Damping shockproof sealing hot melt adhesive as well as preparation process and application method thereof

Abstract

The invention relates to the technical field of hot melt adhesives, and discloses a damping shockproof sealing hot melt adhesive, and a preparation process and an application method thereof, the damping shockproof sealing hot melt adhesive is prepared by compounding naphthenic oil, base oil, microcrystalline wax, monomer resin, AMS, rosin resin, SEBS, maleic anhydride modified SEBS, stearylamine, an ultraviolet light absorber, and an antioxidant according to a specific weight part ratio; the damping rubber strip has excellent damping performance, shockproof performance and sealing performance, is good in aging resistance and convenient to construct, can replace a damping rubber strip, and effectively prevents collision and friction between electric appliances and electronic components and a shell during vibration; meanwhile, the invention further discloses a preparation process and an application method of the sealant, operation is easy, curing is rapid, and the sealant is suitable for damping shockproof sealing scenes in the fields of electric appliances and electronics.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hot melt adhesive, in particular to a damping shockproof sealing hot melt adhesive for electric appliances and electronic components, and a preparation process and application method thereof. BACKGROUND

[0002] In the field of electric appliances and electronic devices, the vibration, collision and friction between components and the shell are important factors affecting the stability and service life of the device. At present, the industry often uses damping adhesive strips to alleviate this problem, but the damping adhesive strip has many defects: the installation process is complicated and requires precise fitting; long-term use can cause aging and deformation, resulting in attenuation of damping and shockproof performance; the sealing performance is insufficient, and dust and water vapor can easily enter the interior of the device, affecting the normal operation of the components. Therefore, a material with more excellent performance and more convenient construction is needed to replace the traditional damping adhesive strip to meet the high requirements of electric appliances and electronic devices for damping and shockproof sealing. SUMMARY

[0003] The present application aims to solve at least one of the problems in the prior art, and provides a damping shockproof sealing hot melt adhesive, a preparation process and application method thereof, which has excellent damping, shockproof and sealing properties, is resistant to aging and convenient to use, and realizes efficient and stable damping and shockproof sealing effect.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: A damping shockproof sealing hot melt adhesive, comprising the following components in parts by weight: 15-44 parts of naphthenic oil; 15-44 parts of base oil; 2-10 parts of microcrystalline wax; 5-15 parts of monomer resin; 0-30 parts of AMS; 0-35 parts of rosin resin; 20-50 parts of SEBS; 5-10 parts of maleic anhydride modified SEBS; 0.5-2 parts of stearylamine; 0.2-1 part of ultraviolet light absorber; 0.4-4 parts of antioxidant.

[0005] Preferably, the naphthenic oil is naphthenic oil 4010; the base oil is base oil 250N; the microcrystalline wax is 70 microcrystalline wax; the monomer resin is SA120 monomer resin; the AMS is AMS110; the rosin resin is KF399S rosin resin; and the ultraviolet light absorber is UV328 ultraviolet light absorber.

[0006] Preferably, the 20-50 parts of SEBS include 10-25 parts of SEBS9550 and 10-25 parts of SEBS9552.

[0007] Preferably, the 0.4-4 parts of antioxidant include 0.2-2 parts of antioxidant 1010 and 0.2-2 parts of antioxidant 168.

[0008] Preferably, the damping shockproof sealing hot melt adhesive comprises the following components in parts by weight: 20-40 parts of naphthenic oil; 20-40 parts of base oil; 3-8 parts of microcrystalline wax; 8-12 parts of monomer resin; 5-20 parts of AMS; 1-10 parts of rosin resin; 21-30 parts of SEBS; 5-8 parts of maleic anhydride modified SEBS; 0.6-1 part of stearylamine; 0.3-0.5 part of ultraviolet light absorber; 1-3.5 parts of antioxidant.

