frame; 62. Third motor; 63. Transfer arm; 64. Mounting plate; 65. Third cylinder; 66. Negative pressure suction tube; 67. First flexible tube; 81. Second electric cylinder; 82. Suction cup; 83. Negative pressure suction hole; 84. Second flexible tube; 91. Transmitter; 92. Receiver. Detailed Implementation

[0034] This application provides an LED chip mounter that integrates solder paste printing, mounting, and inspection. It eliminates the need for multiple transfers of the PCB board, ensures consistent flatness and positioning of the conveyor belt, smooth process flow, and matched production rhythm. Defects are controlled at the mounting stage, preventing defective products from flowing to subsequent processes and improving finished product quality. The solder paste printing mechanism, mounting mechanism, and inspection mechanism are equally spaced, allowing for simultaneous solder paste printing, mounting, and inspection during continuous mounting, thus improving the machine's efficiency and solving the technical problems mentioned in the background art.

[0035] The technical solution in this application embodiment is to solve the problems mentioned in the background art, and the overall idea is as follows:

[0036] Example 1:

[0037] Please see Figure 1-10This invention provides a technical solution: an LED chip mounter, comprising a first conveying mechanism 1, on which a solder paste printing mechanism 2, a mounting mechanism 3, a feeding mechanism 4, a detection mechanism 5, a transfer mechanism 6, and multiple sets of photoelectric sensors 9 are mounted. A lifting mechanism 8 is located below the solder paste printing mechanism 2. The mounting mechanism 3 includes a linear drive assembly 31 and a first electric cylinder 34, both of which drive multiple sets of vacuum nozzles 37 at the end. The feeding mechanism 4 includes a side plate 41, on which a second motor 42 is mounted. The second motor 42... The output shaft is fixedly connected to the roller 43, which is connected to the LED bead braiding tape 44. Multiple sets of vacuum nozzles 37 correspond one-to-one with the mounting positions on the PCB board. The detection mechanism 5 includes a detection frame 51, on which a CCD camera 52 is mounted. The transfer mechanism 6 includes a third motor 62 and a third cylinder 65, both of which are used to drive the negative pressure suction tube 66 at the end. A second conveying mechanism 7 is provided on one side of the transfer mechanism 6. The lifting mechanism 8 includes a second electric cylinder 81, whose push rod is fixedly connected to a suction cup 82. The suction cup 82 has a negative pressure adsorption hole 83.

[0038] The solder paste printing unit 2, the placement unit 3, and the inspection unit 5 share a single conveyor line. Photoelectric sensors 9 are installed in the solder paste printing area, the placement area, and the inspection area. Multiple sets of photoelectric sensors 9 are used to accurately position the PCB board. The placement machine integrates solder paste printing, placement, and inspection into one unit, eliminating the need for multiple transfers of the PCB board. The flatness of the conveyor belt and the positioning reference are consistent, the process is smoothly connected, and the production cycle is well matched.

[0039] The CCD camera 52 captures the reflected light signals from the LED beads, converts the optical image into an electrical signal, and after analysis by the image processing algorithm, compares the real-time image with the standard good product image to identify obvious defects such as misalignment, multiple placements, and damage, and determines whether the LED bead placement status is qualified. If the placement is qualified, the PCB board after placement is continued to be transported to the subsequent process by the first conveyor mechanism 1. If the placement is unqualified, the drive transfer mechanism 6 is activated to remove the PCB board and place it on the second conveyor mechanism 7, which then transports it to the subsequent processing unit.

[0040] In some examples, the solder paste printing mechanism 2 includes a fixed frame 21 and a linear motor 22. The slide of the linear motor 22 is fixedly connected to a drive frame 23. A first cylinder 24 and a second cylinder 25 are mounted on the drive frame 23. The push rod of the first cylinder 24 is fixedly connected to a first scraper 26, and the push rod of the second cylinder 25 is fixedly connected to a second scraper 27.

[0041] The first scraper 26 is driven by the first cylinder 24, and the second scraper 27 is driven by the second cylinder 25. The first scraper 26 and the second scraper 27 are tilted in opposite directions. The two scrapers move in opposite directions and alternately squeeze the solder paste to fill the openings of the printing groove 29 of the stencil 28, so that the solder paste is distributed more evenly and the printing quality is improved.

[0042] In some examples, a stencil 28 is provided on the fixed frame 21, and a printing groove 29 is provided on the stencil 28 to fit the mounting position on the PCB board.

