Cleaning structure and cleaning method for wafer container base

Abstract

The invention relates to a wafer container base cleaning structure and method, the wafer container base cleaning structure comprises a to-be-cleaned base and a housing sleeving the to-be-cleaned base, the housing and the to-be-cleaned base are connected in a sealed manner, and the housing and the to-be-cleaned base are configured to be connected in a sealed manner. The sealing structure is arranged on the base to be cleaned, the cleaning face of the base to be cleaned is separated from the inner portion of the base to be cleaned so as to prevent cleaning liquid from entering the base to be cleaned, and during cleaning, the base to be cleaned is sleeved with the housing, so that the cleaning face of the base to be cleaned and the inner portion of the base to be cleaned are located on the two sides of the sealing structure correspondingly; and the cleaning surface of the to-be-cleaned base is directly washed on one side of the cleaning side. According to the cleaning structure and the cleaning method for the wafer container base, the cleaning surface and the interior are separated through the sealing connection housing, cleaning liquid is prevented from permeating, the base can be cleaned under the condition that the wafer container is not disassembled, meanwhile, the cleaning liquid is effectively prevented from entering the interior of the base, and therefore the maintenance cost is reduced, part abrasion is reduced, and the service life of the base is prolonged. And the cleaning effect and the wafer product quality are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a cleaning structure and cleaning method for a wafer container base. Background Technology

[0002] In the semiconductor manufacturing process, SMIF POD serves as the core container for wafer transport and storage, and its cleanliness directly affects the quality and yield of wafer products.

[0003] Current cleaning processes require operators to disassemble the entire POD (Potentially Targeted Device) into individual components such as the base and cover, clean each component separately, and then reassemble them. This process is not only time-consuming and labor-intensive, significantly increasing labor costs and downtime, but also increases the risk of component wear due to frequent disassembly and reassembly. More importantly, when PODs accumulate contaminants after use on the production line, if the disassembly step is omitted and the PODs are cleaned directly without being disassembled, the cleaning fluid can seep into the internal cavity through the densely distributed pores on the back of the base. Due to the complex internal structure of the base and the presence of hidden gaps, the seeped liquid cannot be completely removed by conventional spin-drying or hot air drying methods. The residual moisture can easily cause defects such as oxidation and particulate contamination during subsequent wafer storage or transportation, resulting in a decrease in wafer surface cleanliness and ultimately leading to performance degradation or even mass scrapping of semiconductor devices.

[0004] The potential for contamination caused by cleaning fluid intruding into the base has become a key bottleneck restricting the efficient maintenance of wafer containers. Existing technologies have not yet provided a reliable solution that can thoroughly clean the base surface without disassembly and effectively prevent internal liquid ingress. Summary of the Invention

[0005] Therefore, the purpose of this invention is to provide a cleaning structure and cleaning method for a wafer container base, which has the advantages of being able to clean the base without disassembling the wafer container, while effectively preventing cleaning fluid from entering the interior of the base, thereby reducing maintenance costs, reducing component wear, and improving cleaning effect and wafer product quality.

[0006] To solve the above-mentioned technical problems, the present invention provides a cleaning structure for a wafer container base, comprising: a base to be cleaned and a cover fitted on the base to be cleaned, wherein the cover and the base to be cleaned are sealed together and configured to separate the cleaning surface of the base to be cleaned from the interior of the base to prevent cleaning fluid from entering the interior of the base to be cleaned.

[0007] In one embodiment of the present invention, the inside of the cover is provided with a receiving hole that conforms to the shape of the base to be cleaned. The cleaning surface of the base to be cleaned is filled in the receiving hole, and the inner wall of the receiving hole is higher than the cleaning surface of the base to be cleaned. The cleaning surface of the base to be cleaned and the inner wall of the receiving hole form a structure that is concave in the middle and high around the edges. This is configured to form a flow-blocking structure between the cleaning liquid and the inside of the base to be cleaned through the inner wall of the receiving hole.

[0008] In one embodiment of the present invention, a flow guide is provided on the end face of the cover near the cleaning surface of the base to be cleaned. The flow guide is configured to form an outwardly expanding funnel-shaped structure with the receiving hole as the center, and the cleaning liquid for cleaning the cleaning surface of the base to be cleaned is guided to the interior away from the base to be cleaned through the flow guide.

[0009] In one embodiment of the present invention, a sealing ring is provided on the base to be cleaned, and a pressure foot is provided on the end face of the receiving hole on the side opposite to the base to be cleaned. The pressure foot is tightly fitted with the sealing ring to form a sealing structure that blocks the cleaning liquid on the cleaning surface of the base to be cleaned.

[0010] In one embodiment of the present invention, the cover has an extension for accommodating the base to be cleaned in the thickness direction of the base to be cleaned, the extension has an insertion hole, and the base to be cleaned has a door lock. The door lock and the insertion hole are configured such that, in the locked and unlocked states, the door lock latch is inserted into the insertion hole to lock the base to be cleaned onto the cover, and the door lock latch is pulled out of the insertion hole to unlock the base to be cleaned from the cover.

[0011] In one embodiment of the present invention, the door lock is a rotary lock structure. When the door lock is rotated clockwise, it is configured such that the latch of the door lock extends out of the base to be cleaned, inserts into the socket, and pulls the base to be cleaned to fit against the cover.

[0012] In one embodiment of the present invention, the cleaning surface of the base to be cleaned is a sealing surface that is separated from the interior of the base to be cleaned.

