Multi-pin connector butt joint device for testing power semiconductor device

Abstract

The invention relates to the technical field of semiconductor device testing, in particular to a power semiconductor device testing multi-pin connector butt joint device which comprises a female head module used for being connected with a testing machine. The male head module is used for being connected with a power semiconductor device to be tested, and the male head module is matched with the female head module; the driving module is connected with the female head module or the male head module so as to drive the female head module and the male head module to realize butt joint or separation; the compensation module comprises a guide assembly and a first floating assembly, the guide assembly is arranged between the male head module and the female head module, the first floating assembly is arranged between the female head module and the testing machine table, and the first floating assembly is used for enabling the whole female head module to have the floating capacity; the position error between the male head module and the female head module is compensated, so that the possibility that the male head module and the female head module are damaged is reduced, and the effect of reducing the production and maintenance cost is achieved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor device testing, and in particular to a multi-pin connector mating device for testing power semiconductor devices. Background Technology

[0002] Currently, in the research, development, and production testing of power semiconductor devices, it is essential to accurately measure the various electrical performance parameters of the device under test (DUT) by connecting them to the testing system via reliable signal paths. These signal paths typically include low-voltage, low-current signals such as the gate, source, and drain terminals used to control the switching states of the device, as well as high-current signals that carry the device's workload. In typical testing scenarios, these signals need to be transmitted from a dedicated fixture (such as a pin tray or test PCB) carrying the DUT to the DC test board of the testing machine.

[0003] In related technologies, to achieve the aforementioned signal connections, the industry commonly uses customized multi-pin connectors that match specific models of the device under test (DUT). During the testing process, when it is necessary to replace a different model of DUT, the standard operating procedure requires the operator to first manually unplug the currently used connector from the testing machine, and then manually plug in another set of connectors that matches the new model of the device.

[0004] Regarding the aforementioned technologies: multi-pin header connectors, especially high-density connectors, typically have very delicate and fragile signal pins and sockets. Frequent manual insertion and removal operations, due to the difficulty in precisely controlling the force and angle, can easily lead to pin bending, deformation, wear, or even breakage, thereby directly damaging expensive connectors and increasing production and maintenance costs. Summary of the Invention

[0005] To reduce production and maintenance costs, this application provides a multi-pin connector mating device for testing power semiconductor devices.

[0006] This application provides a multi-pin connector mating device for testing power semiconductor devices, which adopts the following technical solution: A device for testing multi-pin connector mating of power semiconductor devices includes: The female connector module is used to connect to the testing machine. A male connector module is used to connect to the power semiconductor device under test, and the male connector module is compatible with the female connector module; A drive module is connected to the female connector module or the male connector module to drive the female connector module and the male connector module to dock or disconnect; The compensation module includes a guide component and a first floating component. The guide component is disposed between the male connector module and the female connector module, and the first floating component is disposed between the female connector module and the testing machine. The first floating component is used to enable the entire female connector module to float in order to compensate for the positional error between the male connector module and the female connector module.

[0007] By adopting the above technical solution, the female connector module connects to the testing equipment, and the male connector module connects to the power semiconductor device under test. The two are compatible, enabling electrical signal connection and transmitting the test signals from the power semiconductor device to the testing equipment for testing. The drive module connects to either the female or male connector module, driving them to connect or disconnect. This facilitates testing of different power semiconductor devices without the need for manual plugging and unplugging, simplifying operation, reducing the workload of changing tooling, and lowering the risk of connector damage, thus reducing production and maintenance costs. Furthermore, the first floating component gives the female connector module overall floating capability. During the docking process, if there is a positional error between the male and female connector modules, the female connector module can adjust its position by floating to compensate for the error. Combined with the guiding effect of the guide component, this ensures accurate docking of the male and female connector modules, improving the docking success rate and contributing to better test results.

[0008] Optionally, the female head module includes a support frame, a female head base, and multiple female head pins disposed on the female head base. The support frame is connected to the drive module, the female head base is disposed on the support frame through the first floating component, the multiple female head pins are arranged in an array on the female head base, and the female head pins are electrically connected to the testing machine platform. The male connector module includes a male connector base and multiple male connector pins disposed on the male connector base. The multiple male connector pins are arranged in an array on the male connector base. The male connector pins are used for electrical connection with the power semiconductor device under test. The male connector pins correspond one-to-one with the female connector pins and can be electrically connected. The guide assembly includes several guide pins, which are respectively disposed on the male head base. The female head base has guide holes, and the number of guide holes is equal to the number of guide pins and they are arranged in a one-to-one correspondence.

