Rectification gas homogenizing ring

By designing a rectifier gas equalization ring, the problem of poor gas equalization effect of the gas equalization ring in semiconductor thin film deposition equipment was solved, thereby improving the uniformity of airflow and thin film deposition.

CN121575375APending Publication Date: 2026-02-27PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
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Patent Information

Application Number
CN202511705922.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-19
Publication Date
2026-02-27

AI Technical Summary

Technical Problem

The gas uniformity effect of the gas uniformity ring in existing semiconductor thin film deposition equipment is not good, resulting in uneven film thickness on the wafer surface, requiring repeated nozzle adjustments and consuming a lot of manpower and resources.

Method used

Design a rectifier and gas equalization ring, comprising a gas equalization channel, a gas outlet channel, and a gas equalization layer. The gas equalization layer is provided with gas equalization rows and gas equalization holes distributed circumferentially. The diameter of the gas equalization holes varies depending on their position. By adding a gas equalization layer and arranging the gas equalization holes, the gas equalization and rectification effects are improved.

Benefits of technology

It significantly improves the uniformity of airflow, reduces flow non-uniformity, and enhances the uniformity and efficiency of thin film deposition.

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Abstract

The invention provides a rectifying gas uniformizing ring which comprises a gas uniformizing channel located on an outer ring and communicated with a gas inlet. The air outlet channel is positioned in the inner ring and is communicated with the plurality of air outlets; the gas uniformizing layer is positioned between the gas uniformizing channel and the gas outlet channel; wherein a plurality of gas uniformizing rows distributed in the circumferential direction are arranged in the gas uniformizing layer, each gas uniformizing row comprises a plurality of gas uniformizing holes distributed from top to bottom, and an inlet and an outlet of each gas uniformizing hole are formed in the radial direction of the gas uniformizing ring; the air uniformizing holes in the two adjacent air uniformizing rows are distributed in a staggered manner; in the plurality of gas uniformizing rows, the diameter of the gas uniformizing holes of the gas uniformizing row closer to the gas inlet is smaller.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment manufacturing, and more particularly to gas uniformity structures. Background Technology

[0002] In semiconductor thin film deposition equipment, the gas distribution ring on the HDP (High-density plasma) platform often exhibits poor gas distribution performance. For example, the flow velocity decreases with increasing distance between the gas outlet and inlet, while the dynamic pressure gradually decreases and the static pressure gradually increases. This results in inconsistent flow rates at each gas outlet on the distribution ring. In terms of process performance, the existing structure causes the wafer surface thin film thickness (THK) to exceed the specified standard (SPEC), resulting in jagged, uneven edges. This necessitates repeated nozzle adjustments, consuming significant manpower and resources.

[0003] The existing solution is to adjust the nozzle model to make the airflow inside the cavity more uniform. However, this method often requires multiple adjustments and consumes a lot of manpower and resources. Summary of the Invention

[0004] To overcome the shortcomings of the prior art, the present invention provides a rectifier gas equalization ring.

[0005] The rectifier and gas distribution ring includes, but is not limited to, the following components: An air distribution channel located on the outer ring is connected to an air inlet; An air duct located in the inner ring, the air duct being connected to a plurality of air outlets; and A uniform air layer located between the uniform air channel and the outlet air channel; The gas equalization layer has multiple gas equalization rows distributed circumferentially. Each gas equalization row includes multiple gas equalization holes distributed from top to bottom. The inlet and outlet directions of each gas equalization hole are placed radially along the gas equalization ring. The positions of the gas equalization holes in two adjacent gas equalization rows are staggered. Among the multiple gas equalization rows, the closer the gas equalization row is to the air inlet, the smaller the diameter of its gas equalization holes.

[0006] In one embodiment, each of the air-distributing holes is a cylindrical through hole.

[0007] In one embodiment, the diameter of the air distribution hole varies from 0.2 to 1 mm.

[0008] In one embodiment, each of the air distribution holes is a stepped hole, and the stepped through holes include large-diameter through holes and small-diameter through holes connected in a stepped manner.

[0009] In one embodiment, the large-diameter through-hole is connected to the uniform air passage, and the small-diameter through-hole is connected to the air outlet passage, wherein the diameter of the large-diameter through-hole is larger than the diameter of the small-diameter through-hole.

