Ultra-thin dielectric layer electronic transformer circuit board with high-power current-bearing hole and processing technology of ultra-thin dielectric layer electronic transformer circuit board

Abstract

The invention discloses an ultra-thin dielectric layer electronic transformer circuit board with a high-power current-bearing hole and a processing technology thereof, the circuit board comprises a body, the body contains multiple layers of circuit units, ultra-thin dielectric layers and high-power current-bearing channels, the ultra-thin dielectric layers are separated from the adjacent circuit units to realize electrical isolation and reduce the thickness, and the high-power current-bearing channels are formed in the ultra-thin dielectric layers. The high-power current bearing channel penetrates through the multi-layer structure to realize stable electric connection and high-power bearing; and meanwhile, the magnetic core assembly structure ensures that the magnetic core is accurately fixed to enhance electromagnetic coupling. According to the processing technology, accurate compounding of a multi-layer structure is achieved through the steps of base material pretreatment, dielectric layer preparation and the like. The circuit board is light, thin and high in integration level, the high-power bearing stability and the energy conversion efficiency are improved, and the circuit board is suitable for large-scale production.

Description

Technical Field

[0001] This invention relates to the field of electronic transformer circuit board technology, specifically to an ultra-thin dielectric layer electronic transformer circuit board with high-power current-carrying holes and its processing technology. Background Technology

[0002] With the miniaturization and high-power development of electronic devices, higher requirements are placed on the integration, thinness, and current carrying capacity of electronic transformer circuit boards. Existing electronic transformer circuit boards generally suffer from the following shortcomings: First, the dielectric layer is relatively thick, resulting in a large overall circuit board size, making it difficult to adapt to the needs of miniaturized devices. Furthermore, the thick dielectric layer weakens the electromagnetic coupling effect between winding circuits, affecting energy conversion efficiency. Second, the conductive layer of the current-carrying holes lacks density, easily leading to voids and defects, limiting current carrying capacity, and making them prone to failure due to localized overheating under high-power conditions. Third, the core assembly structure design is unreasonable, resulting in low core positioning accuracy and insecure fixing, easily leading to loosening, which in turn affects electromagnetic induction stability and reduces energy conversion performance. Fourth, the manufacturing process struggles to simultaneously achieve precise composite of ultra-thin dielectric layers, highly dense conductive layers, and multi-layer structures, making it difficult to guarantee yield and reliability. These problems limit the application of electronic transformer circuit boards in high-power, miniaturized electronic devices. Therefore, this paper proposes an electronic transformer circuit board and its supporting process that combines thinness, high power carrying capacity, and stable electromagnetic conversion performance. Summary of the Invention

[0003] The purpose of this invention is to provide an ultra-thin dielectric layer electronic transformer circuit board with high-power current-carrying holes and its processing technology, so as to solve the technical problems of existing electronic transformer circuit boards being difficult to adapt to the needs of miniaturized equipment, prone to failure due to local overheating under high power conditions, poor stability, and low yield and reliability of processing technology.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] An electronic transformer circuit board with an ultra-thin dielectric layer and a high-power current-carrying channel includes an electronic transformer circuit board body, which includes multi-layer circuit units, an ultra-thin dielectric layer, and a high-power current-carrying channel.

[0006] An ultra-thin dielectric layer is spaced between two adjacent circuit units to achieve electrical isolation between adjacent circuit units and reduce the overall thickness of the circuit board.

[0007] The high-power current-carrying channel runs through multiple circuit units and an ultra-thin dielectric layer to achieve electrical connection between different circuit units and carry high-power current.

[0008] The circuit unit includes a primary winding circuit and a secondary winding circuit. The primary winding circuit is connected to the external input circuit, and the secondary winding circuit is connected to the external output circuit. The primary winding circuit and the secondary winding circuit realize energy conversion through electromagnetic induction. The high-power current-carrying channel is connected to the primary winding circuit and the secondary winding circuit respectively to realize the current conduction of the multi-layer winding circuit.

