Sensing device

Abstract

The invention provides a sensing device. The sensing device comprises a first shell, a sensing module and a sensing module fixing part, wherein the first shell is provided with three accommodating parts; the sensing module is provided with a printed circuit board assembly and a pressure sensor; the first accommodating portion accommodates and fixes the sensing module fixing member. The second accommodating part accommodates the sensing module. The third containing part and the second containing part are arranged side by side. A communicating hole is formed between the first accommodating part and the second accommodating part; and the pressure sensor is butted with the pressure channel of the sensing module fixing piece through the communicating hole. And the second accommodating part is filled with a solidified sealing body for packaging and fixing the printed circuit board assembly. According to the sensing device, the unique three-containing-part integrated lower shell and the sensing module fixing piece structure are adopted between the to-be-detected pipeline / inner cavity and the pressure sensor, a sealing unit with high integrity and high pressure resistance is constructed, and the leakproofness and long-term reliability of the device in a high-pressure-difference environment are remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of pressure sensing, in particular to a sensing device. BACKGROUND

[0002] The conventional detection device for monitoring the pressure inside the pipeline or fire extinguisher usually adopts a sealing structure (such as a sealing ring) to realize the isolation between the to-be-detected inner cavity and the pressure sensor. However, in actual application, especially in the environment with high pressure or severe pressure fluctuation, the static sealing structure is easy to fail due to material aging, assembly error or stress deformation, resulting in the decrease of the sealing property of the device, and even leakage. Once the pressure difference between the to-be-detected inner cavity and the monitoring device is too large, the sealing structure is difficult to maintain a reliable sealing state, which not only affects the accuracy of pressure measurement, but also may cause safety hazards, and reduces the overall reliability of the monitoring device. Therefore, how to design a pressure sensing device which can resist high pressure difference, ensure long-term reliable sealing, and is convenient for production assembly and function integration, has become a technical problem to be solved in the field. SUMMARY

[0003] In order to overcome the above defects, the technical scheme of the present application provides a novel sensing device, which adopts a unique three-receiving-part integrated lower shell and fixed sensing module fixing part structure between the to-be-detected pipeline / inner cavity and the pressure sensor, and constructs a sealing unit with high integrity and high pressure resistance, which significantly improves the sealing property and long-term reliability of the device in the environment with high pressure difference.

[0004] The present application provides a sensing device for monitoring the pressure in a high-pressure environment, comprising: a first shell; a sensing module comprising a printed circuit board assembly and a pressure sensor protruding on the printed circuit board assembly; a sensing module fixing part provided with an interface for communicating with a to-be-detected pressure source; The first shell comprises: a first receiving part for accommodating and fixing the sensing module fixing part; a second receiving part for accommodating the printed circuit board assembly; and a third receiving part arranged side by side with the second receiving part; The first receiving part is arranged below the second receiving part and the third receiving part, and a communication hole is arranged between the first receiving part and the second receiving part, and the pressure sensor is connected with the pressure channel of the sensing module fixing part through the communication hole; The second receiving part is filled with a solidified sealing body, and the solidified sealing body encapsulates and fixes the printed circuit board assembly in the second receiving part; The third receiving portion is formed by an integral molding process, thereby physically isolating the third receiving portion from the first receiving portion and the second receiving portion.

[0005] In one embodiment, the sensing module fixing component is a tee, which includes a common port for docking with the pressure sensor, a normally open port for connecting to the pressure source to be measured, and a normally closed port for sealing. The projection of the normally open portion in the Z direction is located within the region of the third receiving portion, and the projection of the normally closed portion in the Z direction is located within the region of the second receiving portion.

[0006] In one embodiment, the second receiving portion and the third receiving portion are separated by a partition; Raised reinforcing ribs are provided on the inner wall of the first housing located in the second receiving portion, and / or on the inner wall of the partition located in the second receiving portion.

[0007] In one embodiment, the surface of the reinforcing rib is provided with at least one groove in the Z direction.

[0008] In one embodiment, the partition is provided with a height marking line for indicating the filling height of the cured sealant.

[0009] In one embodiment, the third accommodating portion is used to accommodate a power supply battery, and the third accommodating portion is not connected to the first accommodating portion.

[0010] In one embodiment, the accommodating space of the second accommodating part is less than or equal to the accommodating space of the third accommodating part.

[0011] In one embodiment, the first receiving portion and the sensing module fixing member are integrally formed by inlay injection molding.

[0012] In one embodiment, the sensing module further includes: A sensor sealing ring is fitted onto the outside of the pressure sensor; A waterproof and breathable membrane covers the air inlet of the pressure sensor; and, A dustproof net is fixed to the pressure sensor by laser welding and presses the waterproof and breathable membrane tightly.

[0013] In one embodiment, the sensing module further includes: A temperature sensor is disposed on the printed circuit board assembly and is located on a different surface from the pressure sensor.

