Device capable of automatically replacing abrasive paper for grinding and polishing machine

Abstract

The invention relates to the technical field of grinding and polishing machines, in particular to an automatic abrasive paper replacing device of a grinding and polishing machine, which comprises a grinding and polishing platform, a grinding and polishing cylinder mechanism for grinding a workpiece is movably mounted above the grinding and polishing platform, and a driving connecting piece connected with a mechanical arm is arranged at the upper end of the grinding and polishing cylinder mechanism; an abrasive paper replacing mechanism is arranged on one side of the grinding and polishing platform and comprises a driving assembly movably installed on the grinding and polishing platform, a U-shaped movable plate is movably installed on one side of the grinding and polishing platform, and the U-shaped movable plate is composed of an upper half part and a lower half part. According to the grinding and polishing device, the abrasive paper replacing mechanism is arranged, simple horizontal linear motion can be converted into accurate rotation control over a rotary gear through mutual cooperation between a fixed toothed bar and a control rack, positioning movement of an adsorption plate and lifting movement of a pressing mechanism in a grinding and polishing cylinder are synchronously achieved only through one driving motor, and the grinding and polishing device is convenient to use and high in practicability. The whole system is compact in structure, lower in manufacturing cost and higher in working reliability.

Description

Technical Field

[0001] This invention relates to the field of polishing machine technology, and in particular to a polishing machine with an automatic sandpaper replacement device. Background Technology

[0002] In industries such as machinery manufacturing, processing, mold making, woodworking, and leather products, grinding and polishing are indispensable processes in product manufacturing. They are used to remove burrs from the surface of workpieces and improve their smoothness to facilitate subsequent processing or direct finishing. Traditional grinding and polishing operations mainly rely on manual operation, which is labor-intensive and inefficient. To replace manual operation, automated equipment that uses robotic arms to control the grinding trajectory has emerged.

[0003] However, in high-frequency, high-precision polishing scenarios, sandpaper usually needs to be replaced every three to five minutes. In existing technologies, when replacing sandpaper, the robotic arm needs to be moved out of the workstation to a safe area, and then the old sandpaper needs to be peeled off and the new sandpaper needs to be pasted manually. The whole process takes about ten to fifteen seconds. Frequent interruptions not only reduce processing efficiency, but also increase the risk of quality fluctuations and equipment downtime caused by inconsistent human operation. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an automatic sandpaper replacement device for a polishing machine. This device solves the technical problem of inconvenient sandpaper replacement and the need for manual intervention in existing automated polishing equipment. It has the advantage of being able to automatically complete sandpaper replacement, which can effectively ensure production continuity.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an automatic sandpaper replacement device for a polishing machine, comprising a polishing platform, a polishing cylinder mechanism for workpiece polishing movably mounted above the polishing platform, a drive connector for connecting to a robotic arm at the upper end of the polishing cylinder mechanism, and a sandpaper replacement mechanism on one side of the polishing platform. During polishing operations, the polishing cylinder mechanism rotates at high speed under the control and drive of the robotic arm, thereby polishing the workpiece on the polishing platform. During the processing, the sandpaper replacement mechanism can change the sandpaper in the polishing cylinder mechanism. The automatic sandpaper replacement mechanism includes a drive assembly movably mounted on a polishing platform. A U-shaped movable plate is movably mounted on one side of the polishing platform. The U-shaped movable plate consists of an upper part and a lower part. The lower part of the U-shaped movable plate is retractable. An adsorption plate is fixedly mounted on the upper part of the U-shaped movable plate. The adsorption plate has several adsorption holes on the side near the polishing platform. A micro air pump is fixedly mounted on the U-shaped movable plate. When the micro air pump is powered on and started, it will draw air through the adsorption holes, thereby creating a negative pressure below the U-shaped movable plate.

[0006] Preferably, the adsorption plate is provided with a fixed toothed rod on the side near the drive assembly. The drive assembly includes a drive gear movably mounted on the polishing platform. The drive gear meshes with the fixed toothed rod. A drive motor is fixedly mounted at the lower end of the polishing platform. When the drive gear rotates, it will cause the adsorption plate to move horizontally through the cooperation of the fixed toothed rod.

