An automated EBL assembly assembly and EBL system

Abstract

This application relates to the field of semiconductor processing technology, specifically disclosing an automated EBL (Enhanced Laser Processing) assembly and an EBL system. The automated EBL assembly includes a wafer loading assembly, a tray positioning assembly, and a mask loading assembly. The wafer loading assembly includes a wafer gripper, a wafer stage, and a wafer adjusting gripper. The tray positioning assembly includes a tray gripper, a tray stage, and a mirror adjusting gripper. The mask loading assembly includes a mask gripper, a mask stage, and a mask adjusting gripper. In this solution, the wafer loading assembly can load and fix the wafer onto the wafer stage; the tray positioning assembly can fix the wafer stage onto the tray stage; and the mask loading assembly can load the mask onto the mask stage. During EBL system operation, the participation of these components can reduce the degree of human intervention and correspondingly improve the automation level of the system.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to an EBL automatic assembly assembly component and EBL system. Background Technology

[0002] Electron Beam Lithography (EBL) systems are core equipment in the field of high-precision micro- and nano-fabrication. They achieve the fabrication and transfer of nanoscale precision patterns through the interaction of a focused electron beam with the photoresist on the wafer surface. Compared to traditional optical lithography, EBL systems, with their shorter electron beam wavelength, can overcome the optical diffraction limit and are widely used in scenarios with stringent requirements for pattern precision, such as VLSI manufacturing, advanced packaging, microelectromechanical systems (MEMS), and cutting-edge quantum technologies. This provides a precise pattern reference for subsequent processes such as etching, deposition, and ion implantation.

[0003] An EBL (Extended Blanking) system typically includes a lithography machine, a wafer carrier, and control equipment. The lithography machine is the core equipment in chip manufacturing; it uses a specific light source and optical system to transfer the intricate circuit patterns from a photomask to the surface of a wafer coated with photoresist. The wafer carrier includes a wafer tray and a mirror positioning platform; the wafer tray holds and secures the wafer, preventing displacement during operation; the mirror positioning platform detects and fine-tunes the tray's position.

[0004] In existing EBL systems, wafer loading, wafer positioning, and mask loading processes require manual intervention. The specific process is as follows:

[0005] During the wafer loading process, workers need to wear clean gloves, then remove each wafer one by one and place it on a special tray. The tray's locking mechanism is then adjusted to secure the wafer.

[0006] During the wafer positioning process, the tray containing the wafer must first be transferred to the placement area of ​​the optical mirror positioning platform. Then, the staff manually adjusts the initial position of the tray on the platform to ensure that the tray is aligned with the positioning reference of the platform.

[0007] During the mask loading process, the operator needs to remove the mask, place it on the stage, and adjust the limiting structure on the stage to fix the mask.

[0008] The above process involves time-consuming manual wafer loading and positioning adjustments, especially the positioning stage which requires repeated fine-tuning. This is greatly affected by the operator's skill level and carries a high risk of wafer contamination. Summary of the Invention

[0009] In view of this, the purpose of this application is to provide an automated EBL assembly assembly and EBL system to solve some or all of the above-mentioned problems.

[0010] To achieve the above-mentioned technical objectives, the first aspect of this application provides an EBL wafer loading automatic assembly assembly, including: a wafer loading assembly, a tray positioning assembly, and a mask loading assembly;

[0011] The wafer loading assembly includes: a wafer gripper, a wafer stage, and a wafer adjustment gripper;

[0012] The wafer gripper is used to load the wafer and then move the wafer to be placed on the wafer carrier.

[0013] The wafer adjusting gripper is used to adjust the wafer fixing structure on the wafer stage to fix the wafer and / or adjust the position of the wafer;

[0014] The pallet positioning assembly includes: a pallet gripper, a pallet platform, and a light mirror adjustment gripper;

[0015] The pallet gripper is used to transfer the wafer stage to the pallet stage after the wafer stage has been loaded with a wafer.

[0016] The tray stage is used to fix the wafer stage;

[0017] The optical mirror adjustment gripper is used to adjust the placement angle and / or height of the wafer on the tray platform;

[0018] The mask loading assembly includes: a mask gripper, a mask stage, and a mask adjusting gripper;

[0019] The mask plate carrier is provided with a mask plate fixing structure for fixing the mask plate;

[0020] The mask adjusting gripper is used to adjust the mask fixing structure so that the mask gripper can grasp the mask and place it on the mask platform, and so that the mask is fixed by the mask fixing structure.

[0021] Furthermore, the mask plate fixing structure includes: a plurality of upper limit plates and a plurality of lower limit plates;

[0022] The lower limiting piece can elastically deform along the vertical direction;

[0023] The mask plate adjusting gripper is equipped with several pressure columns;

[0024] When the pressure column presses down on the lower limiting piece, a mask loading cavity is formed between the upper limiting piece and the lower limiting piece for the mask plate to be loaded into along the first direction;

[0025] After the pressure column separates from the lower limiting plate, the lower limiting plate elastically returns to its original position upwards to clamp the mask plate between the upper limiting plate and the lower limiting plate.

[0026] Furthermore, the mask fixing structure includes: a side pressure block;

[0027] The side pressure block is connected to the mask plate platform via a damping telescopic rod;

[0028] The mask loading assembly includes: a push-pull gripper;

[0029] The push-pull gripper is used to move the side pressure block after the mask plate is clamped by the upper limit plate and the lower limit plate, so that the side pressure block presses against the side or end corner of the mask plate.

[0030] Furthermore, a damping rotation block is provided on the mask plate platform;

[0031] The damping rotating block is rotatably mounted on the mask plate stage via a damping rotating shaft;

[0032] The side pressure block is connected to the damping rotating block via a damping telescopic rod;

[0033] The push-pull gripper is used to move the side pressure block so that the side pressure block presses against the end corner of the mask plate.

[0034] Furthermore, limit posts are provided on the mask plate platform;

[0035] The limiting post is disposed on one side of the mask plate platform along the first direction, and is used to limit the sliding stroke of the mask plate;

[0036] The side pressure block is disposed on the other side of the mask plate stage along the first direction.

[0037] Furthermore, the lower limiting piece is disposed directly below the upper limiting piece;

[0038] The upper limit plate is provided with a pressure column avoidance opening;

[0039] The pressure column can pass through the pressure column clearance opening to press down the lower limit piece.

[0040] Furthermore, the mask plate stage has various sizes and specifications;

[0041] The mask plate adjusting gripper is provided with multiple pressure column mounting holes;

[0042] The pressure post can be selectively positioned in any of the pressure post mounting holes according to the size and specifications of the mask plate stage.

