Machine room heat dissipation system and method for optimizing local airflow organization

Abstract

The invention discloses a machine room heat dissipation system and method for optimizing local airflow organization. The system comprises an air conditioning unit, a server rack and an adjusting device, the adjusting device is arranged on the server rack and comprises a sensing unit, a flow guide unit and a control unit, the sensing unit is used for detecting the air inlet temperature and the air outlet temperature of the server rack, the flow guide unit is located on an air inlet path of the server rack, and the control unit is used for controlling the flow guide unit. The flow guide state of the flow guide unit can be adjusted so as to change the flow and direction of cooling airflow flowing to the server rack, the control unit is connected with the sensing unit and the flow guide unit, and the control unit is configured to generate a control instruction based on the air inlet temperature and the air outlet temperature so as to dynamically adjust the flow guide state of the flow guide unit. According to the invention, on the premise of rack-level accurate perception, intelligent on-demand distribution is taken as a core means, flexible deployment and adaptation are taken as a guarantee, and safe, efficient, energy-saving and intelligent operation and maintenance targets are achieved.

Description

Technical Field

[0001] This invention relates to the fields of infrastructure and IT support technology, and in particular to a data center heat dissipation system and method with optimized local airflow organization. Background Technology

[0002] In data center server rooms, especially older ones using diffused airflow, there is a common problem of a mismatch between the cooling capacity of the server room-level air conditioning and the requirements of the server racks. Related technologies mainly rely on the server room air conditioning to distribute air evenly and on sensors deployed in the aisles to monitor the macroscopic ambient temperature. However, this method cannot accurately sense the intake and exhaust temperatures of individual racks, causing high-power-density racks to form localized hotspots due to insufficient airflow, which are difficult to detect in a timely manner.

[0003] Some data centers have attempted improvements using a "air conditioning + plenum box + manual louvers" solution, but the louver angle requires manual on-site adjustment, resulting in sluggish response and an inability to dynamically adapt to real-time changes in rack load. Furthermore, given the challenges of inconsistent rack specifications and high retrofit costs in older data centers, standardized solutions such as enclosed hot and cold aisles are often difficult to implement. Consequently, the relevant technical systems exhibit significant shortcomings in the precise perception, dynamic adjustment, and low-cost adaptation of rack-level airflow organization. Summary of the Invention

[0004] The present invention aims to at least partially solve one of the technical problems in the related art.

[0005] To this end, embodiments of the present invention propose a data center cooling system with optimized local airflow organization. Based on rack-level precise sensing, intelligent on-demand allocation is the core means, and flexible deployment and adaptation are the guarantee, achieving the operation and maintenance goals of safety, efficiency, energy saving and intelligence.

[0006] The local airflow organization optimization data center cooling system of this invention includes an air conditioning unit, server racks, and regulating devices. The air conditioning unit is used to supply air to the data center space. There are multiple server racks arranged at intervals within the data center. There are also multiple regulating devices, each corresponding to one of the server racks. Each regulating device is located on a server rack and includes a sensing unit, a flow guiding unit, and a control unit. The sensing unit is used to detect the inlet and outlet air temperatures of the server racks. The flow guiding unit is located on the inlet air path of the server racks and its flow guiding state is adjustable to change the flow rate and direction of the cooling airflow to the server racks. The control unit is connected to the sensing unit and the flow guiding unit and is configured to generate control commands based on the inlet and outlet air temperatures to dynamically adjust the flow guiding state of the flow guiding unit.

[0007] In some embodiments, the airflow guiding unit includes a mounting bracket and at least one angle-adjustable air guide plate, the mounting bracket being detachably connected to the server rack, the air guide plate being rotatably disposed on the mounting bracket, and the air guide plate being configured to change its angle with the front of the server rack by rotating about an axis.

[0008] In some embodiments, the angle adjustment range of the air guide plate is between -90 degrees and 90 degrees. When the angle of the air guide plate is 0 degrees, the surface of the air guide plate is parallel to the front of the server rack. When the angle of the air guide plate is positive, the air guide plate guides the airflow to the server rack. When the angle of the air guide plate is negative, the air guide plate blocks the airflow to the server rack.

[0009] In some embodiments, the airflow guiding unit further includes a driving member connected to the air guide plate, the driving member being used to drive the air guide plate to rotate according to the instructions of the control unit.

[0010] In some embodiments, the regulating device further includes an air supply unit disposed inside the airflow guiding unit, the air supply unit being used to actively enhance the cooling airflow toward the server rack during startup.

[0011] In some embodiments, the control unit is further configured to activate the air supply unit when it is determined that the air guiding unit has been adjusted to the maximum air guiding state and the outlet air temperature is still higher than a preset safety threshold.

