Convenient wafer film pasting device and using method thereof

Abstract

The invention discloses a convenient wafer film pasting device and a using method thereof, and belongs to the technical field of semiconductor manufacturing auxiliary equipment. The device comprises a mounting frame, a conveying unit, a film supply unit, a film pasting unit and an edge cutting unit. The conveying unit drives the wafer positioning disc provided with the negative pressure adsorption mechanism to move through the linear module. The film supply unit comprises a film supply roller and a film tearing roller which are in transmission connection; the film pasting unit is provided with a film pasting compression roller with a negative pressure suction nozzle and a die cutter; the edge cutting unit comprises a turnover cover plate, a rotating shaft and a first edge cutter are arranged on the turnover cover plate, and when the cover plate is closed, the rotating shaft is collinear with the axis of the wafer positioning disc. The using method comprises the steps of wafer loading, protective film preparation, initial pasting and covering, continuous rolling and pasting, film belt cutting, trimming and finishing and the like. The film pasting and edge cutting device integrates the film pasting function and the edge cutting function, is compact in structure, easy and convenient to operate, flat in film pasting, high in edge cutting precision and suitable for rapid and high-quality pasting of the wafer protection film.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing auxiliary equipment technology, and in particular to a convenient wafer film bonding device and its usage method. Background Technology

[0002] During the processing, transportation, and storage of semiconductor wafers, protective films are typically applied to their surfaces to prevent scratches or contamination. Current technologies often distribute processes such as loading, film application, film cutting, and edge trimming across different workstations or use independent equipment, resulting in lengthy production lines, multiple wafer transfers and repositionings, cumbersome processes, and low efficiency. Furthermore, the starting point of film application is often difficult to fix flat, easily leading to air bubbles or misalignment; the tape cutting after film application may also be imprecise, affecting subsequent processes or creating burrs. The process of removing excess protective film from the wafer's periphery after film application often relies on manual labor or simple contour cutters, resulting in uneven edges, poor consistency, and low efficiency; the circular cutting path is also difficult to align precisely. For wafers with special structures such as positioning grooves on the edges, general-purpose edge trimming devices are often unsuitable, and residual film within the grooves often cannot be effectively removed, requiring additional manual processing, affecting quality and efficiency. During film application, the supply of protective film and the winding of release film require independent drive configurations, resulting in poor synchronization and easily causing wrinkles, release film accumulation, or breakage, affecting the quality and continuity of the film application. Fixed-type cutting tools are difficult to fine-tune according to wafer size, protective film thickness, and material, making it impossible to guarantee cutting quality and tool life under different working conditions. Currently, fully automated equipment is costly and complex to adjust, while purely manual operation relies too much on human skills, making it difficult to balance accuracy and efficiency. There is a lack of a balanced solution that ensures accuracy in critical processes and maintains operational flexibility in non-critical processes.

[0003] Therefore, in view of the shortcomings of the existing technology, it is necessary to design a convenient wafer film application device and its usage method to solve the above problems.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solution of the present invention and for the convenience of those skilled in the art to understand it. It should not be assumed that the above content is known to those skilled in the art simply because it has been described in the background of the present invention. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the present invention aims to disclose a convenient wafer film application device and its usage method.

[0006] This invention discloses a convenient wafer film application device, including a mounting frame, a conveying unit on the mounting frame, the conveying unit including a linear module and a wafer positioning disk located at the moving end of the linear module, the wafer positioning disk being provided with a negative pressure adsorption mechanism, and multiple liftable limit posts being provided on the outer periphery of the wafer positioning disk.

[0007] A film supply unit, a film application unit, and a trimming unit are sequentially arranged along the travel path of the linear module, and a processing station is provided at the location of the trimming unit;

[0008] The film supply unit includes a detachable film supply roller and a film tearing roller, which are connected in a drive connection.

[0009] The film application unit is equipped with a film application pressure roller driven by the first lifting mechanism. On the side of the film application pressure roller facing the edge cutting unit, multiple negative pressure suction nozzles and a cutting die are arranged in sequence along the axial direction of the film application pressure roller. The cutting die can reciprocate in a direction parallel to the axial direction of the film application pressure roller.

[0010] The trimming unit includes a flip-up cover plate with a rotating shaft. When the cover plate is flipped to the closed position covering the processing station, the axis of the rotating shaft is collinear with the axis of the wafer positioning disk positioned at the processing station. A first trimming blade is provided at the lower end of the rotating shaft via a connecting frame.