[0043] Furthermore, conductive springs are provided on the mask plate carrier;

[0044] The mask loading assembly includes: a conductive sheet gripper;

[0045] The conductive sheet gripper is used to grasp the conductive sheet and install it onto the mask after the mask is clamped by the upper limit plate and the lower limit plate.

[0046] The conductive sheet / spring can elastically deform along the vertical direction;

[0047] During the process of the mask plate being loaded into the mask plate loading cavity along the first direction, the conductive sheet spring can be pushed to deform downwards;

[0048] The conductive sheet spring is used to push the conductive sheet so that the conductive sheet abuts against the mask plate.

[0049] Furthermore, the chip gripper includes: a large gripper area;

[0050] The wafer stage includes a large wafer stage;

[0051] The large-scale stage is used to load wafers larger than a preset size;

[0052] The large gripper is used to load wafers larger than a preset size.

[0053] Furthermore, the wafer fixing structure includes a lifting seat and an upper pressure member;

[0054] The lifting seat can be flexibly raised and lowered on the large platform;

[0055] The upper pressure component is disposed above the lifting seat;

[0056] The chip adjustment gripper includes a pressing gripper;

[0057] The pressing gripper is used to press down the lifting seat, so that a wafer loading cavity is formed between the lifting seat and the upper pressure member. Then, the large gripper loads the wafer into the wafer loading cavity. After the pressing gripper removes the pressure, the lifting seat resets and clamps the wafer between the lifting seat and the upper pressure member.

[0058] Furthermore, the wafer fixing structure includes a lever;

[0059] The chip adjustment gripper includes a paddle gripper;

[0060] The paddle is elastic and rotatably mounted on the large platform;

[0061] The paddle gripper is used to pull the paddle upward and rotate it above the wafer after the wafer is clamped between the lifting seat and the upper pressure member, so that the paddle presses the wafer.

[0062] Furthermore, the wafer fixing structure includes a rotating plunger;

[0063] The chip adjustment gripper includes a plunger gripper;

[0064] The rotating plunger is horizontally extendable and retractable on the large platform.

[0065] The plunger gripper is used to pull the rotating plunger out horizontally after the wafer is clamped between the lifting seat and the upper pressure member, and then rotate the rotating plunger so that the rotating plunger springs back and presses against the side of the wafer.

[0066] Furthermore, the large-scale platform has various size specifications;

[0067] The pressing gripper is provided with multiple concentric arc grooves and pressure rods;

[0068] The pressure bar can be selectively positioned at any location in any of the arc grooves, depending on the size and specifications of the large platform.

[0069] Furthermore, the chip gripper includes: a small gripper piece;

[0070] The wafer stage includes a small wafer stage;

[0071] The small wafer stage is used to load wafers smaller than a preset size;

[0072] The small gripper is used to load wafers smaller than a preset size.

[0073] Furthermore, the small chip carrier is provided with several rotatable and height-adjustable chip stages;

[0074] The wafer fixing structure includes: a lifting knob and a rotating knob;

[0075] The rotary knob is engaged with the wafer stage, and rotating the rotary knob can drive the wafer stage to rotate.

[0076] The lifting knob is located above the wafer stage, and the lifting knob can drive the wafer stage to rise and fall when it is raised and lowered.

[0077] The chip adjustment gripper includes a rotating gripper;

[0078] The rotating gripper is used to drive the lifting knob to rotate and to lift the knob up and down.

[0079] Furthermore, the pallet platform is provided with a first platform, a driving component, a first pressing component, a second pressing component, and a connecting rod;

[0080] The first platform is provided with a placement station for placing the wafer platform;

[0081] The driving component is disposed on the first platform;

[0082] The output end of the driving component is connected to the first pressure component;

[0083] The second pressure member is slidably disposed on the first platform along a third direction;

[0084] One end of the connecting rod is rotatably connected to the output end of the driving component, and the other end is rotatably connected to the second pressure component;

[0085] The driving member is used to drive the first pressing member to move along the second direction, and at the same time drive the second pressing member to move along the third direction through the connecting rod, so that the first pressing member and the second pressing member respectively press the side of the wafer stage along the second direction and the side along the third direction.

[0086] Furthermore, a stop is provided on one side of the first platform;

[0087] The first pressure member is disposed on the other side of the first platform.

[0088] Furthermore, both the second pressure member and the connecting rod are two in number and are symmetrically arranged on both sides of the driving member along the third direction.

[0089] Furthermore, the pallet platform includes a second platform;

[0090] The first platform can be slidably disposed on the second platform;

[0091] Two fine-tuning bolts are provided on the second platform;

[0092] The two fine-tuning bolts are respectively disposed on both sides of the first platform, and are used to push the first platform to slide during rotation.

[0093] Furthermore, the side of the second pressing component closest to the placement station is a V-shaped block;

[0094] The wafer stage is provided with a V-shaped slide on its side;

[0095] When the second pressing member presses the wafer stage, the V-shaped block extends into the V-shaped slide.

[0096] Furthermore, the optical mirror adjusting gripper includes an actuator end and a gripper body;

[0097] The execution end is disposed at the end of the gripper body;

[0098] The main body of the hand claw is a long strip extending horizontally.

[0099] A second aspect of this application provides an EBL system, including the EBL automatic assembly assembly component described in any of the preceding claims.

[0100] As can be seen from the above technical solutions, this application provides an EBL (Electronic Brush Loading) automated assembly component and an EBL system; wherein, the EBL automated assembly component includes: a wafer loading component, a tray positioning component, and a mask loading component; the wafer loading component includes: a wafer gripper, a wafer stage, and a wafer adjusting gripper; the wafer gripper is used to load the wafer and move it to be placed on the wafer stage; the wafer adjusting gripper is used to adjust the wafer fixing structure on the wafer stage to fix the wafer and / or adjust the position of the wafer; the tray positioning component includes: a tray gripper, a tray stage, and a lens adjusting gripper; the tray gripper... The gripper is used to transfer the wafer stage to the tray stage after the wafer is loaded on the wafer stage; the tray stage is used to fix the wafer stage; the optical mirror adjustment gripper is used to adjust the placement angle and / or height of the wafer on the tray stage; the mask loading assembly includes: a mask gripper, a mask stage, and a mask adjustment gripper; the mask stage is provided with a mask fixing structure for fixing the mask; the mask adjustment gripper is used to adjust the mask fixing structure so that the mask gripper can grasp the mask and place it on the mask stage, and so that the mask is fixed by the mask fixing structure.

