Machining device, machining method based on machining device and controller

Abstract

The invention provides a machining device, a machining method based on the machining device and a controller, and relates to the technical field of part manufacturing. The processing device comprises a focusing element and a water coupler. And the focusing element is used for focusing the laser and enabling the focused laser to enter the coupling cavity of the water coupler. The water coupler comprises a first injection port used for being connected with water supply equipment; the second injection port is used for being connected with abrasive particle supply equipment; the first valve is used for opening the second injection port in the first processing mode; the coupling cavity is connected with the first injection port and the second injection port and used for coupling water, abrasive particles and laser to obtain first jet flow in the first machining mode; and the nozzle is connected with the coupling cavity and used for spraying out the first jet flow so as to machine the workpiece. By means of the structural design, the machining device is simple in structure and capable of supporting a new machining mode.

Description

Technical Field

[0001] This disclosure relates to the field of parts manufacturing technology, and in particular to a processing apparatus, a processing method based on the processing apparatus, and a controller. Background Technology

[0002] Water-guided laser processing devices and water-based abrasive processing devices are two commonly used parts processing devices. Water-guided laser processing devices utilize the phenomenon of total internal reflection of laser light at the water-air interface, confining the laser beam within a micro-jet of water, which is then used to process the workpiece surface. Water-based abrasive processing devices incorporate nano- or micro-scale abrasive particles (such as diamond or silicon carbide particles) into a micro-jet of water, which is then used to process the workpiece surface.

[0003] Both of the aforementioned processing devices and corresponding processing methods have mature applications. In actual processing scenarios, it is often necessary to use these two processing devices in combination. Summary of the Invention

[0004] This disclosure provides a processing apparatus, a processing method based on the processing apparatus, and a controller.

[0005] According to a first aspect of this disclosure, a processing apparatus is provided, comprising a focusing element and a water coupler. The focusing element is used to focus a laser beam and incident the focused laser beam into a coupling cavity of the water coupler. The water coupler comprises: a first injection port for connecting to a water supply device; a second injection port for connecting to an abrasive feed device; a first valve for opening the second injection port in a first processing mode; the coupling cavity, connected to the first injection port and the second injection port, for coupling the water provided by the water supply device, the abrasive feed device provided by the abrasive feed device, and the focused laser beam to obtain a first jet in the first processing mode; and a nozzle, connected to the coupling cavity, for ejecting the first jet to process a workpiece.

[0006] In some embodiments, the water coupler further includes a discharge port connected to the coupling cavity for discharging abrasive particles.

[0007] In some embodiments, the outlet is disposed at the bottom of the coupling cavity; and / or, on a circumference with the center of the coupling cavity as the center, the central angle corresponding to the line connecting the location of the outlet and the location of the second injection port is greater than or equal to 170° and less than or equal to 180°.

[0008] In some embodiments, the bottom surface region of the coupling cavity near the outlet is inclined downward to guide abrasive particles out of the outlet.

[0009] In some embodiments, the water coupler further includes a second valve for closing the outlet in the first processing mode.

[0010] In some embodiments, the first valve is further configured to close the second injection port in the second processing mode; the second valve is further configured to close the discharge port in the second processing mode; the coupling cavity is further configured to couple the water supplied by the water supply device with the focused laser in the second processing mode to obtain a second jet; the nozzle is further configured to eject the second jet to process the workpiece.

[0011] In some embodiments, the first valve is further configured to close the second injection port in the abrasive discharge mode; the second valve is further configured to open the discharge port in the abrasive discharge mode.

[0012] In some embodiments, the processing apparatus further includes a laser for emitting laser light in the first processing mode or the second processing mode, and for not emitting the laser light in the abrasive discharge mode.

[0013] According to a second aspect of this disclosure, a processing method is provided, applied to the processing apparatus as described above, comprising: in response to a first processing mode being triggered, a controller setting a first valve to an open state to process a workpiece using a first jet coupled by the water coupler.

[0014] In some embodiments, the processing method further includes: in response to the triggering of a second processing mode, the controller sets the first valve to a closed state to process the workpiece using the second jet coupled by the water coupler.

[0015] In some embodiments, where the processing apparatus further includes a discharge port and a second valve, the processing method further includes: in response to the triggering of a first processing mode or a second processing mode, the controller also sets the second valve to a closed state; in response to the triggering of an abrasive discharge mode, the controller sets the first valve to a closed state and the second valve to an open state to discharge abrasive particles using the discharge port.