[0007] Preferably, a control rack is fixedly installed on the adsorption plate, and the control rack moves synchronously when the adsorption plate moves.

[0008] Preferably, the polishing platform is provided with a polishing area and an installation area. A storage area and a recycling area are respectively provided on both sides of the installation area. The storage area is used to place the cut sandpaper, and the recycling area is used to temporarily store the old sandpaper that has been replaced.

[0009] Preferably, an abutting and correcting ring is provided above the mounting location. The abutting and correcting ring is used to adjust the position of the polishing cylinder, thereby facilitating the replacement of sandpaper.

[0010] Preferably, the polishing cylinder mechanism includes a polishing cylinder, an mounting plate is fixedly installed at the upper end of the inner cavity of the polishing cylinder, a fixing boss is fixedly installed at the lower end of the inner cavity of the polishing cylinder, a rotating gear is movably installed on the mounting plate, a threaded rod is coaxially provided in the middle of the rotating gear, the threaded rod is threadedly engaged with the rotating gear, a connecting bracket is fixedly installed on the threaded rod, side wall grooves are symmetrically opened on the outer side of the polishing cylinder, and an abutment is fixedly installed on the connecting bracket. The abutment extends outward through the side wall groove. When the polishing cylinder moves above the installation location under the control of the robotic arm and gradually moves downward, the abutment will contact the abutment correction ring. Then, the abutment will slide along the abutment correction ring, thereby adjusting the position of the polishing cylinder.

[0011] Preferably, a lifting pressure ring is fixedly installed at the lower end of the connecting bracket, and an abutment ring groove is opened at the lower end of the fixed boss. When the lifting pressure ring moves upward synchronously with the sandpaper, the middle part of the sandpaper will contact the fixed boss, and the edge of the sandpaper will be located between the lifting pressure ring and the abutment ring groove, thereby fixing and limiting the sandpaper.

[0012] Preferably, an ejector rod is fixedly installed on the connecting bracket. The ejector rod is slidably connected to the fixed boss. During grinding, the ejector rod is located inside the fixed boss. When the connecting bracket moves downward, the ejector rod will extend downward through the fixed boss, thereby ejecting the sandpaper downward.

[0013] By employing the above technical solution, the present invention provides an automatic sandpaper replacement device for a polishing machine, which has at least the following beneficial effects: 1. This invention, by setting up a sandpaper replacement mechanism, utilizes the cooperation between the adsorption plate and the control rack to automatically perform sandpaper adsorption and removal, old paper ejection, and new paper placement operations, which greatly simplifies the sandpaper replacement process, saves the time and manpower required by traditional replacement methods, and effectively improves sanding efficiency.

[0014] 2. By setting up a sandpaper replacement mechanism, the present invention utilizes the cooperation between the fixed rack and the control rack to transform simple horizontal linear motion into precise rotational control of the rotating gear. With only one drive motor, the positioning and movement of the adsorption plate and the lifting and lowering of the pressing mechanism inside the polishing cylinder are realized simultaneously, making the entire system compact, with lower manufacturing costs and stronger operational reliability.

[0015] 3. By setting up a grinding and polishing cylinder mechanism, the present invention utilizes the cooperation between the connecting bracket and the lifting pressure ring to fully automate the pressing and releasing process of sandpaper without manual intervention, which significantly improves the efficiency and accuracy of sandpaper replacement. Furthermore, the ejector rod can automatically push the old sandpaper away from the workstation before replacement, providing a clean and accurate foundation for the automatic installation and positioning of the new sandpaper.

[0016] 4. This invention, by setting up a grinding and polishing cylinder mechanism, utilizes the mutual cooperation between the abutting component and the abutting correction ring. When the robotic arm controls the grinding and polishing cylinder to move down to the installation position, the abutting component will slide along the inclined surface of the abutting correction ring. This process can automatically correct and fix the circumferential angle and horizontal position of the grinding and polishing cylinder, ensuring that the rotating gear on it can accurately mesh with the control rack. This effectively overcomes the minor errors that may be caused by repeated positioning of the robotic arm, thereby ensuring the accuracy and reliability of each sandpaper replacement action.