[0009] Preferably, the damping shockproof sealing hot melt adhesive comprises the following components in parts by weight: 22 parts of naphthenic oil 4010; 22 parts of base oil 250N; 4 parts of 70 microcrystalline wax; 10 parts of SA120 monomer resin; 13.5 parts of AMS110; 1.5 parts of KF399S rosin resin; 10.5 parts of SEBS9550; 13 parts of SEBS9552; 6 parts of maleic anhydride modified SEBS; 0.6 part of stearylamine; 0.4 part of UV328 ultraviolet light absorber; 2 parts of antioxidant 1010; 1 part of antioxidant 168.

[0010] Further, the present application also provides the following technical solutions: A preparation process of a damping shockproof sealing hot melt adhesive, the preparation process comprising the following steps: S1, adding naphthenic oil, base oil and microcrystalline wax in a reaction kettle, stirring for 15-20 minutes to make the mixture uniform; S2, putting SEBS and maleic anhydride modified SEBS into the reaction kettle, heating to 140-160℃, and stirring until completely melted; S3, adding monomer resin, AMS and rosin resin, heating to 150-160℃, and stirring for 30-40 minutes; S4, adding stearylamine, ultraviolet light absorber and antioxidant, stirring for 10-15 minutes to obtain a uniform hot melt adhesive melt.

[0011] Preferably, the heating temperature in step S1 is 130℃.

[0012] Preferably, the heating temperature in step S3 is 155℃, and the stirring time is 35 minutes.

[0013] Further, the present application also provides the following technical solutions: An application method of the preparation process of the damping shockproof sealing hot melt adhesive, the application method comprising: coating the hot melt adhesive melt on the contact part of an electric appliance or an electronic component and a shell through a coating device, and naturally cooling and solidifying to form a damping shockproof sealing layer.

[0014] Compared with the prior art, the present application has the following advantages: The present application has excellent damping, shockproof and sealing properties, good aging resistance, convenient construction, can replace damping adhesive tape, effectively prevent the collision and friction of electrical appliances, electronic components and shell when vibrating; at the same time, the application operation is simple, the curing is fast, and it is suitable for damping and shockproof sealing scene in electrical and electronic field; Excellent damping and shockproof performance: through the synergistic effect of various elastomers, plasticizers and resins, the hot melt adhesive has excellent elastic buffering capacity, which can effectively absorb vibration energy and prevent the collision and friction of electrical appliances, electronic components and shell; Good sealing performance: the resin component in the formula gives the hot melt adhesive high cohesion and sealing property, which can effectively prevent dust and water vapor from entering the inside of the equipment and protect the components; Convenient construction: hot melt construction method is adopted, which can be quickly coated through coating equipment, and quickly solidified after natural cooling, greatly simplifying the construction process and improving the production efficiency; Strong aging resistance: the addition of anti-aging additives makes the hot melt adhesive still maintain stable performance in long-term light and heat environment, and the service life is significantly better than that of traditional damping adhesive tape. BRIEF DESCRIPTION OF DRAWINGS

[0015] The drawings accompanying the specification of this application serve to provide further understanding of the present application, the illustrative embodiments of the present application and the description thereof serve to explain the present application, and do not constitute an improper limitation on the present application.

[0016] Figure 1 Comparison chart of damping and shockproof sealing hot melt adhesive particles of the present application and traditional damping adhesive particles. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the present application more clear and explicit, the present application is further described in detail below in combination with the drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application, and do not limit the present application, that is, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0018] It should be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0019] The damping shockproof sealing hot melt adhesive comprises the following components in parts by weight: 15-44 parts of naphthenic oil; 15-44 parts of base oil; 2-10 parts of microcrystalline wax; 5-15 parts of monomer resin; 0-30 parts of AMS; 0-35 parts of rosin resin; 20-50 parts of SEBS; 5-10 parts of maleic anhydride modified SEBS; 0.5-2 parts of stearylamine; 0.2-1 part of ultraviolet light absorber; and 0.4-4 parts of antioxidant.

