Domain controller heat dissipation structure, domain controller and movable platform

Abstract

The invention discloses a domain controller heat dissipation structure, a domain controller and a movable platform, and the heat dissipation structure comprises a housing, a first side is provided with a liquid cooling heat dissipation flow channel, and is provided with a cooling medium inlet and a cooling medium outlet; and the soaking structure is used for being in contact with at least one circuit board chip for heat exchange, is arranged at the arrangement position of the liquid cooling heat dissipation flow channel on the second side of the shell, extends into the liquid cooling heat dissipation flow channel and comprises a first soaking block and a second soaking block which are connected, and the second soaking block is arranged on the downstream side of the first soaking block. According to the invention, heat dissipation is carried out on the circuit board chip of the domain controller through liquid cooling, the first soaking block and the second soaking block are arranged for the circuit board chip, and the two soaking blocks are cooled by the cooling medium for liquid cooling heat dissipation in sequence, so that the heat exchange efficiency between the whole soaking structure and the cooling medium is ensured; therefore, compared with a traditional heat dissipation structure, the whole heat dissipation structure has higher heat dissipation efficiency so as to support high-load operation of the domain controller chip.

Description

Technical Field

[0001] This invention relates to the field of domain controller technology, and in particular to a domain controller heat dissipation structure, a domain controller, and a mobile platform. Background Technology

[0002] As autonomous driving levels increase, the computing power requirements of domain controller main chips are surging, with the TDP (Thermal Design Power) of some chips exceeding 150W. Traditional domain controllers typically use aluminum alloy die-casting for their casings and rely primarily on liquid cooling for heat dissipation. However, under extreme conditions (such as ambient temperature of 85°C + refrigerant temperature of 75°C + continuous full load operation), the chip junction temperature can still reach over 120°C, triggering frequency throttling protection and causing a decrease in computing power. This seriously threatens the functional safety and feasibility of autonomous driving. Summary of the Invention

[0003] This invention provides a domain controller heat dissipation structure, a domain controller, and a portable platform to solve the problem of excessively high temperature of domain controller chips under high load in the prior art.

[0004] According to a first aspect of the present invention, a domain controller heat dissipation structure is provided, comprising: The casing has a liquid cooling heat dissipation channel on the first side, and is provided with a cooling medium inlet and a cooling medium outlet; A heat exchange structure for contacting and exchanging heat with at least one circuit board chip is disposed at the location of the liquid cooling heat dissipation channel on the second side of the housing and extends into the liquid cooling heat dissipation channel. It includes a first heat exchange block and a second heat exchange block connected together, with the second heat exchange block disposed downstream of the first heat exchange block.

[0005] The domain controller heat dissipation structure of the present invention can dissipate heat from the circuit board chip of the domain controller through liquid cooling. In the heat exchange structure that contacts and exchanges heat with at least one circuit board chip, a first heat exchange block and a second heat exchange block are provided. The two heat exchange blocks are cooled successively by the liquid cooling medium, thereby ensuring the heat exchange efficiency between the overall heat exchange structure and the cooling medium. As a result, the overall heat dissipation structure has higher heat dissipation efficiency than the traditional heat dissipation structure, so as to support the high load operation of the domain controller chip.

[0006] In some embodiments, the first heat exchange block and / or the second heat exchange block are configured as heat dissipation fin structures, with the bottoms of the first heat exchange block and the second heat exchange block connected together, and the heat dissipation fin structures extending into the liquid cooling heat dissipation channel.

[0007] Therefore, by using this configuration, the contact area between the heat dissipation fin structure and the cooling medium can be increased to improve heat dissipation efficiency.

[0008] In some implementations, the bottom of the first heat exchanger block is used to contact the circuit board chip for heat exchange.

[0009] Therefore, with this setup, there will be more heat exchange between the first heat exchange block and the circuit board chip, allowing the first heat exchange block to exchange heat with the cooling medium first, ensuring rapid cooling of the circuit board chip. The second heat exchange block is connected to the bottom of the first heat exchange block, thereby optimizing the heat distribution of the overall heat exchange structure and using the cooling medium on the downstream side for secondary heat exchange, forming auxiliary heat dissipation for the circuit board chip and avoiding single-point overheating.

