Cooling system and server equipment with same

Abstract

The invention provides a cooling system and server equipment with the same, the cooling system is used for cooling a target workpiece, a cooling channel is arranged in the target workpiece, the cooling system comprises a liquid cooling assembly used for circulating a first cooling medium, and the liquid cooling assembly is communicated with the cooling channel so as to cool the target workpiece through the first cooling medium; the air cooling assembly is arranged on the side of the target workpiece, and a second cooling medium circulates in the air cooling assembly so as to blow cooling airflow to the target workpiece; and the auxiliary heat dissipation assembly is used for circulating a refrigerant medium, and the auxiliary heat dissipation assembly selectively communicates with the liquid cooling assembly, the air cooling assembly and the target workpiece. The problem that in the prior art, the heat dissipation efficiency of a server is low is solved.

Description

Technical Field

[0001] This invention relates to the field of server heat dissipation technology, and more specifically, to a cooling system and a server device having the same. Background Technology

[0002] Currently, with the development of technologies such as artificial intelligence and cloud computing, the heat dissipation of servers is constantly increasing. The traditional method of cooling by fans can no longer meet the heat dissipation needs of servers. Therefore, cold plate liquid cooling systems are usually added to cool servers.

[0003] However, existing heat dissipation solutions typically use separate cooling sources for liquid cooling and air cooling, resulting in complex system deployment and poor capacity allocation between liquid and air cooling. In principle, liquid cooling and air cooling are used to dissipate heat to different areas of the server. Furthermore, liquid cooling only uses a cooling tower for cooling, and the water temperature cannot be lowered further in hot summer environments, which reduces the server's heat dissipation efficiency for GPU chips that generate a lot of heat. Summary of the Invention

[0004] The main objective of this invention is to provide a cooling system and a server device having the same, in order to solve the problem of low heat dissipation efficiency of servers in the prior art.

[0005] To achieve the above objectives, according to one aspect of the present invention, a cooling system is provided for cooling a target workpiece, wherein a cooling channel is provided within the target workpiece. The cooling system includes: a liquid cooling assembly for circulating a first cooling medium, the liquid cooling assembly being connected to the cooling channel to cool the target workpiece through the first cooling medium; an air cooling assembly disposed on the side of the target workpiece, wherein a second cooling medium is circulated within the air cooling assembly to blow cooling airflow onto the target workpiece; and an auxiliary heat dissipation assembly for circulating a cooling medium, the auxiliary heat dissipation assembly being selectively connected to the liquid cooling assembly, the air cooling assembly, and the target workpiece, respectively.

[0006] Furthermore, the liquid cooling assembly includes a radiator, and the auxiliary cooling assembly includes: a first circuit, the two ends of which are respectively connected to the radiator and the air-cooled assembly; a first heat exchanger connected to the first circuit; and a condenser, which is at least partially connected to the first circuit. The second cooling medium in the air-cooled assembly flows sequentially through the first heat exchanger and the radiator, or flows sequentially through the first heat exchanger, the condenser, and the radiator, and then flows back into the air-cooled assembly.

[0007] Furthermore, the first circuit includes: a first branch, the two ends of which are connected to the liquid outlet of the first heat exchanger and the liquid inlet of the radiator, respectively, and a first control valve is provided on the first branch; and a second branch, which is connected in parallel with the first branch, and a condenser and a second control valve are provided on the second branch; when the first control valve is open and the second control valve is closed, the second cooling medium in the air-cooled assembly flows sequentially through the first heat exchanger and the radiator and then flows back into the air-cooled assembly; when the first control valve is closed and the second control valve is open, the second cooling medium flows sequentially through the first heat exchanger, the condenser and the radiator and then flows back into the air-cooled assembly.

[0008] Furthermore, the auxiliary heat dissipation component also includes: a second circuit, which is connected to the liquid cooling component. The second circuit is equipped with an evaporator and a second heat exchanger. After the first cooling medium exchanges heat with the second heat exchanger, it flows back into the cooling channel.

[0009] Furthermore, the second loop includes a third branch, the two ends of which are connected to the evaporator and the second heat exchanger respectively. A third control valve is installed on the third branch to regulate the flow rate of the refrigerant in the third branch.

[0010] Furthermore, the liquid cooling assembly includes a third circuit, which is connected to the cooling channel. A third heat exchanger and a radiator are installed on the third circuit. The first cooling medium flows through the third heat exchanger and the radiator in sequence and then flows back into the cooling channel.

[0011] Furthermore, the liquid cooling assembly also includes: a first pump body, which is disposed on and connected to the third circuit, and provides power to the first cooling medium in the third circuit through the first pump body.

[0012] Furthermore, the auxiliary heat dissipation assembly includes: a fourth circuit, on which an evaporator, a compressor, and a condenser are connected, and a refrigerant is circulated within the fourth circuit; a first circuit, connected to an air-cooled assembly, with at least a portion of the condenser connected to the first circuit; and a second circuit, connected to a liquid-cooled assembly, with at least a portion of the evaporator connected to the second circuit.

