Wafer crushing treatment equipment and treatment method

Abstract

The invention relates to the technical field of semiconductor device processing, in particular to wafer crushing processing equipment and a processing method.In the equipment, a controller controls an electric control butterfly valve to discharge crushed wafer chippings to a material receiving bag in a timed and quantitative mode, the situation that the material receiving bag is too full is prevented, and continuity and stability of the production process are ensured; the negative pressure supply mechanism forms stable negative pressure in the material collecting barrel, dust generated during crushing is effectively prevented from escaping into workshop air, the health of workers is protected, and the requirements for clean production and environmental protection are met; the controller serves as a center and uniformly coordinates actions of the electric control butterfly valve, weight monitoring, operation of the negative pressure supply mechanism and alarm prompt to form a closed-loop control system, so that the intelligent level of equipment is improved, the dependence on artificial experience is reduced, the accident prevention capability is enhanced through automatic alarm, and the safety of the equipment is improved. Functional modules such as crushing, collecting, weighing and dust removing are integrated on the workbench, the layout is reasonable, the equipment tends to be small, and occupied space is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device processing technology, and in particular to a wafer crushing processing equipment and processing method. Background Technology

[0002] In existing technologies, traditional or rudimentary wafer crushing and recycling equipment generates a large number of micron or nano-sized particles during the crushing process. The dust can seriously pollute the cleanroom environment, endanger the respiratory health of operators, and may cause the loss of precious metal components. Moreover, the output is mostly directly discharged or simply collected, lacking quantitative control. It often requires manual observation of material level and manual bag replacement, which is inefficient, prone to errors, and increases the risk of dust exposure due to human intervention. Furthermore, manually judging whether the collection bag is full can lead to the collection bag bursting, dust escaping, or even clogging the pipeline, affecting the normal operation of the equipment and making cleaning and maintenance troublesome. Summary of the Invention

[0003] The purpose of this invention is to provide a wafer crushing and processing equipment and method to solve the problems of large crushing equipment and serious dust pollution during the processing.

[0004] To achieve this objective, the present invention adopts the following technical solution: A wafer crushing and processing device is provided, including a workbench and a controller. The workbench is provided with a feeding hopper, a crushing chamber connected to the feeding hopper, a collection bucket connected to the crushing chamber, a negative pressure supply mechanism connected to the collection bucket, and a receiving bag connected to the bottom of the collection bucket. An electrically controlled butterfly valve is provided between the receiving bag and the collection bucket, which opens or closes at preset intervals. A weighing mechanism is provided at the bottom of the receiving bag. The weighing mechanism, the electrically controlled butterfly valve, and the negative pressure supply mechanism are electrically connected to the controller, and the controller is also electrically connected to an alarm.

[0005] A wafer crushing method is also provided, relating to the wafer crushing equipment as described in any of the preceding claims, the method comprising: The controller receives real-time weight data from the weighing mechanism; The controller determines whether the weight value in the real-time weight data has reached a preset weight threshold; if so, The controller sends a first shut-off control signal to the electrically controlled butterfly valve, a second shut-off control signal to the negative pressure supply mechanism, and an alarm signal to the alarm. The electrically controlled butterfly valve is used to close the valve according to the first shut-off control signal to stop the feeding of material into the receiving bag and to stop the periodic opening. The negative pressure supply mechanism is used to stop the negative pressure supply to the collection bucket according to the second shut-off control signal.

