Substrate processing equipment for semiconductor chilling plate production

Abstract

The invention relates to the technical field of substrate polishing, and discloses a substrate processing device for semiconductor chilling plate production, which comprises a base and a mounting box, the base is provided with a placing plate, the placing plate is provided with a positioning plate, the positioning plate is provided with a positioning groove for positioning a semiconductor substrate, and the upper surface of the base is provided with a temperature sensing assembly. The temperature sensing assembly is in signal connection with the equipment control system, and the control system is electrically connected with the driving motor to adjust the rotating speed of the polishing plate, so that the semiconductor substrate is prevented from being overheated in the polishing process. The substrate temperature is detected through the temperature sensing assembly, the control system adjusts the rotating speed of the driving motor in a linkage mode, and substrate polishing overheating is avoided. The base plate is accurately positioned through the positioning groove, and the polishing position precision is guaranteed; an absorption notch and an absorption cavity collect redundant processing materials, so that processing pollution is reduced; the temperature and the rotating speed are adjusted in a linkage mode, and quality defects caused by overheat polishing of the substrate are prevented.

Description

Technical Field

[0001] This invention relates to the field of substrate polishing technology, and more specifically to a substrate processing equipment for the production of semiconductor cooling chips. Background Technology

[0002] A thermoelectric refrigeration chip is a thermoelectric cooling device based on the Peltier effect. It consists of thermocouples made of P-type and N-type semiconductor materials and achieves heat transfer through direct current drive. The thermoelectric refrigeration chip is supported by two ceramic substrates, with metal layers plated on the surface to form conductive connection layers. The P-type and N-type semiconductor thermoelectric arms are welded or sintered through the conductive layers and arranged alternately in an "electrically series, thermally parallel" structure. The current circulates from the positive electrode - the conductive layer of the ceramic substrate - the P-type arm - the conductive layer - the N-arm - to the negative electrode, forming a closed loop. The surface flatness of the ceramic substrate is required to be high, and polishing is required during processing.

[0003] Existing technology discloses a substrate processing equipment for semiconductor cooling chip production, application number CN202510400502.1, relating to the field of polishing equipment technology. It includes a substrate polishing mechanism comprising a polishing motor, a fixed plate, a movable plate, and a support plate. The top of the fixed plate is fixedly mounted to the bottom of the polishing motor via a bracket, and the movable plate is movably mounted to the bottom of the fixed plate via several spring-loaded devices. By preheating the substrate to be polished, the brittleness of the substrate is greatly reduced, making it less prone to breakage during polishing and improving polishing efficiency. The cooling chip, cooling guide frame, and air form a low-temperature zone around the polishing wheel to reduce the temperature of the contact area between the polishing wheel and the substrate, preventing localized high temperatures that could cause substrate deformation. Multiple spring-loaded devices keep the movable plate and fixed plate parallel, allowing the ball bearings to smoothly press the substrate, preventing warping and greatly improving the substrate polishing yield and efficiency.

[0004] However, existing technologies, especially this particular solution, still have the following problems: Untreated polishing contaminants can easily cause secondary pollution: Existing technologies do not have a collection structure for particles and residual polishing liquid generated during the polishing process. These contaminants can easily adhere to the substrate surface, balls and the inside of the equipment, which can not only scratch the substrate processing surface, but also contaminate the substrates to be processed later, resulting in a decrease in processing yield and an increase in equipment cleaning and maintenance costs. The cooling method is passive and complex, and the temperature control accuracy is poor: Existing technology achieves cooling by forming a low-temperature area around the polishing wheel through cooling plates and cooling guides. This is a passive cooling method and cannot respond to temperature changes during the substrate polishing process in real time. Moreover, this cooling structure requires additional cooling components and cooling circuits, which increases the complexity of the equipment and energy consumption. At the same time, uneven local cooling is likely to occur, which may still cause the substrate to deform due to thermal stress. Summary of the Invention

[0005] The purpose of this invention is to provide a technical solution that controls the linkage adjustment of the drive motor speed to avoid overheating during substrate polishing, and collects excess processing material in the absorption groove and absorption cavity, thereby solving the problems in the prior art mentioned in the background.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A substrate processing device for manufacturing semiconductor refrigeration chips, comprising: The base and mounting box are located on top of the base. A polishing processing unit is provided below the mounting box. The polishing processing unit includes a polishing plate, a circular cover covering the outside of the polishing plate, and a drive motor. The drive motor is used to drive the polishing plate to rotate. An absorption cavity is provided inside the circular cover. Several absorption slots communicating with the absorption cavity are provided on the bottom periphery of the circular cover. During the polishing of the semiconductor substrate, the absorption slots absorb excess particles and polishing liquid. The base is provided with a placement plate, the placement plate is provided with a positioning plate, the positioning plate is provided with a positioning groove for positioning the semiconductor substrate, and the upper surface of the base is provided with a temperature sensing component. The temperature sensing component is signal-connected to the equipment control system, and the control system is electrically connected to the drive motor to adjust the rotation speed of the polishing plate, thereby preventing the semiconductor substrate from overheating during the polishing process.

