Cleaning device for semiconductor plastic package mold and control method of cleaning device

Abstract

The invention provides a cleaning device for a semiconductor plastic package mold and a control method of the cleaning device. The cleaning device comprises a supporting frame, an execution assembly, a driving assembly, an air blowing assembly and an air suction assembly. The execution assembly comprises a middle plate, a sliding fit module, a bearing plate and a brush plate. The driving assembly comprises a motor, a rotating shaft and an eccentric wheel which is connected with the bearing plate in a matched mode. In the cleaning process, the brush plates on the two sides and the upper mold and the lower mold of the plastic package mold form a relatively sealed environment, the motor drives the rotating shaft to rotate, the eccentric wheel on the rotating shaft drives the bearing plates and the brush plates on the two sides to swing so as to clean residues on the surface of the plastic package mold in an all-dimensional mode, and meanwhile the blowing assembly blows up the residues through all the blowing holes. And the air suction assembly sucks and removes blown residues from the air suction holes and the dust suction cavities, so that the cleaning effect and efficiency are greatly improved, the dimensional precision and cleanliness of subsequent packaged products are guaranteed, stable operation of a mold is maintained, and the requirement of a high-precision semiconductor plastic packaging process is met.

Description

Technical Field

[0001] This invention relates to the field of semiconductor molding compound technology, and more particularly to a cleaning device and control method for semiconductor molding compound molds. Background Technology

[0002] Semiconductor molding is a critical process in semiconductor packaging. The process involves placing the internally bonded chip frame or substrate into a specialized molding die, encapsulating it with molten epoxy molding compound, and then heating, pressurizing, and curing to form a protective package. During this process, molten epoxy molding compound is prone to overflow, and the resulting epoxy residue adheres to the inner wall of the molding die cavity. If this residue is not removed promptly, it will directly affect the dimensional accuracy and sealing performance of subsequent packaged products, and will also impair the long-term stable operation of the die. Therefore, reliable cleaning of the molding die cavity is an indispensable part of the molding process.

[0003] Currently, mainstream plastic sealing mold cleaning solutions in the industry employ cleaning devices with air blowing or suction functions, combined with brushes to perform physical cleaning. However, existing cleaning technologies have many shortcomings and are difficult to meet the cleaning requirements of high-precision packaging: Firstly, existing cleaning devices can usually only achieve a single blowing or suction action. If only blowing is used for cleaning, the airflow will cause the residue to be scattered irregularly around the mold area, which will not only interfere with the normal operation of the equipment, but also pollute the production environment and reduce the cleanliness of subsequent products. Secondly, the movement trajectory of the matching brush is simple, and it can only extend into the mold cavity in a fixed direction. The cleaning action is rigid, which means that the corners, gaps and other areas of the mold cavity cannot be effectively covered, resulting in cleaning dead spots. Third, most of the brushes are roller-type structures with unreasonable installation layouts. During the cleaning process, a relatively sealed cleaning space cannot be formed between the brush and the wall of the molding die cavity. On the one hand, when performing suction cleaning, external air will rush in through the gap between the brush and the die, resulting in a decrease in the vacuum level of the target cleaning area, dispersion of suction, and a significant decrease in the efficiency of capturing and removing residues. On the other hand, when performing blowing cleaning, if the blowing air pressure is increased to improve the cleaning power, due to the lack of a sealed space, the airflow will carry the unremoved residues out from the gap between the brush and the die, further aggravating the problem of residue scattering and pollution. Summary of the Invention

[0004] One objective of this invention is to address the shortcomings of existing technologies by providing a cleaning device for semiconductor molding compounds, which effectively improves the cleaning efficiency and effect of molding compounds and meets the requirements of high-precision semiconductor molding compounding processes.

[0005] A second objective of this invention is to provide a control method for a cleaning device for semiconductor molding compounds, which effectively improves the cleaning efficiency and effect of the molding compounds and meets the requirements of high-precision semiconductor molding processes.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: According to a first aspect of the present invention, a cleaning apparatus for semiconductor molding compounds is provided, the cleaning apparatus for semiconductor molding compounds comprising a support frame, an actuating component, a driving component, an air blowing component, and an air suction component.

