Foldable electronic device including printed circuit board

Abstract

A foldable electronic device according to various embodiments of the present invention comprises: a hinge module; a first housing at least partially coupled to a first side of the hinge module and including a first support member and a first printed circuit board; a first through hole formed in the first support member; a second housing at least partially coupled to a second side of the hinge module and including a second support member and a second printed circuit board; a second through hole formed in the second support member; and a conductive connection member electrically connecting the first printed circuit board and the second printed circuit board through the first through hole and the second through hole, in which the first support member includes a recess, and a portion of the first printed circuit board is disposed in the recess.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to foldable electronic devices including at least one printed circuit board. Background Technology

[0002] The use of foldable electronic devices that can be folded and unfolded in the horizontal or vertical direction is increasing, and a variety of functions are provided in such foldable electronic devices.

[0003] The foldable electronic device can operate in a folded or unfolded state, wherein the first and second housings are configured to move about a hinge module.

[0004] By using a hinge module to rotate the first and second housings, the foldable electronics can operate in an inward and / or outward folding manner. Summary of the Invention

[0005] Technical issues

[0006] Foldable electronics may include a flexible display disposed at least partially across a first housing, a hinge module, and a second housing.

[0007] In foldable electronic devices, when the first and second housings are folded using a hinge module, the flexible display can also be folded together, and when the first and second housings are unfolded, the flexible display can also be unfolded together.

[0008] The foldable electronic device may include a first printed circuit board disposed in the interior space of a first housing and a second printed circuit board disposed in the interior space of a second housing. The first and second printed circuit boards may be electrically connected to each other through a plurality of conductive connecting members (e.g., flexible printed circuit boards (FPCBs)) passing through the first and second housings.

[0009] Foldable electronics can reduce the area of ​​the first and second printed circuit boards in order to ensure channel areas and sealing areas for multiple conductive connection components.

[0010] For example, when the area of ​​the first printed circuit board and the second printed circuit board is reduced, the space for placing electronic components can be reduced, and it may be difficult to connect the first printed circuit board and the second printed circuit board using a single conductive connection member.

[0011] Various embodiments of this disclosure may provide a foldable electronic device capable of partially expanding the area of ​​a printed circuit board (e.g., a first printed circuit board) by forming a recess or slit in a portion of a support member (e.g., a first support member) and disposing a portion of the printed circuit board in the recess or slit.

[0012] The technical problems to be solved by this disclosure are not limited to those described above, and other technical problems not mentioned above can be clearly understood by those skilled in the art to which this disclosure pertains.

[0013] Solution to the problem

[0014] According to embodiments of this disclosure, a foldable electronic device may include: a hinge module; a first housing at least partially coupled to a first side of the hinge module and including a first support member and a first printed circuit board; a first through-hole formed in the first support member; a second housing at least partially coupled to a second side of the hinge module and including a second support member and a second printed circuit board; a second through-hole formed in the second support member; and a conductive connection member configured to electrically connect the first printed circuit board and the second printed circuit board through the first through-hole and the second through-hole. According to an embodiment, the first support member may include a recess. According to an embodiment, a portion of the first printed circuit board may be configured to be disposed in the recess.

[0015] Beneficial effects of the invention

[0016] According to various embodiments of this disclosure, the area of ​​the circuit board can be partially expanded by placing a portion of the printed circuit board in a recess (e.g., groove) or slit formed in a support member, and the first and second circuit boards can be electrically connected by using a single conductive connection member (e.g., FPCB).

[0017] In addition, various effects that can be directly or indirectly identified through this document can be provided. Attached Figure Description

[0018] In conjunction with the description in the accompanying drawings, the same or similar components may be represented by the same or similar reference numerals.

[0019] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0020] Figure 2a and Figure 2b These are front and rear views showing a foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0021] Figure 3a and Figure 3b These are front and rear views showing a foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0022] Figure 4 This is a schematic exploded perspective view illustrating a foldable electronic device according to various embodiments of the present disclosure.

[0023] Figure 5This is a schematic rear view showing a portion of the construction of a foldable electronic device in an unfolded state according to an embodiment of the present disclosure.

[0024] Figure 6 This illustrates an embodiment according to the present disclosure. Figure 5 A schematic cross-sectional view of the cross section A-A' of the foldable electronic device.

[0025] Figure 7 This is an illustrative representation of the formation according to an embodiment of the present disclosure. Figure 5 Enlarged view of at least one slit in a portion of region B of the foldable electronic device.

[0026] Figure 8 This illustrates an embodiment according to the present disclosure. Figure 5 A schematic diagram of an extension of the first printed circuit board in a portion of region B of a foldable electronic device.

[0027] Figure 9a This is an illustrative representation of an embodiment according to the present disclosure. Figure 5 A view showing a partial structure of a portion of the first housing of the foldable electronic device disclosed in the paper.

[0028] Figure 9b This is an illustrative representation of an embodiment according to the present disclosure. Figure 9a A view of a partial structure of portion C of the first housing disclosed herein.

[0029] Figure 9c This is an illustrative representation of an embodiment according to the present disclosure. Figure 9a The diagram shows a partial view of the first housing portion D, with the first antenna module partially removed.

[0030] Figure 9d This is an illustrative representation of an embodiment according to the present disclosure. Figure 9a An enlarged view of a portion D of the first housing shown in the figure.

[0031] Figure 9e This is a schematic view of an elastic member according to an embodiment of the present disclosure. Detailed Implementation

[0032] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0033] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0034] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be adapted to perform a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may implement a portion of the main processor 121.

[0035] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can, together with the main processor 121, control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0036] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0037] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0038] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0039] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0041] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0042] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0043] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0044] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0046] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0047] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0048] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell.

[0049] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 uses user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199).

[0050] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure the performance of high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0051] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0052] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals of the specified high-frequency band.

[0053] At least some of the aforementioned components can be interconnected via a peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)) and can communicatively transmit signals (e.g., commands or data) between them.

[0054] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0055] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0056] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether or not the terms “operably” or “communically” are used, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0057] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0058] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media can be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0059] Figure 2a and Figure 2b These are front and rear views showing a foldable electronic device in an unfolded state according to various embodiments of the present disclosure. Figure 3a and Figure 3b These are front and rear views showing a foldable electronic device in a folded state according to various embodiments of the present disclosure.

[0060] According to various embodiments, Figure 1 The embodiments disclosed herein may include Figures 2a to 3b In the embodiments disclosed herein. For example. Figures 2a to 3b The foldable electronic device 200 shown may include Figure 1 The processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, communication module 190, antenna module 197 and / or user identification module 196 shown.

[0061] Reference Figures 2a to 3b The foldable electronic device 200 according to various embodiments of the present disclosure may include: a pair of housings (e.g., a first housing 210 and a second housing 220), connected by a hinge module (e.g., Figure 4The hinge plate 320 or hinge device is rotatably connected about the folding axis A so that it is foldable relative to each other; a flexible display 230 (e.g., a first display, a foldable display or a main display) is disposed on a pair of housings 210 and 220; and / or a sub-display 300 (e.g., a second display) is disposed on a second housing 220.

[0062] According to various embodiments, at least a portion of the hinge module (e.g., Figure 4 The hinge plate 320 can be positioned so that it is not visible from the outside through the first housing 210 and the second housing 220, and in the unfolded state, it can be made not visible from the outside by means of the hinge cover 310 (e.g., hinge housing) covering the foldable portion.