[0010] In one embodiment, the large-diameter through-holes of each of the air-uniforming holes have the same diameter, and the small-diameter through-holes of each of the air-uniforming holes are arranged according to the rule that the diameter decreases as they are closer to the air inlet.

[0011] In one embodiment, the diameter of the small-diameter through hole varies from 0.2 to 1 mm.

[0012] In one embodiment, for each of the stepped through holes, the ratio of the large aperture to the small aperture is such that the ratio decreases as the distance between the air distribution hole and the air inlet increases.

[0013] In one embodiment, the ratio varies from 1.1 to 1.5.

[0014] In one embodiment, the diameter variation rule of the air distribution holes is as follows: taking the air inlet as the starting position, the air distribution layer is divided into multiple regions along the circumference, and the diameter of the air distribution holes in the same region remains unchanged; the ratio of the diameter of the air distribution hole in the region farthest from the air inlet to the diameter of the air distribution hole in the region closest to the air inlet is in the range of 1.09-1.11 times.

[0015] In one embodiment, the diameter variation rule of the air distribution holes is as follows: taking the air inlet as the starting position, the air distribution layer is divided into multiple regions, and these multiple regions are numbered 1 to 12 in a counterclockwise direction, wherein regions numbered 1 and 12 are closest to the air inlet; wherein, the diameter of the air distribution holes between regions numbered 1 and 12 is 0.2 to 0.4 mm, the diameter of the air distribution holes at regions numbered 1 to 2 and 11 to 12 is 0.3 to 0.5 mm, the diameter of the air distribution holes at regions numbered 2 to 3 and 10 to 11 is 0.4 to 0.6 mm, the diameter of the air distribution holes at regions numbered 3 to 4 and 9 to 10 is 0.5 to 0.7 mm, the diameter of the air distribution holes at regions numbered 4 to 5 and 8 to 9 is 0.6 to 0.8 mm, the diameter of the air distribution holes at regions numbered 5 to 6 and 7 to 8 is 0.7 to 0.9 mm, and the diameter of the air distribution holes between regions numbered 6 and 7 is 0.8 to 1 mm.

[0016] The rectifying and equalizing ring of the present invention has both equalizing and rectifying effects. By adding an equalizing layer, and distributing equalizing holes along the axial and circumferential directions in the equalizing layer, the rectification effect is significantly improved. Moreover, the diameter of the equalizing holes in the equalizing layer varies depending on their position in the equalizing layer, which greatly enhances the equalizing effect and significantly improves the flow uniformity. Attached Figure Description

[0017] The above-described invention and the following detailed description will be better understood when read in conjunction with the accompanying drawings. It should be noted that the drawings are merely examples of the claimed invention. In the drawings, the same reference numerals represent the same or similar elements.

[0018] Figure 1 A schematic diagram of a gas distribution ring according to an embodiment of the present invention is shown; Figure 2 A partial schematic diagram of a gas distribution ring according to an embodiment of the present invention is shown, wherein box A shows a schematic diagram of a gas distribution row according to an embodiment of the present invention; Figure 3 A schematic diagram of the shape of the air distribution holes according to an embodiment of the present invention is shown; Figure 4 A schematic diagram of the shape of the air distribution holes according to an embodiment of the present invention is shown; Figure 5 A distribution diagram showing the overall uniform air pore diameter variation according to an embodiment of the present invention is shown; Figure 6a The pressure gradient of the gas distribution ring outlet channel in the prior art is shown; Figure 6b A static pressure distribution diagram of the outlet channel of the gas equalization ring according to an embodiment of the present invention is shown. Figure 7a The flow rate distribution at each orifice of the O2 gas path according to an embodiment of the present invention is shown; Figure 7b The diagram illustrates the flow distribution at each orifice of the SIH4 gas path according to an embodiment of the present invention.