[0007] Preferably, the circular protective cover is provided with a suction tube and a suction assembly. The suction assembly is connected to the absorption chamber through the suction tube, and excess particles and polishing liquid enter the suction assembly through the suction tube in the absorption chamber.

[0008] Preferably, the polishing plate is provided with a conveying port, and the circular protective cover is provided with a conveying pipe, which conveys polishing liquid to the bottom of the polishing plate through the conveying port.

[0009] Preferably, the circular cover is provided with multiple sets of adjusting rods, and the polishing plate is installed inside the circular cover through the adjusting rods. The adjusting rods are used to adjust the height of the polishing plate inside the circular cover to adapt to the cooling chip substrates of different thicknesses.

[0010] Preferably, the positioning plates are provided in multiple sets and distributed in a circular array on the placement plate, and the positioning slots are provided in multiple sets and distributed in a circular array on the positioning plates.

[0011] Preferably, the circular cover is provided with a connecting plate, a connecting bracket is installed on the connecting plate, and a rotating shaft one and a rotating shaft two are connected to the connecting bracket, and the rotating shaft one and the rotating shaft two are connected in a transmission connection.

[0012] Preferably, the drive motor is installed inside the mounting box, and a lifting assembly is also installed inside the mounting box. The drive motor drives the rotation of rotating shaft one and rotating shaft two, and the lifting assembly drives the lifting of rotating shaft one and rotating shaft two, thereby realizing the lifting and adjustment of the circular cover and polishing plate.

[0013] Preferably, the base is adjustablely mounted with multiple sets of positioning brackets via mounting seats, and multiple sets of positioning wheels are rotatably mounted on the positioning brackets. The positioning wheels fit against the side of the circular cover, and the positioning brackets are also provided with arc-shaped grooves that match the circular cover.

[0014] Preferably, when the temperature sensing component detects that the temperature of the semiconductor substrate is greater than the preset temperature range, the speed of the drive motor is reduced; when the detected temperature is less than the preset temperature range, the drive motor is restored to the initial processing speed.

[0015] Preferably, the temperature sensing component is a non-contact infrared temperature sensor, with its detection end facing the semiconductor substrate placement area on the positioning plate.

[0016] Technical effects and advantages of the present invention: The substrate processing equipment for semiconductor refrigeration chip production proposed in this invention has the following advantages compared with the prior art: This invention positions the semiconductor cooling chip substrate within a positioning groove on a positioning plate. A drive motor rotates a polishing plate to polish the substrate. During polishing, an absorption groove at the bottom of a circular shield draws excess particles and polishing fluid into an internal absorption chamber. A temperature sensor detects the substrate temperature, and the control system adjusts the drive motor speed accordingly to prevent overheating during polishing. The positioning groove ensures precise substrate positioning and guarantees polishing accuracy. The absorption groove and absorption chamber collect excess processing materials, reducing processing contamination. The temperature and speed are linked for adjustment to prevent quality defects caused by overheating during polishing. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of the substrate processing equipment for producing semiconductor refrigeration chips according to the present invention; Figure 2 This is a front view of the substrate processing equipment for producing semiconductor refrigeration wafers according to the present invention. Figure 3 This is a partial structural schematic diagram of the substrate processing equipment for producing semiconductor refrigeration chips according to the present invention; Figure 4 This is one of the schematic diagrams of the structure including the placement plate and the circular protective cover in an embodiment of the present invention; Figure 5 This is a second schematic diagram of the structure including the placement plate and the circular protective cover in an embodiment of the present invention; Figure 6This is a schematic diagram of the circular protective cover and polishing plate in an embodiment of the present invention; Figure 7 This is a schematic diagram of the circular protective cover and positioning plate in an embodiment of the present invention.