[0009] As a preferred embodiment of the present invention, the ultrathin dielectric layer is made of a low-loss insulating material, wherein the dielectric loss tangent of the low-loss insulating material is not greater than 0.002 and the breakdown field strength is not less than 20kV / mm.

[0010] As a preferred embodiment of the present invention, the thickness of the ultrathin dielectric layer is no greater than 20 micrometers, and the interlayer spacing formed between two adjacent circuit units through the ultrathin dielectric layer is no greater than 25 micrometers.

[0011] As a preferred embodiment of the present invention, the inner wall of the high-power current-carrying channel is provided with a dense conductive layer, the thickness of the dense conductive layer is not less than 25 micrometers, the aperture range of the high-power current-carrying channel is 80 micrometers to 200 micrometers, the depth-to-diameter ratio is not less than 4:1, and there are no voids or defects inside the channel.

[0012] As a preferred embodiment of the present invention, it also includes a magnetic core assembly structure, which is an integral structure formed by multiple circuit units and an ultra-thin dielectric layer. The magnetic core assembly structure, together with the primary winding circuit and the secondary winding circuit, forms an electromagnetic induction region to improve electromagnetic coupling efficiency.

[0013] The magnetic core assembly structure includes an annular magnetic core slot, positioning bosses, and a magnetic core pressing part. The annular magnetic core slot is arranged through the thickness direction of the multi-layer circuit unit and the ultra-thin dielectric layer, and the inner wall of the annular magnetic core slot is provided with an insulating protective layer. The positioning bosses are evenly distributed at the two ends of the annular magnetic core slot to achieve precise positioning of the magnetic core. The magnetic core pressing part is located on the outside of the positioning bosses and is used to press and fix the magnetic core embedded in the annular magnetic core slot. The magnetic core pressing part is an elastic metal pressure plate, which is detachably connected to the electronic transformer circuit board body by screws.

[0014] The present invention also provides a processing technology for the above-mentioned circuit board, including the following steps:

[0015] Step 1: Substrate pretreatment. Select a high thermal conductivity substrate and roughen and clean its surface.

[0016] Step 2, preparation of ultrathin dielectric layer: an ultrathin dielectric layer is prepared on the surface of the pretreated substrate using a vacuum deposition process, and the thickness and uniformity of the dielectric layer are controlled.

[0017] Step 3: Circuit forming. Primary and secondary winding circuits are fabricated on the surface of an ultra-thin dielectric layer using photolithography and etching processes.

[0018] Step 4: Processing of flow-carrying holes. Through holes are machined at preset positions using laser drilling technology, and then the inner wall of the through holes is activated.

[0019] Step 5: Forming of high-power current-carrying channels. A two-step pulse electroplating method is used to fill the through holes, forming a high-power current-carrying channel without voids.

[0020] Step 6: Lamination and composite. Repeat steps 2 to 5 to prepare a multilayer circuit structure, and then use a low-temperature lamination process to composite the multilayer structure into one piece.

[0021] Step 7, post-processing: The composite circuit board undergoes surface solder mask treatment and shape processing to obtain the finished circuit board.

[0022] As a further preferred embodiment of the present invention, the vacuum deposition process in step two adopts a cyclic deposition-oxidation mode, the deposition temperature is controlled between 80°C and 120°C, the vacuum degree is not lower than 10^-3Pa, and the thickness of the ultrathin dielectric layer is precisely controlled by controlling the number of deposition cycles.

[0023] As a further preferred embodiment of the present invention, the laser drilling process in step four adopts ultraviolet laser direct copper drilling technology, with a laser pulse frequency of 500Hz to 1000Hz. After drilling, the hole wall is subjected to plasma etching treatment to remove residual impurities on the hole wall and enhance the bonding force between the hole wall and the conductive layer.

[0024] As a further preferred embodiment of the present invention, the specific parameters of the two-step pulse electroplating method in step five are as follows: the first step is a forward pulse current density of 3-8 ASD, a frequency of 50-200 Hz, and a duty cycle of 3:1-4:1; the second step is a reverse pulse current density of 1-3 ASD, a frequency of 500-1000 Hz, and a duty cycle of 1:1. Ultrasonic stirring is used during the electroplating process.