[0013] The present invention also provides a cleaning method for a wafer container base, for cleaning the base of the wafer container without disassembly, comprising the following steps:

[0014] Unlock and remove the base to be cleaned from the wafer container;

[0015] The cover is fitted onto the base to be cleaned, and a sealing structure is formed between the inner wall of the cover and the outer wall of the base to be cleaned. The two sides of the sealing structure are the cleaning side and the liquid-isolating side, respectively, so that the cleaning surface of the base to be cleaned and the interior of the base to be cleaned are located on the two sides of the sealing structure, with the cleaning surface of the base to be cleaned located on one side of the cleaning side and the interior of the base to be cleaned located on one side of the liquid-isolating side.

[0016] Rinse the cleaning surface of the base to be cleaned directly on the cleaning side.

[0017] In one embodiment of the present invention, when rinsing the cleaning surface of the base to be cleaned, the base to be cleaned and the cover are kept in a vertical state, and the upper end of the base to be cleaned is rinsed. The rinsing liquid flows from top to bottom under the action of gravity to clean the entire cleaning surface of the base to be cleaned, and finally the cleaning liquid is discharged from the lower end of the cover.

[0018] In one embodiment of the present invention, the cover is fitted onto the base to be cleaned, and the lock on the base to be cleaned is turned clockwise to lock the base to be cleaned onto the cover. After cleaning, the lock on the base to be cleaned is turned counterclockwise to unlock the base from the cover.

[0019] The cleaning structure and cleaning method of the wafer container base of the present invention, by sealing the cleaning surface and the interior with a cover, prevents the cleaning fluid from seeping in. It has the advantages of being able to clean the base without disassembling the wafer container, while effectively preventing the cleaning fluid from entering the interior of the base, thereby reducing maintenance costs, reducing component wear, and improving cleaning effect and wafer product quality. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the cleaning structure of the wafer container base of the present invention;

[0022] Figure 2 This is a cross-sectional view of the cleaning structure of the wafer container base of the present invention;

[0023] Figure 3 This is a schematic diagram of the structure of the casing of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of the base to be cleaned according to the present invention.

[0025] The following are the markings on the attached drawings: base to be cleaned 100, sealing ring 101, cover 200, receiving hole 201, flow guide 202, pressure foot 203, extension 204, and insertion hole 205. Detailed Implementation

[0026] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0027] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] It should be noted that the following description covers various aspects of embodiments within the scope of the appended claims. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0029] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0030] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0031] Traditional SMIF POD products typically require disassembling all components during cleaning, followed by reassembly and shipment. This disassembly-cleaning-reassembly process is not only cumbersome and time-consuming, but also poses a risk of water ingress into the POD base if the POD is cleaned directly after a period of customer use. Because the back of the POD base has many holes, water accumulation is difficult to remove by spin-drying or drying, posing a risk of wafer contamination. Therefore, current technology cannot achieve effective cleaning without disassembling the POD components, especially since the internal structure of the base is prone to water accumulation and drainage difficulties, which is a major cause of wafer contamination.

[0032] Therefore, the present invention provides a cleaning structure for a wafer container base, referring to... Figure 1-4 As shown, the device includes a substrate 100 to be cleaned and a housing 200 fitted onto the substrate 100. The housing 200 and the substrate 100 are sealed together, and the housing 200 is configured to separate the cleaning surface of the substrate 100 from its interior to prevent cleaning fluid from entering the interior of the substrate 100. The substrate 100 refers to the base portion of the wafer container that needs to be cleaned. This substrate typically has an external surface that needs cleaning and an internal structure that needs to be protected from cleaning fluid intrusion. The housing 200 is an external protective component designed to cooperate with the substrate 100. Its main function is to cover a specific area of ​​the substrate 100 during the cleaning process and form a seal with the substrate 100. The sealed connection refers to a connection state formed between the housing 200 and the substrate 100 that effectively prevents liquid or gas leakage from the connection interface, ensuring that the cleaning fluid is confined within a predetermined area. The cleaning surface refers to the external surface area of ​​the substrate 100 that needs to be cleaned. "Interior" refers to the internal space, cavity, or structure of the base 100 to be cleaned.

[0033] This application provides a cleaning structure for a wafer container base, aiming to solve the problem in the prior art where cleaning fluid easily enters the base during wafer container base cleaning, leading to water accumulation and wafer contamination. Specifically, the cleaning structure includes a base 100 to be cleaned and a housing 200 fitted onto the base 100. As one embodiment, the base 100 to be cleaned can be a standard wafer container base whose outer surface requires regular cleaning. The housing 200 can be a protective cover that matches the shape of the base 100, placed and fixed onto the base 100 by manual operation or automated equipment. Furthermore, a sealed connection is achieved between the housing 200 and the base 100. For example, this sealed connection can be achieved by applying a sealant to the contact surface between the housing 200 and the base 100 or by using a sealing gasket built into the base 100. When the housing 200 is installed, the sealant or sealing gasket is compressed, thereby forming a barrier that prevents liquid from passing through. Therefore, the cover 200 is configured to separate the cleaning surface of the base 100 to be cleaned from the interior of the base 100, preventing cleaning fluid from entering the interior of the base 100. Specifically, the cover 200 can be designed as a structure with sufficient depth and coverage so that, when fitted onto the base 100 and forming a sealed connection, it can completely cover the cleaning surface of the base 100 and physically isolate it from the interior space of the base. For example, the cover 200 can have an internal cavity whose shape and size correspond to the cleaning surface of the base 100. When the cover 200 is installed in place, the cleaning surface is contained within the cavity, while the edges of the cover 200 seal against the non-cleaning areas of the base 100, ensuring that the cleaning fluid only acts on the cleaning surface and does not seep into the interior of the base.