[0019] Explanation of reference numerals in the attached figures

[0020] 101 Uniform Airway

[0021] 102 Uniform Gas Layer

[0022] 103 Exhaust Channel

[0023] 201 Uniform air holes

[0024] 401 large diameter through hole

[0025] 402 Small Diameter Through Hole Detailed Implementation

[0026] The following detailed description of the features and advantages of the present invention provides sufficient information for any person skilled in the art to understand and implement the invention. Furthermore, based on the specification, claims, and drawings disclosed herein, those skilled in the art can easily understand the related objectives and advantages of the invention. Although the description of the invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of the invention. To provide a thorough understanding of the invention, numerous specific details will be included in the following description. The invention may also be implemented without using these details. Moreover, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0029] It is understood that while terms such as "first," "second," and "third" may be used herein to describe various components, channels, assemblies, regions, layers, and / or parts, these components, channels, assemblies, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, assemblies, regions, layers, and / or parts. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0031] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0032] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0033] In existing technology, the distance between the air inlet position and each air outlet on the air distribution ring is different. The farther the air outlet is from the air inlet, the lower the flow velocity, the gradually decreasing dynamic pressure, and the gradually increasing static pressure. This results in different flow rates at each air outlet on the air distribution ring.

[0034] Figure 1 A schematic diagram of a gas equalization ring according to an embodiment of the present invention is shown. The gas equalization ring includes an outlet channel, a gas equalization layer, and a gas equalization channel. The outlet channel 103, the gas equalization layer 102, and the gas equalization channel 101 are all annular; the outlet channel 103 and the gas equalization channel 101 are circumferentially closed annular flow channels. The outlet channel 103 is located in the inner ring, the gas equalization channel 101 is located in the outer ring, and the gas equalization layer 102 is disposed between the gas equalization channel 101 and the outlet channel 103.

[0035] The air distribution channel 101 is connected to the air inlet.

[0036] For example, the inlet for gas A is connected to the gas distribution channel, and the inlet for gas B is also connected to the gas distribution channel. It should be noted that the inlets for gas A and gas B are not on the same level; they are located vertically. Figure 1 The diagram shows a cross-sectional view of the gas distribution ring where the gas inlet of gas A is located, in which the cross-section of the gas inlet pipe of gas A can be seen.

[0037] The air outlet 103 is connected to multiple air outlets. For example... Figure 1As shown, the outlet of gas A is connected to the outlet channel 103, and the outlet of gas B is also connected to the outlet channel 103. One gas can correspond to multiple outlets.

[0038] In one embodiment, one gas A outlet is located between two gas B outlets, and the three outlets can be arranged horizontally. One gas A outlet and two gas B outlets constitute a set of outlets, and multiple sets of outlets can be arranged around the inner wall of the gas distribution ring.

[0039] Figure 2 A partial schematic diagram of a gas distribution ring according to an embodiment of the present invention is shown. Figure 2 As shown, the gas uniformity layer 102 is located between the gas outlet 103 and the gas uniformity channel 101. Multiple gas uniformity channels are provided in the gas uniformity layer 102 to improve the flow uniformity of the gas outlets at different positions, thereby improving the coating uniformity and realizing rectification.

[0040] In one embodiment, the thickness L of the uniform gas layer is 5~19mm.

[0041] Figure 2 Box A shows a schematic diagram of a gas distribution array according to an embodiment of the present invention. The gas distribution layer of the present invention has a plurality of gas distribution arrays arranged circumferentially. Each gas distribution array is shown in box A. The gas distribution array has three gas distribution holes 201 distributed from top to bottom along the axial (Z-axis) direction of the gas distribution ring. The inlet and outlet directions of each gas distribution hole are radially positioned along the gas distribution ring.

[0042] It should be noted that a uniform air distribution channel of the present invention may include any number of uniform air distribution holes arranged from top to bottom.

[0043] In one embodiment, the diameters of the multiple air distribution holes in the same air distribution row are the same.

[0044] In one embodiment, the positions of the air distribution holes in two adjacent air distribution rows are staggered.

[0045] In one embodiment, the diameter of the air distribution holes is 0.6 mm.

[0046] Figure 3 A schematic diagram of the shape of the air-distributing holes according to an embodiment of the present invention is shown. Figure 3 As shown, each air distribution hole is a cylindrical through hole.

