Semiconductor wafer intelligent processing equipment with lens protection function

Abstract

The present application relates to the field of semiconductor processing, especially to a semiconductor wafer intelligent processing equipment with lens protection function. The problem to be solved is that the smoke and fine particles generated by laser cutting pollute the wafer, causing cutting misplacement, and the lens is also polluted and difficult to repair. The technical scheme is as follows: a semiconductor wafer intelligent processing equipment with lens protection function, comprising a box body; a placing rack for placing semiconductor wafers is arranged on the inner side of the box body; a three-dimensional moving assembly is installed on the box body; a laser cutter is connected to the three-dimensional moving assembly; a lens is arranged inside the laser cutter; the present application provides stable nitrogen gas flow on the side of the lens, realizes lens cooling, avoids the influence of airflow on the light beam passing through the lens, and effectively ensures the stability of laser cutting; the nitrogen gas flowing through the airflow channel can quickly take away the possible infiltrated smoke, thereby realizing the air curtain effect and avoiding the infiltration of smoke.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor processing, in particular to a semiconductor wafer intelligent processing equipment with lens protection function. BACKGROUND

[0002] As one of the most important components of modern technology, semiconductor wafers have an important position in various industries. In the production process, the whole semiconductor wafer needs to be laser cut according to the required size. During the cutting process, the placement position of the wafer has clear requirements to ensure that there is no displacement error, which leads to obvious cutting errors. At the same time, laser cutting will produce obvious smoke and fine particle impurities, which can also cause cutting errors of the wafer. Therefore, the position of the wafer needs to be detected at all times, and the smoke and fine particle impurities generated need to be treated synchronously.

[0003] Secondly, during the laser cutting process, the lens inside the laser cutter will also be polluted by smoke or fine particles, which will cause problems with the light beam. At the same time, the lens will have a significant temperature rise during use. The existing technology mainly uses water cooling to handle this problem. However, with the long-term use of the equipment, water leakage is likely to occur, which is difficult to detect and repair. SUMMARY

[0004] In order to overcome the problem of wafer cutting displacement caused by smoke and fine particle pollution generated by laser cutting, and the lens being polluted and difficult to repair, the present application provides a semiconductor wafer intelligent processing equipment with lens protection function.

[0005] The technical scheme is as follows: a semiconductor wafer intelligent processing equipment with lens protection function, comprising a box body; a placing rack for placing semiconductor wafers is arranged on the inner side of the box body; a three-dimensional moving assembly is installed on the box body; a laser cutter is connected to the three-dimensional moving assembly; a lens is arranged inside the laser cutter; a protection box is further included; the protection box is installed on the three-dimensional moving assembly for protecting the lens; a detection camera is installed on the lower side of the protection box; a fan is arranged on the outer side of the box body; a first dust extraction pipe is connected to the air inlet of the fan; a second valve is installed on the first dust extraction pipe; a plurality of air holes are formed around the laser cutter on the lower side of the protection box, and the air holes are in communication with the first dust extraction pipe; a cooling assembly for cooling and protecting the lens is installed on the laser cutter; and the cooling assembly is connected to the protection box.

[0006] As a preferred embodiment, an observation window is formed on the box body.

[0007] As preferred, the cooling assembly comprises a fixing frame, a mounting frame, an air inlet pipe, an air outlet pipe and a first valve; the fixing frame for fixing the lens is movably connected to the protective box; the mounting frame is connected to the laser cutter, and the lens is mounted on the inner side of the mounting frame; the air inlet pipe for nitrogen entering is communicated with the mounting frame, and the air inlet pipe is connected with a nitrogen storage tank; the air outlet pipe is connected to the mounting frame, and the air outlet pipe is communicated with the central pipe; the first valve is mounted on the air outlet pipe.

[0008] As preferred, the right side of the mounting frame is provided with two airflow channels which are symmetrical up and down.

[0009] As preferred, the front and rear sides of the mounting frame are both provided with a group of side channels which are symmetrical up and down, and air ports are synchronously provided at the side channels.

[0010] As preferred, the front side of the protective box is provided with an observation mirror.