[0101] In this solution, the wafer loading assembly loads and secures the wafer onto the wafer stage; the tray positioning assembly secures the wafer stage onto the tray stage; and the mask loading assembly loads the mask onto the mask stage. During EBL system operation, the involvement of these components reduces the need for human intervention and correspondingly increases the system's automation level, thereby improving operational efficiency, stability, and reducing the risk of wafer contamination. Attached Figure Description

[0102] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0103] Figure 1A schematic diagram of a small gripper for an EBL automatic assembly assembly component provided in this application embodiment;

[0104] Figure 2 A schematic diagram of a large gripper for an EBL wafer loading automatic assembly assembly provided in this application embodiment;

[0105] Figure 3 A schematic diagram of a large-scale assembly platform for an EBL wafer loading automatic assembly assembly provided in this application embodiment;

[0106] Figure 4 A schematic diagram of a pressing gripper for an EBL automatic assembly assembly provided in this application embodiment;

[0107] Figure 5 A schematic diagram of a plunger gripper for an automated EBL die assembly assembly provided in this application embodiment;

[0108] Figure 6 A schematic diagram of a small-piece stage for an EBL automatic assembly assembly component provided in this application embodiment;

[0109] Figure 7 A schematic diagram of a rotating gripper and a small piece stage for an EBL automatic assembly assembly provided in this application embodiment;

[0110] Figure 8 A schematic diagram of a tray gripper for an automated EBL wafer assembly assembly provided in this application embodiment;

[0111] Figure 9 A schematic diagram of a tray platform for an EBL automatic assembly assembly component provided in this application embodiment;

[0112] Figure 10 A schematic diagram of the bottom of a tray platform for an EBL automatic assembly assembly component provided in this application embodiment;

[0113] Figure 11 A schematic diagram of an optical mirror adjustment gripper for an EBL automatic assembly assembly component provided in this application embodiment;

[0114] Figure 12 A schematic diagram of a mask adjustment gripper for an EBL automatic assembly assembly provided in this application embodiment;

[0115] Figure 13 A schematic diagram of a mask gripper for an automated EBL wafer assembly assembly provided in this application embodiment;

[0116] Figure 14 A schematic diagram of a mask plate stage for an automated EBL wafer assembly assembly provided in this application embodiment;

[0117] Figure 15 A schematic diagram of a pry bar gripper, a push-pull gripper, and a conductive sheet gripper for an EBL automatic assembly assembly provided in this application embodiment;

[0118] Figure 16 A schematic diagram illustrating the movement of a push-pull gripper in an EBL automatic assembly assembly component provided in this application embodiment;

[0119] Figure 17 A schematic diagram of a conductive sheet being loaded onto a conductive sheet by a gripper in an EBL automatic assembly assembly provided in this application embodiment;

[0120] In the picture:

[0121] 100. Wafer loading assembly;

[0122] 110. Chip-based gripper; 111. Large gripper; 112. Small gripper;

[0123] 120. Wafer stage; 121. Large wafer stage; 122. Lifting seat; 123. Upper pressure component; 124. Paddle; 125. Rotary plunger; 126. Small wafer stage; 127. Wafer stage; 128. Lifting knob; 129. Rotary knob;

[0124] 130. Chip adjustment gripper; 131. Pressing gripper; 132. Paddle gripper; 133. Plunger gripper; 134. Rotating gripper; 135. Arc groove; 136. Pressure rod;

[0125] 200. Pallet positioning assembly;

[0126] 210. Pallet gripper; 211. Clamping rod; 212. Pressure plate;

[0127] 220. Pallet platform; 221. First platform; 222. Drive unit; 223. First clamping component; 224. Second clamping component; 225. Connecting rod; 226. Slide rail; 227. Stop block; 228. Fine-tuning bolt; 229. Second platform;

[0128] 230. Optical mirror adjustment gripper; 231. Actuator; 232. Gripper body;

[0129] 300. Mask mounting assembly;

[0130] 310. Mask plate gripper;

[0131] 320. Mask plate stage; 321. Upper limit plate; 322. Lower limit plate; 323. Side pressure block; 324. Damping telescopic rod; 325. Limiting post; 326. Pressure post clearance opening; 327. Conductive sheet spring; 328. Damping rotating block;

[0132] 330. Mask plate adjusting gripper; 331. Pressure column; 332. Pressure column mounting hole;

[0133] 340. Push-pull gripper;

[0134] 350. Conductive sheet gripper;

[0135] 360. Conductive sheet. Detailed Implementation

[0136] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments in this application specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.

[0137] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0138] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0139] Please see Figures 1 to 17 In this application embodiment, the first aspect of this application provides an automated EBL (Electronic Batch Loading) assembly, including: a wafer loading assembly 100, a tray positioning assembly 200, and a mask loading assembly 300. This solution, through the coordinated operation of the wafer loading assembly 100, the tray positioning assembly 200, and the mask loading assembly 300, can automate the wafer loading, tray loading, and mask loading processes during EBL system operation.

[0140] Please see Figures 1 to 7In this embodiment, the wafer loading assembly 100 includes a wafer gripper 110, a wafer stage 120, and a wafer adjusting gripper 130. The wafer gripper 110 is used to load the wafer and move it onto the wafer stage 120, which can reduce the degree of operator involvement in the wafer loading process. After the wafer is placed on the wafer stage 120, the wafer adjusting gripper 130 is used to adjust the wafer fixing structure on the wafer stage 120 to fix the wafer and / or adjust the position of the wafer, which can reduce the degree of operator involvement in adjusting the wafer position and fixing the wafer.

[0141] It should be noted that each gripper provided in this embodiment is equipped with a quick-connect coupling; through this quick-connect coupling, the gripper can be quickly attached to and detached from the interface of the multi-axis robotic arm. After the gripper is connected to the multi-axis robotic arm, it can move under the drive of the multi-axis robotic arm and perform automated operations under the control of the control system.

[0142] Please see Figures 8 to 11 In this embodiment, the tray positioning component 200 includes: a tray gripper 210, a tray platform 220, and a mirror adjustment gripper 230. The tray gripper 210 is used to transfer the wafer platform 120 onto the tray platform 220 after wafers are loaded onto it, replacing the manual handling of the wafer platform 120 by operators. The function of moving the tray gripper 210 is achieved by the multi-axis robotic arm after it is connected to the multi-axis robotic arm; this implementation method is prior art and will not be described in detail in this embodiment. The tray platform 220 is used to fix the wafer platform 120, replacing the manual adjustment and fixing of the tray by operators. The mirror adjustment gripper 230 is used to adjust the placement angle and / or height of the wafers on the tray platform 220, reducing the degree of operator involvement in adjusting the wafer position on the tray platform 220.