[0017] 5. This invention adopts an integrated design, which rationally arranges the grinding and polishing area, sandpaper replacement and installation area, new sandpaper storage area and old sandpaper recycling area on the same workstation, thereby ensuring that the robotic arm can complete all operations from grinding to sandpaper replacement with only a small range of movement, effectively shortening the time required for sandpaper replacement. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a perspective view of the overall structure of the present invention; Figure 2 This is a schematic diagram of the grinding and polishing platform in this invention; Figure 3 This is a schematic diagram of the grinding and polishing cylinder mechanism in this invention; Figure 4 This is a cross-sectional view of the grinding and polishing cylindrical structure in this invention; Figure 5 This is a schematic diagram of the sandpaper replacement mechanism in this invention; Figure 6 This is a schematic diagram of the adsorption pore structure in this invention.

[0019] In the diagram: 1. Polishing platform; 101. Polishing area; 102. Installation area; 103. Storage area; 104. Recycling area; 105. Alignment and correction ring; 2. Polishing cylinder mechanism; 201. Polishing cylinder; 202. Mounting plate; 203. Rotating gear; 204. Threaded rod; 205. Connecting bracket; 206. Fixed boss; 207. Side wall groove; 208. Alignment component; 209. Lifting pressure ring; 210. Alignment ring groove; 3. Sandpaper changing mechanism; 301. Drive assembly; 302. U-shaped movable plate; 303. Adsorption plate; 304. Fixed rack; 305. Control rack; 306. Adsorption hole; 307. Miniature air pump; 4. Drive connector. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1 In high-frequency, high-precision polishing scenarios, sandpaper typically needs to be replaced every three to five minutes. In existing technologies, when changing sandpaper, the robotic arm must move out of the workstation to a safe area, and then the old sandpaper must be peeled off and the new sandpaper applied manually. This entire process takes about ten to fifteen seconds. Frequent interruptions not only reduce processing efficiency but also increase the risk of quality fluctuations and equipment downtime due to inconsistent human operation. To address this technical deficiency in existing technologies, such as... Figure 1 , Figure 5 as well as Figure 6 As shown, this embodiment proposes an automatic sandpaper replacement device for a polishing machine, which can automatically perform sandpaper adsorption, old paper ejection, and new paper placement operations, greatly simplifying the sandpaper replacement process. The device includes a polishing platform 1, with a polishing cylinder mechanism 2 for workpiece polishing movably mounted on the upper part of the polishing platform 1. The upper end of the polishing cylinder mechanism 2 is provided with a drive connector 4 connected to a robotic arm. A sandpaper replacement mechanism 3 is provided on one side of the polishing platform 1. During the polishing operation, the polishing cylinder mechanism 2 will rotate at high speed under the control and drive of the robotic arm, thereby polishing the workpiece on the polishing platform 1. During the processing, the sandpaper replacement mechanism 3 can automatically replace the sandpaper in the polishing cylinder mechanism 2.

[0022] Specifically, the sandpaper changing mechanism 3 includes a drive assembly 301 movably mounted on the polishing platform 1. A U-shaped movable plate 302 is movably mounted on one side of the polishing platform 1. The U-shaped movable plate 302 consists of an upper part and a lower part. The lower part of the U-shaped movable plate 302 is retractable. An adsorption plate 303 is fixedly mounted on the upper part of the U-shaped movable plate 302. A fixed toothed rod 304 is provided on the side of the adsorption plate 303 near the drive assembly 301. The drive assembly 301 includes a drive gear movably mounted on the polishing platform 1. The drive gear meshes with the fixed toothed rod 304. A drive motor is fixedly installed at the lower end of 1. When the drive gear rotates, it will cause the adsorption plate 303 to move horizontally through the cooperation of the fixed rack 304. A control rack 305 is fixedly installed on the adsorption plate 303. When the adsorption plate 303 moves, the control rack 305 will move synchronously. Several adsorption holes 306 are opened on the side of the adsorption plate 303 near the polishing platform 1. A micro air pump 307 is fixedly installed on the U-shaped movable plate 302. When the micro air pump 307 is powered on and started, it will suck air through the adsorption holes 306, thereby forming a negative pressure below the U-shaped movable plate 302.