[0020] In the embodiment, the naphthenic oil is naphthenic oil 4010; the base oil is base oil 250N; the microcrystalline wax is 70 microcrystalline wax; the monomer resin is SA120 monomer resin; the AMS is AMS110; the rosin resin is KF399S rosin resin; and the ultraviolet light absorber is UV328 ultraviolet light absorber. The 20-50 parts of SEBS comprise 10-25 parts of SEBS9550 and 10-25 parts of SEBS9552. The 0.4-4 parts of antioxidant comprise 0.2-2 parts of antioxidant 1010 and 0.2-2 parts of antioxidant 168.

[0021] In some embodiments, the damping shockproof sealing hot melt adhesive comprises the following components in parts by weight: 20-40 parts of naphthenic oil; 20-40 parts of base oil; 3-8 parts of microcrystalline wax; 8-12 parts of monomer resin; 5-20 parts of AMS; 1-10 parts of rosin resin; 21-30 parts of SEBS; 5-8 parts of maleic anhydride modified SEBS; 0.6-1 part of stearylamine; 0.3-0.5 part of ultraviolet light absorber; and 1-3.5 parts of antioxidant.

[0022] The preparation process of the damping shockproof sealing hot melt adhesive comprises the following steps: S1, adding naphthenic oil, base oil and microcrystalline wax into a reaction kettle, heating to 130℃, and stirring for 15-20 minutes to make the mixture uniform; S2, adding SEBS and maleic anhydride modified SEBS into the reaction kettle, heating to 140-160℃, and stirring until completely melted; S3, adding monomer resin, AMS and rosin resin, heating to 150-160℃, and stirring for 30-40 minutes; S4, adding stearylamine, ultraviolet light absorber and antioxidant, stirring for 10-15 minutes to obtain a uniform hot melt adhesive melt. Embodiment 1

[0023] The damping shockproof sealing hot melt adhesive of the application is prepared according to the following steps: S1, adding 22 parts of naphthenic oil 4010, 22 parts of base oil 250N and 4 parts of 70 microcrystalline wax into a reaction kettle, heating to 130℃, and stirring for 18 minutes to make the mixture uniform; S2, 10.5 parts of SEBS9550, 13 parts of SEBS9552, 6 parts of maleic anhydride modified SEBS are put into the reaction kettle, heated to 160℃, and stirred until completely melted; S3, 10 parts of SA120 monomer resin, 13.5 parts of AMS110, 1.5 parts of KF399S rosin resin are added, heated to 155℃, and stirred for 35 minutes; S4, 0.6 parts of stearylamine, 0.4 parts of UV328 ultraviolet light absorber, 2 parts of antioxidant 1010, 1 part of antioxidant 168 are added, stirred for 12 minutes, and a uniform hot melt adhesive melt is obtained.

[0024] The application method of the damping shockproof sealing hot melt adhesive is as follows: the hot melt adhesive melt is coated on the contact part of the certain type of electrical components and the shell by coating equipment, and a damping shockproof sealing layer is formed after natural cooling and solidification.

[0025] Specifically: Raw material preparation: prepare each component raw material according to the formula, and ensure that the raw material ratio meets the requirements; Melt mixing: melt mixing of each component is completed in the reaction kettle according to steps S1 and S4 in the above examples, and a uniform hot melt adhesive melt is obtained; Coating construction: the hot melt adhesive melt is coated on the contact part of the electrical or electronic components and the shell by coating equipment (such as hot melt adhesive gun, automatic coating machine, etc.), and the coating thickness is controlled according to the vibration condition of the equipment and the sealing gap requirement; Cooling and solidification: after coating, it can be solidified after natural cooling for 1-2 minutes, forming a colloid layer with damping shockproof sealing function.

[0026] The application process is simple to operate and does not require complex equipment. The coating method and thickness can be flexibly adjusted according to production needs, and it is suitable for large-scale production or maintenance scenarios of various electrical and electronic equipment.

