Heating core body, heater and manufacturing method of heating core body

Abstract

The invention relates to a heating core, a heater and a manufacturing method of the heating core. The heating core body comprises an injection molding outer frame and a heating assembly, the heating assembly and the injection molding outer frame are adjacently arranged, the heating assembly comprises an edge wrapping frame, a heating chip and a substrate, the heating chip and the substrate are both embedded in the edge wrapping frame, the surface of the substrate is parallel to the surface of the heating chip, and the surfaces of the substrate and the heating chip are attached to each other. A side sealing piece is arranged on the side wall of the heating chip and located in the edge wrapping frame, an electrode plate set is arranged in the injection molding outer frame, and the substrate is connected with the electrode plate set. The heating assembly is arranged on one side of the injection molding outer frame, the electrode slice set is embedded in the injection molding outer frame, the side sealing piece is arranged on the side wall of the heating chip and wraps the heating chip for sealing treatment, the edge of the heating chip and the electrode slice can be sealed, scraping of the surface of the electrode slice and the edge of the heating core body is reduced, and the service life of the heating chip is prolonged. And the insulativity, the voltage withstanding grade and the heating power of the heating core body are improved.

Description

Technical Field

[0001] This invention relates to the field of heater technology, and in particular to a heating core, a heater, and a method for manufacturing the heating core. Background Technology

[0002] Currently, PTC heating elements in automotive heaters are mostly used for circulating heating of coolant or air. Their structure typically consists of bonded electrode plates, electrode leads, and a heating chip. While the manufacturing process is stable, the structure is cumbersome, the heating power is low, and the surfaces of the heating chip and electrode plates are easily scratched, posing risks of insufficient insulation and withstand voltage. Therefore, there is an urgent need for a heating element, heater, and a method for manufacturing the heating element to address these issues. Summary of the Invention

[0003] To address the aforementioned problems, the present invention provides a heating core comprising an injection-molded outer frame and a heating assembly. The heating assembly is arranged adjacent to the injection-molded outer frame. The heating assembly includes a frame, a heating chip, and a substrate. The heating chip and the substrate are both embedded within the frame. The surface of the substrate is parallel to the surface of the heating chip, and the two surfaces are in contact. A side sealing sheet is provided on the sidewall of the heating chip, and the side sealing sheet is located within the frame. An electrode assembly is provided within the injection-molded outer frame, and the substrate is connected to the electrode assembly.

[0004] Furthermore, there are multiple heating components, which are arranged sequentially at intervals in the vertical direction. Multiple sets of electrode plates are provided inside the injection-molded outer frame, and the substrate of each heating component is connected to the electrode plate set in a one-to-one correspondence.

[0005] Furthermore, the injection-molded outer frame includes multiple outer frame units, each of the electrode sheet groups is arranged in a one-to-one correspondence with an outer frame unit, and each of the outer frame units is connected to each other to form a whole.

[0006] Furthermore, the spacing between adjacent heating components is adjustable.

[0007] Furthermore, the injection-molded outer frame is L-shaped, and the electrode plates of the electrode plate group are embedded in the injection-molded outer frame with both ends extending from the free end of the injection-molded outer frame to form electrode pins. One electrode pin is electrically connected to the substrate, and the other electrode pin is connected to an external power supply.

[0008] Furthermore, the connection node between the substrate and the electrode assembly is covered with a coating.

[0009] Furthermore, the substrate includes a ceramic layer and a copper foil layer, the copper foil layer being bonded to the heating chip by a highly thermally conductive adhesive, and the ceramic layer being disposed on the side of the copper foil layer away from the heating chip.

[0010] On the other hand, the present invention also provides a heater, including a housing and a heating core, wherein the heating core is disposed inside the housing and the heating core is as described above.

[0011] On the other hand, the present invention also provides a method for manufacturing the heating core as described above, comprising the following steps:

[0012] Assemble the substrate and heat-generating chip;

[0013] Connect the substrate to the electrode assembly of the injection-molded outer frame;

[0014] Side sealing sheets are placed on the four sides of the heating chip to obtain the core unit;

[0015] The core unit is placed inside the frame.

