Semiconductor wafer intelligent processing equipment with lens protection function

Abstract

The invention relates to the field of semiconductor processing, in particular to intelligent semiconductor wafer processing equipment with a lens protection function. The problems to be solved are that cutting dislocation of a wafer is caused by the fact that smoke and fine particles generated by laser cutting pollute the wafer, and meanwhile a lens is also polluted and is difficult to overhaul. According to the technical scheme, the semiconductor wafer intelligent processing equipment with the lens protection function comprises a box body; the inner side of the box body is provided with a placing rack used for placing a semiconductor wafer. A three-dimensional moving assembly is mounted on the box body; the three-dimensional moving assembly is connected with a laser cutter; a lens is arranged in the laser cutter; stable nitrogen gas flow is provided on the side face of the lens, the lens is cooled, meanwhile, it can be avoided that the gas flow affects light beams to penetrate through the lens, and the laser cutting stability is effectively ensured; nitrogen flowing through the airflow channel quickly takes away smoke which may permeate, so that an air curtain effect is achieved, and smoke permeation is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing, and more particularly to a smart semiconductor wafer processing device with lens protection function. Background Technology

[0002] Semiconductor wafers, as one of the most important components of modern technology, play a vital role in various industries. During the production process, semiconductor wafers need to be laser-cut to the required dimensions. During the cutting process, there are specific requirements for the placement of the wafer to ensure that it does not shift or misalign, which could lead to significant cutting errors. At the same time, because laser cutting generates significant fumes and fine particulate impurities, it is also easy for wafer cutting errors to occur. Therefore, it is necessary to constantly monitor the wafer position and simultaneously treat the generated fumes and fine particulate impurities.

[0003] Secondly, during the laser cutting process, the lens inside the laser cutter can also be contaminated by fumes or fine particles, causing problems with the beam. At the same time, the lens will experience significant temperature rise during use. Current technologies mostly use water cooling to address this, but with long-term use of the equipment, water cooling is prone to leakage, which is difficult to detect and repair, resulting in maintenance difficulties. Summary of the Invention

[0004] To overcome the drawbacks of laser cutting, such as the contamination of wafers by fumes and fine particles, leading to cutting misalignment, and the contamination of lenses that are difficult to repair, this invention provides a semiconductor wafer intelligent processing equipment with lens protection function.

[0005] The technical solution is as follows: A semiconductor wafer intelligent processing equipment with lens protection function includes a housing; a placement rack for placing semiconductor wafers is provided inside the housing; a three-dimensional moving component is installed on the housing; a laser cutter is connected to the three-dimensional moving component; a lens is installed inside the laser cutter; a protective box is also included; a protective box for protecting the lens is installed on the three-dimensional moving component; a detection camera is installed on the lower side of the protective box; a fan is provided on the outer side of the housing; the fan inlet is connected to a first dust extraction pipe; a second valve is installed on the first dust extraction pipe; several air holes are opened around the laser cutter on the lower side of the protective box, and the air holes are connected to the first dust extraction pipe; a cooling component for cooling and protecting the lens is installed on the laser cutter; the cooling component is connected to the protective box.

[0006] As a preferred option, the enclosure is equipped with an observation window.

[0007] Preferably, the cooling component includes a fixed frame, a mounting frame, an air inlet pipe, an air extraction pipe, and a first valve; a fixed frame for fixing the lens is movably connected to the protective box; a mounting frame is connected to the laser cutter, and the lens is installed inside the mounting frame; an air inlet pipe for nitrogen gas entry is connected to the mounting frame, and the air inlet pipe is connected to a nitrogen storage tank; an air extraction pipe is connected to the mounting frame, and the air extraction pipe is connected to a central pipe; a first valve is installed on the air extraction pipe.

[0008] Preferably, the mounting bracket has two symmetrical airflow channels on the right side.

[0009] Preferably, the mounting bracket has a set of symmetrical side channels on both the front and rear sides, and air vents are opened at the side channels simultaneously.