[0014] This application has at least the following advantages or beneficial effects: 1. The sensing device provided in this application establishes a highly reliable and easily assembled foundation for a pressure sensing device through a unique three-part integrated lower shell (first shell) and a fixing structure for the sensing module. Specific beneficial effects include: The first housing comprises three integrally formed housing sections: a first housing section, a second housing section, and a third housing section. This structure achieves clear functional zoning. The first housing section is dedicated to securing the pressure interface sensing module fixture, the second housing section serves as the core sensing and sealing chamber, and the third housing section provides independent space for other functions such as the battery. The integral molding process physically isolates the third housing section from the first and second housing sections (water isolation, electrical isolation, gas isolation, vibration isolation), ensuring the overall strength and dimensional accuracy of the structure and eliminating the leakage risks and alignment errors that may result from separate assembly.

[0015] The first receiving part is used to house and fix the sensing module fixture, which clarifies the fixed position of the pressure interface, so that the load from the pressure to be measured acts directly on the area of ​​the first receiving part, laying the foundation for overall pressure bearing.

[0016] The second housing is filled with a cured sealant that encapsulates and secures the printed circuit board assembly within it. By filling and curing sealant within this specific second housing, a rigid sealing block is formed that completely encapsulates and integrates the sensing module. This cured sealant not only provides an ultimate sealing barrier, but more importantly, it transmits and distributes the fluid pressure experienced by the pressure sensor to the sidewalls and bottom of the entire second housing, transforming the stress from a point to a surface, significantly improving the device's resistance to high pressure and preventing interface leakage.

[0017] 2. In the sensing device provided in this application, the sensing module fixing component is a three-way connector (the three-way connector can be set as a T-nut). The three-way connector optimizes the internal force transmission path and interface layout. The projected positional relationship of the sensing module fixing component and its various interfaces is clearly defined, directing the projection area of ​​the normally open portion, which bears the external high pressure, towards the structurally independent, sealant-free third receiving part, while directing the normally closed sealed end towards the second receiving part reinforced with a cured sealant. This layout cleverly utilizes the structural characteristics of different functional areas, guiding the main pressure load to act on the more robust and easily load-bearing area, further optimizing the internal stress distribution of the device under high pressure, and improving the overall structural robustness.

[0018] 3. In the sensing device provided in this application, the design of the reinforcing ribs significantly increases the rigidity and deformation resistance of the sidewall of the second receiving portion. At the same time, it greatly increases the contact surface area and mechanical bonding force between the solidified seal and the first housing, enabling the two to remain firmly bonded under long-term high-pressure loads and preventing peeling.

[0019] 4. The sensing device provided in this application further provides a key mechanical locking function to resist seal failure. The grooves on the surface of the reinforcing ribs and the liquid sealant, after curing, form a robust mechanical interlocking structure. When internal high pressure generates an upward thrust on the sealant block, the grooves effectively anchor the sealant, preventing any slight displacement or sliding at the interface, thus solving the problem of seal interface failure due to shear force under high pressure. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 An exploded view of the sensing device provided in the embodiments of this application; Figure 2 An exploded view of the sensing module in the sensing device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the internal structure of the first housing in the sensing device provided in the embodiments of this application; Figure 4 This is a top view of the internal structure of the first housing in the sensing device provided in the embodiments of this application; Figure 5 A schematic diagram showing the filling of housing sealant in the second receiving portion of the first housing in the sensing device provided in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the second receiving portion of the first housing in the sensing device provided in the embodiment of this application, cut along the Z direction.

[0022] icon: Sensing device 100: Shell 10: First shell 11, second shell 12; First receiving section 121, second receiving section 122, third receiving section 123, partition 124; reinforcing rib 122a, height marking line 122b; Sensing module 20: Printed circuit board assembly 21, pressure sensor 22, sensor sealing ring 23, waterproof and breathable membrane 24, dustproof mesh 25, temperature sensor 26; Sensing module mounting bracket 30: common port 31, normally open port 32, normally closed port 33; Power module 40: power supply battery 41, positive electrode cell 42, negative electrode cell 43; Switch module 50; Housing sealing module 60: Cured sealing body 61, housing sealing ring 62. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0028] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] Please see Figures 1-6 This application provides a sensing device 100 for monitoring the pressure inside a pipe or fire extinguisher.

[0030] In one embodiment of this application, the sensing device 100 includes: a first housing 11, a sensing module 20, and a sensing module fixing member 30. For example... Figure 1 and Figure 6 As shown, the sensing device 100 may include a housing 10 consisting of a first housing 11 and a second housing 12 that are detachably connected.

[0031] The sensing module 20 may include a printed circuit board assembly 21 and a pressure sensor 22 protruding from the printed circuit board assembly 21. The printed circuit board assembly 21 includes a PCB board and traces disposed on the PCB board, as well as packaged electronic components. The pressure sensor 22 may be protruding from the PCB board via soldering. The printed circuit board assembly 21 also has a chip capable of processing data and converting electrical signals into wireless signals for transmission to a data receiver. Figure 2 The sensing module 20 shown may also include: a sensor sealing ring 23, a waterproof and breathable membrane 24, a dustproof net 25, and a temperature sensor 26 arranged in sequence.