[0063] Here, the surface on which the flexible display 230 is disposed can be defined as the front surface of the foldable electronic device 200 (e.g., in the z-axis direction), and the surface opposite to the front surface can be defined as the rear surface of the foldable electronic device 200 (e.g., in the -z-axis direction). The surface surrounding the space between the front and rear surfaces can be defined as the side surface of the foldable electronic device 200.

[0064] According to various embodiments, a pair of housings 210 and 220 may include hinge modules (e.g., Figure 4 The hinge plate 320 is arranged foldably relative to the first housing 210 and the second housing 220. The pair of housings 210 and 220 are not limited to... Figures 2a to 3b The shapes and connections shown are not limited to those shown in the diagram and can be achieved through combinations and / or connections of other shapes or components. For example, the first housing 210 and the second housing 220 may be positioned on opposite sides of the folding axis A (e.g., in the x-axis and -x-axis directions) and may have generally symmetrical shapes about the folding axis A. According to various embodiments, the first housing 210 and the second housing 220 may be folded asymmetrically about the folding axis A. The angle or distance between the first housing 210 and the second housing 220 may vary depending on whether the foldable electronics 200 is in an unfolded state, a folded state, or an intermediate state.

[0065] According to various embodiments, when the foldable electronics 200 is in the unfolded state, the first housing 210 can be connected to the hinge module (e.g., Figure 4 The first side of the hinge plate 320 (e.g., in the x-axis direction) may include a first surface 211 disposed facing the front of the foldable electronic device 200, a second surface 212 facing the opposite direction to the first surface 211, and / or a first side surface member 213 surrounding at least a portion of the first space between the first surface 211 and the second surface 212.

[0066] According to various embodiments, when the foldable electronics 200 is in the unfolded state, the second housing 220 can be connected to the hinge module (e.g., Figure 4 The second side of the hinge plate 320 (e.g., in the -x axis direction) may include a third surface 221 disposed facing the front of the foldable electronic device 200, a fourth surface 222 facing the opposite direction of the third surface 221, and / or a second side surface member 223 surrounding at least a portion of the second space between the third surface 221 and the fourth surface 222.

[0067] According to an embodiment, the first surface 211 can be oriented substantially in the same direction as the third surface 221 in the unfolded state, and can face at least partially toward the third surface 221 in the folded state.

[0068] According to various embodiments, the foldable electronic device 200 may further include a recess 201 formed to accommodate the flexible display 230 via a structural connection between a first housing 210 and a second housing 220. The recess 201 may have substantially the same dimensions as the flexible display 230.

[0069] According to various embodiments, a hinge cover 310 (e.g., a hinge housing) may be disposed between a first housing 210 and a second housing 220. The hinge cover 310 may be configured to cover a hinge module (e.g., Figure 4 At least a portion of the hinge plate 320. Depending on whether the foldable electronics 200 is in an unfolded, folded, or intermediate state, the hinge cover 310 may be covered by a portion of the first housing 210 and the second housing 220 or may be exposed to the outside.

[0070] According to various embodiments, when the foldable electronic device 200 is in the unfolded state, at least a portion of the hinge housing 310 may be covered by the first housing 210 and the second housing 220 to be substantially not exposed to the outside. When the foldable electronic device 200 is in the folded state, at least a portion of the hinge cover 310 may be exposed to the outside between the first housing 210 and the second housing 220. When the first housing 210 and the second housing 220 are in an intermediate state folded at an angle, the hinge cover 310 may be at least partially exposed to the outside of the foldable electronic device 200 between the first housing 210 and the second housing 220. For example, the area of ​​the hinge cover 310 exposed to the outside may be smaller than it is in the fully folded state. The hinge cover 310 may at least partially include a curved surface.

[0071] According to various embodiments, when the foldable electronic device 200 is in the unfolded state (e.g., Figure 2a and Figure 2bIn the unfolded state, the first housing 210 and the second housing 220 can form an angle of approximately 180 degrees, and the first region 230a, the second region 230b, and the folded region 230c of the flexible display 230 can be arranged coplanarly and oriented in substantially the same direction (e.g., the z-axis direction). In another embodiment, when the foldable electronics 200 is in the unfolded state, the first housing 210 can rotate relative to the second housing 220 in an outward folded manner such that the second surface 212 and the fourth surface 222 face each other.

[0072] According to various embodiments, when the foldable electronic device 200 is in a folded state (e.g., Figure 3a and Figure 3b When the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 are in the state of facing each other, the first region 230a and the second region 230b of the flexible display 230 can form a narrow angle (e.g., in the range of 0 to about 10 degrees) about each other via the folding region 230c and can be configured to face each other.

[0073] According to various embodiments, at least a portion of the folding region 230c can be deformed into a curved shape with a predetermined curvature. When the foldable electronic device 200 is in an intermediate state, the first housing 210 and the second housing 220 can be arranged at an angle relative to each other. In this case, the first region 230a and the second region 230b of the flexible display 230 can form an angle larger than that in the folded state and smaller than that in the unfolded state, and the curvature of the folding region 230c can be smaller than that in the folded state and larger than that in the unfolded state.

[0074] According to various embodiments, the first housing 210 and the second housing 220 can be connected via a hinge module (e.g., Figure 4 The hinge plates 320 are formed to allow them to stop at a predetermined folding angle between the folded and unfolded states (e.g., a free-stop function). In some embodiments, the first housing 210 and the second housing 220 can be connected via a hinge module (e.g., Figure 4 The hinge plate 320 operates continuously in the opening or closing direction under pressure, with reference to a predetermined inflection angle.

[0075] According to various embodiments, the foldable electronic device 200 may include at least one display (e.g., flexible display 230 or sub-display 300), input device 215, sound output devices 227 and 228, sensor modules 217a, 217b and 226, camera modules 216a, 216b and 225, key input device 219, indicator (not shown), or connector port 229 disposed on a first housing 210 and / or a second housing 220. In some embodiments, at least one of the above components may be omitted from the foldable electronic device 200, or at least one other component may be included.

[0076] According to various embodiments, at least one display (e.g., flexible display 230 or sub-display 300) may include: a flexible display 230 (e.g., a first display), configured to be connected by a hinge module (e.g., from a first surface 211 of a first housing 210 via a hinge module) Figure 4 The hinge plate 320 is supported by a third surface 221 of the second housing 220; and a sub-display 300 (e.g., a second display) is disposed within the interior space of the second housing 220 so that it is at least partially visible from the outside via a fourth surface 222. In some embodiments, the sub-display 300 may be disposed within the interior space of the first housing 210 so that it is visible from the outside via a second surface 212. According to an embodiment, when the foldable electronics 200 is in an unfolded state, the flexible display 230 may be used primarily, and when the foldable electronics 200 is in a folded state, the sub-display 300 may be used primarily. According to an embodiment, in an intermediate state, the foldable electronics 200 may be controlled such that the flexible display 230 and / or the sub-display 300 may be used based on the folding angle of the first housing 210 and the second housing 220.

[0077] According to various embodiments, the flexible display 230 may be disposed within a receiving space formed by a pair of housings 210 and 220. For example, the flexible display 230 may be disposed in a recess 201 defined by the pair of housings 210 and 220, and may be configured to occupy substantially most of the front surface of the foldable electronics 200 in an unfolded state. According to embodiments, at least a portion of the flexible display 230 may deform into a flat or curved surface. The flexible display 230 may include a first region 230a facing the first housing 210, a second region 230b facing the second housing 220, and a junction connecting the first region 230a and the second region 230b and facing a hinge module (e.g., Figure 4 The hinge plate 320) folds into a folding region 230c. According to an embodiment, the flexible display 230 is divided into regions solely by a pair of housings 210 and 220 and a hinge module (e.g., ...). Figure 4The exemplary physical division defined by the hinge plate 320) and the flexible display 230 can be defined by a pair of housings 210 and 220 and a hinge module (e.g., Figure 4 The hinge panel 320 is displayed as a seamless single full screen. The first region 230a and the second region 230b may have a generally symmetrical shape with respect to the folding region 230c, or they may have a partially asymmetrical shape.