[0016] Furthermore, the provision of side sealing sheets on the surrounding sidewalls of the heating chip specifically includes:

[0017] Silicone rubber is applied to the four sides of the heating chip using a dispensing machine to form a side seal.

[0018] The core unit after dotting is cured at room temperature for a period of time until the silicone rubber is completely cured.

[0019] By employing the above technical solutions, this invention has the following advantages compared to existing technologies:

[0020] 1) The heating core provided by the present invention has a heating component disposed on one side of the injection-molded outer frame, an electrode sheet group embedded in the injection-molded outer frame, and a side sealing sheet on the side wall of the heating chip. The side sealing sheet covers the heating chip and performs a sealing treatment, which can seal the edge of the heating chip and the electrode sheet, thereby reducing the scratching of the electrode sheet surface and the edge of the heating core, and improving the insulation, withstand voltage level and heating power of the heating core.

[0021] 2) The heating core provided by the present invention has multiple heating components that can be arranged vertically at intervals along the injection molded outer frame. Multiple heating components are integrated vertically, which has a high degree of integration, is convenient to assemble, and can improve the assembly efficiency of the product.

[0022] 3) The method for manufacturing the heating core provided by the present invention involves sealing the heating chip by setting side sealing sheets on the side walls around the heating chip through a dispensing process. The process is simple and can protect the heating chip and substrate, thereby improving the insulation and withstand voltage level of the heating core. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the heating core provided by the present invention;

[0025] Figure 2 A partial schematic diagram of the heating core provided by the present invention. Figure 1 ;

[0026] Figure 3 A partial schematic diagram of the heating core provided by the present invention. Figure 2 ;

[0027] Figure 4 This is a cross-sectional view of the heating component in the heating core provided by the present invention;

[0028] Figure 5 A schematic diagram of the connection node between the electrode pins and the copper foil pins in the heating core provided by the present invention;

[0029] Figure 6 A top view of the heater provided by the present invention.

[0030] 1-Injection molded outer frame; 11-Outer frame body; 12-Outer frame sub-section; 2-Heating component; 21-Body frame; 22-Heating chip; 23-Ceramic substrate; 24-Copper foil pin; 3-Covering body; 4-First electrode sheet; 41-Electrode pin; 411-End positioning hole; 412-Power supply limiting hole; 5-Second electrode sheet; 6-Side sealing sheet; 7-Housing shell; 71-Inlet; 72-Outlet. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. In the accompanying drawings, the dimensions and relative dimensions of certain parts may be enlarged for clarity.

[0032] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connection" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0033] In the description of this invention, terms such as "upper," "lower," "left," "right," "front," and "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] Furthermore, in the description of this invention, the terms "first" and "second" are used merely for descriptive distinction and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Additionally, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0035] Example 1

[0036] As per the instruction manual Figure 1-5 As shown, the present invention provides a heating core, including an injection-molded outer frame 1 and a heating component 2. The heating component 2 is arranged adjacent to the injection-molded outer frame 1. The heating component 2 includes a frame 21, a heating chip 22, and a substrate. The heating chip 22 and the substrate are both embedded within the frame 21. The surface of the substrate is parallel to the surface of the heating chip 22, and the two surfaces are in contact. A side sealing sheet 6 is provided on the side wall of the heating chip 22, and the side sealing sheet 6 is located within the frame 21. An electrode assembly is provided within the injection-molded outer frame 1, and the substrate is connected to the electrode assembly. In this embodiment, the substrate is preferably a ceramic substrate 23, which has the advantages of efficient heat dissipation, stability and reliability, and good high-frequency performance.

[0037] Specifically, the injection-molded outer frame 1 is disposed on one side of the heating element 2. Each electrode group includes two electrode sheets, referred to as the first electrode sheet 4 and the second electrode sheet 5, respectively. The polarity of the second electrode sheet 5 is opposite to that of the first electrode sheet 4. Both the first electrode sheet 4 and the second electrode sheet 5 are injection-molded within the injection-molded outer frame 1. The free ends of the first electrode sheet 4 and the second electrode sheet 5 extend beyond the outer side of the injection-molded outer frame 1 for electrical connection with the ceramic substrate 23. Two ceramic substrates 23 are provided, respectively disposed on the upper and lower sides of the heating chip 22 and attached to the surface of the heating chip 22 to ensure a large contact area. The two ceramic substrates 23 are electrically connected to the first electrode sheet 4 and the second electrode sheet 5, respectively, to facilitate the conduction of external power.