[0034] With the above structure, this application can effectively isolate the cleaning surface of the wafer container substrate from the interior of the substrate. During the cleaning process, the cleaning fluid is confined to the cleaning surface area and cannot enter the holes and cavities inside the substrate, thus avoiding the problems of internal water accumulation and subsequent drying difficulties. Therefore, efficient cleaning of the substrate cleaning surface is achieved without disassembling the wafer container substrate, while eliminating the risk of wafer contamination caused by internal water accumulation.

[0035] In the embodiments described above, a cover 200 is proposed to achieve a sealed connection to separate the cleaning surface from the interior. However, during its implementation, due to the lack of an effective physical flow-blocking mechanism, the cleaning fluid may seep into the interior of the base to be cleaned through gaps or flow paths, leading to the risk of internal water accumulation. To address this, this application further proposes that the interior of the cover 200 is provided with a receiving hole 201 that conforms to the shape of the base 100 to be cleaned. The cleaning surface of the base 100 is filled within the receiving hole 201, and the inner wall of the receiving hole 201 is higher than the cleaning surface of the base 100. The cleaning surface of the base 100 and the inner wall of the receiving hole 201 form a structure that is concave in the middle and high around the edges, configured to create a flow-blocking structure between the cleaning fluid and the interior of the base 100 through the inner wall of the receiving hole 201.

[0036] Specifically, the housing 200 has an internal receiving hole 201 that conforms to the shape of the base 100 to be cleaned. This receiving hole 201 is a space within the housing 200 designed to precisely accommodate the cleaning surface of the base 100. Its "conformal" design means that the shape and size of the receiving hole 201 are highly matched to the shape of the cleaning surface of the base 100, ensuring a tight fit and minimizing any potential gaps. The cleaning surface of the base 100 is filled within the receiving hole 201. This configuration ensures that the critical cleaning areas of the base 100 are completely covered and surrounded by the receiving hole 201, thus physically forming a barrier layer. During assembly, the base 100 can be directly inserted or placed into the receiving hole 201 of the housing 200 until the side of the base 100 is in close contact with the inner wall of the receiving hole 201. Furthermore, the inner wall of the receiving hole 201 is higher than the cleaning surface of the base 100. This design creates a physical height difference around the cleaning surface, causing the inner wall of the receiving hole 201 to form a "dam" or "baffle" higher than the cleaning surface. For example, when designing the cover 200, the depth of the receiving hole 201 can be greater than the thickness of the cleaning surface of the base 100 to be cleaned, thus forming a raised inner wall around the cleaning surface; alternatively, a raised structure can be provided around the edge of the receiving hole 201, the height of which exceeds the cleaning surface of the base 100 to be cleaned. Based on this, the cleaning surface of the base 100 to be cleaned and the inner wall of the receiving hole 201 form a structure that is concave in the middle and high around the edges. This structure means that the cleaning surface itself is on a relatively low plane, while it is surrounded by the raised inner wall of the receiving hole 201. For example, the cleaning surface of the base 100 to be cleaned can be designed to be flat or slightly concave, while the inner wall of the receiving hole 201 extends upward around it, forming a ring-shaped edge higher than the cleaning surface. With the above structure, the inner wall of the receiving hole 201 is configured to form a flow-blocking structure between the cleaning fluid and the interior of the base 100 to be cleaned.

[0037] Through the above technical solution, a more precise fit and effective physical flow-blocking mechanism are formed between the receiving hole 201 inside the housing 200 and the cleaning surface of the base 100 to be cleaned. The contoured design of the receiving hole 201 ensures a tight fit with the cleaning surface of the base 100 to be cleaned, minimizing potential leakage paths. The cleaning surface fills the receiving hole 201, further enhancing the isolation effect. Most importantly, the inner wall of the receiving hole 201 is higher than the cleaning surface of the base 100 to be cleaned, forming a structure that is concave in the middle and high around the edges, creating a physical "dam" or "baffle" around the cleaning surface. When the cleaning fluid acts on the cleaning surface, the raised inner wall can effectively prevent the cleaning fluid from overflowing or seeping into the interior area of ​​the base 100 to be cleaned. Even if splashing or liquid surface fluctuation occurs during the cleaning process, the cleaning fluid can be confined to the cleaning surface area and guided to be discharged along a predetermined path. This significantly enhances the barrier against the cleaning fluid entering the interior of the base 100 to be cleaned, effectively solving the problem in the prior art where the cleaning fluid may seep into the interior of the base to be cleaned through gaps or flow paths, causing water accumulation. This ensures the safety and thoroughness of cleaning the wafer container base under non-disassembly conditions.