[0078] According to various embodiments, the foldable electronic device 200 may include a first rear surface cover 240 disposed on a second surface 212 of a first housing 210 and a second rear surface cover 250 disposed on a fourth surface 222 of a second housing 220. In some embodiments, at least a portion of the first rear surface cover 240 may be integrally formed with a first side surface member 213. In some embodiments, at least a portion of the second rear surface cover 250 may be integrally formed with a second side surface member 223. According to embodiments, at least one of the first rear surface cover 240 and the second rear surface cover 250 may be made of a substantially transparent plate (e.g., a glass plate including various coatings, or a polymer plate) or an opaque plate.

[0079] According to various embodiments, the first rear cover 240 may be made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or an opaque sheet (such as a combination of two or more of these materials). The second rear cover 250 may be made of, for example, a substantially transparent sheet of glass or polymer. In this case, the second display 300 may be disposed within the interior space of the second housing 220 so that it is visible from the outside through the second rear cover 250.

[0080] According to various embodiments, input module 215 may include a microphone. In some embodiments, input module 203 may include a plurality of microphones configured to detect the direction of sound. Input module 215 may include Figure 1 The input module 150 is shown in the figure.

[0081] According to various embodiments, sound output modules 227 and 228 may include loudspeakers. According to embodiments, sound output modules 227 and 228 may include a call receiver 227 disposed through a fourth surface 222 of the second housing 220 and an external loudspeaker 228 disposed through at least a portion of a second side surface member 223 of the second housing 220. In some embodiments, input device 215, sound output modules 227 and 228, and connector 229 may be disposed within the space of the first housing 210 and / or the second housing 220 and may be exposed to the external environment through at least one aperture formed in the first housing 210 and / or the second housing 220. In some embodiments, the aperture provided in the first housing 210 and / or the second housing 220 may be used collectively for input module 215 and sound output modules 227 and 228. In some embodiments, sound output modules 227 and 228 may include loudspeakers (e.g., piezoelectric loudspeakers) that operate without the aperture formed in the first housing 210 and / or the second housing 220. Sound output modules 227 and 228 may include… Figure 1 The sound output module 155 is shown in the figure.

[0082] According to various embodiments, camera modules 216a, 216b, and 225 may include a first camera module 216a disposed on a first surface 211 of the first housing 210, a second camera module 216b disposed on a second surface 212 of the first housing 210, and / or a third camera module 225 disposed on a fourth surface 222 of the second housing 220. According to embodiments, the foldable electronics 200 may include a flash 218 disposed near the second camera module 216b. The flash 218 may include, for example, a light-emitting diode or a xenon lamp. According to embodiments, camera modules 216a, 216b, and 225 may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, at least one of camera modules 216a, 216b, and 225 may include two or more lenses (e.g., a wide-angle lens and a telephoto lens) and an image sensor, and may be disposed together on one surface of the first housing 210 and / or the second housing 220. Camera modules 216a, 216b, and 225 may include... Figure 1 Camera module 180 is shown in a.

[0083] According to various embodiments, sensor modules 217a, 217b, and 226 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the foldable electronic device 200. In embodiments, sensor modules 217a, 217b, and 226 may include a first sensor module 217a disposed on a first surface 211 of the first housing 210, a second sensor module 217b disposed on a second surface 212 of the first housing 210, and / or a third sensor module 226 disposed on a fourth surface 222 of the second housing 220. In some embodiments, sensor modules 217a, 217b, and 226 may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, an illuminance sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time-of-flight (TOF) sensor or a light detection and ranging (LiDAR) sensor). Sensor modules 217a, 217b, and 226 may include... Figure 1 Sensor module 176 is shown in a.

[0084] According to various embodiments, the foldable electronic device 200 may further include a sensor module (not shown), such as at least one of an atmospheric pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, a Hall sensor, a six-axis sensor, an accelerometer, an angular velocity sensor, or a fingerprint sensor. In some embodiments, the fingerprint sensor may pass through at least one of a first side surface member 213 of the first housing 210 and a second side surface member 223 of the second housing 220.

[0085] According to various embodiments, the key input device 219 may be configured to be exposed to the outside via a first side surface member 213 of the first housing 210. In some embodiments, the key input device 219 may be configured to be exposed to the outside via a second side surface member 223 of the second housing 220. In some embodiments, the foldable electronics 200 may not include some or all of the key input devices 219, and the unincluded key input devices 219 may be implemented in another form, such as soft keys on at least one display 230 or 300. In another embodiment, the key input device 219 may be implemented using a pressure sensor included in at least one of the displays 230 and 300. The key input device 219 may turn the power on or off of the foldable electronics 200, or adjust the volume.

[0086] According to various embodiments, connector port 229 may include a means for connecting to external electronic devices (e.g., Figure 1The connector (e.g., a USB connector or an interface connector port module (IF module)) transmits and / or receives power and / or data from external electronic devices 102, 104, and 108. In some embodiments, connector port 229 may be configured to perform the function of transmitting / receiving audio signals to / from external electronic devices, or may further include a separate connector port (e.g., a headphone jack) configured to perform audio signal transmission / reception functions. The connector port (not shown) may include Figure 1 The publicly disclosed connection terminal is 178.

[0087] According to various embodiments, at least one camera module 216a or 225 among camera modules 216a, 216b, and 225, at least one sensor module 217a or 226 among sensor modules 217a, 217b, and 226, and / or an indicator may be configured to be exposed through at least one display 230 or 300. For example, at least one camera module 216a or 225, at least one sensor module 217a or 226, and / or an indicator may be disposed in the internal space of at least one housing 210 or 300 below the effective area (display area) of at least one display 230 or 300, and may be configured to contact the external environment through openings to a cover member (e.g., a window layer (not shown) of the flexible display 230) and / or a second rear surface cover 250 or a transparent area. According to embodiments, the area where at least one display 230 or 300 and at least one camera module 216a or 225 face each other may be provided as a transmissive area with a predetermined transmittance, as part of the content display area. According to embodiments, the transmissive region may have a transmittance range in the range of about 5% to about 20%. The transmissive region may include an area overlapping with the effective area (e.g., field of view) of at least one camera module 216a or 225, through which light imaged by an image sensor to generate an image passes. For example, the transmissive regions of at least one display 230 or 300 may each include areas having a lower pixel density than the periphery. For example, the transmissive region may be provided instead of an opening. For example, at least one camera module 216a or 225 may include an under-display camera (UDC) or an under-panel camera (UPC). In another embodiment, some of the camera modules or sensor modules 217a and 226 may be arranged to perform their functions without being visually exposed through the display. For example, in an under-display camera (UDC) configuration, the area facing the camera module 216a or 225 and / or sensor module 217a or 226 disposed under at least one display 230 or 300 (e.g., a display panel) may not require a perforated opening.

[0088] Figure 4This is a schematic exploded perspective view illustrating a foldable electronic device according to various embodiments of the present disclosure.