[0038] Preferably, there are multiple heating chips 22, each of which is laid flat between two ceramic substrates 23 to form a heating element. A side sealing sheet 6 is provided on the outermost sidewall of the heating element to reduce the risk of mechanical damage and protect the heating chip 22 from scratches and wear on the sidewall, which would affect the heating efficiency of the heating chip 22.

[0039] Preferably, while side sealing plates 6 are provided around the heating element, side sealing plates 6 are also provided around the ceramic substrates 23 on both sides of the heating element. The side sealing plates 6 on the heating element and the ceramic substrates 23 can be provided simultaneously. The side sealing plates 6 can be provided after the heating element and the ceramic substrates 23 are assembled, without affecting the heating power of the PTC heating core. The side sealing plates 6 can increase the creepage distance and prevent arcing (creep) caused by insufficient electrical clearance between the exposed copper foil layer of the ceramic substrate 23 and the metal shell on which the heating core is placed. The side sealing plates on the side walls of both the heating element and the ceramic substrate 23 can also prevent the edges of the heating chip 22 and the ceramic substrate 23 from scratching. The side sealing plates 6 improve the insulation, withstand voltage rating and heating power of the PTC heating core.

[0040] In this embodiment, the frame 21 is a four-sided frame structure with a cavity in the middle. After the side sealing pieces 6 are set on the outer sides of the heating element, the entire element is placed inside the frame 21. The frame 21 can fix it to prevent it from shifting during the later assembly with the shell and the side sealing pieces 6 from falling off, thus playing a protective role and enhancing the structural stability of the heating core. The side sealing sheet 6 is sheet-shaped, with its surface perpendicular to the surface of the heating chip 22. The side sealing sheet 6 surrounds the side wall of the heating element and achieves a sealing effect by filling the gap between the heating chip 22 and the ceramic substrate 23. The side sealing sheet 6 can cover the copper foil layer of the ceramic substrate 23, thereby reducing the creepage distance between the copper foil layer and the mounting housing, and thus improving the insulation of the heating core. The side sealing sheet 6 is provided around the heating element and the ceramic substrate 23. The side sealing sheet 6 is made of a material with aging resistance and high sealing performance. It has good bonding with the heating chip 22 and the ceramic substrate 23, is firmly adhered, does not swell, and has excellent aging resistance and sealing performance, which can prevent the heating chip 22 and the ceramic substrate 23 from breaking.

[0041] In the optimized implementation, the side sealing sheet 6 is made of silicone rubber, preferably a single-component cured silicone rubber, which has excellent sealing and insulation properties. The cured silicone rubber is an excellent electrical insulator and provides physical and environmental protection. Silicone rubber can maintain its elasticity over a wide temperature range of -60℃ to above 200℃ and is resistant to ultraviolet radiation and ozone aging, making it suitable for the operating environment of PTC heating cores and having good applicability. Moreover, silicone rubber has excellent permeability, making the resulting side sealing sheet 6 easy to manufacture, allowing for rapid operation, and providing good filling effect in narrow gaps.

[0042] In an optimized implementation, the number of heating components 2 is multiple, meaning two or more. These multiple heating components 2 are arranged sequentially at intervals in the vertical direction, allowing for the integration of more heating components 2 within a limited space. The injection-molded outer frame 1 contains multiple sets of electrode plates, with each ceramic substrate 23 of the heating component 2 corresponding to and connected to one of the electrode plates. The injection-molded outer frame is located on one side of the heating components, facilitating the assembly of the electrode plates and the heating components, and also simplifying product maintenance. The injection-molded outer frame 1 is used for connecting the heating components 2 to the power supply, and can be adapted to different structural forms, offering high flexibility and a wide range of applications.

[0043] In an optimized implementation, the spacing between adjacent heating components 2 is adjustable to meet different assembly requirements.