[0006] Compared with the prior art, the present invention has the following beneficial effects: Through the above-mentioned wafer crushing equipment and processing method, the controller controls the opening and closing time interval of the electrically controlled butterfly valve, which can discharge the crushed wafer debris into the collection bag in a timely and quantitative manner, avoiding frequent manual operation and realizing the automation and standardization of the collection process. The weighing mechanism monitors the weight in real time. When the weight reaches a preset threshold, the controller can trigger an alarm and shut down the electrically controlled butterfly valve or stop the upstream equipment, effectively preventing leakage, equipment blockage, or safety accidents caused by overfilling of the receiving bag, ensuring the continuity and stability of the production process. The negative pressure supply mechanism creates a stable negative pressure in the collection bucket, keeping the entire crushing and conveying process in a suction state, effectively suppressing the dust generated during crushing from escaping into the workshop air, protecting worker health, meeting clean production and environmental protection requirements, and improving wafer debris collection to reduce losses. The controller, as the central hub, coordinates the operation of the electrically controlled butterfly valve, weight monitoring, negative pressure supply mechanism, and alarm prompts, forming a closed-loop control system. This improves the intelligence level of the equipment, reduces reliance on human experience, and enhances accident prevention capabilities through automatic alarms. The integrated crushing, collection, weighing, and dust removal modules on the workbench are rationally laid out, making the equipment smaller and reducing space occupation. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0009] Figure 1 This is a schematic diagram of the external structure of a wafer crushing and processing equipment. Figure 2 A schematic diagram of the front structure of the worktable of a wafer crushing and processing equipment; Figure 3 A schematic diagram of the back structure of the worktable of a wafer crushing and processing equipment; Figure 4 A schematic diagram of the crushing chamber structure of a wafer crushing and processing equipment; Figure 5A schematic diagram of the material crushing operation space structure of a wafer crushing and processing equipment; Figure 6 A schematic diagram of the rotating crushing disc structure of a wafer crushing and processing equipment; Figure 7 A schematic diagram of the dustproof component structure of a wafer crushing and processing equipment; Figure 8 for Figure 7 A magnified schematic diagram of part A in the middle; Figure 9 A flowchart illustrating the steps of a wafer crushing process; Illustration: 1. Equipment casing; 2. Controller; 10. Workbench; 11. Feed hopper; 12. Crushing chamber; 13. Collection bucket; 14. Negative pressure supply mechanism; 15. Collection bag; 16. Weighing mechanism; 17. High pressure supply mechanism; 18. Dust filter bucket; 19. Alarm; 20. Electrically controlled butterfly valve; 31. Crushing casing; 32. First drive motor; 33. Fixed cover; 34. Rotating crushing disc; 35. Screening hole; 36. Crushing working space; 41. 42. First cutter column; 43. Second cutter column; 44. First air blowing pipe; 45. First guide nozzle; 46. Second drive motor; 47. Driven roller; 58. Driven roller; 59. Second air blowing pipe; 50. Second guide nozzle; 51. Suction pipe; 62. Movable sleeve; 63. Dustproof plate; 64. Filter screen; 65. Spring; 66. Ring; 67. Frustum; 68. Elastic telescopic sealing sleeve; 69. Magnetic ring; 70. Paddle impeller; 81. Elastic resonant plate. Detailed Implementation

[0010] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0011] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0012] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0013] See Figures 1-8 .

[0014] A wafer crushing and processing device includes a workbench 10 and a controller 2, integrated within a housing 1. The workbench 10 is provided with a feeding hopper 11, a crushing chamber 12 communicating with the feeding hopper 11, a collection bucket 13 communicating with the crushing chamber 12, a negative pressure supply mechanism 14 communicating with the collection bucket 13, and a receiving bag 15 communicating with the bottom of the collection bucket 13. An electrically controlled butterfly valve 20 is provided between the receiving bag 15 and the collection bucket 13, which opens or closes at preset intervals. A weighing mechanism 16 is provided at the bottom of the receiving bag 15. The weighing mechanism 16, the electrically controlled butterfly valve 20, and the negative pressure supply mechanism 14 are electrically connected to the controller 2, and the controller 2 is also electrically connected to an alarm 19.

[0015] Wafer scrap of varying sizes enters the crushing chamber 12 from the feed hopper 11. The crushing chamber 12 crushes the wafer scrap according to the preset particle size requirements. The negative pressure supply mechanism 14 provides negative pressure airflow to draw the wafer fine particles and dust that meet the particle size requirements into the collection bucket 13. When the electrically controlled butterfly valve 20 opens at preset intervals, the wafer fine particles and some dust accumulated in the collection bucket 13 fall into the receiving bag 15 by gravity. Simultaneously, the weighing mechanism 16 detects the weight of the receiving bag 15 in real time. When the detected weight value reaches the preset weight threshold, an alarm is triggered and the electrically controlled butterfly valve 20 is closed.