[0089] Reference Figure 4 The foldable electronic device 200 may include a flexible display 230 (e.g., a first display), a sub-display 300 (e.g., a second display), a hinge plate 320 (e.g., a hinge module, hinge device, or hinge assembly), a pair of support members (e.g., a first support member 261 and a second support member 262), at least one substrate 270 (e.g., a printed circuit board), a first housing 210, a second housing 220, a first rear surface cover 240, and / or a second rear surface cover 250.

[0090] According to various embodiments, the flexible display 230 may include a display panel 430 (e.g., a flexible display panel), a support plate 450 disposed below the display panel 430 (e.g., in the -z axis direction), and a pair of metal plates 461 and 462 disposed below the support plate 450 (e.g., in the -z axis direction).

[0091] According to various embodiments, the flexible display panel 430 may include a first region of the flexible display 230 (e.g., ...). Figure 2a The first panel region 430a corresponding to the first region 230a, and the second region (e.g., the flexible display 230) extending from the first panel region 430a and corresponding to the second region of the flexible display 230. Figure 2a The second panel area 430b corresponding to the second area 230b, and the folded area connecting the first panel area 430a and the second panel area 430b and the first display 230 (e.g., the second panel area 430b). Figure 2a The third panel area 430c corresponds to the folded area 230c.

[0092] According to various embodiments, a support plate 450 may be disposed between the display panel 430 and a pair of support members 261 and 262. The support plate 450 may be configured with a material and shape that provides a flat support structure for a first panel region 430a and a second panel region 430b, and a flexible structure for supporting a third panel region 430c. According to embodiments, the support plate 450 may be formed of a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or fiber-reinforced plastic (FRP)). According to embodiments, the pair of metal plates 461 and 462 may include: a first metal plate 461, disposed between the support plate 450 and the pair of support members 261 and 262 to correspond to at least a portion of the first panel region 430a and the third panel region 430c; and a second metal plate 462, corresponding to at least a portion of the second panel region 430b and the third panel region 430c. According to embodiments, the pair of metal plates 461 and 462 may be formed of a metallic material (e.g., SUS), thereby contributing to providing a grounding connection structure and rigidity reinforcement for the flexible display 230.

[0093] According to various embodiments, the sub-display 300 may be disposed in the space between the second housing 220 and the second rear surface cover 250. According to embodiments, the sub-display 300 may be disposed in the space between the second housing 220 and the second rear surface cover 250 so that it is visible from the outside through substantially the entire area of ​​the second rear surface cover 250.

[0094] According to various embodiments, at least a portion of the first support member 261 can be foldably coupled to the second support member 262 via at least one hinge plate 320 (e.g., a hinge module). According to embodiments, the foldable electronics 200 may include at least one conductive connection member 263 (e.g., a flexible printed circuit board (FPCB)) disposed across the hinge plate 320 from at least a portion of the first support member 261 to a portion of the second support member 262. According to embodiments, the first support member 261 may extend from or be configured to be structurally coupled to the first side surface member 213. According to embodiments, the foldable electronics 200 may include a first space (e.g., provided by the first support member 261 and the first rear surface cover 240) Figure 2a First Space 2101).

[0095] According to various embodiments, the first housing 210 (e.g., a first housing structure) can be constructed by connecting a first side surface member 213, a first support member 261, and a first rear surface cover 240. According to embodiments, a second support member 262 may extend from or be structurally coupled to the second side surface member 223. According to embodiments, the foldable electronics 200 may include a second space (e.g., provided by the second support member 262 and the second rear surface cover 250) Figure 2a The second space 2201).

[0096] According to various embodiments, the second housing 220 (e.g., a second housing structure) can be constructed by the connection of a second side surface member 223, a second support member 262, and a second rear surface cover 250. According to embodiments, at least one conductive connection member 263 and / or at least a portion of the hinge plate 320 can be configured to be supported by at least a portion of a pair of support members 261 and 262. According to embodiments, at least one conductive connection member 263 can be arranged in a direction intersecting the first support member 261 and the second support member 262 (e.g., in the x-axis direction and the -x-axis direction). According to embodiments, at least one conductive connection member 263 can be arranged substantially perpendicular to the folding axis (e.g., ...). Figure 2a In the direction of the y-axis or folding axis A (e.g., the x-axis direction).

[0097] According to various embodiments, at least one substrate 270 may include a first substrate 271 (e.g., a first printed circuit board) disposed in a first space 2101 and a second substrate 272 (second printed circuit board) disposed in a second space 2201. According to embodiments, the first substrate 271 and the second substrate 272 may include one or more electronic components configured to implement various functions of the foldable electronic device 200. According to embodiments, the first substrate 271 (e.g., the first printed circuit board) and the second substrate 272 (e.g., the second printed circuit board) may be electrically connected via at least one conductive connection member 263. In an embodiment, a camera module 282 may be disposed on the first circuit board 271.

[0098] According to various embodiments, the foldable electronic device 200 may include one or more batteries 291 and 292. According to embodiments, the one or more batteries 291 and 292 may include a first battery 291 disposed in a first space 2101 of the first housing 210 and electrically connected to a first substrate 271, and a second battery 292 disposed in a second space 2201 of the second housing 220 and electrically connected to a second substrate 272. According to embodiments, the first support member 261 and the second support member 262 may further include one or more expansion holes for the first battery 291 and the second battery 292.

[0099] According to various embodiments, the first housing 210 may include a first rotating support surface 214. The second housing 220 may include a second rotating support surface 224. According to embodiments, the first rotating support surface 214 and the second rotating support surface 224 may include curved surfaces corresponding to the curved outer surface of the hinge cover 310. According to embodiments, when the foldable electronics 200 is in the unfolded state, the first rotating support surface 214 and the second rotating support surface 224 may cover the hinge cover 310, thereby preventing the hinge cover 310 from being exposed or allowing it to be exposed only partially on the rear surface of the foldable electronics 200. According to embodiments, when the foldable electronics 200 is in the folded state, the first rotating support surface 214 and the second rotating support surface 224 may rotate along the outer surface of the hinge cover 310, thereby allowing the hinge cover 310 to be exposed at least partially on the rear surface of the foldable electronics 200.

[0100] According to various embodiments, the foldable electronic device 200 may include at least one antenna 276 (e.g., an antenna module) disposed in a first space 2201. According to embodiments, the at least one antenna 276 may be disposed in the first space 2201 between a first battery 291 and a first rear surface cover 240. According to embodiments, the at least one antenna 276 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, an ultra-wideband (UWB) antenna, and / or a magnetically secure transmission (MST) antenna. According to embodiments, the at least one antenna 276 may perform, for example, near-field communication with an external device or wireless transmission / reception of power required for charging. According to various embodiments, the at least one antenna 276 (e.g., an antenna module) is not limited to the examples described above and may include various other types of antennas (e.g., millimeter-wave antennas), as long as it can communicate with another electronic device (e.g., Figure 1 The electronic device 102 and / or electronic device 104) perform wireless communication. For example, the antenna structure may be formed by at least a portion of the first side surface member 213 or the second side surface member 223 and / or a portion or combination of the first support member 261 and the second support member 262.

[0101] According to various embodiments, the foldable electronic device 200 may further include one or more electronic component assemblies 274 and 275 and / or additional support members 273 and 277 disposed in the first space 2101 and / or the second space 2201. For example, one or more electronic component assemblies 274 and 275 may include an interface connector port assembly 274 and a speaker assembly 275. For example, the additional support member 273 may include a speaker assembly 273.