[0007] The execution component is located inside the support frame. The execution component includes a middle plate, and sliding engagement modules, a support plate, and a brush plate arranged sequentially on the upper and lower sides of the middle plate away from the middle plate. The sliding engagement modules on the upper side of the middle plate are arranged along a first direction, and the sliding engagement modules on the lower side of the middle plate are arranged along a second direction. A dust collection chamber is provided between the brush plate and the corresponding support plate. The brush plate is provided with a plurality of air blowing holes and a plurality of air suction holes, and each air suction hole is connected to the corresponding dust collection chamber.

[0008] The drive assembly includes a motor, a rotating shaft, and two eccentric wheels. The motor is mounted on the support frame, and the rotating shaft is mounted vertically on the support frame. The motor drives the rotating shaft. The two eccentric wheels are spaced apart on the rotating shaft, and the geometric center axes of the two eccentric wheels are parallel to the center axis of the rotating shaft. The two eccentric wheels are respectively connected to the bearing plates on both sides.

[0009] The air blowing assembly is connected to each air blowing hole.

[0010] The suction assembly is connected to each suction chamber.

[0011] During the cleaning process, the brush plates on the upper and lower sides form a relatively sealed environment with the upper and lower molds of the molding die, respectively. The motor drives the rotating shaft to rotate, and the two eccentric wheels on the rotating shaft drive the bearing plates and brush plates on both sides to swing, so as to clean the residue on the surface of the molding die. At the same time, the blowing assembly blows the residue through each blowing hole, and the suction assembly sucks the blown residue from each suction hole and each suction chamber.

[0012] Preferably, the sliding fit module includes a slide rail and a slider that can be slidably fitted, the slide rail being disposed on one of the intermediate plate and the corresponding support plate, and the slider being disposed on the other of the intermediate plate and the corresponding support plate.

[0013] Preferably, each bearing plate has a mating hole on its side, and a bearing is installed in the mating hole, with each eccentric wheel rotatably installed in the corresponding bearing.

[0014] Preferably, the structure of the brush plates on the upper and lower sides matches the structure of the upper and lower molds of the molding die, respectively.

[0015] Preferably, the air blowing assembly includes a high-pressure gas system, an air blowing pipe, a nozzle, and a control valve. The nozzle is disposed in a corresponding air blowing hole, the nozzle is connected to the high-pressure gas system through the air blowing pipe, and the control valve is disposed on the air blowing pipe.

[0016] Preferably, the suction assembly includes a vacuum system, a suction pipe, and a filter, wherein the suction pipe is connected to each dust collection chamber, and the filter is disposed between the suction pipe and the vacuum system.

[0017] Preferably, the suction pipe includes a main suction pipe and several suction branch pipes; the suction assembly also includes a manifold box, which has an air outlet and several air inlets. The air outlet is connected to the vacuum system through the main suction pipe, the filter is disposed on the main suction pipe, and the several air inlets are respectively connected to the corresponding dust collection chambers through each suction branch pipe.

[0018] Preferably, the support plate has a connecting cavity, which is connected to the corresponding air suction pipe and the corresponding dust suction chamber.

[0019] Preferably, the cleaning device for semiconductor molding die further includes a mounting assembly, which includes a mounting frame, a linear motion module, a moving frame, and a lifting module. The mounting frame is used to mount the molding die, the linear motion module is horizontally mounted on the mounting frame, the moving frame is movably mounted on the linear motion module, the lifting module is vertically mounted on the moving frame, and the support frame is movably mounted on the lifting module.

[0020] According to a second aspect of the present invention, a control method for a cleaning apparatus for a semiconductor molding die as described above is provided, the control method comprising: S1: Move the cleaning device into the molding die so that the brush plates on the upper and lower sides form a relatively sealed environment with the upper and lower molds of the molding die, respectively.

[0021] S2: Turn on the suction component, blowing component and motor. The motor drives the rotating shaft to rotate. The two eccentric wheels on the rotating shaft drive the bearing plates and brush plates on both sides to swing to clean the residue on the surface of the plastic sealing mold. At the same time, the blowing component blows the residue through each blowing hole. The suction component sucks the blown residue out of each suction hole and each dust collection chamber.

