Processing method of back drill stub of circuit board

Abstract

The invention provides a processing method for a back drill stub of a circuit board, and relates to the technical field of high-frequency and high-speed printed circuit boards, and the method comprises the steps: scanning an object code label on a to-be-processed circuit board through a numerical control drilling machine, reading back drill processing data carried in the object code label, the back drilling processing data comprises the actual plate thickness of the position of each back drilling hole in the circuit board to be processed, the theoretical plate thickness of the circuit board to be processed and the theoretical depth control value; converting the back drilling processing data into an actual depth control value corresponding to each back drilling hole by using a back drilling depth conversion formula; the position information and the actual depth control value corresponding to each back drilling hole are written into a back drilling zone; and controlling the numerical control drilling machine to perform back drill stub processing on the circuit board to be processed according to the back drill band. The actual hole depth values of different back drilling holes are determined by measuring the actual board depth of the back drilling holes of the circuit board, the influence of the thickness deviation of the substrate can be eliminated, the consistency of the back drilling depth is ensured, an inner layer channel is prevented from being damaged, and the reliability of the circuit board is improved.

Description

Technical Field

[0001] This application relates to the field of high-frequency and high-speed printed circuit board technology, and in particular to a method for processing back-drilled residual posts of a circuit board. Background Technology

[0002] In PCB manufacturing, vias in multilayer PCBs are used to connect lines on different layers. However, when a signal only needs to be transmitted between a few PCB layers, the vias penetrating the metal walls of the extra layers will form stubs. As the signal rate increases, the rise edge becomes steeper and contains more high-frequency components, making it more sensitive to back-drilled stubs.

[0003] The ultimate goal of back-drilling is to ensure that the residual length of all vias is consistent and sufficiently short (ideally zero). Existing back-drilling technology can only provide overall compensation for back-drilled holes of the same diameter. However, due to the influence of board thickness consistency, the board thickness will inevitably differ at different locations for back-drilled holes of the same diameter. This is unavoidable, which will eventually lead to inconsistencies in the residual length of back-drilled holes of the same diameter. Since high-speed signals are extremely sensitive to timing and reflection, inconsistencies in residual length will introduce time delay differences in via components, increase channel bit error rate, and reduce the stability of PCB applications. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide at least one method for processing back-drilled residual studs of circuit boards, which compensates for the back-drilling depth control by considering the influence of circuit board thickness on the back-drilling depth processing accuracy, thereby improving the back-drilling processing accuracy.

[0005] This application mainly includes the following aspects: In a first aspect, embodiments of this application provide a method for processing back-drilled residual studs on a circuit board. The method includes: scanning a code label on the circuit board to be processed using a CNC drilling machine, reading back-drilling processing data carried in the code label, the back-drilling processing data including the actual board thickness at the location of each back-drilled hole on the circuit board to be processed, the theoretical board thickness of the circuit board to be processed, and the theoretical control depth value; using a back-drilling depth conversion formula to convert the back-drilling processing data into the actual control depth value corresponding to each back-drilled hole; writing the location information and actual control depth value corresponding to each back-drilled hole into the back-drilling drill strip; and controlling the CNC drilling machine to process the back-drilled residual studs on the circuit board to be processed according to the back-drilling drill strip.

[0006] In one possible implementation, a material code label corresponding to the circuit board to be processed is generated in the following way: obtaining the position information corresponding to each back drill hole on the circuit board to be processed based on the model number of the circuit board to be processed; controlling a thickness measuring instrument to scan the actual board thickness at the location of each back drill hole on the circuit board to be processed based on the position information corresponding to each back drill hole; generating back drilling processing data corresponding to the circuit board to be processed based on the actual board thickness at the location of each back drill hole, the theoretical board thickness of the circuit board to be processed, and the theoretical control depth value; generating a material code label corresponding to the back drilling processing data and printing it onto a preset area of ​​the circuit board to be processed.

[0007] In one possible implementation, the back-drilling depth conversion formula is:

[0008] in, This indicates the actual control depth value corresponding to the back-drilled hole. This represents the theoretical depth control value corresponding to the back-drilled hole. This indicates the actual plate thickness at the location of the back-drilled hole. This indicates the theoretical thickness of the circuit board to be processed.