[0012] In some embodiments, the sensing unit includes an inlet air temperature sensor and an outlet air temperature sensor. The inlet air temperature sensor is located on the outlet side of the airflow guiding unit and is used to detect the temperature of the cooling airflow about to enter the server rack. The outlet air temperature sensor is located on the outlet side of the server rack via an extended signal line and is used to detect the temperature of the airflow after it has been cooled by the server rack.

[0013] The embodiments of the present invention also propose a method for optimizing local airflow organization in computer rooms, which is applicable to the computer room cooling system with optimized local airflow organization described in the above embodiments.

[0014] The computer room heat dissipation method with optimized local airflow organization according to embodiments of the present invention includes: The sensing unit continuously monitors the inlet and outlet air temperatures of the server rack. Determine the thermal state of the server rack based on the inlet and outlet air temperatures; Based on the judgment result, control commands are generated to dynamically adjust the airflow state of the airflow guiding unit located on the air intake path of the server rack, so as to regulate the distribution of cooling airflow to the server rack.

[0015] In some embodiments, the dynamic adjustment process of the flow guiding state of the flow guiding unit includes: Compare the outlet air temperature with the preset target temperature; When the outlet air temperature is higher than the target temperature, the flow guiding unit is controlled to increase the flow guiding angle to increase the inflow of cooling air. When the outlet air temperature is lower than the target temperature, the control flow guiding unit reduces the flow guiding angle, or even switches to a blocking state, to reduce the inflow of cooling air.

[0016] In some embodiments, the dynamic adjustment process of the airflow state of the airflow guiding unit is performed periodically, and a redundant range around the target temperature is provided. When the outlet air temperature is within the redundant range, the current state of the airflow guiding unit remains unchanged.

[0017] In some embodiments, when the intake air temperature is higher than a first preset safety threshold, a first alarm message is generated; When the airflow guiding unit has been adjusted to its limit and the outlet air temperature is still higher than the second preset safety threshold, a second alarm message is generated.

[0018] In some embodiments, the method further includes: If the outlet air temperature is still higher than the preset safety threshold after the airflow guiding unit has been adjusted to the maximum airflow state, the air supply unit will be activated to enhance the air supply. After the air supply unit is started, if the outlet air temperature drops below the preset safety threshold, the air supply unit will stop power output and enter a free rotation state.

[0019] In summary, in the embodiments of the present invention, by deploying temperature sensors on the air inlet and outlet sides of each rack, the system achieves independent and accurate measurement of the heat dissipation status of a single rack.

[0020] By dynamically adjusting the airflow guiding unit and actively intervening in the airflow organization, the cooling capacity is precisely delivered to the high-power racks that need it most, thereby eliminating local hot spots at the source and improving the overall operational safety of the data center.

[0021] The control unit automatically generates commands based on real-time temperature data to drive the flow diversion unit. The entire process is fully automatic and has no delay, enabling it to respond instantly to dynamic changes in rack load (such as peak business periods).

[0022] The system offers optional basic (airflow guidance only) and enhanced (airflow guidance + air supply) versions, as well as flexible deployment modes for full and partial deployment. Users can choose the optimal solution based on their budget and the urgency of the problem, achieving a balance between cost-effectiveness and efficiency. Attached Figure Description

[0023] Figure 1 This is a top view schematic diagram of a computer room heat dissipation system with optimized local airflow organization according to an embodiment of the present invention.

[0024] Figure 2 This is a schematic diagram of the arrangement of the airflow guiding unit and the air supply unit on the front of the server rack according to an embodiment of the present invention.

[0025] Figure 3 This is a schematic diagram of the arrangement of the adjustment device on the side of the server rack according to an embodiment of the present invention.

[0026] Figure 4 This is a schematic diagram of the air guide plate in an embodiment of the present invention with an angle of 0 degrees.

[0027] Figure 5 This is a schematic diagram of the air guide plate with an angle of 60 degrees in an embodiment of the present invention.

[0028] Figure 6 This is a schematic diagram of the air guide plate with an angle of -60 degrees in an embodiment of the present invention.

[0029] Figure label: 1-Air conditioning unit; 2-Server racks; 3-Regulating device; 31-Sensing unit; 311-Inlet air temperature sensor; 312-Outlet air temperature sensor; 32-Flow guiding unit; 321-Air guide plate; 33-Air supply unit; 331-Axial flow fan. Detailed Implementation

[0030] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0031] The following describes a computer room cooling system with optimized local airflow organization according to an embodiment of the present invention, with reference to the accompanying drawings.

[0032] like Figures 1 to 6 As shown, the local airflow organization optimization computer room heat dissipation system of this invention includes an air conditioning unit 1, a server rack 2, and an adjustment device 3.