[0143] Please see Figures 12 to 17 The mask loading assembly 300 includes a mask gripper 310, a mask stage 320, and a mask adjusting gripper 330. The mask stage 320 is equipped with a mask fixing structure for securing the mask. The mask adjusting gripper 330 adjusts the mask fixing structure so that the mask gripper 310 can grasp the mask and place it on the mask stage 320, thus securing the mask to the mask fixing structure. Through the cooperation of the mask adjusting gripper 330 and the mask stage 320, this solution enables automatic mask loading, reducing the degree of operator involvement in the mask loading and fixing process.

[0144] The EBL automated assembly component provided in this embodiment requires no manual intervention during the wafer loading, wafer positioning, and mask loading processes, thereby improving loading efficiency and avoiding the risk of wafer and mask damage caused by manual operation, ensuring the stability and accuracy of the assembly process.

[0145] For a more specific embodiment, please refer to Figure 2 and Figure 3 The chip gripper 110 includes a large gripper 111; the chip stage 120 includes a large stage 121; the large stage 121 is used to load chips larger than a preset size; the large gripper 111 is used to load chips larger than a preset size.

[0146] Specifically, in this embodiment, the preset size can be 1.5 inches. That is, the large wafer gripper 111 and large wafer stage 121 provided in this embodiment can be adapted to the processing of commonly used 4-inch, 6-inch, and 8-inch wafers. Furthermore, multiple large wafer stages 121 can be configured for wafers of different sizes, and different large wafer stages 121 have different size specifications, thereby adapting to wafers of different sizes.

[0147] In this embodiment, the large claw 111 is as follows: Figure 2 As shown, it has a lifting platform that can be raised and lowered. A support rod is provided at the bottom of the lifting platform. The support rod can lift the wafer and place it on the large wafer stage 121.

[0148] In a more specific embodiment, please refer to Figure 3 and Figure 4 The wafer fixing structure includes a lifting seat 122 and an upper pressure member 123; the lifting seat 122 is flexibly and vertically mounted on the large wafer stage 121; the upper pressure member 123 is mounted above the lifting seat 122; the wafer adjusting gripper 130 includes a lower pressure gripper 131.

[0149] In this embodiment, the wafer adjusting gripper 130 adjusts the wafer fixing structure to fix the wafer in the following manner: the pressing gripper 131 presses down on the lifting seat 122, forming a wafer loading cavity between the lifting seat 122 and the upper pressure member 123. Then, the large gripper 111 loads the wafer into the wafer loading cavity. After the pressing gripper 131 releases its pressure, the lifting seat 122 resets, clamping and fixing the wafer between the lifting seat 122 and the upper pressure member 123. Correspondingly, when it is necessary to remove the wafer, the pressing gripper 131 presses down on the lifting seat 122, causing the wafer to descend and separate from the upper pressure member 123, after which the wafer can be removed from the large wafer stage 121.

[0150] In application, the bottom of the lifting seat 122 can be equipped with multiple compression springs arranged in a row. When the pressing gripper 131 presses down on the lifting seat 122, the lifting seat 122 is compressed and descends. After the downward pressure on the lifting seat 122 is removed, the lifting seat 122 can rise and return to its original position.

[0151] In existing trays for holding large-size wafers, after the wafer is placed, multiple lifting and lowering clamping members need to be adjusted to press the wafer firmly from multiple directions. However, the inventors have discovered that during the positioning of large-size wafers, attention must be paid not only to the wafer's position and stability after being fixed, but also to its balance. Therefore, existing large-size wafer trays require repeated and precise adjustment of multiple clamping members to ensure the wafer is horizontal. In this embodiment, the position of the upper clamping member 123 can be pre-adjusted to a suitable position and then fixed. Afterward, the lower lifting seat 122 is pressed down to form a wafer loading cavity. After the wafer is loaded, the lowering gripper 131 moves to separate from the lifting seat 122 to fix the large-size wafer. Compared with existing trays, this effectively improves the loading and fixing efficiency of large-size wafers.

[0152] In one implementation, the upper pressure member 123 can be connected to the large wafer stage 121 by bolts; the height of the upper pressure member 123 can be adjusted by tightening the bolts on the upper pressure member 123. Before loading large-size wafers, multiple upper pressure members 123 can be pre-adjusted to preset positions, and the height of the upper pressure member 123 does not need to be adjusted again if the wafer specifications do not change.

[0153] In one embodiment, see Figure 3 and Figure 15 The chip fixing structure includes a lever 124; the chip adjusting gripper 130 includes a lever gripper 132 ( Figure 15 (As shown); the lever 124 is elastic and rotatably mounted on the large wafer stage 121; the lever gripper 132 is used to pull the lever 124 up and rotate it above the wafer after the wafer is clamped between the lifting seat 122 and the upper pressure member 123, so that the lever 124 presses the wafer.

[0154] In this embodiment, the pry bar 124 can be a flexible metal sheet such as a copper sheet, and can be configured with a raised end to facilitate gripping by the pry bar gripper 132. The pry bar 124 provides double fixation for the wafer on top of the clamping between the lifting seat 122 and the upper pressure member 123. The pry bar gripper 132 can be a gripper with a clamping structure, such as… Figure 15As shown, it can clamp the tail end of the lever 124 and drive the lever 124 to deform upward and rotate it above the wafer. After the lever gripper 132 separates from the lever 124, the lever 124 springs back and presses the wafer firmly. The elasticity of the lever 124 provides cushioning during pressing, preventing damage to the wafer. Through the dual fixing function of the lever 124, the fixing reliability of the wafer is further improved, preventing the wafer from loosening during angle adjustment or transportation. In addition, based on the lifting seat 122 and the upper pressure member 123, the lever 124 does not need to be repeatedly adjusted in position, which is convenient for adjustment.

[0155] Correspondingly, before removing the chip, the pick 124 needs to be moved to the outer periphery of the chip using the pick gripper 132.

[0156] In one embodiment, see Figure 3 and Figure 5 The wafer fixing structure includes a rotating plunger 125; the wafer adjusting gripper 130 includes a plunger gripper 133; the rotating plunger 125 is horizontally telescopically mounted on the large wafer stage 121; the plunger gripper 133 is used to pull the rotating plunger 125 horizontally after the wafer is clamped between the lifting seat 122 and the upper pressure member 123, and then rotate the rotating plunger 125 so that the rotating plunger 125 springs back and presses the side of the wafer.