[0010] As a preferred option, an observation mirror is installed on the front of the protective box.

[0011] Preferably, the mounting bracket and the protective box are horizontally slidably connected.

[0012] Preferably, it also includes a cleaning pipe, a second dust extraction pipe, and a third valve; the cleaning pipe is connected to the left side of the laser cutter; the second dust extraction pipe is connected to the cleaning pipe; the second dust extraction pipe is connected to the central pipe; and the third valve is installed on the second dust extraction pipe.

[0013] Preferably, the observation mirror is designed to be openable.

[0014] Preferably, a detector is also included; a detector for detecting leaking nitrogen is installed inside the protective enclosure.

[0015] The beneficial effects of this invention are: by providing a stable nitrogen gas flow on the side of the lens, the lens can be cooled while avoiding the airflow affecting the beam passing through the lens, thus effectively ensuring the stability of laser cutting; Nitrogen flowing through the airflow channel quickly carries away any flue gas that may seep in, thus achieving the effect of an air curtain and preventing flue gas from seeping in. By maintaining a positive pressure inside the mounting bracket, which is greater than the external air pressure, it effectively prevents external moisture and dust from entering the mounting bracket during shutdown, thus ensuring the lens storage environment, reducing maintenance difficulty, and improving protection. Nitrogen gas is blown from the air inlet onto the upper and lower surfaces of the lens to remove impurities. At the same time, the removed impurities are discharged through the second dust extraction tube, achieving a cleaning operation without disassembly. This cleaning operation can be carried out simultaneously with the aforementioned short-term downtime lens maintenance process, effectively integrating the steps and improving efficiency. By keeping the lens inside the protective case at all times, avoiding direct contact with the external environment, and then observing it manually through the observation lens, the cumbersome steps of disassembly are avoided, reducing maintenance difficulty and improving safety. Leak detection using a detector improves the accuracy of maintenance and also plays a significant role in the timely detection of leaks. Attached Figure Description

[0016] Figure 1 This is a closed diagram of the housing of the present invention; Figure 2 This is an open view of the housing of the present invention; Figure 3 This is a three-dimensional structural diagram of the protective box and detection camera assembly of the present invention; Figure 4 This is a front view of the present invention; Figure 5 This is a three-dimensional structural diagram of the combination of the fixing frame and the mounting frame of the present invention; Figure 6 This is a three-dimensional structural diagram of the combined cleaning pipe and the second dust extraction pipe of the present invention. Figure 7 This is a three-dimensional structural diagram of the mounting bracket of the present invention; Figure 8 This is a three-dimensional structural diagram of the air extraction pipe and the first valve assembly of the present invention; Figure 9 This is a diagram showing the lens extraction of the present invention.

[0017] Explanation of reference numerals in the attached drawings: 1-Box body, 1001-Observation window, 2-Placement rack, 3-Electric lifter, 4-Two-dimensional electric mover, 5-Laser cutter, 6-Lens, 101-Protective box, 10101-Observation mirror, 102-Detection camera, 103-Fixed frame, 104-Mounting frame, 10401-Airflow channel, 10402-Side channel, 10403-Air inlet, 105-Inlet pipe, 106-Extraction pipe, 107-First valve, 108-Centralized pipe, 109-Fan, 110-First dust extraction pipe, 111-Second valve, 201-Cleaning pipe, 202-Second dust extraction pipe, 203-Third valve, 301-Detector. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0019] Example 1 A smart semiconductor wafer processing device with lens protection function, such as Figures 1-9As shown, it includes a housing 1, a mounting frame 2, a three-dimensional moving component, a laser cutter 5, and a lens 6; the mounting frame 2 is provided inside the housing 1; the three-dimensional moving component is installed on the housing 1; the laser cutter 5 is connected to the three-dimensional moving component; the lens 6 is provided inside the laser cutter 5; It also includes a protective box 101, a detection camera 102, a central pipe 108, a fan 109, a first dust extraction pipe 110, a second valve 111, and a cooling component; the protective box 101 is installed on the three-dimensional moving component; two detection cameras 102 are installed on the lower side of the protective box 101; a fan 109 is provided on the outside of the box 1; the air inlet of the fan 109 is connected to the first dust extraction pipe 110; the second valve 111 is installed on the first dust extraction pipe 110; several air holes are opened around the laser cutter 5 on the lower side of the protective box 101, and the air holes are connected to the first dust extraction pipe 110; a cooling component is installed on the laser cutter 5; the cooling component is connected to the protective box 101.