[0011] As preferred, the fixing frame and the protective box are horizontally and slidably connected.

[0012] As preferred, the cleaning pipe, the second dust extraction pipe and the third valve are further included; the cleaning pipe is communicated with the left side of the laser cutter; the second dust extraction pipe is connected to the cleaning pipe; the second dust extraction pipe is communicated with the central pipe; and the third valve is mounted on the second dust extraction pipe.

[0013] As preferred, the observation mirror is provided as an openable structure.

[0014] As preferred, the detection instrument is further included; the detection instrument for detecting the leaked nitrogen is mounted on the inner side of the protective box.

[0015] The present application has the following advantages: the present application provides stable nitrogen airflow on the side of the lens, realizes lens cooling, avoids the influence of airflow on the light beam passing through the lens, and effectively ensures the stability of laser cutting.

[0016] The nitrogen flowing through the airflow channel can quickly take away the possible infiltrated smoke, thereby realizing the air curtain effect and avoiding the infiltration of smoke.

[0017] By keeping the inside of the mounting frame in a positive pressure state which is greater than the external air pressure, the outside moisture and dust and other impurities can be effectively prevented from entering the inside of the mounting frame along with the external air during shutdown, the storage environment of the lens is effectively ensured, the maintenance difficulty is reduced, and the protection effect is improved.

[0018] By blowing nitrogen from the air port to the upper and lower surfaces of the lens, the impurities are blown away and cleaned, and the blown-off impurities are discharged through the second dust extraction pipe, thereby realizing cleaning without disassembly, and the cleaning work can be synchronized with the above-mentioned short-term shutdown and the process of maintaining the lens, effectively integrating the steps and improving the efficiency.

[0019] By making the lens always in the internal environment of the protection box, direct contact with the external environment is avoided, then artificial observation is carried out through the observation mirror, tedious steps such as disassembly are avoided, maintenance difficulty is reduced, and the safety factor is improved.

[0020] Leakage detection is carried out through the detector, the maintenance accuracy is improved, and the timely detection of leakage also plays an obvious role. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a closed view of the box of the present application;

[0022] Figure 2 It is an open view of the box of the present application;

[0023] Figure 3 It is a combined perspective structural schematic view of the protection box and the detection camera of the present application;

[0024] Figure 4 It is a front view of the present application;

[0025] Figure 5 It is a combined perspective structural schematic view of the fixing frame and the mounting frame of the present application;

[0026] Figure 6 It is a combined perspective structural schematic view of the cleaning pipe and the second dust extraction pipe of the present application;

[0027] Figure 7 It is a perspective structural schematic view of the mounting frame of the present application;

[0028] Figure 8 It is a combined perspective structural schematic view of the air extraction pipe and the first valve of the present application;

[0029] Figure 9 It is a lens extraction view of the present application.

[0030] The reference signs are as follows: 1-box, 1001-observation window, 2-placing frame, 3-electric lifter, 4-two-dimensional electric mover, 5-laser cutter, 6-lens, 101-protection box, 10101-observation mirror, 102-detection camera, 103-fixing frame, 104-mounting frame, 10401-air flow channel, 10402-side channel, 10403-air port, 105-air inlet pipe, 106-air extraction pipe, 107-first valve, 108-concentration pipe, 109-fan, 110-first dust extraction pipe, 111-second valve, 201-cleaning pipe, 202-second dust extraction pipe, 203-third valve, 301-detector. DETAILED DESCRIPTION

[0031] The present application is further described below in combination with the drawings and specific embodiments.