[0016] In some embodiments, where the processing apparatus further includes the laser, the processing method further includes: the controller activating the laser in response to the triggering of a first processing mode or a second processing mode; and the controller deactivating the laser in response to the triggering of the abrasive discharge mode.

[0017] In some embodiments, the processing method further includes: in response to the triggering of a third processing mode, the controller shuts off the laser, opens the first valve, and closes the second valve to process the workpiece using a third jet obtained by coupling water and abrasive particles within the water coupler.

[0018] According to a third aspect of this disclosure, a controller is provided, comprising: a memory; and a processor coupled to the memory, the processor being configured to perform the processing method as described above based on instructions stored in the memory.

[0019] According to a fourth aspect of this disclosure, a computer-readable storage medium is provided that stores computer program instructions thereon, which, when executed by a processor, implement the processing method as described above.

[0020] According to the fifth aspect of this disclosure, a computer program product is provided, on which computer program instructions are stored, which, when executed by a processor, implement the processing method as described above.

[0021] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0022] The accompanying drawings, which form part of this specification, illustrate embodiments of this disclosure and, together with the specification, serve to explain the principles of this disclosure.

[0023] Figure 1 This is a schematic diagram of the structure of a processing apparatus according to some embodiments of the present disclosure;

[0024] Figure 2 This is a schematic diagram of the structure of a processing apparatus according to other embodiments of the present disclosure;

[0025] Figure 3 This is a schematic flowchart of a processing method according to some embodiments of the present disclosure;

[0026] Figure 4 This is a schematic flowchart of a processing method according to other embodiments of this disclosure;

[0027] Figure 5 This is a schematic diagram of the state of the processing apparatus under a first processing mode according to some embodiments of the present disclosure;

[0028] Figure 6 This is a schematic diagram of the state of the processing apparatus under a second processing mode according to some embodiments of the present disclosure;

[0029] Figure 7 This is a schematic diagram of the state of the processing apparatus under a third processing mode according to some embodiments of the present disclosure;

[0030] Figure 8 This is a schematic diagram of the state of the processing apparatus under abrasive discharge mode according to some embodiments of the present disclosure;

[0031] Figure 9 This is a schematic diagram of the structure of a controller according to some embodiments of the present disclosure;

[0032] Figure 10 This is a schematic diagram of the structure of a controller according to other embodiments of the present disclosure.

[0033] This disclosure can be more clearly understood with reference to the accompanying drawings and the following detailed description. Detailed Implementation

[0034] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0035] At the same time, it should be understood that, for ease of description, the dimensions of the various parts shown in the accompanying drawings are not drawn according to actual scale.

[0036] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this disclosure or its application or use.

[0037] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0038] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0039] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0040] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0041] In related technologies, it is often necessary to use two devices, a water-guided laser device and a water-abrasive processing device, to process a workpiece. During this process, the two devices need to be controlled alternately, resulting in cumbersome process flows, long turnaround times, and high costs. Furthermore, when using these two devices to alternately process the same position on the workpiece, the low repeatability accuracy makes it difficult to guarantee the processing quality.

[0042] In view of this, the present disclosure proposes a processing apparatus, a processing method based on the processing apparatus, and a controller, which can improve the processing efficiency and quality of workpieces and reduce the process cost of workpiece processing.

[0043] Figure 1 This is a schematic diagram of the structure of a processing apparatus according to some embodiments of the present disclosure. For example... Figure 1 The processing device includes a focusing element 11 and a water coupler 12.

[0044] The focusing element 11 is used to focus the laser generated by the laser 15 and direct the focused laser into the coupling cavity of the water coupler. The laser can be green light with a wavelength of 532 nm, or light of other wavelengths. The focusing element 11 can be a focusing lens (such as a convex lens), or other elements with focusing functions.

[0045] The water coupler 12 includes a first inlet 121, a second inlet 122, a first valve 123, a coupling cavity 124, and a nozzle 125.