[0033] Air conditioning unit 1 is used to supply air to the computer room. There are multiple server racks 2, which are arranged at intervals in the computer room. There are multiple regulating devices 3, which correspond one-to-one with the multiple server racks 2, and the regulating devices 3 are located on the server racks 2.

[0034] The regulating device 3 includes a sensing unit 31, a flow guiding unit 32, and a control unit (not shown in the figure). The sensing unit 31 is used to detect the inlet and outlet air temperatures of the server rack 2. The flow guiding unit 32 is located on the inlet air path of the server rack 2, and its flow guiding state is adjustable to change the flow rate and direction of the cooling airflow to the server rack 2. The control unit is connected to the sensing unit 31 and the flow guiding unit 32, and is configured to generate control commands based on the inlet and outlet air temperatures to dynamically adjust the flow guiding state of the flow guiding unit 32.

[0035] The local airflow organization optimization data center cooling system of this invention transforms the originally coarse data center-level diffuse air supply into a refined rack-level on-demand distribution.

[0036] The system directly measures the inlet and outlet air temperatures by independently installing sensing units 31 on each rack. These temperatures constitute key parameters for assessing the heat dissipation status of the rack. Compared to related technologies that only deploy sensors in aisles to monitor the macroscopic ambient temperature, this invention achieves independent diagnosis of the health of each individual rack.

[0037] The outlet air temperature directly reflects the heat output (load) of server rack 2 itself. A higher outlet air temperature indicates a greater load and a more urgent need for heat dissipation. The inlet air temperature reflects the cooling effect supplied to the rack. Ideally, under diffused airflow conditions, the inlet air temperature should be close to the air conditioning supply temperature. If the inlet air temperature is too high, it indicates that the cool air is being mixed during delivery or that there is excessive resistance, resulting in insufficient supply.

[0038] The control unit's decision-making logic is based on the coupling relationship between inlet and outlet air temperatures, rather than a single parameter. It can identify patterns of high outlet air temperature and normal inlet air temperature, indicating high rack load and a need for more cooling air; it can also identify patterns of high outlet air temperature and high inlet air temperature, indicating problems with the cooling air supply path itself or insufficient overall cooling in the server room. Based on this pattern recognition, the control unit generates targeted control commands, thereby achieving intelligent decision-making.

[0039] The airflow guiding unit 32 is placed at a key position in the air intake path of each rack. By dynamically and adjustablely changing its guiding state (such as angle), it essentially changes the pressure and direction of the airflow field locally. When increased cooling is needed, the airflow guiding unit 32 activates, reducing the local airflow resistance on the air intake side of the rack, or actively guiding more cold air to the rack, changing from insufficient airflow to priority airflow. When there is excess cooling, it can increase resistance or form an air curtain to reduce the inflow of cold air and avoid waste. The configuration of the airflow guiding unit 32 changes the passive situation of fixed or lagging manual louvers in related technologies, realizing real-time, dynamic, and adaptive fine-tuning.

[0040] Therefore, the data center heat dissipation system with local airflow organization optimization in this embodiment of the invention can capture the real-time heat dissipation status of each rack with 100% accuracy through dual temperature sensing, and achieve accurate identification and location of rack-level hotspots.

[0041] Dynamic airflow improves cooling efficiency by actively delivering cool air to the racks that need it most, thereby effectively eliminating local hot spots and improving the overall system's heat dissipation reliability and safety.

[0042] The system forms a closed-loop control, which can respond instantly to the dynamic changes in server load, solves the problem of lag in manual adjustment, and realizes fully automatic and adaptive real-time adjustment.

[0043] In some embodiments, such as Figures 1 to 6 As shown, the airflow guiding unit 32 includes a mounting bracket (not shown) and at least one angle-adjustable airflow guide plate 321.

[0044] The mounting bracket is detachably connected to the server rack 2, providing a non-permanent and non-destructive physical connection method. This allows the adjustment device 3 to be quickly installed as an independent module onto the existing server rack 2, or easily removed when maintenance or relocation is required, without the need for permanent fixing methods such as drilling, welding, or using adhesives on the server rack 2.

[0045] For example, flexible hooks can be installed on the mounting bracket to directly attach it to the frame, beam, or ventilation panel of the server rack 2. Alternatively, permanent magnets can be installed on the mounting bracket to magnetically attach it to the metal server rack 2. Another option is to use existing standard mounting holes on the rack (such as mounting holes for server rails, cable management arms, etc.) to secure the mounting bracket with bolts. Furthermore, a combination of these methods can be used for connection, such as a combination of hooks and magnets, which allows for quick positioning and enhances connection reliability.

[0046] For older racks with inconsistent specifications, there is no need to customize a unified installation interface, greatly improving system adaptability. Furthermore, the adjustment device 3 can be easily removed from one rack and installed on another according to changes in hotspot distribution, enabling dynamic resource allocation.