[0009] By adopting the above technical solution, the female connector is electrically connected to the testing equipment, and the male connector is electrically connected to the power semiconductor device under test (DUT). The male and female connectors are one-to-one and electrically connected, facilitating the electrical signal connection between the DUT and the testing equipment, thus aiding in the testing of the power semiconductor device. A first floating component is positioned between the female connector base and the testing equipment, giving the female connector module overall floating capability. This compensates for positional errors between the male and female connector modules, ensuring successful docking even with some positional deviation, improving the success rate and stability of the docking. A guide pin is positioned on the male connector base, with a corresponding guide hole on the female connector base. During docking, the guide pin inserts into the guide hole, providing guidance and further ensuring accurate docking of the male and female connector modules, ensuring stable electrical signal transmission, and improving the accuracy and reliability of the test.

[0010] Optionally, the female head base is provided with a stepped groove, the first floating component includes a limiting member and a first elastic member, the limiting member is adapted to the stepped groove, the limiting member slides through the stepped groove and is connected to the support frame, the first elastic member is disposed in the stepped groove, and the first elastic member is connected to the inner wall of the stepped groove and the support frame respectively.

[0011] By adopting the above technical solution, the limiting component adapts to the stepped groove and slides through the stepped groove to connect to the testing machine. This facilitates the limitation of the vertical movement range and horizontal floating range of the female head base using the limiting component. The first elastic component is disposed within the stepped groove and connected to both the inner wall of the stepped groove and the testing machine, enabling an elastic connection between the female head base and the testing machine. When the male and female head modules are docked, positional errors may occur. In this case, the first elastic component can undergo elastic deformation, causing the female head base to displace relative to the testing machine, thus giving the female head module overall floating capability. This compensates for the positional error between the male and female head modules, ensuring accurate docking and improving the stability and reliability of electrical signal connection.

[0012] Optionally, the compensation module includes a second floating component and a third floating component. The second floating component is disposed in the female head base and connected to multiple female head pins respectively. The second floating component is used to enable the female head pins to float. The third floating component is disposed in the male head base and connected to multiple male head pins respectively. The third floating component is used to enable the male head pins to float.

[0013] By adopting the above technical solution, a second floating component is set in the female connector base and connected to multiple female connector pins, enabling the female connector pins to float. A third floating component is set in the male connector base and connected to multiple male connector pins, enabling the male connector pins to float. This effectively compensates for the cumulative positional errors caused by manufacturing tolerances and installation errors when the male and female connector modules are connected, reduces the difficulty of connection and wear caused by positional deviations, helps to improve the success rate and stability of male and female connector connection, ensures stable and accurate electrical signal connection, and thus improves the reliability and efficiency of power semiconductor device testing.

[0014] Optionally, the second floating component and the third floating component have the same structure. The second floating component includes a fixed sleeve and a plurality of positioning claws. The fixed sleeve is disposed inside the female head base. The number of fixed sleeves is equal to the number of female head pins and they are arranged in a one-to-one correspondence. The female head pins pass through the fixed sleeves and are provided with protrusions. The plurality of positioning claws are arranged around the female head pins inside the fixed sleeves. One end of the positioning claw is connected to the inner wall of the fixed sleeve, and the other end of the positioning claw is spaced apart from the inner wall of the fixed sleeve and abuts against the protrusions.

[0015] By adopting the above technical solution, the fixing sleeve is set inside the female connector base and the number of fixing sleeves is equal to that of the female connector pins and they correspond one-to-one. The female connector pins pass through the fixing sleeves, and the protrusions on them abut against the multiple positioning claws arranged around them. One end of the positioning claws is connected to the inner wall of the fixing sleeve, and the other end is spaced apart. This allows the female connector pins and male connector pins to have floating ability in their respective bases, which can offset the cumulative positional error between different pins and ensure accurate docking of the male connector pins and female connector pins. This helps to improve the stability and reliability of electrical signal connection, reduce connection problems caused by pin position deviation, and thus optimize the testing effect of the multi-pin connector docking device for power semiconductor device testing.