[0046] The first injection port 121 is used to connect to the water supply device 13; the second injection port 122 is used to connect to the abrasive feed device 14. In specific implementations, the first injection port can be directly connected to the water supply device or connected via a pipeline; the second injection port can be directly connected to the abrasive feed device or connected via a pipeline. The water supply device 13 is, for example, a high-pressure water supply system, and the pressure of the water output by this system is within a set range. For example, the water pressure range is 4~35 MPa. The abrasive feed device 14 is used to provide abrasive particles. For example, the abrasive particles it provides can be one or more combinations of diamond, aluminum oxide (Al2O3), silicon carbide (SiC), cerium dioxide (CeO2), or garnet. Alternatively, the abrasive particles provided by the abrasive feed device 14 can also be in slurry form, such as an abrasive slurry formed by mixing solid abrasive particles like diamond with water.

[0047] There are several ways to configure the first injection port 121 and the second injection port 122 on the water coupler. For example, ... Figure 1As shown, the first injection port and the second injection port can be located at different positions at the same height in the coupling cavity, and their opening directions are perpendicular to each other. Alternatively, the first injection port and the second injection port can also be arranged vertically and parallelly at different heights in the coupling cavity.

[0048] The first valve 123 is used to open the second injection port 122 in the first processing mode, or to connect the abrasive supply pipe where the second injection port is located, so that the abrasive particles can enter the coupling chamber of the water coupler. By setting the first valve 123 corresponding to the second injection port, it is convenient to control the entry of abrasive particles into the water coupler or to control the abrasive particles from entering the water coupler.

[0049] The coupling cavity 124 is connected to the first injection port 121 and the second injection port 122, and is used to couple the water provided by the water supply device 13, the abrasive particles provided by the abrasive particle supply device 14, and the focused laser to obtain a first jet in the first processing mode.

[0050] Nozzle 125, connected to the coupling cavity, is used to eject a first jet to process the workpiece. Nozzle 125 can be a ruby ​​nozzle, a diamond nozzle, or other nozzle. In some examples, nozzle 125 has a smooth vertical orifice with a diameter of 40 to 200 micrometers at its center, from which the first jet is ejected. Furthermore, in some examples, the water coupler also includes a window mirror 126.

[0051] In this embodiment, the structural design of the above-mentioned processing device enables a new jet processing mode that combines laser energy, water, and abrasive particles. This new mode allows for simultaneous cutting of the workpiece using laser energy within the water jet and grinding of the workpiece using abrasive particles, improving the surface finish of the cut and thus enhancing processing quality. Simultaneously, the abrasive particles' grinding effect on the material also improves processing efficiency to some extent. Furthermore, in this embodiment, since the laser, abrasive particles, and water share a single coupling cavity and a single nozzle, the same position on the workpiece can be processed based on different processing modes. Therefore, compared to alternating processing of the workpiece using a water-guided laser device and a water-abrasive particle processing device, the processing device of this disclosure improves workpiece processing quality, simplifies the workpiece processing flow, increases workpiece processing efficiency, and reduces workpiece processing costs.

[0052] In addition to the first processing mode, the processing device can also realize a second processing mode. In the second processing mode, the first valve 123 is used to close the second injection port so that the abrasive particles cannot enter the water coupler; the coupling cavity 124 is used to couple the water supplied by the water supply device 13 with the focused laser to obtain a second jet in the second processing mode; the nozzle 125 is also used to eject the second jet to process the workpiece.

[0053] In some embodiments, the processing apparatus may further include a water supply device, an abrasive feed device, and a laser 15. The laser 15 is used to emit laser light in a first processing mode or a second processing mode. In these embodiments, the processing apparatus can implement a third processing mode in addition to the first and second processing modes. In the third processing mode, the laser 15 does not emit laser light; the first valve 123 opens the second injection port in the third processing mode to allow abrasive particles to enter the water coupler; the coupling cavity 124 couples the water supplied by the water supply device with the abrasive particles supplied by the abrasive feed device in the third processing mode to obtain a third jet; the nozzle 125 ejects the third jet to process the workpiece.

[0054] In this embodiment of the disclosure, a single processing device can realize multiple jet processing modes, which improves the flexibility of workpiece processing, simplifies the process of processing workpieces by alternating multiple jet processing modes, reduces workpiece processing costs, and improves workpiece processing efficiency.

[0055] Figure 2 This is a schematic diagram of a processing apparatus according to other embodiments of the present disclosure. The processing apparatus of the embodiments of the present disclosure is... Figure 1 This is a further improvement upon the processing apparatus shown. The following mainly focuses on... Figure 2 and Figure 1 The differences will be explained.