[0032] Embodiment 1

[0033] A semiconductor wafer intelligent processing equipment with lens protection function, as shown in the figure, comprises a box body 1, a placing rack 2, a three-dimensional moving assembly, a laser cutter 5 and a lens 6; the inside of the box body 1 is provided with the placing rack 2; the box body 1 is installed with the three-dimensional moving assembly; the three-dimensional moving assembly is connected with the laser cutter 5; the laser cutter 5 is internally provided with the lens 6; Figures 1-9

[0034] It also comprises a protection box 101, a detection camera 102, a central pipe 108, a fan 109, a first dust extraction pipe 110, a second valve 111 and a cooling assembly; the three-dimensional moving assembly is installed with the protection box 101; the lower side of the protection box 101 is installed with two detection cameras 102; the outside of the box body 1 is provided with the fan 109; the air inlet of the fan 109 is connected with the first dust extraction pipe 110; the first dust extraction pipe 110 is installed with the second valve 111; a plurality of air holes are opened around the laser cutter 5 on the lower side of the protection box 101, and the air holes are communicated with the first dust extraction pipe 110; the laser cutter 5 is installed with the cooling assembly; the cooling assembly is connected with the protection box 101.

[0035] The box body 1 is provided with an observation window 1001, which is convenient for artificial observation of the cutting state of the semiconductor wafer.

[0036] The cooling assembly comprises a fixing frame 103, a mounting frame 104, an air inlet pipe 105, an air extraction pipe 106 and a first valve 107; the fixing frame 103 is movably connected to the protection box 101; the mounting frame 104 is connected to the laser cutter 5, and the lens 6 is installed on the inside of the mounting frame 104; the air inlet pipe 105 is communicated on the mounting frame 104, and the air inlet pipe 105 is connected with a nitrogen storage tank; the air extraction pipe 106 is connected to the mounting frame 104, and the air extraction pipe 106 is communicated with the central pipe 108; the first valve 107 is installed on the air extraction pipe 106.

[0037] The mounting frame 104 is provided with two air flow channels 10401 which are symmetrically arranged upward and downward.

[0038] The mounting frame 104 is provided with a group of side channels 10402 which are symmetrically arranged upward and downward on the front and rear sides of the mounting frame 104, and air ports 10403 are synchronously opened at the side channels 10402.

[0039] The protection box 101 is provided with a viewing mirror 10101 on the front side.

[0040] The fixing frame 103 is horizontally slidably connected with the protection box 101, so as to ensure that the fixing frame 103 is in a horizontal state when it is pulled out.

[0041] ​In the process of laser cutting, the whole circular semiconductor wafer is first fixed on the placing rack 2 by manual operation. After the fixing is completed, the program sets the movement path of the laser cutter 5, and then the wafer of the required cutting size is cut correspondingly. At the same time, the electric lifter 3 and the two-dimensional electric mover 4 are controlled synchronously by the program to realize the three-dimensional space movement control of the laser cutter 5, so as to ensure the orderly progress of the laser cutting work. After the control is completed, the position of the semiconductor wafer is determined by the detection camera 102 at the same time. In the cutting process, real-time observation is carried out to avoid obvious deviation that cannot be adjusted in time. After the above preparation is completed, the box 1 is closed, the laser cutter 5 is started synchronously, and the cutting of the semiconductor wafer is started. The first valve 107 and the second valve 111 are opened synchronously, and the fan 109 starts working synchronously. The high-temperature toxic smoke and fine particles generated in the cutting process are sucked away through the first dust extraction pipe 110, so as to avoid remaining on the surface of the semiconductor wafer or diffusing to other positions of the box 1 to cause pollution. At the same time, the protective box 101 is installed outside the laser cutter 5. Compared with the prior art, the lens 6 is directly installed inside the laser cutter 5, that is, the fixing frame 103 and the installation position of the laser cutter 5 are sealed by bolts. The smoke enters, which causes the fine particles to be adsorbed on the surface of the lens 6, resulting in problems of the laser cutter 5. Therefore, after the protective box 101 is installed, the problem is effectively avoided. At the same time, the lens 6 is prevented from being overheated due to the diffusion of high-temperature smoke, so that the cutting rate and continuity are reduced.

