Grinding pad dressing device, dresser and surface coating treatment method of grinding pad dressing device

Abstract

The invention provides a grinding pad trimming device, a trimmer and a surface coating treatment method of the grinding pad trimming device, and belongs to the technical field of chemical mechanical polishing. The treatment method comprises the steps that a base body of the trimmer is provided, the base body is provided with a consolidation layer, and the consolidation layer is pretreated; hard particles are consolidated on the consolidation layer, and coating materials coated on the surfaces of the hard particles and the consolidation layer are prepared; applying a treatment coating on the surfaces of the hard particles and the consolidation layer; carrying out curing treatment on the trimmer applied with the coating; and carrying out post-treatment on the coating. Therefore, the treatment method for the surface coating of the trimmer, provided by the embodiment of the invention, can be used for treating the surface coating of the trimmer, so that the adaptability of a coating process is improved, the coating can realize complete isolation of metal ions of a consolidation layer, and pollution of the metal ions to a wafer is avoided.

Description

Technical Field

[0001] This application relates to the field of chemical mechanical polishing technology, and in particular to an abrasive pad dressing device, a dressing tool, and a method for treating the surface coating of the abrasive pad. Background Technology

[0002] In the integrated circuit manufacturing process, chemical mechanical polishing (CMP) is a key process to achieve global planarization of wafers. As the core component of CMP equipment, the dresser's main function is to remove the aged layer on the surface of the polishing pad, restore the surface roughness and cutting ability of the polishing pad, and ensure the uniformity and consistency of wafer polishing.

[0003] Currently, the polishing surface of dressers typically uses a nickel-based alloy bonding layer. However, if this nickel-based alloy directly contacts the polishing pad or slurry, it is prone to corrosion or wear, generating metal debris or releasing metal ions, leading to wafer contamination. Furthermore, during the dressing process, hard particles must maintain a uniform protrusion height; otherwise, uneven dressing of the polishing pad surface will occur, affecting the wafer polishing quality. Therefore, a coating treatment is necessary on the dresser surface to isolate the nickel-based alloy bonding layer from wafer contamination while controlling the protrusion height of hard particles.

[0004] However, in current CMP equipment, coating processes typically employ either a single spraying or dip coating method. Spraying alone can easily lead to coating buildup around the particles, while dip coating makes it difficult to control coating thickness. Both methods result in significant deviations in the protruding height of hard particles. Furthermore, coating materials are prone to aging in the chemical environment of CMP, leading to coating cracking or peeling, thus affecting the lifespan of the dressing equipment. Summary of the Invention

[0005] This application provides a grinding pad dressing device, a dresser, and a method for processing the surface coating of the dresser. The method for processing the surface coating of the dresser can be used to process the coating on the surface of the dresser, improving the adaptability of the coating process, enabling the coating to completely isolate the metal ions of the consolidation layer, and avoiding metal ion contamination of the wafer.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] The first aspect of this application provides a method for treating the coating on the surface of a dresser, the method comprising:

[0008] Provide a base for the trimmer, the base having a consolidation layer, and pre-treat the consolidation layer;

[0009] Hard particles are consolidated on the consolidation layer. The coating material to be applied to the surface of the hard particles and the consolidation layer is prepared.

[0010] Apply a treatment coating to the surface of hard particles and consolidated layers;

[0011] The coated trimmer is then cured.

[0012] The coating undergoes post-treatment.

[0013] The method for processing a surface coating of a dresser provided in the first aspect of this application includes: providing a substrate for a dresser, the substrate having a consolidation layer, pre-treating the consolidation layer; consolidating hard particles on the consolidation layer, preparing a coating material to be applied to the surfaces of the hard particles and the consolidation layer; applying a treatment coating to the surfaces of the hard particles and the consolidation layer; curing the dresser with the coating applied; and post-treating the coating. Thus, the method for processing a surface coating of a dresser provided in this application can be used to process coatings on the surface of a dresser, improving the adaptability of the coating process, enabling the coating to completely isolate metal ions from the consolidation layer, and avoiding metal ion contamination of the wafer.

[0014] Based on the above technical solution, the following improvements can be made to this application.

[0015] In one possible implementation, the consolidation layer is pretreated, including:

[0016] The consolidation layer is cleaned using ethanol or isopropanol.