[0157] In this embodiment, the rotating plunger 125 is elastically connected to the large wafer stage 121, allowing the rotating plunger 125 to be pulled out horizontally and reset horizontally after the tension is removed. The end of the rotating plunger 125 has a slotted locking block. The rotating plunger 125 is rotatable; when the rotating plunger 125 rotates to a horizontal position, the locking block engages with a groove on the large wafer stage 121, preventing entry and exit from the wafer loading cavity. When the rotating plunger 125 rotates to a vertical position, the locking block limits and abuts against the wafer on the large wafer stage 121, thereby providing side-mounting for the wafer and further enhancing the wafer's fixation effect.

[0158] Specifically, such as Figure 5 As shown, the end of the plunger gripper 133 is provided with a sleeve. The end edge of the rotating plunger 125 is provided with an L-shaped operating lever. The plunger gripper 133 can be moved by the multi-axis robotic arm to engage the operating lever with the sleeve, and then the rotating plunger 125 can be pulled out and rotated by the operating lever.

[0159] In one embodiment, see Figure 4 The large platform 121 has various sizes and specifications; the pressing gripper 131 is provided with multiple concentric arc grooves 135 and pressing rods 136; the pressing rods 136 can be selectively set at any position of any arc groove 135 according to the size and specifications of the large platform 121.

[0160] In this embodiment, the concentric distribution of multiple arc grooves 135 means that the multiple arc grooves 135 form multiple circles with different diameters but the same center. The pressure rod 136 can be set in circles of different diameters to accommodate wafers of different diameters, and the pressure rod 136 can be set at any position of the arc groove 135 to avoid obstructing components on the large wafer stage 121.

[0161] In practical applications, a buffer block can be provided at the bottom of the pressure bar 136 to reduce damage to the wafer.

[0162] In practical applications, the pressure rod 136 can be equipped with two nuts, which are used to clamp and fix it to the downward pressure gripper 131. Correspondingly, when the nuts are loosened, the pressure rod 136 can adjust its position along the arc groove 135. After removing the top nut, the pressure rod 136 can be removed from the arc groove 135 and installed into other arc grooves 135.

[0163] In another embodiment provided in this application, please refer to Figure 1 and Figure 6 The chip gripper 110 includes a small chip gripper 112; the chip stage 120 includes a small chip stage 126; the small chip stage 126 is used to load chips smaller than a preset size; the small chip gripper 112 is used to load chips smaller than a preset size.

[0164] In this embodiment, the small wafer stage 126 can be used to mount commonly used small-sized wafers, such as 1-inch wafers. During operation, the control system can control the multi-axis robotic arm to connect with the corresponding wafer gripper 110 according to the pre-input operation program.

[0165] In this embodiment, the small gripper 112 may have multiple vacuum adsorption ports, and different vacuum adsorption ports have different sizes to adapt to wafers of different sizes.

[0166] In one embodiment, see Figure 6 and Figure 7 The small wafer stage 126 is provided with several rotatable and height-adjustable wafer stages 127; the wafer fixing structure includes: a lifting knob 128 and a rotating knob 129; the rotating knob 129 is engaged with the wafer stage 127, and the rotating knob 129 can drive the wafer stage 127 to rotate when it rotates; the lifting knob 128 is located above the wafer stage 127, and the lifting knob 128 can drive the wafer stage 127 to rise and fall when it rises and falls; the wafer adjusting gripper 130 includes a rotating gripper 134; the rotating gripper 134 is used to drive the lifting knob 128 to rotate and to drive the lifting knob 128 to rise and fall.

[0167] In this embodiment, the rotating gripper 134 has a rotatable screw end; both the lifting knob 128 and the rotating knob 129 are provided with screw ports. After the screw end is connected to the screw port, the rotating gripper 134 can drive the screw in the lifting knob 128 to rotate, causing the lifting knob 128 to rise or fall, or driving the rotating knob 129 to rotate. Therefore, in this embodiment, the rotating gripper 134 can drive the lifting knob 128 to rotate and rise or fall, thereby driving the wafer stage 127 to rise or fall to adjust the height position of the wafer. At the same time, the rotating gripper 134 can drive the rotating knob 129 to rotate, and through the meshing connection between the rotating knob 129 and the wafer stage 127, the wafer stage 127 is driven to rotate to adjust the placement angle of the wafer. This engagement method can precisely fine-tune the spatial position of small-sized wafers, ensuring the alignment accuracy between the wafer and the subsequent photomask.

[0168] It should be noted that in this embodiment, multiple lifting knobs 128 can be provided and arranged around the wafer stage 127. Additionally, in this embodiment, the wafer stage 127 is provided with a top block for abutting the wafer. The top block can be moved to a suitable position and then fixed with screws, which can also be tightened by a rotating gripper 134. Specifically, the method by which the wafer stage 127 fixes small-sized wafers is existing technology.

[0169] In one embodiment, see Figures 8 to 11 In this embodiment, the tray gripper 210 is provided with two clamping rods 211 that can slide in opposite directions in the horizontal direction. Through the clamping of the two clamping rods 211, the tray gripper 210 can be used to clamp the large wafer stage 121, the small wafer stage 126, and the wafer transfer tray for transferring wafers.

[0170] Optionally, the pallet gripper 210 is provided with a pressure plate 212 that moves vertically, and the pressure plate 212 is driven by a cylinder. After the two gripping rods 211 clamp the pallet, the pressure plate 212 can descend vertically to press the pallet firmly, thereby improving the stability of the pallet during long-distance transportation.

[0171] For a more specific embodiment, please refer to Figure 9 and Figure 10The tray stage 220 is provided with a first stage 221, a drive unit 222, a first pressing member 223, a second pressing member 224, and a connecting rod 225. The first stage 221 has a placement station for placing the wafer stage 120. The drive unit 222 is disposed on the first stage 221. The output end of the drive unit 222 is connected to the first pressing member 223. The second pressing member 224 is slidably disposed on the first stage 221 along a third direction Y. One end of the connecting rod 225 is rotatably connected to the output end of the drive unit 222, and the other end is rotatably connected to the second pressing member 224. The drive unit 222 is used to drive the first pressing member 223 to move along the second direction X', and at the same time, through the connecting rod 225, it drives the second pressing member 224 to move along the third direction Y, so that the first pressing member 223 and the second pressing member 224 respectively press the side of the wafer stage 120 along the second direction X' and the side along the third direction Y. The second direction X' is perpendicular to the third direction Y.