[0016] For example, the workbench 10 is equipped with a feed hopper 11, a crushing chamber 12, and a collection bin 13. A receiving bag 15 is hung at the flange at the bottom of the collection bin 13, with an electrically controlled butterfly valve 20 between them. The weighing mechanism 16 uses a load cell, installed below the support structure of the receiving bag 15 or on the bag base. The controller 2, acting as the main controller, receives signals from the load cell and sends different control signals to the electrically controlled butterfly valve 20, the negative pressure supply mechanism 14 (air compressor), and the alarm 19. It should be noted that the main component of a wafer is silicon, and the fine silicon powder obtained after crushing is flammable and explosive. Therefore, the entire wafer must be explosion-proof, electrically protected, electrostatic grounded, and sealed in accordance with the various requirements of semiconductor equipment safety standards.

[0017] In this embodiment, the workbench 10 is equipped with a feeding hopper 11, a crushing chamber 12 connected to the feeding hopper 11, a collection bucket 13 connected to the crushing chamber 12, a negative pressure supply mechanism 14 connected to the collection bucket 13, and a collection bag 15 connected to the bottom of the collection bucket 13. An electrically controlled butterfly valve 20 is provided between the collection bag 15 and the collection bucket 13, which opens or closes at preset intervals. A weighing mechanism 16 is provided at the bottom of the collection bag 15. The weighing mechanism 16, the electrically controlled butterfly valve 20, and the negative pressure supply mechanism 14 are electrically connected to the controller 2, which is also electrically connected to an alarm 19. By presetting the opening and closing time interval of the electrically controlled butterfly valve 20 by the controller 2, the crushed wafer debris can be discharged into the collection bag 15 in a timely and quantitative manner, avoiding frequent manual operation and realizing the automation and standardization of the collection process. The weighing mechanism 16 monitors the weight in real time. When the weight reaches the preset threshold, the controller 2 can trigger the alarm 19 and link to close the electric butterfly valve 20 or stop the upstream equipment, effectively preventing leakage, equipment blockage or safety accidents caused by overfilling of the receiving bag 15, and ensuring the continuity and stability of the production process. The negative pressure supply mechanism 14 forms a stable negative pressure in the collection bucket 13, so that the entire crushing and conveying process is in a suction state, effectively suppressing the dust generated during crushing from escaping into the workshop air, protecting the health of workers, and meeting the requirements of clean production and environmental protection. The controller 2, as the central hub, coordinates the action of the electric butterfly valve 20, weight monitoring, operation of the negative pressure supply mechanism 14 and alarm prompts, forming a closed-loop control system, improving the intelligence level of the equipment, reducing the reliance on human experience, and enhancing the accident prevention capability through automatic alarms. The functions of crushing, collecting, weighing, and dust removal are integrated into the workbench 10, with a reasonable layout, making the equipment smaller and reducing space occupation.

[0018] In another embodiment, the crushing chamber 12 includes a crushing shell 31, a first drive motor 32, a fixed cover 33, and a rotating crushing disc 34. The fixed cover 33 has an opening on one side and is connected to the inner wall of the crushing shell 31. The rotating crushing disc 34 is rotatably disposed inside the fixed cover 33 and forms a crushing working space 36 communicating with the feed hopper 11 between it and the crushing shell 31. The fixed cover 33 has a plurality of screening holes 35 circumferentially arranged on its side. The first drive motor 32 is disposed outside the crushing shell 31. The power output end of the first drive motor 32 passes through the crushing shell 31 and the fixed cover 33 in sequence and is fixedly connected to the rotating crushing disc 34. The first drive motor 32 is electrically connected to the controller 2.

[0019] In this embodiment, wafer scrap falls from the feed hopper 11 into the crushing working space 36. The rotating crushing disc rotates at high speed under the drive of the drive motor, causing the wafer to be crushed by shear force between the disc surface and the fixed cover 33. The screening holes 35 on the side of the fixed cover 33 are used to allow sufficiently small wafer scraps to be screened out into the downstream collection bucket 13, while larger particles continue to be further crushed in the crushing space.