[0017] Alternatively, the consolidation layer can be cleaned using plasma cleaning.

[0018] In one possible implementation, the preparation of a coating material to be applied to the surfaces of the hard particles and the consolidated layer includes:

[0019] The coating material is a polyimide solution;

[0020] Alternatively, the coating material can be a UV-curable adhesive.

[0021] In one possible implementation, a treatment coating is applied to the surfaces of the hard particles and the consolidated layer, including:

[0022] The substrate is rotated by a rotating platform, and the spray gun is started simultaneously to spray the polyimide solution evenly onto the surface of the solidified layer and hard particles to form a polyimide solution coating.

[0023] Alternatively, the substrate can be rotated by a rotating platform, and the dripping tube can be started simultaneously to drip UV-curable adhesive onto the center of the solidification layer to form a UV-curable adhesive coating.

[0024] In one possible implementation, the coated trimmer is cured, including:

[0025] The polyimide solution coating is cured using a stepped baking process.

[0026] Alternatively, the UV-curable adhesive coating can be cured by irradiating it with ultraviolet light.

[0027] In one possible implementation, the coating undergoes post-processing, including:

[0028] The thickness of the coating is inspected and adjusted to control the height deviation of hard particles within a preset range.

[0029] A second aspect of this application provides a trimmer, comprising:

[0030] The matrix has a consolidation layer;

[0031] Hard particles, a consolidation layer is connected between the matrix and the hard particles, and the hard particles are protruding from the consolidation layer;

[0032] The coating is applied using the surface coating treatment method described above, and the coating is applied as completely as possible to the hard particles and the consolidation layer.

[0033] The dressing tool provided in the second aspect of this application includes a substrate, hard particles, and a coating. The substrate has a consolidation layer. The consolidation layer connects the substrate and the hard particles, with the hard particles protruding from the consolidation layer. The coating is treated using the surface coating treatment method described above, and the coating is applied as completely as possible to both the hard particles and the consolidation layer. Thus, the coating of the dressing tool provided in this application, through treatment, can solve problems such as uneven thickness and poor durability, thereby improving the service life of the dressing tool.

[0034] In one possible implementation, the consolidation layer has several hard particles, which are uniformly distributed on the consolidation layer, or the hard particles are arranged in a certain pattern on the consolidation layer.

[0035] In one possible implementation, the protrusion height of the hard particles ranges from 40 to 80 μm.

[0036] A third aspect of this application provides an abrasive pad dressing apparatus, including the dressing device described above.

[0037] It should be understood that the third aspect of this application corresponds to the technical solutions of the first and second aspects of this application, and the beneficial effects achieved by each aspect and the corresponding feasible implementation are similar, so they will not be repeated here.

[0038] In addition to the technical problems solved by this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the grinding pad dressing device, dressing tool, and surface coating treatment method provided by this application, other technical features contained in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific embodiments. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the drawings described below are only a part of the embodiments of this application. These drawings and text descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 A schematic flowchart illustrating a method for processing a surface coating of a trimmer according to an embodiment of this application;

[0041] Figure 2 A process flow diagram of a method for treating the surface coating of a trimmer provided in an embodiment of this application;

[0042] Figure 3 A schematic diagram of the structure of the dressing device provided in an embodiment of this application, which uses a polyimide solution spray-and-spray composite process;

[0043] Figure 4 A schematic diagram of the structure of the trimmer provided in an embodiment of this application, which uses a UV-curable adhesive for a drop-and-spin composite process.

[0044] Figure 5 This is a schematic diagram of the structure of a trimmer provided in one embodiment of this application.

[0045] Explanation of reference numerals in the attached figures:

[0046] 100- Dresser;

[0047] 200 - Matrix; 210 - Consolidation layer;

[0048] 300 - Hard particles;

[0049] 400 - Coating;

[0050] 500-Rotating Platform;

[0051] 600-Spray gun;

[0052] 700-droplet tube. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0054] As described in the background section, current dresser manufacturing processes typically employ either a single spraying or dip coating method for coating treatment. Spraying alone can easily lead to coating buildup around the particles, while dip coating makes it difficult to control coating thickness. Both methods result in significant deviations in the protruding height of hard particles. Furthermore, the coating material is prone to aging in the chemical environment of CMP, leading to coating cracking or peeling, thus affecting the dresser's service life.