[0047] The air guide plate 321 is rotatably mounted on the mounting bracket and is configured to change its angle with the front of the server rack 2 by rotating about an axis. For example, the air guide structure can be a single piece, with a large air guide plate 321 covering most of the air intake area. Alternatively, the air guide structure can be multi-piece, consisting of multiple smaller air guide plates 321 arranged side by side (similar to louvers), to achieve more precise and complex airflow organization and control.

[0048] Specifically, there are multiple air guide plates 321, which are spaced apart along the height of the frame. The air guide plates 321 are made of lightweight flame-retardant ABS or other lightweight, rigid materials. Each air guide plate 321 has an arc-shaped guide strip on its edge to reduce airflow resistance and turbulence.

[0049] The air guide plate 321 acts as an adjustable airflow rudder or valve. When the air guide plate 321 is tilted at a certain angle, the airflow flowing over its surface will follow the wall adhesion effect and be guided to the area pointed to by the air guide plate 321 (i.e., server rack 2). The angle of the air guide plate 321 changes the effective flow area and path tortuosity of the airflow through the rack air inlet surface, thereby achieving flow control.

[0050] Furthermore, the angle adjustment range of the air guide plate 321 is between -90 degrees and 90 degrees. When the angle of the air guide plate 321 is -90 degrees or 90 degrees, the plate surface of the air guide plate 321 is perpendicular to the front of the server rack 2, and the air guide plate 321 forms an air curtain and vertically blocks the air intake of the rack. That is, the plate surface of the air guide plate 321 is perpendicular to the airflow direction, which theoretically maximizes the obstruction of airflow. At this angle, the air intake channel is completely closed or reaches maximum resistance.

[0051] like Figure 4 As shown, when the angle of the air guide plate 321 is 0 degrees, the surface of the air guide plate 321 is parallel to the front of the server rack 2, the air guide plate 321 is in a fully open state, and the airflow flows relatively parallel to the server rack 2.

[0052] like Figure 5As shown, when the angle of the air guide plate 321 is positive (e.g., 60 degrees), the air guide plate 321 guides the airflow towards the server rack 2. That is, the air guide plate 321 rotates to form an inclined plane, which generates a guiding force on the incoming airflow, deflecting the airflow towards the server rack 2. At the same time, the air guide plate 321 forms a gradually widening inlet between its outer side and the rack. This structure can guide and concentrate the diffused cold air from the air conditioner, making it more concentrated into the target server rack 2.

[0053] Conversely, such as Figure 6 As shown, when the angle of the air guide plate 321 is negative (e.g., -60 degrees), the air guide plate 321 blocks the airflow from flowing towards the server rack 2. That is, the air guide plate 321 directs the airflow away from the server rack 2.

[0054] Thus, the deflector is quantified into a continuous, stepless adjustment range from -90 degrees to 90 degrees, enabling the system to make fine, non-step continuous adjustments. Positive angles are used to attract and enhance airflow, while negative angles are used to block and isolate airflow, achieving precise control of airflow.

[0055] In some embodiments, the flow guiding unit 32 further includes a driving member (not shown) connected to the air guide plate 321. The driving member is used to drive the air guide plate 321 to rotate according to the instructions of the control unit. The driving member includes an actuator capable of driving the air guide plate 321 to rotate. The driving principle of the driving member is to convert the electrical signal (instruction) issued by the control unit into the mechanical rotational motion required by the air guide plate 321.

[0056] For example, the drive unit can be a combination of a micro motor and a reduction gear. The drive unit receives instructions representing the target angle from the control unit. The micro motor outputs high-speed, low-torque rotation. The reduction gear (such as a gear set) converts this into a low-speed, high-torque output to overcome airflow resistance and internal friction, ensuring that the air guide plate 321 can rotate accurately and stably. A position sensor (such as a potentiometer or encoder) is integrated inside the drive unit.

[0057] The drive unit continuously feeds back the actual angle to the control unit. The control unit compares it with the target angle and continuously adjusts the output command until the actual angle matches the target angle, ensuring that even under external interference (such as airflow impact), the air guide plate 321 can still maintain the angle required by the command, thereby achieving precise control of the airflow state.

[0058] Alternatively, the driver can be a stepper motor, which controls the rotation angle by receiving pulse signals, achieving precise positioning without the need for a position sensor (open source control).

[0059] The signal flow of the entire driving process is a clear closed loop: the sensing unit 31 collects temperature → the control unit calculates and makes decisions → issues angle commands → the driving component executes and provides feedback → the control unit corrects, realizing full automation from sensing to execution.