[0013] Furthermore, the auxiliary heat dissipation assembly also includes: a liquid replenishment component for storing the second cooling medium, the liquid replenishment component being connected to the first circuit; and a second pump body connected to the first circuit to provide power to the second cooling medium in the first circuit.

[0014] According to another aspect of the present invention, a server device is provided, including a cooling system and a liquid-cooled cabinet, wherein the cooling system is connected to the liquid-cooled cabinet and the cooling system is the aforementioned cooling system.

[0015] According to the technical solution of the present invention, the cooling system includes a liquid cooling component, an air cooling component, and an auxiliary heat dissipation component. The liquid cooling component is used to circulate a first cooling medium and is connected to a cooling channel to cool the target workpiece through the first cooling medium. The air cooling component is disposed on the side of the target workpiece and a second cooling medium circulates within it to blow cooling airflow onto the target workpiece. The auxiliary heat dissipation component is used to circulate a cooling medium and is selectively connected to the liquid cooling component, the air cooling component, and the target workpiece.

[0016] By combining liquid cooling and air cooling components, the system can flexibly address the heat dissipation needs of different parts of the target workpiece. The liquid cooling component handles high heat flux densities, while the air cooling component is responsible for dissipating low heat flux densities. This design avoids the limitations of a single cooling method, and the introduction of auxiliary heat dissipation components allows the cooling system to dynamically adjust its cooling strategy according to the actual heat load of the workpiece. It can selectively enhance liquid cooling or air cooling as needed, or directly cool the workpiece, thereby ensuring optimal cooling performance under different operating conditions and improving the heat dissipation efficiency of the target workpiece.

[0017] In high-temperature environments during summer, when air cooling or liquid cooling cannot effectively dissipate heat through conventional radiators, auxiliary heat dissipation components can provide additional cooling to ensure that the temperature of the workpiece is controlled within a safe range, avoiding performance degradation or damage caused by overheating. Attached Figure Description

[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0019] Figure 1 A schematic diagram of the cooling system according to the present invention is shown; and

[0020] Figure 2 A schematic diagram of an auxiliary heat dissipation component in a cooling system according to the present invention is shown.

[0021] The above figures include the following reference numerals:

[0022] 100. Target workpiece;

[0023] 200. Liquid cooling assembly; 210. Radiator; 220. Third loop; 230. Third heat exchanger; 240. First pump body; 250. Third pump body;

[0024] 300. Air-cooled components;

[0025] 400, Auxiliary heat dissipation assembly; 410, First circuit; 420, First heat exchanger; 430, Condenser; 411, First branch; 412, First control valve; 413, Second branch; 414, Second control valve; 440, Second circuit; 450, Evaporator; 460, Second heat exchanger; 441, Third branch; 442, Third control valve; 470, Fourth circuit; 471, Compressor; 472, Expansion valve; 480, Liquid replenishment component; 490, Second pump body. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] Please refer to Figure 1 and Figure 2 This application provides a cooling system for cooling a target workpiece 100. The target workpiece 100 has a cooling channel. The cooling system includes: a liquid cooling component 200 for circulating a first cooling medium, which is connected to the cooling channel to cool the target workpiece 100 through the first cooling medium; an air cooling component 300 disposed on the side of the target workpiece 100, which has a second cooling medium circulating within it to blow cooling air onto the target workpiece 100; and an auxiliary heat dissipation component 400 for circulating a cooling medium, which is selectively connected to the liquid cooling component 200, the air cooling component 300, and the target workpiece 100.

[0028] The cooling system provided in this application includes a liquid cooling component 200, an air cooling component 300, and an auxiliary heat dissipation component 400. The liquid cooling component 200 is used to circulate a first cooling medium and is connected to a cooling channel to cool the target workpiece 100 through the first cooling medium. The air cooling component 300 is disposed on the side of the target workpiece 100 and a second cooling medium circulates within the air cooling component 300 to blow cooling airflow onto the target workpiece 100. The auxiliary heat dissipation component 400 is used to circulate a cooling medium and is selectively connected to the liquid cooling component 200, the air cooling component 300, and the target workpiece 100.

[0029] By combining liquid cooling and air cooling components, the system can flexibly address the heat dissipation needs of different parts of the target workpiece 100. The liquid cooling component handles high heat flux densities, while the air cooling component is responsible for dissipating low heat flux densities. This design avoids the limitations of a single cooling method. The introduction of the auxiliary heat dissipation component 400 allows the cooling system to dynamically adjust its cooling strategy according to the actual heat load of the workpiece. It can selectively enhance liquid cooling or air cooling as needed, or directly cool the workpiece, thereby ensuring optimal cooling performance under different operating conditions and improving the heat dissipation efficiency of the target workpiece 100.