[0011] Preferred technical solution: A second cutting blade can also be provided on the cover plate in a lifting manner. The cutting edge of the second cutting blade faces downward and the shape of the cutting edge is adapted to the shape of the positioning groove on the side of the wafer.

[0012] A preferred technical solution: A first pulley is fixed on the shaft of the film feeding roller, and a second pulley is fixed on the shaft of the film tearing roller. The first pulley and the second pulley are connected by a round belt drive. The diameter ratio of the first pulley to the second pulley is greater than the diameter ratio of the film feeding roller to the film tearing roller.

[0013] Preferred technical solution: The negative pressure adsorption mechanism includes a groove structure on the upper surface of the circular crystal positioning disk. The groove structure includes multiple concentric annular grooves with the axis of the circular crystal positioning disk as the center, and a cross groove intersecting with the annular grooves. The bottom of the groove at the intersection of the annular groove and the cross groove is provided with an air extraction hole, which is connected to an external negative pressure source.

[0014] Preferred technical solution: The first cutting blade is hinged to the connecting frame via a hinge shaft, allowing the first cutting blade to swing about the hinge axis towards or away from the axis of rotation; the connecting frame is provided with a first spring, which provides a preload force to make the first cutting blade swing towards the axis of rotation; the connecting frame is also threadedly connected with a first adjusting rod, the end of which abuts against the side of the first cutting blade to limit the extreme position of the first cutting blade swinging towards the axis of rotation.

[0015] Preferred technical solution: The first cutting blade is connected to the hinge shaft via an adapter. The adapter includes a base hinged to the hinge shaft and a mounting seat rotatably connected to the base in a direction perpendicular to the hinge shaft. The first cutting blade is mounted on the mounting seat. The base is provided with a second adjusting rod. The side of the mounting seat is provided with a radially extending protrusion. The second adjusting rod abuts against the protrusion. A second spring is provided between the protrusion and the base. The second spring provides a preload force to cause the cutting edge of the first cutting blade to rotate in the direction of the wafer positioning disk axis. The second adjusting rod is used to limit the extreme position of the cutting edge of the first cutting blade rotating in the direction of the wafer positioning disk axis.

[0016] Preferred technical solution: The film application unit also includes an ion air bar and an independently liftable negative pressure suction nozzle mounting plate. Multiple negative pressure suction nozzles are set on the negative pressure suction nozzle mounting plate, and the negative pressure suction nozzle mounting plate is driven to rise and fall by an independent second lifting mechanism.

[0017] The present invention also provides a method of using the above-mentioned convenient wafer film application device, comprising the following steps:

[0018] S1. Open the cover plate, load the wafer onto the wafer positioning plate at the processing station and fix it with the negative pressure adsorption mechanism, and raise the limiting column to assist in positioning the wafer.

[0019] S2. Control the film-applying roller to rise, pull the protective film from the film-feeding roller to a preset length, fix the release film on the film-tearing roller, and use the negative pressure suction nozzle to adsorb and fix the protective film section.

[0020] S3. Drive the wafer positioning disk to move so that one end of the wafer is directly below the film-applying roller; control the film-applying roller to descend and press the protective film onto the wafer surface from the edge of the wafer positioning disk; the negative pressure nozzle releases the adsorption of the protective film.

[0021] S4. Start the linear module to drive the wafer positioning disk to carry the wafer to the processing station and move continuously, so that the protective film is applied to the wafer surface under the continuous rolling pressure of the film application roller; during this process, the protective film is pulled out from the film supply roller and the peeled release film is simultaneously wound up by the film peeling roller.

[0022] S5. When the protective film completely covers the wafer and the wafer positioning plate reaches the processing station, control the negative pressure suction nozzle to adsorb and fix the protective film again, and then drive the die cutter to cut the protective film between the film supply roller and the wafer.

[0023] S6. Flip the cover plate to the closed position covering the processing station; drive the rotating shaft to rotate, causing the first cutting blade to remove the excess protective film from the edge of the wafer; then open the cover plate and remove the wafer with the film applied and the cut protective film.

[0024] Preferred technical solution: In step S6, the limiting post is lowered before the drive shaft rotates. This avoids interference with the edge cutting process.

[0025] Preferred technical solution: In step S6, the rotation of the rotating shaft is driven manually by a hand crank set on the rotating shaft.