[0060] In some embodiments, such as Figures 1 to 6 As shown, the regulating device 3 also includes an air supply unit 33, which is located inside the airflow guiding unit 32. The air supply unit 33 is used to actively enhance the cooling airflow to the server rack 2 during startup. For server racks 2 with unreasonable layouts or abnormally high power densities, passive airflow guidance by simply changing the airflow direction may be insufficient, while active air supply can overcome the limitations of the local flow field and guide cool air from a greater distance, thus expanding the application boundaries and upper limits of the system.

[0061] The air supply unit 33 can be an axial fan 331, consisting of fan blades, a motor, and a housing. The axial fan 331 has an airflow direction parallel to the axis of the air duct, making it suitable for installation on the air inlet side of the rack in scenarios where space is limited and air needs to be supplied along the airflow direction. The axial fan 331 has a compact structure, large air volume, and can be directly installed on the inner side of the air guiding unit 32 (air guide plate 321), that is, on the side closer to the server rack 2.

[0062] When the axial fan 331 starts, the motor drives the fan blades to rotate, doing work on the air, thereby creating a pressure difference between the inlet and outlet sides of the fan 331, actively drawing in and pushing the cool air into the server rack 2.

[0063] Furthermore, the control unit is also configured to activate the air supply unit 33 when it is determined that the air guiding unit 32 has been adjusted to the maximum air guiding state and the outlet air temperature is still higher than the preset safety threshold. The air supply unit 33 provides additional, forced heat dissipation capacity.

[0064] This operating principle is a tiered, condition-triggered linkage control principle. Its operating logic is based on a clearly defined priority and condition judgment: First priority (passive airflow guidance): The system always prioritizes using the zero-energy-consumption air guide vane 321 for adjustment. This is an economical and energy-saving normal operating mode.

[0065] Triggering conditions: The control unit continuously monitors and judges on two levels. First, it judges that the flow guiding unit 32 has been adjusted to the maximum flow guiding state, indicating that the system has tried its best to solve the problem in a zero-energy manner. While the above conditions are met, it is also necessary to judge that the outlet air temperature is still higher than the preset safety threshold. Only when the above conditions are met simultaneously is it considered that the passive flow guiding capacity has reached its limit, and enhancement measures must be activated.

[0066] Second priority (active air supply): When the above conditions are met, the control unit generates a command to start the air supply unit 33.

[0067] The system employs a tiered principle of first passive and then active operation, ensuring that it operates in a state of extremely low energy consumption for monitoring and airflow guidance most of the time, thus achieving an energy-optimized operating strategy. The air supply unit 33 provides reliable backup cooling capacity, preventing equipment shutdown due to insufficient heat dissipation in extreme situations and enhancing the system's safety redundancy in handling abnormal operating conditions.

[0068] Furthermore, the regulating device 3 can be modularly selected, with two configurations: a basic version and an enhanced version. The basic version only includes the sensing unit 31, the flow guiding unit 32, and the control unit, achieving passive flow guidance and regulation; the enhanced version adds an air supply unit 33 to the basic version, achieving both passive flow guidance and active air supply.

[0069] The adjustment device 3 can be deployed in either a full deployment or a partial deployment. A full deployment means that all server racks 2 are equipped with the enhanced version of the adjustment device 3, which is in a low-power monitoring state by default and the adjustment function is activated as needed. A partial deployment means that the enhanced version of the adjustment device 3 is only installed in historically hot racks or high-load racks (such as racks where the exhaust temperature is often higher than the preset server exhaust temperature safety limit), and not deployed in other racks.

[0070] Therefore, the adjustment device 3 offers extremely high deployment flexibility. Users do not need to make costly modifications to all racks at once; they can install the enhanced version only on known, high-power racks with recurring hotspots, while the remaining racks may not require immediate treatment or only have the basic version installed, making it acceptable to a wide range of older data centers with limited budgets. This optional approach allows the solution to be precisely matched to the user's specific problems and budget, achieving the best balance between cost and benefit.

[0071] Furthermore, it supports phased deployment and technology iteration. The data center can initially deploy a basic version locally to verify the effect, and then upgrade to an enhanced version or expand the deployment scope as needed.

[0072] In some embodiments, such as Figure 1 As shown, the sensing unit 31 includes an inlet air temperature sensor 311 and an outlet air temperature sensor 312. The inlet air temperature sensor 311 is located on the outlet side of the airflow guiding unit 32, and directly measures the temperature of the cold air ultimately supplied to the server rack 2 after the intervention of the airflow guiding unit 32. The outlet air temperature sensor 312 is located on the outlet side of the server rack 2 via an extended signal line, and is used to detect the temperature of the airflow after it has been cooled by the server rack 2.

[0073] By combining these two temperatures, the difference between the outlet air temperature and the inlet air temperature can be understood as the temperature rise of server rack 2. The temperature rise is directly proportional to the real-time power consumption of server rack 2, so that the system can indirectly and accurately calculate the actual load of the rack without the rack itself providing power data, using only two temperature points.