[0043] After the PCB board is moved into the solder paste printing area of ​​the solder paste printing mechanism 2, the second electric cylinder 81 of the lifting mechanism 8 drives the suction cup 82 to move upward. The suction cup 82 contacts the PCB board and is fixed by adsorbing through the negative pressure adsorption hole 83. The lifting mechanism 8 lifts the PCB board so that the PCB board contacts the stencil 28 and the printing groove 29 is aligned with the PCB pads. The squeegee at the corresponding position moves downward under the drive of the cylinder. The squeegee scrapes across the surface of the stencil 28 at a set speed, pressure and angle. The squeegee squeezes the solder paste and fills the area of ​​the hollow printing groove 29 of the stencil 28 with the solder paste, while cutting the air bubbles in the solder paste. After the squeegee is completed, the squeegee is lifted and the solder paste completely fills the bottom of the stencil 28. The lifting mechanism 8 drives the PCB board to move downward and reset, separating the PCB board from the stencil 28. The solder paste remains on the PCB pads due to surface tension, forming a solder paste pattern consistent with the pattern of the stencil 28, completing the solder paste printing and providing a reliable soldering medium for the electrical connection and mechanical fixation of the LEDs and the PCB.

[0044] In some examples, the linear drive assembly 31 includes a U-shaped base 311, a first motor 312 mounted on one end face of the U-shaped base 311, the output shaft of the first motor 312 fixedly connected to a lead screw 313, a slide rod 314 fixedly mounted on the U-shaped base 311 and located above the lead screw 313, both the slide rod 314 and the lead screw 313 passing through a slide block 315, and the slide block 315 and the slide rod 314 are slidably connected, the slide block 315 is fixedly connected to a drive arm 32, the drive arm 32 is fixedly connected to a fixing plate 33, a first electric cylinder 34 is mounted on the fixing plate 33, the push rod of the first electric cylinder 34 is fixedly connected to a negative pressure drive seat 35, the negative pressure drive seat 35 has a built-in vacuum pump assembly, the negative pressure drive seat 35 is mounted on a base plate 36, and multiple sets of vacuum nozzles 37 are provided on the lower end face of the base plate 36.

[0045] When the first motor 312 is working, it drives the lead screw 313 at one end to rotate, which in turn drives the slide block 315 to slide along the slide rod 314. The slide block 315 drives the drive arm 32 fixed to it to move. The drive arm 32 drives the fixed plate 33. The fixed plate 33 drives multiple sets of vacuum nozzles 37 to move, adjusting the horizontal position of the multiple sets of vacuum nozzles 37. When the first electric cylinder 34 is working, it drives the multiple sets of vacuum nozzles 37 to move axially, adjusting the height position of the multiple sets of vacuum nozzles 37. When picking up the LED lamp bead 45, it is first driven by the linear drive assembly 31. Multiple sets of vacuum nozzles 37 are moved to directly above the LED chip tape 44. Then, the first electric cylinder 34 drives the multiple sets of vacuum nozzles 37 to move down and contact the multiple sets of LED chips 45. The multiple sets of LED chips 45 are picked up by negative pressure adsorption force to achieve material picking. After picking up the materials, the multiple sets of LED chips 45 are moved to directly above the PCB board under the drive of the linear drive component 31 and the first electric cylinder 34. Finally, the multiple sets of LED chips 45 are placed above the solder pads, and the solder feet of the chips are brought into contact with the solder paste by the pressing action to complete the mounting.

[0046] In some examples, multiple sets of LED beads 45 are provided on the LED bead tape 44.

[0047] Several LED beads 45 are embedded into the cavity of the carrier tape at a fixed interval and in a fixed arrangement to form a continuous roll packaging form. When the second motor 42 is working, it drives the roller 43 at one end to rotate. The roller 43 winds the LED beads into a tape 44, driving multiple sets of LED beads 45 to the feeding position, where they are precisely peeled off during the mounting process.

[0048] In some examples, the suction cup 82 is connected to a vacuum pump assembly via a second hose 84. The operation of the vacuum pump assembly causes the negative pressure adsorption holes 83 on the suction cup 82 to generate a negative pressure adsorption force, which is used to adsorb and fix the PCB board.