[0030] In high-temperature environments during summer, when air cooling or liquid cooling cannot effectively dissipate heat through conventional radiators, auxiliary heat dissipation components can provide additional cooling to ensure that the temperature of the workpiece is controlled within a safe range, avoiding performance degradation or damage caused by overheating.

[0031] Specifically, such as Figure 1 As shown, the liquid cooling assembly 200 includes a radiator 210, and the auxiliary heat dissipation assembly 400 includes: a first circuit 410, the two ends of which are respectively connected to the radiator 210 and the air-cooled assembly 300; a first heat exchanger 420, which is connected to the first circuit 410; and a condenser 430, which is at least partially connected to the first circuit 410. The second cooling medium in the air-cooled assembly 300 flows sequentially through the first heat exchanger 420 and the radiator 210, or flows sequentially through the first heat exchanger 420, the condenser 430 and the radiator 210, and then flows back into the air-cooled assembly 300.

[0032] The core of the liquid cooling assembly 200 is the heat sink 210, which is designed to handle the heat dissipation requirements of high heat flux density. The first cooling medium flows in the cooling channel, directly contacting and absorbing the heat generated by the target workpiece 100 (such as high-heat-generating components like CPUs and GPUs). Under normal conditions, the heat sink 210 can reduce the temperature of the first cooling medium to a suitable cooling temperature through heat exchange with the outdoor environment.

[0033] The first loop 410 is the critical path connecting the radiator 210 and the air-cooled assembly 300, allowing the second cooling medium (usually air) to circulate between the air-cooled and liquid-cooled assemblies. The first heat exchanger is connected to the first loop 410 and its function is to exchange heat between the air-cooling and liquid-cooling systems. When the temperature of the first cooling medium cannot be effectively reduced by the radiator 210, the second cooling medium will first pass through the first heat exchanger to absorb the cooling energy from the liquid-cooled assembly, thereby reducing its temperature.

[0034] The condenser is at least partially connected to the first loop 410 and functions in the system's cooling mode. After being pre-cooled by the first heat exchanger 420, the second cooling medium can be further cooled by the condenser 430 to address the heat dissipation challenges in high-temperature summer environments.

[0035] By combining liquid cooling and air cooling sources, efficient air-liquid fusion cooling is achieved. Under normal conditions, the second cooling medium dissipates heat through the naturally cooled radiator 210, while under extreme conditions, the liquid cooling component 200 provides additional cooling capacity to the air cooling component 300 through the first heat exchanger 420 or condenser 430, ensuring stable system operation.

[0036] The design of the first loop 410 and the first heat exchanger 420 allows the second cooling medium to dynamically select the heat dissipation path based on the actual heat load of the workpiece and the external ambient temperature. This ability to dynamically distribute cooling capacity ensures optimal cooling performance under different operating conditions, improving the system's flexibility and adaptability.

[0037] In the specific implementation process, the first circuit 410 includes: a first branch 411, the two ends of which are connected to the liquid outlet of the first heat exchanger 420 and the liquid inlet of the radiator 210 respectively, and a first control valve 412 is provided on the first branch 411; a second branch 413, which is arranged in parallel with the first branch 411, and a condenser 430 and a second control valve 414 are provided on the second branch 413; when the first control valve 412 is open and the second control valve 414 is closed, the second cooling medium in the air-cooled assembly 300 flows through the first heat exchanger 420 and the radiator 210 in sequence and then flows back into the air-cooled assembly 300; when the first control valve 412 is closed and the second control valve 414 is open, the second cooling medium flows through the first heat exchanger 420, the condenser 430 and the radiator 210 in sequence and then flows back into the air-cooled assembly 300.

[0038] In the design of the first circuit 410, by setting the first branch 411 and the second branch 413, and by regulating the first control valve 412 and the second control valve 414, the second cooling medium in the air-cooled component 300 can selectively flow through different components for cooling according to the actual heat dissipation requirements and the ambient temperature, thereby optimizing the cooling efficiency and system energy consumption.

[0039] The first branch 411 is the path through which the second cooling medium within the air-cooled assembly 300 directly exchanges heat with the first heat exchanger 420 and the radiator 210. The opening of the first control valve 412 allows the second cooling medium to originate from the air-cooled assembly, be pre-cooled by the first heat exchanger 420, and then directly enter the radiator 210 for further heat release before finally flowing back to the air-cooled assembly 300. This path is suitable for operating conditions with low ambient temperatures or low system loads. Pre-cooling by the first heat exchanger 420 prevents the second cooling medium from becoming excessively hot when it directly enters the radiator 210, thus improving heat dissipation efficiency.

[0040] The second branch 413 is equipped with a condenser 430. When the first control valve 412 is closed and the second control valve 414 is open, the second cooling medium, after being pre-cooled by the first heat exchanger 420, further enters the condenser 430 for deep cooling, and then releases heat through the radiator 210 before finally flowing back to the air-cooled assembly 300. This path is suitable for high-temperature environments in summer or situations with extremely high server loads. In these cases, natural cooling of the first cooling medium alone cannot meet the heat dissipation requirements. The second cooling medium further reduces its temperature through the condenser 430, thereby providing a more effective cooling effect and ensuring the normal operation of the workpiece.