[0074] The difference between a high temperature rise and a normal intake air temperature indicates high rack power consumption, requiring increased cooling air supply. A high temperature rise indicates the server is generating a large amount of heat. If the intake air temperature is normal at this time, it means the cooling air supply path is open, but the flow rate is insufficient, requiring the airflow guide unit 32 to be adjusted to increase the airflow angle.

[0075] High temperature rise and high intake air temperature indicate that not only is the rack power consumption high, but the cold air has also been heated during delivery (such as when it is mixed with hot air). This indicates that there is a fundamental problem with the airflow organization, which may not be solved by local adjustment alone and requires triggering a higher level of alarm.

[0076] The following describes a data center heat dissipation method with optimized local airflow organization according to an embodiment of the present invention. This method is applicable to the data center heat dissipation system with optimized local airflow organization described in the above embodiments.

[0077] The computer room heat dissipation method with optimized local airflow organization according to embodiments of the present invention includes: The sensing unit 31 continuously monitors the inlet and outlet air temperatures of the server rack 2.

[0078] The thermal state of server rack 2 is determined based on the inlet and outlet air temperatures.

[0079] Based on the judgment result, a control command is generated to dynamically adjust the airflow guiding state of the airflow guiding unit 32 located on the air intake path of the server rack 2, so as to regulate the distribution of cooling airflow to the server rack 2.

[0080] Understandably, the system is based on the regulation of both inlet and outlet air temperatures. When the air conditioning and server operations are stable, the two temperatures are in a dynamic equilibrium state. That is, with a fixed server load, a fixed air supply volume, and the air conditioning supply in the server room remaining unchanged, the two temperatures are constant. When the server load increases, and other conditions remain unchanged, the inlet air temperature remains constant, while the outlet air temperature will first rise and then remain constant after reaching a certain value. When the server load decreases, and other conditions remain unchanged, the inlet air temperature remains constant, while the outlet air temperature will first decrease and then remain constant after reaching a certain value.

[0081] The local airflow organization optimization method for computer room heat dissipation in this invention improves heat dissipation management from the extensive computer room level to the refined rack level.

[0082] This method uses sensors deployed at specific locations to collect two key physical quantities: inlet air temperature and outlet air temperature. The outlet air temperature directly reflects the real-time heat generation power (load) of the server rack 2 itself, while the inlet air temperature reflects the actual cooling effect delivered to the rack. By combining these two temperature parameters, the system can indirectly calculate the rack's power consumption. Under constant airflow, the difference between the outlet and inlet air temperatures is proportional to the rack's power consumption, thus cleverly circumventing the limitation of older racks lacking power interfaces. By analyzing the combination patterns of these two temperatures, the causes of hotspots can be determined.

[0083] Based on dynamic equilibrium analysis and judgment, the state pairs formed by the inlet and outlet air temperatures are analyzed. For example, in mode 1 (high-power hotspot), the outlet air temperature is high, but the inlet air temperature is normal, indicating that the cold air supply path is open, but the supply is less than the demand, and the decision direction is to increase the airflow. In mode 2 (insufficient supply overheating), the outlet air temperature is high, and the inlet air temperature is also high, indicating that not only is the rack itself under high load, but the cold air has also been heated due to mixing and other reasons during delivery.

[0084] By independently collecting the inlet and outlet air temperatures for each rack, it achieves 100% identification and location of local hotspots, and can respond to dynamic changes in server load in real time, making millisecond-level adjustments.

[0085] In some embodiments, the dynamic adjustment process of the flow guiding state of the flow guiding unit 32 includes: Compare the outlet air temperature with the preset target temperature; When the outlet air temperature is higher than the target temperature, the flow guiding unit 32 is controlled to increase the flow guiding angle to increase the inflow of cooling air. When the outlet air temperature is lower than the target temperature, the control flow guiding unit 32 reduces the flow guiding angle, or even switches to a blocking state, to reduce the inflow of cooling airflow.

[0086] For example, when the outlet air temperature is ≤24℃ (normal temperature): the angle of the air guide plate 321 is 10 degrees (fine-tuning the angle facilitates the flow of cold air); when 24℃ < outlet air temperature ≤27℃ (higher temperature): the angle of the air guide plate 321 is 30 degrees (appropriately guides the airflow according to demand, balancing the air intake and wind resistance); when the outlet air temperature >27℃ (high temperature): the angle of the air guide plate 321 is 60 degrees (maximizes the capture of cold air and prioritizes the high cooling capacity).

[0087] The entire adjustment process is designed with the outlet air temperature as the single controlled variable, resulting in a clear control objective and reducing system complexity and hardware requirements. The system actively identifies and collects wasted cooling capacity and redistributes it to the server rack 2 that needs it most, achieving efficient on-demand allocation and improving the overall cooling efficiency of the data center.