[0025] As a further preferred embodiment of the present invention, the pressing temperature of the low-temperature pressing process in step six is ​​120°C to 150°C, the pressure is 2-4 MPa, the heat and pressure holding time is 30-60 minutes, and an inert gas is introduced for protection during the pressing process.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. Achieving both thinness and high integration: By using an ultra-thin dielectric layer to separate adjacent circuit units, the overall thickness of the circuit board is significantly reduced while ensuring reliable electrical isolation. At the same time, the integrated design of multi-layer circuit units improves the integration of the circuit board, making it suitable for the installation requirements of miniaturized electronic devices.

[0028] 2. Enhanced high-power carrying capacity and transmission stability: The dense conductive layer and void-free structure of the inner wall of the high-power current carrying channel enhance the conductivity and current carrying capacity of the channel, ensuring the stable conduction of high-power current between multi-layer circuit units, avoiding local overheating or current interruption faults, and enabling the circuit board to stably adapt to high-power operating conditions.

[0029] 3. Enhanced electromagnetic coupling and energy conversion efficiency: The ultra-thin dielectric layer reduces the interlayer spacing between adjacent circuit units. Combined with the magnetic core assembly structure, the magnetic core and winding circuit are enclosed to form a highly efficient electromagnetic induction area, which significantly enhances the electromagnetic coupling effect between the primary winding circuit and the secondary winding circuit, improves energy conversion efficiency, and reduces energy loss.

[0030] 4. Ensuring assembly precision and operational stability: The annular core groove, positioning boss, and core pressing part of the core assembly structure work together to achieve precise positioning and firm fixation of the core, preventing the core from loosening and affecting the electromagnetic induction effect; the insulating protective layer on the inner wall of the annular core groove prevents electrical interference between the core and the circuit unit, further ensuring the stability of the circuit board operation.

[0031] 5. Reliable process and adaptable to large-scale production: The supporting processing technology achieves precise preparation and reliable composite of each component through orderly substrate pretreatment, ultra-thin dielectric layer preparation, circuit forming and other steps. Low temperature pressing, pulse electroplating and other processes ensure that the performance of the components is not damaged and improve the yield. The entire process flow is reasonable and highly operable, which can meet the needs of large-scale production. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a structural illustration of an embodiment of the present invention. Figure 1 ;

[0034] Figure 2 for Figure 1 Enlarged structural diagram at point A;

[0035] Figure 3 This is a structural illustration of an embodiment of the present invention. Figure 2 .

[0036] Figure label:

[0037] 1. Electronic transformer circuit board body; 101. Circuit unit; 102. Ultra-thin dielectric layer; 103. High-power current carrying channel;

[0038] 2. Core assembly structure; 201. Annular core groove; 202. Positioning boss; 203. Core pressing part. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

[0040] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0041] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present invention should be understood according to the specific circumstances.

[0042] Example 1:

[0043] See Figures 1-3 As shown, an embodiment of the present invention provides an electronic transformer circuit board with an ultra-thin dielectric layer and a high-power current-carrying via, comprising an electronic transformer circuit board body 1, which includes a multilayer circuit unit 101, an ultra-thin dielectric layer 102, and a high-power current-carrying channel 103.

[0044] An ultra-thin dielectric layer 102 is spaced between two adjacent circuit units 101 to achieve electrical isolation between adjacent circuit units 101 and reduce the overall thickness of the circuit board.

[0045] The high-power current-carrying channel 103 runs through the multilayer circuit unit 101 and the ultra-thin dielectric layer 102, and is used to realize the electrical connection between different circuit units 101 and carry high-power current.

[0046] The circuit unit 101 includes a primary winding circuit and a secondary winding circuit. The primary winding circuit is connected to an external input circuit, and the secondary winding circuit is connected to an external output circuit. The primary winding circuit and the secondary winding circuit realize energy conversion through electromagnetic induction. The high-power current-carrying channel 103 is connected to the primary winding circuit and the secondary winding circuit respectively to realize the current conduction of the multi-layer winding circuit.