[0041] By regulating the first control valve 412 and the second control valve 414, the system can flexibly select the appropriate cooling path according to the external environment and the thermal load of the internal workpiece. This dynamic thermal management mechanism ensures that the cooling system can operate efficiently even under complex and variable working conditions, effectively control the workpiece temperature, and avoid performance degradation or equipment damage caused by overheating.

[0042] When the ambient temperature is suitable, the system prioritizes natural cooling, avoiding additional energy consumption from the condenser 430. In high-temperature environments, supplemental cooling is provided through the condenser 430. Although this increases energy consumption, it ensures the system's cooling efficiency, preventing over-cooling or under-cooling, and ultimately achieving energy-saving operation.

[0043] The combined use of the first heat exchanger 420 and the condenser 430 enables the system to meet heat dissipation requirements under different temperature conditions, improving the stability and reliability of the entire cooling system. This design reduces the failure rate caused by changes in ambient temperature and extends the lifespan of data center equipment.

[0044] Furthermore, the auxiliary heat dissipation component 400 also includes a second circuit 440, which is connected to the liquid cooling component 200. An evaporator 450 and a second heat exchanger 460 are provided on the second circuit 440. After the first cooling medium exchanges heat with the second heat exchanger 460, it flows back into the cooling channel.

[0045] The second loop 440 is connected at one end to a cooling channel within the liquid cooling assembly 200, and at the other end to an evaporator 450 and a second heat exchanger 460. This arrangement allows the first cooling medium (such as a special cooling liquid) to circulate between the cooling channel and the second loop in the liquid cooling assembly, thereby ensuring that the liquid cooling assembly can continuously and effectively remove heat from the target workpiece 100.

[0046] Evaporator 450, as part of the second circuit 440, contains another cooling medium, typically a refrigerant (such as ammonia or Freon). During the circulation of the first cooling medium in the second circuit, it exchanges heat with the evaporator 450, thereby lowering its temperature. It then flows back into the cooling channel to continue cooling the target workpiece 100.

[0047] Before the first cooling medium flows back to the cooling channel, it passes through the second heat exchanger 460. The presence of the second heat exchanger allows the first cooling medium to exchange heat again with room temperature air or other cooling media before flowing back, further enhancing its cooling capacity. This design ensures that the liquid cooling components maintain their efficient heat transfer performance even under continuous high heat load conditions.

[0048] By introducing the second loop 440, the liquid cooling assembly 200 gains additional cooling capacity. During the circulation process, the first cooling medium not only directly removes heat from the target workpiece 100 in the cooling channel, but also regulates the temperature in the second heat exchanger 460 and evaporator 450, significantly improving cooling efficiency, making it particularly suitable for handling the heat dissipation of high-heat-flux-density devices such as high-power servers or GPUs.

[0049] The presence of the second loop 440 allows the system to respond more flexibly to changes in heat load. When the heat generated by the target workpiece 100 suddenly increases, the first cooling medium, after passing through the evaporator 450 and the second heat exchanger 460, can quickly restore its cooling capacity, maintain the stable operation of the liquid cooling components, and thus protect sensitive electronic equipment from overheating damage.

[0050] Specifically, such as Figure 2 As shown, the second circuit 440 includes a third branch 441, the two ends of which are connected to the evaporator 450 and the second heat exchanger 460 respectively. A third control valve 442 is provided on the third branch 441 to regulate the flow rate of the refrigerant in the third branch 441.

[0051] The third branch 441, as part of the second loop 440, is connected at both ends to the evaporator 450 and the second heat exchanger 460, respectively. The main function of this branch is to provide a path for the circulation of the refrigerant, in which the medium first absorbs heat in the evaporator 450 and is then transported to the second heat exchanger 460 through the third branch 441.

[0052] The third control valve is located on the third branch 441 and is used to regulate the flow rate of the refrigerant through this branch. By adjusting the opening of the third control valve, the flow rate of the refrigerant between the evaporator 450 and the second heat exchanger 460 can be precisely controlled, thereby affecting the cooling capacity of the entire system. Under different seasons or server loads, by changing the state of the third control valve, the system can automatically adjust to the most suitable operating mode to achieve the best cooling effect.

[0053] The function of the second heat exchanger 460 is to exchange heat between the hot and cold medium from the evaporator 450 and the cooling medium in the first loop 410, thereby helping to further reduce the temperature of the second cooling medium. Specifically, the second heat exchanger 460 acts as a make-up cooling plate to supply the liquid cooling system with the cooling capacity of the liquid cooling system to meet the cooling needs under high heat loads or high temperatures in summer.