[0010] In some embodiments, the liquid cooling heat dissipation channel is configured in a "U" shape to form an upstream section closer to the cooling medium inlet and a downstream section closer to the cooling medium outlet; The first heat spreader is located at the upstream section of the second side of the housing, and the second heat spreader is located at the downstream section of the second side of the housing.

[0011] Therefore, by using this configuration, the distance between the upstream and downstream sections can be shortened by utilizing the "U"-shaped liquid cooling heat dissipation channel, thereby reducing the distance between the first and second heat exchange blocks. This allows the second heat exchange block to better distribute the heat of the first heat exchange block. At the same time, the "U"-shaped cooling heat dissipation channel can lengthen the liquid cooling heat dissipation channel, allowing the shell to further exchange heat and lower the temperature of the cooling medium. This results in a lower temperature of the cooling medium undergoing secondary heat exchange with the second heat exchange block, leading to higher heat dissipation efficiency for the second heat exchange block. Thus, the overall heat dissipation of the domain controller is optimized from multiple dimensions.

[0012] In some embodiments, the gap between the upstream segment and the downstream segment is configured to be formed using a partition.

[0013] Therefore, by setting it up in this way, the distance between the first heat exchanger and the second heat exchanger can be further reduced.

[0014] In some embodiments, the length direction of the liquid cooling heat dissipation channel is arranged along the length direction of the housing.

[0015] Therefore, by setting it up in this way, the heat exchange between the shell and the cooling medium can be further optimized, so that the temperature of the cooling medium that exchanges heat with the second heat exchange block can be lower, and the heat dissipation efficiency of the second heat exchange block can be higher.

[0016] In some embodiments, two sets of heat exchange structures are arranged side by side, each set of heat exchange structures is used to contact and exchange heat with a single circuit board chip, the first heat exchange block of the second set of heat exchange structures is arranged on the upstream section of the second side of the housing, downstream of the first heat exchange block of the first set of heat exchange structures, and the second heat exchange block of the second set of heat exchange structures is arranged on the upstream section of the second side of the housing, upstream of the second heat exchange block of the first set of heat exchange structures.

[0017] Therefore, this configuration can be adapted to PCBA circuit boards with two circuit board chips arranged simultaneously, so as to dissipate heat and cool down the two circuit board chips at the same time. At this time, the circuit board chips that exchange heat with the first heat exchange structure can be configured with two circuit board chips for data redundancy and backup.

[0018] In some embodiments, the housing is provided with an opening that communicates with the liquid cooling heat dissipation channel.

[0019] Therefore, this setup allows for the direct molding of the integral shell shape using die casting, simplifying the production process, reducing production costs, and improving production efficiency.

[0020] In some embodiments, the opening is provided with a top cover, which is sealed to the housing.

[0021] Therefore, this design achieves a seal between the top cover and the shell, ensuring the airtightness of the liquid cooling heat dissipation channel. The sealing connection can be achieved by welding or adhesive bonding. Welding can be done by friction stir welding, which can effectively reduce the residual stress or deformation of the structure after welding.

[0022] In some embodiments, the heat exchange structure is provided with thermally conductive adhesive for heat exchange with the circuit board chip.

[0023] Therefore, this configuration can improve the heat exchange efficiency between the circuit board chip and the heat dissipation structure.

[0024] In some embodiments, the heat dissipation structure is made of pure copper, copper alloy, aluminum alloy, and / or the housing is made of copper-embedded die-cast aluminum alloy.

[0025] Therefore, by using this configuration, the copper heat exchange structure can achieve more efficient heat exchange and cooling, while the shell is made of aluminum alloy through one-piece die casting with copper inlay. The production process is relatively simple, the yield is high, the cost is low, and the heat exchange efficiency is higher than that of the traditional aluminum alloy die-cast shell.

