Tin soldering equipment for copper bar

By designing a soldering equipment with a main module and a continuous soldering module, the problems of low efficiency and complex operation of existing equipment have been solved. Continuous soldering of copper busbars and terminals has been achieved, improving the ease of operation and stability of the equipment, reducing costs, and facilitating its widespread adoption.

CN121551752AInactive Publication Date: 2026-02-24海安能达电气有限公司
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Patent Information

Application Number
CN202512040986.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-31
Publication Date
2026-02-24
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing soldering equipment is inefficient and complex to operate in the process of soldering copper busbars and terminals, while CNC equipment is expensive and difficult to popularize.

Method used

Design a soldering device that includes a main module and a continuous soldering module. Employ a main rotating rod, a unidirectional moving component, an adjustment drive component, a connecting component, a rack and pinion, and a locking component to achieve continuous soldering. Improve stability and ease of operation through components such as a locking rod, a locking hole, and a resistance block.

Benefits of technology

It enables continuous welding of copper busbars and terminals, lowers the threshold for equipment adjustment, improves operational convenience and stability, reduces costs, and facilitates widespread use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses tin soldering equipment for a copper bar, and belongs to the technical field of copper bar tin soldering, the tin soldering equipment comprises a main body module and a continuous tin soldering module, the main body module comprises a tin soldering frame, the top of the tin soldering frame is fixedly connected with a device frame, the device frame is provided with an air cylinder, and an output shaft of the air cylinder is fixedly connected with a tin soldering device main body; a long-strip-shaped displacement groove is formed in the top of the tin soldering frame, the continuous tin soldering module comprises a moving table slidably connected to the interior of the long-strip-shaped displacement groove, and through arrangement of a main body rotating rod, a one-way moving assembly, an adjusting driving assembly, a connecting assembly, a rack and a locking assembly, the equipment can achieve continuous welding operation; the numerical control soldering equipment is simple in structure, convenient to use, convenient to adjust the distance, capable of lowering the equipment adjusting threshold, capable of being operated by workers more conveniently, low in cost compared with existing numerical control soldering equipment and convenient to popularize and use in the field.
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Description

Technical Field

[0001] This invention relates to the field of copper busbar soldering technology, and more specifically, to a soldering device for copper busbars. Background Technology

[0002] Because copper is an excellent conductor with very good electrical conductivity, copper busbars are commonly used as conductive connectors. Terminals are soldered onto the copper busbars to facilitate connections with other components. Currently, before soldering the terminals, a tin sheet is usually placed between the copper busbar and the terminals. Soldering is typically performed using soldering equipment. During heating, the tin sheet melts between the copper busbar and the terminals. The main advantages of placing a tin sheet between the copper and the connecting terminals include improved solderability and enhanced oxidation resistance. Firstly, improved solderability is a significant benefit of soldering copper plates. Tin has a low melting point and good fluidity, allowing it to fill the tiny gaps on the copper plate surface, increasing the contact area and thus improving solderability. Furthermore, improved conductivity is another important advantage of soldering copper plates. Although tin's conductivity is not as high as copper's, with proper design and process control, a suitable tin layer can be formed on the copper plate surface, preventing oxidation while maintaining a certain level of conductivity. Especially at high temperatures, the conductivity of the tin layer increases with rising temperature.

[0003] Regarding the aforementioned technologies, the inventor believes that while current soldering equipment can solder copper busbars and terminals, the copper busbars typically have multiple terminals arranged in a straight line at equal intervals, requiring continuous soldering. In practice, most soldering equipment requires continuous manual operation to place the copper busbars, terminals, and solder sheets, gradually soldering multiple terminals – a very slow process. A smaller number of soldering devices are CNC-controlled, allowing for continuous, equidistant soldering of multiple terminals. However, the spacing between terminals varies across different copper busbars, and this type of equipment requires CNC adjustment. Most operators cannot master the adjustment operation of CNC soldering equipment, making it inconvenient for workers. Furthermore, such equipment is expensive. Therefore, considering these problems, widespread use of such equipment is not feasible. To address this, a soldering device for copper busbars is proposed. Summary of the Invention