[0055] To address the aforementioned technical problems, the first aspect of this application provides a method for processing a coating on the surface of a dresser. This method includes: providing a substrate for the dresser, the substrate having a consolidation layer; pre-treating the consolidation layer; consolidating hard particles onto the consolidation layer; preparing a coating material to be applied to the surfaces of the hard particles and the consolidation layer; applying a treatment coating to the surfaces of the hard particles and the consolidation layer; curing the dresser with the coating applied; and post-treating the coating. Thus, the method for processing a coating on the surface of a dresser provided by this application can be used to process coatings on the surface of a dresser, improving the adaptability of the coating process and enabling the coating to completely isolate metal ions from the consolidation layer, thus preventing metal ion contamination of the wafer.

[0056] A second aspect of this application provides a dressing tool comprising a substrate, hard particles, and a coating. The substrate has a consolidation layer. The consolidation layer connects the substrate and the hard particles, with the hard particles protruding from the consolidation layer. The coating is processed using the aforementioned method for treating the surface coating of a dressing tool, and the coating is applied to at least a portion of the hard particles and the consolidation layer. Thus, the coating of the dressing tool provided in this application, through processing, can solve problems such as uneven thickness and poor durability, thereby improving the service life of the dressing tool.

[0057] A third aspect of this application provides an abrasive pad dressing apparatus. This abrasive pad dressing apparatus includes the dressing device described above.

[0058] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0059] This application provides a polishing pad dressing device, a dresser, and a method for processing the surface coating of the dresser. The method for processing the surface coating of the dresser can be used to treat the coating on the surface of the dresser, improving the adaptability of the coating process and enabling the coating to completely isolate metal ions in the consolidation layer, thus avoiding metal ion contamination of the wafer. The specific structure of the dresser and polishing pad dressing device provided in this application, as well as the method for processing the surface coating of the dresser, are described below with reference to the accompanying drawings.

[0060] refer to Figure 1 as well as Figure 2 The first aspect of this application provides a method for processing a coating 400 on the surface of a trimmer 100. This method may include providing a substrate 200 for the trimmer 100, the substrate 200 having a consolidation layer 210; pre-treating the consolidation layer 210; consolidating hard particles 300 onto the consolidation layer 210; preparing a coating 400 material to be coated on the surfaces of the hard particles 300 and the consolidation layer 210; applying the treatment coating 400 to the surfaces of the hard particles 300 and the consolidation layer 210; curing the trimmer 100 with the coating 400 applied; and post-treating the coating 400.

[0061] Figure 1 A schematic flowchart illustrating a method for processing the surface coating 400 of a trimmer 100 according to an embodiment of this application is provided, referring to... Figure 1 As shown in the embodiment of this application, a method for processing the surface coating 400 of a trimmer 100 includes:

[0062] S101. Provide a substrate 200 for the trimmer 100, the substrate 200 having a consolidation layer 210, and pre-treat the consolidation layer 210.

[0063] In this embodiment of the application, a substrate 200 for the trimmer 100 is provided, and a consolidation layer 210 is provided on the surface of the substrate 200. It is understood that the consolidation layer 210 can be pretreated before coating the consolidation layer.

[0064] In one possible implementation, pretreatment of the consolidation layer 210 may include cleaning the consolidation layer 210 using ethanol or isopropanol. Specifically, the consolidation layer 210 can be immersed in an ethanol or isopropanol solution for 15-25 minutes, during which time a clean, soft-bristled brush can be used to gently scrub the surface of the consolidation layer 210 to enhance the cleaning effect.

[0065] For example, the solidified layer 210 can be cleaned using a 95% ethanol solution. The soaking time can be set to 20 minutes, during which the surface of the solidified layer 210 is gently brushed 2-3 times with a soft brush. After soaking and brushing, the surface is rinsed multiple times with sufficient deionized water until the rinsing solution is neutral to remove oil, impurities, and oxide layers, ensuring the adhesion between the coating 400 and the solidified layer 210. Finally, the cleaned solidified layer 210 is placed in a clean oven and dried at 60-80 degrees Celsius for 30-40 minutes to thoroughly remove moisture, resulting in a clean and dry solidified layer 210.