[0042] Further, in the cutting process, in order to further ensure that the temperature of the lens 6 is within the normal range, when the first valve 107 is opened and the fan 109 starts working, the nitrogen tank is connected to the air inlet pipe 105. The nitrogen enters the airflow channel 10401 through the air inlet pipe 105, and then enters the side channel 10402 from the airflow channel 10401. Finally, it is discharged from the air exhaust pipe 106 and enters the collecting pipe 108. In the process, by providing stable nitrogen flow on the side of the lens 6, the lens 6 is cooled while avoiding the influence of airflow on the light beam passing through the lens 6, effectively ensuring the stability of laser cutting. At the same time, the upper side and the lower side of the installation frame 104 and the installation contact position of the laser cutter 5 are the main positions of smoke penetration. Because when the airflow channel 10401 starts to ventilate, corresponding air slots are opened at the installation contact position of the installation frame 104 and the laser cutter 5. Even if smoke penetrates through this position during use, it can still be quickly carried away by the nitrogen flowing through the airflow channel 10401, thereby realizing the air curtain effect and avoiding smoke penetration.

[0043] Further, after the laser cutting device 5 is stopped for a short period of time, the lens 6 needs to be protected so as to be normally used next time. In the prior art, the lens 6 is not handled because it needs to be physically sealed and kept in a clean, low-humidity and constant-temperature environment, and thus the maintenance is difficult. In the present application, when the lens 6 needs to be maintained, the nitrogen tank is opened to supply nitrogen to the air inlet pipe 105, so that the nitrogen gradually fills the inside of the mounting frame 104, and then the first valve 107 and the second valve 111 are closed, and at the same time, the nitrogen continues to fill the inside of the mounting frame 104, and the inside of the mounting frame 104 is kept in a positive pressure state greater than the outside air pressure, and then the nitrogen supply is stopped. At this time, the lens 6 is in a nitrogen-filled positive pressure environment, and the positive pressure can effectively prevent the outside air from entering the inside of the mounting frame 104 during the shutdown process, effectively ensuring the storage environment of the lens 6, reducing the maintenance difficulty and improving the protection effect.

[0044] Embodiment 2

[0045] Based on the embodiment 1, as shown in Figure 4 and Figure 6 , the cleaning pipe 201, the second dust extraction pipe 202 and the third valve 203 are further included; the cleaning pipe 201 is in communication with the left side of the laser cutting device 5; the second dust extraction pipe 202 is connected to the cleaning pipe 201; the second dust extraction pipe 202 is in communication with the collecting pipe 108; and the third valve 203 is installed on the second dust extraction pipe 202.

[0046] The observation mirror 10101 is arranged in an openable structure, so as to facilitate the disassembly and replacement of the lens 6.

[0047] After the use of the lens 6 is completed, in the prior art, the lens 6 needs to be manually disassembled and cleaned, and then the lens 6 is exposed to the outside air after being disassembled, which always has a risk of being contaminated, and the lens 6 needs to be kept in a horizontal state during the disassembly process, i.e. the lens 6 is vertically and stably extracted, which is difficult for the operator to operate and causes the lens 6 to be deviated, and then the lens 6 needs to be calibrated and positioned, which consumes time. Therefore, when the lens 6 needs to be cleaned, the first valve 107 is closed and the third valve 203 is opened, and nitrogen is simultaneously supplied, and the fan 109 starts to work, so that the nitrogen is blown to the upper and lower surfaces of the lens 6 from the air port 10403, the impurities are blown and cleaned, the impurities are discharged through the second dust extraction pipe 202, the cleaning work is realized without disassembly, and the cleaning work can be simultaneously performed with the above-mentioned short-term shutdown and the maintenance of the lens 6, the steps are effectively integrated, and the efficiency is improved.

[0048] Further, after cleaning is completed, the cleanliness of the lens 6 also needs to be checked irregularly. The lens 6 can be slowly and stably horizontally extracted by disassembling the fixing frame 103, so that the lens 6 is always in the internal environment of the protection box 101, avoiding direct contact with the external environment, and then the lens 6 can be observed by the observation mirror 10101, avoiding the cumbersome steps of disassembly and reducing the maintenance difficulty and improving the safety factor.

[0049] Embodiment 3

[0050] On the basis of embodiment 2, as shown in Figure 5 The detection instrument 301 is further included, and the detection instrument 301 is installed on the inner side of the protection box 101.