[0102] Figure 5This is a schematic rear view showing a portion of the construction of a foldable electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 6 This illustrates an embodiment according to the present disclosure. Figure 5 A schematic cross-sectional view of the cross section A-A' of the foldable electronic device. Figure 7 This is an illustrative representation of the formation according to an embodiment of the present disclosure. Figure 5 Enlarged view of at least one slit in a portion of region B of the foldable electronic device. Figure 8 This illustrates an embodiment according to the present disclosure. Figure 5 A schematic diagram of an extension of the first printed circuit board in a portion of region B of a foldable electronic device.

[0103] According to an embodiment, Figure 5 This can be illustrated when an embodiment is presented according to this disclosure. Figure 2b A schematic rear view (e.g., in the -z axis direction) of a portion of the construction of the first housing 210 and the second housing 220 (where the first rear surface cover 240 and the second rear surface cover 250 are omitted) when the foldable electronic device 200 is in the unfolded state.

[0104] According to various embodiments, the foldable electronic device 200 described below may include Figure 1 Electronic device 101 and Figures 2a to 4 An embodiment of the foldable electronic device 200. In the following description of the foldable electronic device 200, with Figures 1 to 4 Components that are substantially the same as those shown in the figures are indicated by the same reference numerals, and repeated descriptions of their functions may be omitted.

[0105] In the following description, for example with reference to foldable electronic device 200, the present disclosure is not limited thereto and can be applied substantially equivalently to other types of electronic devices, such as candybar, rollable, sliding, tablet PCs and / or notebook PCs.

[0106] In Figure 5 In the embodiments of the foldable electronic device 200 shown, a structure in which the first housing 210 and the second housing 220 unfold and fold in the horizontal direction (e.g., in the x-axis direction and the -x-axis direction) is shown. However, this disclosure is not limited thereto and can be applied substantially equivalently to foldable electronic devices having a structure in which the housings unfold and fold in the vertical direction (e.g., in the y-axis direction and the -y-axis direction).

[0107] Reference Figure 5 The foldable electronic device 200 may include a first housing 210, a hinge module 320, and a second housing 220.

[0108] According to the embodiments, such as Figures 2a to 3b As shown, the first housing 210 and the second housing 220 may be relative to the hinge module 320 (e.g., Figure 4 The hinge plate operates in either the unfolded or folded state. The hinge module 320 can rotatably connect the first housing 210 and the second housing 220.

[0109] According to an embodiment, the first housing 210 may be at least partially connected to a first side of the hinge module 320 (e.g., in the x-axis direction). The second housing 220 may be at least partially connected to a second side of the hinge module 320 (e.g., in the -x-axis direction). The first housing 210 may be configured to be foldable and deployable with respect to the second housing 220 using the hinge module 320. The second housing 220 may be configured to be foldable and deployable with respect to the first housing 210 using the hinge module 320.

[0110] According to an embodiment, the first housing 210 may include a first support member 261 and a first printed circuit board 271. At least a portion of the first support member 261 may be foldably and unfoldably connected to a second support member 262 via a hinge module 320. The first support member 261 may extend from or be structurally connected to the first side surface member 213.

[0111] According to an embodiment, the first support member 261 may include a first through hole 510. The first through hole 510 may be formed at a predetermined position on the first support member 261 to allow a portion of the conductive connection member 263 to pass through it.

[0112] According to an embodiment, a first printed circuit board 271 may be disposed on the rear surface of a first support member 261 (e.g., in the -z-axis direction). The first printed circuit board 271 may be supported by the first support member 261. The first printed circuit board 271 may be disposed in a first space defined by the first support member 261 and the first rear surface cover 240 (e.g., ...). Figure 2a In the first space 2101).

[0113] According to an embodiment, the second housing 220 may include a second support member 262 and a second printed circuit board 272. At least a portion of the second support member 262 may be foldably and unfoldably connected to the first support member 261 via a hinge module 320. The second support member 262 may extend from or be structurally connected to the second side surface member 223.

[0114] According to an embodiment, the second support member 262 may include a second through hole 520. The second through hole 520 may be formed at a predetermined position on the second support member 262 to allow a portion of the conductive connection member 263 to pass through it.

[0115] According to an embodiment, the second printed circuit board 272 may be disposed on the rear surface of the second support member 262 (e.g., in the -z axis direction). The second printed circuit board 272 may be supported by the second support member 262. The second printed circuit board 272 may be disposed in a second space (e.g., defined by the second support member 262 and the second rear surface cover 250). Figure 2a In the second space (2201).

[0116] According to various embodiments, the first circuit board 271 and the second circuit board 272 may include at least one electronic component disposed thereon (e.g., Figure 6 Electronic components 560) to realize various functions of the foldable electronic device 200. For example, at least one electronic component (e.g., Figure 6 The electronic component 560 may include Figure 1 At least one of the processor 120, memory 130, communication module 190, sensor module 176 and antenna module 197 disclosed herein.

[0117] According to an embodiment, the first circuit board 271 and the second circuit board 272 can be electrically connected via a conductive connection member 263 (e.g., an FPCB). For example, the conductive connection member 263 can electrically connect the first circuit board 271 and the second circuit board 272 via a first through hole 510 and a second through hole 520. For example, the conductive connection member 263 can electrically connect the first circuit board 271 and the second circuit board 272 across the first through hole 510, at least a portion of the hinge module 320, and the second through hole 520. For example, the conductive connection member 263 can electrically connect the first circuit board 271 and the second circuit board 272 via connectors 550 respectively disposed on the first circuit board 271 and the second circuit board 272.

[0118] According to an embodiment, the conductive connecting member 263 may be disposed in a direction intersecting the first support member 261 and the second support member 262 (e.g., in the x-axis direction and the -x-axis direction). For example, the conductive connecting member 263 may be disposed substantially perpendicular to the folding axis (e.g., Figure 2a In the direction of the y-axis or folding axis A (e.g., in the x-axis direction and the -x-axis direction).

[0119] According to an embodiment, a first sealing member 530 may be disposed in a first through hole 510 through which the conductive connecting member 263 passes. The first sealing member 530 may seal the portion of the conductive connecting member 263 passing through the first through hole 510. For example, the first sealing member 530 may seal both the first through hole 510 and the portion of the conductive connecting member 263 disposed within the first through hole 510. The first sealing member 530 may perform waterproof and dustproof functions. For example, the first sealing member 530 may prevent moisture and dust from entering the interior of the foldable electronic device 200 from the exterior of the first housing 210 (e.g., the first support member 261).

[0120] According to an embodiment, a second sealing member (not shown) may be disposed in the second through hole 520 through which the conductive connecting member 263 passes. The second sealing member may seal the portion of the conductive connecting member 263 passing through the second through hole 520. For example, the second sealing member may seal the portion of the second through hole 520 and the portion of the conductive connecting member 263 disposed in the second through hole 520. The second sealing member may perform waterproof and dustproof functions. For example, the second sealing member may prevent moisture and dust from entering the interior of the foldable electronic device 200 from the outside of the second housing 220 (e.g., the second support member 262) of the foldable electronic device 200.

[0121] Reference Figure 6 The first printed circuit board (PCB) 271 may include a connector 550. The connector 550 may be disposed on a first surface of the first printed circuit board 271 (e.g., in the -z-axis direction). For example, the connector 550 may be disposed on the first surface of the first printed circuit board 271 using a header 555 (e.g., a socket or connector plug). For example, the first printed circuit board 271 and the connector 550 may be electrically connected to each other using the header 555. The connector 550 may be electrically connected to a portion of the conductive connection member 263.