[0004] To address the above problems, this invention provides a soldering device for copper busbars, employing the following technical solution: A soldering device for copper busbars includes a main module and a continuous soldering module. The main module includes a solder rack, a device frame fixedly connected to the top of the solder rack, a cylinder mounted on the device frame, and the output shaft of the cylinder fixedly connected to the main body of the soldering device. A long displacement groove is formed on the top of the solder rack. The continuous soldering module includes a movable stage slidably connected inside the long displacement groove. A fixing component is provided on the top of the movable stage. A main rotating rod is rotatably connected to the rear end face of the inner wall of the solder rack. A one-way movable component is provided between one end of the main rotating rod and the rear end face. An adjustment drive component is provided on the rear end face of the solder rack, and the adjustment drive component is connected to the one-way movable component. A connecting component is provided between the other end of the main rotating rod and the top of the inner wall of the solder rack. A rack is fixedly connected to the bottom of the movable stage near the rear end face of the solder rack, and the connecting component is connected to the rack. A locking component is provided between the main body of the soldering device and the top of the movable stage. A resistance component is provided between the rear end face of the solder rack and the outer surface of the main rotating rod.

[0005] Furthermore, the unidirectional moving component includes a rotating wheel rotatably connected to the rear end of the main rotating rod, a hollow gear rotatably connected to the rear end face of the solder frame, a ratchet groove formed on the inner wall of the hollow gear, the rotating wheel located inside the ratchet groove, a plurality of thrust ratchet teeth movably connected to the rear end face of the rotating wheel, one end of each of the plurality of thrust ratchet teeth being movably connected inside the ratchet groove, and a plurality of elastic plates fixedly connected to the rear end face of the rotating wheel, the outer surfaces of the plurality of elastic plates respectively contacting the outer surfaces of the plurality of thrust ratchet teeth.

[0006] Furthermore, the unidirectional moving component also includes a large gear disk rotatably connected to the rear end face of the solder frame, and a linkage gear is fixedly connected to the rear end face of the large gear disk, with the outer surface of the large gear disk meshing with the outer surface of the hollow gear.

[0007] Furthermore, the adjustment drive assembly includes an incomplete gear rotatably connected to the rear end face of the solder frame, the outer surface of the incomplete gear meshing with the outer surface of the linkage gear, and a swing arm fixedly connected to the rear end face of the incomplete gear, the swing arm having a strip groove inside.

[0008] Furthermore, the adjustment drive assembly also includes a drive motor fixedly connected to the rear end face of the inner wall of the solder frame. The output shaft of the drive motor extends to the rear end face of the solder frame and is fixedly connected to a drive disk. A sliding groove is formed on the rear end face of the drive disk. An adjustment screw is rotatably connected between the top and bottom of the inner wall of the sliding groove. One end of the adjustment screw extends to the outside of the drive disk. A moving block is slidably connected inside the sliding groove. The inside of the moving block is threadedly connected to the outer surface of the adjustment screw. A pointer is fixedly connected to the outer surface of the moving block. Multiple spacing indicator slots are formed at equal intervals in a straight line on the rear end face of the drive disk. The pointer is located directly in front of one of the spacing indicator slots. A transmission shaft is fixedly connected to the front end face of the moving block. The transmission shaft is movably connected inside the strip groove.

[0009] Furthermore, the connecting assembly includes a hexagonal slot formed on the front end face of the main rotating rod, a hexagonal rod movably connected inside the hexagonal slot, a fixing spring fixedly connected between one end of the hexagonal rod and the inner wall of the hexagonal slot, a connecting gear fixedly connected to the front end face of the hexagonal rod, the connecting gear meshing with a rack, and two mounting seats fixedly connected to the top of the inner wall of the solder frame, one of the mounting seats being rotatably sleeved on the outer surface of the main rotating rod, and a pressure rod movably connected inside the other mounting seat, one end of the pressure rod being fixedly connected to the front end face of the connecting gear.

[0010] Furthermore, the locking assembly includes two mounting plates fixedly connected to the main body of the soldering device. A locking rod is fixedly connected to the bottom of each of the two mounting plates. Multiple locking holes are provided on the top of the moving platform near the front and rear faces, and each of the multiple locking holes is adapted to the locking rod.