[0066] In another possible implementation, pretreatment of the solidified layer 210 may further include cleaning the solidified layer 210 using plasma cleaning. The plasma device can have a power range of 50-100 watts, and the cleaning time can be 2-5 minutes. For example, a plasma device with a rated output power of 80 watts can be used to clean the solidified layer 210, and the cleaning time can be set to 3 minutes. After cleaning, a clean and dry solidified layer 210 can be obtained.

[0067] S102. Hard particles 300 are solidified on the solidification layer 210. The coating material 400 applied to the surface of the hard particles 300 and the solidification layer 210 is prepared.

[0068] In this embodiment, hard particles 300 may be bonded to the consolidation layer 210. The hard particles 300 protrude from the side of the consolidation layer 210 facing away from the substrate 200. The hard particles 300 on the consolidation layer 210 are used to grind the grinding pad, restoring its surface roughness and cutting ability. Since the consolidation layer 210 releases metal ions due to the influence of the grinding pad and grinding fluid, a coating 400 is applied to the surface of the consolidation layer 210 to prevent direct contact between the consolidation layer 210 and the grinding pad. It is understood that the coating 400 material can be prepared before applying the coating 400 to the surfaces of the hard particles 300 and the consolidation layer 210. In one possible embodiment, the coating 400 material can be made of a polymer material, meeting the requirements for chemical corrosion resistance, insulation, and adhesion to the hard particles 300 after curing. This embodiment is not limited in its application.

[0069] In one possible implementation, preparing the coating 400 material applied to the surfaces of the hard particles 300 and the consolidation layer 210 may include using a polyimide solution as the coating 400 material. It is understood that polyimide possesses properties of resistance to high and low temperatures and resistance to acids and alkalis. The solid content of the polyimide solution may be 10%-30%, and the solvent may be N-methylpyrrolidone. For example, N-methylpyrrolidone solvent may be used to dissolve the polyimide, thereby preparing a polyimide solution with a solid content of 20%.

[0070] In another possible embodiment, preparing the coating 400 material applied to the surfaces of the hard particles 300 and the consolidation layer 210 may further include using a UV-curable adhesive for the coating 400 material. It is understood that UV-curable adhesives have good solvent resistance and mechanical properties, extending their service life to more than 1.5 times that of conventional products. The viscosity of the UV-curable adhesive can be 50-500 cP. For example, an acrylic UV-curable adhesive with a viscosity of 300 cP can be used.

[0071] S103. Apply a treatment coating 400 to the surface of the hard particles 300 and the consolidation layer 210.

[0072] In this embodiment of the application, the coating material 400 is processed and the processed coating material 400 is applied to the surface of the hard particles 300 and the consolidation layer 210 to form the coating 400, thereby avoiding direct contact between the consolidation layer 210 and the grinding pad and the grinding fluid.

[0073] In one possible implementation, such as Figure 3 As shown, applying a treatment coating 400 to the surface of hard particles 300 can include rotating the substrate 200 via a rotating platform 500, simultaneously activating a spray gun 600 to uniformly spray a polyimide solution onto the surfaces of the solidification layer 210 and the hard particles 300, forming a polyimide solution coating to further eliminate buildup and ensure that the polyimide solution uniformly and continuously covers the hard particles 300 and the solidification layer 210. A spray-and-spin composite process can be used to apply the coating 400 to the surfaces of the hard particles 300 and the solidification layer 210. Some parameters of the spray-and-spin composite process are as follows: the rotation speed of the rotating platform 500 can be 500-3000 rpm, the spray volume can be 1-5 ml, the spray pressure can be 0.2-0.5 MPa, the distance between the spray gun 600 and the rotating platform 500 can be 10-30 cm, and the synchronization time between spraying and rotation can be 5-30 s. After spraying, the rotating platform 500 continues to rotate for 5-20 s.

[0074] For example, the rotating platform 500 is started. When the rotation speed of the rotating platform 500 reaches 1500 rpm, spraying begins using the spray gun 600. The spray gun 600 is adjusted to a working pressure of 0.3 MPa, and the nozzle maintains a constant distance of 20 cm from the surface of the hard particles 300 to ensure uniform coverage of the coating 400. The spraying process is synchronized with the rotational motion and continues for 30 seconds before stopping. Subsequently, the rotating platform 500 continues to rotate at 1500 rpm for 15 seconds, using centrifugal force to further level and homogenize the coating 400.