[0026] According to a second aspect of the present invention, a domain controller is provided, which is provided with the domain controller heat dissipation structure described in the first aspect above, and further includes a circuit board, on which a circuit board chip is disposed, the circuit board is mounted on a second side of the housing, and the circuit board chip exchanges heat with the heat dissipation structure.

[0027] The domain controller of the present invention, by providing the domain controller heat dissipation structure described in the first aspect above, can effectively improve the overall heat dissipation effect of the domain controller, enabling the chip to meet the operating requirements under extreme conditions and ensuring the safe and stable operation of driving functions.

[0028] According to a third aspect of the present invention, a mobile platform is provided, including the domain controller described in the second aspect above.

[0029] The mobile platform of the present invention, by being equipped with the domain controller described in the second aspect above, can effectively improve the security and stability of the overall system operation. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is an exploded view of the overall structure of the heat dissipation structure of a domain controller according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of the heat dissipation structure of the domain controller according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the back structure of a domain controller heat dissipation structure according to an embodiment of the present invention; Figure 4 This is a front view of the heat dissipation structure of a domain controller according to an embodiment of the present invention. Figure 5 for Figure 4 The diagram shows a cross-sectional view of part A of the domain controller's heat dissipation structure. Figure 6 This is an exploded view of the overall structure of a domain controller according to an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached drawings: 1. Shell; 11. First side; 12. Second side; 2. Liquid cooling heat dissipation channel; 21. Cooling medium inlet; 22. Cooling medium outlet; 23. Upstream section; 24. Downstream section; 25. Partition; 26. Through hole; 3. Heat dissipation structure; 301. First heat dissipation structure; 302. Second heat dissipation structure; 31. First heat dissipation block; 32. Second heat dissipation block; 33. Thermal conductive adhesive; 34. Heat dissipation part; 35. Bottom; 41. Opening; 42. Top cover; 51. Circuit board; 52. Circuit board chip; 53. Reinforcing structure; 54. Rear cover. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0035] In the description of this application, it should be understood that the use of terms such as "center," "middle," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" to indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings is solely for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Features defined with "first" and "second" are used to distinguish feature names and do not have special meanings. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] It should also be noted that, in this document, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] The present invention will now be described in further detail with reference to the accompanying drawings.

[0040] Figure 1 The diagram schematically illustrates the configuration of a domain controller heat dissipation structure according to an embodiment of the present invention. (Refer to...) Figure 1 As shown, the domain controller heat dissipation structure of the present invention includes a housing 1 and a heat dissipation structure 3. A liquid cooling channel 2 is provided on the first side 11 of the housing 1 for cooling the circuit board chip 52 of the domain controller. The heat dissipation structure 3 is disposed on the second side 12 of the housing 1 at the location of the liquid cooling channel 2 and extends into the liquid cooling channel 2 for liquid cooling. The heat dissipation structure 3 is used for heat exchange with at least one circuit board chip 52 and includes a first heat dissipation block 31 and a second heat dissipation block 32 connected together, with the second heat dissipation block 32 disposed downstream of the first heat dissipation block 31.

[0041] The first and second heat spreaders 31 and 32 each include a heat dissipation section 34 and a bottom 35. The bottom 35 is used for direct / indirect heat exchange with the circuit board chip 52, and the heat dissipation section 34 is used for heat exchange with external media (such as air, coolant, etc.) to achieve heat dissipation and cooling of the circuit board chip 52. The heat dissipation section 34 of the first and second heat spreaders 31 and 32 can be configured as a heat dissipation fin structure or as a heat dissipation guide pillar structure or other structures commonly used in the prior art. When the heat dissipation section 34 is configured as a heat dissipation fin structure, the length direction of the heat dissipation fin structure needs to be non-perpendicular to the flow direction of the cooling medium in the liquid cooling channel 2, so that each fin in the heat dissipation fin structure can contact the cooling medium to achieve heat exchange and ensure heat dissipation efficiency. Optionally, since the thermal conductivity of copper (401 W / m·K) is nearly twice that of aluminum (237 W / m·K), the overall heat dissipation structure 3 can be made of pure copper or various copper alloys, or aluminum alloys or other metal alloys with high thermal conductivity. This invention does not limit this. For example, refer to... Figure 1 and Figure 4 As shown, in Figure 1 and Figure 4 In the embodiment shown, the fins in the heat dissipation fin structure are configured such that their length direction is parallel to the flow direction of the cooling medium in the liquid cooling heat dissipation channel 2, thereby ensuring contact between each fin and the cooling medium and improving heat dissipation efficiency.