[0011] Furthermore, the resistance assembly includes an inner hollow slot plate fixedly connected to the rear end face of the inner wall of the solder rack. A lifting block is slidably connected inside the inner hollow slot plate. A pressure spring is fixedly connected to the top of the lifting block. A mounting screw is threadedly connected to the bottom of the inner hollow slot plate. The top of the mounting screw is rotatably connected to the bottom of the lifting block. A resistance block is fixedly connected to the outer surface of the main rotating rod. A resistance arm is slidably connected inside the inner hollow slot plate. The bottom of the resistance arm is fixedly connected to the top of the pressure spring. The top of the resistance arm is in contact with the outer surface of the resistance block.

[0012] Furthermore, the fixing component includes a hollow base fixedly connected to the top of the moving platform. A T-shaped plate is slidably connected inside the hollow base. A first screw is rotatably connected between the bottom and top of the inner wall of the hollow base. The interior of the T-shaped plate is threadedly connected to the outer surface of the first screw. Both ends of the outer surface of the T-shaped plate are threadedly connected to second screws. An n-shaped plate is provided below the T-shaped plate. The top of the n-shaped plate is rotatably connected to the bottom ends of the two second screws.

[0013] Furthermore, the fixing component also includes a strip-shaped limiting groove formed on the top of the moving platform, and a pad is movably connected inside the strip-shaped limiting groove. The top of the pad is at the same height as the bottom of the n-shaped plate.

[0014] In summary, the present invention has the following beneficial technical effects: (1) By setting up the main rotating rod, unidirectional moving component, adjustment drive component, connecting component, rack and pinion and locking component, the present invention enables the equipment to realize continuous welding operation and makes the spacing adjustment more convenient, which can reduce the threshold of equipment adjustment, thereby making the equipment easier for workers to operate. In addition, the cost of the equipment is lower than that of existing CNC soldering equipment, which facilitates the widespread use of the equipment in this field. (2) The present invention, through the setting of locking rod, locking hole, resistance block, resistance arm, pressure spring and mounting screw, can increase the resistance when the main rotating rod rotates, and avoid the main rotating rod from rotating due to inertia. At the same time, when the main body of the soldering device descends, the position of the moving stage can be locked by inserting the locking rod into the locking hole, thereby making the moving stage more stable and improving the stability of the equipment during operation. (3) The present invention enables the pressing and fixing of copper busbars and terminals by setting up a first screw, a T-plate, a second screw, an n-shaped plate and a pad, thereby making them more stable during the soldering connection process and further improving the stability of the soldering operation. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the rear end face structure of the present invention; Figure 2 This is a schematic diagram of the front end structure of the present invention; Figure 3 This is a schematic diagram of the continuous soldering module of the present invention; Figure 4 For the present invention Figure 3 Enlarged structural diagram at point A in the middle; Figure 5 An exploded view of the adjusted drive component of this invention; Figure 6 For the present invention Figure 5 Enlarged structural diagram at point B; Figure 7 This is a cross-sectional view of the connecting component of the present invention; Figure 8 For the present invention Figure 7 Enlarged structural diagram at point C; Figure 9 This is an exploded structural diagram of the fixing component of the present invention.

[0016] Explanation of the labels in the diagram: 100. Main module; 110. Solder rack; 120. Device frame; 130. Cylinder; 140. Main body of soldering device; 150. Long strip displacement groove; 200. Continuous soldering module; 210. Moving stage; 220. Fixing component; 221. Hollow base; 222. First screw; 223. T-plate; 224. Second screw; 225. N-shaped plate; 226. Strip-shaped limiting groove; 227. Pad; 230. Main rotating rod; 240. One-way moving component; 241. Rotating wheel; 242. Hollow gear; 243. Thrust ratchet; 244. Elastic plate; 245. Racket groove; 246. Large gear disk; 247. Linkage gear; 250. Adjustment drive component; 251. Incomplete gear; 252. Swing arm; 253. Strip-shaped groove; 254. 255. Drive motor; 256. Drive disc; 257. Adjusting screw; 258. Moving block; 259. Spacing indicator slot; 250. Pointer; 2510. Drive shaft; 260. Connecting assembly; 261. Mounting base; 262. Hexagonal rod; 263. Fixing spring; 264. Connecting gear; 265. Pressure rod; 270. Rack; 280. Locking assembly; 281. Mounting plate; 282. Locking rod; 283. Locking hole; 290. Resistance assembly; 291. Hollow slot plate; 292. Lifting block; 293. Resistance block; 294. Resistance arm; 295. Pressure spring; 296. Mounting screw. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0018] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0020] The following is in conjunction with the appendix Figure 1-9 The present invention will be described in further detail below.