[0009] In one possible implementation, a CNC drilling machine carries multiple circuit boards of the same model to be processed, and the CNC drilling machine is equipped with drill bits of different diameters. The step of controlling the CNC drilling machine to perform back-drilling piling on the circuit boards to be processed according to the back-drilling strip includes: selecting a first manufactured circuit board from the multiple circuit boards to be processed; starting multiple target drill bits corresponding to the first manufactured circuit board; controlling the multiple target drill bits to perform back-drilling piling on the first manufactured circuit board according to the back-drilling strip to obtain the processed first manufactured circuit board and obtain its corresponding processing result data; using the processing result data to perform tool compensation on the multiple target drill bits to generate a tool compensation strip; integrating the tool compensation strip into the back-drilling strip, and using the updated back-drilling strip to batch process the remaining circuit boards to be processed except for the first manufactured circuit board.

[0010] In one possible implementation, the first-piece manufactured circuit is back-drilled for piling by: for each target drill bit: identifying at least one back-drilled hole on the first-piece manufactured circuit board with the same specifications as the target drill bit; and, based on the back-drilled drill tape, using the target drill bit to perform back-drilled piling on at least one back-drilled hole to obtain the finished first-piece manufactured circuit board.

[0011] In one possible implementation, the tool compensation strip is generated as follows: the machined first-piece manufactured circuit board is sliced ​​to obtain machining result data, which includes the machining depth corresponding to each back drill hole; for each back drill hole, the machining depth corresponding to the back drill hole is compared with the actual control depth value, and the control depth error corresponding to the back drill hole is calculated; for each target drill bit, the average control depth error of at least one back drill hole corresponding to the target drill bit is calculated; and the tool compensation strip is generated from the average control depth error corresponding to each target drill bit.

[0012] In one possible implementation, the step of integrating a tool compensation tape into a back drill tape and using the updated back drill tape to batch process the remaining circuit boards to be processed, excluding the first manufactured circuit board, includes: reading the average depth control error recorded by the tool compensation tape for each target drill bit; for each back drill hole corresponding to each target drill bit, determining the difference between the actual depth control value of the back drill hole and the average depth control error corresponding to the target drill bit as the compensated depth control value of the back drill hole; updating the actual depth control value corresponding to the back drill tape using the compensated depth control value of each back drill hole; and batch processing the remaining circuit boards to be processed using the compensated depth control value of each back drill hole.

[0013] Secondly, embodiments of this application also provide a processing apparatus for back-drilled residual studs on a circuit board. The apparatus includes: a scanning module, used to scan the code label on the circuit board to be processed using a CNC drilling machine, and read the back-drilling processing data carried in the code label. The back-drilling processing data includes the actual board thickness at the location of each back-drilled hole on the circuit board to be processed, the theoretical board thickness of the circuit board to be processed, and the theoretical control depth value; a conversion module, used to convert the back-drilling processing data into the actual control depth value corresponding to each back-drilled hole using a back-drilling depth conversion formula; a writing module, used to write the location information and actual control depth value corresponding to each back-drilled hole into the back-drilling drill strip; and a processing module, used to control the CNC drilling machine to process the back-drilled residual studs on the circuit board to be processed according to the back-drilling drill strip. Thirdly, embodiments of this application also provide an electronic device, including: a processor, a memory, and a bus. The memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate via the bus. The machine-readable instructions are executed by the processor to perform the steps of the back-drilling residual post processing method of the circuit board in the first aspect or any possible implementation of the first aspect.

[0014] Fourthly, embodiments of this application also provide a computer-readable storage medium storing a computer program, which, when executed by a processor, performs the steps of the back-drilling residual stud processing method for a circuit board in the first aspect or any possible implementation of the first aspect.

[0015] This application provides a method for processing back-drilled residual stubs on a circuit board. The method includes: scanning a material code label on the circuit board to be processed using a CNC drilling machine, reading the back-drilling processing data carried in the material code label, the back-drilling processing data including the actual board thickness at the location of each back-drilled hole on the circuit board to be processed, the theoretical board thickness of the circuit board to be processed, and the theoretical control depth value; using a back-drilling depth conversion formula, converting the back-drilling processing data into the actual control depth value corresponding to each back-drilled hole; writing the location information and actual control depth value corresponding to each back-drilled hole into the back-drilling drill tape; and controlling the CNC drilling machine to process the back-drilled residual stubs on the circuit board to be processed according to the back-drilling drill tape. By measuring the actual board depth of the back-drilled holes on the circuit board to determine the actual hole depth value of different back-drilled holes, the influence of substrate thickness deviation can be eliminated, ensuring the consistency of back-drilling depth, avoiding damage to inner layer channels, and improving the reliability of the circuit board.