[0047] Figure 4 A schematic diagram of the shape of the air-distributing holes according to an embodiment of the present invention is shown. Figure 4As shown, the air distribution orifice is a stepped through-hole. This stepped through-hole includes a large-diameter through-hole 401 and a small-diameter through-hole 402, which are distributed in a stepped manner. The large-diameter through-hole 401 communicates with the air distribution channel, and the small-diameter through-hole 402 communicates with the air outlet channel. The diameter of the large-diameter through-hole 401 is larger than the diameter of the small-diameter through-hole 402. The diameter of each air distribution orifice decreases along the air distribution channel towards the air outlet channel, which can concentrate the airflow and reduce turbulence.

[0048] Figure 5 A distribution diagram showing the overall uniform pore diameter variation according to an embodiment of the present invention is shown. Figure 5 The arrow indicates the direction of gas flow from the inlet to the outlet.

[0049] For cylindrical through holes, the diameter d of the air distribution hole varies depending on its position in the air distribution layer. Specifically, among multiple air distribution rows, the closer the air distribution row is to the air inlet, the smaller the diameter of its air distribution hole (cylindrical through hole).

[0050] In one embodiment, for a cylindrical through hole, the diameter d of the air distribution hole varies from 0.2 to 1 mm.

[0051] In one embodiment, for stepped through-holes, the diameter of the large-diameter through-holes is the same, while the diameter d of the small-diameter through-holes varies depending on their location within the gas uniform layer. Specifically, among multiple gas uniform rows, the closer the gas uniform row is to the air inlet, the smaller the diameter of the small-diameter through-holes in the stepped through-holes.

[0052] In one embodiment, for stepped through-holes, the diameter d of the small-diameter through-hole varies from 0.2 to 1 mm.

[0053] In one embodiment, the diameter variation of the uniform air holes (or the diameter variation of the small-diameter through holes) follows the following rules: taking the air inlet as the starting position, the uniform air layer is divided into multiple regions along the circumference, and the diameter of the uniform air holes in the same region remains unchanged; the ratio of the diameter of the uniform air holes in the region farthest from the air inlet to the diameter of the uniform air holes in the region closest to the air inlet is in the range of 1.09-1.11 times.

[0054] The aforementioned "location of the uniform gas layer" refers to the ability to divide the uniform gas layer into multiple regions along the circumference, for example... Figure 5 As shown, the area is divided into 12 regions (numbered 1 to 12), with each region representing a different location within the uniform air layer. Regions numbered 1 and 12 are closest to the air inlet.

[0055] For example, the diameter d of the air distribution hole (for stepped through-holes, it is the diameter of the smaller diameter through-hole) varies from 0.2 to 1 mm depending on its location in the air distribution channel. Starting from the air inlet, groups 1 to 12 are numbered counterclockwise. The diameter of the air distribution holes between groups 1 and 12 is 0.2 to 0.4 mm; the diameter of the air distribution holes at groups 1 to 2 and 11 to 12 is 0.3 to 0.5 mm; the diameter of the air distribution holes at groups 2 to 3 and 10 to 11 is 0.4 to 0.6 mm; the diameter of the air distribution holes at groups 3 to 4 and 9 to 10 is 0.5 to 0.7 mm; the diameter of the air distribution holes at groups 4 to 5 and 8 to 9 is 0.6 to 0.8 mm; the diameter of the air distribution holes at groups 5 to 6 and 7 to 8 is 0.7 to 0.9 mm; and the diameter of the air distribution holes between groups 6 and 7 is 0.8 to 1 mm.

[0056] Of course, dividing the gas uniform layer into 12 regions is just an example. This invention can divide the gas uniform layer into any number of regions along the circumference. Each region can correspond to a specific diameter, such that the diameter of the air inlet increases with distance from the air inlet along the airflow direction.

[0057] In one embodiment, for stepped through-holes, the diameter of the large-diameter through-hole can also vary. For each stepped through-hole, there is a ratio between the large-diameter through-hole and the small-diameter through-hole, and this ratio decreases as the distance between the air distribution hole and the air inlet increases.

[0058] In one embodiment, the ratio varies from 1.1 to 1.5.

[0059] Figure 6a This illustrates the pressure gradient of a conventional gas distribution ring outlet channel in the prior art. For example... Figure 6a As shown, the outlet channel of a conventional uniform gas ring has a large pressure gradient.

[0060] Figure 6b A static pressure distribution diagram of the outlet channel of the gas distribution ring according to an embodiment of the present invention is shown. Figure 6b As shown, relative to Figure 6a Yellow-green pressure distribution, Figure 6b The pressure distribution exhibits a more pronounced and even distribution of green.