[0044] In an optimized implementation, the injection-molded outer frame 1 includes multiple outer frame units, with each electrode sheet group corresponding to one of the outer frame units. Each outer frame unit contains a set of electrode sheets for connection to the corresponding heating element 2. The outer frame units are interconnected to form a whole. The structures of the outer frame units can be the same or different, and the overall structure is strong when the outer frame units are connected together.

[0045] In this embodiment, one outer frame unit is an outer frame body 11, and the remaining outer frame units are outer frame sub-units 12. Each outer frame sub-unit 12 is vertically spaced on the outer frame body 11. Both the outer frame body 11 and each outer frame sub-unit 12 contain a set of electrode plates. Each set of electrode plates includes a first electrode plate 4 and a second electrode plate 5. For example, if the first electrode plate 4 is a positive electrode plate, then the second electrode plate 5 is a negative electrode plate. The first electrode plate 4 and the second electrode plate 5 can be jointly disposed within the same outer frame body 11 with a gap between them, or they can be disposed separately within two different outer frame bodies 11. In this embodiment, the first electrode plate 4 and the second electrode plate 5 are disposed within one outer frame body 11, forming a standard outer frame body 11, which facilitates the provision of spare parts. Each outer frame sub-unit 12 includes two frames, with the first electrode plate 4 and the second electrode plate 5 disposed in the two frames respectively. Of course, the first electrode plate 4 and the second electrode plate 5 can also be disposed within the same outer frame sub-unit 12.

[0046] In the optimized implementation, the position of each outer frame component 12 on the outer frame body 11 is adjustable and the adjustment direction is parallel to the vertical. The outer frame component 12 is set on the outer frame body 11 and can be connected by screws or buckles. The adjustable position of the outer frame component 12 on the outer frame body 11 can adjust the spacing between two adjacent heating components 2 to meet different assembly requirements.

[0047] Preferably, when the injection-molded outer frame 1 and the heating element 2 are arranged adjacent to each other, and multiple heating elements 2 are provided, each heating element 2 is arranged vertically at intervals, resulting in a compact structure and reduced overall volume, which is especially suitable for integrated installation in confined spaces such as automotive air conditioning systems. In vehicles, the heater needs to be embedded in compact pipes or air ducts. The injection-molded outer frame 1 and the heating element 2 are set separately, and their shape can be adjusted according to the vehicle space, providing good adaptability and high flexibility. They can fit into the corners of the vehicle body or irregular spaces, improving space utilization and avoiding assembly conflicts caused by excessive size. In this embodiment, the injection-molded outer frame 1 preferably has an L-shaped structure, which can fit into the corner space of the vehicle body and adapt to the tight space of the vehicle.

[0048] Preferably, the injection-molded outer frame 1 adopts a modular design with one main frame 11 and multiple separate outer frame parts 12, which can be assembled as needed, improving assembly efficiency. The main frame 11 and the separate outer frame parts 12 can be prefabricated in batches and assembled on-site as needed, reducing assembly steps and meeting standardized production requirements. According to the different power requirements of the heater for different vehicle models, the spacing between adjacent heating components can be quickly adjusted by adjusting the installation position of the separate outer frame parts 12 on the main frame 11, achieving flexible adaptation without the need to redesign molds, shortening the development cycle. The modular structure facilitates positioning and supports and is compatible with efficient assembly line assembly.

[0049] In an optimized implementation, the outer frame body 11 and the outer frame sub-body 12 are injection molded from engineering plastics. The engineering plastics are preferably high-temperature resistant nylon, which replaces the traditional metal brackets, reduces the weight of the whole vehicle, meets the lightweight requirements of new energy vehicles, and the plastic parts are corrosion resistant, have a long service life, and can reduce maintenance costs.