[0021] Please see Figure 1-9 A soldering device for copper busbars includes a main module 100 and a continuous soldering module 200. The main module 100 includes a solder rack 110, a device frame 120 fixedly connected to the top of the solder rack 110, a cylinder 130 mounted on the device frame 120, and a soldering device body 140 fixedly connected to the output shaft of the cylinder 130. An elongated displacement groove 150 is formed on the top of the solder rack 110. The continuous soldering module 200 includes a movable stage 210 slidably connected inside the elongated displacement groove 150, a fixing component 220 mounted on the top of the movable stage 210, and a main rotating rod 230 rotatably connected to the rear end face of the inner wall of the solder rack 110. A one-way movable component 240 is provided between one end and the rear end face. An adjustment drive component 250 is provided on the rear end face of the solder frame 110. The adjustment drive component 250 is connected to the one-way movable component 240. A connecting component 260 is provided between the other end of the main rotating rod 230 and the top of the inner wall of the solder frame 110. A rack 270 is fixedly connected to the bottom of the moving stage 210 near the rear end face of the solder frame 110. The connecting component 260 is connected to the rack 270. A locking component 280 is provided between the main body 140 of the soldering device and the top of the moving stage 210. A resistance component 290 is provided between the rear end face of the solder frame 110 and the outer surface of the main rotating rod 230.

[0022] In use, the copper busbars to be soldered are placed on top of the moving stage 210, and the terminals and solder sheets are arranged accordingly. They are then secured using the fixing component 220. Subsequently, the operator manipulates and adjusts the drive component 250 according to the spacing between the terminals. Opening the drive component 250 causes it to swing downwards, which in turn drives the main rotating rod 230 via the one-way moving component 240. The main rotating rod 230 then drives the connecting component 260 to drive the rack 270, causing the rack 270 to move the moving stage 210 a certain distance within the elongated displacement groove 150. The subsequent upward swing of the adjustment drive component 250 will drive the unidirectional moving component 240 to idle. At this time, the cylinder 130 drives the soldering device body 140 to descend, thereby achieving soldering connection of the copper busbar and terminals. Afterward, the cylinder 130 lifts the soldering device body 140, and the adjustment drive component 250 swings downward again. At this time, the adjustment drive component 250 will again achieve the transmission displacement of the moving stage 210. Subsequently, the soldering device body 140 descends again to complete the continuous soldering operation. This equipment can realize continuous soldering operation and makes the spacing adjustment more convenient.

[0023] The one-way movable component 240 includes a rotating wheel 241 rotatably connected to the rear end of the main rotating rod 230. A hollow gear 242 is rotatably connected to the rear end face of the solder frame 110. A ratchet groove 245 is formed on the inner wall of the hollow gear 242. The rotating wheel 241 is located inside the ratchet groove 245. Multiple thrust ratchet teeth 243 are movably connected to the rear end face of the rotating wheel 241. One end of each thrust ratchet tooth 243 is movably connected to the inside of the ratchet groove 245. Multiple elastic plates 244 are fixedly connected to the rear end face of the rotating wheel 241. The outer surfaces of the multiple elastic plates 244 contact the outer surfaces of the multiple thrust ratchet teeth 243. The one-way movable component 240 also includes a large gear disk 246 rotatably connected to the rear end face of the solder frame 110. A linkage gear 247 is fixedly connected to the rear end face of the 46. The outer surface of the large gear disk 246 meshes with the outer surface of the hollow gear 242. The adjustment drive assembly 250 includes an incomplete gear 251 rotatably connected to the rear end face of the solder frame 110. The outer surface of the incomplete gear 251 meshes with the outer surface of the linkage gear 247. A swing arm 252 is fixedly connected to the rear end face of the incomplete gear 251. A strip groove 253 is provided inside the swing arm 252. The adjustment drive assembly 250 also includes a drive motor 254 fixedly connected to the rear end face of the inner wall of the solder frame 110. The output shaft of the drive motor 254 extends to the rear end face of the solder frame 110 and is fixedly connected to a drive disk 255. A sliding groove is provided on the rear end face of the drive disk 255. An adjusting screw 256 is rotatably connected between the top and bottom of the wall. One end of the adjusting screw 256 extends to the outside of the drive disc 255. A moving block 257 is slidably connected inside the slide groove. The inside of the moving block 257 is threadedly connected to the outer surface of the adjusting screw 256. A pointer 259 is fixedly connected to the outer surface of the moving block 257. The rear end face of the drive disc 255 has multiple spacing indicator slots 258 evenly spaced in a straight line. The pointer 259 is located directly in front of one of the spacing indicator slots 258. A drive shaft 2510 is fixedly connected to the front end face of the moving block 257. The drive shaft 2510 is movably connected inside the strip groove 253. The connecting assembly 260 includes a hexagonal slot formed on the front end face of the main rotating rod 230. The inner surface of the hexagonal slot... A hexagonal rod 262 is movably connected to the soldering device. A fixing spring 263 is fixedly connected between one end of the hexagonal rod 262 and the inner wall of the hexagonal slot. A connecting gear 264 is fixedly connected to the front end face of the hexagonal rod 262. The connecting gear 264 meshes with the rack 270. Two mounting seats 261 are fixedly connected to the top of the inner wall of the soldering device 110. One mounting seat 261 is rotatably sleeved on the outer surface of the main rotating rod 230. A pressure rod 265 is movably connected inside the other mounting seat 261. One end of the pressure rod 265 is fixedly connected to the front end face of the connecting gear 264. The locking assembly 280 includes two mounting plates 281 fixedly connected to the main body 140 of the soldering device. A locking rod 282 is fixedly connected to the bottom of each mounting plate 281.Multiple locking holes 283 are provided on the top of the mobile platform 210 near both the front and rear faces, and each locking hole 283 is adapted to a locking rod 282.