[0018] In the picture: 11. Base; 12. Mounting box; 13. Positioning bracket; 14. Mounting seat; 15. Positioning wheel; 16. Placement plate; 17. Temperature sensing component; 21. Circular protective cover; 22. Connecting plate; 23. Polishing plate; 24. Absorption chamber; 25. Absorption slot; 26. Suction pipe; 27. Suction assembly; 28. Adjusting rod; 29. ​​Positioning plate; 210. Positioning slot; 211. Rotating shaft one; 212. Rotating shaft two; 213. Drive motor; 214. Lifting assembly; 215. Connecting bracket; 216. Conveying port. Detailed Implementation

[0019] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the subject matter described herein, and changes may be made to the function and arrangement of the elements discussed without departing from the scope of this specification. Various processes or components may be omitted, substituted, or added as needed in the examples. Furthermore, features described in some examples may be combined in other examples.

[0020] The invention provides, for example Figures 1 to 7 As shown, a substrate processing equipment for manufacturing semiconductor refrigeration chips includes: The base 11 and the mounting box 12 are arranged above the base 11; A polishing processing unit is provided below the mounting box 12. The polishing processing unit includes a polishing plate 23, a circular protective cover 21 covering the outside of the polishing plate 23, and a drive motor 213. The drive motor 213 is used to drive the polishing plate 23 to rotate. An absorption cavity 24 is provided inside the circular protective cover 21. A plurality of absorption slots 25 communicating with the absorption cavity 24 are provided on the bottom periphery of the circular protective cover 21. During the polishing process of the semiconductor substrate, the absorption slots 25 absorb excess particles and polishing liquid. The base 11 is provided with a placement plate 16, the placement plate 16 is provided with a positioning plate 29, the positioning plate 29 is provided with a positioning groove 210 for positioning the semiconductor substrate, the upper surface of the base 11 is provided with a temperature sensing component 17, the temperature sensing component 16 is connected to the equipment control system, and the control system is electrically connected to the drive motor 213 to adjust the rotation speed of the polishing plate 23, thereby preventing the semiconductor substrate from overheating during the polishing process.

[0021] Working principle: The semiconductor cooling chip substrate is positioned by placing it in the positioning groove 210 of the positioning plate 29; the drive motor 213 drives the polishing plate 23 to rotate and polish the substrate; during the polishing process, the absorption groove 25 at the bottom of the circular shield 21 sucks in excess particles and polishing liquid into the internal absorption cavity 24; the temperature sensing component 17 detects the substrate temperature and controls the control system to adjust the speed of the drive motor 213 to prevent the substrate from overheating during polishing.

[0022] The positioning groove 210 enables precise positioning of the substrate, ensuring the accuracy of the polishing position; the absorption groove 25 and the absorption cavity 24 collect excess processing materials, reducing processing pollution; the temperature and speed are linked for adjustment to prevent the substrate from developing quality defects due to overheating during polishing.

[0023] like Figure 5 and Figure 6 As shown, in order to further clarify the subsequent transport and collection path of the particulate matter and polishing liquid collected in the absorption chamber 24, and to form a closed loop in the collection process of polishing contaminants, the suction structure of the circular shield 21 is refined as follows: The circular shield 21 is provided with a suction pipe 26 and a suction assembly 27. The suction assembly 27 is connected to the absorption chamber 24 through the suction pipe 26. Excess particulate matter and polishing liquid enter the suction assembly 27 in the absorption chamber 24 through the suction pipe 26.

[0024] like Figure 6 As shown, in order to achieve precise delivery of polishing slurry to the polishing work area, and at the same time to collect excess polishing slurry with absorption tank 25, to ensure the balance between polishing slurry supply and recovery, the following structure is provided for the delivery of polishing slurry: the polishing plate 23 is provided with a delivery port 216, and the circular cover 21 is provided with a delivery pipe. The delivery pipe delivers polishing slurry to the bottom of the polishing plate 23 through the delivery port 216.

[0025] Specifically, to improve the equipment's adaptability to semiconductor cooling substrates of different thicknesses and expand the equipment's applicability, the height of the polishing plate 23 is adjustable through the adjustment rod 28 structure: multiple sets of adjustment rods 28 are provided on the circular cover 21, and the polishing plate 23 is installed inside the circular cover 21 through the adjustment rods 28. The adjustment rods 28 are used to adjust the height of the polishing plate 23 inside the circular cover 21 to adapt to cooling substrates of different thicknesses.

[0026] like Figure 4 and Figure 7 As shown, in order to achieve batch synchronous processing of multiple semiconductor cooling substrates and greatly improve the processing efficiency of the substrates, the distribution of the positioning plate 29 and the positioning groove 210 is designed as follows: the positioning plate 29 is provided in multiple sets and distributed in a ring array on the placement plate 16, and the positioning groove 210 is provided in multiple sets and distributed in a ring array on the positioning plate 29.