[0016] Optionally, the second floating component includes a telescopic sleeve and multiple positioning claws. The telescopic sleeve is disposed on the female head base, with one end extending to the side of the female head base near the male head base. The number of telescopic sleeves is equal to the number of female head pins and they are arranged in a one-to-one correspondence. The female head pins pass through the telescopic sleeves and have protrusions. The multiple positioning claws are disposed around the female head pins within the telescopic sleeves, and each positioning claw abuts against the protrusion. When the telescopic sleeve is in the extended state, it constrains the positioning claws. When the telescopic sleeve is in the retracted state, it releases the constraint of the positioning claws.

[0017] By adopting the above technical solution, telescopic sleeves are set on the female connector base, and their number is equal to that of the female connector pins, with each pin corresponding to the other. The female connector pins pass through the telescopic sleeves. When the telescopic sleeves are in the extended state, they constrain the positioning claws that surround the female connector pins and abut against the protrusions on the pins, keeping the positioning claws stable and preventing the female connector pins from shaking or shifting, thus ensuring the accurate position of the female connector pins in the initial state. When the telescopic sleeves are in the retracted state, the constraint on the positioning claws is released, allowing the positioning claws to undergo certain displacement changes according to the actual situation. This provides the female connector pins with floating capability, which can offset the cumulative positional errors between different female connector pins, ensuring better electrical connection between the male and female connector pins, improving the accuracy and stability of the connection, and thus ensuring the normal operation of the multi-pin connector connection device for power semiconductor device testing and the accuracy of semiconductor device testing.

[0018] Optionally, the positioning claw is made of shape memory alloy material, and the positioning claw is configured to retract when the temperature rises to increase the clamping force on the female pin.

[0019] By adopting the above technical solution, the positioning claw is made of shape memory alloy material and is designed to contract when the temperature rises. During the power semiconductor device testing process, heat is generated as the test proceeds, causing the temperature to rise. Due to the shape memory alloy properties, the positioning claw contracts, thereby increasing the clamping force on the female pin. This ensures the stability and reliability of the female pin connection, reduces test errors and instability caused by loose connections, and thus improves the accuracy and effectiveness of power semiconductor device testing.

[0020] Optionally, the telescopic sleeve includes a fixed part and a movable part. The fixed part is disposed on the female head base, and the female head pin passes through the fixed part. The movable part is coaxially sleeved on the fixed part, and one end of the movable part extends out of the female head base near the male head base. A second elastic element is disposed between the fixed part and the movable part. The positioning claw is disposed in the fixed part and slidably connected to the movable part.

[0021] By adopting the above technical solution, when the male connector module and the female connector module are docked, the male connector module squeezes the movable part. After being subjected to force, the movable part overcomes the elastic force of the second elastic element and retracts. Since the positioning claw is slidably connected to the movable part, the retraction of the movable part can drive the positioning claw to move. This allows the positioning claw to make corresponding position adjustments according to the docking state of the male connector module and the female connector module, so that the female connector pin has floating capability. This can offset the cumulative positional error between different pins, ensuring accurate and stable electrical connection between the male connector pin and the female connector pin, and improving the docking accuracy and stability of the multi-pin connector docking device for testing power semiconductor devices.

[0022] Optionally, a clearance groove is provided on the fixed part corresponding to the position of the positioning claw, a guide block is provided on the inner wall of the movable part, and a guide surface is provided on the positioning claw. The guide block is slidably inserted into the clearance groove and fits against the guide surface. When the movable part extends, the guide block can push the positioning claw against the female pin through the guide surface.

[0023] By adopting the above technical solution, when the movable part extends, the guide block on the inner wall of the movable part slides in the clearance groove of the fixed part and fits against the guide surface of the positioning claw. This causes the movement of the guide block to generate a component force that pushes the positioning claw to press against the female pin, thereby enhancing the clamping stability of the positioning claw on the female pin, ensuring the positional accuracy of the female pin during use, and thus improving the stability and reliability of the electrical signal connection when the male and female modules are connected.