[0032] The sensing module holder 30 is used to fix the sensing module 20. The sensing module holder 30 is provided with an interface for communicating with the pressure source to be measured.

[0033] like Figure 1 and Figure 3As shown, the first housing 11 includes a first receiving portion 121, a second receiving portion 122, and a third receiving portion 123. The first receiving portion 121 is used to accommodate and fix the sensing module fixing member 30. The second receiving portion 122 is used to accommodate the printed circuit board assembly 21. The third receiving portion 123 is arranged side by side with the second receiving portion 122. The first receiving portion 121 is located below the second receiving portion 122 and the third receiving portion 123. A connecting hole is provided between the first receiving portion 121 and the second receiving portion 122, and the pressure sensor 22 is connected to the pressure channel of the sensing module fixing member 30 through the connecting hole. The second receiving portion 122 is filled with a cured sealing body 61, which encapsulates and fixes the printed circuit board assembly 21 within the second receiving portion 122.

[0034] Specifically, during installation, the pressure sensor 22 on the printed circuit board assembly 21 is aligned with the connecting hole between the first receiving portion 121 and the second receiving portion 122. Then, the printed circuit board assembly 21 is pressed down so that the pressure sensor 22 is completely submerged in the sensing module fixing member 30. Next, 20mm of epoxy resin is poured into the second receiving portion 122 to form a cured seal 61. When the sensing device 100 collects air pressure, the pressure sensor 22 experiences an upward thrust. Since the cured seal 61 in the sensing device 100 has solidified, the cured seal 61 and the pressure sensor 22 become a single unit, effectively resisting the upward thrust generated by air pressure and improving product reliability.

[0035] In this embodiment, a highly reliable and easily assembled pressure sensing device foundation is constructed through a unique three-part integrated lower shell (first shell 11) structure. Specific beneficial effects include: The first housing 11 includes an integrally formed first receiving portion 121, a second receiving portion 122, and a third receiving portion 123: this structure achieves clear functional partitioning. The first receiving portion 121 is dedicated to fixing the pressure interface sensing module fixture 30, the second receiving portion 122 serves as the core sensing and sealing chamber, and the third receiving portion 123 provides independent space for other functions such as the battery. The integral molding allows the third receiving portion 123 to be physically isolated from the first receiving portion 121 and the second receiving portion 122 (water isolation, electrical isolation, gas isolation, vibration isolation), ensuring the overall strength and dimensional accuracy of the structure and eliminating the leakage risk and alignment error that may be caused by separate assembly.

[0036] The first receiving portion 121 is used to house and fix the sensing module fixing member 30, which clarifies the fixed position of the pressure interface, so that the load from the pressure to be measured acts directly on the area of ​​the first receiving portion 121, laying the foundation for overall pressure bearing.

[0037] The second receiving portion 122 is filled with a cured sealant 61, which encapsulates and fixes the printed circuit board assembly 21 within the second receiving portion 122. By filling and curing sealant within this specific second receiving portion 122, a rigid sealing block is formed that completely encloses and integrates the sensing module 20. This cured sealant 61 not only provides an ultimate sealing barrier, but more importantly, it transmits and distributes the fluid pressure experienced by the pressure sensor 22 to the sidewalls and bottom of the entire second receiving portion 122, realizing a transformation from point-based force to surface-based pressure bearing, greatly improving the device's ability to resist high pressure and prevent interface leakage.

[0038] Please see Figure 1 , Figure 3 , Figure 5 and Figure 6 In one embodiment, the sensing module fixing member 30 is a three-way member (the three-way member can be set as a T-nut), which includes a common port 31 for docking with the pressure sensor 22, a normally open port 32 for connecting to the pressure source to be measured, and a normally closed port 33. The projection of the normally open port 32 in the Z direction is located in the region of the third receiving portion 123, and the projection of the normally closed port 33 in the Z direction is located in the region of the second receiving portion 122.

[0039] In this embodiment, the normally open 32 is the inlet of the external high-pressure medium, bearing the greatest pressure impact and fluctuations. Projecting it onto the third receiving portion 123 means that the most important pressure input point is spatially aligned and isolated vertically from the core sensing sealing unit located in the second receiving portion 122. Physical isolation (water isolation, gas isolation, electrical isolation, vibration isolation) ensures that after the high-pressure load enters the sensing device 100, its initial force transmission path is guided to the third receiving portion 123 region, mainly composed of the first housing 11. This is equivalent to setting up a structural buffer for the high-pressure impact, utilizing the strength and stiffness of the housing itself for the first stage of absorption and dispersion, thereby preventing the high-pressure fluid energy from directly and frontally impacting the core potting seal and the fragile sensor welding points. This significantly reduces the risk of fatigue failure of the sealing interface due to direct exposure to high-pressure pulses.