[0088] Furthermore, the flow guiding unit 32 dynamically adjusts its flow guiding state periodically and has a redundant range around the target temperature. When the outlet air temperature is within the redundant range, the current state of the flow guiding unit 32 remains unchanged.

[0089] When both the intake and exhaust temperatures are below the preset safety limits, an adjustment cycle can be set to reduce power consumption caused by frequent system adjustments. This cycle setting should take into account the power consumption of the air guide plate 321 and fan 331 during startup and adjustment, the power consumption of the fan 331 during operation, the impact of server temperature rise, and server security control requirements.

[0090] Adjust the temperature redundancy range. To prevent frequent start-ups of adjustment due to minor temperature fluctuations, the temperature redundancy range is set to ±1℃. For example, the preset temperature is 24℃ and the temperature adjustment will not be activated. In actual operation, when the air outlet temperature is between 23℃ and 25℃, the air guide plate 321 and fan 331 will not be activated for adjustment.

[0091] The preset suitable air outlet temperature for the rack is 24℃. When the air outlet temperature is within the range of 24℃ ± redundancy, the angle of the air guide plate 321 will no longer change.

[0092] To avoid localized hotspots and ensure that the servers in the rack do not overheat, when the exhaust temperature is >24℃+ (over the redundancy range, under high load), the 321-degree angle of the air guide plate automatically increases by 10 degrees per cycle, up to a maximum of 60 degrees (to increase the flow of cool air from the side), until the exhaust temperature drops to 24℃.

[0093] To avoid wasting cooling capacity and ensure that the cooling capacity of the server rack 2 is fully utilized, when the outlet air temperature is below 24℃ - redundant range (low load), the angle of the air guide plate 321 automatically decreases by 10 degrees per cycle, with a minimum of -60 degrees (to reduce the inflow of cold air from the sides and to form an air curtain at the front of the rack to block the air intake from the front of the rack, thus reducing cooling capacity waste. It is not completely shut down to avoid sudden changes in server load), until the outlet air temperature rises to 24℃.

[0094] In some embodiments, when the inlet air temperature exceeds a first preset safety threshold, a first alarm message is generated. An alarm is sent to the data center's environmental monitoring system or maintenance personnel, indicating that the cooling capacity of the rack is insufficient and that the data center air conditioning cooling capacity or airflow needs to be increased, or that other abnormalities need to be checked.

[0095] When the airflow guiding unit 32 has been adjusted to its limit and the outlet air temperature is still higher than the second preset safety threshold, a second alarm message is generated. Immediate manual intervention is required to check whether there are any obstacles obstructing the rack, whether the cabinet is not equipped with a blind flange, or whether there are other physical faults.

[0096] In some embodiments, the method of the present invention further includes: If the outlet air temperature is still higher than the preset safety threshold after the flow guiding unit 32 has been adjusted to the maximum flow guiding state, the air supply unit 33 will be activated to enhance the air supply. After the air supply unit 33 is started, if the outlet air temperature drops below the preset safety threshold, the air supply unit 33 will stop power output and enter a free rotation state.

[0097] Understandably, this step is an independent control logic for fan 331 (an enhanced function that only takes effect when fan 331 is installed), serving as a supplement to air deflector 321, and is only activated when air deflector 321 is under-adjusted.

[0098] When the outlet air temperature exceeds the preset safe limit for server outlet air temperature, and the air guide plate 321 has been adjusted to 60 degrees, the fan 331 will be activated immediately to further enhance the airflow effect.

[0099] If the air temperature after fan 331 starts is still higher than the preset server air temperature safety limit (a very special case, which is due to abnormal room design or rack layout), an alarm will be sent to the room's environmental control system or maintenance personnel, indicating that the cooling capacity of this rack is insufficient and that the room's air conditioning cooling capacity or air supply volume needs to be increased, or other abnormalities need to be checked. When the outlet air temperature is lower than the preset server outlet air temperature safety limit, the fan 331 enters free rotation mode. At this time, the fan 331 no longer consumes power, and only the air guide plate 321 is activated for dynamic adjustment.

[0100] In summary, the data center cooling method with optimized local airflow organization in this embodiment of the invention achieves 100% hotspot identification rate by capturing the independent cooling status of each rack in real time using dual temperature sensors, thus reducing the risk of server overheating and downtime. Through dynamic adjustment—increasing cooling capacity when temperatures are high and decreasing it when temperatures are low—on-demand distribution of cooling capacity is achieved.