[0054] The liquid cooling assembly 200 includes a third circuit 220, which is connected to the cooling channel. A third heat exchanger 230 and a radiator 210 are provided on the third circuit 220. The first cooling medium flows through the third heat exchanger 230 and the radiator 210 in sequence and then flows back into the cooling channel.

[0055] The first cooling medium originates from the cooling channel and enters the third loop 220, first passing through the third heat exchanger 230. In the third heat exchanger 230, the first cooling medium exchanges heat with another cold source (such as cooling water or air), releasing some of the heat it carries and thus lowering its temperature. The pre-cooled first cooling medium then flows through the radiator 210, further exchanging heat with the external environment, reducing its temperature to a level suitable for returning to the cooling channel. The first cooling medium, having completed its heat exchange, finally returns to the cooling channel, ready for the next heat absorption cycle.

[0056] The combined design of the third heat exchanger 230 and the radiator 210 ensures that the first cooling medium can effectively dissipate heat during circulation while maintaining its temperature below the operating temperature of the target workpiece 100. This design allows the liquid cooling system to better adapt to the cooling requirements of high heat flux density equipment, such as high-performance computing chips like GPUs and CPUs. Especially under high-temperature conditions in summer, the pre-cooling function of the third heat exchanger and the natural cooling function of the radiator work together to ensure the stable operation and efficient heat dissipation of the liquid cooling system.

[0057] Among them, the third heat exchanger 230 is a liquid-cooled CDU (Cooling Distribution Unit). A liquid-cooled CDU is a type of heat exchanger specifically used in liquid-cooled architectures as an intermediary between the liquid cooling medium and the internal heat source of the server. It can precisely control the flow rate and temperature of the cooling medium flowing to each server to achieve efficient thermal management.

[0058] The liquid cooling assembly 200 also includes a first pump body 240, which is disposed on and connected to the third circuit 220, and provides power to the first cooling medium in the third circuit 220 through the first pump body 240.

[0059] The first pump body 240 is typically a high-performance circulating pump whose core function is to overcome various resistances encountered by the cooling medium when it flows in the third loop 220 (i.e., the liquid cooling circulation path), such as pipe friction and heat exchanger resistance, thereby maintaining the stable circulation of the cooling medium and ensuring that the liquid cooling assembly 200 can continuously and effectively absorb and discharge the heat generated by the target workpiece 100.

[0060] The third circuit 220 includes an outlet flow path and an inlet flow path. The first pump body 240 is installed on the outlet flow path, and the third pump body 250 is also installed on the inlet flow path.

[0061] The auxiliary heat dissipation assembly 400 includes: a fourth circuit 470, on which an evaporator 450, a compressor 471, and a condenser 430 are connected, and a refrigerant flows within the fourth circuit 470; a first circuit 410, connected to the air-cooled assembly 300, with at least a portion of the condenser 430 connected to the first circuit 410; and a second circuit 440, connected to the liquid-cooled assembly 200, with at least a portion of the evaporator 450 connected to the second circuit 440.

[0062] The fourth loop 470 is the core of the auxiliary heat dissipation assembly. It includes an evaporator 450, a compressor 471, and a condenser 430, forming a complete refrigeration cycle. In this cycle, the cooling medium (such as refrigerant) absorbs heat and vaporizes in the evaporator, then is compressed to a high-pressure state by the compressor. After releasing heat and re-liquefying in the condenser, it returns to the evaporator to start the next cycle. This process not only provides the necessary cooling capacity for the liquid cooling assembly 200, but also allows for flexible adjustment of the heat dissipation strategy according to changes in ambient temperature, ensuring that the data center maintains good heat dissipation performance in different seasons.

[0063] The first loop 410 is mainly used to circulate the second cooling medium (such as air) and is connected to the air-cooled assembly 300, responsible for cooling equipment that is not suitable for or does not require liquid cooling. Part or all of the condenser 430 is connected to the first loop 410, allowing the second cooling medium to exchange heat here, absorbing the heat released by the cooling medium in the refrigeration cycle, and then dissipating this heat into the outside air. This achieves energy conversion and complementarity between air cooling and liquid cooling, improving the overall cooling efficiency of the system.

[0064] The second loop 440 is responsible for circulating the first cooling medium (such as a special coolant) and is connected to the liquid cooling assembly 200 to directly handle the heat dissipation of high heat flux density equipment. Part or all of the evaporator 450 is connected to the second loop 440, so that the first cooling medium can exchange heat with the cold medium in it, absorb the cold energy of the cold medium, thereby reducing its own temperature, and then flow back to the liquid cooling assembly to continue participating in the cooling cycle.

[0065] The auxiliary cooling component 400 is designed to ensure efficient heat dissipation at any time of year. In high-temperature summer environments, the combined operation of the compressor 471 and condenser 430 provides additional cooling capacity, ensuring that the data center is not affected by excessive temperatures. In winter or cooler seasons, the system can rely more on natural cooling, reducing compressor operating time and saving energy.