[0024] When the drive motor 254 is turned on, the drive disk 255 rotates. The drive disk 255 drives the transmission shaft 2510 to move inside the strip groove 253. The transmission shaft 2510 pushes the swing arm 252, which in turn drives the incomplete gear 251 to swing upward. The strip groove 253 then drives the large gear disk 246 through the linkage gear 247. The large gear disk 246 drives the hollow gear 242. The hollow gear 242 drives the thrust ratchet 243 through the ratchet groove 245. The thrust ratchet 243 drives the rotating wheel 241, thereby driving the main rotating rod 230 to rotate. When the rotating rod 230 rotates, it will drive the connecting gear 264 to rotate via the hexagonal rod 262. The connecting gear 264 drives the rack 270, causing the rack 270 to drive the moving table 210 to slide a certain distance inside the long displacement groove 150. Subsequently, the incomplete gear 251 will be driven to swing downwards. When the incomplete gear 251 swings downwards, the large gear disk 246 will drive the hollow gear 242 to rotate freely on the outer surface of the rotating wheel 241, so that the connecting gear 264 will not drive the moving table 210 to move. At this time, the cylinder 130 drives the soldering device body 140 to descend, and the soldering... When the main body 140 of the device descends, the locking rod 282 will insert into the locking hole 283 to lock the moving stage 210, thereby making the soldering connection of the main body 140 of the soldering device to the copper busbar and terminals more stable. Then, the cylinder 130 lifts the main body 140 of the soldering device, and the incomplete gear 251 swings downward again, thereby realizing the transmission displacement of the moving stage 210 again. When it is necessary to adjust the displacement distance of the moving stage 210 according to the terminal spacing, the pressure rod 265 is pushed. The pressure rod 265 will drive the connecting gear 264 and the hexagonal rod 262 to move. At this time, the fixing spring 26 3. The compression and connection gear 264 are disconnected from the rack 270. Then, the adjusting screw 256 is rotated according to the spacing between multiple terminals. The adjusting screw 256 will drive the moving block 257 and the transmission shaft 2510 to move downward. The transmission shaft 2510 knows the adjusted spacing value according to the cooperation of the pointer 259 and the spacing indicator slot 258. After the adjustment is completed, the pressure rod 265 is released, the connection gear 264 is reset and reconnected to the rack 270, thereby completing the adjustment of the solder spacing. This allows the equipment to achieve continuous soldering operation and makes the spacing adjustment more convenient.