[0040] 2. The normally closed port 33, as the closed end of the tee's pressure chamber, exhibits a tendency to slightly expand outwards under internal pressure. The second receiving portion 122 is the area where epoxy resin sealant (cured sealant 61) is poured to form a high-strength cured body. Projecting the normally closed port 33 onto the second receiving portion 122 ensures that the normally closed port 33 is no longer backed by an ordinary cavity or thin wall, but rather by a highly rigid composite structure formed by the cured sealant and the shell. This provides a solid support wall for the normally closed port 33, greatly suppressing any minor deformation under pressure and ensuring the geometric stability of the entire tee's internal pressure chamber. A stable chamber is the foundation for accurate and long-term measurements by the pressure sensor.

[0041] 3. Assume that the third housing 123 is used to house batteries or other components that may generate heat, while the second housing 122 is a precision electronic sensing area. The technical solution in this embodiment can also achieve thermal management and vibration isolation. By vertically grouping the high-pressure fluid inlet opening 32 and functional units such as batteries in the same projection area of ​​the third housing 123, and placing the sensing module 20 in the projection area of ​​the second housing 122, the main heat source / interference source, the high-pressure fluid which may carry temperature changes, and the core signal acquisition unit are essentially vertically partitioned in spatial structure. This layout effectively blocks the heat that may be transmitted by the high-pressure pipeline or the vibration caused by fluid pulsation, directly affecting the pressure and temperature sensors, thereby improving the stability and accuracy of signal acquisition.

[0042] In this embodiment, the sensing module fixing member 30 is a three-way connector (the three-way connector can be set as a T-nut). The three-way connector optimizes the internal force transmission path and interface layout. The projection position relationship of the sensing module fixing member 30 and its various interfaces is clearly defined. The projection area of ​​the normally open portion 32, which bears the external high pressure, is directed towards the structurally independent, sealant-free third receiving portion 123, while the normally closed sealed end 33 is directed towards the second receiving portion 122 reinforced with a cured sealant. This layout cleverly utilizes the structural characteristics of different functional areas, guiding the main pressure load to act on a more robust and easily load-bearing area, further optimizing the internal stress distribution of the device under high pressure and improving the overall structural robustness.

[0043] Please see Figure 3 , Figure 4 and Figure 6 In one embodiment, the second receiving portion 122 and the third receiving portion 123 are separated by a partition 124. The partition 124, located on the inner wall of the first housing 11 of the second receiving portion 122 and / or on the side wall of the second receiving portion 122, is provided with raised reinforcing ribs 122a. The number of reinforcing ribs 122a can be one or more.

[0044] In this embodiment, the long-term structural stability and sealing durability of the sensing device 100 are further enhanced. The design of the reinforcing rib 122a significantly increases the rigidity and deformation resistance of the sidewall of the second receiving portion 122. At the same time, it greatly increases the contact surface area and mechanical bonding force between the cured seal and the first housing 11, enabling them to remain firmly bonded under long-term high-pressure loads and preventing peeling.

[0045] In one embodiment, the surface of the reinforcing rib 122a is provided with at least one groove in the Z direction. This embodiment further provides a crucial mechanical locking function to resist seal failure. The groove on the surface of the reinforcing rib 122a, after curing with the liquid sealant, forms a robust mechanical interlocking structure. When internal high pressure generates an upward thrust on the sealant block, the groove effectively anchors the sealant, preventing any slight displacement or sliding at the interface, thereby solving the problem of seal interface failure due to shear force under high pressure.

[0046] Please see Figure 6 In one embodiment, the partition 124 is provided with a height indicator line 122b for indicating the filling height of the cured sealant 61. The height of the height indicator line 122b can be set to 60%-95% of the overall height of the first housing 11 in the Z-axis direction. In one embodiment, the height of the height indicator line 122b is 20 mm.

[0047] In this embodiment, the uniformity of product sealing quality and the controllability of production can be ensured. The height marking line 122b provides an intuitive and accurate quantitative reference for the dispensing process, ensuring that the volume and coverage of the cured sealant in each product are consistent, thereby ensuring reliable reproduction of sealing performance and avoiding sealing weaknesses caused by insufficient glue or internal stress problems caused by excessive glue.

[0048] In one embodiment, the third receiving portion 123 is used to receive the power supply battery 41, and the third receiving portion 123 is not connected to the first receiving portion 121. The power module 40 includes the power supply battery 41, the positive electrode cell 42, and the negative electrode cell 43, all of which are disposed in the third receiving portion 123.