[0066] The auxiliary heat dissipation assembly 400 also includes: a liquid replenishment component 480 for storing a second cooling medium, the liquid replenishment component 480 being connected to the first circuit 410; and a second pump body 490 connected to the first circuit 410 to provide power to the second cooling medium in the first circuit 410.

[0067] The replenishment unit 480 is mainly used to store the second cooling medium. It is connected to the first loop 410 and serves to replenish and stabilize the level of the second cooling medium. During the operation of the liquid cooling system, the amount of cooling medium in the system may decrease due to evaporation, leakage, or volume expansion caused by temperature changes, affecting the cooling effect. The replenishment unit is designed to address this situation. It can automatically replenish the medium when it detects that the system medium level is insufficient, maintaining the medium level required for normal system operation. The replenishment unit 480 typically includes a storage tank, a level sensor, and an automatic replenishment control device. The storage tank stores spare second cooling medium. The level sensor monitors the medium level in the first loop 410 in real time. Once the level drops to a set threshold, the automatic replenishment control device is activated, drawing medium from the storage tank to fill the first loop, ensuring the continuity and stability of the cooling medium circulation.

[0068] This application also provides a server device, including a cooling system and a liquid-cooled cabinet, wherein the cooling system is connected to the liquid-cooled cabinet, and the cooling system is the cooling system described in the above embodiment.

[0069] In the cooling system of this application, the liquid cooling component is designed to circulate a first cooling medium that can effectively absorb and remove the heat generated by the target workpiece 100 during operation. The component includes a cooling channel through which the cooling medium directly contacts the workpiece surface for heat exchange. The high efficiency of the liquid cooling component lies in its ability to handle high heat flux density heat dissipation requirements, making it particularly suitable for cooling high-heat-generating core components such as CPUs and GPUs.

[0070] The air-cooling assembly is located on the side of the target workpiece 100. It circulates a second cooling medium (usually air) internally, and indirectly cools the workpiece through airflow generated by a fan or blower. The air-cooling assembly is used for components that are unsuitable for or do not require liquid cooling, such as network switches, memory, and hard drives, which have relatively low heat dissipation requirements.

[0071] The auxiliary heat dissipation component can selectively connect to the liquid cooling component 200, the air cooling component 300, and the target workpiece 100 according to the heat dissipation requirements of the workpiece. The cooling medium within this component can be cooling water or coolant. Through interaction with the liquid cooling and air cooling components, it redistributes heat, thereby optimizing the overall cooling efficiency. In high-temperature summer conditions, when liquid cooling or air cooling alone cannot meet the cooling requirements, the auxiliary heat dissipation component can intervene to provide additional cooling capacity.

[0072] The cooling system of this application, such as Figure 1 As shown, the liquid-cooled cabinet exchanges heat with the outdoor heatsink via a liquid-cooled CDU to cool the CPU and GPU chips. In summer, when the outdoor ambient temperature is high and the heatsink fails to lower the liquid cooling supply temperature to the target value, supplementary cooling is provided by the auxiliary cooling component 400. The auxiliary cooling component 400 provides a lower temperature to the air-cooled terminal, meeting the air supply temperature requirements of the data center, while also supplementing the cooling of the liquid-cooled cabinet, thus achieving integrated air-liquid cooling in the data center.

[0073] like Figure 2 As shown, the auxiliary heat dissipation component 400 integrates a chiller unit, a natural cooling plate heat exchanger (first heat exchanger 420), a liquid-cooled make-up cooling plate heat exchanger (second heat exchanger 460), a chilled water pump (second pump body 490), a liquid replenishment component 480, and regulating valves into one unit. High-temperature chilled water first exchanges heat with cooling water through the natural cooling plate heat exchanger before entering the evaporator for cooling. Low-temperature chilled water not only handles heat dissipation for the computer room environment but can also bypass the regulating valve to enter the make-up cooling plate heat exchanger, simultaneously providing make-up cooling for the liquid cooling system. This achieves flexible distribution of the air-liquid ratio, adapting to rapid changes in computer room load.

[0074] The auxiliary heat dissipation component 400 and the third heat exchanger 230 (liquid-cooled CDU) jointly handle the heat dissipation needs of the data center. The main components include: air-cooled component 300, liquid-cooled cabinet, radiator 210, liquid-cooled CDU, liquid-cooled circulation pump (first pump body), and cooling water pump (third pump body). Under the circulation of the liquid-cooled circulation pump and cooling water pump, the radiator cools the liquid-cooled cabinet through the liquid-cooled CDU. When the outdoor ambient temperature is high, if the liquid cooling supply temperature fails to drop to the target value, the auxiliary heat dissipation component 400 provides supplemental cooling, jointly handling the cooling load demand of the liquid-cooled cabinet. The auxiliary heat dissipation component 400 provides low-temperature chilled water to the air-cooled component 300, handling part of the air-cooled load of the data center. The auxiliary heat dissipation component 400 and the liquid-cooled CDU together achieve air-liquid fusion in the data center, with heat dissipated through the same cold source radiator.