[0042] The bottoms 35 of the first heat spreader 31 and the second heat spreader 32 are connected, allowing simultaneous heat dissipation of the circuit board chip 52 using both heat spreaders. Specifically, the circuit board chip 52 can be in direct / indirect contact with at least one of the first and second heat spreaders 31, thereby transferring heat from the circuit board chip 52 to both heat spreaders 31 and 32. In some possible embodiments, the circuit board chip 52 can be disposed at the bottom 35 of the first heat spreader 31. Since the first heat spreader 31 is located upstream of the second heat spreader 32, the cooling medium, upon contacting the heat spreader structure 3, will first contact and exchange heat with the heat dissipation portion 34 on the first heat spreader 31. Therefore, by disposing of the circuit board chip 52 at the bottom 35 of the first heat spreader 31, most of the heat from the circuit board chip 52 can be transferred to the first heat spreader 31, allowing direct heat dissipation using the cooling medium without heat exchange. The remaining small portion of heat from the circuit board chip 52 is transferred to the second heat spreader 32 through the bottom 35 of the first heat spreader 31 and the bottom 35 of the second heat spreader 32. The second heat spreader 32 then uses the cooling medium that has exchanged heat with the first heat spreader 31 to dissipate heat, thus achieving auxiliary secondary heat dissipation. For example, referring to... Figure 1 and Figure 5 As shown, in Figure 1 and Figure 5In the embodiment shown, the bottom 35 of the first heat exchange block 31 is connected to the bottom 35 of the second heat exchange block 32. The bottom 35 of the first heat exchange block 31 is raised at the position where it contacts the circuit board chip 52 for heat exchange, and is provided with thermal conductive adhesive 33 for contacting the circuit board chip 52 for heat exchange, thereby improving the heat transfer efficiency between the circuit board chip 52 and the first heat exchange block 31.

[0043] For the liquid cooling heat dissipation channel 2 provided on the housing 1, the cooling medium used can be commonly used cooling media such as water or ethylene glycol. Specifically, the shape of the overall liquid cooling heat dissipation channel 2 can be configured as a "U"-shaped channel design, with the cooling medium inlet 21 and cooling medium outlet 22 located on the same side of the housing 1. In this case, the overall liquid cooling heat dissipation channel 2 forms an upstream section 23 closer to the cooling medium inlet 21 and a downstream section 24 closer to the cooling medium outlet 22. For example, referring to… Figure 1 and Figure 2 As shown, in Figure 1 and Figure 2 In the embodiment shown, the overall liquid cooling heat dissipation channel 2 is configured as a "U" shape, and both the cooling medium inlet 21 and the cooling medium outlet 22 are located at... Figure 1 and Figure 2 The left side of the casing 1 is shown. Because the liquid cooling channel 2 is U-shaped, the overall liquid cooling channel 2 can be divided into two sections based on the middle interval of the U-shape. One section is the upstream section 23, which is closer to the cooling medium inlet 21 (i.e....). Figure 2 The upper half of the liquid cooling heat dissipation channel 2 shown in the diagram), and the other end is the downstream section 24, which is closer to the cooling medium outlet 22 (i.e. Figure 2 The lower half of the liquid cooling heat dissipation channel 2 shown in the figure.