[0056] like Figure 2 As shown, the water coupler 12 also includes a discharge port 127. The discharge port 127 is connected to the coupling cavity and is used to discharge abrasive particles. In this embodiment of the present disclosure, by further providing a discharge port on the water coupler, it is helpful to better discharge abrasive particles from the water coupler, and to facilitate switching between multiple jet processing modes when processing a workpiece using a processing device.

[0057] In this embodiment, the inventors have further designed the discharge port 127. In some examples, the discharge port 127 satisfies at least one of the following: the discharge port is located at the bottom of the coupling cavity; and the central angle corresponding to the line connecting the location of the discharge port and the location of the second injection port on a circle centered at the center of the coupling cavity is greater than or equal to 170° and less than or equal to 180°. For example, the discharge port is located at the lowest point of the coupling cavity, so that the central angle corresponding to the line connecting the location of the discharge port and the location of the second injection port is 180°. Through the above design of the discharge port, the abrasive particles in the coupling cavity can be discharged more effectively, thereby eliminating the need for manual discharge of abrasive particles when switching between different processing modes, and improving the efficiency of switching between processing modes.

[0058] In the embodiments disclosed herein, the inventors have further designed the coupling cavity. In some examples, the coupling cavity satisfies the following condition: the bottom surface region of the coupling cavity near the outlet is inclined downwards to guide the abrasive grains out of the outlet.

[0059] In practical implementation, the bottom surface region near the outlet of the coupling cavity can be a plane with a fixed downward tilt angle. Alternatively, the bottom surface region near the outlet of the coupling cavity can be divided into upper and lower parts, with different downward tilt angles for these two parts. For example, the downward tilt angle of the upper part can be greater than that of the lower part. For instance, the downward tilt angle of the upper part can be 20°~45°, and the downward tilt angle of the lower part can be 5°~20°.

[0060] In the embodiments of this disclosure, the above-described design of the coupling cavity enables better removal of abrasive particles from the coupling cavity, thereby eliminating the need for manual abrasive particle removal when switching between multiple jet processing modes and improving switching efficiency.

[0061] based on Figure 2 The structure shown enables three processing modes: the first, the second, and the third. In all three modes, the generated jet passes through the nozzle and is discharged from the jet outlet 129. Figure 1 The difference lies in that, in the three modes described above, in addition to setting the states of the laser and the first valve, the state of the second valve is also set. For example, in the three processing modes described above, the second valve is set to the closed state to close the outlet. In some examples, the processing apparatus also includes at least one of an abrasive content adjustment element and a water content adjustment element. For example, an abrasive content adjustment element is installed on the abrasive supply pipeline between the abrasive supply device and the second injection port, and a water content adjustment element is installed on the water pipeline between the water supply device and the first injection port, so as to adjust the content ratio of abrasive particles in the coupling cavity, thereby meeting different processing purposes and further improving the processing quality of the workpiece.

[0062] Furthermore, based on Figure 2 The structure shown can also achieve abrasive particle discharge mode. In abrasive particle discharge mode, the laser does not emit laser light, the second injection port is closed by the first valve, and the discharge port is opened by the second valve to discharge the abrasive particles in the coupling cavity.

[0063] In this embodiment, a simple processing apparatus capable of supporting multiple processing modes is realized. In this apparatus, by sharing a cavity for abrasive particles, water, and laser, and by having the resulting composite jet share a single nozzle, a new jet processing mode combining laser energy, water, and abrasive particles can be achieved, improving workpiece processing quality and efficiency. Furthermore, when multiple processing modes are used individually or in combination, the same location can be repeatedly processed, improving workpiece processing quality, simplifying the processing flow, and increasing processing efficiency.

[0064] Figure 3 This is a schematic flowchart illustrating a processing method according to some embodiments of this disclosure. Figure 3 As shown, based on Figure 1 The processing apparatus shown includes steps 31 and 32 in its processing method.

[0065] In step 31, in response to the first processing mode being triggered, the controller sets the first valve to the open state so as to process the workpiece using the first jet obtained by the water coupler.