[0075] In another possible implementation, such as Figure 4 As shown, applying a treatment coating 400 to the surface of hard particles 300 can include rotating the substrate 200 via a rotating platform 500 while simultaneously starting a dripping tube 700 to drop UV-curable adhesive onto the center of the solidification layer 210, forming a UV-curable adhesive coating. Centrifugal force is used to evenly spread the adhesive, ensuring that the UV-curable adhesive uniformly and continuously covers both the hard particles 300 and the solidification layer 210. A drop-and-spray composite process can be used to apply the coating 400 to the surfaces of the hard particles 300 and the solidification layer 210. Some parameters of the drop-and-spray composite process are as follows: the rotation speed of the rotating platform 500 can be 800-4000 rpm, the dropping volume can be 0.025-0.15 ml, the distance between the dripping tube 700 and the rotating platform 500 can be 10-20 cm, and the synchronization time between dropping and rotation can be 10-40 s. After dropping, the rotating platform 500 continues to rotate for 5-10 seconds.

[0076] For example, the rotating platform 500 is started. When the rotation speed of the rotating platform 500 reaches 2000 rpm, the UV-curable adhesive dispensing device is turned on to dispense the adhesive at a precisely controlled flow rate to the center of the solidification layer 210. The dispensing process is synchronized with the rotation and is stopped after 40 seconds. After the dispensing is completed, the rotating platform 500 continues to rotate at 2000 rpm for 10 seconds, using centrifugal force to promote the uniform spread of the UV-curable adhesive.

[0077] S104. The dressing device 100 with the coating 400 applied is cured.

[0078] In this embodiment, after the coating 400 is applied to the hard particles 300 and the consolidation layer 210, the corresponding curing method can be selected according to the type of coating 400 material, and the trimmer 100 with the coating 400 applied is cured.

[0079] In one possible implementation, the trimmer 100 with the coating 400 applied is subjected to a curing process, which may include curing the polyimide solution coating using a stepped baking method. Specifically, the polyimide solution coating employs a stepped temperature curing process, comprising two stages: first, pre-baking at 80–120°C for 30–60 minutes; followed by curing at a high temperature of 200–300°C for 1–3 hours, forming a stable cured film with excellent heat resistance.

[0080] For example, the polyimide solution coating can be pre-baked at 100°C for 45 minutes and then cured at 250°C for 2 hours to achieve the curing process of the entire trimmer 100.

[0081] In another possible implementation, curing the trimmer 100 with the coating 400 applied may include curing the UV-curable adhesive coating by UV light irradiation. Specifically, the UV-curable adhesive coating is cured by irradiation in the 365–405 nm UV wavelength range, with a light intensity range of 500–2000 mW / cm². 2 The irradiation time is controlled between 10 and 60 seconds to achieve rapid curing of the coating through ultraviolet light.

[0082] For example, the UV-curable adhesive coating can be irradiated under a 365nm UV light band, with a light intensity range of 1000mW / cm². 2 The irradiation time is controlled at 30 seconds to achieve the curing treatment of the entire trimmer 100.

[0083] S105. Post-treatment of coating 400.

[0084] In this embodiment, after the dressing device 100 with the coating 400 is cured, the coating 400 can be post-processed. The thickness of the coating 400 can be detected and adjusted, and the height deviation of the hard particles 300 can be controlled within a preset range. In one possible implementation, the preset range can be 0-10 μm. During the dressing process, the hard particles 300 maintain a uniform protrusion height, avoiding uneven dressing of the polishing pad surface, which could affect the polishing quality of the wafer.

[0085] In one possible implementation, the coating 400 can be inspected using an optical microscope or a laser profilometer to ensure that the coating 400 uniformly and continuously covers the hard particles 300 and the consolidation layer 210 without any exposed areas. Alternatively, pre-grinding can remove the coating from the surface of the hard particles 300, allowing the hard particles 300 to directly act on the abrasive pad.

[0086] In one possible implementation, the thickness of the polyimide solution coating can range from 3 to 20 μm. For example, through inspection and adjustment of the coating 400, it was determined that the coating 400 thickness is 5 μm and can uniformly and completely cover the surface of the hard particles 300. The protrusion height of the hard particles 300 is 50 μm, and the height deviation is controlled within ±3 μm.