[0047] By integrating the electronic transformer circuit board body 1, the ultra-thin dielectric layer 102 effectively reduces the overall thickness of the circuit board while achieving electrical isolation between adjacent circuit units 101; the high-power current-carrying channel 103 ensures stable electrical connection between different circuit units 101, realizing reliable conduction of high-power current; the primary winding circuit and the secondary winding circuit work together to complete the electromagnetic induction energy conversion, combined with the current conduction function of the high-power current-carrying channel 103, so that the circuit board can meet the requirements of thinness and lightness and high-power energy conversion and transmission capabilities, thereby improving the integration and applicability of the electronic transformer circuit board.

[0048] The ultra-thin dielectric layer 102 is made of low-loss insulating material. The dielectric loss tangent of the low-loss insulating material is no greater than 0.002, and the breakdown field strength is no less than 20kV / mm. While maintaining reliable electrical isolation between adjacent circuit units 101, the ultra-thin dielectric layer 102 reduces energy loss in the dielectric layer, improves the energy conversion efficiency of the circuit board, and the characteristics of the low-loss insulating material ensure the insulation stability of the ultra-thin dielectric layer 102 under high-power conditions, thus extending the service life of the circuit board.

[0049] The thickness of the ultrathin dielectric layer 102 is no greater than 20 micrometers, and the interlayer spacing formed between two adjacent circuit units 101 through the ultrathin dielectric layer 102 is no greater than 25 micrometers. The thinness of the ultrathin dielectric layer 102 further enhances the effect of the circuit board's lightweight design. Reducing the interlayer spacing between adjacent circuit units 101 helps to enhance the electromagnetic coupling effect between the primary winding circuit and the secondary winding circuit, improving energy transmission efficiency. At the same time, the simplified interlayer structure reduces the amount of material used and the processing difficulty of the circuit board. The low-loss insulating material includes one of polyimide (PI), polyphenylene oxide (PPO), and liquid crystal polymer (LCP). These materials have low dielectric loss characteristics, which can meet the preparation requirements of the ultrathin dielectric layer 102, ensuring the electrical isolation effect of adjacent circuit units 101 and reducing energy loss.

[0050] The inner wall of the high-power current-carrying channel 103 is provided with a dense conductive layer with a thickness of not less than 25 micrometers. The aperture of the high-power current-carrying channel 103 ranges from 80 micrometers to 200 micrometers, with a depth-to-diameter ratio of not less than 4:1, and there are no voids or defects inside the channel. The dense conductive layer on the inner wall of the high-power current-carrying channel 103 improves the conductivity and current carrying capacity of the channel. The void-free channel structure ensures the continuity and stability of current conduction, avoids overheating problems caused by local current concentration, ensures the reliability of current conduction between multilayer circuit units 101, and enables the circuit board to stably adapt to high-power operating conditions.

[0051] The material of the dense conductive layer on the inner wall of the high-power current-carrying channel 103 is as follows:

[0052] 1. Electrolytic copper: It has excellent electrical conductivity and a dense structure after deposition, which can effectively reduce the resistance to current conduction and meet the requirements of high power current carrying capacity. At the same time, electrolytic copper has good compatibility with the metal circuit of the circuit unit 101. Through the electroplating process, it can achieve a firm bond with the through hole wall, ensuring the stability of current conduction.

[0053] 2. Silver-copper alloy: Based on the high conductivity of copper, the addition of silver further improves the conductivity efficiency. The alloy structure is more compact and has better wear resistance and oxidation resistance than pure copper. It can reduce the loss of the conductive layer under high power conditions and extend the service life of the high power current-carrying channel 103.

[0054] 3. Nickel-gold alloy: The nickel layer has good substrate adhesion, which can enhance the bonding force between the conductive layer and the through hole wall, while the outer gold layer has extremely high conductivity and corrosion resistance. It is suitable for high-power scenarios with extremely high reliability requirements and can effectively avoid current conduction failures caused by oxidation and corrosion of the conductive layer.