[0066] In practice, the first processing mode can be triggered in various ways. For example, after the user selects the first processing mode from the various processing modes displayed on the interactive interface, step S31 is executed. For example, after detecting that the current working condition meets the preset conditions, the controller automatically executes step S31. Yet another example is that the controller executes step S31 according to a pre-set processing flow.

[0067] In the first processing mode, the laser emitted by the laser is focused into the coupling cavity of the water coupler by a focusing element. Water is injected into the coupling cavity of the water coupler through the first injection port. With the first valve open, abrasive particles can also be injected into the coupling cavity of the water coupler through the second injection port. The water, abrasive particles, and laser energy combine to form a first jet, which is ejected from the nozzle to process the workpiece positioned below the nozzle. This allows for simultaneous water-guided laser cutting of the workpiece and simultaneous polishing of the workpiece's surface, thereby improving processing quality and efficiency. In practice, the abrasive particle content in the jet can be controlled according to the workpiece information, thereby reducing the absorption and reflection of laser energy by the abrasive particles while ensuring a certain amount of polishing, further improving the processing effect.

[0068] In step 32, in response to the second processing mode being triggered, the controller sets the first valve to the closed state so as to process the workpiece using the second jet obtained by the water coupler.

[0069] In the second processing mode, the laser emitted by the laser is focused into the coupling cavity of the water coupler by a focusing element. Water is injected into the coupling cavity of the water coupler through the first inlet. Because the first valve is closed, the abrasive supply channel is cut off, preventing the abrasive particles from entering the coupling cavity. Inside the coupling cavity, the water and laser energy combine to form a second jet, which is ejected from the nozzle, thereby processing the workpiece positioned below the nozzle. In this way, a water-guided laser cutting mode can be realized based on the above processing device.

[0070] In some embodiments, the processing method further includes step 33, in response to the triggering of the third processing mode, the controller shuts off the laser and opens the first valve to process the workpiece using a third jet formed by the coupling of water and abrasive particles within the coupling cavity. In this way, a water-abrasive polishing mode can be implemented based on the above-described processing apparatus.

[0071] The processing steps corresponding to the first, second, and third processing modes can be performed individually or in combination. For example, when processing film venting holes in hot-end components of an aero-engine, the second processing mode can be used first to process the holes, followed by the third processing mode to perform secondary polishing of the hole walls in situ or polishing of the "sharp edge" areas at the inlet and outlet, thereby completing the processing of the film venting holes. Alternatively, the first processing mode can be used directly to process the film venting holes. By using the above methods to process film venting holes, the problem of microscopic exposure after processing materials such as carboxymethyl cellulose (CMC) and resin-based composite materials can be eliminated to a certain extent, improving the processing quality.

[0072] In this embodiment of the disclosure, step 31 achieves a new jet processing mode that combines laser energy, water, and abrasive particles, which can improve the processing quality and efficiency of the workpiece. Furthermore, by coordinating the execution of steps 31, 32, and other corresponding steps of the processing mode, not only can the repeatability accuracy of the position to be processed be improved during the processing, thus improving the processing quality of the workpiece, but the processing flow can also be simplified, processing efficiency improved, and processing costs of the workpiece reduced.

[0073] Figure 4 This is a schematic flowchart illustrating a processing method according to other embodiments of this disclosure. For example... Figure 4 As shown, based on Figure 2 The processing apparatus shown includes steps 41 to 44 in its processing method.

[0074] In step 41, in response to the first processing mode being triggered, the controller starts the laser, sets the first valve to the open state, and sets the second valve to the closed state, so as to process the workpiece using the first jet obtained by the water coupler.

[0075] In the first processing mode, the state of the processing device is as follows: Figure 5As shown, the laser is in the start-up state, the first valve is in the open state, and the second valve is in the closed state. After the first processing mode is triggered, by controlling the laser, the first valve, and the second valve according to step 41, a jet of laser energy, water, and abrasive particles can be realized, and the workpiece can be processed based on this jet.

[0076] In step 42, in response to the second processing mode being triggered, the controller starts the laser, sets the first valve to the closed state, and sets the second valve to the closed state, so as to process the workpiece using the second jet obtained by the water coupler.

[0077] In the second processing mode, the state of the processing device is as follows: Figure 6 As shown, the laser is in the activated state, the first valve is closed, and the second valve is closed. After the second processing mode is triggered, by controlling the laser, the first valve, and the second valve according to step 42, a jet of laser energy combined with water can be realized, and the workpiece can then be processed based on this jet.