[0087] Based on the above embodiments, it can be understood that in actual testing, for example, the dressing device 100 provided in this application embodiment was used continuously 500 times in a polishing slurry with pH=3. The coating 400 in the dressing device 100 did not peel off, the metal ion detection was negative, and the height deviation of the hard particles 300 protrusion was less than or equal to 4μm, which met the preset range.

[0088] In another possible implementation, the thickness of the UV-curable adhesive coating can range from 5 to 30 μm. For example, through inspection and adjustment of the coating 400, it was determined that the coating 400 thickness is 12 μm, and it can uniformly and completely cover the surface of the hard particles 300. The protrusion height of the hard particles 300 is 40 μm, with the height deviation controlled within ±5 μm, and the maximum deviation of the protrusion height of the hard particles 300 still meets the requirement of being less than or equal to 8 μm.

[0089] Based on the above embodiments, it can be understood that, in actual testing, for example, the dresser 100 provided in this application embodiment was used continuously 600 times in a polishing slurry with pH=10, and the coating 400 in the dresser 100 did not crack, and the dressing effect was stable.

[0090] Understandably, by simultaneously applying spraying / dropping and spin coating, the coating material 400 is distributed in real time within the centrifugal force field, avoiding the accumulation lag caused by step-by-step operations. The protrusion height deviation of the hard particles 300 is controlled within 10μm. The coating 400 can cover the consolidation layer 210, completely avoiding direct contact with the grinding environment and eliminating metal debris and ion contamination. By adjusting parameters such as spraying pressure and spin coating speed, the thickness of the coating 400 and the protrusion height of the hard particles 300 can be precisely controlled, adapting to the dressing requirements of different types of grinding pads and improving the flexibility of the CMP process.

[0091] Based on the above-described method for processing the surface coating 400 of a trimmer 100, a second aspect of the embodiments of this application provides a trimmer 100, with reference to... Figure 5 The trimmer 100 may include a substrate 200, hard particles 300, and a coating 400. It is understood that the coating 400 in the trimmer 100 provided in this application embodiment can be obtained by the above-described treatment method for the surface coating 400 of the trimmer 100.

[0092] Continue to refer to Figure 5 In a specific implementation of this application embodiment, the substrate 200 may have a consolidation layer 210. The consolidation layer 210 can be connected between the substrate 200 and the hard particles 300, and the hard particles 300 protrude from the consolidation layer 210. It is understood that the coating 400 can be processed using the above-described surface coating 400 treatment method of the dresser 100, and the coating 400 can be coated as completely as possible on the hard particles 300 and the consolidation layer 210, thereby avoiding direct contact between the consolidation layer 210 and the polishing pad, which could lead to wafer contamination.

[0093] Continue to refer to Figure 5 Based on the above embodiments, in one possible implementation, the substrate 200 can be a disk-shaped structure, while the hard particles 300 can be a prismatic structure. It is understood that the hard particles 300 can be any protruding structure, including but not limited to prismatic shapes. This application embodiment does not limit the shapes of the substrate 200 and the hard particles 300. In this application embodiment, one side of the consolidation layer 210 can be connected to the substrate 200, and the other side of the consolidation layer 210 can be connected to the hard particles 300, thereby making the substrate 200, the consolidation layer 210, and the hard particles 300 form a whole.

[0094] Thus, the coating 400 of the trimmer 100 provided in this application embodiment can be processed to solve problems such as uneven thickness and poor durability, thereby improving the service life of the trimmer 100.

[0095] Based on the above embodiments, in one possible implementation, the substrate 200 can be made of stainless steel, ceramic, or a polymer. Additionally, the consolidation layer 210 can be made of a nickel-based alloy. The embodiments described herein are not intended to be limiting.

[0096] Continue to refer to Figure 5 Based on the above embodiments, in one possible implementation, the number of hard particles 300 can be several. This application embodiment does not limit the number of hard particles 300. In this application embodiment, several hard particles 300 can be evenly distributed on the consolidation layer 210, thereby facilitating the surface trimming of the abrasive pad by the several hard particles 300. Alternatively, in another possible implementation, several hard particles 300 can be arranged in a certain pattern on the consolidation layer 210. This application embodiment does not limit this.