[0044] At this point, for the heat dissipation structure 3, the first heat dissipation block 31 can be located at the upstream section 23 of the second side 12 of the housing 1, and the second heat dissipation block 32 can be located at the downstream section 24 of the second side 12 of the housing 1. Since the overall liquid cooling heat dissipation channel 2 is set in a "U" shape, by setting the first heat dissipation block 31 and the second heat dissipation block 32 in this way, the distance between the upstream section 23 and the downstream section 24 can be shortened by utilizing the "U" shaped liquid cooling heat dissipation channel 2, thereby reducing the distance between the first heat dissipation block 31 and the second heat dissipation block 32, so that the second heat dissipation block 32 can better share the heat of the first heat dissipation block 31. At the same time, the "U" shaped cooling heat dissipation channel can lengthen the length of the liquid cooling heat dissipation channel 2, so that the housing 1 can further exchange heat and cool down the cooling medium, so that the temperature of the cooling medium that exchanges heat with the second heat dissipation block 32 can be lower, and the heat dissipation efficiency of the second heat dissipation block 32 can be higher, thereby optimizing the heat dissipation of the overall domain controller from multiple dimensions. Furthermore, to further reduce the distance between the first heat exchanger 31 and the second heat exchanger 32, the gap between the upstream section 23 and the downstream section 24 can be formed by a partition 25. Simultaneously, the liquid cooling heat dissipation channel 2 is positioned along the length of the housing 1 to further optimize heat exchange between the housing 1 and the cooling medium. This allows the temperature of the cooling medium undergoing secondary heat exchange with the second heat exchanger 32 to be lower, resulting in higher heat dissipation efficiency for the secondary heat exchange of the second heat exchanger 32.

[0045] For example, refer to Figure 2 As shown, in Figure 2 In the illustrated embodiment, the overall liquid cooling heat dissipation channel 2 is U-shaped, with a partition 25 forming the middle section, and its length direction is consistent with the length direction of the overall shell 1. Inclined surfaces are provided at both ends of the liquid cooling heat dissipation channel 2 (near the cooling medium inlet 21 and the cooling medium outlet 22) to allow the cooling medium to flow more effectively from the cooling medium inlet 21 into the liquid cooling heat dissipation channel 2 and to flow more effectively from the cooling medium outlet 22. The first heat spreader 31 is located at the upstream section 23, and the second heat spreader 32 is located at the downstream section 24, thereby effectively shortening the distance between the first heat spreader 31 and the second heat spreader 32 and optimizing the overall heat dissipation effect.

[0046] In this embodiment of the invention, the heat dissipation structure 3 can be designed for at least one circuit board chip 52. The above embodiment is only described using one circuit board chip 52 as an example. In other embodiments, the same heat dissipation structure 3 can also contact multiple circuit board chips simultaneously (such as the first heat dissipation block 31 contacting multiple circuit board chips 52 simultaneously). By setting two heat dissipation blocks upstream and downstream of the flow channel, the heat dissipation effect of multiple circuit board chips 52 can be improved.

[0047] In some other embodiments, for a circuit board 51 having multiple circuit board chips 52, a corresponding number of heat dissipation structures 3 may also be provided on the housing 1. For example, referring to... Figure 2 , Figure 3 and Figure 6 As shown, two circuit board chips 52 are disposed on circuit board 51, and two sets of heat dissipation structures 3 are arranged side by side. (Refer to...) Figure 2 As shown, the first heat-spreading structure 301 is closer to the cooling medium inlet 21 and cooling medium outlet 22 on the liquid cooling heat dissipation channel 2, while the second heat-spreading structure 302 is disposed on one side of the first heat-spreading structure 301. Specifically, the first heat-spreading block 31 of the second heat-spreading structure 302 is disposed downstream of the first heat-spreading block 31 of the first heat-spreading structure 301 in the upstream section 23 of the second side 12 of the housing 1, and the second heat-spreading block 32 of the second heat-spreading structure 302 is disposed upstream of the second heat-spreading block 32 of the first heat-spreading structure 301 in the downstream section 24 of the second side 12 of the housing 1. Exemplarily, the first heat-spreading structure 301 contacts one circuit board chip 52, and the second heat-spreading structure 301 contacts another circuit board chip 52, so as to achieve simultaneous heat dissipation treatment for two circuit board chips 52 on the circuit board 51.