[0020] The rotating crushing disc is made of high-strength alloy steel or carbide material, and its surface can be hardened or inlaid with cutting tools. The power output end of the first drive motor 32 is a rotating shaft, which uses a rotating shaft seal ring when passing through the crushing shell 31 and the fixed cover 33. Centrifugal force is generated during the crushing operation in the crushing working space 36. The discharge end of the feed hopper 11 can extend to the center of the crushing working space 36. The wafer residue enters the center of the crushing working space 36 and diffuses from the center to the outside under the action of centrifugal force. It is crushed by the crushing structure (cutting tools, etc.) between the rotating crushing disc and the fixed cover 33. The wafer fragments that are small enough to reach the preset particle size enter the collection bucket 13 through the screen hole 35.

[0021] Understandably, the fixed cover 33 and the rotating crushing disc 34 are located inside the crushing shell 31, and the screen hole 35 is connected to the inside of the crushing shell 31. The crushed wafer fragments will be densely distributed in the channel between the crushing shell 31 and the fixed cover 33 under the action of centrifugation. Furthermore, a guide hopper is provided at the bottom of the crushing shell 31 to guide the wafer fragments into the collection bucket 13.

[0022] Controller 2 controls the start, stop and speed of the first drive motor 32.

[0023] In another embodiment, the rotating shredder disk 34 is provided with a plurality of first blades 41 extending toward the opening of the fixed cover 33, and the inner wall of the shredder shell 31 near the opening of the fixed cover 33 is provided with a plurality of second blades 42 extending toward the rotating shredder disk 34; the first blades 41 and the second blades 42 are arranged alternately in a ring from the inner ring to the outer ring.

[0024] In this embodiment, the first blade column 41 and the second blade column 42 form an alternating blade pair and shearing gap. When the rotating first blade column 41 passes the fixed second blade column 42, it generates shearing, impact and crushing effects. The alternating ring arrangement ensures that the crushed material can be uniformly crushed in both the radial and circumferential directions, resulting in a more uniform particle size of the product.

[0025] Understandably, both the first cutter post 41 and the second cutter post 42 can be equipped with cutting edges or tungsten carbide inserts, arranged alternately from the inside to the outside in a concentric ring. The spacing and cutter height are designed according to the expected particle size and feed rate. They are fixed by positioning pins and bolts, so that the first cutter post 41 and the second cutter post 42 can be replaced for maintenance.

[0026] The first cutter column 41 and the second cutter column 42 are used to improve crushing efficiency and product particle size uniformity. The simple mechanism realizes both shearing and impact crushing mechanisms, which has strong practicality.

[0027] In another embodiment, the workbench 10 is further provided with a high-pressure supply mechanism 17 electrically connected to the controller 2, and the discharge side of the crushed material shell 31 is provided with a first air blowing pipe 43 connecting the inside and outside. One end of the first air blowing pipe 43 is connected to the high-pressure supply mechanism 17, and the other end extends to the outside of the screen hole 35 and is provided with a first guide nozzle 44 at the end.

[0028] In this embodiment, the first guide nozzle 44 can be designed as a nozzle or a flat diffuser. The controller 2 controls the high-pressure supply mechanism 17 (air compressor or high-pressure air pump, etc.) to spray high-pressure airflow to the discharge side of the crushed material shell 31 through the first air pipe 43 and the first guide nozzle 44 to sweep the outside of the screen holes or the screen surface, accelerating the wafer fragments that have been crushed to the required particle size to enter the collection bucket 13 through the screen holes 35, thereby improving the screening efficiency. On the other hand, the wafer fragments that have not met the particle size requirements re-enter between the first cutter column 41 and the second cutter column 42 under the action of sweeping, and undergo multiple crushings to meet the particle size requirements, thereby avoiding the wafer fragments that have not met the particle size requirements from blocking the screen holes 35 for a long time under the action of centrifugal force, thereby improving the crushing efficiency.

[0029] It should be noted that the high-pressure air blowing and crushing action bring significant noise pollution, and a sound insulation structure can be installed on the side wall of the crushing chamber 12.