[0022] S3: After the set cleaning time is reached, remove the cleaning device from the plastic seal mold and turn off the motor, blowing assembly and suction assembly.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: In the cleaning device for semiconductor molding compounds of the present invention, the driving component and the execution component cooperate. When the motor drives the rotating shaft to rotate, it can drive the upper and lower brush plates to swing, breaking through the limitation of a single trajectory and realizing all-round coverage cleaning of the molding compound cavity, eliminating cleaning dead corners. A relatively sealed environment is formed between the brush plates and the molding compound. The execution component, driving component, blowing component, and suction component work together to avoid the escape of residue and pollution of the environment, and to ensure the vacuum degree during suction, thereby improving the residue capture efficiency. This greatly improves the cleaning effect and efficiency, ensures the dimensional accuracy and cleanliness of subsequent packaged products, maintains the stable operation of the mold, and adapts to the high-precision semiconductor molding process requirements.

[0024] The control method of the cleaning device for semiconductor molding die of the present invention can significantly improve the cleaning effect and efficiency, ensure the dimensional accuracy and cleanliness of subsequent packaged products, maintain the stable operation of the die, and adapt to the requirements of high-precision semiconductor molding process. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a cleaning device for semiconductor molding compounds according to the present invention.

[0026] Figure 2 This is a cross-sectional view of a cleaning apparatus for semiconductor molding dies according to the present invention.

[0027] Figure 3 for Figure 2 Enlarged view of the structure at point A in the middle.

[0028] Figure 4 This is a cross-sectional view of an execution component in a cleaning apparatus for semiconductor molding dies according to the present invention.

[0029] Figure 5 This is a schematic diagram showing the disassembled structure of some components in the execution assembly.

[0030] Figure 6 This is a schematic diagram of the air blowing component in a cleaning device for semiconductor molding dies according to the present invention.

[0031] Figure 7 This is a schematic diagram of the air suction component in a cleaning device for semiconductor molding die according to the present invention.

[0032] Figure 8 This is a schematic diagram of another cleaning device for semiconductor molding dies according to the present invention.

[0033] In the diagram, 10-support frame, 20-actuator assembly, 21-intermediate plate, 22-sliding mating module, 221-slide rail, 222-slider, 23-bearing plate, 231-mating hole, 232-bearing, 233-connecting cavity, 24-brush plate, 241-blowing hole, 242-suction hole, 25-dust suction chamber, 30-drive assembly, 31-motor, 32-rotating shaft, 33-eccentric wheel, 40-blowing assembly, 41-high pressure gas system, 42-blowing pipe, 43-nozzle, 44-control valve, 50-suction assembly, 51-vacuum system, 52-suction pipe, 521-suction main pipe, 522-suction branch pipe, 53-filter, 54-manifold, 60-mounting assembly, 61-mounting frame, 62-linear movement module, 63-moving frame, 64-lifting module. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. It is understood that, without conflict, some technical means of the various embodiments described herein can be substituted for or combined with each other.

[0035] In the description of this invention, the terms "first," "second," etc., are used only to distinguish the described objects and have no sequential or technical meaning. Therefore, objects specified with "first," "second," etc., may explicitly or implicitly include one or more of those objects. Furthermore, the words "one" or "a" do not indicate a quantity limitation, but rather indicate the presence of at least one, while "multiple" indicates at least two.

[0036] In the description of this invention, references to "one embodiment" or "some embodiments" mean that one or more embodiments of the invention include a particular feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "one embodiment," "some embodiments," "other embodiments," "and other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0037] According to a first aspect of the present invention, a cleaning apparatus for semiconductor molding dies is provided, with reference to... Figure 1In some embodiments, the cleaning device for semiconductor molding compounds includes a support frame 10, an actuation component 20, a drive component 30, an air blowing component 40, and an air suction component 50. The support frame 10 serves as the mounting base for each component, the drive component 30 drives the actuation component 20 to clean residues in the molding compound, the air blowing component 40 blows up the residues, and the air suction component 50 sucks up the residues.