[0049] In this embodiment, functional safety isolation and space optimization are achieved. The power module 40 is independently disposed in the third receiving portion 123, completely physically isolated from the second receiving portion 122 where potting and sealing are performed. This avoids any possible contact risk between the battery and the sealant, improving electrical safety, and allows battery replacement and maintenance without interfering with the core sealing structure, while also optimizing the internal space layout of the device. In one embodiment, the space of the second receiving portion 122, which serves as the core sealing area, is no larger than that of the third receiving portion 123, which serves as the battery compartment. While ensuring the space required for the sealing function, sufficient and potentially larger space is reserved for the power supply or other extended functions, making the overall structural design more balanced and practical.

[0050] In one embodiment, the first receiving portion 121 and the sensing module fixing member 30 are integrally formed by inlay injection molding.

[0051] In this embodiment, the sensing device 100 achieves extremely simplified assembly, leak-free connection, and ultra-high connection strength. Through an inlay injection molding process, the materials of the sensing module fixing member 30 and the first housing 11 are bonded at the molecular level, completely eliminating any assembly gaps at this critical interface and achieving absolute sealing. Simultaneously, the inlay injection molding process between the first receiving portion 121 and the sensing module fixing member 30 provides a connection strength far exceeding that of threaded or press-fit connections.

[0052] In one embodiment, the sensing module 20 further includes: a sensor sealing ring 23, a waterproof and breathable membrane 24, and a dustproof mesh 25.

[0053] A sensor sealing ring 23 is fitted around the outside of the pressure sensor 22, surrounding it to prevent adhesive leakage and achieve an initial seal. A waterproof and breathable membrane 24 covers the air inlet of the pressure sensor 22. A dustproof mesh 25 is laser-welded to the pressure sensor 22, pressing the waterproof and breathable membrane 24 firmly. The adhesive side of the waterproof and breathable membrane 24 is adhered to the edge of the air inlet of the pressure sensor 22, while the dustproof mesh 25 is laser-welded to the edge of the pressure sensor. By pressing the waterproof and breathable membrane 24 between the pressure sensor 22 and the dustproof mesh 25, dust and water can be effectively prevented from entering the interior of the pressure sensor 22.

[0054] In this embodiment, advanced and reliable micro-environmental protection is provided for the pressure sensor 22. The combination of the laser-welded dustproof mesh 25 and the waterproof and breathable membrane 24 constitutes refined protection for the sensor's pressure-sensing diaphragm. Laser welding ensures the secure installation and edge sealing of the protective mesh, effectively blocking dust, oil, and liquid water, while allowing for lossless transmission of gas pressure, greatly improving the long-term stability and service life of the pressure sensor 22 in harsh environments. In this embodiment, the design of the sensing module 20 makes the sensing device 100 applicable to all types of fire extinguishers (such as dry powder, water-based, and pure gas fire extinguishers).

[0055] In one embodiment, the sensing module 20 further includes a temperature sensor 26 disposed on the printed circuit board assembly 21 and located on a different surface from the pressure sensor 22.

[0056] In this embodiment, the monitoring dimensions and data value of the device are expanded. The addition of a temperature sensor 26, strategically placed on the printed circuit board, enables simultaneous and accurate monitoring of temperature and pressure. This multi-parameter acquisition capability provides a richer data foundation for equipment condition diagnosis, environmental analysis, and process control, increasing the added value of the product.

[0057] In one embodiment, the sensing device 100 also supports sleep and wake-up control modes. When the sensing device 100 detects that the pressure value of the pressure sensor 22 is stable, it collects pressure data every 60 seconds. At this time, the sensing device 100 is in sleep control mode, which can save power.

[0058] When the sensing device 100 detects a change in the pressure value of the pressure sensor 22, it can upload data within 10ms or issue an alarm in the software. At this time, the sensing device 100 is in the wake-up control mode.

[0059] In one embodiment, the sensing device 100 also has a power monitoring function, which prompts for battery replacement when the voltage is low. The power monitoring function monitors data by detecting the battery voltage.

[0060] In one embodiment, the sensing device 100 further includes a switch module 50. The switch module 50 uses a magnetic switch to control the operation of the pressure sensor 22, reducing the number of openings inside the housing 10 and enabling the sensing device 100 to achieve an IP68 waterproof and dustproof rating. When a magnet approaches the switch module 50 (magnetic switch), the indicator light on the switch module 50 flashes twice, the sensing device 100 is fully turned on, the pressure sensor 22 begins monitoring the pressure value, and the printed circuit board assembly 21 begins processing the monitoring data from the pressure sensor 22.

[0061] Please see Figure 1 , Figure 2 , Figure 5 andFigure 6 The sensing device 100 includes: a housing 10, a sensing module 20, a sensing module fixing member 30, and a housing sealing module 60.

[0062] The housing 10 includes a first housing 11 and a second housing 12, which are sealed by a housing sealing ring 62.