[0038] In the embodiments described above, a flow-blocking structure is proposed to be formed on the inner wall of the receiving hole 201 to prevent the cleaning fluid from entering the interior of the base 100 to be cleaned. However, during its implementation, the cleaning fluid may not be effectively guided away from the interior of the base 100, posing a risk of water accumulation. To address this, this application further proposes that a flow guide 202 be provided on the end face of the cover 200 near the cleaning surface of the base 100. The flow guide 202 is configured to form an outwardly expanding funnel-shaped structure centered on the receiving hole 201, and the cleaning fluid used to clean the cleaning surface of the base 100 is guided away from the interior of the base 100. Specifically, the flow guide 202 is a structure provided on the cover 200, positioned on the end face near the cleaning surface of the base 100, i.e., the area through which the cleaning fluid may flow or accumulate. This arrangement ensures that the flow guide 202 can directly act on the flow path of the cleaning fluid, thereby effectively guiding the cleaning fluid. The flow guide shroud 202 can be integrally formed on the end face of the housing 200. The flow guide shroud 202 is configured to form an outwardly expanding funnel-shaped structure centered on the receiving hole 201. The funnel-shaped structure is a common fluid guiding structure, characterized by a narrow inlet and a wide outlet, which can effectively diffuse or guide the fluid. Here, the flow guide shroud 202 forms a shape that gradually expands outward from the receiving hole 201, aiming to guide the cleaning fluid flowing out of the receiving hole 201 area outward and prevent it from flowing into the interior of the base 100 to be cleaned. This funnel-shaped structure can be a smooth conical or arc-shaped diffusion surface, ensuring that the cleaning fluid can flow smoothly along its surface, and the flow guide shroud 202 can completely cover the base 100 to be cleaned, preventing liquid from splashing into the interior of the base 100 to be cleaned during the cleaning process.

[0039] The flow guide hood 202 directs the cleaning fluid from the cleaning surface of the base 100 to a direction away from the interior of the base 100. Through its specific position and funnel-shaped structure, the flow guide hood 202 actively changes the flow direction of the cleaning fluid, directing it from the cleaning surface area of ​​the base 100 to a direction away from the interior of the base 100. This effectively prevents the cleaning fluid from seeping into or remaining in the internal structure of the base 100 during the cleaning process. The funnel opening of the flow guide hood 202 can be designed at a certain angle to guide the cleaning fluid to the outside of the housing 200 or a pre-set drainage channel using gravity or hydrodynamic pressure. Simultaneously, the edge of the flow guide hood 202 can connect to the drain port or drain trough of the housing 200, forming a complete cleaning fluid discharge path to ensure effective collection and discharge of the cleaning fluid.

[0040] Through the above technical solution, when cleaning the cleaning surface of the substrate 100, the cleaning fluid flows through the area of ​​the receiving hole 201. Since the end face of the housing 200 near the cleaning surface is provided with a guide shield 202 forming an outwardly expanding funnel shape centered on the receiving hole 201, this guide shield 202 can effectively capture and guide the cleaning fluid. The funnel-shaped structure utilizes its diffusion characteristics to diffuse the cleaning fluid outward from the area of ​​the receiving hole 201 and guide it away from the interior of the substrate 100. This allows the guide shield 202 to actively guide the cleaning fluid away from critical areas, preventing the cleaning fluid from remaining inside or near the substrate 100 during the cleaning process. This effectively solves the problem of the cleaning fluid not being effectively guided away from the interior of the substrate, thus preventing the risk of water accumulation. This ensures the thoroughness of the cleaning process, prevents wafer contamination caused by cleaning fluid residue, and improves the reliability and efficiency of the cleaning structure.

[0041] In the above-described embodiments of this application, a flow-blocking structure is proposed to prevent cleaning fluid from entering the interior of the base 100 to be cleaned. However, during its implementation, the flow-blocking structure may not be able to completely seal, leading to the risk of cleaning fluid seeping into the interior. To address this, this application further proposes that the base 100 to be cleaned be provided with a sealing ring 101, and a pressure foot 203 is provided on the end face of the receiving hole 201 opposite to the base 100 to be cleaned. The pressure foot 203 is tightly fitted with the sealing ring 101 to form a sealing structure that blocks the cleaning fluid from the cleaning surface of the base 100 to be cleaned.

[0042] The sealing ring 101 is an elastic element whose main function is to provide a compressible barrier between two contact surfaces to prevent fluid or gas leakage. The sealing ring 101 can be made of various elastic materials, such as silicone rubber, fluororubber, and nitrile rubber, to adapt to different cleaning fluid environments and temperature requirements. Its cross-sectional shape can be circular, rectangular, X-shaped, or lip-shaped to optimize its sealing performance and installation method. The sealing ring 101 can be pre-installed in a specific groove in the base 100 to be cleaned, or fixed to the surface of the base 100 to be cleaned by means of bonding. The pressure foot 203 is a structure on the housing 200 used to form a tight contact with the sealing ring 101. The pressure foot 203 can be designed as part of the housing 200 body, for example, formed by injection molding or machining into a flange or annular structure that contacts the sealing ring 101. Its contact surface can be designed as a flat surface, an arc surface, or a shaped surface that matches the shape of the sealing ring 101 to ensure uniform pressure distribution and effective sealing. The pressure foot 203 and the sealing ring 101 are tightly fitted together to form a sealing structure that blocks the cleaning fluid from the cleaning surface of the base 100 to be cleaned. This tight fit means that sufficient contact pressure is generated between the pressure foot 203 and the sealing ring 101 through mechanical force, thereby eliminating the tiny gaps between them and forming a continuous and impermeable barrier. When the cover 200 is fitted onto the base 100 to be cleaned, a preload can be applied through the relative movement between the cover 200 and the base 100 or through a locking mechanism, causing the pressure foot 203 to compress and deform the sealing ring 101. This compression deformation allows the sealing ring 101 to fill the irregular microstructures between the contact surfaces, thereby forming an effective seal. In addition, the design of the sealing structure can also consider setting a guide structure in the contact area between the pressure foot 203 and the sealing ring 101 to ensure accurate alignment during assembly, further improving the reliability of the seal.