[0055] An embodiment of the present invention provides an electronic transformer circuit board with a high-power current-carrying hole and an ultra-thin dielectric layer, which also includes a magnetic core assembly structure 2. The magnetic core assembly structure 2 penetrates the overall structure formed by the multi-layer circuit unit 101 and the ultra-thin dielectric layer 102. The magnetic core assembly structure 2, together with the primary winding circuit and the secondary winding circuit, forms an electromagnetic induction region to improve electromagnetic coupling efficiency.

[0056] The magnetic core assembly structure 2 includes an annular magnetic core groove 201, a positioning boss 202, and a magnetic core pressing part 203. The annular magnetic core groove 201 is arranged through the thickness direction of the multilayer circuit unit 101 and the ultra-thin dielectric layer 102, and the inner wall of the annular magnetic core groove 201 is provided with an insulating protective layer. The positioning bosses 202 are evenly distributed at the two ends of the annular magnetic core groove 201 to achieve precise positioning of the magnetic core. The magnetic core pressing part 203 is arranged on the outside of the positioning bosses 202 to press and fix the magnetic core embedded in the annular magnetic core groove 201. The magnetic core pressing part 203 is an elastic metal pressure plate, which is detachably connected to the electronic transformer circuit board body 1 by screws. The addition of the magnetic core assembly structure 2 allows the magnetic core to be stably assembled on the circuit board. The annular magnetic core groove 201 provides a precise installation space for the magnetic core, and the insulating protective layer on its inner wall prevents electrical interference between the magnetic core and the circuit unit 101. The positioning boss 202 ensures the accuracy of the magnetic core installation position, and the magnetic core pressing part 203 achieves a stable fixation of the magnetic core, effectively preventing the magnetic core from loosening and affecting the electromagnetic induction effect. The electromagnetic induction area formed by the magnetic core, the primary winding circuit, and the secondary winding circuit significantly improves the electromagnetic coupling efficiency and further enhances the energy conversion performance of the circuit board.

[0057] Example 2:

[0058] The processing technology of Embodiment 1 of the present invention includes the following steps:

[0059] Step 1: Substrate pretreatment. Select a high thermal conductivity substrate and roughen and clean its surface.

[0060] Step 2, preparation of ultrathin dielectric layer: ultrathin dielectric layer 102 is prepared on the surface of pretreated substrate using vacuum deposition process, and the thickness and uniformity of dielectric layer are controlled.

[0061] Step 3: Circuit forming. Primary winding circuit and secondary winding circuit are prepared on the surface of ultrathin dielectric layer 102 by photolithography etching process.

[0062] Step 4: Processing of flow-carrying holes. Through holes are machined at preset positions using laser drilling technology, and then the inner wall of the through holes is activated.

[0063] Step 5: Forming of high-power current-carrying channel. A two-step pulse electroplating method is used to fill the through holes to form a void-free high-power current-carrying channel 103.

[0064] Step 6: Lamination and composite. Repeat steps 2 to 5 to prepare a multilayer circuit structure, and then use a low-temperature lamination process to composite the multilayer structure into one piece.

[0065] Step 7, post-processing: The composite circuit board undergoes surface solder mask treatment and shape processing to obtain the finished circuit board.

[0066] The above steps achieve the precise fabrication and reliable composite of the multilayer circuit unit 101, the ultra-thin dielectric layer 102, and the high-power current-carrying channel 103. The reasonable connection of each link ensures the structural integrity and connection reliability of each component of the finished circuit board, and ensures that the circuit board can stably achieve the designed thinness, high power carrying capacity and high-efficiency energy conversion performance. At the same time, the process flow is operable and easy to mass-produce.

[0067] In step two, the vacuum deposition process employs a cyclic deposition-oxidation mode, with the deposition temperature controlled between 80℃ and 120℃ and the vacuum level not lower than 10⁻³ Pa. The thickness of the ultrathin dielectric layer 102 is precisely controlled by adjusting the number of deposition cycles. This cyclic deposition-oxidation vacuum deposition process allows for precise control of the thickness and uniformity of the ultrathin dielectric layer 102, ensuring consistent insulation performance across all areas of the layer. This avoids localized insulation weaknesses caused by uneven dielectric layer thickness, providing a process guarantee for reliable isolation of adjacent circuit units 101 and stable operation of the circuit board.