[0050] In an optimized implementation, the injection-molded outer frame 1 has an L-shaped structure. When multiple heating components 2 are provided, both the outer frame body 11 and the outer frame sub-body 12 are L-shaped structures, including a horizontal frame and a vertical frame. The horizontal frame and the vertical frame are arranged vertically and are integrally injection-molded. The first electrode sheet 4 and the second electrode sheet 5 are embedded in the injection-molded outer frame 1, and their shapes are adapted to the injection-molded outer frame 1. The installation structure of the second electrode sheet 5 is the same as that of the first electrode sheet 4. Taking the assembly of the first electrode sheet 4 as an example, both ends of the first electrode sheet 4 extend out of the outside of the injection-molded outer frame 1 to form electrode pins 41. One electrode pin 41 extends from the free end of the horizontal frame and is electrically connected to the ceramic substrate 23. The other electrode pin 41 extends from the free end of the vertical frame for connecting to an external power supply. Both ends of the second electrode sheet 5 also extend out of the injection-molded outer frame and form electrode pins 41. The installation structure is the same as that of the first electrode sheet, and will not be described again here. The injection-molded outer frame 1 adopts an L-shaped structure, and the electrode pins 41 extend from the free end of the injection-molded outer frame 1, which simplifies wiring. The L-shaped structure makes the external power supply and the heating component 2 clearly arranged in sections, avoiding cable tangling and reducing the electrical failure rate.

[0051] Specifically, the input end of the ceramic substrate 23 is provided with a copper foil pin 24, which is used to connect with the corresponding electrode pin 41. The electrode pin 41 is welded to the copper foil pin 24, and a cover 3 is provided at the weld to seal the exposed metal, thereby playing a role in insulation and protection.

[0052] The encapsulation 3 is made of silicone rubber, preferably a single-component cured silicone rubber. The silicone rubber encapsulation wraps around the connection node between the copper foil pin 24 and the electrode pin 41, covering the exposed metal structure. The insulating properties of silicone rubber can withstand high and low temperature cycling in automotive applications, reducing solder joint defects and further lowering the electrical failure rate. This application achieves a double insulation and sealing effect by setting a side seal 6 on the outside of the heating chip 22 and setting an encapsulation 3 at the connection between the copper foil pin 24 and the electrode pin 41. Furthermore, the side seal 6 and the encapsulation 3 are made of highly insulating materials, solving the problems of easy scratching and insufficient insulation at the electrode sheet and chip edge in traditional structures, thereby significantly improving the withstand voltage rating. The sealing protection of silicone rubber effectively improves the withstand voltage performance.

[0053] When the heating element is installed in a vehicle, the high-frequency vibrations during vehicle operation can easily cause traditional welding points to loosen. This application embeds both the first electrode plate 4 and the second electrode plate 5 within the injection-molded outer frame 1, with only the electrode pins 41 extending out of the injection-molded outer frame 1 for electrical connection. The injection-molded outer frame fixes the electrode plates and prevents metal electrodes from being exposed. A covering 3 is provided at the connection point between the electrode pins 41 and the copper foil pins 24, significantly reducing the risk of open circuits and improving the structure's resistance to vibration and impact. The double-sealing structure of the side sealing plate 6 and the covering 3 blocks coolant and road moisture corrosion, improving insulation and withstand voltage ratings, and enhancing dust and moisture resistance. The injection-molded outer frame 1 physically isolates the edge of the heating component 2, preventing tools or adjacent parts from scratching the heating chip 22 during assembly and causing damage.

[0054] In an optimized implementation, the ceramic substrate 23 includes a ceramic layer and a copper foil layer. The leads of the ceramic layer and the copper foil layer are aligned and soldered together to form a copper foil lead 24 at the input end. The copper foil layer is bonded to the heating chip 22 with a highly thermally conductive adhesive. The ceramic layer is disposed on the side of the copper foil layer away from the heating chip 22. Traditional heating elements use a heating chip and an aluminum electrode sheet for heat transfer, resulting in relatively high interfacial thermal resistance. In this embodiment, the heating chip 22 is connected to a copper foil layer and a ceramic layer for heat transfer, resulting in lower interfacial resistance. Furthermore, the thermal conductivity of copper is 401 W / (m·K), that of the ceramic layer is 24 W / (m·K), and that of aluminum is 237 W / (m·K). The copper foil layer has an even higher thermal conductivity, which can effectively improve the heating power of the heating element.

[0055] Specifically, the heating chip 22 is bonded to the copper foil layer of the ceramic substrate 23 at high temperature using highly thermally conductive black adhesive. The thermal conductivity of the black adhesive can reach 3.0 W / (m:K), ensuring heat transfer efficiency and improving the power density of the heating core.