[0043] Through the above technical solution, when the housing 200 is fitted onto the base 100 to be cleaned, the sealing ring 101 on the base 100 and the pressure foot 203 on the opposite side of the receiving hole 201 on the housing 200 can fit tightly together. This tight fit forms an additional, reliable sealing barrier, effectively solving the problem of incomplete sealing that may exist when relying solely on the flow-blocking structure. The sealing ring 101 provides an elastic and compressible sealing interface, while the pressure foot 203 applies continuous pressure, eliminating tiny gaps between them. This ensures that the cleaning fluid is completely blocked on the cleaning surface side of the base 100 to be cleaned, preventing the cleaning fluid from seeping into the interior of the base 100. This greatly improves the safety of the cleaning process, effectively protects the internal structure of the base 100 from cleaning fluid contamination, thereby avoiding the risk of wafer contamination and simplifying the drying process after cleaning.

[0044] In the embodiments described above in this application, a sealed connection between the housing 200 and the base 100 to be cleaned is proposed to separate the cleaning surface from the interior. However, during its implementation, without a reliable locking device, the housing may loosen or shift, leading to seal failure and allowing cleaning fluid to seep into the interior of the base 100, increasing the risk of wafer contamination. To address this, this application further proposes that the housing 200 has an extension 204 in the thickness direction of the base 100 to accommodate it. The extension 204 has an insertion hole 205, and the base 100 is equipped with a lock. In the locked and unlocked states, the lock and insertion hole 205 are configured such that the lock's latch is inserted into the insertion hole 205 to lock the base 100 to the housing 200, and the lock's latch is pulled out of the insertion hole 205 to unlock the base 100 from the housing 200.

[0045] The housing 200 has an extension 204 on its thickness direction to accommodate the base 100. This extension 204 is a structural part of the housing 200, extending along the thickness direction of the base 100 to form an area that can cover, support, or guide the base 100 into the correct position. Its function is to provide physical support and precise positioning for the base 100, ensuring accurate alignment during installation and providing a stable structural foundation for the subsequent locking mechanism. Furthermore, the extension 204 has a socket 205. The socket 205 is a pre-set hole or groove on the extension 204, its main function being to serve as a receiving interface for the door latch, an indispensable component for achieving the locking function. For example, the socket 205 can be a circular or square through-hole for receiving a cylindrical or plate-shaped latch; or it can be a groove with a specific shape, precisely matching the shape of the latch to provide a more secure and anti-rotation locking effect. Meanwhile, a lock is provided on the base 100 to be cleaned. The lock is a mechanical device installed on the base 100, and its core component is a retractable or rotatable latch. The function of the lock is to cooperate with the socket 205, and through the extension or retraction of the latch, to achieve a secure locking and convenient unlocking between the base 100 to be cleaned and the cover 200. For example, the lock can be a rotary lock, and the latch can be extended, retracted, or rotated to engage by rotating the handle. The configuration of the lock and the socket 205 in the locked and unlocked states is as follows: in the locked state, the latch of the lock is inserted into the socket 205, thereby securely locking the base 100 to be cleaned onto the cover 200; while in the unlocked state, the latch of the lock is pulled out from the socket 205, thereby unlocking the base 100 to be cleaned from the cover 200. This configuration clearly defines the working principle of the locking mechanism: the mechanical movement of the latch and the precise engagement of the socket allow for the fixing and separation of the base 100 to be cleaned from the housing 200. For example, when locking, the operator manually or automatically drives the lock, causing the latch to extend and precisely insert into the socket 205 on the extension 204 of the housing 200, thereby firmly fixing the base 100 to be cleaned onto the housing 200, preventing loosening or displacement during cleaning and ensuring the integrity of the sealing structure. When unlocking, the operator reverses the operation of the lock, causing the latch to be pulled out or retracted from the socket 205, releasing the lock and allowing the base 100 to be cleaned to be removed from the housing 200 for post-cleaning processing or replacement.

[0046] Through the above technical solution, the extension 204 on the housing 200 provides precise positioning and support for the base 100 to be cleaned, ensuring that the base 100 can be accurately and stably installed into the housing 200. The cooperation between the door lock and the socket 205 forms a reliable mechanical locking mechanism. During the cleaning process, the door lock latch is inserted into the socket 205, firmly fixing the base 100 to be cleaned onto the housing 200, effectively preventing the housing 200 from loosening or shifting due to cleaning fluid impact or operational vibration. This stable locking ensures that the sealing connection between the housing 200 and the base 100 to be cleaned remains effective at all times, thereby completely preventing the risk of cleaning fluid seeping into the interior of the base 100 to be cleaned and avoiding wafer contamination. At the same time, after cleaning, the latch can be pulled out of the socket 205 with a simple operation to quickly release the lock, facilitating the removal and placement of the base 100 to be cleaned and improving the convenience and efficiency of the cleaning operation.

[0047] This application further proposes a rotary lock structure. When the lock is rotated clockwise, the latch extends from the base 100 to be cleaned, inserts into the socket 205, and pulls the base 100 to be cleaned into the housing 200. The rotary lock structure refers to a mechanical device that performs locking and unlocking functions through rotation. This structure is designed to provide an intuitive and labor-saving operation method to achieve quick fixation between the base 100 and the housing 200. Specifically, the rotary lock structure can take various forms; for example, it can be a cam lock structure where a rotating cam drives the extension and retraction of the latch. Furthermore, this technical solution describes the specific actions and effects of the rotary lock structure during the locking process. When the lock 102 rotates clockwise, its internal latch is driven to extend and precisely insert into the pre-set socket 205 on the housing 200. After the latch is inserted into the socket 205, through its specific structural design or its cooperation with the socket 205, it can generate a tightening force, so that the base 100 to be cleaned and the cover 200 are tightly fitted together. The implementation of this tightening mechanism may include, but is not limited to: the latch may be designed with a structure with a bevel or a taper, and when it is inserted into the socket 205 and rotated further, the bevel action generates a force that pulls the base 100 to be cleaned closer to the cover 200.