[0172] In this embodiment, a slide rail 226 is provided on the first stage 221 along the third direction Y; the second pressing member 224 is slidably disposed on the slide rail 226 and limited by the slide rail 226. When the driving member 222 is activated, the driving member 222 moves and drives the first pressing member 223 to move along the second direction X'. At the same time, the output end of the driving member 222 drives the second pressing member 224, which slides along the third direction Y, to move through the connecting rod 225, so that the first pressing member 223 and the second pressing member 224 press against the side of the wafer stage 120 from two vertical directions respectively. With the above structure, the first stage 221 does not need to be provided with multiple driving sources to drive the first pressing member 223 and the second pressing member 224 to move synchronously, thereby reducing the structural cost and control cost of the tray stage 220.

[0173] In this embodiment, the first pressing member 223 can be a T-shaped block with multiple pushing rods at its end to form multi-point touch on the wafer stage 120.

[0174] Furthermore, a stop 227 is provided on one side of the first platform 221; the first pressing member 223 is provided on the other side of the first platform 221.

[0175] After the wafer stage 120 is placed on the first stage 221, as the first pressure member 223 pushes, one side of the wafer stage 120 moves to fit against the stop 227 to form a limit.

[0176] In one embodiment, there are two second pressing members 224 and two connecting rods 225, which are symmetrically arranged on both sides of the drive member 222 along the third direction Y, so that when the drive member 222 is started, the two second pressing members 224 can be driven to press the two sides of the wafer stage 120 simultaneously.

[0177] Optionally, the pallet platform 220 includes a second platform 229; a first platform 221 is slidably disposed on the second platform 229; two fine-tuning bolts 228 are disposed on the second platform 229; the two fine-tuning bolts 228 are respectively disposed on both sides of the first platform 221, and are used to push the first platform 221 to slide during rotation.

[0178] In this embodiment, the fine-tuning bolt 228 can also be controlled by the rotary gripper 134. Specifically, the rotary gripper 134 can move to a horizontal position under the drive of the multi-axis robotic arm and then contact the fine-tuning bolt 228. After that, the stepper motor of the rotary gripper 134 can be started to drive the fine-tuning bolt 228 to rotate, so as to fine-tune the position of the first platform 221.

[0179] Optionally, the side of the second pressing member 224 closest to the placement station is a V-shaped block; a V-shaped slide is provided on the side of the wafer stage 120; when the second pressing member 224 presses the wafer stage 120, the V-shaped block extends into the V-shaped slide.

[0180] In this embodiment, during the pushing process of the wafer stage 120, the V-shaped block can be engaged in the V-shaped slide. The V-shaped block and the V-shaped slide can provide precise guidance and anti-displacement positioning for the wafer stage 120, and the limiting effect of the two can prevent the wafer stage 120 from being pried.

[0181] Optionally, the optical mirror adjustment gripper 230 includes an actuating end 231 and a gripper body 232; the actuating end 231 is disposed at the end of the gripper body 232; the gripper body 232 is an elongated strip extending in the horizontal direction.

[0182] In this embodiment, when the height and / or angle of the wafer needs to be adjusted, the optical mirror adjustment gripper 230 can extend into the tray stage 220 to adjust the wafer fixing structure on the wafer stage 120. The gripper body 232 is elongated to facilitate its extension under the optical mirror stage. Specifically, after the wafer stage 120 is aligned with the optical mirror stage, the positioning markers (such as sapphire) on the wafer stage 120 will align with the optical mirror stage. By extending the optical mirror adjustment gripper 230 under the optical mirror stage, the wafer stage 120 does not need to be re-exposed to the optical mirror stage, thereby reducing the number of steps required to adjust the wafer position and angle.

[0183] In one embodiment, see Figures 12 to 17The mask fixing structure includes: several upper limit plates 321 and several lower limit plates 322; the lower limit plates 322 are elastically deformable in the vertical direction; the mask adjusting gripper 330 is provided with several pressure posts 331; when the pressure posts 331 press down on the lower limit plates 322, a mask loading cavity is formed between the upper limit plates 321 and the lower limit plates 322 for the mask to be loaded in the first direction X; after the pressure posts 331 separate from the lower limit plates 322, the lower limit plates 322 elastically reset upward to clamp the mask between the upper limit plates 321 and the lower limit plates 322.

[0184] In this embodiment, the lower limiting piece 322 can be a copper sheet. When the lower limiting piece 322 is not pressed down, it can abut against the upper limiting piece 321 by its own elastic force. When the lower limiting piece 322 is pressed down, it separates from the upper limiting piece 321 to form a gap, which serves as a mask loading cavity, allowing the mask to pass through. The mask platform 320 and mask adjusting gripper 330 provided in this solution can easily and conveniently install the mask, and quickly fix the mask after the mask adjusting gripper 330 removes the downward pressure, which can improve work efficiency and meet the requirements of automated operation.

[0185] In a more specific embodiment, the mask fixing structure includes: a side pressure block 323; the side pressure block 323 is connected to the mask platform 320 via a damping telescopic rod 324; the mask loading assembly 300 includes: a push-pull gripper 340; the push-pull gripper 340 is used to move the side pressure block 323 after the mask is clamped by the upper limit plate 321 and the lower limit plate 322, so that the side pressure block 323 presses against the side or end corner of the mask.

[0186] In this embodiment, the push-pull gripper 340 has two opening and closing gripper structures. As one implementation, the push-pull gripper 340, the paddle gripper 132, and the conductive sheet gripper 350 described below can share the same gripper.

[0187] In this embodiment, the side pressure block 323 can slide along the damping telescopic rod 324 after a certain pushing and pulling force is applied by the push-pull gripper 340. After the mask plate is clamped by the upper limit plate 321 and the lower limit plate 322, the side pressure block 323 can abut against the side or end corner of the mask plate, improving the stability of the mask plate after loading.

[0188] Furthermore, a damping rotating block 328 is provided on the mask stage 320; the damping rotating block 328 is rotatably mounted on the mask stage 320 via a damping rotating shaft; a side pressure block 323 is connected to the damping rotating block 328 via a damping telescopic rod 324; a push-pull gripper 340 is used to move the side pressure block 323 so that the side pressure block 323 presses against the end corner of the mask.