[0025] The resistance assembly 290 includes an inner hollow slot plate 291 fixedly connected to the rear end face of the inner wall of the solder rack 110. A lifting block 292 is slidably connected inside the inner hollow slot plate 291. A pressure spring 295 is fixedly connected to the top of the lifting block 292. A mounting screw 296 is threadedly connected to the bottom of the inner hollow slot plate 291. The top of the mounting screw 296 is rotatably connected to the bottom of the lifting block 292. A resistance block 293 is fixedly connected to the outer surface of the main rotating rod 230. A resistance arm 294 is slidably connected inside the inner hollow slot plate 291. The bottom of the resistance arm 294 is fixedly connected to the top of the pressure spring 295. The top of the resistance arm 294 is in contact with the outer surface of the resistance block 293.

[0026] When the main rotating rod 230 is working, the resistance arm 294 abuts against the outer surface of the resistance block 293 through the elastic force of the pressure spring 295, thereby increasing the resistance when the main rotating rod 230 rotates, thus preventing the main rotating rod 230 from rotating due to inertia and improving its stability. At the same time, the resistance can be adjusted by rotating the mounting screw 296 to compress the pressure spring 295, which is convenient for operators.

[0027] The fixing component 220 includes a hollow base 221 fixedly connected to the top of the moving platform 210. A T-shaped plate 223 is slidably connected inside the hollow base 221. A first screw 222 is rotatably connected between the bottom and top of the inner wall of the hollow base 221. The interior of the T-shaped plate 223 is threadedly connected to the outer surface of the first screw 222. Both ends of the outer surface of the T-shaped plate 223 are threadedly connected to second screws 224. An n-shaped plate 225 is provided below the T-shaped plate 223. The top of the n-shaped plate 225 is rotatably connected to the bottom ends of the two second screws 224. The fixing component 220 also includes a strip-shaped limiting groove 226 opened on the top of the moving platform 210. A pad 227 is movably connected inside the strip-shaped limiting groove 226. The top of the pad 227 is at the same height as the bottom of the n-shaped plate 225.

[0028] Replace the pad 227 according to the thickness of the copper busbar, so that the top of the pad 227 is on the same plane as the top of the copper busbar. Then, stack the terminals and solder sheets to be soldered between the top of the copper busbar and the pad 227. Then, rotate the first screw 222, which drives the T-plate 223 to descend. The descending T-plate 223 presses down on multiple terminals. Finally, rotate the two second screws 224 to drive the n-shaped plate 225 to descend. The n-shaped plate 225 presses down and fixes the copper busbar, making the subsequent soldering operation more stable.

[0029] The implementation principle of this invention is as follows: During use, the copper busbar is placed on top of the moving platform 210. Then, the pad 227 is replaced according to the thickness of the copper busbar, ensuring the top of the pad 227 is flush with the top of the copper busbar. The terminals to be soldered and solder sheets are then stacked between the copper busbar and the top of the pad 227. Next, the first screw 222 is rotated, causing the T-plate 223 to descend. The descending T-plate 223 presses down on multiple terminals. Finally, the two second screws 224 are rotated to descend the n-shaped plate 225, which presses and fixes the copper busbar, making subsequent soldering operations more stable. Then, the drive motor 254 is turned on to drive the drive disk 255 to rotate. The drive shaft 2510 moves within the slot 253, pushing the swing arm 252 to cause the incomplete gear 251 to swing upwards. The slot 253 then drives the large gear disk 246 via the linkage gear 247. The large gear disk 246 drives the hollow gear 242, which in turn drives the thrust ratchet 243 via the ratchet groove 245. The thrust ratchet 243 drives the rotating wheel 241, thereby rotating the main rotating rod 230. When the main rotating rod 230 rotates, it drives the connecting gear 264 via the hexagonal rod 262. The connecting gear 264 drives the rack 270, causing the rack 270 to drive the moving table 210 to slide a certain distance within the long displacement slot 150. The subsequent incomplete... Gear 251 will be driven to swing downwards. When the incomplete gear 251 swings downwards, the large gear disk 246 will drive the hollow gear 242 to rotate freely on the outer surface of the rotating wheel 241, so that the connecting gear 264 will not drive the moving stage 210 to move. At this time, the cylinder 130 drives the soldering device body 140 to descend. When the soldering device body 140 descends, the locking rod 282 will insert into the locking hole 283 to lock the moving stage 210, thereby making the subsequent soldering connection of the soldering device body 140 to the copper busbar and terminals more stable. Afterwards, the cylinder 130 lifts the soldering device body 140, and the incomplete gear 251 swings downwards again, thereby realizing the transmission displacement of the moving stage 210 again. Adjustments need to be made according to the terminal spacing. When the moving stage 210 moves a certain distance, the pressure rod 265 is pushed. The pressure rod 265 will drive the connecting gear 264 and the hexagonal rod 262 to move. At this time, the fixing spring 263 is compressed and the connecting gear 264 is disengaged from the rack 270. Then, the adjusting screw 256 is rotated according to the spacing between multiple terminals. The adjusting screw 256 will drive the moving block 257 and the transmission shaft 2510 to move downward. The transmission shaft 2510 knows the adjusted spacing value according to the cooperation of the pointer 259 and the spacing indicator slot 258. After the adjustment is completed, the pressure rod 265 is released, the connecting gear 264 resets and reconnects to the rack 270, thus completing the adjustment of the solder spacing. This allows the equipment to achieve continuous soldering operation and makes the spacing adjustment more convenient.Furthermore, this equipment has a lower cost compared to existing CNC soldering equipment, facilitating its widespread use in this field. When the main rotating rod 230 is working, the resistance arm 294, through the elastic force of the pressure spring 295, abuts against the outer surface of the resistance block 293, thereby increasing the resistance during the rotation of the main rotating rod 230. This prevents the main rotating rod 230 from rotating due to inertia, improving its stability. Simultaneously, the resistance can be adjusted by rotating the mounting screw 296 to compress the pressure spring 295, facilitating operator control.