[0024] Optionally, a conductive element is provided at one end of the movable part near the fixed part, and a detection contact is provided inside the female head base. When the female head base and the male head base come into contact, the movable part retracts, and the conductive element abuts against the detection contact.

[0025] By adopting the above technical solution, when the female and male connector bases come into contact, the movable part will retract, causing the conductive part to abut against the detection contact. This facilitates the detection of whether the female and male connector bases have made successful contact, thereby helping to determine whether the multi-pin connector mating device for power semiconductor device testing has completed the mating process. This ensures the reliability of electrical signal connection and provides accurate connection status feedback for the testing of power semiconductor devices, which is beneficial to improving the accuracy and efficiency of testing.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. The drive module enables the female and male connector modules to automatically connect or disconnect, reducing the workload of workers changing tooling and also reducing the risk of connector damage, thereby helping to reduce production and maintenance costs; 2. Through the cooperation of the first floating component, the second floating component, and the third floating component, the female connector module can be adjusted in position by floating, and the female and male connector pins can also float. This can effectively compensate for the cumulative positional error caused by manufacturing tolerances and installation errors when the male and female connector modules are connected, reduce the difficulty of connection and wear caused by positional deviation, help improve the success rate and stability of the connection between the male and female connector pins, ensure stable and accurate electrical signal connection, and thus improve the reliability and efficiency of power semiconductor device testing. 3. Through the cooperation of the telescopic sleeve and the positioning claw, it is ensured that the test system is allowed to output high voltage / high current only when the physical connection is completely reliable, thus fundamentally eliminating the safety risks caused by blind testing. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of a power semiconductor device testing multi-pin connector mating device according to Embodiment 1 of this application.

[0028] Figure 2 This is a schematic diagram of the structure of the female head module in Embodiment 1 of this application.

[0029] Figure 3 This is a schematic diagram of the male header module in Embodiment 1 of this application.

[0030] Figure 4 This is a side view of a power semiconductor device testing multi-pin connector mating device according to Embodiment 1 of this application.

[0031] Figure 5 It is along Figure 4 A partial structural cross-sectional view of line AA in the middle.

[0032] Figure 6 This is a schematic diagram of the structure of the female pin and the second floating component in Embodiment 1 of this application.

[0033] Figure 7 It is along Figure 6 A structural cross-sectional view of the BB line in the middle.

[0034] Figure 8 This is a partial structural cross-sectional view of the mother head module and the second floating component in Embodiment 2 of this application.

[0035] Explanation of reference numerals in the attached figures: 1. Female connector module; 11. Support frame; 12. Female connector base; 121. Guide hole; 122. Stepped groove; 123. Detection contact; 13. Female connector pin; 131. Protrusion; 2. Male connector module; 21. Male connector base; 22. Male connector pin; 3. Drive module; 4. Compensation module; 41. Guide assembly; 411. Guide pin; 42. First floating assembly; 421. Limiting component; 422. First elastic component; 43. Second floating assembly; 431. Fixing sleeve; 432. Positioning claw; 4321. Guide surface; 433. Telescopic sleeve; 4331. Fixing part; 4332. Moving part; 4333. Second elastic component; 4334. Relief groove; 4335. Guide block; 434. Conductive component; 44. Third floating assembly; 5. Test machine. Detailed Implementation

[0036] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0037] This application discloses a device for testing multi-pin connector mating for power semiconductor devices.

[0038] It should be noted that, in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] Example 1: Refer to Figure 1 and Figure 2 A multi-pin connector mating device for testing power semiconductor devices includes a female connector module 1, a male connector module 2, a drive module 3, and a compensation module 4. The female connector module 1 is used to connect to a testing machine 5, and the male connector module 2 is used to connect to the power semiconductor device under test. The female connector module 1 and the male connector module 2 are adapted to be mated to achieve electrical signal connection.

[0040] The drive module 3 includes a cylinder, which enables the drive module 3 to drive the female head module 1 to move closer to or away from the male head module 2, thereby realizing the docking or separation of the female head module 1 and the male head module 2.

[0041] In another preferred embodiment, the drive module 3 can also be connected to the male connector module 2 to drive the male connector module 2 to move closer to or further away from the female connector module 1.