[0030] In another embodiment, the crushing chamber 12 further includes a crushing roller assembly disposed between the feed hopper 11 and the crushing working space 36. The crushing roller assembly includes a second drive motor 45, a drive roller 46, and a driven roller 47. The second drive motor 45 is disposed on the worktable 10 and electrically connected to the controller 2. The power output end of the second drive motor 45 is connected to the drive roller 46. The drive roller 46 is connected to the driven roller 47 through gear transmission. The feed ends of the drive roller 46 and the driven roller 47 correspond to the feed hopper 11, and the discharge ends correspond to the crushing working space 36.

[0031] In this embodiment, the wafer is held by the active roller 46 and the driven roller 47 (with adjustable spacing) from the feed hopper 11, and the wafer is initially crushed or cracked. The feeding speed is controlled to avoid a large amount of wafer debris entering the crushing chamber at one time, which may cause blockage or excessive impact from the cutter, thus achieving uniform feeding and primary crushing.

[0032] Understandably, the second drive motor 45, under the regulation of the controller 2, has a lower output rotational speed than the first drive motor 32. The drive roller 46 and driven roller 47 are equipped with wear-resistant teeth or textured carbonized or alloyed layers to provide gripping and initial crushing energy. Their discharge ends are also equipped with corresponding guide hoppers as extensions of the feed end of the feed hopper 11, accurately feeding the wafer debris into the crushing operation space 36.

[0033] In another embodiment, a dust filter 18 is also included, which is disposed between the negative pressure supply mechanism 14 and the collection bucket 13 and is connected to both of them. The dust filter 18 is connected to the collection bucket 13 through an air extraction pipe 53. The top of the collection bucket 13 is provided with a second air blowing pipe 51, one end of which faces the receiving bag 15 and the other end of which is connected to the high pressure supply mechanism 17. One end of the air extraction pipe 53 is located on the flow path of the airflow blown out by the second air blowing pipe 51.

[0034] In this embodiment, the broken wafer fragments are drawn into the collection bin 13 by the suction of the negative pressure supply mechanism 14. Some of the entrained dust and harmful gases generated during the breakage are discharged into the air through the negative pressure supply mechanism 14. The dust and gas are adsorbed and filtered by a dust filter bin 18 (containing a dust filter element). A second air blowing pipe 51 is provided at the top of the collection bin 13, which blows air towards the collection bag 15 to fully open the bag opening and promote the wafer fragments in the collection bin 13 to sink into the bag. On the other hand, under the airflow guidance of the second air blowing pipe 51, the dust diffused in the collection bin 13 is blown to the exhaust pipe 53, improving the filtration effect of the dust filter bin 18.

[0035] It should be noted that a pulse backflushing cleaning mechanism can also be added to the dust filter bin 18 to improve the cleaning efficiency and service life of the dust filter element and facilitate the collection of wafer debris in the dust filter bin 18.

[0036] In another embodiment, a dustproof component is provided at one end of the exhaust pipe 53 near the collection bucket 13. The dustproof component includes a movable sleeve 61, a dustproof cover provided on the exhaust pipe 53, and a spring 64 provided between the exhaust pipe 53 and the dustproof cover. One end of the dustproof cover is provided with an inwardly protruding ring 65, and one end of the exhaust pipe 53 is provided with an outwardly protruding frustum 66 with a diameter smaller than the inner diameter of the dustproof cover. The inner side of the ring 65 abuts against one side of the frustum 66, and the end face of the frustum 66 is provided around the opening of the exhaust pipe 53 with the spring 64 abutting against the inner side of the dustproof cover.

[0037] It should be noted that the dustproof assembly is designed to prevent larger-diameter wafer debris from entering the dust filter canister 18, not to block all dust. The dust cover engages with the end of the extraction pipe 53 via a ring 65 and a frustum 66 under the action of the spring 64. Since the diameter of the frustum 66 is smaller than the inner diameter of the dust cover and abuts against the inner side of the ring 65, the spring 64 presses between the end of the extraction pipe 53 and the dust cover, creating a dynamic engagement. In this situation, under the airflow guided by the second blowing pipe 51 and / or the extraction pipe 53, larger-diameter wafer debris can impact the dust cover, causing it to vibrate and dislodge dust particles accumulated at the dust inlet of the dust cover, preventing blockage and avoiding further impact on the filtration efficiency of the dust filter canister 18.