[0049] Example 2:

[0050] Based on Example 1, this example describes the specific structure of the transfer mechanism 6 in the LED chip mounter. The transfer mechanism 6 includes a transfer frame 61, on which a third motor 62 is mounted. The output shaft of the third motor 62 is fixedly connected to a transfer arm 63. The transfer arm 63 is fixedly connected to a mounting plate 64. A third cylinder 65 is mounted on the mounting plate 64. The push rod of the third cylinder 65 is fixedly connected to a negative pressure suction tube 66.

[0051] In some examples, the negative pressure suction tube 66 is connected to a vacuum pump assembly via a first hose 67, and the vacuum pump assembly operates to generate a negative pressure suction force in the negative pressure suction tube 66.

[0052] When the third motor 62 is working, it drives the transfer arm 63 at one end to rotate. The transfer arm 63 drives the mounting plate 64 fixed to it to move. The mounting plate 64 drives the negative pressure suction tube 66 at the end to move. The negative pressure suction tube 66 is driven to make a circular motion by the third motor 62. When the third cylinder 65 is working, it drives the negative pressure suction tube 66 to move axially. When the PCB board in the detection area is not properly mounted, the transfer mechanism 6 picks up the PCB board, moves the PCB board out and transfers it to the second conveying mechanism 7.

[0053] The inspection mechanism 5 performs quality inspection on the assembled PCB board, and the transfer mechanism 6 is used as the execution mechanism. When a defective product is detected, the transfer mechanism 6 picks up and transfers the defective product, controlling the defect at the assembly stage, preventing the defective product from flowing to subsequent processes, and improving the quality of the finished product.

[0054] Example 3:

[0055] Based on Embodiments 1 and 2, this embodiment describes the specific structure of the first conveying mechanism 1, the second conveying mechanism 7, and the photoelectric sensor 9 in the LED chip mounting machine. Both the first conveying mechanism 1 and the second conveying mechanism 7 include a side frame 11. Multiple sets of conveying rollers 12 are installed on the side frame 11, and the conveying rollers 12 are connected to the side frame 11 through bearings. One set of conveying rollers 12 is connected to the output shaft of the motor, and a conveyor belt 13 is provided on the conveying rollers 12.

[0056] like Figure 10 As shown, the spacing between the side frames 11 on both sides of the conveying mechanism is adapted to the size of the PCB board. When the PCB board is conveyed by the conveying mechanism, the side frames 11 on both sides limit the PCB board to prevent the PCB board from deviating from the designated path.

[0057] In some examples, the photoelectric sensor 9 includes a transmitter 91 and a receiver 92. A groove is provided on the side frame 11. The transmitter 91 and the receiver 92 are respectively mounted on the side frames 11 on both sides of the first conveying mechanism 1 and are located in the groove of the side frame 11.

[0058] The photoelectric sensor 9 determines the presence or position change of the PCB board by emitting light signals and receiving changes in reflected light signals. It converts the spatial position of the PCB board into changes in the on / off state of the light signals, which are then processed by the circuit into electrical signals. Finally, the control system interprets the signals as position data. When the side of the PCB board reaches the area of ​​the photoelectric sensor 9, the PCB board blocks the light path, triggering a signal that controls the first conveying mechanism 1 to brake. After the operation is completed, the first conveying mechanism 1 is started to continue conveying the PCB board, thereby achieving precise positioning of the PCB board.

[0059] The solder paste printing mechanism 2, the placement mechanism 3, and the inspection mechanism 5 are set at equal intervals. When the printed PCB board enters the placement area of ​​the placement mechanism 3 under the drive of the first conveyor mechanism 1, the next set of PCB boards just enters the solder paste printing area of ​​the solder paste printing mechanism 2. When the placed PCB board enters the inspection area of ​​the inspection mechanism 5 under the drive of the first conveyor mechanism 1, the next set of PCB boards just enters the placement area of ​​the placement mechanism 3, and the last set of PCB boards just enters the solder paste printing area of ​​the solder paste printing mechanism 2. During continuous placement, solder paste printing, placement, and inspection are carried out simultaneously, which improves the working efficiency of the placement machine.