[0078] In step 43, in response to the third processing mode being triggered, the controller shuts off the laser, sets the first valve to the open state, and sets the second valve to the closed state, so as to process the workpiece using the third jet obtained by the water coupler.

[0079] In the third processing mode, the state of the processing device is as follows: Figure 7 As shown, the laser is in the off state, the first valve is in the open state, and the second valve is in the closed state. After the third processing mode is triggered, by controlling the laser, the first valve, and the second valve according to step 43, a jet of water and abrasive particles can be realized, and then the workpiece can be processed based on this jet.

[0080] In practice, steps 41 to 43 can be executed individually or in combination. For example, steps 42 and 43 can be executed together, or steps 41 and 43 can be executed together.

[0081] In step 44, in response to the abrasive discharge mode being triggered, the controller shuts off the laser, sets the first valve to the closed state and the second valve to the open state, so as to discharge the abrasive through the discharge port.

[0082] In abrasive discharge mode, the state of the processing device is as follows: Figure 8 As shown, the laser is in the off state, the first valve is in the closed state, and the second valve is in the open state. After the abrasive particle discharge mode is triggered, the laser, the first valve, and the second valve are controlled according to step 44 to facilitate the subsequent discharge of abrasive particles from the water coupler using water.

[0083] In practice, step 44 can be performed in various situations. For example, after completing the workpiece machining task through step 41 or step 43, the abrasive particles in the water coupler can be emptied through step 44. For example, if the workpiece needs to be machined alternately through steps 41 and 42, the abrasive particles in the water coupler can be emptied through step 44 after performing step 41, and then step 42 can be performed.

[0084] In this embodiment of the disclosure, the above method enables multiple processing modes to be implemented based on a single processing device. Compared with related technologies, this not only improves the quality of workpiece processing but also simplifies the workpiece processing control process and increases workpiece processing efficiency.

[0085] Figure 9 This is a schematic diagram of the controller according to some embodiments of this disclosure. For example... Figure 9 As shown, the controller 90 includes a memory 91 and a processor 92 coupled to the memory 91. The memory 91 is used to store instructions for executing embodiments of the processing methods. The processor 92 is configured to execute the processing methods in any of the embodiments of this disclosure based on the instructions stored in the memory 91.

[0086] Figure 10 This is a schematic diagram of the structure of a controller 100 according to some embodiments of the present disclosure. For example... Figure 10 As shown, the controller 100 can be represented in the form of a general computing device. The controller 100 includes a memory 101, a processor 102, and a bus 103 connecting different system components.

[0087] The memory 101 may include, for example, system memory, non-volatile storage media, etc. The system memory may store, for example, an operating system, application programs, a boot loader, and other programs. The system memory may include volatile storage media, such as random access memory (RAM) and / or cache memory. The non-volatile storage media may store, for example, instructions for executing at least one embodiment of the processing method. Non-volatile storage media include, but are not limited to, disk storage, optical storage, flash memory, etc.

[0088] The processor 102 can be implemented using a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete hardware components such as discrete gates or transistors. Correspondingly, each module, such as the first control module and the second control module, can be implemented by executing instructions in the central processing unit (CPU) memory to perform the corresponding steps, or by implementing dedicated circuits to perform the corresponding steps.

[0089] Bus 103 can use any of the various bus architectures. For example, bus architectures include, but are not limited to, Industry Standard Architecture (ISA) bus, Micro Channel Architecture (MCA) bus, and Peripheral Component Interconnect (PCI) bus.

[0090] The interfaces 104, 105, and 106 in the controller 100, as well as the memory 101 and processor 102, can be connected via bus 103. Input / output interface 104 provides a connection interface for input / output devices such as monitors, mice, and keyboards. Network interface 105 provides a connection interface for various networked devices. Storage interface 106 provides a connection interface for external storage devices such as floppy disks, USB flash drives, and SD cards.

[0091] Various aspects of this disclosure are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus, and computer program products according to embodiments of this disclosure. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations thereof, can be implemented by computer-readable program instructions.

[0092] These computer-readable program instructions are provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable device to produce a machine, such that execution of the instructions by the processor produces means for implementing the functions specified in one or more boxes of the flowchart and / or block diagram.