[0068] In step four, the laser drilling process employs ultraviolet laser direct copper drilling technology with a laser pulse frequency of 500Hz to 1000Hz. After drilling, the hole wall undergoes plasma etching to remove residual impurities and enhance the adhesion between the hole wall and the conductive layer. Ultraviolet laser direct copper drilling technology improves the processing accuracy and efficiency of through holes, reducing damage to the substrate and the formed structure. Plasma etching effectively removes residual impurities from the hole wall, enhances the adhesion between the hole wall and the subsequent dense conductive layer, ensures the connection stability between the high-power current-carrying channel 103 and the hole wall, and improves the forming quality of the high-power current-carrying channel 103.

[0069] The specific parameters for the two-step pulse electroplating method in step five are as follows: Step one: forward pulse current density 3-8 ASD, frequency 50-200 Hz, duty cycle 3:1-4:1; Step two: reverse pulse current density 1-3 ASD, frequency 500-1000 Hz, duty cycle 1:1. Ultrasonic-assisted stirring is used during the electroplating process. This two-step pulse electroplating method, combined with ultrasonic-assisted stirring, can precisely control the deposition quality of the dense conductive layer, improve the density and uniformity of the conductive layer, ensure that the high-power current-carrying channel 103 is free of voids and defects, further enhance the current carrying capacity and conductivity stability of the high-power current-carrying channel 103, and ensure the reliability and consistency of the electroplating process.

[0070] In step six, the low-temperature lamination process involves a lamination temperature of 120℃ to 150℃, a pressure of 2-4 MPa, and a holding time of 30-60 minutes. Inert gas is introduced for protection during the lamination process. This low-temperature lamination process avoids damage to components such as the ultra-thin dielectric layer 102 and circuit unit 101 caused by high temperatures, ensuring that the original performance of each component is not compromised. Inert gas protection prevents oxidation of components during lamination, improving the composite quality and stability of the multilayer structure. Reasonable lamination parameters ensure a tight fit between the multilayer structures, avoiding interlayer delamination and guaranteeing the structural strength and operational reliability of the finished circuit board.

[0071] Usage method of this invention embodiment:

[0072] 1. Core installation: First, align the matching core with the annular core slot 201 on the electronic transformer circuit board body 1. Use the positioning boss 202 to calibrate the core position to ensure that the core is accurately embedded in the annular core slot 201. Then, attach the elastic metal pressure plate of the core pressing part 203 to both ends of the core and use screws to fix the elastic metal pressure plate to the electronic transformer circuit board body 1 to complete the firm assembly of the core.

[0073] 2. Circuit connection: Connect the terminals of the external input circuit to the primary winding circuit in the circuit unit 101 to ensure a firm connection and good contact; connect the terminals of the external output circuit to the secondary winding circuit in the circuit unit 101 to complete the circuit loop construction.

[0074] 3. Operation: After connection, start the external power supply equipment. The power is transmitted to the primary winding circuit through the external input circuit. The circuit board realizes energy conversion through electromagnetic induction. The converted power is output to the external output circuit through the secondary winding circuit to power the subsequent electronic equipment. During operation, the high-power current carrying channel 103 realizes the current conduction between the multi-layer circuit units 101 to ensure the stable transmission of high-power current.

[0075] 4. Maintenance and inspection: Regularly check the fixing of the magnetic core crimping part 203. If the elastic metal pressure plate is found to be loose, tighten the screws in time. Check whether there is oxidation, loosening or other problems at the circuit connection parts. Clean or reconnect if necessary. Check whether there is overheating, damage or other abnormalities on the surface of the electronic transformer circuit board body 1 to ensure stable operation of the circuit board.

[0076] In this embodiment of the invention, the electronic transformer circuit board achieves efficient conversion and stable transmission of high-power energy through the synergistic effect of the multi-layer circuit unit 101, the ultra-thin dielectric layer 102, the high-power current-carrying channel 103, and the magnetic core assembly structure 2 of the electronic transformer circuit board body 1.