[0023] As can be seen from the above, after the position of the polishing cylinder 201 is fixed, the drive gear will rotate under the action of the drive motor. When the drive gear rotates, it will cause the U-shaped movable plate 302 to move horizontally through the cooperation with the fixed gear 304. During the movement of the U-shaped movable plate 302, the adsorption plate 303 will first move to the top of the storage 103. Next, the micro air pump 307 will draw air upward through the adsorption hole 306, generating negative pressure below the adsorption plate 303, thereby sucking up the sandpaper in the storage 103.

[0024] Subsequently, the adsorption plate 303 will continue to move between the lifting pressure ring 209 and the abutment ring groove 210, following the U-shaped movable plate 302. During this process, the adsorption plate 303 will push the old sandpaper that has fallen on the lifting pressure ring 209 horizontally, so that it falls into the inside of the recycling point 104. Next, the micro air pump 307 will gradually reduce the suction force, so that the adsorbed sandpaper will fall smoothly onto the lifting pressure ring 209.

[0025] Subsequently, the drive gear will rotate in the opposite direction, causing the adsorption plate 303 to move out from between the lifting pressure ring 209 and the abutment ring groove 210. During the removal of the adsorption plate 303, the control rack 305 will cause the rotating gear 203 to rotate in the opposite direction, thereby causing the threaded rod 204 and the connecting bracket 205 to move upward. When the connecting bracket 205 moves upward, the lifting pressure ring 209 will move upward synchronously. When the lifting pressure ring 209 moves upward, it will press the sandpaper tightly against the lower end of the fixed boss 206, thereby completing the replacement of the sandpaper.

[0026] This embodiment, by setting up a sandpaper replacement mechanism 3, utilizes the cooperation between the adsorption plate 303 and the control rack 305 to automatically perform sandpaper adsorption, old paper ejection, and new paper placement operations, greatly simplifying the sandpaper replacement process, saving the time and manpower required by traditional replacement methods, and effectively improving sanding efficiency. Moreover, by setting up a sandpaper replacement mechanism 3, this embodiment, through the cooperation between the fixed rack 304 and the control rack 305, can transform simple horizontal linear motion into precise rotational control of the rotating gear 203. With only one drive motor, the positioning and movement of the adsorption plate 303 and the lifting and lowering of the pressing mechanism inside the polishing cylinder 201 are realized simultaneously, making the entire system compact, with lower manufacturing costs and stronger operational reliability.

[0027] Example 2 To further improve sandpaper replacement efficiency and avoid manual intervention, based on Example 1, such as... Figure 1 , Figure 3 as well as Figure 4 As shown, this embodiment includes a polishing cylinder mechanism 2. Specifically, the polishing cylinder mechanism 2 includes a polishing cylinder 201. A mounting plate 202 is fixedly installed at the upper end of the inner cavity of the polishing cylinder 201, and a fixing boss 206 is fixedly installed at the lower end of the inner cavity of the polishing cylinder 201. A rotating gear 203 is movably installed on the mounting plate 202. A threaded rod 204 is coaxially arranged in the middle of the rotating gear 203. The threaded rod 204 is threadedly engaged with the rotating gear 203. A connecting bracket 205 is fixedly installed on the threaded rod 204, and an ejector rod is fixedly installed on the connecting bracket 205. The ejector rod is slidably connected to the fixing boss 206. During polishing, the ejector rod is located inside the fixing boss 206. When the connecting bracket 205 moves downward, the ejector rod extends downward through the fixing boss 206, thereby pushing the sandpaper downward. The polishing cylinder 201 has symmetrically provided side wall grooves 207 on its outer side. Abutment 208 is fixedly installed on the connecting bracket 205. The abutment 208 extends outward through the side wall grooves 207. When the polishing cylinder 201 moves above the installation location 102 under the control of the robotic arm and gradually moves downward, the abutment 208 will contact the abutment correction ring 105. Then, the abutment 208 will slide along the abutment correction ring 105 to adjust the position of the polishing cylinder 201. A lifting pressure ring 209 is fixedly installed at the lower end of the connecting bracket 205. Abutment ring groove 210 is provided at the lower end of the fixed boss 206. When the lifting pressure ring 209 moves upward synchronously with the sandpaper, the middle part of the sandpaper will contact the fixed boss 206. The edge of the sandpaper is located between the lifting pressure ring 209 and the abutment ring groove 210, thereby fixing and limiting the sandpaper.