[0122] According to an embodiment, the first printed circuit board 271 (or the second printed circuit board 272) may include at least one electronic component 560. For example, at least one electronic component 560 may be disposed on a second surface of the first printed circuit board 271 (or the second printed circuit board 272) (e.g., in the z-axis direction).

[0123] According to an embodiment, a shielding member 570 may be disposed on a second surface of a first printed circuit board 271 (or a second printed circuit board 272). The shielding member 570 may be disposed between the first printed circuit board 271 (or the second printed circuit board 272) and a first support member 261 (or the second support member 262). The shielding member 570 may shield electrical noise generated from at least one electronic component 560. For example, the shielding member 570 may be formed of a conductive material. For example, the shielding member 570 may include a shielding cover.

[0124] According to an embodiment, the first support member 261 may include a first portion 261a and a second portion 261b. The first portion 261a and the second portion 261b may be integrally connected. For example, the first portion 261a may be disposed vertically (e.g., in the -z-axis direction) relative to the first printed circuit board 271. For example, the second portion 261b may be disposed horizontally (e.g., in the x-axis direction) relative to the first printed circuit board 271. For example, the angle formed between the first portion 261a and the second portion 261b may be approximately 90°. For example, the angle between the first portion 261a and the second portion 261b may be substantially 90°.

[0125] According to an embodiment, the first support member 261 may include a recess 505 (e.g., a groove). The recess 505 may be formed in a first portion 261a of the first support member 261. For example, the recess 505 may include a gap or groove formed by cutting a portion of the first portion 261a. For example, the width of the groove 505 in the horizontal direction (e.g., the x-axis or -x-axis direction) may be in the range of about 0.1 mm to about 0.3 mm. One or more recesses 505 may be formed in the first portion 261a of the first support member 261. The recess 505 may be a slit (e.g., Figure 7 The first slit 710 or the second slit 720 can be used instead. For example, the first portion 261a of the first support member 261 may include the first slit (e.g., Figure 7 The first slit 710) and / or the second slit (e.g., Figure 7(Second slit 720). A portion of the first printed circuit board 271 (e.g., in the -x-axis direction) may be disposed at a position corresponding to the recess 505. A portion of the first printed circuit board 271 (e.g., in the -x-axis direction) may be disposed in the recess 505. For example, since a portion of the first printed circuit board 271 (e.g., in the -x-axis direction) may be disposed within the recess 505, the area of ​​the first printed circuit board 271 may be expanded. For example, the first printed circuit board 271 may include an extension region 271a extending toward a direction corresponding to the recess 505 (e.g., in the -x-axis direction). For example, the extension region 271a of the first printed circuit board 271 may be disposed within the recess 505. For example, the recess 505 may be formed to have a width greater than the height of the extension region 271a of the first printed circuit board 271. For example, the recess 505 may accommodate the extension region 271a of the first printed circuit board 271. For example, the extension region 271a of the first printed circuit board 271 may be disposed adjacent to the recess 505. For example, since the extension region 271a of the first printed circuit board 271 can be located at a position corresponding to the recess 505 formed in the first portion 261a of the first support member 261, the extension region 271a of the first printed circuit board 271 can extend from about 0.1 mm to about 0.3 mm.

[0126] According to an embodiment, the first portion 261a of the first support member 261 may partially include a stepped structure. The first portion 261a of the first support member 261 may partially include a stepped shape. The first portion 261a of the first support member 261 may have partially different thicknesses. For example, the first width W1 of the upper portion of the first portion 261a (e.g., in the -z-axis direction) may be different from the second width W2 of the lower portion (e.g., in the z-axis direction). For example, the first width W1 of the upper portion of the first portion 261a (e.g., in the -z-axis direction) may be in the range of about 0.3 mm to about 0.4 mm. For example, the second width W2 of the lower portion of the first portion 261a (e.g., in the z-axis direction) may be in the range of about 0.5 mm to about 0.6 mm. For example, the height h of the upper portion of the first portion 261a (e.g., in the -z-axis direction) may be in the range of about 1.0 mm to about 1.2 mm. For example, the upper portion of the first portion 261a (e.g., in the -z axis direction) may include the upper end of the recess 505 to the upper end of the first portion 261a (e.g., in the -z axis direction).

[0127] According to an embodiment, a first portion 261a of the first support member 261 may be disposed adjacent to the first through hole 510. The first portion 261a of the first support member 261 may be disposed adjacent to the first sealing member 530. For example, the first portion 261a of the first support member 261 may be disposed closer to the first through hole 261 or the first sealing member 530 than the second portion 261b.

[0128] Reference Figure 7 The first portion 261a of the first support member 261 may include at least one slit. For example, the first portion 261a may include a first slit 710 and / or a second slit 720. The first slit 710 and / or the second slit 720 may be formed in the first portion 261a of the first support member 261. The first slit 710 and / or the second slit 720 may be formed in a recess 505 provided in the first portion 261a of the first support member 261. The first slit 710 and / or the second slit 720 may be formed instead of... Figure 6 The recess 505 (e.g., groove) shown in the figure. The first slit 710 and / or the second slit 720 may be replaced. Figure 6 The recess 505 (e.g., groove) is shown in the diagram. A portion of the first circuit board 271 (e.g., in the -x-axis direction) (e.g., extension region 271a) can be provided at a position corresponding to the first slit 710 and / or the second slit 720. Since a portion of the first circuit board 271 (e.g., in the -x-axis direction) (e.g., extension region 271a) can be provided in the first slit 710 and / or the second slit 720, the area of ​​the first circuit board 271 can be expanded.

[0129] According to an embodiment, the extension region 271a of the first circuit board 271 may be disposed at a position corresponding to the first slit 710 and / or the second slit 720 of the first portion 261a. For example, the first slit 710 may be formed in the y-axis direction of the first portion 261a of the first support member 261. For example, the second slit 720 may be formed in the -y-axis direction of the first portion 261a of the first support member 261. For example, the width W11 of the first slit 710 in the y-axis direction may be in the range of about 7.5 mm to about 7.8 mm. For example, the width W12 of the second slit 720 in the -y-axis direction may be in the range of about 7.5 mm to about 7.8 mm. For example, the widths of the first slit 710 and the second slit 720 may be substantially the same or different. The first slit 710 and the second slit 720 may be spaced apart from each other. For example, a portion of the first portion 261a of the first support member 261 may be disposed between the first slit 710 and the second slit 720. For example, the width W3 of the portion of the first part 261a disposed between the first slit 710 and the second slit 720 can be in the range of about 1.3 mm to about 1.5 mm.

[0130] Reference Figure 8 A portion of the first circuit board 271 (e.g., in the -x-axis direction) may include at least a partially extended portion. For example, the first circuit board 271 may include a first extension 810 and / or a second extension 820. For example, the first extension 810 and / or the second extension 820 may be formed in the -x-axis direction of the first circuit board 271. The first extension 810 and / or the second extension 820 may be formed in relation to... Figure 7 The first extension portion 810 and / or the second extension portion 720 of the first circuit board 271 may be disposed in the first slit 710 and / or the second slit 720, respectively, as shown in the diagram. For example, the first extension portion 810 and / or the second extension portion 820 of the first circuit board 271 may be disposed within the first slit 710 and / or the second slit 720 formed in the first portion 261a of the first support member 261.