[0030] The above are all preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A soldering device for copper busbars, comprising a main module (100) and a continuous soldering module (200), characterized in that: The main module (100) includes a solder rack (110), a device frame (120) is fixedly connected to the top of the solder rack (110), a cylinder (130) is provided on the device frame (120), the output shaft of the cylinder (130) is fixedly connected to the main body of the soldering device (140), and a long strip displacement groove (150) is opened on the top of the solder rack (110). The continuous soldering module (200) includes a movable stage (210) slidably connected inside an elongated displacement groove (150). A fixing component (220) is provided on the top of the movable stage (210). A main rotating rod (230) is rotatably connected to the rear end face of the inner wall of the soldering frame (110). A one-way movable component (240) is provided between one end of the main rotating rod (230) and the rear end face. An adjustment drive component (250) is provided on the rear end face of the soldering frame (110). The adjustment drive component (250) is connected to the one-way movable component (240). A connecting component (260) is provided between the other end of the main rotating rod (230) and the top of the inner wall of the solder frame (110). A rack (270) is fixedly connected to the bottom of the moving platform (210) near the rear end face of the solder frame (110). The connecting component (260) is connected to the rack (270). A locking component (280) is provided between the main body (140) of the soldering device and the top of the moving platform (210). A resistance component (290) is provided between the rear end face of the solder frame (110) and the outer surface of the main rotating rod (230).

2. The soldering equipment for copper busbars according to claim 1, characterized in that: The unidirectional moving component (240) includes a rotating wheel (241) rotatably connected to the rear end of the main rotating rod (230). The rear end face of the solder frame (110) is rotatably connected to a hollow gear (242). The inner wall of the hollow gear (242) is provided with a ratchet groove (245). The rotating wheel (241) is located inside the ratchet groove (245). The rear end face of the rotating wheel (241) is movably connected to a plurality of thrust ratchet teeth (243). One end of each of the plurality of thrust ratchet teeth (243) is movably connected to the inside of the ratchet groove (245). The rear end face of the rotating wheel (241) is fixedly connected to a plurality of elastic plates (244). The outer surfaces of the plurality of elastic plates (244) respectively contact the outer surfaces of the plurality of thrust ratchet teeth (243).

3. The soldering equipment for copper busbars according to claim 2, characterized in that: The unidirectional moving component (240) also includes a large gear disk (246) rotatably connected to the rear end face of the solder frame (110), and a linkage gear (247) is fixedly connected to the rear end face of the large gear disk (246). The outer surface of the large gear disk (246) meshes with the outer surface of the hollow gear (242).

4. The soldering equipment for copper busbars according to claim 3, characterized in that: The adjustment drive assembly (250) includes an incomplete gear (251) rotatably connected to the rear end face of the solder frame (110). The outer surface of the incomplete gear (251) meshes with the outer surface of the linkage gear (247). A swing arm (252) is fixedly connected to the rear end face of the incomplete gear (251). A strip groove (253) is provided inside the swing arm (252).