[0061] Figure 7a The diagram illustrates the flow rate distribution at each orifice of gas path A according to an embodiment of the present invention. Figure 7b The diagram illustrates the flow rate distribution at each orifice of the B gas path according to an embodiment of the present invention.

[0062] Combination Figures 7a-7b After the reactive gas enters the gas distribution ring, the airflow gradually increases from the near end to the far end of the air inlet due to the resistance and rectification effect of the air passage and the gas distribution hole. It is evenly distributed in each nozzle within a 360° range, thereby reducing the flow non-uniformity coefficient and improving the coating uniformity.

[0063] Table 1 shows a comparison of flow rate changes between a gas equalization ring and a conventional gas equalization ring according to an embodiment of the present invention. In this embodiment, gas A can be O2 gas, and gas B can be SiH4.

[0064] For each orifice in the O2 and SIH4 gas paths, the orifice diameter distribution is 0.3~0.9mm. Simulation results show that the flow uniformity is improved by 76% and 72%, respectively.

[0065]

[0066] Table 1

[0067] The terminology and expressions used above are for descriptive purposes only, and the invention should not be limited to these terms and expressions. The use of these terms and expressions does not mean excluding any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various modifications that may exist should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

[0068] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims.

[0069] Similarly, it should be noted that although the present invention has been described with reference to the specific embodiments described above, those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, any changes or modifications to the above embodiments within the scope of the essential spirit of the present invention will fall within the scope of the claims of this application.

Claims

1. A rectifier and gas-uniforming ring, characterized in that, include: An air distribution channel located on the outer ring is connected to an air inlet; An air duct located in the inner ring, the air duct being connected to multiple air outlets; as well as A uniform air layer located between the uniform air channel and the outlet air channel; The gas equalization layer has multiple gas equalization rows distributed circumferentially. Each gas equalization row includes multiple gas equalization holes distributed from top to bottom. The inlet and outlet directions of each gas equalization hole are placed radially along the gas equalization ring. The positions of the gas equalization holes in two adjacent gas equalization rows are staggered. Among the multiple gas equalization rows, the closer the gas equalization row is to the air inlet, the smaller the diameter of its gas equalization holes.

2. The rectifying and equalizing ring as described in claim 1, characterized in that, Each of the aforementioned air-distributing holes is a cylindrical through hole.

3. The rectifying and equalizing ring as described in claim 1, characterized in that, The diameter of the air distribution holes varies from 0.2 to 1 mm.

4. The rectifying and equalizing ring as described in claim 1, characterized in that, Each of the air-distributing holes is a stepped through-hole, which includes large-diameter through-holes and small-diameter through-holes connected in a stepped manner.

5. The rectifying and equalizing ring as described in claim 4, characterized in that, The large-diameter through hole is connected to the uniform air channel, and the small-diameter through hole is connected to the air outlet channel. The diameter of the large-diameter through hole is larger than the diameter of the small-diameter through hole.

6. The rectifying and equalizing ring as described in claim 4, characterized in that, The large-diameter through-holes of each of the air-uniforming holes have the same diameter, and the small-diameter through-holes of each of the air-uniforming holes are arranged according to the rule that the diameter decreases as they are closer to the air inlet.

7. The rectifying and equalizing ring as described in claim 6, characterized in that, The diameter of the small-diameter through hole varies from 0.2 to 1 mm.

8. The rectifier and gas-uniforming ring as described in claim 4, characterized in that, For each of the stepped through holes, the ratio of the large-diameter through hole to the small-diameter through hole is smaller as the distance between the air distribution hole and the air inlet increases.

9. The rectifier and gas equalization ring as described in claim 8, characterized in that, The ratio varies from 1.1 to 1.

5.

10. The rectifier and gas-uniforming ring as described in claim 1, characterized in that, The diameter variation rule of the air distribution holes is as follows: taking the air inlet as the starting position, the air distribution layer is divided into multiple regions along the circumference, and the diameter of the air distribution holes in the same region remains unchanged; the ratio of the diameter of the air distribution hole in the region farthest from the air inlet to the diameter of the air distribution hole in the region closest to the air inlet is in the range of 1.09-1.11 times.