[0038] It should be noted that there is a predetermined gap between the end of the extraction pipe 53 and the dust cover. A flexible dust cover can be installed on the outside of the dust cover opening to wrap around the outside of the extraction pipe 53, so as to prevent dust from entering through the gap and prevent long-term accumulation from causing dynamic fit failure. The flexible dust cover can be made of a woven material with extensibility and tensile properties.

[0039] In another embodiment, the dust cover includes a movable sleeve 61 and a dust cover 62. The central area of ​​the dust cover 62 is provided with a filter screen 63 corresponding to the opening of the exhaust pipe 53. The area of ​​the dust cover 62 located on the outer periphery of the filter screen 63 is detachably connected to the end face of the movable sleeve 61. The ring 65 is provided on the movable sleeve 61. It also includes an elastic telescopic sealing sleeve 67 fixed to the dust cover 62 around the outer periphery of the filter screen 63. The side of the elastic telescopic sealing sleeve 67 near the frustum 66 is provided with a magnetic ring 68. The end face of the frustum 66 is provided with a magnetic attracting body corresponding to the magnetic ring 68. When the magnetic ring 68 and the magnetic body are attracted, the sleeve of the elastic telescopic sealing sleeve 67 is stretched under the elastic action of the spring 64, and the spring 64 is sealed between the elastic telescopic sealing sleeve 67 and the movable sleeve 61.

[0040] Understandably, the magnetic attractor can be a ferromagnetic material attracted by the magnetic ring or a magnet that is irregularly shaped and attracted to the magnetic ring.

[0041] In this embodiment, a filter screen 63 is installed at the center of the dustproof plate 62, and its outer periphery is connected to the movable sleeve 61 by buckles or bolts. The elastic telescopic sealing sleeve 67 is made of elastic rubber or silicone tape, and a magnetic body (such as a magnet) is installed on the end face of the frustum 66. When attracted, the elastic telescopic sealing sleeve 67 is stretched and forms a pre-tight seal under the action of the spring 64. This structure is simple to assemble and can be disassembled and assembled by the operator with one hand. The elastic telescopic sealing sleeve 67 extends and is assembled on the end face of the frustum 66 under the magnetic attraction, so that the filter screen 63, the elastic telescopic sealing sleeve 67 and the inner diameter of the exhaust pipe 53 form a continuous and sealed gas guide channel. The gap between the spring 64 and the exhaust pipe 53 and the dustproof cover is sealed to prevent dust from entering.

[0042] In another embodiment, a second guide nozzle 52 is provided at one end of the second air pipe 51, and a paddle wheel 69 is rotatably provided on the flow path of the airflow blown out by the second guide nozzle 52. An elastic resonant plate 70 is provided on one side of the dust cover, with one end extending to the rotation path of the paddle wheel 69.

[0043] In this embodiment, the impeller 69 is made of lightweight alloy or engineering plastic, with low-friction bearings, and can be driven by airflow. The elastic resonant plate 70 is fixed at one end by a rubber or metal spring and swings freely at the other end, generating periodic impacts or vibrations when it enters the impeller path. The second guide nozzle 52 directs the airflow to the surface of the impeller 69, causing it to rotate and generate periodic impacts on the elastic resonant plate 70 to produce elastic resonance. This resonance is then transmitted to the dust inlet of the filter screen 63 or dust cover, assisting in dust removal or preventing filter clogging, achieving self-cleaning of the dust inlet of the dust cover, and further improving the filtration efficiency of the dust filter canister 18.

[0044] See Figure 9 .

[0045] A wafer crushing method is also provided, relating to the aforementioned wafer crushing equipment, the method comprising: S1, Controller 2 receives real-time weight data from weighing mechanism 16; S2, Controller 2 determines whether the weight value in the real-time weight data has reached a preset weight threshold; if so, S3, the controller 2 sends a first closing control signal to the electrically controlled butterfly valve 20, a second closing control signal to the negative pressure supply mechanism 14, and an alarm signal to the alarm 19. The electrically controlled butterfly valve 20 is used to close the valve according to the first closing control signal to stop the action of feeding material into the receiving bag 15 and to stop the periodic opening. The negative pressure supply mechanism 14 is used to stop the negative pressure supply action into the collection bucket 13 according to the second closing control signal.