[0028] As can be seen from the above, the polishing cylinder 201 is connected to the robotic arm via the drive connector 4. During the polishing process, the polishing cylinder 201 will rotate at high speed under the drive of the robotic arm, thereby polishing the workpiece located at the polishing point 101.

[0029] When the sandpaper needs to be replaced, the polishing cylinder 201 will move above the installation location 102 under the control of the robotic arm and gradually move downward. When the polishing cylinder 201 moves downward, the abutment 208 will come into contact with the abutment correction ring 105. Then, as the polishing cylinder 201 continues to move downward, the abutment 208 and the polishing cylinder 201 will rotate at a certain angle under the guidance of the abutment correction ring 105, thereby adjusting the angle and fixing the position of the polishing cylinder 201.

[0030] Next, the U-shaped movable plate 302 will move horizontally under the drive of the drive assembly 301. When the U-shaped movable plate 302 moves, the control rack 305 will pass through the polishing cylinder 201. During this process, the control rack 305 will mesh with the rotating gear 203 and make it rotate in the forward direction. When the rotating gear 203 rotates in the forward direction, the threaded rod 204 will move vertically downward. When the threaded rod 204 moves downward, the connecting bracket 205 will move downward synchronously.

[0031] When the connecting bracket 205 moves downward, the lifting pressure ring 209 will move downward synchronously, thereby releasing the clamping and fixing effect on the sandpaper. At the same time, the ejector rod will extend from below the fixed boss 206, thereby pushing down the old sandpaper that is attached to the fixed boss 206 and letting it fall onto the lifting pressure ring 209, preparing for the subsequent sandpaper replacement.

[0032] This embodiment, by setting up a polishing cylinder mechanism 2, utilizes the cooperation between the connecting bracket 205 and the lifting pressure ring 209 to fully automate the sandpaper clamping and releasing process without manual intervention, significantly improving the efficiency and accuracy of sandpaper replacement. Furthermore, the ejector rod automatically pushes the old sandpaper away from the workstation before replacement, providing a clean and accurate foundation for the automatic installation and positioning of the new sandpaper. Moreover, by setting up the polishing cylinder mechanism 2, and utilizing the cooperation between the abutting member 208 and the abutting correction ring 105, when the robotic arm controls the polishing cylinder 201 to move down to the installation position 102, the abutting member 208 slides along the inclined surface of the abutting correction ring 105. This process automatically corrects and fixes the circumferential angle and horizontal position of the polishing cylinder 201, ensuring that the rotating gear 203 on it can precisely mesh with the control rack 305, effectively overcoming the minor errors that may occur due to repeated positioning by the robotic arm, thereby ensuring the accuracy and reliability of each sandpaper replacement action.

[0033] Example 3 Based on the above embodiments, such as Figure 1 , Figure 2 as well as Figure 5 As shown, in this embodiment, a polishing area 101 and an installation area 102 are provided on the polishing platform 1. A storage area 103 and a recycling area 104 are respectively provided on both sides of the installation area 102. The storage area 103 is used to place the cut sandpaper inside, and the recycling area 104 is used to temporarily store the old sandpaper that has been replaced. An abutting and correcting ring 105 is provided above the installation area 102. The abutting and correcting ring 105 is used to adjust the position of the polishing cylinder 201, thereby facilitating the replacement of sandpaper.