[0189] Specifically, after the push-pull gripper 340 clamps the side pressure block 323, it can drive the side pressure block 323 to rotate and extend around the damping axis. Initially, the side pressure block 323 is positioned to avoid the mask plate, allowing the mask plate to be smoothly installed into the mask plate loading cavity; then, the push-pull gripper 340 clamps the side pressure block 323 and moves it to the position to press against the end corner of the mask plate, so that the side pressure block 323 simultaneously limits both sides of the end corner of the mask plate, preventing the mask plate from shifting in the horizontal direction.

[0190] Furthermore, a limiting post 325 is provided on the mask stage 320; the limiting post 325 is provided on one side of the mask stage 320 along the first direction X, and is used to limit the sliding stroke of the mask; the side pressure block 323 is provided on the other side of the mask stage 320 along the first direction X.

[0191] In one embodiment, the lower limiting piece 322 is disposed directly below the upper limiting piece 321; the upper limiting piece 321 is provided with a pressure post clearance opening 326; the pressure post 331 can pass through the pressure post clearance opening 326 to press down the lower limiting piece 322. The way the pressure post 331 passes through the pressure post clearance opening 326 can avoid the pressure post 331 interfering with the insertion of the mask plate.

[0192] Furthermore, the mask stage 320 has various sizes and specifications; the mask adjusting gripper 330 is provided with multiple pressure post mounting holes 332; the pressure post 331 can be selectively set in any pressure post mounting hole 332 according to the size and specifications of the mask stage 320.

[0193] Furthermore, a conductive sheet spring 327 is provided on the mask stage 320; the mask loading assembly 300 includes: a conductive sheet gripper 350; the conductive sheet gripper 350 is used to grasp the conductive sheet 360 and install the conductive sheet 360 onto the mask after the mask is clamped by the upper limit plate 321 and the lower limit plate 322; the conductive sheet spring 327 can elastically deform in the vertical direction; during the process of the mask being loaded into the mask loading cavity along the first direction X, the conductive sheet spring 327 can be pushed to deform downward; the conductive sheet spring 327 is used to push the conductive sheet 360 so that the conductive sheet 360 abuts against the mask, thereby ensuring the effective connection between the conductive sheet 360 and the mask.

[0194] A second aspect of this application provides an EBL system, including the EBL automatic assembly assembly component of any of the above claims.

[0195] The EBL system provided in this solution is equipped with an automated EBL assembly component, enabling the EBL system to automate wafer loading. The coordinated operation of various components, such as the wafer loading component 100, the tray positioning component 200, and the mask loading component 300, can seamlessly connect with the EBL system's processing flow. There is no need for manual assembly of wafers and masks within the system, which not only significantly improves the overall processing efficiency of the EBL system but also avoids interference from manual wafer loading on the system's internal precision structures. At the same time, the high-precision positioning and fixing capabilities of the assembly component ensure the accuracy of EBL processing and improve processing quality.

[0196] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although this application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An automated assembly assembly for EBL wafer loading, characterized in that, include: Wafer loading assembly (100), tray positioning assembly (200) and mask loading assembly (300); The wafer loading assembly (100) includes: a wafer gripper (110), a wafer stage (120), and a wafer adjustment gripper (130). The wafer gripper (110) is used to load the wafer and then move the wafer to be placed on the wafer stage (120); The wafer adjusting gripper (130) is used to adjust the wafer fixing structure on the wafer stage (120) so that the wafer fixing structure fixes the wafer and / or adjusts the position of the wafer; The pallet positioning assembly (200) includes: a pallet gripper (210), a pallet platform (220), and a light mirror adjustment gripper (230). The pallet gripper (210) is used to transfer the wafer stage (120) to the pallet stage (220) after the wafer is loaded on the wafer stage (120); The tray stage (220) is used to fix the wafer stage (120); The optical mirror adjustment gripper (230) is used to adjust the placement angle and / or height of the wafer on the tray stage (220); The mask loading assembly (300) includes: a mask gripper (310), a mask stage (320), and a mask adjusting gripper (330). The mask plate stage (320) is provided with a mask plate fixing structure for fixing the mask plate; The mask plate adjusting gripper (330) is used to adjust the mask plate fixing structure so that the mask plate gripper (310) can grasp the mask plate and place it on the mask plate stage (320), and so that the mask plate is fixed by the mask plate fixing structure. The pallet platform (220) is provided with a first platform (221), a drive unit (222), a first pressing unit (223), a second pressing unit (224) and a connecting rod (225). The first stage (221) is provided with a placement station for placing the wafer stage (120); The driving component (222) is disposed on the first platform (221); The output end of the driving component (222) is connected to the first pressure component (223); The second pressure member (224) is slidably disposed on the first platform (221) along a third direction; One end of the connecting rod (225) is rotatably connected to the output end of the driving member (222), and the other end is rotatably connected to the second pressure member (224). The driving member (222) is used to drive the first pressing member (223) to move along the second direction, and at the same time drive the second pressing member (224) to move along the third direction through the connecting rod (225), so that the first pressing member (223) and the second pressing member (224) respectively press the side of the wafer stage (120) along the second direction and the side along the third direction.

2. The EBL automatic assembly assembly according to claim 1, characterized in that, The mask plate fixing structure includes: a plurality of upper limit plates (321) and a plurality of lower limit plates (322). The lower limiting piece (322) can elastically deform in the vertical direction; The mask plate adjusting gripper (330) is provided with a number of pressure posts (331); When the pressure column (331) presses down on the lower limiting piece (322), a mask loading cavity is formed between the upper limiting piece (321) and the lower limiting piece (322) for the mask to be loaded along the first direction; After the pressure column (331) separates from the lower limiting piece (322), the lower limiting piece (322) elastically resets upward to clamp the mask plate between the upper limiting piece (321) and the lower limiting piece (322).

3. The EBL automatic assembly assembly according to claim 2, characterized in that, The mask fixing structure includes: a side pressure block (323); The side pressure block (323) is connected to the mask plate stage (320) via a damping telescopic rod (324). The mask loading assembly (300) includes: a push-pull gripper (340); The push-pull gripper (340) is used to move the side pressure block (323) after the mask plate is clamped by the upper limit plate (321) and the lower limit plate (322), so that the side pressure block (323) presses against the side or end corner of the mask plate.

4. The EBL automatic assembly assembly according to claim 3, characterized in that, A damping rotating block (328) is provided on the mask plate stage (320); The damping rotating block (328) is rotatably mounted on the mask plate stage (320) via a damping rotating shaft. The side pressure block (323) is connected to the damping rotating block (328) via a damping telescopic rod (324); The push-pull gripper (340) is used to move the side pressure block (323) so that the side pressure block (323) presses against the end corner of the mask plate.