[0056] In this embodiment, the black adhesive used is UB5706 black adhesive. UB5706 black adhesive integrates multiple functions such as strong adhesion, reliable sealing, electrical insulation, and stress buffering while achieving efficient heat conduction. This black adhesive has a high thermal conductivity, effectively transferring the heat generated by the heating chip 22 to the ceramic substrate 23, significantly reducing hot spot temperature and improving product reliability and lifespan. While achieving efficient heat conduction, this black adhesive also has strong adhesive strength, firmly bonding the heating chip 22 and the ceramic substrate 23 together without the need for additional mechanical fixing, simplifying the assembly process. UB5706 black adhesive is a two-component mixed adhesive with moderate viscosity after mixing, making it easy to apply, ensuring thorough heat dissipation and sealing, and convenient to use. It can be selected for slow curing at room temperature or rapid curing with heating according to production needs, offering good flexibility.

[0057] Preferably, the electrode pin 41 has an end positioning hole 411 at one end near the copper foil pin 24 for welding positioning, the end of the electrode pin 41 away from the copper foil pin 24 passes through the injection molded outer frame 1 and extends out, and the end of the electrode pin 41 has a power supply limiting hole 412. The end positioning hole 411 and the power supply limiting hole 412 can improve assembly accuracy and stability.

[0058] The ceramic substrate 23 of the heating core is powered through the injection-molded outer frame 1 and electrode pins 41. In addition, the side of the PTC heating chip 22 is coated with a side sealing sheet 6, which covers the PTC heating chip 22 for sealing. The connection between the electrode pins 41 and the copper foil pins 24 is provided with a covering body 3, which is also sealed. The sealant of the covering body 3 and the side sealing sheet 6 is a single-component cured silicone rubber. Using it for sealing can reduce the edge scratches of the PTC heating chip 22 and the ceramic substrate 23. The process is simple and improves the insulation, withstand voltage level and heating power of the PTC heating core.

[0059] Example 2

[0060] As per the instruction manual Figure 6 As shown, the present invention also provides a heater, including a housing 7 and a heating element, wherein the heating element is disposed within the housing 7, and the heating element is the same as that described in Embodiment 1, which will not be repeated here. The housing 7 is provided with a water inlet 71 and a water outlet 72.

[0061] Example 3

[0062] The present invention also provides a method for manufacturing a heating core as described in Example 1, comprising the following steps:

[0063] Assemble the substrate and heat-generating chip 22;

[0064] Connect the substrate to the electrode assembly of the injection-molded outer frame 1;

[0065] Side sealing sheets 6 are provided on the four sides of the heating chip 22 to obtain the core unit;

[0066] The core unit is placed inside the frame 21.

[0067] In this embodiment, the substrate is preferably a ceramic substrate 23, and the ceramic substrate 23 is bonded to the heating chip 22 by an adhesive.

[0068] The specific production method is as follows:

[0069] S1. Apply an adhesive layer to the ceramic substrate.

[0070] Specifically, black adhesive is preferred as the bonding agent. A fully automated precision screen printing process is used to uniformly coat the highly thermally conductive black adhesive onto the copper foil layer of the ceramic substrate, controlling the adhesive layer thickness to be 80±10μm. This thickness balances filling gaps and minimizing thermal resistance. An online film thickness monitoring system is used for real-time monitoring during the coating process to ensure thickness consistency.

[0071] S2. Place the heating chip 22 on the adhesive layer and wait for the adhesive to cure to complete the bonding of the heating chip 22 and the ceramic substrate 23.

[0072] Specifically, the heating chip 22 is precisely placed on the ceramic substrate 23 coated with the adhesive layer. A positioning fixture is used to ensure alignment accuracy within a set range. The bonded assembly is then placed in a temperature-controlled oven and preheated at 75-85°C for a period of time to evaporate trace amounts of solvent in the adhesive and prevent bubble formation. It is then cured at 140°C for 30 minutes to allow the resin to fully cross-link, achieving maximum bonding strength and thermal conductivity. Finally, it is removed and cooled to room temperature to release internal thermal stress and prevent warping.

[0073] S3. Connect the ceramic substrate 23 to the electrode assembly of the injection-molded housing 1.