[0063] The first housing 11 includes a first receiving portion 121, a second receiving portion 122, and a third receiving portion 123. The first receiving portion 121, the second receiving portion 122, and the third receiving portion 123 can be integrally formed or formed separately. The first receiving portion 121 is disposed away from the second housing 12. The second receiving portion 122 and the third receiving portion 123 are disposed close to the second housing 12, and the tops of the second receiving portion 122 and the third receiving portion 123 are sealed to the bottom of the second housing 12 by a housing sealing ring 62.

[0064] A connecting hole is provided between the first receiving portion 121 and the second receiving portion 122. No connecting hole is provided between the first receiving portion 121 and the third receiving portion 123. The second receiving portion 122 and the third receiving portion 123 are arranged parallel to each other in the Z direction. In the Z direction, the bottoms of the second receiving portion 122 and the third receiving portion 123 can be set at the same height, and the tops of the second receiving portion 122 and the third receiving portion 123 can also be set at the same height. The receiving space of the second receiving portion 122 is less than or equal to the receiving space of the third receiving portion 123.

[0065] In one embodiment, the sensing module fixing member 30 includes a tee, for example, a T-nut. The sensing module fixing member 30 includes a common port 31, a normally open port 32, and a normally closed port 33. The common port 31 is located as a connecting hole between the first receiving portion 121 and the second receiving portion 122. The first receiving portion 121 is used to receive the normally open port 32 and the normally closed port 33 of the T-nut. The normally open port 32 and the normally closed port 33 extend in the Y direction. In the Z direction, the normally open port 32 is located in the projection area of ​​the third receiving portion 123; the normally closed port 33 is located in the projection area of ​​the second receiving portion 122. During use, the normally open port 32 communicates with the cavity to be measured (the inside of the pipe to be monitored or the inside of the fire extinguisher). The normally closed port 33 is sealed by a sealing element. The common port 31 is connected to the sensing module 20, specifically the pressure sensor 22. The first receiving portion 121 and the sensing module fixing member 30 can be integrally formed. For example, when the first housing 11 is molded, the T-nut is placed at the position of the first receiving part 121, and after molding, the first receiving part 121 and the T-nut are embedded together.

[0066] In one embodiment, the second receiving portion 122 and the third receiving portion 123 may be separated by a partition 124. The partition 124 may also serve as a battery compartment isolation assembly. The inner wall of the first housing 11 located in the second receiving portion 122 has reinforcing ribs 122a, and / or the side wall of the partition 124 located in the second receiving portion 122 has reinforcing ribs 122a. The reinforcing ribs 122a may be provided with grooves to increase friction when the second receiving portion 122 is filled with the cured sealant 61 (which may be epoxy resin). The inner wall of the first housing 11 located in the second receiving portion 122, and / or the side wall of the partition 124 located in the second receiving portion 122, is provided with height marking lines 122b to indicate the filling height of the cured sealant 61.

[0067] The sensing module 20 includes: a printed circuit board assembly 21, a pressure sensor 22, a sensor sealing ring 23, a waterproof and breathable membrane 24, and a dustproof mesh 25. The pressure sensor 22 is fixedly mounted on the first surface of the printed circuit board assembly 21 by welding. The sensor sealing ring 23 is fitted onto the outer wall of the pressure sensor 22. The waterproof and breathable membrane 24 is attached to the edge of the air inlet of the pressure sensor 22. The dustproof mesh 25 is laser-welded to the edge of the pressure sensor 22, pressing the waterproof and breathable membrane 24 between the pressure sensor 22 and the dustproof mesh 25, effectively preventing dust and water from entering the pressure sensor 22.

[0068] Temperature sensor 26 is disposed on the second surface of printed circuit board assembly 21. The first surface of printed circuit board assembly 21 contacts the inner bottom wall of the first housing 11 of the second receiving portion 122. Pressure sensor 22, sensor sealing ring 23, waterproof and breathable membrane 24, and dustproof mesh 25 are exposed to the first receiving portion 121 through the connecting hole between the first receiving portion 121 and the second receiving portion 122. Sensing module fixing member 30 includes: a common port 31, a normally open port 32, and a normally closed port 33. Common port 31 is located in the connecting hole between the first receiving portion 121 and the second receiving portion 122. Pressure sensor 22, sensor sealing ring 23, waterproof and breathable membrane 24, and dustproof mesh 25 are located within common port 31.

[0069] The housing sealing module 60 includes a housing sealing ring 62 and a cured sealant 61. The housing sealing ring 62 is disposed between the second housing 12 and the first housing 11 to achieve a positioning seal between the second housing 12 and the first housing 11. The cured sealant 61 is poured into the second receiving portion 122. The height marking line 122b is used to indicate the pouring height of the cured sealant 61. When the finished sensing device 100 is used to collect the gas pressure of the pipeline / fire extinguisher, the pressure sensor 22 will have an upward thrust. Since the cured sealant 61 in the finished sensing device 100 has solidified, the cured sealant 61 and the pressure sensor 22 become a whole. That is, the solid cured sealant 61 will be subjected to an upward thrust. Adding grooves on the reinforcing rib 122a can effectively resist the upward thrust generated by the gas pressure and improve the reliability of the product.