[0075] In practical implementation, the liquid cooling circulation section is equipped with two liquid cooling circulation pumps, one for use and one for standby, or only one pump can be configured, which can be designed according to actual usage requirements.

[0076] Furthermore, the liquid-cooled CDU supply outlet is connected to the heat exchanger in the auxiliary heat dissipation component 400 via a tee. The liquid-cooled circulating refrigerant is a special solution that does not directly contact the refrigerant in the auxiliary heat dissipation component 400.

[0077] Furthermore, the liquid cooling circulating refrigerant can be deionized water, an alcohol solution, or a fluorinated liquid specifically for liquid-cooled servers, and can be designed according to actual usage requirements.

[0078] In practical implementation, the radiator can be a cooling tower, an evaporative condenser, or a dry cooler, and can be designed according to actual usage requirements.

[0079] Furthermore, the radiator and auxiliary heat dissipation components 400 are arranged in a distributed manner, or they can be integrated into a single cold source, and can be designed according to actual usage requirements.

[0080] Figure 2 This is a schematic diagram of the auxiliary heat dissipation component 400. The auxiliary heat dissipation component 400 integrates the chiller unit's compressor 471, evaporator 450, condenser 430, and expansion valve 472, as well as the natural cooling plate heat exchanger, the supplementary cooling plate heat exchanger, the chilled water pump (second pump body 490), and the liquid replenishment component 480 into one modular integrated design.

[0081] In practice, the liquid refrigerant in the evaporator absorbs heat and evaporates into gaseous refrigerant, which then enters the compressor for compression and is finally discharged into the condenser for heat dissipation. The condensed liquid refrigerant is then throttled by the expansion valve and enters the evaporator, thus creating a cycle.

[0082] Furthermore, the compressor uses an oil-free magnetic levitation centrifugal compressor, which allows the system to operate without oil, requires no maintenance, and has high energy efficiency, making it more suitable for the energy-efficient needs of data centers.

[0083] In practice, the pipeline connecting the natural heat exchanger and the condenser 430 is equipped with a cooling water bypass valve (first control valve 412) and a cooling water isolation valve (second control valve 414), which are responsible for switching the operating mode of the auxiliary heat dissipation component 400 and regulating the cooling water flow.

[0084] Furthermore, when the auxiliary heat dissipation component 400 is running in natural cooling mode, the compressor stops, the cooling water bypass valve is fully open, and the cooling water isolation valve is fully closed, so that heat exchange between the air-cooled terminal and the radiator is achieved only through natural cooling plate heat exchange.

[0085] Furthermore, when the auxiliary heat dissipation component 400 is running in the cooling mode in a high-temperature environment in summer, the compressor is running, the cooling water bypass valve is fully closed, and the cooling water isolation valve is fully open. The return water from the air-cooled terminal is first pre-cooled through the natural cooling plate heat exchanger, and then enters the condenser for heat exchange, thereby maximizing the utilization of the natural cold source.

[0086] Furthermore, when the auxiliary heat dissipation component 400 is running in the cooling mode during the spring and autumn transition season, the compressor is running. Due to the low radiator water temperature, the compressor operating pressure is extremely low. The cooling water flow rate is adjusted by regulating the opening of the cooling water bypass valve to meet the minimum cooling water flow rate required for stable operation of the auxiliary heat dissipation component 400.

[0087] In practice, a heat exchanger is added between the evaporator outlet pipe and the liquid-cooled CDU outlet pipe to exchange heat and avoid direct contact between the liquid-cooled circulating refrigerant and the main unit refrigerant.

[0088] Furthermore, a cooling adjustment valve is installed on the evaporator outlet pipe to adjust the cooling capacity, quickly adapt to changes in server load, and achieve flexible distribution of the air-liquid ratio in the computer room.

[0089] In practice, the number of chilled water pumps can be configured as follows: two units, one for use and one for standby, or only one unit can be configured, depending on the actual usage requirements.

[0090] Furthermore, the chilled water pump can be located at the inlet of the natural cooling plate heat exchanger or at the inlet of the evaporator, and the design can be tailored to the actual usage requirements.

[0091] Furthermore, the constant pressure water supply component is integrated into the auxiliary heat dissipation component 400 and is located at the inlet front of the chilled water pump to maintain stable water system pressure and prevent cavitation in the chilled water pump.

[0092] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0093] By combining liquid cooling and air cooling components, the system can flexibly address the heat dissipation needs of different parts of the target workpiece 100. The liquid cooling component handles high heat flux density, while the air cooling component is responsible for dissipating low heat flux density. This design avoids the limitations of a single cooling method, and the introduction of the auxiliary heat dissipation component 400 allows the cooling system to dynamically adjust its cooling strategy according to the actual heat load of the workpiece. It can selectively enhance liquid cooling or air cooling as needed, or directly cool the workpiece, thereby ensuring optimal cooling performance under different operating conditions.