[0046] In steps S1 and S2, the controller 2 reads the weight data of the weighing mechanism 16 and compares it with the preset weight threshold. When it is determined that the weight exceeds the threshold, that is, when the receiving bag 15 reaches the rated load, the controller 2 triggers and generates the control signal in step S3.

[0047] On the other hand, if not, the controller 2 maintains the preset interval for opening / closing of the electrically controlled butterfly valve 20, while maintaining the normal operation of the negative pressure supply mechanism 14 and continuously receiving real-time weight data from the weighing mechanism 16.

[0048] In step S3, the first shut-off control signal instructs the electrically controlled butterfly valve 20 to close, preventing further material feeding and stopping its periodic opening behavior. The second shut-off control signal instructs the negative pressure supply mechanism 14 to stop, halting the continued feeding of wafer debris into the collection bin 13 via airflow. The alarm signal instructs the alarm 19 to notify the operator to stop material feeding and, when appropriate, shut down the first and second drive mechanisms. This protects the receiving bag 15 from rupture, ensuring safety and prompting timely replacement.

[0049] It should be noted that the closing of the electrically controlled butterfly valve 20 can be an immediate action. After closing, the weighing result of the receiving bag 15 may be affected by vibration, airflow, or valve operation. To prevent the program from automatically opening the electrically controlled butterfly valve 20, the reopening of the electrically controlled butterfly valve 20 after closing can be set to be manually operated. On the other hand, a one-way valve is provided between the collection bucket 13 and the crushing chamber 12 to prevent the backflow of wafer debris after the negative pressure supply mechanism 14 stops. The negative pressure supply mechanism 14 can also be set to stop after a certain period of time after the electrically controlled butterfly valve 20 closes, so that the uncollected wafer debris is basically accumulated in the collection bucket 13, avoiding the possible settling or blockage of residues in the pipeline.

[0050] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer crushing and processing device, characterized in that, The system includes a workbench (10) and a controller (2). The workbench (10) is equipped with a feeding hopper (11), a crushing chamber (12) connected to the feeding hopper (11), a collection bucket (13) connected to the crushing chamber (12), a negative pressure supply mechanism (14) connected to the collection bucket (13), and a receiving bag (15) connected to the bottom of the collection bucket (13). An electrically controlled butterfly valve (20) is provided between the receiving bag (15) and the collection bucket (13) and opens or closes at a preset interval. A weighing mechanism (16) is provided at the bottom of the receiving bag (15). The weighing mechanism (16), the electrically controlled butterfly valve (20), and the negative pressure supply mechanism (14) are electrically connected to the controller (2). The controller (2) is also electrically connected to an alarm (19).

2. The wafer crushing and processing equipment according to claim 1, characterized in that, The crushing chamber (12) includes a crushing shell (31), a first drive motor (32), a fixed cover (33), and a rotating crushing disc (34). The fixed cover (33) has an opening on one side and is connected to the inner wall of the crushing shell (31). The rotating crushing disc (34) is rotatably disposed inside the fixed cover (33) and forms a crushing operation space (36) connected to the feed hopper (11) between the crushing shell (31) and the fixed cover (33). The fixed cover (33) has several screening holes (35) on its side. The first drive motor (32) is disposed outside the crushing shell (31). The power output end of the first drive motor (32) passes through the crushing shell (31) and the fixed cover (33) in sequence and is fixedly connected to the rotating crushing disc (34). The first drive motor (32) is electrically connected to the controller (2).

3. The wafer crushing and processing equipment according to claim 2, characterized in that, The rotating shredder disc (34) is provided with a plurality of first blades (41) extending toward the opening of the fixed cover (33), and the inner wall of the shredder shell (31) near the opening of the fixed cover (33) is provided with a plurality of second blades (42) extending toward the rotating shredder disc (34); the first blades (41) and the second blades (42) are arranged alternately in a ring from the inner ring to the outer ring.

4. The wafer crushing and processing equipment according to claim 2, characterized in that, The workbench (10) is also provided with a high-pressure supply mechanism (17) electrically connected to the controller (2). The discharge side of the crushed material shell (31) is provided with a first air blowing pipe (43) that connects the inside and outside. One end of the first air blowing pipe (43) is connected to the high-pressure supply mechanism (17), and the other end extends to the outside of the screen hole (35) and is provided with a first guide nozzle (44).