[0016] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A flowchart illustrating a method for processing back-drilled residual studs of a circuit board according to an embodiment of this application is provided. Figure 2 This illustration shows a schematic diagram of a back-drilled residual pile processing method provided in an embodiment of this application; Figure 3 This illustration shows a schematic diagram of an etching allowance provided in an embodiment of this application; Figure 4 A flowchart illustrating a batch back-drilling process for circuit boards according to an embodiment of this application is shown. Figure 5 This paper illustrates a functional block diagram of a back-drilled residual stud processing device for a circuit board according to an embodiment of this application. Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It should be understood that the drawings in this application are for illustrative and descriptive purposes only and are not intended to limit the scope of protection of this application. Furthermore, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate operations implemented according to some embodiments of this application. It should be understood that the operations in the flowcharts may not be implemented in sequence, and steps without logical contextual relationships may be reversed or implemented simultaneously. In addition, those skilled in the art, guided by the content of this application, may add one or more other operations to the flowcharts, or remove one or more operations from the flowcharts.

[0020] Furthermore, the described embodiments are merely some, not all, of the embodiments of this application. The components of the embodiments of this application described and illustrated herein can typically be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] In PCB manufacturing, vias in multilayer PCBs are used to connect traces on different layers. However, when a signal only needs to be transmitted between a few PCB layers, the via penetrating the metal walls of the extra layers creates a stub. The higher the signal speed, the steeper the rise time and the richer the high-frequency components, making it more sensitive to back-drilled stubs. At speeds above 10Gbps, especially in 56G / 112G systems using PAM4 modulation, the impact of stubs is fatal. When a signal encounters an impedance discontinuity (open circuit) at the end of a stub, energy is reflected back onto the main signal path. This reflected signal superimposed on the original signal causes inter-symbol interference, leading to waveform distortion and eye diagram closure. A stub itself has a specific electrical length, and at certain frequency points, it resonates like a tuning fork. When the signal frequency approaches its resonant frequency, it generates very strong reflections and insertion losses, severely degrading signal quality.

[0022] In devices such as AI servers, core routers, and high-speed switches, the bit error rate of data must be extremely low. Back drilling is a key process for solving residual pile interference in high-speed signal transmission. Its core objective is to remove unused metal portions of the hole walls in vias, thereby improving signal integrity and directly reducing the system's bit error rate, ensuring the long-term stable operation of the equipment.

[0023] The ultimate goal of back drilling is to ensure that the length of the residual piles in all through holes is consistent and sufficiently short (ideally zero). Differences in plate thickness directly affect the achievement of this goal. Specifically, for a large, thick plate, if the core plate itself has poor thickness uniformity, or if slight thickness variations occur during lamination, then the same depth value set during back drilling will result in different residual pile lengths removed in different areas, leading to poor consistency of residual piles within the plate. When there are differences in the actual thickness within the plate, the following problems arise: In thicker areas, the back-drilling depth is relatively shallow, which cannot completely remove the required length of the residual stake, resulting in "shallow drilling" and an excessively long residual stake. In thinner areas, the same back-drilling depth will result in drilling deeper, possibly over-drilling. This not only completely removes the residual stake but may even "drill through" useful signal copper or inner layer circuitry, causing an open circuit, rendering the product unusable.

[0024] High-speed signals are extremely sensitive to timing and reflection; inconsistencies in the length of residual piles will directly lead to the following problems: Inter-channel skew (delay difference): For multiple differential pairs in a parallel bus (such as DDR) or a high-speed serial link, vias with different stud lengths will introduce additional delay differences, disrupting strict timing relationships.

[0025] Inconsistent reflected noise: Residual stakes of different lengths will resonate and reflect at different frequency points, which makes it impossible for signal integrity engineers to use a unified model to predict and optimize the performance of the entire board. The bit error rate of some channels will be much higher than that of other channels.

[0026] Reduced system stability: This unpredictable performance fluctuation makes the system more prone to errors under marginal conditions such as high temperature and voltage fluctuation.