[0048] The above technical solution employs a rotary lock structure as the door lock 102. When rotated clockwise, the latch not only extends out of the insertion hole 205 but also simultaneously tightens the base 100 to be cleaned, ensuring a tight fit against the housing 200. This design significantly optimizes the locking mechanism, making the operation more convenient and intuitive, avoiding the cumbersome and uncertainties inherent in traditional locking methods. More importantly, the tightening effect of the latch after insertion into the insertion hole 205 effectively enhances the seal between the base 100 to be cleaned and the housing 200, ensuring that cleaning fluid does not seep into the interior of the base 100 during cleaning, thus completely eliminating the risk of cleaning fluid leakage due to poor sealing. This not only improves the reliability and safety of cleaning but also avoids potential wafer contamination issues, making the cleaning process of wafer container bases more efficient and worry-free.

[0049] Furthermore, the cleaning surface of the base 100 to be cleaned is specified as a sealing surface separated from the interior of the base 100. The cleaning surface of the base 100 is designed as a sealing surface, its main function being to ensure that the cleaning fluid does not penetrate into the interior of the base 100 during the cleaning process. This sealing surface can be achieved in various ways. For example, the cleaning surface can be made of a dense, non-permeable material, such as a polymer or a metal surface with a special coating, to physically block the penetration of the cleaning fluid. In addition, the sealing surface can also form an effective seal through its geometry and fitting precision. For example, the contact area between the cleaning surface and the housing 200 can be designed with a structure of micro-protrusions or grooves, which, when the two are tightly fitted, can form multiple barriers, further enhancing the sealing effect.

[0050] By defining the cleaning surface of the substrate 100 to be cleaned as a sealing surface that separates it from the interior of the substrate 100, this application fundamentally improves the sealing reliability of the cleaning structure when separating the cleaning area from the interior area. This design ensures that the cleaning surface itself has the inherent property of preventing cleaning fluid penetration, thereby effectively compensating for the potential sealing imperfections in the cleaning surface of existing solutions. Combined with the existing sealed connection between the housing 200 and the substrate 100 to be cleaned, and further, through the tight fit structure formed by the sealing ring 101 on the substrate 100 and the pressure foot 203 on the housing 200, the sealing surface can more reliably block the cleaning fluid, completely confining it to the cleaning side and thoroughly preventing the cleaning fluid from leaking into the interior of the substrate 100 to be cleaned. This eliminates the risk of wafer contamination caused by internal water accumulation and significantly improves the thoroughness and safety of wafer container substrate cleaning.

[0051] Existing SMIF POD products face significant technical challenges during cleaning. Currently, customers typically need to disassemble the POD components before cleaning and then reassemble them for shipment. This disassembly-cleaning-reassembly process is not only cumbersome and time-consuming, but also risks water ingress into the POD base if the POD is cleaned without disassembly after a period of use. Because the back of the POD base has many holes, water accumulation is difficult to remove by spin-drying or drying, posing a risk of wafer contamination. Therefore, existing technology cannot achieve effective cleaning without disassembling the POD components, especially since the internal structure of the base is prone to water accumulation and drainage difficulties, which is a major cause of wafer contamination.

[0052] In response, this application proposes a cleaning method for a wafer container base, which cleans the wafer container base 100 to be cleaned without disassembly. By combining the cover 200 and the base 100 to be cleaned in a way that forms a sealed structure, the cleaning surface is physically isolated from the interior of the base during the cleaning process, effectively preventing the cleaning fluid from entering the interior and causing contamination.

[0053] The cleaning method includes the following steps:

[0054] Unlock and remove the base 100 to be cleaned from the wafer container;

[0055] The cover 200 is fitted onto the base 100 to be cleaned, and a sealing structure is formed between the inner wall of the cover 200 and the outer wall of the base 100 to be cleaned. The two sides of the sealing structure are the cleaning side and the liquid-isolating side, respectively, so that the cleaning surface of the base 100 to be cleaned and the interior of the base 100 to be cleaned are located on the two sides of the sealing structure, with the cleaning surface of the base 100 to be cleaned located on one side of the cleaning side and the interior of the base 100 to be cleaned located on one side of the liquid-isolating side.

[0056] Rinse the cleaning surface of the base 100 to be cleaned directly on one side of the cleaning side to ensure that the cleaning solution only acts on the cleaning surface area and does not penetrate into the interior of the base 100 to be cleaned.

[0057] Through the above technical solution, the sealed structure formed by the housing 200 and the substrate 100 to be cleaned effectively creates a physical barrier, confining the cleaning fluid to the cleaning side area. Since the cleaning fluid cannot penetrate into the liquid-separating side through the sealed interface, the internal space of the substrate 100 to be cleaned is protected, avoiding water accumulation problems caused by the porous structure. Furthermore, this method eliminates the need to disassemble the internal components of the substrate, significantly shortening the cleaning cycle while ensuring the substrate remains dry after cleaning. Thus, efficient cleaning of the cleaning surface is achieved without disassembling the wafer container substrate, completely eliminating the risk of wafer contamination caused by internal water accumulation, and improving the safety and reliability of the cleaning operation.