[0027] In this embodiment, SEBS9550 and SEBS9552 are used as the elastomer matrix, which can endow the hot melt adhesive with excellent elasticity and toughness, and is the core component for realizing the damping and shockproof performance; naphthenic oil 4010 and base oil 250N are used as plasticizers, which can improve the fluidity and flexibility of the system and enhance the buffering capacity of the hot melt adhesive; 70 microcrystalline wax is used to adjust the melting performance and hardness of the hot melt adhesive, and optimize the workability; SA120 monomer resin, AWS110 and KF399S rosin resin are used in cooperation to improve the viscosity, cohesion and heat resistance of the hot melt adhesive, and ensure the durability of the sealing effect; stearic amine (octadecylamine) is used to stabilize the system; UV328 ultraviolet light absorber, antioxidant 1010 and antioxidant 168 are used together to form an anti-aging system, which can effectively delay the performance degradation of the hot melt adhesive under light and heat environment, and prolong the service life.

[0028] Performance test, the hot melt adhesive prepared in the above embodiment is tested for performance, and compared with the traditional damping adhesive tape: Damping and shockproof test: the electrical equipment coated with the hot melt adhesive and the same equipment using the traditional damping adhesive tape are subjected to vibration test (amplitude 5mm, frequency 1050Hz), and the results show that the equipment coated with the hot melt adhesive has no obvious collision friction sound, while the equipment using the traditional adhesive tape has slight friction sound; Sealing performance test: using the air tightness test device, the sealing performance of the equipment coated with the hot melt adhesive reaches IP65 level, while the traditional adhesive tape only reaches IP54 level; Anti-aging test: the sample is placed in an ultraviolet aging oven (40W ultraviolet lamp, distance 30cm) and a heat aging oven (85℃) for 500 hours of aging test, and the damping performance and sealing performance retention rate of the hot melt adhesive after the test are both above 90%, while the performance of the traditional adhesive tape decays by more than 30%.

[0029] In summary, the damping and shockproof sealing hot melt adhesive and the application process thereof can effectively solve the problems of the traditional damping adhesive tape, and have significant advantages in damping and shockproof, sealing, anti-aging and convenient construction, and can be widely used in the field of damping and shockproof sealing between electrical equipment, electronic components and housings, and has good market application prospect. Example 2

[0030] The damping and shockproof sealing hot melt adhesive is prepared according to the following steps: S1, 23 parts of naphthenic oil 4010, 25 parts of base oil 250N and 5 parts of 70 microcrystalline wax are added to a reaction kettle, heated to 130℃, and stirred for 18 minutes to make the mixture uniform; S2, 12 parts of SEBS9550, 15 parts of SEBS9552, 5.5 parts of maleic anhydride modified SEBS are put into a reaction kettle, heated to 160℃, and stirred until completely melted; S3, 9 parts of SA120 monomer resin, 10 parts of AMS110, 1.5 parts of KF399S rosin resin are added, heated to 155℃, and stirred for 35 minutes; S4, 0.7 parts of stearylamine, 0.5 parts of UV328 ultraviolet light absorber, 2 parts of antioxidant 1010, 1 part of antioxidant 168 are added, stirred for 12 minutes, and a uniform hot melt adhesive melt is obtained; S5, the obtained hot melt adhesive melt is cooled and solidified to form a granular (such as Figure 1 ) or block product.

[0031] The application method of the damping shockproof sealing hot melt adhesive is: the granular or block product is heated and melted to obtain a hot melt adhesive melt, and then the hot melt adhesive melt is coated on the contact part of the electrical appliance or electronic component and the shell by coating equipment, and a damping shockproof sealing layer is formed after natural cooling and solidification.