[0077] 1. Basic Energy Conversion and Conduction: The external input circuit is connected to the primary winding circuit in the circuit unit 101, inputting electrical energy into the primary winding circuit. After the primary winding circuit is energized, it generates an alternating magnetic field. Since the primary winding circuit and the secondary winding circuit are spaced apart by an ultra-thin dielectric layer 102, and the ultra-thin dielectric layer 102 is relatively thin, the electromagnetic coupling effect between the two can be enhanced. The alternating magnetic field generated by the primary winding circuit can act efficiently on the secondary winding circuit, realizing the conversion of electrical energy to the secondary winding circuit through electromagnetic induction. The converted electrical energy is output from the secondary winding circuit to the external output circuit.

[0078] 2. Multi-layer structure synergy: The high-power current-carrying channel 103 runs through the multi-layer circuit unit 101 and the ultra-thin dielectric layer 102. The dense conductive layer on its inner wall ensures a stable electrical connection between different layers of circuit units 101, so that the multi-layer primary winding circuit and the multi-level winding circuit can form complete current loops respectively, improving the overall current carrying capacity and meeting the requirements of high-power operation. The ultra-thin dielectric layer 102 achieves electrical isolation between adjacent circuit units 101 while effectively controlling the overall thickness of the circuit board and ensuring the thin and light characteristics.

[0079] 3. Core Assembly Auxiliary Enhancement: The magnetic core is installed and fixed through the magnetic core assembly structure 2. The annular magnetic core groove 201 provides a suitable installation space for the magnetic core, the positioning boss 202 ensures the accurate installation position of the magnetic core, and the magnetic core pressing part 203 presses and fixes the magnetic core to prevent the magnetic core from loosening. After installation, the magnetic core, primary winding line and secondary winding line form a closed electromagnetic induction area, which further improves the electromagnetic coupling efficiency and enhances the energy conversion performance. At the same time, the insulating protective layer on the inner wall of the annular magnetic core groove 201 can prevent electrical interference between the magnetic core and the line unit 101, ensuring operational stability.

[0080] The foregoing has shown and described the basic principles of the present invention. The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. The above embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Any modifications, equivalent substitutions, and improvements made within the scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-power current-carrying via ultra-thin dielectric layer electronic transformer circuit board, characterized in that: The circuit board includes an electronic transformer circuit board body (1), which comprises a multilayer circuit unit (101), an ultra-thin dielectric layer (102), and a high-power current-carrying channel (103), wherein: The ultrathin dielectric layer (102) is spaced between two adjacent circuit units (101) to achieve electrical isolation between adjacent circuit units (101) and reduce the overall thickness of the circuit board; The high-power current-carrying channel (103) runs through the multilayer circuit unit (101) and the ultra-thin dielectric layer (102) to realize the electrical connection between different circuit units (101) and carry high-power current; The circuit unit (101) includes a primary winding circuit and a secondary winding circuit. The primary winding circuit is connected to an external input circuit, and the secondary winding circuit is connected to an external output circuit. The primary winding circuit and the secondary winding circuit achieve energy conversion through electromagnetic induction. The high-power current-carrying channel (103) is connected to the primary winding circuit and the secondary winding circuit respectively to realize the current conduction of the multi-layer winding circuit.

2. The ultra-thin dielectric layer electronic transformer circuit board with high-power current-carrying vias according to claim 1, characterized in that: The ultrathin dielectric layer (102) is made of a low-loss insulating material, wherein the dielectric loss tangent of the low-loss insulating material is not greater than 0.002 and the breakdown field strength is not less than 20kV / mm.

3. The ultra-thin dielectric layer electronic transformer circuit board with high-power current-carrying vias according to claim 1, characterized in that: The thickness of the ultrathin dielectric layer (102) is no greater than 20 micrometers, and the interlayer spacing formed between two adjacent circuit units (101) through the ultrathin dielectric layer (102) is no greater than 25 micrometers.