[0026] Due to the application of the above technical solutions, the beneficial effects of this invention compared with the prior art are as follows:

[0027] This invention integrates automatic conveying, film application, film cutting, and edge trimming functions into a single unit, featuring a compact process, convenient operation, and improved film application efficiency. The cooperation between the negative pressure suction nozzle and the cutting blade ensures reliable fixation and precise cutting of the protective film. The unique edge trimming unit design, through a flip-up cover plate and a coaxially arranged rotating shaft with the first edge trimming blade, allows for convenient and precise one-time removal of excess protective film from the circumferential edge of the wafer. A dedicated second edge trimming blade is provided for precise trimming of the wafer's side positioning grooves, offering good adaptability. The film supply and tearing rollers utilize belt drives with a specific transmission ratio, ensuring synchronization between film supply and release film winding, and stable film tension. The first edge trimming blade features a multi-degree-of-freedom adjustable mechanism, allowing for fine-tuning according to the wafer size and protective film characteristics, guaranteeing trimming quality and accuracy. The operation method is clear and combines automation and manual operation, ensuring both precision and flexibility. Attached Figure Description

[0028] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of a convenient wafer film bonding device according to the present invention;

[0030] Figure 2 This is a schematic diagram of the working state of a convenient wafer film application device according to the present invention;

[0031] Figure 3 This is a schematic diagram of the conveying unit in this invention;

[0032] Figure 4 This is a schematic diagram of the membrane supply unit in this invention;

[0033] Figure 5 This is a schematic diagram of the film-applying unit in this invention;

[0034] Figure 6 This is a schematic diagram of the edge-cutting unit in this invention;

[0035] Figure 7This is a schematic diagram of the structure of the first cutting blade in this invention.

[0036] In the attached diagrams above, 1 is the mounting bracket; 2 is the linear module; 3 is the wafer positioning plate; 31 is the groove structure; 32 is the air extraction hole; 33 is the limiting post; 4 is the film supply roller; 41 is the first pulley; 5 is the film tearing roller; 51 is the second pulley; 6 is the circular belt; 7 is the film application roller; 8 is the first lifting mechanism; 9 is the negative pressure suction nozzle; 10 is the die cutter; 11 is the cover plate; 12 is the rotating shaft; 13 is the connecting frame; 14 is the first edge trimmer; 15 is the hinge shaft; 16 is the first spring; 17 is the first adjusting rod; 18 is the base; 19 is the mounting base; 20 is the protrusion; 21 is the second adjusting rod; 22 is the second spring; 23 is the second edge trimmer; 24 is the hand crank; 25 is the negative pressure suction nozzle mounting plate; 26 is the second lifting mechanism; 27 is the ion air bar; 100 is the wafer; 101 is the protective film; and 102 is the release film. Detailed Implementation

[0037] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate for the description of embodiments of this application herein. Furthermore, the terms "comprising" and "having," and their synonyms, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0039] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing the invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0040] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0041] Furthermore, the terms "installation," "setting," "equipped with," "connection," "linking," "fitting," and "fitting" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Similarly, "fitting" can mean completely or partially fitted. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0043] Example:

[0044] like Figure 1 and Figure 2 As shown, this invention discloses a convenient wafer film application device, including a mounting frame 1, a conveying unit, a film supply unit, a film application unit, and an edge trimming unit. The main components of the invention will be described in detail below:

[0045] like Figure 1 and Figure 2 As shown, mounting bracket 1 is used to support and connect various functional units.

[0046] like Figure 1 , Figure 2 and Figure 3 As shown, the mounting frame 1 is equipped with a conveying unit, including a linear module 2. A wafer positioning disk 3 is mounted on the sliding block of the linear module 2. The wafer positioning disk 3 is used to support and fix the wafer 100 to be coated. The upper surface of the wafer positioning disk 3 is machined with a specific groove structure 31. In this embodiment, the groove structure 31 includes multiple concentric annular grooves and cross grooves communicating with them. The bottom of the concentric annular grooves and cross grooves is provided with an air extraction hole 32 at the intersection. The air extraction hole 32 is connected to an external vacuum pump through an internal pipeline. When the wafer 100 is placed on the disk surface and the vacuum is started, the negative pressure distributed by the groove structure 31 can evenly and firmly adsorb the wafer 100. At the edge of the wafer positioning disk 3, multiple independently controllable lifting limit posts 33 are also provided. They rise during the initial loading to circumferentially limit the wafer 100 and prevent it from sliding. When in use, the top height of the limit post 33 is not higher than the height of the wafer 100 at the outermost end face of the wafer positioning disk 3.