[0051] When the laser cutting device 5 stops being used, the airtightness of the installation position of the laser cutting device 5 and the lens 6 needs to be checked. In the prior art, the laser cutting device 5 and the lens 6 need to be disassembled, and then manual checking is performed by artificial, which is time-consuming and laborious, and the checking accuracy is poor, and the effect is general. Artificial cannot effectively check, therefore, when the lens 6 stops being used, and the installation frame 104 is filled with nitrogen, if there is a gas leakage problem in the installation position of the installation frame 104 and the laser cutting device 5, the nitrogen can be detected by the detection instrument 301. At the same time, other parts located in the protection box 101 can also be detected by this method, and the leakage detection can also be performed in the daily maintenance and repair process, which has the effect of killing two birds with one stone, not only improving the checking accuracy, but also playing an obvious role in the timely detection of leakage.

[0052] The above embodiments are only for illustrating the technical concept and characteristics of the present application, the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application shall be covered within the protection scope of the present application.

Claims

1. A semiconductor wafer intelligent processing equipment with lens protection function, comprising a box body (1); a placing rack (2) for placing semiconductor wafers is arranged on the inner side of the box body (1); a three-dimensional moving assembly is installed on the box body (1); a laser cutter (5) is connected to the three-dimensional moving assembly; a lens (6) is arranged in the laser cutter (5); characterized in that, It also includes a protective box (101); a protective box (101) for protecting the lens (6) is installed on the three-dimensional moving component; a detection camera (102) is installed on the lower side of the protective box (101); a fan (109) is provided on the outside of the box (1); the air inlet of the fan (109) is connected to the first dust extraction pipe (110); a second valve (111) is installed on the first dust extraction pipe (110); several air holes are opened on the lower side of the protective box (101) around the laser cutter (5), and the air holes are connected to the first dust extraction pipe (110); a cooling component for cooling and protecting the lens (6) is installed on the laser cutter (5); the cooling component is connected to the protective box (101); The cooling assembly includes a fixed frame (103), a mounting frame (104), an air inlet pipe (105), an air extraction pipe (106), and a first valve (107); a fixed frame (103) for fixing a lens (6) is movably connected to the protective box (101); a mounting frame (104) is connected to the laser cutter (5), and the lens (6) is installed inside the mounting frame (104); an air inlet pipe (105) for nitrogen gas to enter is connected to the mounting frame (104), and the air inlet pipe (105) is connected to a nitrogen gas storage tank; an air extraction pipe (106) is connected to the mounting frame (104), and the air extraction pipe (106) is connected to a central pipe (108); a first valve (107) is installed on the air extraction pipe (106); It also includes a cleaning pipe (201), a second dust extraction pipe (202) and a third valve (203); the cleaning pipe (201) is connected to the left side of the laser cutter (5); the second dust extraction pipe (202) is connected to the cleaning pipe (201); the second dust extraction pipe (202) is connected to the central pipe (108); the third valve (203) is installed on the second dust extraction pipe (202).

2. The semiconductor wafer intelligent processing equipment with lens protection function according to claim 1, characterized in that, An observation window (1001) is provided on the box (1).

3. The intelligent semiconductor wafer processing equipment with lens protection function according to claim 1, characterized in that, The mounting bracket (104) has two symmetrical airflow channels (10401) on the right side.

4. The intelligent semiconductor wafer processing equipment with lens protection function according to claim 3, characterized in that, The mounting bracket (104) has a set of symmetrical side channels (10402) on both the front and rear sides, and air vents (10403) are opened at the side channels (10402).

5. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 1, characterized in that, An observation mirror (10101) is installed on the front side of the protective box (101).

6. The intelligent semiconductor wafer processing equipment with lens protection function according to claim 1, characterized in that, The fixed frame (103) and the protective box (101) are horizontally slidably connected.

7. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 5, characterized in that, The observation mirror (10101) is configured to be openable.

8. A semiconductor wafer intelligent processing equipment with lens protection function according to claim 1, characterized in that, It also includes a detector (301); the inside of the protective box (101) is equipped with a detector (301) for detecting leaked nitrogen.

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