[0070] The sensing device 100 provided in this embodiment uses a double-layer seal between the inner cavity of the pipe / fire extinguisher to be detected and the pressure sensor, which is achieved by a sensor sealing ring 23 and a cured sealing body 61. At the same time, the printed circuit board assembly is encapsulated inside the epoxy resin sealant, which has high reliability and can ensure the airtightness of the device.

[0071] In one embodiment, the distance between the projection of the outer edge of the normally open 32 in the Z direction and the projection of the center of the common opening 31 in the Z direction is d1; the distance between the projection of the outer edge of the normally closed opening 33 in the Z direction and the projection of the center of the common opening 31 in the Z direction is d2. d1 > d2 can be set to buffer the instantaneous pressure value when the sensing device 100 is installed to the pressure source to be measured. For example, d1:d2 = 5.5:4.5, 6:4, 6.5:3.5, 7:3, etc. When setting the values ​​of d1:d2, the design space of the power module 40 should also be considered (such as the length, width, and height of the power supply battery 41, and the installation positions of the positive electrode battery 42 and the negative electrode battery 43, etc.).

[0072] In this embodiment, the d1>d2 design is an asymmetrical lever arm structure, which mainly brings the following two beneficial effects: Firstly, it can optimize the internal stress distribution and improve the reliability of the pressure sensor 22 (sensing module 20): The normally open 32 is the working interface for actually connecting the high-pressure source. Fluid pressure will act on the cavity of the sensing module fixing member 30 through the normally open 32 and finally be transmitted to the pressure sensor 22 and the solidified seal 61. Therefore, the normally open 32 is a major stress point. By making d1>d2, it is equivalent to setting the major stress point (normally open 32) further away from the core common port 31 and the printed circuit board assembly 21, pressure sensor 22 and solidified seal 61 in the second receiving part 122 in the Z direction. The d1>d2 design increases the lever arm for the pressure load to be transmitted to the pressure sensor 22 and the solidified seal 61. According to the principles of mechanics, this helps to distribute the concentrated pressure more evenly across the entire sensing module fixing member 30 and the housing structure of the first receiving part 121 of the first housing 11, rather than directly impacting the pressure sensor mounting area at close range. This reduces the risk of localized stress and potential micro-deformation in the pressure sensor 22 and its surrounding sealing structure due to direct exposure to high-pressure impact, thereby improving measurement accuracy and structural durability under long-term pressure cycling. On the other hand, it improves the layout of external connection pipelines and reduces installation stress. The normally open end 32 connects to external high-pressure pipelines. These external connection pipelines can be application pipelines of the sensing device 100, such as gas pipelines, fire pipelines, fire extinguisher optical paths, etc., pipelines requiring pressure testing. A larger d1 means that the interface has more axial space outside the device. This allows for a larger bending radius or more flexible routing space for external connection pipe fittings or pipes during installation, avoiding sharp bends due to limited space, thus preventing additional installation stress directly acting on the interface. The d1>d2 design reduces the impact of external mechanical stresses (such as lateral tension and bending moment) introduced by improper on-site installation on the core sensing sealing module inside the device, improving the product's robustness in practical applications.

[0073] In this embodiment, the d1>d2 design is a strategy to optimize mechanical performance through spatial geometry. By moving the high-voltage input point further away, it cleverly guides potential concentrated stress to a more robust shell structure to bear it, while also facilitating external connections, thereby enhancing the overall reliability of the device from both internal stress and external interference perspectives.

[0074] In one embodiment, the accommodating space of the second accommodating portion 122 is less than or equal to the accommodating space of the third accommodating portion 123.

[0075] In this embodiment, the accommodating space of the second accommodating part 122 is less than or equal to the accommodating space of the third accommodating part 123, which can achieve the following beneficial effects: 1. Precise functional zoning and efficient space utilization; 2. Enhanced structural rigidity and isolation of interference.

[0076] Beneficial effect 1: On the one hand, the second receiving portion 122, i.e., the core sealing area, has a small area: its dimensions are precisely calculated to accommodate the sensing module 20 and fill the necessary amount of cured sealant 61 within a minimal but sufficient space. This compact space ensures that the cured sealant 61 forms a dense, bubble-free coating during infusion and curing, reducing the risk of internal stress or shrinkage cracking due to excessive or uneven colloid thickness. Smaller space also means a shorter colloid curing path and more uniform curing performance.

[0077] On the other hand, the third receiving section 123, i.e., the extended functional area, has a large area: it provides a definite and sufficient space to accommodate a large battery. At the same time, this large space can just accommodate a three-way branch with a longer connecting channel (usually the extended distance between the normal opening 32 and the common opening 31).