[0048] The housing 1 can be manufactured entirely by die casting, and its material can be common materials such as aluminum alloy. For example, the liquid cooling channel 2 can be manufactured separately and connected to the second side 12 of the housing 1 by welding, adhesive bonding, or other methods. To ensure the stability of the connection between the liquid cooling channel 2 and the housing 1, the liquid cooling channel 2 can be manufactured together with the overall housing 1 by die casting. Due to process requirements, refer to... Figure 1 As shown, an opening 41 with the same shape as the liquid cooling channel 2 is provided at the location of the liquid cooling channel 2 on the first side 11 of the housing 1. In this embodiment, a top cover 42 can be provided at the opening 41, and the top cover 42 is sealed to the housing 1 to ensure the sealing performance and operational stability of the liquid cooling channel 2. Exemplarily, the top cover 42 and the housing 1 can be sealed together by friction stir welding. Friction stir welding can effectively reduce the residual stress or deformation of the structure after welding, thereby ensuring the structural stability of the liquid cooling channel 2.

[0049] Furthermore, since the heat dissipation section 34 of the heat dissipation structure 3 needs to extend into the liquid cooling heat dissipation channel 2, a through hole 26 for the heat dissipation section 34 of the heat dissipation structure 3 to pass through can be correspondingly provided on the bottom surface of the liquid cooling heat dissipation channel 2. (See reference...) Figure 3As shown, the heat dissipation part 34 of the heat dissipation structure 3 passes through the through hole 26 and is connected to the housing 1 by a sealed connection to ensure the structural stability of the liquid cooling heat dissipation channel 2. In some possible embodiments, the heat dissipation structure 3 can also be integrally die-cast with the housing 1 and the liquid cooling heat dissipation channel 2. For example, it can be integrally die-cast by embedding a heat dissipation copper block in the housing 1 to ensure the connection stability and sealing of each part.

[0050] The domain controller heat dissipation structure of the present invention can dissipate heat from the circuit board chip 52 of the domain controller through liquid cooling. The liquid cooling heat dissipation channel 2 is set in a "U" shape to form an upstream section 23 and a downstream section 24. In the heat exchange structure 3 that contacts and exchanges heat with a single circuit board chip 52, a first heat exchange block 31 and a second heat exchange block 32 are provided. The two heat exchange blocks are respectively set in the upstream section 23 and the downstream section 24 so that they are cooled by the liquid cooling medium in sequence, thereby ensuring the heat exchange efficiency between the overall heat exchange structure 3 and the cooling medium. As a result, the overall heat dissipation structure has higher heat dissipation efficiency than the traditional heat dissipation structure, so as to support the high load operation of the domain controller chip.

[0051] Figure 6 The overall configuration of a domain controller according to an embodiment of the present invention is illustrated schematically. (Refer to...) Figure 6 As shown, the domain controller of the present invention includes a domain controller heat dissipation structure according to any of the aforementioned embodiments, and further includes a circuit board 51. A circuit board chip 52 is disposed on the circuit board 51, and the circuit board chip 52 is mounted on the second side 12 of the housing 1. The circuit board chip 52 contacts the heat exchange structure 3 for heat exchange (e.g., through thermally conductive adhesive to improve heat exchange efficiency), thereby achieving heat dissipation for the circuit board chip 52. (Refer to...) Figure 6 As shown, a reinforcing structure 53 can be provided on the back of the circuit board 51, and the reinforcing structure 53 can be formed of steel. For example, the reinforcing structure 53 can be correspondingly provided at the bottom of the location of the circuit board chip 52, for example, by screwing or pasting onto the circuit board 51, to support the circuit board 51, partially offsetting the bending of the circuit board 51 caused by the heat generated by the circuit board chip 52, and preventing cracking. A rear cover 54 can also be provided on the second side 12 of the housing 1. The rear cover 54 is installed on the back of the circuit board 51 to mount the entire circuit board 51 onto the second side 12 of the housing 1, ensuring that the circuit board chip 52 can stably contact and exchange heat with the heat exchange structure 3, and ensuring the installation stability of the circuit board 51.

[0052] The domain controller of the present invention, by setting the aforementioned domain controller heat dissipation structure, can effectively improve the overall heat dissipation effect of the domain controller, enabling the chip to meet the operating requirements under extreme conditions and ensuring the safe and stable operation of driving functions.