5. A soldering device for copper busbars according to claim 4, characterized in that: The adjustment drive assembly (250) further includes a drive motor (254) fixedly connected to the rear end face of the inner wall of the solder frame (110). The output shaft of the drive motor (254) extends to the rear end face of the solder frame (110) and is fixedly connected to a drive disk (255). A sliding groove is provided on the rear end face of the drive disk (255). An adjustment screw (256) is rotatably connected between the top and bottom of the inner wall of the sliding groove. One end of the adjustment screw (256) extends to the outside of the drive disk (255). A moving block (25) is slidably connected inside the sliding groove. 7) The interior of the moving block (257) is threadedly connected to the outer surface of the adjusting screw (256). A pointer (259) is fixedly connected to the outer surface of the moving block (257). The rear end face of the drive disk (255) is provided with multiple spacing indicator slots (258) at equal intervals in a straight line. The pointer (259) is located directly in front of one of the spacing indicator slots (258). A transmission shaft (2510) is fixedly connected to the front end face of the moving block (257). The transmission shaft (2510) is movably connected to the interior of the strip groove (253).

6. A soldering device for copper busbars according to claim 5, characterized in that: The connecting assembly (260) includes a hexagonal slot formed on the front end face of the main rotating rod (230). A hexagonal rod (262) is movably connected inside the hexagonal slot. A fixing spring (263) is fixedly connected between one end of the hexagonal rod (262) and the inner wall of the hexagonal slot. A connecting gear (264) is fixedly connected to the front end face of the hexagonal rod (262). The connecting gear (264) meshes with the rack (270). Two mounting seats (261) are fixedly connected to the top of the inner wall of the solder frame (110). One of the mounting seats (261) is rotatably sleeved on the outer surface of the main rotating rod (230). A pressure rod (265) is movably connected inside the other mounting seat (261). One end of the pressure rod (265) is fixedly connected to the front end face of the connecting gear (264).

7. A soldering device for copper busbars according to claim 6, characterized in that: The locking assembly (280) includes two mounting plates (281) fixedly connected to the main body (140) of the soldering device. The bottom of each of the two mounting plates (281) is fixedly connected to a locking rod (282). The top of the moving platform (210) is provided with multiple locking holes (283) near the front and rear faces. The multiple locking holes (283) are adapted to the locking rods (282).

8. A soldering device for copper busbars according to claim 7, characterized in that: The resistance assembly (290) includes an inner hollow slot plate (291) fixedly connected to the rear end face of the inner wall of the solder rack (110). A lifting block (292) is slidably connected inside the inner hollow slot plate (291). A pressure spring (295) is fixedly connected to the top of the lifting block (292). An installation screw (296) is threadedly connected to the bottom of the inner hollow slot plate (291). The top of the installation screw (296) is rotatably connected to the bottom of the lifting block (292). A resistance block (293) is fixedly connected to the outer surface of the main rotating rod (230). A resistance arm (294) is slidably connected inside the inner hollow slot plate (291). The bottom of the resistance arm (294) is fixedly connected to the top of the pressure spring (295). The top of the resistance arm (294) is in contact with the outer surface of the resistance block (293).

9. A soldering device for copper busbars according to claim 8, characterized in that: The fixing component (220) includes a hollow base (221) fixedly connected to the top of the moving platform (210). A T-shaped plate (223) is slidably connected inside the hollow base (221). A first screw (222) is rotatably connected between the bottom and top of the inner wall of the hollow base (221). The interior of the T-shaped plate (223) is threadedly connected to the outer surface of the first screw (222). Both ends of the outer surface of the T-shaped plate (223) are threadedly connected to second screws (224). An n-shaped plate (225) is provided below the T-shaped plate (223). The top of the n-shaped plate (225) is rotatably connected to the bottom ends of the two second screws (224).

10. A soldering device for copper busbars according to claim 9, characterized in that: The fixing component (220) also includes a strip-shaped limiting groove (226) opened on the top of the moving platform (210), and a pad (227) is movably connected inside the strip-shaped limiting groove (226). The top of the pad (227) is at the same height as the bottom of the n-shaped plate (225).