[0101] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0102] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0103] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0104] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0105] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0106] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A computer room cooling system with optimized local airflow organization, characterized in that, include: An air conditioning unit, wherein the air conditioning unit is used to supply air to the computer room space; Server racks, wherein there are multiple server racks, and the multiple server racks are arranged at intervals in the computer room; An adjustment device, comprising multiple adjustment devices, each corresponding one-to-one with a plurality of server racks, is disposed on the server rack. Each adjustment device includes a sensing unit, a flow guiding unit, and a control unit. The sensing unit detects the inlet and outlet air temperatures of the server rack. The flow guiding unit is located on the inlet air path of the server rack, and its flow guiding state is adjustable to change the flow rate and direction of the cooling airflow towards the server rack. The control unit is connected to the sensing unit and the flow guiding unit, and is configured to generate control commands based on the inlet and outlet air temperatures to dynamically adjust the flow guiding state of the flow guiding unit.

2. The computer room heat dissipation system with optimized local airflow organization according to claim 1, characterized in that, The airflow guiding unit includes a mounting frame and at least one angle-adjustable air guide plate. The mounting frame is detachably connected to the server rack, and the air guide plate is rotatably disposed on the mounting frame. The air guide plate is configured to change its angle with the front of the server rack by rotating about an axis.

3. The computer room heat dissipation system with optimized local airflow organization according to claim 2, characterized in that, The angle adjustment range of the air guide plate is between -90 degrees and 90 degrees. When the angle of the air guide plate is 0 degrees, the surface of the air guide plate is parallel to the front of the server rack. When the angle of the air guide plate is positive, the air guide plate guides the airflow to the server rack. When the angle of the air guide plate is negative, the air guide plate blocks the airflow to the server rack.

4. The computer room heat dissipation system with optimized local airflow organization according to claim 2, characterized in that, The air guiding unit also includes a driving component connected to the air guide plate, the driving component being used to drive the air guide plate to rotate according to the instructions of the control unit.

5. The computer room heat dissipation system with optimized local airflow organization according to claim 1, characterized in that, The regulating device also includes an air supply unit, which is located inside the airflow guiding unit. The air supply unit is used to actively enhance the cooling airflow to the server rack during startup.

6. The computer room heat dissipation system with optimized local airflow organization according to claim 5, characterized in that, The control unit is also configured to activate the air supply unit when it is determined that the air guiding unit has been adjusted to the maximum air guiding state and the outlet air temperature is still higher than a preset safety threshold.

7. The computer room heat dissipation system with optimized local airflow organization according to claim 1, characterized in that, The sensing unit includes an inlet air temperature sensor and an outlet air temperature sensor. The inlet air temperature sensor is located on the outlet side of the airflow guiding unit and is used to detect the temperature of the cooling airflow about to enter the server rack. The outlet air temperature sensor is located on the outlet side of the server rack via an extended signal line and is used to detect the temperature of the airflow after it has been cooled by the server rack.

8. A method for optimizing local airflow organization in a computer room for heat dissipation, characterized in that, The method is applicable to a computer room cooling system with optimized local airflow organization according to any one of claims 1-7, and the method includes: The sensing unit continuously monitors the inlet and outlet air temperatures of the server rack. Determine the thermal state of the server rack based on the inlet and outlet air temperatures; Based on the judgment result, control commands are generated to dynamically adjust the airflow state of the airflow guiding unit located on the air intake path of the server rack, so as to regulate the distribution of cooling airflow to the server rack.

9. The computer room heat dissipation method with optimized local airflow organization according to claim 8, characterized in that, The dynamic adjustment process of the flow guiding state of the flow guiding unit includes: Compare the outlet air temperature with the preset target temperature; When the outlet air temperature is higher than the target temperature, the flow guiding unit is controlled to increase the flow guiding angle to increase the inflow of cooling air. When the outlet air temperature is lower than the target temperature, the control flow guiding unit reduces the flow guiding angle, or even switches to a blocking state, to reduce the inflow of cooling air.

10. The computer room heat dissipation method with optimized local airflow organization according to claim 9, characterized in that, The flow guiding unit dynamically adjusts its flow state periodically and has a redundant range around the target temperature. When the outlet air temperature is within the redundant range, the current state of the flow guiding unit remains unchanged.

11. The computer room heat dissipation method with optimized local airflow organization according to claim 8, characterized in that, When the intake air temperature exceeds the first preset safety threshold, a first alarm message is generated; When the airflow guiding unit has been adjusted to its limit and the outlet air temperature is still higher than the second preset safety threshold, a second alarm message is generated.

12. The computer room heat dissipation method with optimized local airflow organization according to claim 8, characterized in that, The method further includes: If the outlet air temperature is still higher than the preset safety threshold after the airflow guiding unit has been adjusted to the maximum airflow state, the air supply unit will be activated to enhance the air supply. After the air supply unit is started, if the outlet air temperature drops below the preset safety threshold, the air supply unit will stop power output and enter a free rotation state.

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