[0053] The present invention also provides a mobile platform in which a domain controller of any of the above embodiments is provided, so as to ensure that the domain controller can still operate normally under extreme conditions when the mobile platform is running, thereby effectively improving the security and stability of the overall system operation and adapting to the working environment of various mobile platforms.

[0054] It should be noted that the mobile platform described in the embodiments of the present invention can be, for example, a mobile robot, a model aircraft, a drone, a robotic arm, a car, a ship, etc. It should also be pointed out that the structure of the mobile platform is not limited to this; this embodiment is merely illustrative.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation structure for a domain controller, characterized in that, include: The housing (1) has a liquid cooling heat dissipation channel (2) on the first side (11), and is provided with a cooling medium inlet (21) and a cooling medium outlet (22); A heat exchange structure (3) is used to contact and exchange heat with at least one circuit board chip (52). It is located at the position of the liquid cooling heat dissipation channel (2) on the second side (12) of the housing (1) and extends into the liquid cooling heat dissipation channel (2). It includes a first heat exchange block (31) and a second heat exchange block (32) connected together. The second heat exchange block (32) is located downstream of the first heat exchange block (31).

2. The domain controller heat dissipation structure according to claim 1, characterized in that, The first heat exchange block (31) and / or the second heat exchange block (32) are configured as heat dissipation fin structures, the bottoms (35) of the first heat exchange block (31) and the second heat exchange block (32) are connected, and the heat dissipation fin structure extends into the liquid cooling heat dissipation channel (2).

3. The domain controller heat dissipation structure according to claim 1, characterized in that, The bottom (35) of the first heat exchange block (31) is used to contact the circuit board chip (52) for heat exchange.

4. The domain controller heat dissipation structure according to claim 1, characterized in that, The liquid cooling heat dissipation channel (2) is configured as a "U" shape to form an upstream section (23) closer to the cooling medium inlet (21) and a downstream section (24) closer to the cooling medium outlet (22); The first heat spreader (31) is located at the upstream section (23) of the second side (12) of the housing (1), and the second heat spreader (32) is located at the downstream section (24) of the second side (12) of the housing (1).

5. The domain controller heat dissipation structure according to claim 4, characterized in that, The interval between the upstream segment (23) and the downstream segment (24) is formed by a partition (25).

6. The domain controller heat dissipation structure according to claim 4, characterized in that, The heat exchange structure (3) is arranged in two groups side by side. Each heat exchange structure (3) is used to contact and exchange heat with a single circuit board chip (52). The first heat exchange block (31) of the second heat exchange structure (302) is located on the upstream section (23) of the second side (12) of the housing (1) downstream of the first heat exchange block (31) of the first heat exchange structure (301). The second heat exchange block (32) of the second heat exchange structure (302) is located on the upstream side of the second heat exchange block (32) of the first heat exchange structure (301) on the downstream section (24) of the second side (12) of the housing (1).

7. The domain controller heat dissipation structure according to any one of claims 1 to 6, characterized in that, The housing (1) is provided with an opening (41) communicating with the liquid cooling heat dissipation channel (2), and a top cover (42) is provided at the opening (41), and the top cover (42) is sealed to the housing (1). And / or, The heat-spreading structure (3) is provided with thermally conductive adhesive (33) for exchanging heat with the circuit board chip (52).

8. The domain controller heat dissipation structure according to any one of claims 1 to 6, characterized in that, The heat dissipation structure (3) is made of pure copper, copper alloy, or aluminum alloy, and / or the shell (1) is made of copper-embedded die-cast aluminum alloy.

9. A domain controller, characterized in that, The domain controller heat dissipation structure according to any one of claims 1 to 8 is provided, and further includes a circuit board (51). A circuit board chip (52) is provided on the circuit board (51). The circuit board (51) is mounted on the second side (12) of the housing (1). The circuit board chip (52) exchanges heat with the heat dissipation structure (3).

10. A mobile platform, characterized in that, Includes the domain controller as described in claim 9.

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