[0042] The female connector module 1 includes a support frame 11, a female connector base 12, and multiple female connector pins 13 mounted on the female connector base 12. The support frame 11 is connected to the drive module 3. The female connector base 12 is movably mounted on the support frame 11, and the multiple female connector pins 13 are arranged in an array on the female connector base 12, which facilitates the neat and orderly connection of the various signal lines of the test bench 5. In this embodiment, the female connector base 12 is made of a material with certain strength and insulation properties, such as plastic or ceramic, thereby ensuring insulation between the female connector pins 13 and from the outside world, preventing signal interference. The female connector pins 13 are electrically connected to the test bench 5, typically using a soldering or plug-in connection method.

[0043] Reference Figure 4 and Figure 5 The male connector module 2 includes a male connector base 21 and multiple male connector pins 22 disposed on the male connector base 21. The multiple male connector pins 22 are arranged in an array on the male connector base 21, and the male connector pins 22 are used for electrical connection with the power semiconductor device under test. Each male connector pin 22 corresponds one-to-one with a female connector pin 13 and is electrically connected. When the male connector module 2 and the female connector module 1 are connected, the male connector pins 22 are inserted into the corresponding positions of the female connector pins 13, making the male connector pins 22 and female connector pins 13 electrically connected, thereby establishing a signal path from the power semiconductor device under test to the test equipment 5.

[0044] In this embodiment, the male connector base 21 also needs to have good insulation and a certain strength, and its material selection can be similar to that of the female connector base 12.

[0045] Reference Figure 5 The compensation module 4 includes a guide component 41, a first floating component 42, a second floating component 43, and a third floating component 44. The guide component 41 includes several guide pins 411, which are fixedly connected to the male connector base 21. In this embodiment, multiple guide pins 411 are provided, each located on one side of the male connector base 21. Each guide pin 411 is a cylindrical metal rod with a smooth surface, and the end of the guide pin 411 furthest from the male connector base 21 has a tapered design.

[0046] The female head base 12 has guide holes 121. The number of guide holes 121 is equal to the number of guide pins 411 and they are set one by one. The guide holes 121 are adapted to the guide pins 411, making it easier for the guide pins 411 to be inserted into the guide holes 121.

[0047] The female head base 12 has a stepped groove 122. The first floating component 42 includes a limiting member 421 and a first elastic member 422. The limiting member 421 is adapted to the stepped groove 122 and slides through the stepped groove 122 and is connected to the support frame 11. In this embodiment, the limiting member 421 uses an equal-height screw, so that the head of the limiting member 421 engages with the stepped surface of the stepped groove 122, restricting the vertical position of the female head base 12. At the same time, a gap is left between the rod of the limiting member 421 and the inner wall of the stepped groove 122, allowing the female head base 12 to move in the horizontal direction.

[0048] The first elastic element 422 is disposed in the stepped groove 122, and the first elastic element 422 is connected to the inner wall of the stepped groove 122 and the support frame 11 respectively. In this embodiment, the first elastic element 422 is a spring. When the female head base 12 is subjected to an external force, the spring will be compressed or stretched, thereby realizing the floating of the female head base 12.

[0049] Reference Figure 5 and Figure 6 The second floating component 43 includes a fixed sleeve 431 and a plurality of positioning claws 432. The fixed sleeve 431 is installed inside the female head base 12, and the number of fixed sleeves 431 is equal to the number of female head pins 13, with one female head pin 13 passing through one fixed sleeve 431.

[0050] Reference Figure 5 and Figure 7The female pin 13 has an integrally formed protrusion 131. Multiple positioning claws 432 are arranged around the female pin 13 within the fixing sleeve 431, and are inclined within the fixing sleeve 431. One end of each positioning claw 432 is fixedly connected to the inner wall of the fixing sleeve 431, while the other end is spaced apart from the inner wall of the fixing sleeve 431 and abuts against the protrusion 131. In this embodiment, the positioning claws 432 are elastic metal sheets, allowing the female pin 13 a certain amount of floating space within the fixing sleeve 431, while ensuring that the female pin 13 does not detach from the fixing sleeve 431.

[0051] Multiple positioning claws 432 work together to form a structure that can adaptively adjust the position of the female pin 13. When the female module 1 and the male module 2 are docked, if there is a certain positional deviation between the male pin 22 and the female pin 13, the female pin 13 can move slightly under the constraint of the positioning claws 432, so that the male pin 22 and the female pin 13 can dock smoothly, thereby increasing the docking flexibility and success rate, and reducing the requirements for manufacturing and assembly precision.