[0131] Figure 9a This is an illustrative representation of an embodiment according to the present disclosure. Figure 5 A view showing a partial structure of the first housing of the foldable electronic device. Figure 9b This is an illustrative representation of an embodiment according to the present disclosure. Figure 9a A view showing a partial structure of part C of the first housing. Figure 9c This is an illustrative representation of an embodiment according to the present disclosure. Figure 9aThe diagram shows a partial construction view of part D of the first housing, from which the first antenna module has been removed. Figure 9d This is an illustrative representation of an embodiment according to the present disclosure. Figure 9a An enlarged view of a portion D of the first housing shown in the figure. Figure 9e This is a schematic view of an elastic member according to an embodiment of the present disclosure.

[0132] Reference Figure 9a and Figure 9b The first housing 210 of the foldable electronic device 200 may include a first antenna module 911, a second antenna module 912, and / or a third antenna module 913 disposed on the rear surface (e.g., in the -z-axis direction) of the first circuit board 271 and / or the first support member 261. For example, the first antenna module 911 may include a UWB (ultra-wideband) antenna. For example, the second antenna module 912 may include at least one of a near-field communication (NFC) antenna, a magnetically secure transmission (MST) antenna, and a wireless charging antenna. For example, the third antenna module 913 may include a millimeter-wave antenna.

[0133] According to an embodiment, a first antenna module 911 (e.g., a UWB antenna) may be disposed on one side of the camera module 180 (e.g., in the -x-axis direction). For example, the camera module 180 may be disposed on the upper part of the first housing 210 (e.g., in the y-axis direction) in the x-axis direction. A second antenna module 912 (e.g., an NFC antenna) may be disposed below the camera module 180 and the first antenna module 911 (e.g., in the -y-axis direction). A third antenna module 913 (e.g., a millimeter-wave antenna) may be disposed on one side of the second antenna module 912 (e.g., in the -x-axis direction) and below the first antenna module 911 (e.g., in the -y-axis direction). For example, the first antenna module 911, the second antenna module 912, and the third antenna module 913 may be disposed on the first support member 261 and the first rear surface cover (e.g., Figure 4 Between the first rear surface cover 240).

[0134] Reference Figure 9c and Figure 9d The first circuit board 271 may include a first connector 910 (e.g., a UWB antenna connector), a second connector 920 (e.g., an NFC antenna connector), a third connector 930 (e.g., a millimeter-wave antenna connector), and / or a fourth connector 940 (e.g., a digitizer connector).

[0135] According to an embodiment, a first connector 910 (e.g., a UWB antenna connector) can be electrically connected to a first antenna module 911 (e.g., a UWB antenna). A second connector 920 (e.g., an NFC antenna connector) can be electrically connected to a second antenna module 912 (e.g., an NFC antenna). A third connector 930 (e.g., a millimeter-wave antenna connector) can be electrically connected to a third antenna module 913 (e.g., a millimeter-wave antenna). A fourth connector 940 (e.g., a digitizer connector) can be electrically connected to a display module (e.g., a...). Figure 1 The digital converter (not shown) of the display module 160.

[0136] According to an embodiment, the first connector 910 (e.g., a UWB antenna connector) can be electrically connected via signal path 905 to a processor disposed on the first circuit board 271 (e.g., Figure 1 The processor 120) and / or wireless communication module (e.g., Figure 1 The wireless communication module 192). Signal path 905 may include at least one microstrip line. Signal path 905 may include at least one radio frequency (RF) wiring. Signal path 905 may be disposed on a first surface of the first circuit board 271 (e.g., in the -z axis direction).

[0137] According to an embodiment, the first connector 910 can be electrically connected to the first antenna module 911 (e.g., a UWB antenna) via a flexible printed circuit board (FPCB) 915. The flexible printed circuit board 915 (e.g., the FPCB) may include FPCB leads that electrically connect the first connector 910 and the first antenna module 911 (e.g., the UWB antenna). For example, the flexible printed circuit board (FPCB) 915 may include a portion at the folding axis A (e.g., along the folding axis A of the foldable electronic device 200)... Figure 2a The structure extends in a direction parallel to the folding axis A (e.g., in the y-axis direction or the -y-axis direction). For example, the first antenna module 911 (e.g., a UWB antenna) and / or the flexible printed circuit board 915 may be configured to overlap the upper part of the first connector 910 and / or the signal path 905 (e.g., in the -z-axis direction).

[0138] According to an embodiment, a first elastic element 901 (e.g., a first rubber) and a second elastic element 902 (e.g., a second rubber) may be disposed around the first connector 910. The first elastic element 901 and the second elastic element 902 may be formed of an elastic material (e.g., rubber). For example, the first elastic element 901 and the second elastic element 902 may be mounted on the first circuit board 271 using a surface mount device (SMD).

[0139] According to an embodiment, a first elastic element 901 may be disposed on a first direction (e.g., the y-axis direction) of the first connector 910. The first elastic element 901 may be configured not to overlap with the signal path 910. For example, the first elastic element 901 may be disposed at a first position in a direction (e.g., the -x-axis direction) to avoid overlapping with the signal path 910. For example, the first elastic element 901 may be positioned offset in a direction (e.g., the -x-axis direction) to avoid overlapping with the signal path 910. For example, at least a portion of the first elastic element 901 may be disposed between the first connector 910 and the fourth connector 940. According to an embodiment, a second elastic element 902 may be disposed at a second position in a second direction (e.g., the -y-axis direction) of the first connector 910. No signal path 910 may be disposed in the second direction (e.g., the -y-axis direction) of the first connector 910. For example, the first elastic element 901 and the second elastic element 902 may be misaligned relative to each other with respect to the y-axis direction. For example, the second elastic element 902 may be disposed between the first connector 910 and the second connector 920.

[0140] According to an embodiment, the first elastic element 901 and the second elastic element 902 may be disposed in a first direction (e.g., on the upper side (in the y-axis direction)) and a second direction (e.g., on the lower side (in the y-axis direction)) of the first connector 910, such that vertical movement of the first connector 910 can be prevented even when an impact (e.g., a drop) occurs on the foldable electronic device 200. For example, when an impact (e.g., a drop) occurs on the foldable electronic device 200, the first elastic element 901 and the second elastic element 902 can absorb the impact caused by the vertical movement of the first connector 910 and can prevent the first connector 910 from detaching from the first circuit board 271.

[0141] According to various embodiments, although the arrangement of the first elastic element 901 and the second elastic element 902 in a first direction (e.g., on the upper side (y-axis direction)) and a second direction (e.g., on the lower side (-y-axis direction)) of the first connector 910 has been described, this arrangement is not limited to this and can be placed at other locations around the first connector 910, as long as vertical movement of the first connector 910 can be prevented. For example, additional elastic elements can be provided in the x-axis and -x-axis directions of the first connector 910 to prevent lateral movement of the first connector 910. For example, the first elastic element 901 and the second elastic element 902 can be integrally formed and can be provided on the upper, lower, left, and right sides of the first connector 910. In various embodiments, as long as vertical movement of the first connector 910 can be prevented, the elastic element can be provided on at least one of the upper, lower, left, or right sides of the first connector 910.

[0142] Reference Figure 9e According to embodiments, the first elastic element 901 or the second elastic element 902 may have a hexahedral shape. For example, the height (h) of the first surface 951 (e.g., the front surface) of the first elastic element 901 or the second elastic element 902 may be in the range of about 0.4 mm to about 0.6 mm. For example, the width (W) of the first surface 951 (e.g., the front surface) of the first elastic element 901 or the second elastic element 902 may be in the range of about 2.3 mm to about 2.5 mm. For example, the height and width of each surface of the first elastic element 901 or the second elastic element 902 may be formed to be substantially the same as the height (h) and width (W) of the first surface 951 (e.g., the front surface). In various embodiments, the first elastic element 901 or the second elastic element 902 is not limited to the hexahedral shape described above, as long as the first elastic element 901 or the second elastic element 902 can prevent the first connector 910 from moving, and may be configured in various other shapes.