[0058] In the above-described embodiments of this application, a method for cleaning a wafer container base without disassembly was proposed. However, when directly rinsing the cleaning surface, the cleaning fluid may not evenly cover the entire surface or be effectively drained, resulting in incomplete cleaning or residual liquid retention, increasing the risk of internal water accumulation. To address this, this application further proposes that when rinsing the cleaning surface of the base 100 to be cleaned, the base 100 and the housing 200 be kept vertical, and the upper end of the base 100 be rinsed. The rinsing fluid flows from top to bottom under gravity to clean the entire cleaning surface of the base 100, and finally, the cleaning fluid is discharged from the lower end of the housing 200.

[0059] To ensure the cleaning fluid fully utilizes gravity for effective top-to-bottom flow and avoids stagnation on the cleaning surface, this application maintains the base 100 and housing 200 in a vertical position during the cleaning process. Furthermore, to ensure the cleaning process begins at the highest point of the base 100, creating favorable conditions for the cleaning fluid to cover the entire cleaning surface under gravity, this application rinses the upper part of the base 100. Therefore, this application utilizes natural gravity to guide the cleaning fluid to form a continuous and uniform flow on the cleaning surface, thereby achieving comprehensive coverage and effective cleaning of the entire surface. Specifically, by precisely controlling the flow rate and spray pressure of the cleaning fluid, the cleaning fluid, upon contact with the upper part of the base 100, can spread smoothly downwards along the cleaning surface under gravity in the form of a stable water film or liquid flow. Meanwhile, to ensure that the waste liquid after cleaning can be completely and promptly discharged, and to prevent the cleaning liquid from remaining or accumulating inside the housing 200 or at the bottom of the cleaning surface of the base 100 to be cleaned, this application discharges the final cleaning liquid from the lower end of the housing 200. The bottom of the housing 200 can be designed as an outwardly inclined conical or sloping structure, so that the cleaning liquid can naturally collect at the lowest point and be discharged from there, thereby minimizing liquid residue.

[0060] The above technical solution effectively solves the problems of uneven cleaning solution distribution and incomplete drainage when cleaning the wafer container's cleaning base 100. By keeping the cleaning base 100 and the housing 200 vertical and rinsing from the top of the cleaning base 100, the cleaning solution flows evenly from top to bottom under gravity, fully covering the entire cleaning surface of the cleaning base 100 and ensuring thorough cleaning. Simultaneously, the cleaning solution ultimately drains from the bottom of the housing 200, avoiding retention and accumulation of the cleaning solution in the cleaning area. This effectively prevents the risk of cleaning solution entering the interior of the cleaning base 100 and eliminates the potential wafer contamination hazard caused by residual liquid after cleaning. This cleaning method not only improves cleaning efficiency but also significantly enhances cleaning quality and reliability.

[0061] In the above-described embodiments of this application, a method is proposed for cleaning while keeping the base 100 and the cover 200 in a vertical position. However, in this process, a simple and reliable locking and unlocking mechanism is needed to ensure a firm connection between the base 100 and the cover 200 during the cleaning process and to facilitate disassembly after cleaning, so as to avoid the risk of leakage of cleaning fluid due to seal failure or inconvenience of operation. To this end, this application further proposes to fit the cover 200 onto the base 100, turn the lock on the base 100 clockwise to lock the base 100 onto the cover 200, and after cleaning, turn the lock on the base 100 counterclockwise to unlock the base 100 from the cover 200.

[0062] Specifically, before the cleaning operation begins, the cover 200 is first fitted onto the base 100 to be cleaned. This step aims to achieve a preliminary physical connection between the cover 200 and the base 100, aligning them and forming a lockable unit. This operation lays the foundation for the subsequent locking steps, ensuring that the cleaning surface of the base 100 can be effectively covered by the cover 200 and creating conditions for forming a sealed structure. Subsequently, a reversible and secure connection between the base 100 and the cover 200 is achieved by operating the lock on the base 100. When cleaning is required, the lock 102 is turned clockwise. This operation activates the locking function of the lock 102. Through the internal mechanical linkage of the lock 102, the locking component (e.g., the latch) extends and engages with the mating structure (e.g., the socket 205) on the cover 200, thereby tightly fixing the base 100 and the cover 200 together. The purpose of the locking operation is to ensure a stable and reliable connection between the base 100 to be cleaned and the housing 200 during the cleaning process, preventing relative displacement or separation under the impact of the cleaning fluid or gravity. This tight fit also helps maintain the sealing structure between the housing 200 and the base 100, effectively preventing the cleaning fluid from entering the interior of the base 100. After cleaning, to remove the base 100 from the housing 200, turn the door lock 102 counterclockwise. This operation releases the locking function of the door lock 102. By rotating the door lock 102 in the opposite direction, the locking component (e.g., the latch) disengages or retracts from the mating structure of the housing 200, thereby releasing the fixed state between the base 100 and the housing 200. The purpose of the unlocking operation is to allow for convenient and quick separation of the base 100 from the housing 200 after the cleaning process is completed, facilitating subsequent drying, inspection, or reassembly operations, thus improving the overall efficiency and convenience of the cleaning operation.