[0032] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

[0033] In this specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features or characteristics can be combined in any one or more embodiments or examples in a suitable manner. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0034] Finally, it should be pointed out that the above is only the preferred embodiment of the present application, and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, and for the person skilled in the art, the technical scheme recorded in the foregoing embodiments can be modified without creative labor, or some technical features can be replaced. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A damping and shock-absorbing sealing hot melt adhesive, characterized in that, The damping and shock-absorbing sealing hot melt adhesive comprises the following components in parts by weight: 15 to 44 parts of naphthenic oil; 15–44 parts base oil; 2–10 parts microcrystalline wax; 5–15 parts monomer resin; 0–30 parts AMS; 0–35 parts rosin resin; 20–50 parts SEBS; 5–10 parts maleic anhydride modified SEBS; 0.5–2 parts stearylamine; 0.2–1 part ultraviolet absorber; 0.4–4 parts antioxidant.

2. The preparation process of the damping and shock-absorbing sealing hot melt adhesive according to claim 1, characterized in that, The naphthenic oil is naphthenic oil 4010; the base oil is base oil 250N; the microcrystalline wax is 70 microcrystalline wax; the monomer resin is SA120 monomer resin; the AMS is AMS110; the rosin resin is KF399S rosin resin; The ultraviolet light absorber is UV328 ultraviolet light absorber.

3. The damping and shock-absorbing sealing hot melt adhesive according to claim 2, characterized in that, The 20-50 parts of SEBS include: 10-25 parts of SEBS9550 and 10-25 parts of SEBS9552.

4. The damping and shock-absorbing sealing hot melt adhesive according to claim 3, characterized in that, The 0.4 to 4 parts of antioxidants include: 0.2 to 2 parts of antioxidant 1010 and 0.2 to 2 parts of antioxidant 168.

5. The damping and shock-absorbing sealing hot melt adhesive according to claim 4, characterized in that, The damping and shock-absorbing sealing hot melt adhesive comprises the following components in parts by weight: 20-40 parts naphthenic oil; 20-40 parts base oil; 3-8 parts microcrystalline wax; 8-12 parts monomer resin; 5-20 parts AMS; 1-10 parts rosin resin; 21-30 parts SEBS; 5-8 parts maleic anhydride modified SEBS; 0.6-1 part stearylamine; 0.3-0.5 parts ultraviolet light absorber; and 1-3.5 parts antioxidant.

6. The damping and shock-absorbing sealing hot melt adhesive according to claim 5, characterized in that, The damping and shockproof sealing hot melt adhesive comprises the following components in parts by weight: 22 parts naphthenic oil 4010; 22 parts base oil 250N; 4 parts 70 microcrystalline wax; 10 parts SA120 monomer resin; 13.5 parts AMS110; and 1.5 parts KF399S rosin resin. 10.5 parts SEBS9550; 13 parts SEBS9552; 6 parts maleic anhydride modified SEBS; 0.6 parts stearylamine; 0.4 parts UV328 ultraviolet light absorber; 2 parts antioxidant 1010; 1 part antioxidant 168.

7. The preparation process of the damping and shock-absorbing sealing hot melt adhesive according to any one of claims 1-6, characterized in that, The preparation process includes the following steps: S1. Add naphthenic oil, base oil, and microcrystalline wax to the reactor and stir for 15-20 minutes to ensure uniform mixing. S2. Add SEBS and maleic anhydride-modified SEBS into the reactor, heat to 140-160℃, and stir until completely melted; S3. Add monomer resin, AMS and rosin resin, heat to 150-160℃ and stir for 30-40 minutes. S4. Add stearylamine, UV absorber, and antioxidant, and stir for 10-15 minutes to obtain a uniform hot melt adhesive.

8. The preparation process of the damping and shock-absorbing sealing hot melt adhesive according to claim 7, characterized in that, The heating temperature in step S1 is 130°C.

9. The preparation process of the damping and shock-absorbing sealing hot melt adhesive according to claim 7, characterized in that, In step S3, the temperature is raised to 155°C and the stirring time is 35 minutes.

10. The application method of the preparation process of the damping and shock-absorbing sealing hot melt adhesive according to claim 7, characterized in that, The application method includes: applying hot melt adhesive molten material to the contact area between electrical or electronic components and the housing using a coating device, and then allowing it to cool and solidify naturally to form a damping and shockproof sealing layer.

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