[0020] An observation window 1001 is provided on the housing 1 to facilitate manual observation of the cutting status of the semiconductor wafer.

[0021] The cooling assembly includes a fixed frame 103, a mounting frame 104, an air inlet pipe 105, an air extraction pipe 106, and a first valve 107; the fixed frame 103 is movably connected to the protective box 101; the mounting frame 104 is connected to the laser cutter 5, and the lens 6 is installed inside the mounting frame 104; the air inlet pipe 105 is connected to the mounting frame 104, and the air inlet pipe 105 is connected to a nitrogen storage tank; the air extraction pipe 106 is connected to the mounting frame 104, and the air extraction pipe 106 is connected to the central pipe 108; the first valve 107 is installed on the air extraction pipe 106.

[0022] The mounting bracket 104 has two symmetrical airflow channels 10401 on its right side.

[0023] The mounting bracket 104 has a set of symmetrical side channels 10402 on both the front and rear sides, and air vents 10403 are opened at the side channels 10402.

[0024] An observation mirror 10101 is installed on the front side of the protective box 101.

[0025] The fixing frame 103 and the protective box 101 are horizontally slidably connected, thereby ensuring that the fixing frame 103 is in a horizontal state when it is pulled out.

[0026] During laser cutting, a whole circular semiconductor wafer is first manually fixed onto the placement rack 2. After fixing, the movement path of the laser cutter 5 is set by the program, and then the wafer of the required cutting size is cut accordingly. At the same time, the electric lift 3 and the two-dimensional electric mover 4 are synchronously controlled by the program to achieve three-dimensional spatial motion control of the laser cutter 5, so as to ensure that the laser cutting work is carried out in an orderly manner. After the adjustment is completed, the position of the semiconductor wafer is simultaneously determined by the detection camera 102. At the same time, real-time observation is carried out during the cutting process to avoid the inability to make timely adjustments in case of significant deviations. After the above preparations are completed, the housing 1 is closed, the laser cutter 5 is turned on simultaneously, and the cutting of the semiconductor wafer begins. The first valve 107 and the second valve 111 are opened simultaneously, and the fan 109 starts working simultaneously. The fan 109 draws in air, allowing the high-temperature toxic fumes and fine particles generated during the cutting process to be removed through the first dust extraction pipe 110, preventing them from remaining on the semiconductor wafer surface or spreading to other parts of the housing 1 and causing pollution. Meanwhile, by adding a protective housing 101 to the outside of the laser cutter 5, compared to the prior art where the lens 6 is directly installed inside the laser cutter 5 (i.e., the mounting bracket 103 and the laser cutter 5 are sealed with bolts), which allows fumes to seep in and cause fine particles to adhere to the lens 6 surface, potentially malfunctioning the laser cutter 5, the protective housing 101 effectively avoids this problem. It also prevents the lens 6 from overheating due to the diffusion of high-temperature fumes, thus avoiding the need to stop the machine for cooling and reducing the cutting rate and continuity.