[0094] In high-temperature environments during summer, when air cooling or liquid cooling cannot effectively dissipate heat through conventional radiators, auxiliary heat dissipation components can provide additional cooling to ensure that the temperature of the workpiece is controlled within a safe range, avoiding performance degradation or damage caused by overheating. It should be noted that the terminology used herein is for describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0095] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0096] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0097] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0098] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A cooling system for cooling a target workpiece (100), wherein the target workpiece (100) has a cooling channel disposed therein, characterized in that, The cooling system includes: A liquid cooling assembly (200) is used to circulate a first cooling medium. The liquid cooling assembly (200) is connected to the cooling channel to cool the target workpiece (100) through the first cooling medium. An air-cooling assembly (300) is disposed on the side of the target workpiece (100), and a second cooling medium flows through the air-cooling assembly (300) to blow cooling airflow onto the target workpiece (100); An auxiliary heat dissipation component (400) is used to circulate a cooling medium. The auxiliary heat dissipation component (400) is selectively connected to the liquid cooling component (200), the air cooling component (300), and the target workpiece (100), respectively.

2. The cooling system according to claim 1, characterized in that, The liquid cooling assembly (200) includes a heat sink (210), and the auxiliary heat dissipation assembly (400) includes: The first circuit (410) is connected at both ends to the heat sink (210) and the air-cooled assembly (300), respectively. The first heat exchanger (420) is connected to the first circuit (410); The condenser (430) is at least partially connected to the first circuit (410). The second cooling medium in the air-cooled assembly (300) flows sequentially through the first heat exchanger (420) and the radiator (210), or flows sequentially through the first heat exchanger (420), the condenser (430) and the radiator (210), and then flows back into the air-cooled assembly (300).

3. The cooling system according to claim 2, characterized in that, The first circuit (410) includes: The first branch (411) is connected to the liquid outlet of the first heat exchanger (420) and the liquid inlet of the radiator (210) at both ends, and a first control valve (412) is provided on the first branch (411). The second branch (413) is connected in parallel with the first branch (411), and a condenser (430) and a second control valve (414) are provided on the second branch (413). When the first control valve (412) is open and the second control valve (414) is closed, the second cooling medium in the air-cooled assembly (300) flows through the first heat exchanger (420) and the radiator (210) in sequence, and then flows back into the air-cooled assembly (300). When the first control valve (412) is closed and the second control valve (414) is open, the second cooling medium flows sequentially through the first heat exchanger (420), the condenser (430) and the radiator (210) before returning to the air-cooled assembly (300).

4. The cooling system according to claim 1, characterized in that, The auxiliary heat dissipation assembly (400) also includes: The second circuit (440) is connected to the liquid cooling assembly (200). The second circuit (440) is equipped with an evaporator (450) and a second heat exchanger (460). After the first cooling medium exchanges heat with the second heat exchanger (460), it flows back to the cooling channel.

5. The cooling system according to claim 4, characterized in that, The second circuit (440) includes: The third branch (441) is connected to the evaporator (450) and the second heat exchanger (460) at both ends. A third control valve (442) is provided on the third branch (441) to regulate the flow rate of the refrigerant in the third branch (441).

6. The cooling system according to claim 1, characterized in that, The liquid cooling assembly (200) includes: The third circuit (220) is connected to the cooling channel. The third circuit (220) is equipped with a third heat exchanger (230) and a radiator (210). The first cooling medium flows through the third heat exchanger (230) and the radiator (210) in sequence and then flows back into the cooling channel.

7. The cooling system according to claim 6, characterized in that, The liquid cooling assembly (200) also includes: A first pump body (240) is disposed on and connected to the third circuit (220), and provides power to the first cooling medium in the third circuit (220) through the first pump body (240).

8. The cooling system according to claim 1, characterized in that, The auxiliary heat dissipation component (400) includes: The fourth circuit (470) is connected to an evaporator (450), a compressor (471) and a condenser (430), and is used to circulate a refrigerant. A first circuit (410) is connected to the air-cooled assembly (300), and at least a portion of the condenser (430) is connected to the first circuit (410); The second circuit (440) is connected to the liquid cooling assembly (200), and at least a portion of the evaporator (450) is connected to the second circuit (440).

9. The cooling system according to claim 8, characterized in that, The auxiliary heat dissipation assembly (400) also includes: A replenishment component (480) is used to store the second cooling medium, and the replenishment component (480) is connected to the first circuit (410); The second pump body (490) is connected to the first circuit (410) to provide power to the second cooling medium in the first circuit (410).

10. A server device, comprising a cooling system and a liquid-cooled cabinet, wherein the cooling system is connected to the liquid-cooled cabinet, characterized in that, The cooling system is the cooling system according to any one of claims 1 to 9.

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