[0027] Based on this, this application provides a method for processing back-drilled residual studs on a circuit board. By considering the influence of the circuit board thickness on the back-drilling depth processing accuracy, the method compensates for the back-drilling depth control, thereby improving the back-drilling processing accuracy. Specifically, as follows: Please see Figure 1 , Figure 1 This is a flowchart illustrating a method for processing back-drilled residual posts on a circuit board according to an embodiment of this application. For example... Figure 1 As shown, the method provided in this application embodiment includes the following steps: S100: Scan the code label on the circuit board to be processed using a CNC drilling machine, and read the back drilling processing data carried in the code label.

[0028] The back-drilling processing data includes the actual board thickness at the location of each back-drilled hole on the circuit board to be processed, the theoretical board thickness of the circuit board to be processed, and the theoretical depth control value. S200. Using the back drill depth conversion formula, the back drill processing data is converted into the actual control depth value corresponding to each back drill hole.

[0029] S300: Write the location information and actual control depth value corresponding to each back drill hole into the back drill strip.

[0030] S400 controls the CNC drilling machine to process the back-drilling residual piles of the circuit board to be processed according to the back-drilling drill belt.

[0031] In step S100, a code label is formed in advance on the edge area of ​​the circuit board to be processed by laser printing. The code label is the identification of the circuit board to be processed. For example, the code label is a QR code or a barcode. The specific form of the code label is not shown here. The code label carries the back drilling processing data corresponding to the circuit board to be processed.

[0032] In this application, since the CNC drilling machine has multiple control axes, the circuit board to be processed is randomly placed on one of the corresponding control axes. Therefore, in order to ensure that the control depth value of each control axis in the converted back drilling strip corresponds to the circuit board to be processed, this application uses a code label for error prevention. That is, the code label of the circuit board to be processed carried on the control axis is scanned one by one by a scanning device such as a barcode scanner to establish a mapping relationship between the control axis and the circuit board to be processed and its corresponding back drilling processing data, so as to facilitate the subsequent conversion of the actual control depth value corresponding to the circuit board to be processed under each control axis.

[0033] In a preferred embodiment, under the above-described implementation, the method for generating a material code label corresponding to a circuit board to be processed provided by this application embodiment is as follows: By obtaining the location information of each back-drilled hole on the circuit board to be processed according to the corresponding model, the thickness measuring instrument (such as a laser detector) is controlled to scan the actual board thickness at the location of each back-drilled hole on the circuit board to be processed based on the actual board thickness at the location of each back-drilled hole, the theoretical board thickness of the circuit board to be processed, and the theoretical depth control value, back-drilling processing data corresponding to the circuit board to be processed is generated. A material code label corresponding to the back-drilling processing data is generated and printed to a preset area of ​​the circuit board to be processed (the edge area of ​​the board, for example).

[0034] In a preferred embodiment, in step S200, the back drilling depth conversion formula is:

[0035] in, This indicates the actual control depth value corresponding to the back-drilled hole. This represents the theoretical depth control value corresponding to the back-drilled hole. This indicates the actual plate thickness at the location of the back-drilled hole. This indicates the theoretical thickness of the circuit board to be processed. Specifically, for the same circuit board, the theoretical thickness is consistent at all locations throughout the entire circuit board.

[0036] In a preferred embodiment, please refer to Figure 2 , Figure 2 A schematic diagram of a back-drilled residual pile processing method provided in an embodiment of this application is shown. Figure 2 As shown, this application provides a method for determining the theoretical depth control value corresponding to the back-drilled hole using the following formula. :

[0037] Among them, such as Figure 2 As shown, This represents the theoretical total thickness between the back-drilling face and the unpenetrable layer. The maximum residual pile depth specified by the customer. The minimum residual pile depth specified for the customer (typically 2 mil). This indicates the amount of etching allowance. For details, please refer to [link / reference]. Figure 3 , Figure 3 This diagram illustrates an etching allowance provided in an embodiment of this application. The etching allowance depends on the processing stage of the circuit board. Specifically, when the circuit board is back-drilled after plating, the etching allowance is set to 2 mil (0.05 mm); when the circuit board is back-drilled before plating, the etching allowance is set to 1 mil (0.025 mm); and when the circuit board is back-drilled after solder masking, the etching allowance is set to 0 mil.