[0027] like Figure 2 and Figure 5 As shown, in order to ensure the stable installation and transmission connection of each component of the polishing processing unit and to make the rotation of the polishing plate 23 more reliable, the connection structure between the circular cover 21 and the transmission component is defined as follows: a connecting plate 22 is provided on the circular cover 21, a connecting bracket 215 is installed on the connecting plate 22, and a rotating shaft 1 211 and a rotating shaft 212 are connected to the connecting bracket 215, and the rotating shaft 1 211 and the rotating shaft 212 are connected in a transmission connection.

[0028] Specifically, in order to achieve independent control of the rotation and lifting actions of the polishing plate 23 and ensure that the pressure and position of the polishing operation are adjustable, the installation and function of the drive and lifting structure are described as follows: The drive motor 213 is installed inside the mounting box 12, and the lifting assembly 214 is also installed inside the mounting box 12. The drive motor 213 realizes the rotation drive of the first rotating shaft 211 and the second rotating shaft 212, and the lifting assembly 214 realizes the lifting drive of the first rotating shaft 211 and the second rotating shaft 212, thereby realizing the lifting and adjustment of the circular cover 21 and the polishing plate 23.

[0029] like Figure 3 and Figure 4 As shown, in order to improve the structural stability of the circular protective cover 21 during the polishing process and avoid its displacement affecting the processing accuracy, an auxiliary positioning support structure for the circular protective cover 21 is set up: multiple sets of positioning brackets 13 are adjustablely installed on the base 11 through the mounting seat 14, multiple sets of positioning wheels 15 are rotatably installed on the positioning brackets 13, the positioning wheels 15 are in contact with the side of the circular protective cover 21, and the positioning brackets 13 are also provided with arc-shaped grooves that match the circular protective cover 21.

[0030] Regarding the precise linkage control of temperature and polishing speed, the triggering conditions for speed adjustment are clarified, and the overheating of the substrate is prevented more reliably. The speed regulation logic of the temperature sensing component 17 is refined: when the temperature sensing component 17 detects that the temperature of the semiconductor substrate is greater than the preset temperature range, the speed of the drive motor 213 is reduced; when the detected temperature is less than the preset temperature range, the drive motor 213 is restored to the initial processing speed.

[0031] More specifically, in order to ensure the accuracy of temperature detection and the convenience of non-contact detection, and to ensure the reliable triggering of the temperature speed regulation function, the specific type and parameters of the temperature sensing component 17 are limited as follows: the temperature sensing component 17 is a non-contact infrared temperature sensor, its detection end faces the semiconductor substrate placement area on the positioning plate 29, the detection distance is 10-15mm, and the temperature detection accuracy is ≤±0.5℃.

[0032] In summary, the present invention also has the following combined effects: The semiconductor cooling chip substrate is placed in the positioning grooves 210 of the positioning plates 29 arranged in a ring on the placement plate 16, enabling batch placement of multiple substrates. The lifting assembly 214 drives the rotating shafts 211 and 212 to lower the circular shield 21 and polishing plate 23. Simultaneously, the adjusting rod 28 finely adjusts the height of the polishing plate 23 within the circular shield 21 to match the substrate thickness. Subsequently, the drive motor 213 rotates the rotating shafts, connecting bracket 215, and polishing plate 23, while the delivery pipe precisely delivers polishing fluid to the polishing area through the delivery port 216 of the polishing plate 23. During the polishing process... Excess particles and polishing liquid enter the absorption chamber 24 through the absorption slot 25 at the bottom of the circular protective cover 21, and are then collected by the suction component 27 through the suction pipe 26. During processing, the non-contact infrared temperature sensing component 17 detects the substrate temperature. If it exceeds the preset range, the control system reduces the speed of the drive motor 213. If it is below the preset range, the initial speed is restored. At the same time, the positioning wheel 15 of the positioning bracket 13 on the base 11 is attached to the side of the circular protective cover 21 to help maintain its structural stability. After polishing is completed, the lifting component 214 drives the circular protective cover 21 and the polishing plate 23 to reset, and the substrate can be removed to complete the processing.

[0033] Improved processing efficiency: The positioning plate 29 and the positioning groove 210 are arranged in a ring array, which can simultaneously place and process multiple semiconductor cooling substrates, realizing batch processing; Achieve closed-loop management of polishing materials: The conveying pipeline accurately delivers polishing liquid, which, together with the absorption tank 25, absorption chamber 24 and suction component 27, completes the supply of polishing liquid and the recovery of excess particles and polishing liquid, reducing material waste and processing pollution; Enhanced equipment adaptability: The height of the polishing plate 23 can be finely adjusted by adjusting rod 28, which can adapt to semiconductor cooling substrates of different thicknesses and expand the scope of equipment application; To ensure processing stability and accuracy: the positioning wheel 15 on the positioning bracket 13 fits against the side of the circular cover 21 to prevent it from shifting during processing and improve polishing accuracy; at the same time, the cooperation of the rotating shaft, the connecting bracket 215 and the lifting component 214 enables independent control of the rotation and lifting of the polishing plate 23, making the operation more flexible. Ensuring substrate processing quality: The non-contact infrared temperature sensing component 17 is linked to the drive motor 213 for speed adjustment, which can effectively prevent overheating during substrate polishing and avoid quality defects caused by thermal deformation of the substrate.