[0093] These computer-readable program instructions may also be stored in a computer-readable storage medium. These instructions cause a computer to work in a particular manner to produce an article of manufacture, including instructions that implement the functions specified in one or more boxes in a flowchart and / or block diagram.

[0094] This disclosure may take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects.

[0095] The processing apparatus, processing method, and controller described in the above embodiments can improve workpiece processing quality and efficiency, and reduce workpiece processing costs.

[0096] The processing apparatus, processing method based on the apparatus, and controller according to this disclosure have been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art will fully understand how to implement the technical solutions disclosed herein based on the above description.

Claims

1. A processing apparatus, comprising a focusing element and a water coupler, wherein the focusing element is used to focus a laser and incident the focused laser into the coupling cavity of the water coupler, the water coupler comprising: The first inlet is used to connect to the water supply equipment; The second injection port is used to connect to the abrasive feeding equipment; A first valve is used to open the second injection port in a first processing mode; The coupling cavity is connected to the first injection port and the second injection port, and is used to couple the water provided by the water supply device, the abrasive provided by the abrasive supply device, and the focused laser to obtain a first jet in the first processing mode. A nozzle, connected to the coupling cavity, is used to eject the first jet to process the workpiece.

2. The processing apparatus according to claim 1, wherein, The water coupler also includes a discharge port connected to the coupling cavity for discharging abrasive particles.

3. The processing apparatus according to claim 2, wherein: The outlet is located at the bottom of the coupling cavity; and / or, On a circle centered at the center of the coupling cavity, the central angle corresponding to the line connecting the location of the outlet and the location of the second injection port is greater than or equal to 170° and less than or equal to 180°.

4. The processing apparatus according to claim 3, wherein, The bottom surface region of the coupling cavity near the outlet is inclined downward to guide the abrasive particles out of the outlet.

5. The processing apparatus according to claim 2, wherein, The water coupler also includes a second valve for closing the outlet in the first processing mode.

6. The processing apparatus according to claim 5, wherein: The first valve is also used to close the second injection port in the second processing mode; The second valve is also used to close the discharge port in the second processing mode; The coupling cavity is also used to couple the water supplied by the water supply device with the focused laser in the second processing mode to obtain a second jet; The nozzle is also used to eject the second jet to process the workpiece.

7. The processing apparatus according to claim 5, wherein: The first valve is also used to close the second injection port in abrasive discharge mode; The second valve is also used to open the discharge port in the abrasive discharge mode.

8. The processing apparatus according to claim 6 or 7, further comprising: A laser is used to emit laser light in the first processing mode or the second processing mode, and is also used not to emit laser light in the abrasive discharge mode.

9. A processing method, applied to the processing apparatus according to any one of claims 1 to 8, comprising: In response to the first processing mode being triggered, the controller sets the first valve to the open state to process the workpiece using the first jet coupled by the water coupler.

10. The processing method according to claim 9, further comprising: In response to the second processing mode being triggered, the controller sets the first valve to the closed state so as to process the workpiece using the second jet coupled by the water coupler.

11. The processing method according to claim 10, wherein if the processing apparatus further includes a discharge port and a second valve, the processing method further includes: In response to the triggering of the first processing mode or the second processing mode, the controller will also set the second valve to the closed state; In response to the abrasive discharge mode being triggered, the controller sets the first valve to the closed state and the second valve to the open state to discharge abrasive particles through the discharge port.

12. The processing method according to claim 11, wherein if the processing apparatus further includes the laser, the processing method further includes: The controller activates the laser in response to the triggering of either the first processing mode or the second processing mode. In response to the abrasive discharge mode being triggered, the controller shuts down the laser.

13. The processing method according to claim 12, further comprising: In response to the triggering of the third processing mode, the controller shuts off the laser, opens the first valve, and closes the second valve to process the workpiece using the third jet obtained by coupling water and abrasive particles within the water coupler.

14. A controller, comprising: Memory; as well as A processor coupled to the memory, the processor being configured to perform the processing method as described in any one of claims 9 to 13 based on instructions stored in the memory.

15. A computer-readable storage medium having stored thereon computer program instructions that, when executed by a processor, implement the processing method as described in any one of claims 9 to 13.

16. A computer program product having stored computer program instructions thereon, which, when executed by a processor, implement the processing method as described in any one of claims 9 to 13.

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