[0038] Specifically, refer to Figure 1 , Figure 2 and Figure 3 The support frame 10 has a hollow frame structure, and the execution component 20 is located inside the support frame 10. The execution component 20 includes a middle plate 21, and sliding engagement modules 22, a support plate 23, and a brush plate 24 arranged sequentially on the upper and lower sides of the middle plate 21 away from the middle plate 21. The sliding engagement modules 22 on the upper side of the middle plate 21 are arranged in a first direction, and the sliding engagement modules 22 on the lower side of the middle plate 21 are arranged in a second direction. The middle plate 21 and the upper support plate 23 can slide relative to each other in the first direction, and the middle plate 21 and the lower support plate 23 can slide relative to each other in the second direction.

[0039] Reference Figure 4 A dust collection chamber 25 is provided between the brush plate 24 and the corresponding support plate 23. The brush plate 24 is provided with a number of air blowing holes 241 and a number of air suction holes 242, and each air suction hole 242 is connected to the corresponding dust collection chamber 25.

[0040] Reference Figure 2 and Figure 3 The drive assembly 30 includes a motor 31, a rotating shaft 32, and two eccentric wheels 33. The motor 31 is mounted on a support frame 10, and the rotating shaft 32 is vertically mounted on the support frame 10. The motor 31 drives the rotating shaft 32. The two eccentric wheels 33 are spaced apart on the rotating shaft 32. The rotation center axes of the two eccentric wheels 33 coincide with the center axis of the rotating shaft 32, and the geometric center axes of the two eccentric wheels 33 are parallel to the center axis of the rotating shaft 32. The two eccentric wheels 33 are respectively connected to the bearing plates 23 on both sides. When the motor 31 drives the rotating shaft 32 to rotate, the two eccentric wheels 33 rotate with the rotating shaft 32. The upper eccentric wheel 33 drives the upper bearing plate 23 and the upper brush plate 24 to swing; the lower eccentric wheel 33 drives the lower bearing plate 23 and the lower brush plate 24 to swing. Meanwhile, the middle plate 21 and the bearing plates 23 on both sides form a sliding fit through the corresponding sliding fit module 22, which can ensure the overall reliability and stability of the device.

[0041] The air blowing assembly 40 is connected to each air blowing hole 241.

[0042] The suction assembly 50 is connected to each suction chamber 25.

[0043] During the cleaning process, the brush plates 24 on the upper and lower sides form a relatively sealed environment with the upper and lower molds of the plastic sealing mold, respectively. The motor 31 drives the rotating shaft 32 to rotate, and the two eccentric wheels 33 on the rotating shaft 32 drive the bearing plates 23 and brush plates 24 on both sides to swing to clean the residue on the surface of the plastic sealing mold. At the same time, the blowing assembly 40 blows the residue through each blowing hole 241, and the suction assembly 50 sucks the blown residue out from each suction hole 242 and each suction chamber 25.

[0044] In the cleaning device for semiconductor molding compounds of the present invention, the drive component 30 cooperates with the execution component 20. When the motor 31 drives the rotating shaft 32 to rotate, it can drive the upper and lower brush plates 24 to swing, breaking through the limitation of a single trajectory and realizing all-round coverage cleaning of the molding compound cavity, eliminating cleaning dead corners. A relatively sealed environment is formed between the brush plate 24 and the molding compound. The execution component 20, drive component 30, air blowing component 40 and air suction component 50 work together to avoid the emission of residue and pollution of the environment, and to ensure the vacuum degree during air suction, thereby improving the residue capture efficiency, thus greatly improving the cleaning effect and efficiency, ensuring the dimensional accuracy and cleanliness of subsequent packaged products, maintaining the stable operation of the mold, and adapting to the requirements of high-precision semiconductor molding compounding processes.

[0045] In some preferred embodiments, the sliding engagement module includes a slidably engaged slide rail and a slider, the slide rail being disposed on one of the intermediate plate and the corresponding support plate, and the slider being disposed on the other of the intermediate plate and the corresponding support plate. (See reference...) Figure 5 In one embodiment, each sliding engagement module 22 includes a slidably engaging slide rail 221 and a slider 222. The slide rail 221 is disposed at the bottom of the upper support plate 23 along a first direction, and the slider 222 that engages with the slide rail 221 is disposed at the top of the middle plate 21. The slide rail is disposed at the top of the lower support plate 23 along a second direction, and the slider that engages with the slide rail is disposed at the bottom of the middle plate 21. However, the present invention is not limited thereto, and in other embodiments, the sliding engagement module may also adopt other reasonable structural designs.