5. The wafer crushing and processing equipment according to claim 2, characterized in that, The crushing chamber (12) also includes a crushing roller assembly located between the feed hopper (11) and the crushing operation space (36). The crushing roller assembly includes a second drive motor (45), an active roller (46), and a driven roller (47). The second drive motor (45) is located on the workbench (10) and electrically connected to the controller (2). The power output end of the second drive motor (45) is connected to the active roller (46). The active roller (46) is connected to the driven roller (47) through gear transmission. The feed ends of the active roller (46) and the driven roller (47) correspond to the feed hopper (11), and the discharge ends correspond to the crushing operation space (36).

6. The wafer crushing and processing equipment according to claim 4, characterized in that, It also includes a dust filter (18) disposed between the negative pressure supply mechanism (14) and the collection bucket (13) and connected to both respectively. The dust filter (18) is connected to the collection bucket (13) through an air extraction pipe (53). The top of the collection bucket (13) is provided with a second air blowing pipe (51) with one end facing the collection bag (15) and the other end connected to the high pressure supply mechanism (17). One end of the air extraction pipe (53) is located on the flow path of the airflow blown out by the second air blowing pipe (51).

7. The wafer crushing and processing equipment according to claim 6, characterized in that, The exhaust pipe (53) is provided with a dustproof component at one end near the collection bucket (13). The dustproof component includes a movable sleeve (61), a dustproof cover provided on the exhaust pipe (53), and a spring (64) provided between the exhaust pipe (53) and the dustproof cover. One end of the dustproof cover is provided with an inwardly protruding ring (65), and the outer side of one end of the exhaust pipe (53) is provided with a truncated cone (66) with a diameter smaller than the inner diameter of the dustproof cover. The inner side of the ring (65) abuts against one side of the truncated cone (66), and the end face of the truncated cone (66) is provided around the opening of the exhaust pipe (53) and abuts against the inner side of the dustproof cover.

8. The wafer crushing and processing equipment according to claim 7, characterized in that, The dust cover includes a movable sleeve (61) and a dust cover plate (62). The central area of ​​the dust cover plate (62) is provided with a filter screen (63) corresponding to the opening of the exhaust pipe (53). The area of ​​the dust cover plate (62) located on the outer periphery of the filter screen (63) is detachably connected to the end face of the movable sleeve (61). The ring (65) is provided on the movable sleeve (61). It also includes an elastic telescopic sealing sleeve (67) fixed on the dust cover plate (62) around the outer periphery of the filter screen (63). The elastic telescopic sealing sleeve (67) is provided with a magnetic ring (68) on the side near the truncated cone (66). The end face of the truncated cone (66) is provided with a magnetic attractor corresponding to the magnetic ring (68). When the magnetic ring (68) and the magnetic body are attracted, the sleeve of the elastic telescopic sealing sleeve (67) is stretched under the elastic action of the spring (64), and the spring (64) is sealed between the elastic telescopic sealing sleeve (67) and the movable sleeve (61).

9. The wafer crushing and processing equipment according to claim 8, characterized in that, The second air pipe (51) has a second guide nozzle (52) at one end, and a paddle wheel (69) is provided on the flow path of the airflow blown out by the second guide nozzle (52). An elastic resonant plate (70) is provided on one side of the dust cover, with one end extending to the rotation path of the paddle wheel (69).

10. A wafer crushing method, relating to the wafer crushing equipment as described in any one of claims 1-9, characterized in that, The method includes: The controller (2) receives real-time weight data from the weighing mechanism (16); The controller (2) determines whether the weight value in the real-time weight data has reached the preset weight threshold; if so, The controller (2) sends a first closing control signal to the electric butterfly valve (20), a second closing control signal to the negative pressure supply mechanism (14), and an alarm signal to the alarm (19). The electric butterfly valve (20) is used to close the valve according to the first closing control signal to stop the action of feeding material into the receiving bag (15) and to stop the periodic opening. The negative pressure supply mechanism (14) is used to stop the negative pressure supply action into the collection bucket (13) according to the second closing control signal.

Images