[0047] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, a film supply unit, a film application unit, and a trimming unit are sequentially arranged along the conveying path of the straight module 2. The film supply unit includes a film supply roller 4 and a film peeling roller 5, both of which can be easily disassembled and replaced to change the roll. The film supply roller 4 is used to load the roll of protective film 101 with release film 102. The film peeling roller 5 is used to roll up the release film 102 peeled off during the film application process. To ensure that the two start and stop synchronously and achieve smooth release film peeling, a first pulley 41 is fixed to the shaft end of the film supply roller 4, and a second pulley 51 is fixed to the shaft end of the film peeling roller 5. The two are connected by a round belt 6. In the design, the ratio of the diameter of the first pulley 41 to the diameter of the second pulley 51 is slightly larger than the ratio of the roll diameter of the film supply roller 4 to the roll diameter of the film peeling roller 5 when fully loaded, so as to compensate for the transmission and ensure that the release film 102 is always wound up with appropriate tension.

[0048] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, the main component of the film-applying unit is a film-applying roller 7, which is driven by a first lifting mechanism 8 and can move vertically. On the side of the film-applying roller 7 facing the processing direction (i.e., the side near the edge-cutting unit), a set of negative pressure suction nozzles 9 and a cutting blade 10 are mounted side by side along its axial direction. The negative pressure suction nozzles 9 are used to adsorb and fix the free end of the protective film 101 at a specific stage. The cutting blade 10 can be driven by a small linear actuator to move in a direction parallel to the axial direction of the film-applying roller 7 to cut the protective film. In some embodiments, a guide roller group is also provided between the film supply roller 4 and the film-applying roller 7 to control the feed angle of the protective film and avoid excessive angle causing film wrinkles. In some embodiments, the negative pressure suction nozzles 9 are mounted on a negative pressure suction nozzle mounting plate 25 that can be lifted and lowered independently. The negative pressure suction nozzle mounting plate 25 is driven to lift and lower by a second lifting mechanism 26. An ion air bar 27 is also provided in front of the film-applying roller 7 to eliminate static electricity and remove dust from the passing wafers and protective films by blowing high-voltage ionized air.

[0049] like Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 7As shown, the trimming unit is located at the processing station at the end of the stroke of the linear module 2. It includes a flip-up cover plate 11. A rotating shaft 12 is vertically mounted on the cover plate 11. A hand crank 24 can be mounted on the top of the shaft 12 for manual operation, or it can be connected to a motor for automatic rotation. When the cover plate 11 is flipped down to the closed state, covering the wafer positioning disk 3 located at the processing station, the axis of the rotating shaft 12 precisely coincides with the axis of the wafer 100. A first trimming blade 14 is mounted on the lower end of the rotating shaft 12 via a connecting bracket 13, used to remove excess protective film from the outer circumference of the wafer 100. The first trimming blade 14 is designed to be adjustable to ensure cutting accuracy and adaptability.

[0050] Radial adjustment: The first cutting blade 14 is hinged to the connecting frame 13 via a hinge shaft 15, allowing it to swing around the hinge shaft 15, thereby changing the distance from its cutting edge to the center of the rotating shaft 12. A first spring 16 provides a preload force to cause the first cutting blade 14 to swing toward the axis. A first adjusting rod 17 is threaded onto the connecting frame 13, with its end pressing against the side of the first cutting blade 14. By rotating the first adjusting rod 17, the limit position of the inward swing of the first cutting blade 14 can be precisely set, thus determining the radial dimension of the cut.

[0051] Angle Adjustment: The first cutting blade 14 is not directly fixed to the hinge shaft 15, but is mounted via a transition structure. This structure includes a base 18 connected to the hinge shaft 15, and a mounting base 19 rotatably connected to the base 18. The first cutting blade 14 is fixed to the mounting base 19. The mounting base 19 has a protrusion 20 on its side. A second spring 22 acts between the protrusion 20 and the base 18, causing the mounting base 19 to drive the cutting edge 141 to have a tendency to tilt towards the center of the wafer. A second adjusting rod 21 is threaded onto the base 18, and its end abuts against the protrusion 20. By adjusting the second adjusting rod 21, the inward tilt angle of the cutting edge 141 can be limited to adapt to the cutting requirements of protective films with different properties.

[0052] like Figure 1 , Figure 2 , Figure 3 and Figure 6 As shown, in addition, a second cutting blade 23 that can be independently controlled to rise and fall is also installed on the cover plate 11. The cutting edge shape of the second cutting blade 23 is specially designed according to the positioning groove commonly found on the side of the wafer 100, and is used to descend and remove the excess protective film remaining in the groove after the circumferential cutting is completed.