[0046] Reference Figure 3 and Figure 5 In some preferred embodiments, each bearing plate 23 has a mating hole 231 on its side (the side closest to the drive assembly 30), and a bearing 232 is provided in the mating hole 231. Each eccentric wheel 33 is rotatably disposed in the corresponding bearing 232 to ensure the stability of the eccentric wheel 33 when it rotates.

[0047] In some preferred embodiments, the structures of the upper and lower brush plates 24 are respectively matched with the structures of the upper and lower molds of the molding die. Further, the brush plates 24 on both sides can each adopt a single plate structure, or they can be formed by splicing different sub-plates to better match the structures of the upper and lower molds of the molding die. In addition, the height and distribution density of the brushes on the brush plates 24 can be designed to match the structures of the upper and lower molds to ensure that a relatively sealed environment is formed between the upper and lower brush plates 24 and the upper and lower molds of the molding die during cleaning operations. (Refer to...) Figure 2 In one embodiment, the brush plates on both sides are formed by splicing different sub-plates, and the brush density at the edge of each sub-plate is greater than the brush density on the inner side.

[0048] Furthermore, each air blowing hole 241 is located in the middle of the corresponding brush plate 24, and each air suction hole 242 is arranged around the corresponding air blowing hole 241. In this way, the efficiency of the air suction assembly 50 in capturing residues in a relatively sealed environment can be improved, achieving a better cleaning effect.

[0049] Reference Figure 2 , Figure 4 and Figure 6 In some preferred embodiments, the air blowing assembly 40 includes a high-pressure gas system 41, an air blowing pipe 42, nozzles 43, and a control valve 44. The nozzles 43 are disposed in corresponding air blowing holes 241 and are connected to the high-pressure gas system 41 via the air blowing pipe 42. The control valve 44 is located on the air blowing pipe 42. During the cleaning process, after the control valve 44 is opened, the high-pressure gas generated by the high-pressure gas system 41 is delivered to each nozzle 43 through the air blowing pipe 42. Each nozzle 43 blows the high-pressure gas out of its respective air blowing hole 241, thereby blowing up the residue so that the suction assembly 50 can remove the residue.

[0050] Furthermore, referring to Figure 2 and Figure 5 The intermediate plate 21 is set as a hollow frame structure, and the sliding fit module 22 is set at the edge of the intermediate plate 21. The internal space of the intermediate plate 21 can be used to install the nozzle 43 and the air blowing pipe 42 wiring, thereby improving the integration of the device and reducing the size of the device.

[0051] Reference Figure 2 and Figure 7 The suction assembly 50 includes a vacuum system 51, a suction pipe 52, and a filter 53. The suction pipe 52 is connected to each suction chamber 25, and the filter 53 is located between the suction pipe 52 and the vacuum system 51. The vacuum system 51 can be a vacuum pump or similar product. When the vacuum system 51 is activated, it can remove residue between the cleaning device and the molding die from each suction port 242 and each suction chamber 25. The filter 53 can filter the residue in the suction pipe 52 for subsequent processing.

[0052] Reference Figure 2 and Figure 7 In some preferred embodiments, the suction pipe 52 includes a main suction pipe 521 and a plurality of suction branch pipes 522. The suction assembly 50 also includes a manifold 54, which has an air outlet and a plurality of air inlets. The air outlet is connected to the vacuum system 51 through the main suction pipe 521. A filter 53 is disposed on the main suction pipe 521. The plurality of air inlets are respectively connected to the corresponding dust collection chamber 25 through each suction branch pipe 522.

[0053] Reference Figure 4 The support plate 23 has a connecting cavity 233, which is connected to the corresponding suction pipe 52 and the corresponding dust suction chamber 25 respectively. Furthermore, the connecting cavity 233 is located on the side of the support plate 23 near the drive assembly 30, which facilitates the installation and connection of the suction pipe 52 and helps to improve the integration of the device.