[0038] In this application, non-drillable layers and mandatory drillable layers are defined according to actual needs.

[0039] Indicates an invalid depth, specifically:

[0040] in, Indicates the diameter of the hole drilled by back drilling. This indicates the drill tip angle, where if the drill bit is a fluting cutter, then... Take 165°, and for drill bits other than grooving tools, generally take 130°.

[0041] In step S300, specifically, after determining the actual control depth value corresponding to each back drill hole on the circuit board to be processed, the position information and actual control depth value corresponding to each back drill hole on the circuit board to be processed are written into the axis machining array of the control axis to which the circuit board to be processed belongs in the back drill tape.

[0042] In a preferred embodiment, the CNC drilling machine carries multiple circuit boards of the same model to be processed and drill bits of different diameters. For details, please refer to [link to specific documentation]. Figure 4 , Figure 4 A flowchart illustrating a batch back-drilling process for circuit boards according to an embodiment of this application is shown. Figure 4 As shown, step S400 includes: S4001. Select the first circuit board to be manufactured from a plurality of circuit boards to be processed.

[0043] S4002, activate multiple target drills corresponding to the first manufactured circuit board.

[0044] S4003. Control multiple target drill bits to perform back-drilling residual pile processing on the first manufactured circuit board according to the back-drilling strip, obtain the processed first manufactured circuit board and acquire its corresponding processing result data.

[0045] S4004. Use the machining result data to perform tool compensation on multiple target drill bits and generate a tool compensation band.

[0046] S4005. Integrate the tool compensation tape into the back drill tape, and use the updated back drill tape to batch process the remaining circuit boards to be processed, excluding the first manufactured circuit board.

[0047] In steps S4001 to S4005, for the back drilling processing of the same batch of circuit boards, multiple control axes under the CNC drilling machine respectively carry multiple circuit boards of the same model to be processed. In order to meet the back drilling accuracy requirements, this application considers the error brought by the drill bit used in the back drilling process to the processing process. Before the formal mass production of the circuit boards to be processed, a circuit board is selected from multiple circuit boards to be processed as the first manufactured circuit board. The processing results of the first manufactured circuit board are used to compensate the drill bit, so as to ensure the accuracy of subsequent mass production.

[0048] In step S4002, the model of the circuit board to be processed is different, and the drill bit set (including multiple drill bits) used for back drilling is also different. Different drill bits correspond to different drilling diameters. Therefore, after selecting the first manufactured circuit board, this application needs to start the target drill bit set corresponding to the first manufactured circuit board, that is, start multiple target drill bits. Multiple target drill bits are adapted to the diameter of the back drill hole on the first manufactured circuit board.

[0049] In a preferred embodiment, step S4003 includes: For each target drill bit: identify at least one back drill hole with the same specifications as the target drill bit on the first manufactured circuit board. Based on the back drill tape, use the target drill bit to perform back drill residue processing on at least one back drill hole to obtain the processed first manufactured circuit board.

[0050] In the specific embodiments provided in this application, the axis machining array corresponding to the control axis of the first manufactured circuit board is read from the back drill tape. The target drill bit is used to process each back drill hole below it, using the position information and actual control depth value of the back drill hole below the target drill bit recorded in the axis machining array, until the processing of the corresponding back drill hole below the target drill bit is completed, and the processing of the first manufactured circuit board ends, and the processed first manufactured circuit board is obtained.

[0051] In this application, the back-drilling process for the remaining circuit boards to be processed, excluding the first manufactured circuit board, is similar to step S4003, and will not be described in detail here.

[0052] In a preferred embodiment, step S4004 includes: The first manufactured circuit board is sliced ​​to obtain processing result data, which includes the drilling depth corresponding to each back drill hole.

[0053] In a preferred embodiment, step S4005 includes: For each back drill hole, the machining depth corresponding to the back drill hole is compared with the actual control depth value, and the control depth error corresponding to the back drill hole is calculated. For each target drill bit, the average control depth error of at least one back drill hole corresponding to the target drill bit is calculated. The tool compensation band is generated from the average control depth error corresponding to each target drill bit.

[0054] Among them, the tool compensation band is a text file for tool compensation, and the depth control error is the difference between the machining drilling depth and the actual depth control value.