[0027] Furthermore, during the cutting process, to ensure the temperature of lens 6 remains within the normal range, after the first valve 107 opens and the fan 109 starts working, nitrogen gas is supplied through an external nitrogen tank connected to the air inlet pipe 105. Nitrogen gas then enters the airflow channel 10401 through the air inlet pipe 105, subsequently entering the side channel 10402 from the airflow channel 10401, and finally exiting from the exhaust pipe 106 and entering the central pipe 108. In this process, by providing a stable nitrogen gas flow to the side of lens 6, the lens 6 is cooled while preventing airflow issues. The beam passes through lens 6, which effectively ensures the stability of laser cutting. At the same time, the upper and lower sides of the mounting bracket 104 and the laser cutter 5 are the main locations for flue gas to seep in. This is because when the airflow channel 10401 starts to circulate, corresponding slots are opened at the mounting bracket 104 and the laser cutter 5. Even if flue gas seeps in through this location during use, it can still be quickly carried away by the nitrogen flowing through the airflow channel 10401, thereby achieving the effect of an air curtain and preventing flue gas from seeping in.

[0028] Furthermore, after the laser cutter 5 is shut down and no longer in use, i.e., after a short-term shutdown, the lens 6 needs to be protected so that it can be used normally when it is turned on again. In the current operation, the lens 6 is generally not treated because it requires not only physical sealing but also ensuring that the lens 6 is in a clean, low-humidity, and constant-temperature environment, which makes maintenance difficult. In this application, when the lens 6 needs to be maintained, the nitrogen tank is opened to supply nitrogen to the air inlet pipe 105, so that the nitrogen gradually fills the inside of the mounting bracket 104. After filling for a certain period of time, the air inside the mounting bracket 104 is squeezed out by the nitrogen. Then the first valve 107 and the second valve 111 are closed. At the same time, nitrogen continues to fill the inside of the mounting bracket 104, making the inside of the mounting bracket 104 a positive pressure state, which is greater than the outside air pressure. Then the nitrogen supply is stopped. At this time, the lens 6 is in a nitrogen-filled positive pressure environment. At the same time, the positive pressure can effectively prevent external moisture and dust and other impurities from entering the inside of the mounting bracket 104 with the outside air during the shutdown process, effectively ensuring the storage environment of the lens 6, reducing maintenance difficulty, and improving the protection effect.

[0029] Example 2 Based on Example 1, such as Figure 4 and Figure 6 As shown, it also includes a cleaning pipe 201, a second dust extraction pipe 202 and a third valve 203; the cleaning pipe 201 is connected to the left side of the laser cutter 5; the second dust extraction pipe 202 is connected to the cleaning pipe 201; the second dust extraction pipe 202 is connected to the central pipe 108; the third valve 203 is installed on the second dust extraction pipe 202.

[0030] The observation mirror 10101 is designed to be openable, making it easy to disassemble and replace the lens 6.

[0031] After lens 6 is used, the current operation requires manual disassembly of lens 6 to clean any impurities that may be present on its surface. After disassembly, lens 6 is exposed to the outside air, posing a constant risk of contamination. Furthermore, during disassembly, it is necessary to ensure that lens 6 is horizontal, i.e., pulled out vertically and stably. However, in actual operation, this requires a high level of skill from the operator, as errors can easily lead to lens 6 shifting, necessitating calibration and positioning, which is time-consuming. Therefore, when cleaning lens 6 is required, the first valve 107 is closed, the third valve 203 is opened, and nitrogen is supplied simultaneously. At the same time, the blower 109 starts working, causing nitrogen to be blown from the air inlet 10403 onto the upper and lower surfaces of lens 6, effectively removing impurities. Simultaneously, the removed impurities are discharged through the second dust extraction pipe 202, achieving a cleaning operation without disassembly. This cleaning operation can also be performed concurrently with the aforementioned short-term downtime maintenance of lens 6, effectively integrating the steps and improving efficiency.

[0032] Furthermore, after cleaning, the cleanliness of lens 6 needs to be checked periodically. This can be done by disassembling the mounting bracket 103 and then slowly and steadily pulling out lens 6 horizontally, so that lens 6 is always in the internal environment of the protective box 101, avoiding direct contact with the external environment. Then, it can be observed manually through the observation mirror 10101, avoiding cumbersome steps such as disassembly, reducing maintenance difficulty, and improving safety.