5. The EBL automatic assembly assembly according to claim 4, characterized in that, Limiting posts (325) are provided on the mask plate stage (320); The limiting post (325) is disposed on one side of the mask plate stage (320) along the first direction to limit the sliding stroke of the mask plate; The side pressure block (323) is disposed on the other side of the mask plate stage (320) along the first direction.

6. The EBL automatic assembly assembly according to claim 2, characterized in that, The lower limiting piece (322) is disposed directly below the upper limiting piece (321); The upper limit plate (321) is provided with a pressure column avoidance opening (326). The pressure column (331) can pass through the pressure column clearance opening (326) to press down the lower limit piece (322).

7. The EBL automatic assembly assembly according to claim 2, characterized in that, The mask plate stage (320) is available in various sizes; The mask plate adjusting gripper (330) is provided with multiple pressure column mounting holes (332); The pressure post (331) can be selectively disposed in any of the pressure post mounting holes (332) according to the size specifications of the mask plate stage (320).

8. The EBL automatic assembly assembly according to claim 2, characterized in that, The mask plate stage (320) is provided with conductive sheet springs (327). The mask loading assembly (300) includes: a conductive sheet gripper (350); The conductive sheet gripper (350) is used to grasp the conductive sheet (360) and install the conductive sheet (360) onto the mask plate after the mask plate is clamped by the upper limit plate (321) and the lower limit plate (322); The conductive sheet (327) is capable of elastic deformation in the vertical direction; During the process of the mask plate being loaded into the mask plate loading cavity along the first direction, the conductive sheet spring (327) can be pushed to deform downward; The conductive sheet spring (327) is used to push the conductive sheet (360) so that the conductive sheet (360) abuts against the mask plate.

9. The EBL automatic assembly assembly according to claim 1, characterized in that, The chip gripper (110) includes: a large gripper (111); The wafer stage (120) includes a large wafer stage (121). The large wafer stage (121) is used to load wafers larger than a preset size; The large gripper (111) is used to load wafers larger than a preset size.

10. The EBL automatic assembly assembly according to claim 9, characterized in that, The wafer fixing structure includes a lifting seat (122) and an upper pressing component (123). The lifting seat (122) can be flexibly and vertically mounted on the large plate platform (121). The upper pressure member (123) is disposed above the lifting seat (122); The chip adjustment gripper (130) includes a pressing gripper (131). The pressing gripper (131) is used to press down the lifting seat (122), so that a wafer loading cavity is formed between the lifting seat (122) and the upper pressing member (123). Then the large gripper (111) loads the wafer into the wafer loading cavity. After the pressing gripper (131) removes the pressure, the lifting seat (122) resets and clamps the wafer between the lifting seat (122) and the upper pressing member (123).

11. The EBL automatic assembly assembly according to claim 10, characterized in that, The wafer fixing structure includes a lever (124). The chip adjustment gripper (130) includes a paddle gripper (132); The paddle (124) is elastic and rotatably mounted on the large plate platform (121). The paddle gripper (132) is used to pull the paddle (124) up and rotate it above the wafer after the wafer is clamped between the lifting seat (122) and the upper pressure member (123), so that the paddle (124) presses the wafer.

12. The EBL automatic assembly assembly according to claim 10 or 11, characterized in that, The wafer fixing structure includes a rotating plunger (125); The chip adjustment gripper (130) includes a plunger gripper (133); The rotating plunger (125) is horizontally telescopically mounted on the large platform (121). The plunger gripper (133) is used to pull the rotating plunger (125) out in the horizontal direction after the wafer is clamped between the lifting seat (122) and the upper pressure member (123), and then rotate the rotating plunger (125) so that the rotating plunger (125) springs back and presses the side of the wafer.

13. The EBL automatic assembly assembly according to claim 10, characterized in that, The large platform (121) has various sizes and specifications; The pressing gripper (131) is provided with multiple concentric circular arc grooves (135) and pressure rods (136). The pressure bar (136) can be selectively positioned at any position of any of the arc grooves (135) according to the size specifications of the large platform (121).

14. The EBL automatic assembly assembly according to claim 1 or 9, characterized in that, The chip gripper (110) includes: a small chip gripper (112); The wafer stage (120) includes a small wafer stage (126). The wafer stage (126) is used to load wafers smaller than a preset size; The small gripper (112) is used to load wafers smaller than a preset size.

15. The EBL automatic assembly assembly according to claim 14, characterized in that, The small wafer stage (126) is provided with several rotatable and liftable wafer stages (127). The wafer fixing structure includes: a lifting knob (128) and a rotating knob (129). The rotary knob (129) is engaged with the wafer stage (127), and the rotary knob (129) can drive the wafer stage (127) to rotate when it is rotated; The lifting knob (128) is located above the wafer stage (127), and the lifting knob (128) can drive the wafer stage (127) to rise or fall when it is raised or lowered; The chip adjustment gripper (130) includes a rotating gripper (134). The rotating gripper (134) is used to drive the lifting knob (128) to rotate and to lift the lifting knob (128) up and down.

16. The EBL automatic assembly assembly according to claim 1, characterized in that, A stop (227) is provided on one side of the first platform (221); The first pressure member (223) is disposed on the other side of the first platform (221).

17. The EBL automatic assembly assembly according to claim 1, characterized in that, The second pressure member (224) and the connecting rod (225) each include two, and are symmetrically arranged on both sides of the driving member (222) along the third direction.

18. The EBL automatic assembly assembly according to claim 1, characterized in that, The pallet platform (220) includes a second platform (229). The first platform (221) is slidably disposed on the second platform (229); Two fine-tuning bolts (228) are provided on the second platform (229); The two fine-tuning bolts (228) are respectively disposed on both sides of the first platform (221) for pushing the first platform (221) to slide during rotation.

19. The EBL automatic assembly assembly according to claim 1, characterized in that, The second pressing component (224) has a V-shaped block on the side closest to the placement station; The wafer stage (120) is provided with a V-shaped slide on its side; When the second pressing member (224) presses the wafer stage (120), the V-shaped block extends into the V-shaped slide.

20. The EBL automatic assembly assembly according to claim 1, characterized in that, The optical mirror adjustment gripper (230) includes an actuator (231) and a gripper body (232). The execution end (231) is disposed at the end of the gripper body (232); The main body of the hand claw (232) is a long strip extending in the horizontal direction.

21. An EBL system, characterized in that, Includes the EBL automatic assembly assembly as described in any one of claims 1 to 20.

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