[0055] In a preferred embodiment, step S4005 further includes: The average depth control error of each target drill bit recorded in the tool compensation tape is read. For each back drill hole corresponding to each target drill bit, the difference between the actual depth control value of the back drill hole and the average depth control error of the target drill bit is determined as the compensation depth control value of the back drill hole. The actual depth control value in the back drill tape is updated using the compensation depth control value of each back drill hole. The remaining circuit boards to be processed are batch-processed using the compensation depth control value of each back drill hole.

[0056] In one specific embodiment, assuming the average depth control error is B, if B is less than zero, it indicates that the machining depth is less than the actual depth control value A, meaning that the machining depth of the back-drilled hole has not yet reached the actual depth control value A, and it needs to be increased based on the actual depth control value A. That is, the updated actual depth control value = A + =AB.

[0057] If B equals zero, it means that the machining depth is equal to the actual control depth value A. That is, the machining section of the back drill hole has not reached the actual control depth value A, indicating that the tool has not suffered tool loss and there is no need to adjust the actual control depth value of the corresponding back drill hole under the tool.

[0058] In another preferred embodiment, if B is greater than zero, it indicates that the drilling depth is greater than the actual control depth value A. That is, the machining depth of the back-drilled hole has not yet exceeded the actual control depth value A, and it needs to be reduced based on the actual control depth value A. That is, the updated actual control depth value = A - =AB.

[0059] Based on the same application concept, this application also provides a processing device for back-drilled residual studs of circuit boards, which corresponds to the processing method for back-drilled residual studs of circuit boards provided in the above embodiments. Since the principle of the device in this application is similar to the processing method for back-drilled residual studs of circuit boards in the above embodiments of this application, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be described again.

[0060] Please see Figure 5 , Figure 5 This diagram illustrates a functional block diagram of a back-drilled residual stud processing device for a circuit board according to an embodiment of this application. Figure 5 As shown, the device includes: The scanning module 500 is used to scan the code label on the circuit board to be processed by the CNC drilling machine and read the back drilling processing data carried in the code label. The back drilling processing data includes the actual board thickness at the location of each back drilling hole on the circuit board to be processed, the theoretical board thickness of the circuit board to be processed, and the theoretical control depth value. The conversion module 510 is used to convert back drill processing data into the actual control depth value corresponding to each back drill hole by applying the back drill depth conversion formula. The writing module 520 is used to write the position information and actual control depth value corresponding to each back drill hole into the back drill strip. The processing module 530 is used to control the CNC drilling machine to process the back drill residue of the circuit board to be processed according to the back drill strip.

[0061] Based on the same application concept, please refer to Figure 6 , Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. Figure 6 As shown, the electronic device 60 includes a processor 601, a memory 602, and a bus 603. The memory 602 stores machine-readable instructions that can be executed by the processor 601. When the electronic device 60 is running, the processor 601 and the memory 602 communicate through the bus 603. The machine-readable instructions are executed by the processor 601 to perform the steps of the back-drilling residual pile processing method of the circuit board provided in any of the above embodiments.

[0062] Based on the same concept, this application also provides a computer-readable storage medium storing a computer program, which, when run by a processor, executes the steps of the back-drilling residual stake processing method for the circuit board provided in the above embodiments.

[0063] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems and devices described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division; in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the displayed or discussed mutual coupling or direct coupling or communication connection may be through some communication interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.

[0064] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0065] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0066] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0067] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for processing back-drilled residual studs on a circuit board, characterized in that, The method includes: The CNC drilling machine scans the material code label on the circuit board to be processed and reads the back drilling processing data carried in the material code label. The back drilling processing data includes the actual board thickness at the location of each back drilling hole on the circuit board to be processed, the theoretical board thickness of the circuit board to be processed, and the theoretical control depth value. The back drill depth conversion formula is used to convert the back drill processing data into the actual control depth value corresponding to each back drill hole. Write the location information and actual control depth value corresponding to each back drill hole into the back drill strip; The CNC drilling machine is controlled to perform back-drilling residual pile processing on the circuit board to be processed according to the back-drilling strip.