[0053] according to Figures 1 to 7 As shown, the method of using the above-mentioned device includes the following steps:

[0054] S1. Loading the wafer: Open the cover plate 11 and place the wafer 100 on the wafer positioning plate 3 at the processing station. Start vacuum adsorption to firmly adsorb and fix the wafer 100 through the groove structure 31 and the air extraction hole 32. Raise the limiting post 33 to perform auxiliary circumferential positioning of the wafer.

[0055] S2. Preparing the film material: Control the film application roller 7 to rise. Pull out a section of protective film 101 from the film supply roller 4, so that its free end passes under the film application roller 7 and is sucked in by the negative pressure suction nozzle 9. Fix the head of the peeled release film 102 onto the film peeling roller 5.

[0056] S3, Initial Application: The linear module 2 drives the wafer positioning disk 3 to move, causing one edge of the wafer 100 to move directly below the film application roller 7. The first lifting mechanism 8 is controlled to lower the film application roller 7, rolling and pasting the starting end of the protective film 101 onto the edge surface of the wafer 100. Subsequently, the negative pressure nozzle 9 releases the protective film. Specifically, the negative pressure nozzle 9 depressurizes, and the second lifting mechanism 26 moves the negative pressure nozzle mounting plate 25 and the negative pressure nozzle 9 on it away from the protective film.

[0057] S4. Continuous Rolling Application: Start the linear module 2, driving the wafer positioning disk 3 to move the wafer 100 at a constant speed towards the processing station. The film application roller 7 remains in a downward pressing state, continuously rolling and applying the protective film 101 to the entire upper surface of the wafer 100 as it moves. During this process, the protective film 101 is continuously pulled out from the film supply roller 4, while the peeled release film 102 is neatly wound up by the film tearing roller 5 under the synchronous drive of the circular belt 6, maintaining stable film tension.

[0058] S5. Cutting the protective film strip: When the surface of the wafer 100 is completely covered by the protective film 101 and the wafer positioning disk 3 moves back to the processing station, the negative pressure suction nozzle 9 operates again to adsorb the protective film strip behind the film material. Then, the cutting die 10 is driven to move laterally to cut the protective film 101, so that the film on the wafer is separated from the protective film strip.

[0059] S6. Edge Trimming: First, lower the limiting post 33 to prevent it from interfering with the edge trimming action. Then, flip the cover plate 11 to close it. At this time, under the preload of its spring, the first trimming blade 14 is close to the side wall of the wafer 100. By turning the hand crank 24 to drive the rotating shaft 12 to rotate one revolution, the connecting frame 13 drives the first trimming blade 14 to rotate around the wafer 100 one revolution, thus neatly cutting off the excess protective film overflowing from its outer circumference. If there is a positioning groove on the side of the wafer 100, control the second trimming blade 23 to descend, using its specific shaped cutting edge to cut off the protective film in the groove. After trimming, open the cover plate 11 and turn off the vacuum adsorption of the wafer positioning plate 3, then remove the wafer 100 with intact film and clean edges, as well as the cut-off waste edge of the protective film.