[0052] In practical applications, even if there is a certain positional deviation between the male pin 22 and the female pin 13, the female pin 13 will not be subjected to excessive stress, thereby reducing the risk of pin damage. Moreover, for different batches or models of power semiconductor devices under test, as long as the layout and size of their male pins 22 are within a certain range, good docking can be achieved through a floating design.

[0053] The structure and working principle of the third floating component 44 are similar to those of the second floating component 43, which enables the male pin 22 to also have floating capability. Thus, when the male module 2 and the female module 1 are docked, both the male pin 22 and the female pin 13 can be finely adjusted according to the actual situation, further improving the accuracy and stability of the docking.

[0054] The implementation principle of the multi-pin connector mating device for testing power semiconductor devices in this application embodiment is as follows: During testing, the power semiconductor device under test is mounted on a test fixture, and its gate, source, and other test signal pins are connected to each male pin 22 through internal wiring such as a pin plate. When the test begins, the drive module 3 activates, driving the female connector base 12 to approach the male connector base 21 via the support frame 11.

[0055] During the docking process, the guide pin 411 first enters the guide hole 121 to perform preliminary coarse positioning of the female head base 12 and the male head base 21. At this time, if there is an overall positional deviation between the female head base 12 and the male head base 21, the female head base 12 will shift as a whole to accommodate the positional deviation. At the same time, the first elastic element 422 will be compressed or stretched.

[0056] As the docking progresses, each male pin 22 aligns with and is inserted into the female pin 13. During this process, if there is a slight positional deviation between the male pin 22 and the female pin 13, the positioning claw 432 operates, allowing the male pin 22 and the female pin 13 to float independently and adjust their positions. This fine-tunes and compensates for the cumulative error between individual contacts, thereby achieving precise and reliable full docking of multiple male pins 22 and multiple female pins 13, and completing the electrical signal connection.

[0057] After the test, drive module 3 reverses its movement, smoothly separating female connector module 1 and male connector module 2, ready for the next test cycle. The entire process is fully automated, requiring no manual intervention, ensuring high reliability of the connection while improving testing efficiency.

[0058] Example 2: Refer to Figure 5 and Figure 8 The difference between this embodiment and embodiment 1 is that the second floating component 43 is different.

[0059] In this embodiment, the second floating component 43 includes a telescopic sleeve 433 and a plurality of positioning claws 432. The number of telescopic sleeves 433 is equal to the number of female pins 13, and one female pin 13 passes through one telescopic sleeve 433.

[0060] The telescopic sleeve 433 includes a fixed part 4331 and a movable part 4332. The fixed part 4331 is installed inside the female head base 12, and the female head pin 13 passes through the fixed part 4331. The movable part 4332 is coaxially sleeved on the fixed part 4331 and slidably connected to the fixed part 4331, and one end of the movable part 4332 extends out of the female head base 12 near the male head base 21. In this embodiment, both the movable part 4332 and the fixed part 4331 are made of insulating material.

[0061] A second elastic element 4333, which is a spring, is provided between the fixed part 4331 and the movable part 4332. In the separated state, the second elastic element 4333 pushes the movable part 4332 to the extended position at the front end, so that the end face of the movable part 4332 is higher than the tip of the female needle 13, thus providing protection.

[0062] Multiple positioning claws 432 are arranged around the female pin 13 within the fixed part 4331, and each positioning claw 432 abuts against the protrusion 131. A guide surface 4321 is provided on each positioning claw 432. A clearance groove 4334 is provided on the fixed part 4331, and a guide block 4335 is fixedly connected to the inner wall of the movable part 4332. The guide block 4335 slides into the clearance groove 4334 and fits against the guide surface 4321.

[0063] When the movable part 4332 is in the extended state, the guide block 4335 presses against the guide surface 4321 on the positioning claw 432 through the relief groove 4334, forcing the positioning claw 432 to clamp inward and firmly fix the female pin 13 in the theoretical center position. At this time, the female pin 13 is in a rigid locked state and has no floating ability, which is conducive to precise alignment before docking.