[0097] Based on the above embodiments, the hard particles 300 can be protruding onto the side of the consolidation layer 210 facing away from the substrate 200. In one possible embodiment, the hard particles 300 can be made of diamond particles, and the particle size range of the hard particles 300 can be 120-170 μm. Additionally, the protrusion height of the hard particles 300 can range from 40-80 μm; this embodiment does not impose any limitations on this.

[0098] A third aspect of this application provides an abrasive pad dressing device (not shown in the figure), which may include the dressing device 100 described above.

[0099] In the embodiments of this application, the method for processing the coating 400 on the surface of the dresser 100 provided in this application can be used to process the coating 400 on the surface of the dresser 100, improving the adaptability of the coating 400 process, so that the coating 400 can achieve complete isolation between the hard particles 300 and the consolidation layer 210, avoiding wafer contamination.

[0100] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0101] It should be noted that phrases such as "in specific implementations," "in some embodiments," "in this embodiment," and "exemplarily" in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0102] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0103] It should be readily understood that “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0104] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0105] Finally, it should be noted that other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and alterations may be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A method for treating the coating on the surface of a dresser, characterized in that, The processing method includes: A substrate (200) is provided for the trimmer (100), the substrate (200) having a consolidation layer (210), the consolidation layer (210) being pretreated; Hard particles (300) are solidified on the solidification layer (210), and a coating (400) material is prepared to be coated on the surface of the hard particles (300) and the solidification layer (210); The coating (400) is applied to the surfaces of the hard particles (300) and the consolidation layer (210). The trimmer (100) with the coating (400) applied is then cured. The coating (400) is then post-treated.

2. The method for treating the surface coating of the dressing tool according to claim 1, characterized in that, The pretreatment of the solidified layer (210) includes: The solidified layer (210) is cleaned by washing with ethanol or isopropanol; Alternatively, the solidified layer (210) can be cleaned using plasma cleaning.

3. The method for treating the surface coating of the dresser according to claim 2, characterized in that, The preparation of the coating (400) material applied to the surfaces of the hard particles (300) and the consolidation layer (210) includes: The coating (400) material is a polyimide solution; Alternatively, the coating (400) material may be a UV-curable adhesive.

4. The method for treating the surface coating of the dresser according to claim 3, characterized in that, Applying the coating (400) to the surfaces of the hard particles (300) and the consolidation layer (210) includes: The substrate (200) is rotated by a rotating platform (500), and the spray gun (600) is started simultaneously to uniformly spray the polyimide solution onto the surface of the consolidation layer (210) and the hard particles (300) to form a polyimide solution coating. Alternatively, the substrate (200) can be rotated by a rotating platform (500), and the dripping tube (700) can be started simultaneously to drip ultraviolet curing adhesive onto the center of the solidification layer (210) to form an ultraviolet curing adhesive coating.

5. The method for treating the surface coating of the dresser according to claim 4, characterized in that, The curing process of the trimmer (100) to which the coating (400) has been applied includes: The polyimide solution coating is cured by a stepped baking process. Alternatively, the ultraviolet-curable adhesive coating may be cured by ultraviolet light irradiation.

6. The method for treating the surface coating of the dressing tool according to claim 5, characterized in that, The post-processing of the coating (400) includes: The thickness of the coating (400) is detected and adjusted, and the height deviation of the hard particles (300) is controlled within a preset range.

7. A trimmer, characterized in that, include: The substrate (200) has a consolidation layer (210); Hard particles (300), the consolidation layer (210) is connected between the matrix (200) and the hard particles (300), and the hard particles (300) protrude from the consolidation layer (210). The coating (400) is processed by the method of processing the surface coating of the dressinger according to any one of claims 1-6, and the coating (400) is applied as completely as possible to the hard particles (300) and the consolidation layer (210).

8. The trimmer according to claim 7, characterized in that, The number of hard particles (300) is several, and the several hard particles (300) are evenly distributed on the consolidation layer (210), or the several hard particles (300) are arranged in a certain manner on the consolidation layer (210).

9. The trimmer according to claim 8, characterized in that, The protrusion height of the hard particles (300) ranges from 40 to 80 μm.

10. A grinding pad dressing device, characterized in that, Includes the trimmer (100) as described in any one of claims 7-9 above.

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