2. The method according to claim 1, characterized in that, The component code label corresponding to the circuit board to be processed is generated in the following manner: By identifying the corresponding model of the circuit board to be processed, obtain the position information of each back-drilled hole on the circuit board to be processed; Based on the location information corresponding to each back drill hole, control the thickness measuring instrument to scan the actual board thickness at the location of each back drill hole on the circuit board to be processed. The back-drilling processing data corresponding to the circuit board to be processed is generated from the actual board thickness at the location of each back-drill hole, the theoretical board thickness of the circuit board to be processed, and the theoretical control depth value. Generate a code label corresponding to the back-drilling data and print it onto a preset area of ​​the circuit board to be processed.

3. The method according to claim 1, characterized in that, The formula for converting back drilling depth is: in, This indicates the actual control depth value corresponding to the back-drilled hole. This represents the theoretical depth control value corresponding to the back-drilled hole. This indicates the actual plate thickness at the location of the back-drilled hole. This indicates the theoretical thickness of the circuit board to be processed.

4. The method according to claim 1, characterized in that, The CNC drilling machine carries multiple circuit boards of the same model to be processed, and the CNC drilling machine is equipped with drill bits of different diameters. The steps of controlling the CNC drilling machine to process the back-drilled residual piles of the circuit board to be processed according to the back-drilling strip include: Select the first circuit board from a list of circuit boards to be processed for manufacturing; Start the multiple target drills corresponding to the first manufactured circuit board; Control the multiple target drill bits to perform back-drilling residual pile processing on the first manufactured circuit board according to the back-drilling strip, obtain the processed first manufactured circuit board and acquire its corresponding processing result data; The machining result data is used to perform tool compensation on the multiple target drill bits to generate a tool compensation band; The tool compensation tape is integrated into the back drill tape, and the updated back drill tape is used to batch process the remaining circuit boards to be processed, excluding the first piece manufactured circuit board.

5. The method according to claim 4, characterized in that, The first-piece manufactured circuit is back-drilled for residual piling in the following manner: For each target drill bit: Identify at least one back drill hole on the first manufactured circuit board that has the same specifications as the target drill bit; Based on the back drill strip, the target drill bit is used to process the back drill residue of the at least one back drill hole to obtain the processed first piece of manufactured circuit board.

6. The method according to claim 4, characterized in that, The tool compensation strip and drill strip are generated in the following way: The first manufactured circuit board is sliced ​​to obtain the processing result data, which includes the drilling depth corresponding to each back drill hole. For each back drill hole, the corresponding machining depth is compared with the actual control depth value, and the control depth error corresponding to the back drill hole is calculated. For each target drill bit, the average depth control error of at least one back drill hole corresponding to that target drill bit is calculated. The tool compensation band is generated from the average depth control error corresponding to each target drill bit.

7. The method according to claim 4, characterized in that, The steps of integrating the tool compensation tape into the back drill tape and using the updated back drill tape to batch process the remaining circuit boards excluding the first manufactured circuit board include: Read the average depth control error of each target drill bit recorded by the tool compensation band; For each back drill hole corresponding to each target drill bit, the difference between the actual depth control value of the back drill hole and the average depth control error corresponding to the target drill bit is determined as the compensation depth control value of the back drill hole. Update the actual depth control value corresponding to the back drill strip using the compensated depth control value of each back drill hole; The remaining circuit boards to be processed are batch-processed using the compensation depth control value of each back-drilled hole.

8. A processing device for back-drilled residual studs of a circuit board, characterized in that, The device includes: The scanning module is used to scan the code label on the circuit board to be processed by a CNC drilling machine and read the back drilling processing data carried in the code label. The back drilling processing data includes the actual board thickness at the location of each back drilling hole on the circuit board to be processed, the theoretical board thickness of the circuit board to be processed, and the theoretical control depth value. The conversion module is used to convert the back drill processing data into the actual control depth value corresponding to each back drill hole using the back drill depth conversion formula. The writing module is used to write the location information and actual control depth value corresponding to each back drill hole into the back drill strip; The processing module is used to control the CNC drilling machine to process the back drill residue of the circuit board to be processed according to the back drill strip.

9. An electronic device, characterized in that, include: The device includes a processor, a memory, and a bus. The memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor communicates with the memory via the bus. The machine-readable instructions are executed by the processor to perform the steps of the back-drilling residual post processing method for a circuit board as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, performs the steps of the method for processing back-drilled studs of a circuit board as described in any one of claims 1 to 7.

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