[0063] Through the above technical solution, after the cover 200 is fitted onto the base 100 to be cleaned, the rotation of the lock 102 enables quick and reliable locking and unlocking between the base 100 and the cover 200. Specifically, rotating the lock 102 clockwise securely locks the base 100 to the cover 200, ensuring a stable connection and effective seal during cleaning, especially when the base 100 and the cover 200 are rinsed in a vertical position. This locking mechanism effectively prevents loosening of components or seal failure caused by the impact of cleaning fluid or gravity, thus preventing cleaning fluid from entering the interior of the base 100 and solving the problems of cleaning fluid leakage and internal water accumulation. After cleaning, rotating the lock 102 counterclockwise quickly unlocks the cover, allowing the base 100 to be easily removed from the cover 200, greatly simplifying the disassembly process after cleaning and improving operational efficiency. Therefore, this solution provides a simple and reliable locking and unlocking method, which effectively ensures the stability of the cleaning process and the reliability of the cleaning effect, while improving the convenience of the overall cleaning operation.

[0064] Compared to the cumbersome process of disassembling the wafer container base in existing technologies, this cleaning structure and method enables cleaning of the wafer container base without disassembly. Through the sealed connection between the housing 200 and the base 100 to be cleaned, and the locking mechanism of the door lock 102 on the base 100, the cleaning fluid is effectively blocked in the cleaning surface area, preventing it from entering the interior of the base 100 and thus eliminating the risk of internal water accumulation and wafer contamination. This method simplifies the cleaning operation, shortens the cleaning cycle, and ensures cleaning quality.

[0065] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A cleaning structure for a wafer container base, characterized in that, The application relates to a cleaning device for a wafer carrier, which comprises: a to-be-cleaned base and a cover sleeved on the to-be-cleaned base, the cover being in sealed connection with the to-be-cleaned base and being configured to separate the cleaning surface of the to-be-cleaned base from the interior of the to-be-cleaned base to prevent cleaning liquid from entering the interior of the to-be-cleaned base.

2. The cleaning structure of a wafer container base according to claim 1, characterized by: The interior of the cover is provided with a receiving hole which is shaped according to the to-be-cleaned base, the cleaning surface of the to-be-cleaned base is filled in the receiving hole, and the inner wall of the receiving hole is higher than the cleaning surface of the to-be-cleaned base; the cleaning surface of the to-be-cleaned base and the inner wall of the receiving hole form an intermediate concave structure, which is configured to form a flow-blocking structure between the cleaning liquid and the interior of the to-be-cleaned base by the inner wall of the receiving hole.

3. The cleaning structure of the wafer container base according to claim 2, characterized by: The cover is provided with a flow guide cover on the end face close to the cleaning surface of the to-be-cleaned base, the flow guide cover is configured to form an outwardly expanding horn-shaped structure with the receiving hole as the center, and the flow guide cover is configured to guide the cleaning liquid for cleaning the cleaning surface of the to-be-cleaned base to be far away from the interior of the to-be-cleaned base.

4. The cleaning structure of the wafer container base according to claim 2, characterized by: The to-be-cleaned base is provided with a sealing ring, the receiving hole is provided with a pressing foot on the end face opposite to the to-be-cleaned base, and the pressing foot is tightly attached to the sealing ring to form a sealing structure for blocking the cleaning liquid on the cleaning surface of the to-be-cleaned base.

5. The cleaning structure of a wafer container base according to Claim 1, wherein: The cover is provided with an extension part in the thickness direction of the to-be-cleaned base, the extension part is provided with a receiving hole, the to-be-cleaned base is provided with a door lock, and the door lock and the receiving hole are in locked and unlocked states, which are configured that the door lock is inserted into the receiving hole to lock the to-be-cleaned base on the cover, and the door lock is pulled out of the receiving hole to unlock the to-be-cleaned base from the cover.

6. The cleaning structure of the wafer container base according to claim 5, wherein: The door lock is a rotary lock structure, and when the door lock is rotated clockwise, the door lock is configured to insert the to-be-cleaned base into the receiving hole and tightly attach the to-be-cleaned base to the cover.

7. The cleaning structure of a wafer container base according to any one of claims 1 to 6, characterized by: The cleaning surface of the to-be-cleaned base is a sealed surface which is separated from the interior of the to-be-cleaned base.

8. A cleaning method of a wafer container base for cleaning a base of a wafer container to be cleaned in a disassembled condition, characterized by comprising: a step of cleaning the base of the wafer container to be cleaned in the disassembled condition. The application further relates to a method for cleaning a wafer carrier, which comprises the following steps: unlocking and taking off the to-be-cleaned base from a wafer carrier; sleeving a cover on the to-be-cleaned base and keeping a sealed structure between the inner wall of the cover and the outer wall of the to-be-cleaned base, the two sides of the sealed structure being a cleaning side and a liquid-separating side respectively, so that the cleaning surface of the to-be-cleaned base and the interior of the to-be-cleaned base are located on the two sides of the sealed structure respectively, the cleaning surface of the to-be-cleaned base is located on one side of the cleaning side, and the interior of the to-be-cleaned base is located on one side of the liquid-separating side; directly flushing the cleaning surface of the to-be-cleaned base on one side of the cleaning side.

9. The wafer container base cleaning method of claim 8, wherein: When the cleaning surface of the to-be-cleaned base is flushed, the to-be-cleaned base and the cover are kept in a vertical state, the upper end of the to-be-cleaned base is flushed, and the flushing liquid flows from top to bottom under the action of gravity to clean the whole cleaning surface of the to-be-cleaned base, and finally the flushing liquid is discharged from the lower end of the cover.

10. The wafer container base cleaning method of claim 9, wherein: sleeving the cover on the to-be-cleaned base, rotating the door lock on the to-be-cleaned base clockwise to lock the to-be-cleaned base on the cover, after cleaning, rotating the door lock on the to-be-cleaned base counterclockwise to unlock the to-be-cleaned base from the cover.

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