[0034] As can be seen from the above, during the grinding process, the workers will place the workpiece to be ground in the polishing area 101 and put the pre-cut sandpaper in the storage area 103 for later use.

[0035] This embodiment adopts an integrated design, which rationally arranges the grinding and polishing area, sandpaper replacement and installation area, new sandpaper storage area and old sandpaper recycling area on the same workstation, thereby ensuring that the robotic arm can complete all operations from grinding to sandpaper replacement with only a small range of movement, effectively shortening the time required for sandpaper replacement.

[0036] The control method of this invention is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the art. Furthermore, since this invention is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail here.

[0037] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A polishing machine with an automatic sandpaper changing device, comprising a polishing platform (1), characterized in that: A grinding and polishing cylinder mechanism (2) for grinding workpieces is movably installed above the grinding and polishing platform (1). The upper end of the grinding and polishing cylinder mechanism (2) is provided with a drive connector (4) connected to the robotic arm. A sandpaper replacement mechanism (3) is provided on one side of the grinding and polishing platform (1). The sandpaper replacement mechanism (3) includes a drive assembly (301), which is movably mounted on the polishing platform (1). A U-shaped movable plate (302) is movably mounted on one side of the polishing platform (1). The U-shaped movable plate (302) consists of an upper part and a lower part. The lower part of the U-shaped movable plate (302) is retractable. An adsorption plate (303) is fixedly mounted on the upper part of the U-shaped movable plate (302). Several adsorption holes (306) are opened on the side of the adsorption plate (303) near the polishing platform (1). A micro air pump (307) is fixedly mounted on the U-shaped movable plate (302).

2. The automatic sandpaper replacement device for a polishing machine according to claim 1, characterized in that: The adsorption plate (303) is provided with a fixed toothed rod (304) on the side near the drive assembly (301). The drive assembly (301) includes a drive gear movably mounted on the polishing platform (1). The drive gear meshes with the fixed toothed rod (304). A drive motor is fixedly mounted on the lower end of the polishing platform (1).

3. The automatic sandpaper replacement device for a polishing machine according to claim 1, characterized in that: A control rack (305) is fixedly installed on the adsorption plate (303).

4. The automatic sandpaper replacement device for a polishing machine according to claim 1, characterized in that: The polishing platform (1) is provided with a polishing area (101) and an installation area (102). A storage area (103) and a recycling area (104) are respectively opened on both sides of the installation area (102).

5. The automatic sandpaper replacement device for a polishing machine according to claim 4, characterized in that: An anti-alignment ring (105) is provided above the mounting location (102).

6. The automatic sandpaper replacement device for a polishing machine according to claim 1, characterized in that: The polishing cylinder mechanism (2) includes a polishing cylinder (201). A mounting plate (202) is fixedly installed at the upper end of the inner cavity of the polishing cylinder (201). A fixing boss (206) is fixedly installed at the lower end of the inner cavity of the polishing cylinder (201). A rotating gear (203) is movably installed on the mounting plate (202). A threaded rod (204) is coaxially provided in the middle of the rotating gear (203). The threaded rod (204) is threadedly engaged with the rotating gear (203). A connecting bracket (205) is fixedly installed on the threaded rod (204). Side wall grooves (207) are symmetrically opened on the outer side of the polishing cylinder (201). An abutment (208) is fixedly installed on the connecting bracket (205). The abutment (208) extends outward through the side wall grooves (207).

7. The automatic sandpaper replacement device for a polishing machine according to claim 6, characterized in that: The lower end of the connecting bracket (205) is fixedly installed with a lifting pressure ring (209), and the lower end of the fixed boss (206) is provided with an abutment ring groove (210).

8. The automatic sandpaper replacement device for a polishing machine according to claim 6, characterized in that: An ejector rod is fixedly installed on the connecting bracket (205), and the ejector rod is slidably connected to the fixed boss (206).

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