[0054] Reference Figure 8 In other embodiments, the cleaning apparatus for semiconductor molding compounds further includes a mounting assembly 60, which includes a mounting frame 61, a linear motion module 62, a moving frame 63, and a lifting module 64. The mounting frame 61 is mounted on the molding compound, the linear motion module 62 is horizontally mounted on the mounting frame 61, the moving frame 63 is movably mounted on the linear motion module 62, the lifting module 64 is vertically mounted on the moving frame 63, and the support frame 10 is movably mounted on the lifting module 64. During cleaning, the linear motion module 62 can drive the moving frame 63, the lifting module 64, and the support frame 10 to move horizontally as a whole, allowing the actuator 20 to enter or exit the molding compound. The lifting module 64 can drive the support frame 10 to move up and down, so that the brush plates 24 can better fit with the upper and lower molds of the molding compound and form a relatively sealed environment.

[0055] According to a second aspect of the present invention, a control method for a cleaning apparatus for a semiconductor molding die as described above is provided, the control method comprising: S1: Move the cleaning device into the molding die so that the brush plates 24 on the upper and lower sides form a relatively sealed environment with the upper and lower molds of the molding die, respectively.

[0056] This step creates a relatively enclosed cleaning area, preventing residue from escaping during cleaning and avoiding contamination of the production environment and surrounding equipment. Simultaneously, the relatively sealed environment reduces airflow leakage from the blowing assembly 40 and suction loss from the suction assembly 50, providing a stable airflow field for subsequent operations to blow up and remove residue, thus improving the effectiveness of the cleaning operation.

[0057] S2: Turn on the suction assembly 50, the blowing assembly 40 and the motor 31. The motor 31 drives the rotating shaft 32 to rotate. The two eccentric wheels 33 on the rotating shaft 32 drive the bearing plates 23 and the brush plate 24 on both sides to swing to clean the residue on the surface of the plastic seal mold. At the same time, the blowing assembly 40 blows the residue through each blowing hole 241. The suction assembly 50 sucks the blown residue out of each suction hole 242 and each suction chamber 25.

[0058] Compared to the unidirectional movement trajectory of existing roller brushes, this invention utilizes a motor 31 to drive a rotating shaft 32 to rotate, which in turn drives the brush plate 24 to oscillate via an eccentric wheel 33. This increases the contact angle and coverage area between the brush and the mold surface, enabling efficient removal of residual molding compound, dust, and other impurities from the mold surface, parting surface, and corner gaps, thus improving cleaning thoroughness. Simultaneously, the air blowing component 40 blows away stubborn residues adhering to the mold surface through air blowing holes 241, breaking the adhesion between the residues and the mold; the suction component 50 simultaneously removes the blown-away residues through suction holes 242 and a dust suction chamber 25, preventing secondary settling and adhesion of residues to the mold surface, achieving integrated cleaning and significantly improving cleaning efficiency.

[0059] S3: After the set cleaning time is reached, remove the cleaning device from the plastic seal mold and turn off the motor 31, the blowing assembly 40, and the suction assembly 50. The cleaning time can be set appropriately according to actual conditions, such as 30 seconds or 1 minute. The motor 31, blowing assembly 40, and suction assembly 50 are turned off sequentially. After the motor 31 and blowing assembly 40 stop working, there may be some suspended residue that has not been completely removed in the cleaning space, as well as residual residue adsorbed on the brush plate 24 and the inner wall of the suction chamber 25. The suction assembly 50 is delayed in turning off, and these residual impurities are sucked away through continuous negative pressure suction, ensuring that the mold cleanliness meets the standards and guaranteeing thorough cleaning.

[0060] The control method of the cleaning device for semiconductor molding die of the present invention can significantly improve the cleaning effect and efficiency, ensure the dimensional accuracy and cleanliness of subsequent packaged products, maintain the stable operation of the die, and adapt to the requirements of high-precision semiconductor molding process.

[0061] The present invention has been described in the above-described embodiments; however, these embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the present invention. Conversely, any modifications and refinements made without departing from the spirit and scope of the present invention are within the scope of patent protection of the present invention.