[0060] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. An LED lamp bead pasting machine, comprising a first conveying mechanism (1), characterized in that: The first conveying mechanism (1) is provided with a tin printing mechanism (2), a patch mechanism (3), a feeding mechanism (4), a detection mechanism (5), a transfer mechanism (6) and a plurality of photoelectric sensors (9), the tin printing mechanism (2) is provided with a jacking mechanism (8) below, the patch mechanism (3) comprises a linear drive assembly (31) and a first electric cylinder (34), the linear drive assembly (31) and the first electric cylinder (34) are used for driving a plurality of vacuum nozzles (37) at the tail end, the feeding mechanism (4) comprises a side plate (41), the side plate (41) is provided with a second motor (42), the output shaft of the second motor (42) is fixedly connected with a winding roller (43), the winding roller (43) is connected with a lamp bead ribbon (44), a plurality of the vacuum nozzles (37) correspond to the mounting positions on the PCB board one by one, the detection mechanism (5) comprises a detection frame (51), the detection frame (51) is provided with a CCD camera (52), the transfer mechanism (6) comprises a third motor (62) and a third cylinder (65), the third motor (62) and the third cylinder (65) are used for driving a negative pressure suction tube (66) at the tail end, one side of the transfer mechanism (6) is provided with a second conveying mechanism (7), the jacking mechanism (8) comprises a second electric cylinder (81), the push rod of the second electric cylinder (81) is fixedly connected with a suction disc (82), the suction disc (82) is provided with a negative pressure adsorption hole (83).

2. The LED lamp bead pasting machine according to claim 1, characterized in that: The tin printing mechanism (2) comprises a fixed frame (21) and a linear motor (22), the sliding table of the linear motor (22) is fixedly connected with a driving frame (23), the driving frame (23) is provided with a first cylinder (24) and a second cylinder (25), the push rod of the first cylinder (24) is fixedly connected with a first scraper (26), the push rod of the second cylinder (25) is fixedly connected with a second scraper (27).

3. The LED lamp bead pasting machine according to claim 2, characterized in that: The fixed frame (21) is provided with a steel mesh (28), the steel mesh (28) is provided with a printing groove (29), and the printing groove (29) is matched with the mounting positions on the PCB board.

4. The LED lamp bead pasting machine according to claim 1, characterized in that: The linear drive assembly (31) comprises a U-shaped seat (311), one side end face of the U-shaped seat (311) is provided with a first motor (312), the output shaft of the first motor (312) is fixedly connected with a lead screw (313), a sliding rod (314) is fixedly arranged on the U-shaped seat (311) and located above the lead screw (313), the sliding rod (314) and the lead screw (313) penetrate through a sliding seat (315) and are slidably connected between the sliding seat (315) and the sliding rod (314), the sliding seat (315) is fixedly connected with a driving arm (32), the driving arm (32) is fixedly connected with a fixed plate (33), the fixed plate (33) is provided with a first electric cylinder (34), the push rod of the first electric cylinder (34) is fixedly connected with a negative pressure driving seat (35), the negative pressure driving seat (35) is internally provided with a vacuum pump assembly, the negative pressure driving seat (35) is arranged on a base plate (36), and the lower end face of the base plate (36) is provided with a plurality of vacuum nozzles (37).

5. The LED lamp bead tacking machine according to claim 1, characterized in that: A plurality of LED lamp beads (45) are arranged on the lamp bead braid (44).

6. The LED lamp bead pasting machine according to claim 1, characterized in that: The suction cup (82) is connected with the vacuum pump assembly through the second hose (84).

7. The LED lamp bead pasting machine according to claim 1, characterized in that: The transfer mechanism (6) comprises a transfer frame (61), the transfer frame (61) is provided with a third motor (62), the output shaft of the third motor (62) is fixedly connected with a transfer arm (63), the transfer arm (63) is fixedly connected with a mounting plate (64), the mounting plate (64) is provided with a third cylinder (65), and the push rod of the third cylinder (65) is fixedly connected with a negative pressure suction pipe (66).

8. The LED lamp bead pasting machine according to claim 7, characterized in that: The negative pressure suction pipe (66) is connected with the vacuum pump assembly through the first hose (67).

9. The LED lamp bead pasting machine according to claim 1, characterized in that: The first conveying mechanism (1) and the second conveying mechanism (7) both comprise a side frame (11), a plurality of conveying rollers (12) are arranged on the side frame (11) and connected with the side frame (11) through bearings, one group of the conveying rollers (12) is connected with the output shaft of an electric motor, and the conveying rollers (12) are provided with a conveying belt (13).

10. The LED lamp bead tacking machine according to claim 9, characterized in that: The photoelectric sensor (9) comprises an emitter (91) and a receiver (92), recesses are formed in the side frames (11), and the emitter (91) and the receiver (92) are arranged on the side frames (11) on the two sides of the first conveying mechanism (1) and located in the recesses of the side frames (11).

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