[0034] The embodiments of the present invention have been described above, but the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention, all of which are within the protection scope of the present invention.

Claims

1. A substrate processing equipment for manufacturing semiconductor refrigeration chips, characterized in that, include: A base (11) and a mounting box (12), the mounting box (12) being positioned above the base (11); A polishing processing unit is provided below the mounting box (12). The polishing processing unit includes a polishing plate (23), a circular protective cover (21) covering the outside of the polishing plate (23), and a drive motor (213). The drive motor (213) is used to drive the polishing plate (23) to rotate. An absorption cavity (24) is provided inside the circular protective cover (21). Several absorption slots (25) communicating with the absorption cavity (24) are provided on the bottom periphery of the circular protective cover (21). During the polishing process of the semiconductor substrate, the absorption slots (25) absorb excess particles and polishing liquid. The base (11) is provided with a placement plate (16), the placement plate (16) is provided with a positioning plate (29), the positioning plate (29) is provided with a positioning groove (210) for positioning the semiconductor substrate, the upper surface of the base (11) is provided with a temperature sensing component (17), the temperature sensing component (16) is connected to the equipment control system, and the control system is electrically connected to the drive motor (213) to adjust the rotation speed of the polishing plate (23) to prevent the semiconductor substrate from overheating during the polishing process.

2. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 1, characterized in that, The circular shield (21) is provided with a suction tube (26) and a suction assembly (27). The suction assembly (27) is connected to the absorption chamber (24) through the suction tube (26). Excess particles and polishing liquid enter the suction assembly (27) through the suction tube (26) in the absorption chamber (24).

3. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 2, characterized in that, The polishing plate (23) is provided with a conveying port (216), and the circular cover (21) is provided with a conveying pipe. The conveying pipe conveys polishing liquid to the bottom of the polishing plate (23) through the conveying port (216).

4. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 3, characterized in that, The circular cover (21) is provided with multiple sets of adjusting rods (28). The polishing plate (23) is installed inside the circular cover (21) through the adjusting rods (28). The adjusting rods (28) are used to adjust the height of the polishing plate (23) inside the circular cover (21) to adapt to the cooling chip substrates of different thicknesses.

5. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 4, characterized in that, The positioning plates (29) are provided in multiple sets and are arranged in a ring array on the placement plate (16), and the positioning slots (210) are provided in multiple sets and are arranged in a ring array on the positioning plates (29).

6. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 1, characterized in that, A connecting plate (22) is provided on the circular cover (21), and a connecting bracket (215) is installed on the connecting plate (22). A rotating shaft one (211) and a rotating shaft two (212) are connected on the connecting bracket (215), and the rotating shaft one (211) and the rotating shaft two (212) are connected in a transmission.

7. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 6, characterized in that, The drive motor (213) is installed inside the mounting box (12). The mounting box (12) is also equipped with a lifting assembly (214). The drive motor (213) drives the rotation of the first rotating shaft (211) and the second rotating shaft (212). The lifting assembly (214) drives the lifting of the first rotating shaft (211) and the second rotating shaft (212), thereby achieving the lifting and adjustment of the circular cover (21) and the polishing plate (23).

8. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 1, characterized in that, Multiple sets of positioning brackets (13) are adjustablely mounted on the base (11) via mounting base (14). Multiple sets of positioning wheels (15) are rotatably mounted on the positioning brackets (13). The positioning wheels (15) fit against the side of the circular cover (21). The positioning brackets (13) are also provided with arc-shaped grooves that match the circular cover (21).

9. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 8, characterized in that, When the temperature sensing component (17) detects that the temperature of the semiconductor substrate is greater than the preset temperature range, it controls the speed of the drive motor (213) to decrease; when the detected temperature is less than the preset temperature range, it controls the drive motor (213) to resume the initial processing speed.

10. The substrate processing equipment for producing semiconductor refrigeration wafers according to claim 9, characterized in that, The temperature sensing component (17) is a non-contact infrared temperature sensor, with its detection end facing the semiconductor substrate placement area on the positioning plate (29).

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