Claims

1. A cleaning device for semiconductor molding compounds, characterized in that: The cleaning device for semiconductor molding dies includes a support frame, an execution component, a drive component, an air blowing component, and an air suction component; The execution component is located inside the support frame. The execution component includes a middle plate, and sliding engagement modules, a support plate, and a brush plate arranged sequentially on the upper and lower sides of the middle plate away from the middle plate. The sliding engagement modules on the upper side of the middle plate are arranged in a first direction, and the sliding engagement modules on the lower side of the middle plate are arranged in a second direction. A dust collection chamber is provided between the brush plate and the corresponding support plate. The brush plate is provided with a plurality of air blowing holes and a plurality of air suction holes, and each air suction hole is connected to the corresponding dust collection chamber. The drive assembly includes a motor, a rotating shaft, and two eccentric wheels. The motor is mounted on the support frame, and the rotating shaft is mounted vertically on the support frame. The motor drives the rotating shaft. The two eccentric wheels are spaced apart on the rotating shaft, and the geometric center axes of the two eccentric wheels are parallel to the center axis of the rotating shaft. The two eccentric wheels are respectively connected to the bearing plates on both sides. The air blowing assembly is connected to each air blowing hole; The air intake assembly is connected to each dust collection chamber; During the cleaning process, the brush plates on the upper and lower sides form a relatively sealed environment with the upper and lower molds of the molding die, respectively. The motor drives the rotating shaft to rotate, and the two eccentric wheels on the rotating shaft drive the bearing plates and brush plates on both sides to swing, so as to clean the residue on the surface of the molding die. At the same time, the blowing assembly blows the residue through each blowing hole, and the suction assembly sucks the blown residue from each suction hole and each suction chamber.

2. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The sliding engagement module includes a sliding rail and a slider that can be slidably engaged. The sliding rail is disposed on one of the intermediate plate and the corresponding support plate, and the slider is disposed on the other of the intermediate plate and the corresponding support plate.

3. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: Each bearing plate has a mating hole on its side, and a bearing is installed in the mating hole. Each eccentric wheel is rotatably installed in the corresponding bearing.

4. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The structure of the brush plates on the top and bottom sides is matched with the structure of the upper and lower molds of the plastic sealing mold, respectively.

5. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The air blowing assembly includes a high-pressure gas system, an air blowing pipe, a nozzle, and a control valve. The nozzle is disposed in a corresponding air blowing hole. The nozzle is connected to the high-pressure gas system through the air blowing pipe. The control valve is disposed on the air blowing pipe.

6. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The suction assembly includes a vacuum system, a suction pipe, and a filter. The suction pipe is connected to each dust collection chamber, and the filter is located between the suction pipe and the vacuum system.

7. The cleaning apparatus for semiconductor molding compounds as described in claim 6, characterized in that: The suction pipe includes a main suction pipe and several suction branch pipes; the suction assembly also includes a manifold box, which has an air outlet and several air inlets. The air outlet is connected to the vacuum system through the main suction pipe. The filter is located on the main suction pipe, and the several air inlets are connected to the corresponding dust collection chambers through the respective suction branch pipes.

8. The cleaning apparatus for semiconductor molding compounds as described in claim 6, characterized in that: The support plate is provided with a connecting cavity, which is connected to the corresponding air suction pipe and the corresponding dust suction chamber respectively.

9. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The cleaning device for semiconductor molding compounds further includes a mounting assembly, which includes a mounting frame, a linear motion module, a moving frame, and a lifting module. The mounting frame is used to mount the molding compound onto the molding compound. The linear motion module is horizontally mounted on the mounting frame. The moving frame is movably mounted on the linear motion module. The lifting module is vertically mounted on the moving frame. The support frame is movably mounted on the lifting module.

10. A control method for a cleaning apparatus for semiconductor molding compounds as described in any one of claims 1-9, characterized in that: The control method includes: S1: Move the cleaning device into the molding die so that the brush plates on the upper and lower sides form a relatively sealed environment with the upper and lower molds of the molding die, respectively. S2: Turn on the suction component, the blowing component and the motor. The motor drives the rotating shaft to rotate. The two eccentric wheels on the rotating shaft drive the bearing plates and brush plates on both sides to swing to clean the residue on the surface of the plastic sealing mold. At the same time, the blowing component blows the residue through each blowing hole, and the suction component sucks the blown residue out from each suction hole and each dust collection chamber. S3: After the set cleaning time is reached, remove the cleaning device from the plastic seal and turn off the motor, blowing assembly and suction assembly.

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