[0074] Specifically, the electrode pins 41 are aligned and soldered to the copper foil pins 24 of the ceramic substrate 23 using a soldering process at a temperature of 380-410℃. Solder wire is used as the solder wire. After soldering, all solder joints are inspected to ensure there are no cold solder joints or missing solder joints.

[0075] S4. Apply adhesive around the heating chip 22 to form a side sealing sheet 6, and apply adhesive at the connection node between the ceramic substrate 23 and the electrode sheet group to form a coating.

[0076] Specifically, a single-component curable silicone rubber is applied to the sides of the heating chip 22 using a dispensing machine to form a side seal 6. Silicone rubber is also applied to the solder joints between the electrode pins 41 and the copper foil pins 24 to form an overlay that completely covers the exposed metal parts. The applied core is then cured at room temperature for 2 hours to ensure complete curing of the silicone rubber.

[0077] S5. Place the heating chip 22 and ceramic substrate 23 inside the frame 21 to complete the assembly of the heating core.

[0078] An optimized implementation method involves attaching heat-conducting sheets to both sides of the heating core obtained above and installing it into the housing, ensuring that the surface of the heat-conducting sheets is flat and undamaged, thus enabling the assembly of the heater.

[0079] Those skilled in the art will understand that the present invention can be implemented in many other specific forms without departing from the spirit and scope of the invention. Although embodiments of the invention have been described, it should be understood that the invention is not limited to these embodiments, and those skilled in the art can make changes and modifications within the spirit and scope of the invention as defined in the appended claims.

Claims

1. A heating core, comprising an injection-molded outer frame and a heating assembly, characterized in that, The heating component is arranged adjacent to the injection-molded outer frame. The heating component includes a frame, a heating chip, and a substrate. The heating chip and the substrate are both embedded in the frame. The surface of the substrate is parallel to the surface of the heating chip and the two surfaces are in contact. A side sealing sheet is provided on the side wall of the heating chip. The side sealing sheet is located inside the frame. An electrode sheet group is provided inside the injection-molded outer frame. The substrate is connected to the electrode sheet group.

2. The heating core according to claim 1, characterized in that, The number of heating components is multiple, and the multiple heating components are arranged sequentially at intervals in the vertical direction. Multiple sets of electrode plates are provided in the injection molded outer frame, and the substrate of each heating component is connected to the electrode plate set in a one-to-one correspondence.

3. The heating core according to claim 2, characterized in that, The injection-molded outer frame includes multiple outer frame units, and each of the electrode sheet groups is arranged in a one-to-one correspondence with an outer frame unit. All the outer frame units are connected to each other to form a whole.

4. The heating core according to claim 2, characterized in that, The spacing between adjacent heating components is adjustable.

5. The heating core according to claim 1, characterized in that, The injection-molded outer frame is L-shaped. The electrode plates of the electrode plate group are embedded in the injection-molded outer frame and both ends extend from the free end of the injection-molded outer frame to form electrode pins. One electrode pin is electrically connected to the substrate, and the other electrode pin is connected to an external power supply.

6. The heating core according to claim 1, characterized in that, The connection point between the substrate and the electrode assembly is covered with a coating.

7. The heating core according to claim 1, characterized in that, The substrate includes a ceramic layer and a copper foil layer. The copper foil layer is bonded to the heating chip by a highly thermally conductive adhesive. The ceramic layer is disposed on the side of the copper foil layer away from the heating chip.

8. A heater, comprising a housing and a heating element, wherein the heating element is disposed within the housing, characterized in that, The heating element is the heating element as described in any one of claims 1-7.

9. A method for manufacturing a heating core as described in any one of claims 1-7, characterized in that, Includes the following steps: Assemble the substrate and heat-generating chip; Connect the substrate to the electrode assembly of the injection-molded outer frame; Side sealing sheets are placed on the four sides of the heating chip to obtain the core unit; The core unit is placed inside the frame.

10. The method for manufacturing a heating core according to claim 9, characterized in that, The provision of side sealing sheets on the four sides of the heating chip specifically includes: Silicone rubber is applied to the four sides of the heating chip using a dispensing machine to form a side seal. The core unit after dotting is cured at room temperature for a period of time until the silicone rubber is completely cured.

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