[0078] The synergistic effect of the two area settings: the longer connecting channel on the sensing module mounting member 30 (T-joint or T-nut) can naturally extend and occupy part of the depth space of the third receiving portion 123. This allows the depth of the first receiving portion 121 to not be too deep to accommodate the long channel, thus maintaining the overall miniaturization trend of the device. In other words, the large size of the third receiving portion is not only for the battery, but also for the design freedom reserved to optimize the internal flow channel structure of the sensing module mounting member 30 (T-joint or T-nut).

[0079] Beneficial effect 2: On the one hand, the longer connecting channel itself acts as a structural reinforcing rib, enhancing the overall rigidity of the sensing module mounting bracket 30 (T-joint or T-nut) and the area it occupies. Placing this long channel within the relatively independent and spacious projection area of ​​the third receiving portion 123 allows for better physical isolation between it and the delicate electronic components (sensing module 20 and its constituent elements) and the solidified seal 61 within the second receiving portion 122. This helps reduce interference to the sensor signal caused by vibrations that may be transmitted through the housing due to fluid flow or pressure pulsations.

[0080] On the other hand, separating the power module 40, which may generate thermal or electromagnetic interference, from the sensing module 20 into two separate spaces also conforms to good electromagnetic compatibility and thermal design principles.

[0081] The spatial division of the second and third receiving sections 122 into one large and one small section is not arbitrary, but precisely matched with the asymmetrical flow channel (d1>d2) design inside the sensing module fixing component 30 (T-joint or T-nut). This collaborative design achieves: 1. a compact and efficient core sealing area; 2. ample design space for the extended function power module 40 and external connection pipelines; 3. enhanced overall structural rigidity; and 4. minimized interference between different functional modules. It embodies a high-level design philosophy that considers space, structure, and function as an integrated whole, starting from the overall system.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A sensing device for monitoring pressure in a high-pressure environment, characterized in that, include: First shell (11); The sensing module (20) includes a printed circuit board assembly (21) and a pressure sensor (22) protruding from the printed circuit board assembly (21). The sensing module fixture (30) is provided with an interface for communicating with the pressure source to be measured; The first housing (11) includes: The first receiving part (121) is used to receive and fix the sensing module fixing member (30). The second receiving portion (122) is used to receive the printed circuit board assembly (21); and, The third receiving section (123) is arranged side by side with the second receiving section (122); The first receiving part (121) is disposed below the second receiving part (122) and the third receiving part (123), and a communication hole is provided between it and the second receiving part (122). The pressure sensor (22) is connected to the pressure channel of the sensing module fixing member (30) through the communication hole. The second receiving portion (122) is filled with a cured sealant (61), which encapsulates and fixes the printed circuit board assembly (21) within the second receiving portion (122); The third receiving portion (123) is formed by an integral molding process, so that the third receiving portion (123) is physically isolated from the first receiving portion (121) and the second receiving portion (122).

2. The sensing device according to claim 1, characterized in that, The sensing module fixing part (30) is a three-way part, which includes a common port (31) that connects to the pressure sensor (22), a normally open port (32) for connecting to the pressure source to be measured, and a normally closed port (33) that is sealed. The projection of the normally open (32) in the Z direction is located within the area of ​​the third receiving portion (123), and the projection of the normally closed (33) in the Z direction is located within the area of ​​the second receiving portion (122).

3. The sensing device according to claim 1, characterized in that, The second receiving portion (122) and the third receiving portion (123) are separated by a partition (124); Protruding reinforcing ribs (122a) are provided on the inner wall of the first housing (11) in the second receiving part (122) and / or on the inner wall of the partition (124) in the second receiving part (122).

4. The sensing device according to claim 3, characterized in that, In the Z direction, the surface of the reinforcing rib (122a) is provided with at least one groove.

5. The sensing device according to claim 3, characterized in that, The partition (124) is provided with a height marking line (122b) for indicating the filling height of the cured sealant (61).

6. The sensing device according to claim 1, characterized in that, The third receiving portion (123) is used to receive the power supply battery (41), and the third receiving portion (123) is not connected to the first receiving portion (121).

7. The sensing device according to claim 1, characterized in that, The accommodating space of the second accommodating part (122) is less than or equal to the accommodating space of the third accommodating part (123).

8. The sensing device according to claim 1, characterized in that, The first receiving part (121) and the sensing module fixing part (30) are integrally formed by inlay injection molding.

9. The sensing device according to claim 1, characterized in that, The sensing module (20) also includes: The sensor sealing ring (23) is fitted onto the outside of the pressure sensor (22); A waterproof and breathable membrane (24) covers the air inlet of the pressure sensor (22); and, The dustproof net (25) is fixed to the pressure sensor (22) by laser welding and presses the waterproof and breathable membrane (24) together.

10. The sensing device according to claim 1, characterized in that, The sensing module (20) also includes: A temperature sensor (26) is disposed on the printed circuit board assembly (21) and is located on a different surface from the pressure sensor (22).

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