[0033] Example 3 Based on Example 2, such as Figure 5 As shown, it also includes a detector 301; the detector 301 is installed inside the protective box 101.

[0034] When the laser cutter 5 is no longer in use, an airtightness inspection is required at the mounting location of the laser cutter 5 and the lens 6. In the existing technology, it is generally necessary to disassemble the laser cutter 5 and the lens 6 and then manually inspect them. This process is time-consuming and labor-intensive, with poor inspection accuracy and mediocre results. Manual inspection is not effective. Therefore, when the lens 6 is no longer in use and the mounting bracket 104 is filled with nitrogen, if there is an air leak at the mounting location of the mounting bracket 104 and the laser cutter 5, the nitrogen can be used to detect it through the detector 301. At the same time, other components located in the protective box 101 can also be leak-detected in this way. This can also be done during routine maintenance and inspection, achieving two goals at once. It not only improves the inspection accuracy but also plays a significant role in the timely detection of leaks.

[0035] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor wafer intelligent processing equipment with lens protection function, comprising a housing (1); a placement rack (2) for placing semiconductor wafers is provided inside the housing (1); a three-dimensional moving component is installed on the housing (1); a laser cutter (5) is connected to the three-dimensional moving component; a lens (6) is provided inside the laser cutter (5); characterized in that, It also includes a protective box (101); a protective box (101) for protecting the lens (6) is installed on the three-dimensional moving component; a detection camera (102) is installed on the lower side of the protective box (101); a fan (109) is provided on the outside of the box (1); the air inlet of the fan (109) is connected to the first dust extraction pipe (110); a second valve (111) is installed on the first dust extraction pipe (110); several air holes are opened on the lower side of the protective box (101) around the laser cutter (5), and the air holes are connected to the first dust extraction pipe (110); a cooling component for cooling and protecting the lens (6) is installed on the laser cutter (5); the cooling component is connected to the protective box (101).

2. The intelligent semiconductor wafer processing equipment with lens protection function according to claim 1, characterized in that, An observation window (1001) is provided on the box (1).

3. The intelligent semiconductor wafer processing equipment with lens protection function according to claim 1, characterized in that, The cooling assembly includes a fixed frame (103), a mounting frame (104), an air inlet pipe (105), an air extraction pipe (106), and a first valve (107); a fixed frame (103) for fixing a lens (6) is movably connected to the protective box (101); a mounting frame (104) is connected to the laser cutter (5), and the lens (6) is installed inside the mounting frame (104); an air inlet pipe (105) for nitrogen gas to enter is connected to the mounting frame (104), and the air inlet pipe (105) is connected to a nitrogen gas storage tank; an air extraction pipe (106) is connected to the mounting frame (104), and the air extraction pipe (106) is connected to a central pipe (108); a first valve (107) is installed on the air extraction pipe (106).

4. The intelligent semiconductor wafer processing equipment with lens protection function according to claim 3, characterized in that, The mounting bracket (104) has two symmetrical airflow channels (10401) on the right side.

5. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 4, characterized in that, The mounting bracket (104) has a set of symmetrical side channels (10402) on both the front and rear sides, and air vents (10403) are opened at the side channels (10402).

6. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 1, characterized in that, An observation mirror (10101) is installed on the front side of the protective box (101).

7. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 3, characterized in that, The fixed frame (103) and the protective box (101) are horizontally slidably connected.

8. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 3, characterized in that, It also includes a cleaning pipe (201), a second dust extraction pipe (202) and a third valve (203); the cleaning pipe (201) is connected to the left side of the laser cutter (5); the second dust extraction pipe (202) is connected to the cleaning pipe (201); the second dust extraction pipe (202) is connected to the central pipe (108); the third valve (203) is installed on the second dust extraction pipe (202).

9. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 6, characterized in that, The observation mirror (10101) is configured to be openable.

10. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 1, characterized in that, It also includes a detector (301); the inside of the protective box (101) is equipped with a detector (301) for detecting leaked nitrogen.

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