[0060] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A portable wafer pasting device, comprising a mounting frame, characterized in that: a conveying unit is arranged on the mounting frame, the conveying unit comprises a linear module and a wafer positioning disc arranged at the moving end of the linear module, a negative pressure suction mechanism is arranged on the wafer positioning disc, and a plurality of liftable limiting columns are arranged on the outer periphery of the wafer positioning disc; a film supplying unit, a pasting unit and an edge cutting unit are sequentially arranged along the stroke path of the linear module, and a processing station is arranged at the position of the edge cutting unit; the film supplying unit comprises a detachable film supplying roller and a film tearing roller, and the film supplying roller is in driving connection with the film tearing roller; the pasting unit is provided with a pasting roller driven by a first lifting mechanism, a plurality of negative pressure suction nozzles and a cutting die are sequentially arranged on the side of the pasting roller facing the edge cutting unit along the axial direction of the pasting roller, and the cutting die can reciprocate along a direction parallel to the axial direction of the pasting roller; the edge cutting unit comprises a reversible cover plate, and a pivot is arranged on the cover plate; when the cover plate is turned to a closed position covering the processing station, the axis of the pivot is collinear with the axis of the wafer positioning disc positioned at the processing station; and a first edge cutting die is arranged at the lower end of the pivot through a connecting frame. A second edge cutting die is also liftable arranged on the cover plate, the blade of the second edge cutting die faces downward, and the shape of the blade is matched with the shape of the wafer side positioning slot; a first pulley is fixed on the rotating shaft of the film supplying roller, a second pulley is fixed on the rotating shaft of the film tearing roller, the first pulley and the second pulley are in driving connection through a round belt, and the diameter ratio of the first pulley to the second pulley is greater than the diameter ratio of the film supplying roller to the film tearing roller. The negative pressure suction mechanism comprises a groove structure arranged on the upper end surface of the wafer positioning disc, the groove structure comprises a plurality of concentric annular grooves with the axis of the wafer positioning disc as the center, and a cross groove intersecting with the annular grooves, the groove bottoms at the intersection points of the annular grooves and the cross groove are provided with air suction holes, and the air suction holes are communicated to an external negative pressure source. The first edge cutting die is hinged to the connecting frame through a hinge shaft, so that the first edge cutting die can swing towards the direction approaching or away from the axis of the pivot; a first spring is arranged on the connecting frame, the first spring provides a pre-tightening force for swinging the first edge cutting die towards the direction approaching the axis of the pivot; a first adjusting jacking rod is also threadedly connected to the connecting frame, the end of the first adjusting jacking rod abuts against the side of the first edge cutting die to limit the limit position of the first edge cutting die swinging towards the axis of the pivot. ​ ​ 2. The device according to claim 1, wherein: ​ 3. The device according to claim 1, wherein: ​ 4. The device according to claim 1, wherein: ​ 5. The device of claim 1, wherein: ​ 6. The device for applying a film to a circular wafer according to claim 5, wherein: The first trimming cutter is connected with the hinge shaft through an adapter, the adapter comprises a base hinged with the hinge shaft, and a mounting seat rotatably connected with the base in a direction perpendicular to the hinge shaft, and the first trimming cutter is arranged on the mounting seat; a second adjusting jack is arranged on the base, a radial protrusion is arranged on the side of the mounting seat, the second adjusting jack abuts against the protrusion, a second spring is arranged between the protrusion and the base, the second spring provides a pre-tightening force for rotating the blade of the first trimming cutter to the direction of the axis of the wafer positioning disc, and the second adjusting jack is used for limiting the limit position of the blade of the first trimming cutter rotating to the direction of the axis of the wafer positioning disc.

7. The device of claim 1, wherein: The film pasting unit further comprises an ion wind rod and a negative pressure suction nozzle mounting plate which can be independently lifted, and a plurality of negative pressure suction nozzles are arranged on the negative pressure suction nozzle mounting plate and driven to lift the negative pressure suction nozzle mounting plate by a second independent lifting mechanism.

8. A method of using the convenient round crystal film pasting device according to any one of claims 1 to 7, characterized in that, The method comprises the following steps: S1, open the cover plate, load the wafer on the wafer positioning disc at the processing station and fix it by the negative pressure suction mechanism, and lift the limiting column to assist in positioning the wafer; S2, control the film pasting roller to rise, pull out a preset length of protective film from the film supply roller, fix the release film on the film tearing roller, and fix the section of protective film by the negative pressure suction nozzle; S3, drive the wafer positioning disc to move, so that one end of the wafer is located directly below the film pasting roller; control the film pasting roller to descend, press the protective film on the wafer surface from the edge of the wafer positioning disc; and the negative pressure suction nozzle releases the suction of the protective film; S4, start the linear module to drive the wafer positioning disc to continuously move the wafer to the processing station, so that the protective film is pasted on the wafer surface under the continuous rolling of the film pasting roller; in this process, the protective film is pulled out from the film supply roller, and the release film is synchronously wound and peeled off from the film tearing roller; S5, when the protective film completely covers the wafer, and the wafer positioning disc reaches the processing station, control the negative pressure suction nozzle to suction and fix the protective film again, and then drive the cutting knife to move to cut off the protective film between the film supply roller and the wafer; S6, turn the cover plate to the closed position covering the processing station; drive the rotating shaft to rotate, drive the first trimming cutter to cut off the excess protective film on the edge of the wafer; then open the cover plate, take out the wafer with pasted film and the cut protective film.

9. The method of use of claim 8, wherein: In step S6, the rotating shaft is driven to rotate first, and then the limiting column is lowered.

10. The method of use of claim 8, wherein: In step S6, the rotating shaft is driven to rotate by a hand crank arranged on the rotating shaft.

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