[0064] When the devices are docked, the front end face of the movable part 4332 first contacts the male base 21 and is pressed in the opposite direction, overcoming the elastic force of the second elastic element 4333 and entering a retracted state. As the movable part 4332 retracts, the guide block 4335 on it disengages from the guide surface 4321 of the positioning claw 432, releasing the radial constraint on the positioning claw 432. At this time, the positioning claw 432 returns to a flexible clamping state, and the female pin 13 also gains floating ability, which can compensate for alignment errors and realize a flexible connection.

[0065] In this embodiment, the positioning claw 432 is made of shape memory alloy material, and the positioning claw 432 is designed to retract when the temperature rises to increase the clamping force on the female pin 13. During actual testing, when the test current passes through the female pin 13, the female pin 13 will heat up and the temperature will rise. At this time, the positioning claw 432 retracts, further improving the fixing effect on the female pin 13.

[0066] Reference Figure 1 and Figure 8 A conductive element 434, which can be a metal sheet, is provided at one end of the movable part 4332 near the fixed part 4331. A detection contact 123 is provided inside the female connector base 12. When the female connector base 12 and the male connector base 21 contact each other, the movable part 4332 retracts, causing the conductive element 434 to contact the detection contact 123, thus closing a detection circuit. The testing machine 5 can accurately determine whether the connector has physically completed the connection and is in a reliable state by monitoring the continuity of this circuit. Only after receiving a "connection complete" signal will the testing machine 5 activate the high-voltage or high-current output, thereby avoiding the risk of "blind testing" in cases of incomplete connection and eliminating safety hazards such as arcing and electric shock.

[0067] The implementation principle of Example 2 is as follows: Before docking, the fixing part 4331 extends and locks the female pin 13, achieving rigid alignment. During docking, the fixing part 4331 retracts, releasing the female pin 13 and allowing it to float to compensate for errors. After docking, the conductive part 434 contacts the detection contact 123, sending a "positioned" signal to allow the test to begin. During the test, if the device heats up due to high current, the positioning claw 432 will automatically increase the clamping force to ensure stable connection. This solution integrates three major functions: a rigid-flexible alignment mechanism, thermal response-enhanced clamping, and hardware safety interlocking, comprehensively improving the efficiency, reliability, and safety of the test connection.

[0068] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A device for testing multi-pin connector mating in power semiconductor devices, characterized in that, include: The female connector module (1) is used to connect to the test machine (5); The male connector module (2) is used to connect to the power semiconductor device under test, and the male connector module (2) is compatible with the female connector module (1); The drive module (3) is connected to the female connector module (1) or the male connector module (2) to drive the female connector module (1) and the male connector module (2) to dock or separate. The compensation module (4) includes a guide component (41) and a first floating component (42). The guide component (41) is disposed between the male head module (2) and the female head module (1). The first floating component (42) is disposed between the female head module (1) and the test machine (5). The first floating component (42) is used to enable the entire female head module (1) to float in order to compensate for the positional error between the male head module (2) and the female head module (1).

2. The power semiconductor device testing multi-pin connector mating device according to claim 1, characterized in that: The female head module (1) includes a support frame (11), a female head base (12), and multiple female head pins (13) disposed on the female head base (12). The support frame (11) is connected to the drive module (3). The female head base (12) is disposed on the support frame (11) through the first floating component (42). The multiple female head pins (13) are arranged in an array on the female head base (12). The female head pins (13) are electrically connected to the test machine (5). The male connector module (2) includes a male connector base (21) and multiple male connector pins (22) disposed on the male connector base (21). The multiple male connector pins (22) are arranged in an array on the male connector base (21). The male connector pins (22) are used to electrically connect with the power semiconductor device under test. The male connector pins (22) correspond one-to-one with the female connector pins (13) and can be electrically connected. The guide assembly (41) includes a plurality of guide pins (411), which are respectively disposed on the male head base (21). The female head base (12) is provided with guide holes (121). The number of guide holes (121) is equal to the number of guide pins (411) and they are arranged in a one-to-one correspondence.