[0143] According to embodiments of this disclosure, a foldable electronic device 200 may include: a hinge module 320; a first housing 210, at least partially connected to a first side of the hinge module 320 and including a first support member 261 and a first printed circuit board 271; a first through hole 510 formed in the first support member 261; a second housing 220, at least partially connected to a second side of the hinge module 320 and including a second support member 262 and a second printed circuit board 272; a second through hole 520 formed in the second support member 262; and a conductive connection member 263 configured to electrically connect the first printed circuit board 271 and the second printed circuit board 272 through the first through hole 510 and the second through hole 520. According to an embodiment, the first support member 261 may include a recess 505, and a portion of the first printed circuit board 271 may be configured to be disposed in the recess 505.

[0144] According to an embodiment, the first support member 261 may include a first portion 261a and a second portion 261b. The first portion 261a may be disposed vertically relative to the first printed circuit board 271, and the second portion 261b may be configured to be disposed horizontally relative to the first printed circuit board 271.

[0145] According to an embodiment, the recess 505 may be formed in the first portion 261a of the first support member 261.

[0146] According to an embodiment, the first portion 261a of the first support member 261 may be positioned closer to the first through hole 510 than the second portion 261b.

[0147] According to an embodiment, the first sealing member 530 may be disposed in the first through hole 510 through which the conductive connecting member 263 passes.

[0148] According to an embodiment, the second sealing member may be disposed in the second through hole 520 through which the conductive connecting member 263 passes.

[0149] According to an embodiment, the foldable electronic device 200 may include a shielding member 570 disposed between a first printed circuit board 271 and a first support member 261.

[0150] According to an embodiment, the first printed circuit board 271 may include a connector 550, and the connector 550 may be electrically connected to the first printed circuit board 271 using a connector 555.

[0151] According to an embodiment, the first portion 261a and the second portion 261b can be integrally formed, and the angle between the first portion 261a and the second portion 261b can be substantially 90°.

[0152] According to an embodiment, the first printed circuit board 271 may include an extension region 271a extending in a direction corresponding to the recess 505.

[0153] According to an embodiment, the recess 505 may include at least one slit 710 or 720.

[0154] According to an embodiment, at least one slit 710 or 720 may be formed in the first portion 261a of the first support member 261.

[0155] According to an embodiment, the recess 505 can be replaced by at least one slit 710 or 720.

[0156] According to an embodiment, the first printed circuit board 271 may include at least one extension 810 or 820 formed at a location corresponding to at least one slit 710 or 720.

[0157] According to an embodiment, at least one extension portion 810 or 820 may be disposed within at least one slit 710 or 720.

[0158] According to an embodiment, the first printed circuit board 271 may include at least one of a first connector 910, a second connector 920, a third connector 930, and a fourth connector 940.

[0159] According to an embodiment, the first connector 910 can be electrically connected to the processor 120 and / or the wireless communication module 192 disposed on the first printed circuit board 271 via the signal path 905.

[0160] According to an embodiment, the foldable electronic device 200 may further include a first antenna module 911 disposed on a first printed circuit board 271, and a first connector 910 may be electrically connected to the first antenna module 911 via a flexible circuit board 915.

[0161] According to an embodiment, the foldable electronic device 200 may include a first elastic member 901 disposed in a first direction of the first connector 910 and a second elastic member 902 disposed in a second direction of the first connector 910.

[0162] According to an embodiment, the first elastic member 901 may be configured not to overlap with the signal path 905.

[0163] In the foregoing description, various embodiments of the present disclosure have been described with reference to them. However, it is obvious that any changes and modifications made by those skilled in the art to which this disclosure pertains without departing from the technical spirit of the present disclosure fall within the scope of this disclosure.

Claims

1. A foldable electronic device (200), comprising: Hinge module (320); The first housing (210) is at least partially connected to the first side of the hinge module (320) and includes a first support member (261) and a first printed circuit board (271). A first through hole (510) is formed in the first support member (261); The second housing (220) is at least partially connected to the second side of the hinge module (320) and includes a second support member (262) and a second printed circuit board (272). A second through hole (520) is formed in the second support member (262); as well as The conductive connection member (263) is configured to electrically connect the first printed circuit board (271) and the second printed circuit board (272) through the first through hole (510) and the second through hole (520). The first support member (261) includes a recess (505), and a portion of the first printed circuit board (271) is configured to be disposed in the recess (505).

2. The foldable electronic device according to claim 1, wherein, The first support member (261) includes a first part (261a) and a second part (261b), and The first portion (261a) is disposed vertically relative to the first printed circuit board (271), and the second portion (261b) is configured to be disposed horizontally relative to the first printed circuit board (271).

3. The foldable electronic device according to claim 1 or 2, wherein, The recess (505) is formed in the first portion (261a) of the first support member (261).

4. The foldable electronic device according to claim 2 or 3, wherein, The first portion (261a) of the first support member (261) is configured to be closer to the first through hole (510) than the second portion (261b).

5. The electronic device according to any one of claims 1 to 4, wherein, The first sealing member (530) is disposed in the first through hole (510) through which the conductive connection member (263) passes.

6. The electronic device according to any one of claims 1 to 5, wherein, The second sealing member is disposed in the second through hole (520) through which the conductive connecting member (263) passes.

7. The electronic device according to any one of claims 1 to 6, further comprising: The shielding member (570) is disposed between the first printed circuit board (271) and the first support member (261).

8. The foldable electronic device according to any one of claims 1 to 7, wherein, The first printed circuit board (271) includes a connector (550), and The connector (550) is electrically connected to the first printed circuit board (271) using a plug (555).

9. The foldable electronic device according to any one of claims 2 to 4, wherein, The first part (261a) and the second part (261b) are integrally formed, and The angle between the first part (261a) and the second part (261b) is approximately 90°.

10. The foldable electronic device according to any one of claims 1 to 9, wherein, The first printed circuit board (271) includes an extension region (271a) extending in a direction corresponding to the recess (505).

11. The foldable electronic device according to claim 1, wherein, The recess (505) includes at least one slit (710, 720), and The at least one slit (710, 720) is formed in the first portion (261a) of the first support member (261).

12. The foldable electronic device according to claim 11, wherein, The first printed circuit board (271) includes at least one extension (810, 820) formed at a position corresponding to the at least one slit (710, 720), and The at least one extension portion (810, 820) is disposed within the at least one slit (710, 720).

13. The foldable electronic device according to any one of claims 1 to 12, wherein, The first printed circuit board (271) includes at least one of a first connector (910), a second connector (920), a third connector (930), and a fourth connector (940). The first connector (910) is electrically connected to the processor (120) and / or wireless communication module (192) disposed on the first printed circuit board (271) via a signal path (905).

14. The foldable electronic device of claim 13, further comprising: The first antenna module (911) is disposed on the first printed circuit board (271). The first connector (910) is electrically connected to the first antenna module (911) via a flexible circuit board (915).

15. The foldable electronic device according to claim 13 or 14, further comprising: The first elastic member (901) is disposed in the first direction of the first connector (910); as well as The second elastic member (902) is disposed in the second direction of the first connector (910).

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