4. The ultra-thin dielectric layer electronic transformer circuit board with high-power current-carrying vias according to claim 1, characterized in that: The inner wall of the high-power current-carrying channel (103) is provided with a dense conductive layer, the thickness of the dense conductive layer is not less than 25 micrometers, the aperture range of the high-power current-carrying channel (103) is 80 micrometers to 200 micrometers, the depth-to-diameter ratio is not less than 4:1, and there are no voids or defects inside the channel.

5. The ultra-thin dielectric layer electronic transformer circuit board with high-power current-carrying vias according to claim 1, characterized in that: It also includes a magnetic core assembly structure (2), which penetrates the overall structure formed by the multi-layer circuit unit (101) and the ultra-thin dielectric layer (102). The magnetic core assembly structure (2) together with the primary winding circuit and the secondary winding circuit forms an electromagnetic induction area to improve electromagnetic coupling efficiency. The magnetic core assembly structure (2) includes an annular magnetic core groove (201), a positioning boss (202), and a magnetic core pressing part (203). The annular magnetic core groove (201) is arranged through the thickness direction of the multilayer circuit unit (101) and the ultra-thin dielectric layer (102). The inner wall of the annular magnetic core groove (201) is provided with an insulating protective layer. The positioning boss (202) is evenly distributed at the edges of the two ends of the annular magnetic core groove (201) to achieve precise positioning of the magnetic core. The magnetic core pressing part (203) is arranged outside the positioning boss (202) to press and fix the magnetic core embedded in the annular magnetic core groove (201). The magnetic core pressing part (203) is an elastic metal plate. The elastic metal plate is detachably connected to the electronic transformer circuit board body (1) by screws.

6. The processing technology of an ultra-thin dielectric layer electronic transformer circuit board with high-power current-carrying vias as described in any one of claims 1-5, characterized in that... Includes the following steps: Step 1: Substrate pretreatment. Select a high thermal conductivity substrate and roughen and clean its surface. Step 2, preparation of ultrathin dielectric layer: an ultrathin dielectric layer (102) is prepared on the surface of the pretreated substrate using a vacuum deposition process, and the thickness and uniformity of the dielectric layer are controlled. Step 3, circuit forming: the primary winding circuit and the secondary winding circuit are prepared on the surface of the ultrathin dielectric layer (102) by photolithography and etching process; Step 4: Processing of flow-carrying holes. Through holes are machined at preset positions using laser drilling technology, and then the inner wall of the through holes is activated. Step 5: Forming of high-power current-carrying channel. The through hole is filled by a two-step pulse electroplating method to form a high-power current-carrying channel (103) without voids. Step 6: Lamination and composite. Repeat steps 2 to 5 to prepare a multilayer circuit structure, and then use a low-temperature lamination process to composite the multilayer structure into one piece. Step 7, post-processing: The composite circuit board undergoes surface solder mask treatment and shape processing to obtain the finished circuit board.

7. The processing technology according to claim 6, characterized in that: The vacuum deposition process described in step two adopts a cyclic deposition-oxidation mode, with the deposition temperature controlled between 80°C and 120°C and the vacuum degree not lower than 10-3 Pa. The thickness of the ultrathin dielectric layer (102) is precisely controlled by controlling the number of deposition cycles.

8. The processing technology according to claim 6, characterized in that: The laser drilling process described in step four uses ultraviolet laser direct copper drilling technology with a laser pulse frequency of 500Hz to 1000Hz. After drilling, the hole wall is subjected to plasma etching treatment to remove residual impurities and enhance the adhesion between the hole wall and the conductive layer.

9. The processing technology according to claim 6, characterized in that: The specific parameters of the two-step pulse electroplating method described in step five are as follows: the first step is a forward pulse current density of 3-8 ASD, a frequency of 50-200 Hz, and a duty cycle of 3:1-4:1; the second step is a reverse pulse current density of 1-3 ASD, a frequency of 500-1000 Hz, and a duty cycle of 1:

1. Ultrasonic stirring is used during the electroplating process.

10. The processing technology according to claim 6, characterized in that: The low-temperature pressing process described in step six involves a pressing temperature of 120°C to 150°C, a pressure of 2-4 MPa, and a holding time of 30-60 minutes. Inert gas is introduced for protection during the pressing process.

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