3. The power semiconductor device testing multi-pin connector mating device according to claim 2, characterized in that: The female head base (12) is provided with a stepped groove (122). The first floating component (42) includes a limiting member (421) and a first elastic member (422). The limiting member (421) is adapted to the stepped groove (122). The limiting member (421) slides through the stepped groove (122) and is connected to the support frame (11). The first elastic member (422) is disposed in the stepped groove (122). The first elastic member (422) is connected to the inner wall of the stepped groove (122) and the support frame (11) respectively.

4. The power semiconductor device testing multi-pin connector mating device according to claim 2, characterized in that: The compensation module (4) includes a second floating component (43) and a third floating component (44). The second floating component (43) is disposed in the female head base (12) and connected to multiple female head pins (13) respectively. The second floating component (43) is used to enable the female head pins (13) to float. The third floating component (44) is disposed in the male head base (21) and connected to multiple male head pins (22) respectively. The third floating component (44) is used to enable the male head pins (22) to float.

5. The power semiconductor device testing multi-pin connector mating device according to claim 4, characterized in that: The second floating component (43) and the third floating component (44) have the same structure. The second floating component (43) includes a fixed sleeve (431) and a plurality of positioning claws (432). The fixed sleeve (431) is disposed inside the female head base (12). The number of fixed sleeves (431) is equal to the number of female head pins (13) and they are arranged in a one-to-one correspondence. The female head pins (13) pass through the fixed sleeve (431). The female head pins (13) are provided with protrusions (131). The plurality of positioning claws (432) are arranged around the female head pins (13) inside the fixed sleeve (431). One end of the positioning claw (432) is connected to the inner wall of the fixed sleeve (431), and the other end of the positioning claw (432) is spaced apart from the inner wall of the fixed sleeve (431) and abuts against the protrusions (131).

6. The power semiconductor device testing multi-pin connector mating device according to claim 4, characterized in that: The second floating component (43) includes a telescopic sleeve (433) and a plurality of positioning claws (432). The telescopic sleeve (433) is disposed on the female head base (12). One end of the telescopic sleeve (433) extends to the side of the female head base (12) near the male head base (21). The number of telescopic sleeves (433) is equal to the number of female head pins (13) and they are arranged in a one-to-one correspondence. The female head pins (13) pass through the telescopic sleeves (433). The head pin (13) is provided with a protrusion (131), and a plurality of positioning claws (432) are arranged around the female head pin (13) inside the telescopic sleeve (433). The plurality of positioning claws (432) respectively abut against the protrusion (131). When the telescopic sleeve (433) is in the extended state, the telescopic sleeve (433) applies a constraint to the positioning claws (432). When the telescopic sleeve (433) is in the retracted state, the constraint of the positioning claws (432) is released.

7. The power semiconductor device testing multi-pin connector mating device according to claim 6, characterized in that: The positioning claw (432) is made of shape memory alloy material and is configured to contract when the temperature rises to increase the clamping force on the female pin (13).

8. The power semiconductor device testing multi-pin connector mating device according to claim 6, characterized in that: The telescopic sleeve (433) includes a fixed part (4331) and a movable part (4332). The fixed part (4331) is disposed on the female head base (12). The female head pin (13) passes through the fixed part (4331). The movable part (4332) is coaxially sleeved on the fixed part (4331). One end of the movable part (4332) extends out of the female head base (12) and is close to the male head base (21). A second elastic element (4333) is disposed between the fixed part (4331) and the movable part (4332). The positioning claw (432) is disposed in the fixed part (4331) and is slidably connected to the movable part (4332).

9. The power semiconductor device testing multi-pin connector mating device according to claim 8, characterized in that: The fixed part (4331) has a clearance groove (4334) corresponding to the position of the positioning claw (432). The inner wall of the movable part (4332) is provided with a guide block (4335). The positioning claw (432) is provided with a guide surface (4321). The guide block (4335) slides into the clearance groove (4334) and fits against the guide surface (4321). When the movable part (4332) extends, the guide block (4335) can push the positioning claw (432) against the female pin (13) through the guide surface (4321).

10. The power semiconductor device testing multi-pin connector mating device according to claim 8, characterized in that: The movable part (4332) is provided with a conductive element (434) at one end near the fixed part (4331). The female base (12) is provided with a detection contact (123). When the female base (12) and the male base (21) come into contact, the movable part (4332) retracts and the conductive element (434) abuts against the detection contact (123).

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